CN101193499A - Patterning method, droplet discharging device and circuit board - Google Patents
Patterning method, droplet discharging device and circuit board Download PDFInfo
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- CN101193499A CN101193499A CN 200710196105 CN200710196105A CN101193499A CN 101193499 A CN101193499 A CN 101193499A CN 200710196105 CN200710196105 CN 200710196105 CN 200710196105 A CN200710196105 A CN 200710196105A CN 101193499 A CN101193499 A CN 101193499A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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Abstract
A rack (23) carries a raw material thin sheet (4G) onto a ventilating rack plate (23b), and a rubber heater (H) is disposed under the rack plate (23b) to heat the raw material thin sheet (4G) to a predetermined temperature. The rack (23) reduces the pressure under the rack plate (23b) via an attraction access to reduce the pressure in the rack plate (23b), thereby to integrally reduce the pressure under the raw material thin sheet (4G) carried in the rack plate (23b). Droplets (Fb) dropped on the raw material thin sheet (4G) further promote evaporation into the internal of the raw material thin sheet (4G). Thereby, drying time of metal ink dropped on the raw material thin sheet (4G) is further reduced. Thereby, a patterning method, a droplet discharging device and a circuit board can be provided with high precision and short time.
Description
Technical field
The present invention relates to pattern formation method, droplet ejection apparatus and circuit substrate.
Background technology
As on substrate, forming desired method of patterning, become effective scheme and what receive much attention is to make the ink-jetting style (for example patent documentation 1) of functional liquid with the ejection of drop state.
Ink-jetting style possesses: the mechanism that the stand of mounting substrate (stage), the functional liquid that will contain functional material are ejected into the droplet discharging head on the substrate with the drop state and substrate (stand) and droplet discharging head are relatively moved two-dimensionally.Ink-jetting style relatively moves by substrate and droplet discharging head, optional position that will be from the droplet configuration of droplet discharging head ejection to substrate surface.It is overlapped that each drop that is configured to substrate surface in turn is configured to the scope of drop profit exhibition, thus, and the pattern that can form covered substrate surface seamlessly and constitute by functional liquid.
Have under the situation of lyophobicity at the relative functional liquid of substrate surface, a little less than the power that the drop that substrate surface attracts the force rate of drop to be in contact with one another attracts each other.Therefore, at substrate surface, functional liquid concentrates on local location.If produce this concentration of local, functional liquid covered substrate surface equably not then.And if concentration of local further develops, then the part of substrate surface can be exposed because lacking functional liquid.
In ink-jetting style, for fear of this concentration of local,, need before the follow-up drop of drippage, make the drop intensive drying of previous drippage making between the drop that is in contact with one another when overlapping, the result causes pattern to form to be needed for a long time.Given this, proposed a kind of in ink-jetting style by substrate is heated in advance, make the quick-drying method of drop (for example patent documentation 2, patent documentation 3) of drippage.
[patent documentation 1] spy opens the 2004-347695 communique
[patent documentation 2] spy opens the 2004-306372 communique
[patent documentation 3] spy opens flat 11-281985 communique
Yet if improve substrate temperature, the drop meeting bumping of drippage causes forming pattern.Therefore, there is boundary in the method that improves substrate temperature aspect the rising rate of drying, therefore, forms and has restriction aspect the needed time further shortening pattern.
Summary of the invention
The present invention is the scheme that proposes in order to address the above problem, and its purpose is, pattern formation method, droplet ejection apparatus and the circuit substrate that can form patterns of high precision at short notice are provided.
Pattern formation method of the present invention is used for forming pattern on substrate, by will be ejected into by the drop that the functional liquid that contains functional material constitutes heated aeration substrate above, thereby on described aeration substrate the formation pattern.
According to pattern formation method of the present invention, can promote the evaporation of drippage drop by heated substrate.Because substrate is the aeration substrate, so the evaporation composition of drop also can be to the diffusion inside of substrate.Therefore, pattern formation method of the present invention can improve the rate of drying of drop.
In this pattern formation method,, the downside of described aeration substrate is reduced pressure when ejection during described drop.
According to this pattern formation method, the evaporation composition of drop also can be to the diffusion inside of substrate.At this moment, because the downside of aeration substrate is depressurized, so, can promote diffusion to aeration substrate inside.As a result, this pattern formation method can further improve the rate of drying of drop.
In this pattern formation method, when the described drop of ejection, on porous matter stand, make described aeration substrate be adsorbed in described stand described aeration substrate-placing with aeration.
According to this pattern formation method and since the aeration substrate by mounting on porous matter stand with aeration, so, when the stand downside to aeration reduces pressure, can the integral body of aeration substrate downside be reduced pressure equably.Therefore, drip in about the position that the drop of aeration substrate is not dripped, can promote equably and the join evaporation of a side of aeration substrate.
In this pattern formation method, the surface temperature of described aeration substrate is set at more than the temperature of the functional liquid when the described drop of ejection and is lower than the boiling point that the liquid that contains in the described functional liquid is formed.
According to this pattern formation method, because more than the temperature of the surface temperature of aeration substrate functional liquid during for ejection, so, drip in the drop of aeration substrate and directly begin drying.And, because the surface temperature of aeration substrate is lower than the boiling point that liquid is formed, so, drop can be on substrate bumping.As a result, this pattern formation method can form high density, high meticulous pattern at short notice.
In this pattern formation method, described aeration substrate is a porous matter substrate, is the easy fired thin plate that is made of ceramic particle and resin, and described functional liquid is the liquid that is dispersed with as the metallic of functional material.
