TWI356661B - Patterning method, droplet discharging device and - Google Patents
Patterning method, droplet discharging device and Download PDFInfo
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- TWI356661B TWI356661B TW96144825A TW96144825A TWI356661B TW I356661 B TWI356661 B TW I356661B TW 96144825 A TW96144825 A TW 96144825A TW 96144825 A TW96144825 A TW 96144825A TW I356661 B TWI356661 B TW I356661B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- Manufacturing Of Printed Wiring (AREA)
- Engineering & Computer Science (AREA)
- Coating Apparatus (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
Description
1356661 九、發明說明： 【發明所屬之技術領域】 本發明係關於圖案形成方法、 及滴喷出裝置及電路基 板0 【先前技術】 作為在基板上形成所希望之圖幸 固累之方法，喷出功能液作 為液滴之噴墨方式為有效手段而 两又庄目（例如，專利々 獻1)。 卞〜又 噴墨方式係包含載置基板之台、 π基板噴出含功能材料 之功能液作為液滴之液滴噴出頭 ^及使基板（台）與液滴噴 出頭2維地相對移動之機構。噴 贺墨方式係措基板與液滴噴 出頭之相對移動而將從液滴噴出 貝®頊噴出之液滴配置於基板 表面之任w位f 4 _人配置於基板表面之各液滴被配置成 液滴之濕潤擴散範圍互相重疊，藉以毫無間隙地覆蓋基板 表面而形成由功能液構成之圖案。 土 在基板表面對功能液具有缝性之情形，基板表面拉液 滴之力會比互相接觸之液滴彼此相拉之力弱。因此，在基 板表面’功能液會局部地集中。發生此種局部的集中現^ 時，基板表面無法均句地被功能液所覆蓋。局部的集甲進 一步進行時，基板表面之—部分會因欠缺功能液而露出。 在喷墨方式中’為避免此種局部的集令，在互相接觸之 液滴彼此重疊之情形’有必要在後續之液滴喷到之前，使 先喷到之液滴充分乾燥，此結果，圖案之形成便需要較長 之時間。因此’在喷墨方式中，有藉預先加熱基板而使噴 126255.doc 1356661 .到之液滴迅速乾燥之方法之提案（例如專利文獻2、專利文 獻3)。 [專利文獻1]日本特開2004·347695號公報 [專利文獻2]日本特開2〇〇4 3〇6372號公報 : [專利文獻3]日本特開平11 281985號公報 【發明内容】 • (發明所欲解決之問題） 但，提高基板溫度時，噴到之液滴會突㈣騰，而不能 再$成圖案。因此，提高基板溫度之方法在提高乾燥速度 之點上有極限，圖案之形成所需之時間要進一步縮短也有 其極限。 本發明係為解決上述問題而發明者’其目的在於提供可 短時間形成高精度之圖案之圖案形成方法、液滴喷出裝置 及電路基板》 (解決問題之技術手段） • 本發明之圖案形成方法係在基板形成圖案者，且；將包 括含功能材料之功能液之液滴喷出至被加熱之通氣性基板 上表面，藉以在前述通氣性基板上表面形成圖案。 依據本發明之圖案形成方法，喷到之液滴可藉被加熱之 土板促進蒸發。因基板為通氣性基板，故液滴之蒸發成分 也會擴散至基板内部。從而本發明之圖案形成方法可提高 液滴之乾燥速度。 在此圖案形成方法令’喷出前述液滴時，將前述通氣性 基板之下側減壓。 126255.doc 1356661 •依據此圖案形成方法，液滴之蒸發成分也會擴散至基板 内部。此時，通氣性基板之下側會被減愿，故可促進對通 氣，基板之内側之擴散。其結果，此圖案形成方法可進一 步提高液滴之乾燥速度。 ; 在此㈣形成方法中’喷出前述液料，將前述通氣性 &板載置於具有通氣性之多孔質性之台且使前述台吸附前 - 述通氣性基板。 ㈣此圖㈣成方法’由於將通氣性基板載置於具有通 氣性之多孔質性之台’故在減壓具有通氣性之台之下側 時，通氣性之台之下側之全體可均勾地受到減壓。因此， 嘴至通氣性基板之液滴不會受喷到之位置所纟纟，而可毫 無不均地均一地促進與通氣性基板接觸之側之蒸發。 在此圖案形成方法中，將前述通氣性基板之表面溫度控 制在噴出前述液滴時之功能液之溫度以上，且未滿前述功 能液所含之液體組成之沸點。 _ &據此圖案形成方法，喷附通氣性基板之液滴由於通氣 性基板之表面溫度在噴出時之功能液之溫度以上，故可立 即開始乾燥，且通氣性基板之表面溫度未滿液體組成之沸 點’故液滴不會在基板上突然沸騰，其結果，此圖案形成 方法可在紐時間形成高密度、高精細之圖案。 在此圖案形成方法中，由於前述通氣性基板係多孔質性 基板’且為陶瓷粒子與樹脂所構成之低溫燒成用板；前述 功此液係分散有作為功能材料之金屬粒子之液體。 依據此圖案形成方法，可在多孔質性基板上美觀且短時 I26255.doc 間地形成金屬膜構成之圖索β 本發明之液滴喷出裝置 喷出頭，其係喷出含 含.載置基板之台；及液滴 台與前述液滴嗔出頭之功能液作為液滴，·使前述 述液滴喷出至載置於前 二：：前述液滴嘴出頭將前 〈别述基板之上表面，蕻以在 别述基板上表面形成圖案W猎以在 板；前述台具有加妖前述A拓别述基板係通氣性基 …、别述基板之加熱機構。 之液㈣出裝置，噴到之液滴可藉被加熱之 蒸發。因基板為通氣性基板，故液滴之蒸發成分 也會擴放至基板内部。從而本發明之圖案形成裝置可提高 液滴之乾燥速度。 在，圖案形成裝置中’前述台係包含：載置部，其係具 有通氣J·生且載置刖述基板；減壓機構，其係經由前述載置 部將載置於前述载置部之前述基板之下側減壓。 依據此液滴喷出裝置，例如將通氣性基板載 置於通氣性 之口時，藉減壓機構，將通氣性之台之下側減壓時，通氣 性基板之下側會被減壓，因此，喷附之液滴之蒸發成分也 會擴散至基板内部。此時，通氣性基板之下側會被減壓， 故可促進對通氣性基板之内側之擴散。其結果，液滴喷出 裝置可進一步提高乾燥速度。 本發明之電路基板係安裝電路元件，並具有被電性連接 於前述電路元件之佈線者，且；前述佈線係藉由上述之圖 案形成方法所形成》 本發明之電路基板係可進一步提高生產性之電路基板。 126255.doc 1356661 【實施方式】 (第一實施型態） 以下，依照圖1〜圖8說明將半導體晶片安裝於c多層 基板（LTCC : Low Temperature C〇-fired Ceramics 多層基 板：低溫燒成陶瓷多層基板）所構成之電路模組，且在將 本發明具體化於在構成㈣以層基板之複數低溫燒成基 板（生胚片）形成佈線圖案之方法之第一實施型態。1356661 IX. Description of the Invention: [Technical Field] The present invention relates to a pattern forming method, a droplet discharge device, and a circuit substrate 0. [Prior Art] As a method for forming a desired pattern on a substrate, the method is sprayed. The discharge of the functional liquid as a droplet is an effective means and is both good (for example, Patent 1). Further, the ink jet method includes a stage on which a substrate is placed, a liquid droplet discharge head including a functional liquid containing a functional material on a π substrate, and a mechanism for moving the substrate (stage) and the liquid droplet ejection head in two dimensions. . The droplets are ejected from the droplets, and the droplets ejected from the droplets are disposed on the surface of the substrate at any w-bit f 4 _ the droplets disposed on the surface of the substrate are arranged The wet diffusion ranges of the droplets overlap each other, so that the surface of the substrate is covered without any gap to form a pattern composed of the functional liquid. Soil In the case where the surface of the substrate has a slit property to the functional liquid, the force of pulling the liquid droplet on the surface of the substrate is weaker than the force of pulling the liquid droplets in contact with each other. Therefore, the functional liquid is locally concentrated on the surface of the substrate. When such a local concentration occurs, the surface of the substrate cannot be uniformly covered by the functional liquid. When the local armor is further advanced, part of the surface of the substrate is exposed due to lack of functional liquid. In the ink jet method, in order to avoid such localized assembly, in the case where the droplets in contact with each other overlap each other, it is necessary to sufficiently dry the droplets which are sprayed before the subsequent droplets are sprayed, and as a result, The formation of the pattern takes a long time. Therefore, in the ink jet method, there is a proposal for a method of rapidly drying the substrate by spraying the substrate 126255.doc 1356661 (for example, Patent Document 2 and Patent Document 3). [Patent Document 1] Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. The problem to be solved) However, when the substrate temperature is raised, the droplets that are sprayed will suddenly rise (4) and cannot be patterned. Therefore, the method of increasing the temperature of the substrate has a limit at the point of increasing the drying speed, and the time required for the formation of the pattern is further shortened and has its limit. The present invention has been made in order to solve the above problems, and an object of the invention is to provide a pattern forming method, a droplet discharge device, and a circuit substrate which can form a pattern with high precision in a short period of time (technical means for solving the problem). The method is characterized in that a pattern is formed on a substrate, and a liquid droplet including a functional liquid containing a functional material is ejected onto an upper surface of the heated air-permeable substrate to form a pattern on the upper surface of the air-permeable substrate. According to the pattern forming method of the present invention, the droplets sprayed thereon can be promoted by the heated earth plate. Since the substrate is a gas permeable substrate, the evaporation component of the droplets also diffuses into the inside of the substrate. Thus, the pattern forming method of the present invention can increase the drying speed of the droplets. In this pattern forming method, when the liquid droplets are ejected, the lower side of the air-permeable substrate is decompressed. 126255.doc 1356661 • According to this pattern forming method, the evaporation component of the droplets also spreads to the inside of the substrate. At this time, the lower side of the air-permeable substrate is reduced, so that the ventilation and the diffusion of the inside of the substrate can be promoted. As a result, this pattern forming method can further increase the drying speed of the droplets. In the above (4) forming method, the liquid material is ejected, and the air permeability & plate is placed on a table having a porous air permeability, and the air-permeable substrate is adsorbed before the stage. (4) In the figure (4), the method of 'the air-permeable substrate is placed on the bottom of the permeable air-permeable stage', and the lower side of the lower side of the ventilating stage can be used. The hook is decompressed. Therefore, the liquid droplets from the nozzle to the air permeable substrate are not subjected to the position where the ink is ejected, and the evaporation on the side in contact with the air permeable substrate can be uniformly promoted without unevenness. In the pattern forming method, the surface temperature of the air permeable substrate is controlled to be higher than the temperature of the functional liquid when the liquid droplets are ejected, and is less than the boiling point of the liquid composition contained in the functional liquid. According to the pattern forming method, since the droplets of the air-permeable substrate are sprayed over the temperature of the functional liquid at the time of ejection, the surface of the air-permeable substrate can be immediately dried, and the surface temperature of the air-permeable substrate is not full. The boiling point of the composition is such that the droplet does not suddenly boil on the substrate, and as a result, the pattern forming method can form a high-density, high-definition pattern at the time. In the pattern forming method, the air-permeable substrate-based porous substrate ’ is a low-temperature firing plate made of ceramic particles and a resin; and the above-mentioned liquid is a liquid in which metal particles as a functional material are dispersed. According to the pattern forming method, the metal film can be formed on the porous substrate in a beautiful and short time between I26255.doc. The liquid droplet ejection device of the present invention has a discharge head containing a load. a substrate for placing the substrate; and a functional liquid of the droplet table and the liquid droplet ejection head as droplets, and discharging the liquid droplets to be placed on the first two: the liquid droplet nozzle is in front of the substrate On the upper surface, a pattern is formed on the upper surface of the substrate, and the substrate is provided with a pattern on the upper surface of the substrate. The table has a heating mechanism for the substrate. The liquid (4) is discharged from the device, and the droplets sprayed thereon can be evaporated by heating. Since the substrate is a gas permeable substrate, the evaporation component of the droplets is also expanded to the inside of the substrate. Thus, the pattern forming device of the present invention can increase the drying speed of the droplets. In the pattern forming apparatus, the stage includes: a mounting portion that has a ventilation J and a substrate, and a pressure reducing mechanism that is placed on the mounting portion via the mounting portion. The lower side of the substrate is decompressed. According to the liquid droplet ejecting apparatus, for example, when the air-permeable substrate is placed on the air-permeable port, the lower side of the air-permeable substrate is decompressed by the decompression mechanism, and the lower side of the air-permeable substrate is decompressed. Therefore, the evaporation component of the sprayed droplets also diffuses into the interior of the substrate. At this time, the lower side of the air-permeable substrate is decompressed, so that the diffusion of the inside of the air-permeable substrate can be promoted. As a result, the droplet discharge device can further increase the drying speed. The circuit board of the present invention is provided with a circuit component and has a wiring electrically connected to the circuit component, and the wiring is formed by the above-described pattern forming method. The circuit board of the present invention can further improve productivity. The circuit board. 126255.doc 1356661 [Embodiment] (First Embodiment) Hereinafter, a semiconductor wafer is mounted on a c-layer substrate in accordance with FIGS. 1 to 8 (LTCC: Low Temperature C〇-fired Ceramics multilayer substrate: low-temperature firing ceramic multilayer The present invention is embodied in a first embodiment of a method of forming a wiring pattern in a plurality of low-temperature fired substrates (green sheets) constituting a layer substrate.