According to this pattern formation method, can on porous matter substrate, totally and in short time form the pattern that constitutes by metal film.
Droplet ejection apparatus of the present invention has: the stand of mounting substrate and the functional liquid that will contain functional material are as the droplet discharging head of drop ejection, by described stand and described droplet discharging head are relatively moved, and from described droplet discharging head to mounting described drop of ejection above the described substrate of described stand, thereby formation pattern on described substrate, wherein, described substrate is the aeration substrate, and described stand has the heating arrangements of the described substrate of heating.
According to droplet ejection apparatus of the present invention, can promote the evaporation of drippage drop by the substrate of heating.Because substrate is the aeration substrate, so the evaporation composition of drop is also to the diffusion inside of substrate.Therefore, pattern formation method of the present invention can improve the rate of drying of drop.
In this droplet ejection apparatus, described stand comprises: have the mounting portion of aeration and the described substrate of mounting and the mechanism of decompressor that mounting is reduced pressure in the downside of the described substrate of described mounting portion via described mounting portion.
According to this droplet ejection apparatus, for example with the aeration substrate-placing during in the stand of aeration, if reduce pressure by the stand downside of the mechanism of decompressor to aeration, then the downside of aeration substrate can be depressurized.Therefore, the evaporation composition of drippage drop also can be to the evaporation of the inside of aeration substrate.At this moment, because the downside of aeration substrate is depressurized, so, can promote diffusion to aeration substrate inside.As a result, droplet ejection apparatus can further improve rate of drying.
Circuit substrate of the present invention is equipped with circuit element and has the wiring that is electrically connected with described circuit element, and described wiring forms by above-mentioned pattern formation method.
Circuit substrate of the present invention becomes the circuit substrate that can further boost productivity.
Description of drawings
Fig. 1 is the sectional view of circuit module.
Fig. 2 is the overall perspective view of droplet ejection apparatus.
Fig. 3 is a upward view of observing droplet discharging head from raw material thin plate side.
Fig. 4 is the major part sectional view of droplet discharging head.
Fig. 5 is used for the electrical block circuit diagram that the electric formation to droplet ejection apparatus describes.
Fig. 6 is the schematic diagram that is used to illustrate the profile construction of raw material thin plate.
Fig. 7 is the key diagram that is used to illustrate the effect that pattern forms.
Fig. 8 (a)～(d) is the drop ejection figure in proper order that the expression pattern forms.
Fig. 9 is the key diagram that is used to illustrate the formation of stand.
Figure 10 is the schematic diagram that is used to illustrate the profile construction of raw material thin plate.
Figure 11 is the electrical block circuit diagram that is used to illustrate the electric formation of droplet ejection apparatus.
Figure 12 (a)～(f) is the figure of expression with other order formation pattern.
Among the figure: 1-circuit module, 2-LTCC multilager base plate, 4-easy fired substrate, 4G-is as the raw material thin plate of matrix, 6-internal wiring, 20-droplet ejection apparatus, the 23-stand, 23a-stand main body, 23b-stand plate, the 30-droplet discharging head, the 50-control device, F-is as the metallic ink of functional liquid, the Fb-drop, PZ-piezoelectric element, P-pattern, the H-rubber heater, the VP-suction pump.
Embodiment
(first execution mode)
Below with reference to Fig. 1～Fig. 8 first execution mode of the present invention is described, this execution mode is semiconductor chip go up to be installed and in the circuit module that constitutes at LTCC multilager base plate (LTCC:Low Temperature Co-fired Ceramics multilager base plate), will go up mode after the method that forms wiring pattern is specialized at a plurality of easy fired substrates (raw material thin plate (green sheet)) that constitute the LTCC multilager base plate.
At first, the circuit module that the semiconductor wafer formation is installed on the LTCC multilager base plate is described.The cutaway view of Fig. 1 indication circuit module 1.Circuit module 1 has: form the semiconductor chip 3 that tabular LTCC multilager base plate 2 and upside at this LTCC multilager base plate 2 are connected by wire bond.
LTCC multilager base plate 2 is the duplexers that form laminal a plurality of easy fired substrates 4.Each easy fired substrate 4 be respectively glass ceramics based material (for example mixture of ceramic component such as glass ingredient such as boric acid base oxide and alumina) sintered body, be porous matter substrate, its thickness is hundreds of μ m.
For easy fired substrate 4, the material before its sintering is called raw material thin plate 4G (with reference to Fig. 2,4,7).Raw material thin plate 4G by with the powder of glass ceramics based material and dispersant as adhesive, together be mixed and made into slurries (slurry) with foam control agent (foam control agent) etc., and these slurries are formed carry out drying after tabular and form, have aeration.That is, raw material thin plate 4G is the aeration substrate.
Each easy fired substrate 4 has: various circuit elements 5 such as resistive element, capacity cell, coil part; Internal wiring 6 with each circuit element 5 electrical connection; A plurality of via holes 7 with the predetermined hole diameter (for example 20 μ m) that is rendered as stacked vias (stackvia) structure, hot via hole (thermal via) structure; With many via hole wirings 8 that are filled in each via hole 7.
Each internal wiring 6 on each easy fired substrate 4 is respectively the sintered body of metal particles such as silver or silver alloy, can form by the wiring pattern formation method of having utilized droplet ejection apparatus shown in Figure 2 20.
Fig. 2 is the overall perspective view of explanation droplet ejection apparatus 20.