首先，說明有關將半導體晶片安裝於LTCC多層基板所 構成之電路模組。圖1係表示電路模組丨之剖面圖。電路模 組1具有形成板狀之LTCC多層基板2、及線焊接連接於該 LTCC多層基板2之上側之半導體晶片3。 之複數低溫燒成基板4之 由玻璃陶瓷系材料（例如 化紹等陶瓷成分之混合 ’其厚度係以數百μιη形First, a circuit module in which a semiconductor wafer is mounted on an LTCC multilayer substrate will be described. Figure 1 is a cross-sectional view showing a circuit module. The circuit module 1 has a LTCC multilayer substrate 2 formed in a plate shape, and a semiconductor wafer 3 wire bonded to the upper side of the LTCC multilayer substrate 2. The plurality of low-temperature fired substrates 4 are made of a glass-ceramic material (for example, a mixture of ceramic components such as sulphate), and the thickness thereof is in the form of hundreds of μm
LTCC多層基板2係形成薄片狀 積層體。各低溫燒成基板4係分別 硼矽酸鹼氧化物等玻璃成分與氧 物）之燒結體’即多孔質性基板 成0 心里現成暴扳4係將其燒結前之基板稱為生胚片 :2、4、7)。生胚片4G係與黏合劑、整泡劑等同時混: 璃陶瓷系材料之粉末及分散媒而作 板狀後乾燥而成，具有通氣性：，將此聚泥形 板。 即生胚片4G係通氣性 各低溫燒成基板4係具有 件等各種電路元件5 ;電性 6 ;具有呈層疊通路構造、 電阻元件、電容元件、線圈元 連接各電路兀件5之内部佈線 熱通路構造之特定孔徑(例如 I26255.doc 1356661 20 μιη)之複數通孔7;及填充於各通孔7之複數之通路佈線 8 ° 各低溫燒成基板4上之各内部佈線6分別為銀或銀合金等 金屬微粒子之燒結體，利用圖2所示之液滴喷出裝置2〇之 佈線圖案形成方法所形成。 圖2係表示液滴噴出裝置2〇之全體立體圖。 在圖2t，液滴噴出裝置2G具有形成略直方體形狀之基 σ 21在基台21之上面形成沿著其長側方向（以下僅稱γ箭 號方向）延伸之一對導溝2 2。在導溝2 2之上方設置有沿著 導溝22而向Υ箭號方向及反γ箭號方向移動之台23。 在台23之上面，形成載置部24，用於載置燒成前之低溫 燒成基板4，即通氣性之生胚片4G。載置部以係對台。定 位固定被載置狀態之生胚片4G而向γ箭號方向及反γ箭號 方向搬送生胚片4G。在台23之上面，配設有橡膠加熱器 Η。可藉橡膠加熱器Η加熱載置於载置部以之生胚片4g， 而使本身之上面全體升溫至特定溫度。 在基台21，架設跨過與γ箭號方向正交之方向（以下僅稱 X箭號方向）之門型之導引構件25。在導㈣件25之上㈣ 設向X箭號方向延伸之墨水盒26。墨水盒26貯存著作為功 至液滴喷出頭（以下僅稱喷出頭）3〇。供應至喷出頭3〇之金 屬墨水F係由喷出頭3〇向生胚請喷出作為液滴Fb(參照圓 4) 〇 金屬墨水F可使用使作為功能材料之金屬微粒子，例如 I26255.doc 1356661 粒徑數nm〜數十⑽之金屬微粒子分散於溶媒之分㈣金屬 墨水。 〃 作為使用於金屬墨水F之金屬微粒子，例如除了含有金 (Au)、銀（Ag)、銅（Cu)、链（Αι)、鈀（pd) ' 鐘⑽卜鈦 ΓΠ)、钽（Ta)及鎳（Ni)等之材料外，可使用此等之氧化物、 以及超電導體之微粒子等。金屬微粒子之粒徑最好在【⑽ 以上0.1 μηι以下。金屬微粒子之粒徑大於時噴出 頭30之喷嘴N有發生阻塞之虞。又，金屬微粒子之粒徑小 於1 nm時，對金屬微粒子之分散劑之體積比變大，所得之 膜中之有機物之比率過多。 作為分散媒，只要屬於可使上述金屬微粒子分散，且不 引起凝聚之材料’並無特別限定。例如，&了水系溶媒以 外，可例不甲醇、乙醇、丙醇、丁醇等醇類、n_庚烷、n_ 辛烷、癸烷、十二烷、四癸烷、甲苯、二甲苯、曱基異丙 苯、暗煤、節、二戊烯、四氫化萘、十氫化萘、環己基苯 等碳化氫系化合物、或乙二醇、二乙二醇、三乙二醇、甘 /由、1，3 -丙一醇等多元醇類、聚乙二醇、乙二醇二曱醚、 乙二醇二乙蟪、乙二醇二甲乙醚、二乙二醇二甲醚、二乙 一醇一乙喊、二乙二醇二曱乙醚、1，2-二曱氧基乙烷、雙 (2-甲氧基乙）鍵、p_二噁烷等之醚系化合物、以及碳酸丙 烯S曰、γ-丁内酯、N_甲基·2·。比咯烷酮、二曱替曱醯胺、二 曱亞砜、3¾己酮、乳酸乙酯等極性化合物。此等之中，在 微粒子之分散性與分散液之穩定性、及適用於液滴噴出法 之奋易度之點上，以水、醇類、碳化氫系化合物、醚系化 126255.doc •12- 1356661 合物較理想， ’作為更理想之分散媒，可列舉水、碳化氣系 化合物。The LTCC multilayer substrate 2 is formed into a sheet-like laminate. Each of the low-temperature fired substrates 4 is a sintered body of a glass component such as a borosilicate acid oxide and an oxygen compound, that is, a porous substrate, and the substrate is formed into a green sheet. The substrate before sintering is referred to as a green sheet: 2, 4, 7). The green sheet 4G is mixed with a binder, a foam stabilizer, and the like: a powder of a glass ceramic material and a dispersion medium, and is dried in a plate shape, and has a gas permeability: the clay plate is formed. That is, the green sheet 4G is a gas-permeable low-temperature firing substrate 4 having various circuit elements 5 such as a member, and the electric circuit 6 has an internal wiring of a laminated via structure, a resistive element, a capacitor element, and a coil element connecting the circuit elements 5. a plurality of via holes 7 having a specific aperture (for example, I26255.doc 1356661 20 μm) of the heat path structure; and a plurality of via wirings filled in the respective via holes 8; each of the internal wirings 6 on each of the low-temperature fired substrates 4 is silver A sintered body of metal fine particles such as a silver alloy is formed by a wiring pattern forming method of the droplet discharge device 2 shown in Fig. 2 . Fig. 2 is a perspective view showing the entire droplet discharge device 2'. In Fig. 2t, the droplet discharge device 2G has a base σ 21 forming a substantially rectangular parallelepiped shape, and a pair of guide grooves 22 extending along the long side direction (hereinafter referred to as only the γ arrow direction) is formed on the upper surface of the base 21. Above the guide groove 22, a stage 23 that moves along the guide groove 22 in the direction of the arrow and the direction of the reverse y arrow is provided. On the upper surface of the stage 23, a placing portion 24 for placing the low-temperature fired substrate 4 before firing, that is, the air-permeable green sheet 4G, is formed. The placing unit is tied to the table. The green sheets 4G are placed in a fixed state, and the green sheets 4G are conveyed in the γ arrow direction and the reverse γ arrow direction. On top of the table 23, a rubber heater Η is provided. The raw material piece 4g placed on the placing portion can be heated by a rubber heater, and the entire upper surface of the material can be heated to a specific temperature. On the base 21, a door type guide member 25 that spans a direction orthogonal to the direction of the gamma arrow (hereinafter referred to simply as the X arrow direction) is set. Above the guide (four) member 25 (four), an ink tank 26 extending in the direction of the X arrow is provided. The ink tank 26 stores the work as a droplet discharge head (hereinafter simply referred to as a discharge head) 3 turns. The metal ink F supplied to the discharge head 3 is ejected from the ejection head 3 to the green sheet as a droplet Fb (reference circle 4). The metal ink F can be used as a metal microparticle as a functional material, for example, I26255. Doc 1356661 Metal microparticles having a particle size of several nm to several tens (10) are dispersed in a solvent (4) metal ink. 〃 As the metal fine particles used in the metal ink F, for example, in addition to gold (Au), silver (Ag), copper (Cu), chain (Αι), palladium (pd) 'clock (10), titanium (ΓΠ), tantalum (Ta) In addition to materials such as nickel (Ni), such oxides, fine particles of superconducting conductors, and the like can be used. The particle size of the metal fine particles is preferably [(10) or more and 0.1 μηι or less. When the particle diameter of the metal fine particles is larger than the nozzle N of the discharge head 30, there is a clogging. Further, when the particle diameter of the metal fine particles is less than 1 nm, the volume ratio of the dispersing agent to the metal fine particles becomes large, and the ratio of the organic substances in the obtained film is excessive. The dispersion medium is not particularly limited as long as it belongs to a material which can disperse the above-mentioned metal fine particles and does not cause aggregation. For example, other than the aqueous solvent, an alcohol such as methanol, ethanol, propanol or butanol, n-heptane, n-octane, decane, dodecane, tetradecane, toluene or xylene may be used. a hydrocarbon-based compound such as mercapto cumene, dark coal, nodal, dipentene, tetrahydronaphthalene, decalin or cyclohexylbenzene, or ethylene glycol, diethylene glycol, triethylene glycol, or glycerol Polyols such as 1,3 -propanol, polyethylene glycol, ethylene glycol dioxime ether, ethylene glycol diethyl hydrazine, ethylene glycol dimethyl ether, diethylene glycol dimethyl ether, diethyl alcohol An ether compound such as diethyl phthalate, diethylene glycol dioxime ether, 1,2-dimethoxy ethane, bis(2-methoxyethyl) bond, p-dioxane, and propylene carbonate , γ-butyrolactone, N-methyl·2·. A polar compound such as pyrrolidone, diterpene amine, disulfoxide, 33⁄4 hexanone or ethyl lactate. Among these, in terms of the dispersibility of fine particles, the stability of the dispersion, and the ease of application to the droplet discharge method, water, alcohols, hydrocarbon-based compounds, and ethers are 126255.doc • 12-1356661 is preferable, and as a more preferable dispersion medium, water and a carbonized gas compound are mentioned.