In Fig. 2, droplet ejection apparatus 20 has the base station 21 that forms rectangular shape.On base station 21, be formed with a pair of gathering sill 22 that extends along its length direction (below simply be called the Y direction of arrow).Above gathering sill 22, possess along gathering sill 22 and reach the stand 23 that the direction opposite with the Y direction of arrow moves to the Y direction of arrow.
On stand 23, be formed with mounting portion 24, to the easy fired substrate 4 before burning till, be that the raw material thin plate 4G of aeration carries out mounting.Mounting portion 24 will be in positioned by the relative stand 23 of raw material thin plate 4G of carrying state fixing, along the Y direction of arrow and the direction conveyance raw material thin plate 4G opposite with the Y direction of arrow.On stand 23, be provided with rubber heater H.By mounting in the raw material thin plate 4G of mounting portion 24 by heating by rubber heater H, make self top integral body be warming up to the temperature of regulation.
Metallic ink F can adopt the metal particle as functional material, for example is distributed to the disperse system metallic ink of the liquid in the solvent as the metal particle that with particle diameter is several nm～tens nm.
As the metal particle that uses among the metallic ink F, for example except gold (Au), silver (Ag), copper (Cu), aluminium (Al), palladium (Pd), manganese (Mn), titanium (Ti), tantalum (Ta), and material such as nickel, also can use their oxide and the particulate of supraconductor etc.The particle diameter of preferable alloy particulate is more than the 1nm, below the 0.1 μ m.If the particle diameter of metal particle greater than 0.1 μ m, then might block in the nozzle N of shower nozzle 30.In addition, if the particle diameter of metal particle less than 1nm, then the volume ratio of the relative metal particle of dispersant increases, and causes the organic substance ratio in the resulting film too much.
As dispersant, so long as can disperse above-mentioned metal particle and can not cause that the material of cohesion gets final product, there is no particular limitation.For example except water solvent, can also enumerate: methyl alcohol, ethanol, propyl alcohol, alcohols such as butanols, normal heptane, normal octane, decane, dodecane, the tetradecane, toluene, dimethylbenzene, isopropyl toluene, durene, indenes, cinene, tetrahydronaphthalene, decahydronaphthalenes, hydrocarbon system compounds such as cyclohexyl benzene, all right in addition illustration ethylene glycol, diethylene glycol, triethylene glycol, glycerine, 1, polyalcohols such as ammediol, all right in addition illustration polyethylene glycol, glycol dimethyl ether, ethylene glycol diethyl ether, ethylene glycol methyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol ethylmethyl ether, 1, the 2-dimethoxy-ethane, two (2-methoxy ethyl) ether, ether based compounds such as p-diox, and then all right illustration propene carbonate, gamma-butyrolacton, the N-N-methyl-2-2-pyrrolidone N-, dimethyl formamide, the divalence sulfoxide, cyclohexanone, ethyl lactate isopolarity compound.Wherein, consider, preferably make water, alcohols, hydrocarbon system compound, ether based compound,, can enumerate water, hydrocarbon system compound as preferred dispersant from the stability of the dispersiveness of particulate and dispersion liquid and to the aspects such as suitable easness of drop ejection method.
Drip the part evaporation that makes solvent or dispersant in the metallic ink F of raw material thin plate 4G from self surface.At this moment, because raw material thin plate 4G is heated, so, can promote the solvent that in metallic ink F, contains or the evaporation of dispersant.And, because raw material thin plate 4G is the aeration substrate, so, as shown in Figure 6, drip in the metallic ink F of raw material thin plate 4G and the part of solvent or dispersant is evaporated by raw material thin plate 4G with the raw material thin plate 4G side of joining.Therefore, for dripping for the metallic ink F of raw material thin plate 4G, can further shorten the dry needed time of self.In addition, in the present embodiment, be set in the prescribed limit by dripping the contact angle in the metallic ink F of raw material thin plate 4G (gas permeability substrate), the porosity of raw material thin plate 4G etc., can make and drip in the drop Fb of raw material thin plate 4G is not impregnated into raw material thin plate 4G.
Drip in the metallic ink F of raw material thin plate 4G and be accompanied by drying, begin to make the surface of self to increase viscosity from outer rim.That is, dripping in the metallic ink F of raw material thin plate 4G, because solid constituent (particle) concentration of the peripheral part of metallic ink F is compared the concentration that reaches capacity rapidly with central portion, so, for metallic ink F, begin to make the surface of self to increase viscosity from outer rim.Increase the outer rim of the metallic ink F of viscosity, stop self profit exhibition, promptly locked (pinning) along the face direction of raw material thin plate 4G.The metallic ink F that is in the lock state is fixed in raw material thin plate 4G.For the metallic ink F that is in the lock state, when overlapping other metallic ink F on self, owing to be in the state that is fixed on raw material thin plate 4G, so, can not attracted by ensuing drop Fb.
Be formed with pair of guide rails 28 up and down on guiding parts 25, its almost whole width of the X direction of arrow that spreads all over guiding parts 25 extends along the X direction of arrow.On the pair of guide rails 28 objective table 29 is being installed up and down.Objective table 29 is guided by guide rail 28, moves along the X direction of arrow and the direction opposite with the X direction of arrow.On objective table 29, be equipped with droplet discharging head 30.
Fig. 3 is the upward view of expression from raw material thin plate 4G side observation droplet discharging head 30, and Fig. 4 is the major part cutaway view of expression shower nozzle.Downside at shower nozzle 30 possesses nozzle plate 31.For nozzle plate 31, form top approximate parallel with raw material thin plate 4G below it.Below, below nozzle plate 31, be called nozzle formation face 31a simply, will be called ejection face 4Ga above the raw material thin plate 4G.Raw material thin plate 4G be positioned at shower nozzle 30 under the time, the distance (following simply be called dull and stereotyped gap) that nozzle plate 31 forms face 31a and ejection face 4Ga with nozzle remains the distance (for example 600 μ m) of regulation.