4G為通氣性基板，故如圖6所示， 媒之蒸發。另外，因生胚片 示’喷附在生胚片4G之金屬 墨水F即使在與生胚片4(5接觸之側，也會透過生胚片4〇而 使溶媒或分散媒之一部份蒸發。因此，喷附在生胚片4G之 金屬墨水F可進一步縮短本身乾燥所需之時間。又，在本 實施型態中，將喷附在生胚片4G(通氣性基板）之金屬墨水 F之接觸角、生胚片4G之氣孔率等設定在特定範圍時，喷 附在生胚片4G之液滴Fb不會滲透至生胚片4G内。 喷附在生胚片4G之金屬墨水F會隨著乾燥而使本身之表 面由外緣增黏。也就是說，在喷附在生胚片4G之金屬墨水 F中，金屬墨水F之外周部之固形份（粒子）濃度會比中央部 更快達到飽和濃度’故金屬墨水F會使本身之表面由外緣 增黏。增黏之金屬墨水F之外緣會停止沿著生胚片4 g之面 方向之本身之濕潤擴散。即，停止移動。停止移動狀態之 金屬墨水F會被固定在生胚片4G。停止移動狀態之金屬墨 水F在有其他之金屬墨水f重疊在本身之上時，會處於被固 定在生胚片4G之狀態，故不會被其次之液滴Fb拉過去。Since 4G is a gas permeable substrate, as shown in Fig. 6, the medium evaporates. In addition, the green ink F sprayed on the green sheet 4G shows a part of the solvent or the dispersion medium through the green sheet 4 even on the side of the green sheet 4 (5). Therefore, the metal ink F sprayed on the green sheet 4G can further shorten the time required for drying itself. Further, in the present embodiment, the metal ink sprayed on the green sheet 4G (air permeable substrate) is sprayed. When the contact angle of F, the porosity of the green sheet 4G, and the like are set to a specific range, the droplet Fb sprayed on the green sheet 4G does not penetrate into the green sheet 4G. The metal ink sprayed on the green sheet 4G F will thicken its surface by the outer edge as it dries. That is, in the metallic ink F sprayed on the green sheet 4G, the solid portion (particle) concentration in the outer periphery of the metallic ink F is higher than that in the center. The part reaches the saturation concentration faster', so the metal ink F will make its surface thicker by the outer edge. The outer edge of the thickened metal ink F will stop the wet diffusion along itself in the direction of the surface of the green sheet 4g. , stop moving. The metal ink F that stops moving will be fixed to the green sheet 4G. Stop moving. Metal ink F at the other metal ink f superimposed on itself, will be in a state of being fixed to 4G of the green sheet, it will not be followed by the droplets Fb pull over.
在導引構件25’在其X箭號方向大略全寬，形成向X箭 號方向延伸之上下一對之導執28。在上下一對導軌28，安 裝支架29。支架29被導軌28導動而可向X箭號方向及反X 126255.doc •13· < s) 箭號方向移動。在支架29, 裝載著液滴喷出頭30The guide member 25' is substantially wide in its X-arrow direction to form a pair of guides 28 extending in the X-arrow direction. A bracket 29 is mounted on the pair of upper and lower guide rails 28. The bracket 29 is guided by the guide rail 28 to move in the direction of the X arrow and the direction of the arrow X 126255.doc •13· < s). In the holder 29, the droplet discharge head 30 is loaded
正下方時 之下面稱為噴嘴形成面31a，將生胚片4G之上 面4Ga噴嘴板3 1在生胚片4G位於噴出頭30之 可將噴嘴形成面31a與喷出面4Ga間之距離（以 下僅稱為工作台間隙）保持特定距離（例如600 μιη)。 在圖3中，在喷嘴形成面3U，形成由沿著γ箭號方向排 列之複數喷嘴N所構成之一對喷嘴列NL。一對喷嘴列NL* 別形成有每吋180個喷嘴又，在圖3中，為便於說明起 見’僅s己載每一列1 〇個之喷嘴N。 在一對喷嘴列NL·中，從X箭號方向觀之，將一方喷嘴列 NL之各噴内插於他方噴嘴列nl之各喷嘴n之間。即， 喷出頭30係沿著γ箭號方向具有每吋18〇個χ2=36〇個喷嘴 Ν°即’將Υ箭號方向之最大解像度設定為36〇 dpi。 在圖4中’在喷出頭3 〇之上側，連結有作為流路之供應 管30T。供應管30T係配設成向Z箭號方向延伸，而將來自 墨水盒26之金屬墨水F供給至喷出頭30。 在各喷嘴N之上側，形成連通於供應管30T之空腔32。 空腔32收容來自供應管30T之金屬墨水F，並將收容之金屬 墨水F之一部分供給至連通之喷嘴n。在空腔3 2之上側，貼 附著可藉由沿著Z箭號方向振動而使空腔32内之容積擴大 及縮小之振動板33。在振動板33之上側，於各噴嘴N配設 126255.doc • 14· 1356661 有壓電疋件Pz。壓電元件pz沿著z箭號方向伸張而收縮 時，可使振動板33沿著Z箭號方向振動。沿著Z箭號方向振 動之振動板33由嘴嘴时出金屬墨水F作為特定大小之液滴 Fb。所噴出之液滴扑向喷嘴n之反z箭號方向飛行，妙 喷至生胚片犯之噴出面4Ga。 … 其-人，依照圖5，說明如上述所構成之液滴喷出裝置2〇 之電氣的構成。The lower side is referred to as a nozzle forming surface 31a, and the upper 4Ga nozzle plate 31 of the green sheet 4G is located at a distance between the nozzle forming surface 31a and the ejection surface 4Ga of the green sheet 4G at the ejection head 30 (below) Just called the table gap) keep a certain distance (for example, 600 μηη). In Fig. 3, at the nozzle forming surface 3U, a pair of nozzle rows NL composed of a plurality of nozzles N arranged along the γ arrow direction are formed. A pair of nozzle rows NL* are formed with 180 nozzles per turn. In Fig. 3, for convenience of explanation, only the nozzles N of each column are loaded. In the pair of nozzle rows NL·, each of the nozzle rows NL is interposed between the nozzles n of the other nozzle row n1 as viewed in the direction of the X arrow. That is, the ejection head 30 has 18 吋 2 = 36 喷嘴 nozzles per 吋 arrow direction Ν °, that is, the maximum resolution in the direction of the arrow is set to 36 〇 dpi. In Fig. 4, 'the supply pipe 30T as a flow path is connected to the upper side of the discharge head 3'. The supply pipe 30T is disposed to extend in the direction of the Z arrow, and supplies the metallic ink F from the ink tank 26 to the discharge head 30. On the upper side of each nozzle N, a cavity 32 communicating with the supply pipe 30T is formed. The cavity 32 accommodates the metallic ink F from the supply tube 30T and supplies a portion of the contained metallic ink F to the communicating nozzle n. On the upper side of the cavity 3 2, a vibrating plate 33 which can expand and contract the volume in the cavity 32 by vibrating in the direction of the Z arrow is attached. On the upper side of the vibrating plate 33, a 126255.doc • 14· 1356661 piezoelectric element Pz is disposed in each nozzle N. When the piezoelectric element pz is stretched in the z-arrow direction and contracted, the vibrating plate 33 can be vibrated in the Z-arrow direction. The vibrating plate 33 vibrating in the direction of the Z arrow emits the metallic ink F from the nozzle as a droplet Fb of a specific size. The ejected droplets fly toward the anti-z arrow of the nozzle n, and are sprayed to the ejection surface 4Ga of the raw embryo. The configuration of the liquid droplet ejection device 2A configured as described above will be described with reference to Fig. 5 .
在圖5中’控制裝置50具有CPU50A、ROM50B、 RAM 0C等。控制裝置5()係依照所儲存之各種資料及各種 控制程式執行台23之搬送處理、支架29之搬送處理、嘴 出頭30之液滴噴出處理、橡膠加熱器叹加熱處理等。 在控制裝置5G’連接具有各種操作開關與顯示器之輸出 入裝置51。輸出入裝置51係顯示液滴喷出裝置20所執行之 各種處理之處理狀況。冑出入裝置產生形成内部佈線6 用之位兀對映f料BD，並將位元對映資料BD輸入至控制In Fig. 5, the control device 50 has a CPU 50A, a ROM 50B, a RAM 0C, and the like. The control device 5 () controls the transfer processing of the table 23, the transfer processing of the holder 29, the droplet discharge processing of the nozzle 30, and the rubber heater sigh heat treatment in accordance with various stored data and various control programs. An output device 51 having various operation switches and displays is connected to the control device 5G'. The input/output device 51 displays the processing conditions of various processes executed by the droplet discharge device 20. The 胄 access device generates a 兀 mapping material BD for forming the internal wiring 6 and inputs the bit mapping data BD to the control
位元對映資料将仿B3欠A - 係依3各位几值（〇或1)規定各壓電元件 PZ之通電或斷電之眘料。_ &丨 I电t貢科。位TG對映資料BD係規定是否將 液滴Fb噴出至通過嘻+ 迴贺出頊3〇,即各噴嘴N之描繪平面（噴出 面4Ga)上之各位晋夕咨决止 _ 之貝枓。即，位元對映資料BD係用來 使佈線用之液滴Fb喷出ψ & 噴出面4Ga所規定之内部佈線6之 目標形成位置之資料。 驅動電路52。控制裝置5〇 驅動電路52。X軸馬達驅 在控制裝置50 ’連接X轴馬達 將驅動控制信號輸出至X軸馬達 126255.doc •15· 1356661 動電路52回應來自控㈣置％之驅動控制信號，而使促使 支架29移動用之χ軸馬達Μχ正轉或反轉。在控制裝置， 連接Υ轴馬達驅動電路53。控制裝置5〇將驅動控制信號輸 出至Υ轴馬達駆動電路53。Υ轴馬達驅動電路53回應來自 控制裝置5〇之驅動控制信號，而使促使台23移動用之Υ轴 馬達Μ Υ正轉或反轉。 在控制裝置50’連接噴出頭驅動電路54。控制裝置5〇係 與特定之喷出頻率同步而產生噴出時間信號[丁，將喷出時 間H LT輸出至喷出頭驅動電路54。控制裝置係與喷出 頻率同步而將驅動各壓電^ρζ用之驅動電壓讀輸出 至喷出頭驅動電路54。The bit mapping data will be in accordance with the assumption that B3 owes A-type according to the values of three bits (〇 or 1) to prescribe the energization or de-energization of each piezoelectric element PZ. _ &丨 I electric t Gongke. The bit TG mapping data BD specifies whether or not the droplets Fb are ejected to pass through the 嘻+ 贺 顼 〇 〇 〇 〇 〇 〇 〇 〇 〇 枓 枓 枓 枓 枓 枓 枓 枓 枓 枓 枓 枓 枓 枓 枓 枓 枓 枓 枓 枓 枓 枓 枓 枓 枓 枓 枓 枓 枓 枓 枓In other words, the bit-equivalent data BD is used to cause the droplets Fb for wiring to be ejected from the target formation position of the internal wiring 6 defined by the ejection surface 4Ga. Drive circuit 52. Control device 5 〇 drive circuit 52. The X-axis motor drive is connected to the X-axis motor at the control device 50' to output a drive control signal to the X-axis motor 126255.doc • 15· 1356661 The dynamic circuit 52 responds to the drive control signal of the control (four) set, thereby causing the carriage 29 to move. The axis motor is either forward or reverse. In the control device, the x-axis motor drive circuit 53 is connected. The control unit 5 outputs a drive control signal to the x-axis motor swing circuit 53. The x-axis motor drive circuit 53 responds to the drive control signal from the control unit 5 to cause the spindle motor Μ 促使 to move forward or reverse. The discharge head drive circuit 54 is connected to the control device 50'. The control unit 5 generates a discharge time signal in synchronization with a specific discharge frequency, and outputs the discharge time H LT to the discharge head drive circuit 54. The control device reads and outputs the driving voltage for driving each of the piezoelectric electrodes to the ejection head driving circuit 54 in synchronization with the ejection frequency.