Among Fig. 3, form face 31a at nozzle and be formed with a pair of nozzle rows NL, it is made of a plurality of nozzle N that arrange along the Y direction of arrow.A pair of nozzle rows NL has 180 nozzle N in the distance of each inch.In addition, for convenience of description, each row has only been put down in writing 10 nozzle N among Fig. 3.
In a pair of nozzle rows NL,, be inserted in each nozzle N of a side nozzle rows NL between each nozzle N of the opposing party's nozzle rows NL when observing from the X direction of arrow.That is, shower nozzle 30 along the Y direction of arrow in each inch, have 180 a * 2=360 nozzle N, soon the ultimate resolution of Y direction is made as 360dpi.
Among Fig. 4, be connected with supply pipe 30T as stream at the upside of shower nozzle 30.Supply pipe 30T is configured to extend along the Z direction of arrow, will offer shower nozzle 30 from the metallic ink F of print cartridge 26.
Upside at each nozzle N is formed with the chamber 32 that is communicated with supply pipe 30T.Chamber 32 is not only accommodated the metallic ink F from supply pipe 30T, and provides it to the nozzle N that is communicated with the part of the metallic ink F that is accommodated.Upside at chamber 32 is pasted with oscillating plate 33, and it is by along Z direction of arrow vibration, enlarges and dwindles volume in the chamber 32.Upside at oscillating plate 33 disposes piezoelectric element PZ by each nozzle N.Piezoelectric element PZ makes oscillating plate 33 vibrate along the Z direction of arrow by upholding, shrink along the Z direction of arrow.Oscillating plate 33 along the vibration of the Z direction of arrow makes metallic ink F become the drop Fb of prescribed level, sprays from nozzle N.The drop Fb of ejection then, is dropped in the ejection face 4Ga of raw material thin plate 4G along the direction flight opposite with the Z direction of arrow of nozzle N.
Then, according to Fig. 5 the electric formation of the droplet ejection apparatus 20 that constitutes is as mentioned above described.
Among Fig. 5, control device 50 has CPU50A, ROM50B, RAM50C etc.Control device 50 is carried out the conveyance processing of stand 23, the conveyance processing of objective table 29, the drop ejection processing of shower nozzle 30, the heat treated of rubber heater H etc. according to various data of being stored and various control program.
Data bitmap BD is the data that are switched on or switched off of stipulating each piezoelectric element PZ according to everybody value (0 or 1).Data bitmap BD is that the drop Fb to the usefulness that whether will connect up is ejected into shower nozzle 30, is that predetermined data is carried out in each position of describing on the plane (ejection face 4Ga) that each nozzle N is passed through.That is, data bitmap BD is the data that the target that is used to make the drop Fb of wiring usefulness to be ejected into the internal wiring 6 that is ejected face 4Ga regulation forms the position.
Be connected with head drive circuit 54 on the control device 50.Control device 50 generates ejection signal on opportunity LT with the ejection Frequency Synchronization of regulation, and will spray opportunity signal LT and export to head drive circuit 54.Control device 50 is used in the driving voltage COM and ejection Frequency Synchronization that drives each piezoelectric element PZ, outputs it to head drive circuit 54.
Connecting rubber heater drive circuit 55 on the control device 50.Control device 50 is to rubber heater drive circuit 55 output drive control signal.55 responses of rubber heater drive circuit drive rubber heater H from the drive control signal of control device 50, thus, mounting are controlled at predefined temperature in the temperature of the raw material thin plate 4G of stand 23.In the present embodiment, the temperature of predefined raw material thin plate 4G, the temperature that promptly sprays face 4Ga are more than the temperature of the metallic ink F from shower nozzle 30 ejections the time, and the temperature of the boiling point of forming less than the liquid that metallic ink F is contained.Here, the boiling point formed of liquid be meant the liquid that contains among the metallic ink F form among the boiling point of the minimum composition of boiling point.
That is more than the temperature of the metallic ink F when, control device 50 is controlled at the temperature of raw material thin plate 4G from shower nozzle 30 ejections.Thus, metallic ink F can be dry in shower nozzle 30 when ejection, and can be heated rapidly when dripping as drop Fb and drying.And control device 50 is controlled to be the boiling point of forming less than liquid with the temperature of raw material thin plate 4G.Thus, when metallic ink F drips as drop Fb because drop Fb is heated to be less than boiling point, so, can be on raw material thin plate 4G bumping.
Then, the wiring pattern formation method of the raw material thin plate 4G that forms utilizing above-mentioned droplet ejection apparatus 20 describes.
As shown in Figure 2, droplet ejection apparatus 20 in stand 23, is configured in upside with the ejection face 4Ga of raw material thin plate 4G with raw material thin plate 4G mounting.At this moment, stand 23 is configured in raw material thin plate 4G the direction opposite with the Y direction of arrow of objective table 29.This raw material thin plate 4G has via hole 7, via hole wiring 8, forms internal wiring 6 as wiring pattern by droplet ejection apparatus 20 at ejection face 4Ga.