控制裝置50係利用位元對映資料的而與特定頻率同步 地產生圖案形成用控制信號SI ’將圖案形成用控制信號^ 串列轉送至喷出頭驅動電路54。喷出頭驅動電㈣使來自 控制裝置50之圖案形成用控制信號幻對應於各壓電元件Μ 而逐次施行φ列/並列變換。喷出頭驅動電路⑽在每當 接到來自控制裝置50之喷出時間信號[丁時，閃鎖串列/並 列變換後之圖案形成用控制信號SI，將驅動電壓刪供給 至此圖案形成用控制信號SI所選擇之壓電元件pz。 在控制裝置50,連接橡膠加熱器驅動電路^。控制裝置 50係將驅動控制信號輸出至橡膠加熱器驅動電路55。橡耀 加熱器驅動電路55回應來自控制裝置5〇之驅動控制信號而 驅動橡膠加熱器Η，藉此，將裁 种戰置於台23之生胚片4g之溫 度控制於預定之溫度。在本實施型態中，預定之生胚片扣 126255.doc •16· 1356661 2皿度即喷出面4Ga之溫度為由嘴出頭％喷出時之 墨水F之溫度以上，B 隻屬 、 未滿金屬墨水F所含之液體組成中之 /點之’皿度。在此’所謂液體組成之沸點係未滿金屬墨水 ，所含之液體組成中沸點最低之組成之沸點。 也就是說，控制裝置5〇係將生胚片扣之溫度控制在由喷 出頭30贺出時之金屬墨水F之溫度以上。因此， 在被喷出時不會在喷出頭3〇乾 時，會迅速被加熱而乾燥…晴置=為液滴Fb 衩制裝置50係將生胚片4g 之溫度控制在未滿液體組成中之沸點之溫度。藉此，金屬 墨水^喷附作為液滴_，會被加熱至未滿㈣Fbq 點之溫度，故不會在生胚片4G上突然沸騰。 其次，說明有關使用上述液滴喷出裝置2Q所形成之生胚 片4G之佈線圖案之形成方法。 如圖2所示，液滴喷出裝置20將生胚片4G载置於台23, 將生胚片4G之喷出面4Ga配置於上側。此時，台U係將生 胚片4G配置於支架29之反¥箭號方向。此生胚片扣且有通 孔7、與通路佈線8’可藉液滴喷出裝置2〇在喷出面仙形 成作為佈線圖案之内部佈線6。 由此狀態，將形成内部佈線6用之位元對映資料BD由輸 出入裝置51輸入至控制裝置5〇。控制裝置儲存由輸出入 裝置51輸入之位謂映資料BDe此時，控制裝置5〇經由 橡膠加熱器驅動電路55驅動橡膠加熱器H，將生胚片叩全 體均句地加熱至前述特定溫度。即，將生胚片4G之喷出Z 4Ga控制於由喷出頭30噴出時之金屬墨水f之溫产以上，且 126255.doc 17 1356661 未滿金屬墨水F所含之液體組成之沸點（未滿液體組成中沸 點最低之溫度）之溫度。 接著，控制裝置50經由Y轴馬達驅動電路53驅動γ軸馬 達MY，以搬送台23，藉此可使喷出頭3〇通過目標形成位 置之正上方。而，控制裝置50經由X軸馬達驅動電路52驅 動X轴馬達MX而開始喷出頭30之掃描（往動）。 控制裝置50在開始喷出頭30之掃描（往動）時，依據位元 對映資料BD產生圖案形成用控制信號SI，將圖案形成用控 制信號SI與驅動電壓COM輸出至喷出頭驅動電路54。即， 控制裝置50係在每當經由喷出頭驅動電路M驅動各壓電元 件PZ，喷出頭30位於形成内部佈線6用之位置上時，即由 被選擇之喷嘴N喷出液滴Fb。噴附在此生胚片4(}之液滴扑 由於生胚片4G已被加熱至喷出時之液滴Fb之溫度以上，故 可迅速乾燥。而且，因生胚片4G為通氣性基板，故如圖6 所示’可促進液滴Fb向生胚片4G内蒸發、乾燥。 在本實施型態中，如圖7及圖8(a)〜(d)所示，被喷出之各 液滴Fb分別逐次喷附在形成内部佈線6用之各位置。詳言 之，在本實施型態中，為形成圖案而先噴附之液滴扑可藉 本身之一部份之乾燥而固定（停止移動）於生胚片4g。即， 停止本身之濕潤擴散。噴附在生胚片4G之次一液滴扑會被 噴出至圖7及圖8(a)之1點短劃線所示之位置而使本身之一 部份重疊於前面之液滴Fb。 也就是說，喷出頭30喷出液滴几之時點係依據由液滴^ 從喷出頭3G喷出之時至被固^於生胚片4G(停止移動）所需 126255.doc •18· uu丄 之時間或由喷出 頭〇喷出前一液滴Fb 一液滴Fb之位署杯雨 < 1立直主到達喷出次 .. 所而之移動時間等加以決定。因此，龙# 賀出裝置20係由生胚 疋因此，液滴 ^ ^ 之加熱溫度、喷出頭30之移動这 度專預先以f驗笼讯<秒動連 、貧驗“疋喷出時點，即喷出間隔時間。 因此，液滴喷出裝置2〇在 向往動，一面以…係在一面使喷出頭30向X箭號方 述喷出間隔時間喷出液滴Fb時，使先噴 附在生胚片4G之液滴Fb迅逮乾燥。 使先噴 而如圖8(b)所示，當虚♦义 *處於别一液滴Fb被固定於生胚片 4G之狀態時，次 玍胚片 ' 會被喷附在圖8(c)之1點短劃線 所不之位置而使本身 』深 艿之°卩伤重疊於處於固定狀態之前一 液滴Fb。此時，處於固 疋狀I之刖一液滴Fb在生胚片4g :移動，故不會被拉向次-液滴Fh又，重疊於前— ’’ 之X液滴Fb由於本身未重疊之部份會被生胚片 .，，、故可立即開始乾燥而迅速乾燥，並處於固定狀 態。因此，次-液滴Fb不會被拉向前一液滴別。 其結果，逐次切在形成㈣佈線6用之各位置之液滴The control device 50 relays the pattern forming control signal to the discharge head driving circuit 54 in a series of pattern forming control signals SI' in synchronization with the specific frequency by using the bit mapping data. The discharge head driving electric power (4) causes the pattern forming control signal from the control device 50 to morphly correspond to each piezoelectric element Μ to sequentially perform φ column/parallel conversion. The ejection head driving circuit (10) supplies the driving voltage to the pattern forming control every time the discharge time signal from the control device 50 is received, and the pattern forming control signal SI after the flash lock serial/parallel conversion is received. The piezoelectric element pz selected by the signal SI. At the control device 50, a rubber heater drive circuit ^ is connected. The control device 50 outputs a drive control signal to the rubber heater drive circuit 55. The rubber heater driving circuit 55 drives the rubber heater 回应 in response to a drive control signal from the control unit 5, whereby the temperature of the green sheet 4g placed on the table 23 by the cutting operation is controlled to a predetermined temperature. In this embodiment, the predetermined green piece buckle 126255.doc •16·1356661 2 degrees, that is, the temperature of the ejection surface 4Ga is greater than the temperature of the ink F when the nozzle is ejected by the mouth, B is only, not The degree of the liquid in the liquid composition contained in the full metal ink F. Here, the boiling point of the liquid composition is less than the boiling point of the composition having the lowest boiling point among the liquid compositions contained in the metal ink. That is, the control unit 5 controls the temperature of the green sheet buckle to be higher than the temperature of the metallic ink F when the ejection head 30 is ejected. Therefore, when it is ejected, it will not be heated and dried quickly when the ejection head 3 is dried. The clear setting = the droplet Fb The tanning device 50 controls the temperature of the green sheet 4g to be less than the liquid composition. The temperature