From this state, be used to form the data bitmap BD of internal wiring 6 to control device 50 inputs by input/output unit 51.50 couples of data bitmap BD from input/output unit 51 inputs of control device store.At this moment, control device 50 drives rubber heater H by utilizing rubber heater drive circuit 55, and the integral body of raw material thin plate 4G is heated to set point of temperature equally.That is, the ejection face 4Ga of raw material thin plate 4G is controlled as more than the temperature of the metallic ink F of temperature from shower nozzle 30 ejections the time, and is lower than the boiling point (forming the minimum temperature of mid-boiling point less than liquid) of the liquid composition that contains among the metallic ink F.
Then, control device 50 comes conveyance stand 23 by utilizing Y-axis motor drive circuit 53 to drive Y-axis motor MY, thus, shower nozzle 30 can target form the position directly over pass through.Then, control device 50 begins the scanning (toward moving) of shower nozzle 30 by utilizing X-axis motor drive circuit 52 driving X-axis motor MX.
When the scanning that has begun shower nozzle 30 (toward moving), control device 50 generates pattern according to data bitmap BD and forms and use control signal SI, and forms to head drive circuit 54 output patterns and to use control signal SI and driving voltage COM.That is,, when making shower nozzle 30 be positioned on the position that is used to form internal wiring 6, all spray drop Fb from selected nozzle N whenever control device 50 drives each piezoelectric element PZ by head drive circuit 54.Because raw material thin plate 4G is heated to be more than the temperature of drop Fb when being ejection, so this drips in the rapid drying of the drop Fb of raw material thin plate 4G meeting.And, because raw material thin plate 4G is the aeration substrate, so as shown in Figure 6, drop Fb evaporates in raw material thin plate 4G, can further promote drying.
In the present embodiment, shown in Fig. 7 and Fig. 8 (a)～(d), each drop Fb of ejection is dropped in each position that is used to form internal wiring 6 respectively in turn.Specifically, in the present embodiment, at first the drop Fb of drippage is deciding (locking) in raw material thin plate 4G by the drying of self part in order to form pattern, promptly stops the profit exhibition of self.Drip ensuing drop Fb in raw material thin plate 4G according to the part of self and the previous overlapping mode of drop Fb, be ejected among Fig. 7 and Fig. 8 (a) position by single-point line expression.
Promptly, the opportunity of shower nozzle 30 ejection drop Fb, can according to when drop Fb is sprayed by shower nozzle 30, begun to fixing (locking) in needed time till the raw material thin plate 4G, arrive the position that sprays next drop Fb from the position of the last drop Fb of shower nozzle 30 ejections till needed traveling time etc. decide.Therefore, droplet ejection apparatus 20 can wait the ejection opportunity set in advance by experiment according to the heating-up temperature of raw material thin plate 4G, the translational speed of shower nozzle 30 etc., promptly spray blanking time.
Therefore, make along the X direction of arrow shower nozzle 30 toward moving, when spraying drop Fb blanking time with above-mentioned ejection simultaneously, droplet ejection apparatus 20 make previous drip in the drop Fb of raw material thin plate 4G dry rapidly.
Then, shown in Fig. 8 (b), when the previous relative raw material thin plate of drop Fb 4G was in fixing state, next drop Fb was dropped in the position of the single-point line expression of Fig. 8 (c) according to self a part and the overlapping mode of previous drop Fb that is in stationary state.At this moment, being locked to raw material thin plate 4G owing to be in the previous drop Fb of stationary state, so, can not attracted by next drop Fb.And because for the next drop Fb overlapping with previous drop Fb, self underlapped part is by raw material thin plate 4G heating, so, can directly begin drying and be dried to rapidly and be stationary state.Therefore, next drop Fb can not attracted by previous drop Fb.
As a result, be dropped in the drop Fb of each position that is used to form internal wiring 6 in turn, not to be dried respectively from the state of offset of drippage.Therefore, shown in Fig. 8 (d), droplet ejection apparatus 20 can be formed for the wiring pattern P of internal wiring 6.And, because droplet ejection apparatus 20 not only heats raw material thin plate 4G, also use the raw material thin plate 4G of aeration substrate, so, can make rapidly drippage drop Fb drying, be fixed in raw material thin plate 4G.As a result, because droplet ejection apparatus 20 can shorten ejection blanking time of drop Fb, so, can be formed for the wiring pattern P of internal wiring 6 at short notice.And, because the temperature of raw material thin plate 4G is controlled to be the temperature of the boiling point that is lower than drop Fb, so droplet ejection apparatus 20 can be avoided the bumping of the drop Fb that drips, thereby can form the wiring pattern P reliably.
When beginning the scanning (double action) of shower nozzle 30, control device 50 similarly drives each piezoelectric element PZ according to data bitmap BD and by head drive circuit 54 with above-mentioned.Then, when shower nozzle 30 was positioned at each position that is used to form internal wiring 6, control device 50 all made drop Fb spray from selected nozzle N.Also with above-mentioned same, at first drip in the drop Fb of raw material thin plate 4G and directly begin drying and dry rapidly under this situation.Then, if the relative raw material thin plate of drop Fb 4G is in fixing state, then control device 50 makes next drop Fb drippage, so that the part of himself is overlapping with the drop Fb that is in stationary state.
Afterwards, control device 50 makes shower nozzle 30 move back and forth along the X direction of arrow and the direction opposite with the X direction of arrow, and, along Y direction of arrow conveyance stand 23.And control device 50 carries out spraying with the opportunity based on data bitmap BD the action of drop Fb repeatedly in the reciprocating motion of shower nozzle 30.Thus, droplet ejection apparatus 20 forms the wiring pattern P of internal wiring 6 by drop Fb on raw material thin plate 4G.
Then, the effect with first execution mode that constitutes as mentioned above is described as follows.
(1) according to above-mentioned execution mode, because more than the temperature of the temperature of the raw material thin plate 4G drop Fb when being heated to be ejection, so the drop Fb of drippage can be dry rapidly.Therefore, droplet ejection apparatus 20 can shorten the ejection blanking time of drop Fb, can form the wiring pattern P at short notice.
(2) according to above-mentioned execution mode, because raw material thin plate 4G is the aeration substrate, so drop Fb can thus, can further promote drying by evaporating in the raw material thin plate 4G.Therefore, droplet ejection apparatus 20 can further shorten the ejection blanking time of drop Fb, thereby can form the wiring pattern P with the shorter time.
(3) according to above-mentioned execution mode, because the heating-up temperature of raw material thin plate 4G is controlled as the temperature of the boiling point that is lower than drop Fb, so the drop Fb of drippage can bumping.Therefore, droplet ejection apparatus 20 can form high density, high fine wiring pattern P.
(4) according to above-mentioned execution mode, when the drop Fb that droplet ejection apparatus 20 formerly drips is in stationary state, according to dripping next drop Fb with the partly overlapping mode of one.Therefore, being in the next drop Fb that the previous drop Fb of stationary state can not dripped according to the overlapping mode of the part of self attracts.Thereby droplet ejection apparatus 20 can form high density, high fine wiring pattern P.
(5) according to above-mentioned execution mode, droplet ejection apparatus 20 heats above raw material thin plate 4G whole equally by rubber heater H.Therefore, drip the peripheral part start vaporizer from self, compare, the solid constituent of peripheral part (particle) the concentration concentration that reaches capacity rapidly with central portion in the drop Fb of raw material thin plate.As a result, the drop Fb of drippage stops self the profit exhibition along the face direction of raw material thin plate 4G.That is, because the drop Fb of drippage is initially located in stationary state from peripheral part, so keeping the outer shape when dripping.As a result, droplet ejection apparatus 20 can form high density, high meticulous pattern.
(6), because setting, the time of the drop Fb that droplet ejection apparatus 20 utilizes drippage till fixing sprays blanking time, so drop formerly becomes after the stationary state really, can spray ensuing drop according to above-mentioned execution mode.
(second execution mode)
Below, according to Fig. 9～Figure 11 second execution mode that the present invention is specialized is described.Second execution mode has changed the stand 23 of first execution mode.Therefore, will describe this variation point in detail below.
Among Fig. 9, stand 23 have stand main body 23a, the rubber heater H that on stand main body 23a, disposes and be configured in rubber heater H above and constitute the stand plate 23b of mounting portion.Stand main body 23a be configured in base station 21 above, by receiving the actuating force of Y-axis motor MY, move along the Y direction of arrow and the direction opposite with the Y direction of arrow.Rubber heater H is configured between stand main body 23a and the stand plate 23b, will be on stand plate 23b the raw material thin plate 4F of mounting be heated to be the temperature of regulation.Stand plate 23b is ceramic substrate, is the porous matter substrate with aeration, mounting raw material thin plate 4G in the above.Mounting receives heat from rubber heater H in the raw material thin plate 4G of stand plate 23b by stand plate 23b, makes the temperature that is raised to regulation above self whole.
As shown in phantom in Figure 9, stand 23 have from the inside of stand main body 23a extend to rubber heater H above attraction path 23c.For attracting path 23c, one end opening portion below stand plate 23b, the opposed position of raw material thin plate 4G that is configured in Yu is disposed.The other end peristome of attraction path 23c is connected with not shown suction tube, and this suction tube is connected the side of stand main body 23a.Suction tube is connected with suction pump VP (with reference to Figure 11), thereby can and attract path 23c that the downside of stand plate 23b is reduced pressure via suction tube.At this moment, because stand plate 23b is the porous matter substrate with aeration,, arrive the integral body below the raw material thin plate 4G in stand plate 23b so the attraction of suction pump VP is passed through.The attraction that acts on below the raw material thin plate 4G makes raw material thin plate 4G be adsorbed in stand plate 23b.
Among Figure 10, drip metallic ink F (drop Fb) in raw material thin plate 4G makes solvent or dispersant from self surface part evaporation.At this moment, because raw material thin plate 4G is heated, so, can promote the solvent that contains among the drop Fb or the evaporation of dispersant.And, because raw material thin plate 4G is the aeration substrate, thus as shown in figure 10, drip in the drop Fb of raw material thin plate 4G with the raw material thin plate 4G side of joining, also make the part evaporation of solvent or dispersant by raw material thin plate 4G.Therefore, drip in the drop Fb of raw material thin plate 4G and can further shorten self dry needed time.
And, because raw material thin plate 4G is configured on the stand plate 23b of aeration, so, by the attraction of suction pump VP via stand plate 23b, make self below be attracted.Because drip the attraction that is subjected to suction pump VP in the drop Fb of raw material thin plate 4G, so, solvent or dispersant are further spread in raw material thin plate 4G.As a result, drip in the drop Fb of raw material thin plate 4G and can further shorten drying time.
In addition, in the present embodiment, the porosity that can be by will dripping contact angle in the drop Fb of raw material thin plate 4G (aeration substrate), raw material thin plate 4G and act on raw material thin plate 4G below attraction etc. be set in prescribed limit, make and drip in the drop Fb of raw material thin plate 4G is not impregnated into raw material thin plate 4G.
Then, according to Figure 11 the electric formation of the droplet ejection apparatus 20 that constitutes is as mentioned above described.
In Figure 11, control device 50 is according to various data of being stored and various control program, and the drop ejection of carrying out conveyance processing, the shower nozzle 30 of conveyance processing, the objective table 29 of stand 23 is handled, the reduced pressure treatment of the downside of the heat treated of rubber heater H, raw material thin plate 4G etc.
Be connected with suction pump drive circuit 56 on the control device 50.Control device 50 is to suction pump drive circuit 56 output drive control signal.56 responses of suction pump drive circuit drive suction pump VP from the drive control signal of control device 50, thus, with the decompression state of stipulating mounting are carried out mounting in the raw material thin plate 4G of stand plate 23b and fix.
When forming wiring pattern, control device 50 similarly is heated to be described set point of temperature with mounting in the integral body of the raw material thin plate 4G of stand plate 23b by the rubber heater H that is arranged at stand main body 23a is driven.That is, more than the temperature of the metallic ink F the when temperature of the ejection face 4Ga of raw material thin plate 4G is controlled as from shower nozzle 30 ejection, and be lower than the boiling point that the liquid that contains among the metallic ink F forms (being lower than the boiling point minimum temperature of liquid in forming).And control device 50 drives suction pump VP by suction pump drive circuit 56, and mounting is reduced pressure in the raw material thin plate 4G of stand plate 23b downside.Therefore, because the downside of raw material thin plate 4G is in decompression state, so the diffusion of vapor of the drop Fb in raw material thin plate 4G is further promoted, thus, can further shorten the drying time of drop Fb.
Then, the effect of second execution mode that constitutes is as mentioned above carried out following narration.
(7) according to above-mentioned execution mode, because the downside of raw material thin plate 4G is in decompression state, so, for dripping, can further promote the diffusion of vapor in raw material thin plate 4G in the metallic ink F of raw material thin plate 4G.As a result, drip in the metallic ink F of raw material thin plate 4G and can further shorten drying time.
(8) and, raw material thin plate 4G is configured in the porous matter stand plate 23b with aeration.Therefore, because the downside of raw material thin plate 4G is depressurized via porous matter stand plate 23b, so, the downside integral body of raw material thin plate 4G is reduced pressure equably.As a result, drip in about the position that the drop Fb of raw material thin plate 4G can not be dripped, the evaporation that contacts the one side side with raw material thin plate 4G is spread equably.
(9) and then, owing to compile by attracting path 23c to be attracted pump VP, so droplet ejection apparatus 20 can reduce the pollution that causes because of steam from the steam of drop Fb evaporation.
In addition, above-mentioned execution mode can carry out following change.
In the above-described embodiment, stand plate 23b is the porous ceramic substrate of aeration.Stand plate 23b is not limited to this, gets final product so long as have the material of aeration, and for example can be sintering metal with aeration.
In the above-described embodiment, stand 23 stacked rubber heater H and stand plate 23b of constituting by the porous ceramic substrate of aeration on stand main body 23a.Also it can be constituted stand main body 23a for example above have recess, dispose rubber heater H in the bottom of this recess, dispose the structure of stand plate 23b on the top of this rubber heater H.
And the integral body of stand 23 can be the porous matter pottery with aeration, also can be the porous sintering metal of aeration.
In the above-described embodiment, when making a next drop Fb part drip in previous drop Fb overlappingly, droplet ejection apparatus 20 drop Fb formerly is in after the state that is fixed on the raw material thin plate 4G, makes next drop drippage.But be not limited to this, droplet ejection apparatus 20 also can be in before the state that is fixed on raw material thin plate 4G by drop Fb formerly, drips next drop Fb.
In the above-described embodiment, drip next drop Fb according to self a part and the overlapping mode of previous drop Fb.But be not limited to this, also can not drip according to the part of next drop Fb with the overlapping mode of previous drop Fb.
In the above-described embodiment, previous drop Fb and next drop Fb carry out overlapping with half spacing of drippage radius, implement but also can suitably change this overlapping situation.
In the above-described embodiment, come overlapping a plurality of drop Fb, formed the wiring pattern P by order according to ejection.But be not limited to this, for example also can spray a plurality of drop Fb, form the wiring pattern P according to the order shown in Figure 12 (a)～(f).
That is, shown in Figure 12 (a), in order to form pattern, when previous drop Fb dropped onto assigned position, the drippage position A1 by 1 single-point line expression in that the drop Fb behind drippage leaves dripped ensuing drop Fb.When drop Fb drips in drippage during the A1 of position, next drop Fb is according to the part of self and the overlapping mode of drop Fb of initial drippage, is dropped among Figure 12 (b) the drippage position A2 by single-point line expression.
When drop Fb drips in drippage during the A2 of position, ensuing drop Fb according to self a part with drip in the overlapping mode of drop of drippage position A1, be dropped among Figure 12 (c) drippage position A3 by single-point line expression.After, after the same method, with the order shown in Figure 12 (d), (e), at drippage position A4, A5 drippage configuration drop Fb.Thus, can form the wiring pattern P shown in Figure 12 (f).
In the above-described embodiment, by rubber heater H heating raw material thin plate 4G, but also can be by other heating arrangements heating raw material thin plate 4G.
In the above-described embodiment, functional liquid is embodied in metallic ink F.But be not limited to this, for example functional liquid also can be specially the functional liquid that contains liquid crystal material.That is, as long as functional liquid is the liquid that sprays in order to form pattern.
In the above-described embodiment, matrix is specially raw material thin plate 4G.But be not limited to this, if substrate be the aeration substrate, substrate that drop is directly soaked into, this can adopt substrate arbitrarily.
In the above-described embodiment, drop ejection mechanism is specially the droplet discharging head 30 of piezoelectric element type of drive.But be not limited to this, droplet discharging head also can be specially the shower nozzle of resistance heating mode or static driven mode.
Claims (8)
1. a pattern formation method is used for forming pattern on substrate,
By will be ejected into by the drop that the functional liquid that contains functional material constitutes heated aeration substrate above, thereby on described aeration substrate the described pattern of formation.
2. pattern formation method according to claim 1 is characterized in that,
When ejection during described drop, the downside of described aeration substrate is reduced pressure.
3. pattern formation method according to claim 2 is characterized in that,
When the described drop of ejection, on the stand of porous matter, make described aeration substrate be adsorbed in described stand described aeration substrate-placing with aeration.
4. according to any described pattern formation method in the claim 1～3, it is characterized in that,
When ejection during described drop, the surface temperature of described aeration substrate is set at more than the temperature of the described functional liquid when the described drop of ejection and is lower than the boiling point that the liquid that contains in the described functional liquid is formed.
5. according to any described pattern formation method in the claim 1～4, it is characterized in that,
Described aeration substrate is a porous matter substrate, is the easy fired thin plate that is made of ceramic particle and resin,
Described functional liquid is the liquid that is dispersed with as the metallic of functional material.
6. droplet ejection apparatus has: substrate carried out the stand of mounting and will contain the droplet discharging head of the functional liquid of functional material as the drop ejection,
By described stand and described droplet discharging head are relatively moved, and from described droplet discharging head to mounting described drop of ejection above the described substrate of described stand, thereby on described substrate the formation pattern,
Described substrate is the aeration substrate,
Described stand has the heating arrangements of the described substrate of heating.
7. droplet ejection apparatus according to claim 6 is characterized in that,
Described stand comprises:
Mounting portion, it has aeration, and described substrate is carried out mounting; With
The mechanism of decompressor, it reduces pressure to the downside of mounting in the described substrate of described mounting portion via described mounting portion.
8. a circuit substrate is equipped with circuit element, and has the wiring that is electrically connected with described circuit element,
Described wiring forms by any described pattern formation method in the claim 1～5.
Applications Claiming Priority (9)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006321264 | 2006-11-29 | ||
| JP2006-321263 | 2006-11-29 | ||
| JP2006321263 | 2006-11-29 | ||
| JP2006-321264 | 2006-11-29 | ||
| JP2006321264 | 2006-11-29 | ||
| JP2006321263 | 2006-11-29 | ||
| JP2007-189151 | 2007-07-20 | ||
| JP2007189151A JP5141121B2 (en) | 2006-11-29 | 2007-07-20 | PATTERN FORMING METHOD, DROPLET DISCHARGE DEVICE, AND CIRCUIT BOARD |
| JP2007189151 | 2007-07-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101193499A true CN101193499A (en) | 2008-06-04 |
| CN101193499B CN101193499B (en) | 2011-12-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200710196105 Expired - Fee Related CN101193499B (en) | 2006-11-29 | 2007-11-28 | Patterning method, droplet discharging device and circuit board |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5141121B2 (en) |
| KR (1) | KR100927364B1 (en) |
| CN (1) | CN101193499B (en) |
| TW (1) | TWI356661B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106457299A (en) * | 2014-03-19 | 2017-02-22 | 实用光有限公司 | Printing high aspect ratio patterns |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020136549A (en) * | 2019-02-22 | 2020-08-31 | 株式会社Ｓｃｒｅｅｎホールディングス | Pattern formation device, pattern formation method, and discharge data formation method |
| TWI816267B (en) * | 2021-10-29 | 2023-09-21 | 財團法人工業技術研究院 | Embedded packaging structure |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW442945B (en) * | 1998-11-20 | 2001-06-23 | Sony Computer Entertainment Inc | Integrated circuit chip, integrated circuit device, printed circuit board and electronic machine |
| GB2379414A (en) * | 2001-09-10 | 2003-03-12 | Seiko Epson Corp | Method of forming a large flexible electronic display on a substrate using an inkjet head(s) disposed about a vacuum roller holding the substrate |
| JP3948247B2 (en) * | 2001-10-29 | 2007-07-25 | セイコーエプソン株式会社 | Method for forming a film pattern |
| JP2005057140A (en) * | 2003-08-06 | 2005-03-03 | Seiko Epson Corp | Multilayer wiring board and its manufacturing method |
| JP2006239565A (en) * | 2005-03-03 | 2006-09-14 | Konica Minolta Holdings Inc | Coating method |
-
2007
- 2007-07-20 JP JP2007189151A patent/JP5141121B2/en not_active Expired - Fee Related
- 2007-11-26 TW TW96144825A patent/TWI356661B/en not_active IP Right Cessation
- 2007-11-26 KR KR20070120657A patent/KR100927364B1/en not_active IP Right Cessation
- 2007-11-28 CN CN 200710196105 patent/CN101193499B/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106457299A (en) * | 2014-03-19 | 2017-02-22 | 实用光有限公司 | Printing high aspect ratio patterns |
| CN106457299B (en) * | 2014-03-19 | 2020-01-03 | 实用光有限公司 | Printing high aspect ratio patterns |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5141121B2 (en) | 2013-02-13 |
| KR100927364B1 (en) | 2009-11-19 |
| TWI356661B (en) | 2012-01-11 |
| CN101193499B (en) | 2011-12-07 |
| TW200913826A (en) | 2009-03-16 |
| KR20080048940A (en) | 2008-06-03 |
| JP2008155196A (en) | 2008-07-10 |
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