of the boiling point in the medium. Thereby, the metal ink is sprayed as the droplet _, and is heated to a temperature less than the (F) Fbq point, so that it does not suddenly boil on the green sheet 4G. Next, a method of forming a wiring pattern of the green sheet 4G formed by using the above-described droplet discharge device 2Q will be described. As shown in Fig. 2, the droplet discharge device 20 mounts the green sheet 4G on the stage 23, and arranges the discharge surface 4Ga of the green sheet 4G on the upper side. At this time, the U-series arranges the green sheets 4G in the direction of the anti-¥ arrow of the holder 29. The green sheet has a through hole 7 and a via wiring 8' which can be formed on the ejection surface by the droplet discharge device 2 to form an internal wiring 6 as a wiring pattern. In this state, the bit mapping material BD for forming the internal wiring 6 is input from the input/output device 51 to the control device 5A. The control device stores the bit map data BDe input from the input/output device 51. At this time, the control device 5 drives the rubber heater H via the rubber heater drive circuit 55 to heat the green sheet to the specific temperature. That is, the ejection Z 4Ga of the green sheet 4G is controlled above the temperature of the metallic ink f when ejected from the ejection head 30, and 126255.doc 17 1356661 is less than the boiling point of the liquid composition contained in the metallic ink F (not The temperature at which the lowest boiling point of the liquid composition is the lowest. Next, the control device 50 drives the γ-axis motor MY via the Y-axis motor drive circuit 53 to transport the stage 23, whereby the discharge head 3〇 can be passed directly above the target formation position. On the other hand, the control device 50 drives the X-axis motor MX via the X-axis motor drive circuit 52 to start scanning (moving) of the discharge head 30. When the scanning device 30 starts the scanning (moving) of the ejection head 30, the pattern forming control signal SI is generated based on the bit mapping material BD, and the pattern forming control signal SI and the driving voltage COM are output to the ejection head driving circuit. 54. That is, the control device 50 drives the respective piezoelectric elements PZ via the ejection head driving circuit M, and when the ejection head 30 is located at the position for forming the internal wiring 6, that is, the droplets Fb are ejected from the selected nozzle N. . The droplets squirted on the green sheet 4 (*) can be rapidly dried because the green sheet 4G has been heated to a temperature higher than the temperature of the droplet Fb at the time of ejection. Moreover, since the green sheet 4G is a gas permeable substrate, Therefore, as shown in Fig. 6, the liquid droplet Fb can be promoted to evaporate and dry into the green sheet 4G. In the present embodiment, as shown in Figs. 7 and 8(a) to (d), each of the liquid droplets is ejected. The droplets Fb are successively sprayed at respective positions for forming the internal wiring 6. In detail, in the present embodiment, the droplets which are first sprayed to form a pattern can be fixed by drying a part of itself. (stop moving) on the green sheet 4g, that is, stop the wet diffusion of itself. The next droplet sprayed on the green sheet 4G will be ejected to the one-dot dash line of Fig. 7 and Fig. 8(a). The position is shown so that one part of itself overlaps the front drop Fb. That is, the time at which the discharge head 30 ejects the liquid droplets is based on the time when the liquid droplets are ejected from the ejection head 3G to the time Fixing the raw embryo 4G (stop moving) required 126255.doc •18· uu丄 time or jetting the first droplet Fb a droplet Fb by the ejection head 杯 cup of rain < 1 upright Arriving and ejecting Therefore, the movement time and so on are determined. Therefore, the dragon #贺出装置20 is made of raw embryos. Therefore, the heating temperature of the droplet ^^ and the movement of the ejection head 30 are pre-tested. <Second-time continuous connection, poor inspection "The time when the squirting is ejected, that is, the ejection interval. Therefore, the liquid droplet ejecting device 2 is moving forward, and the ejection head 30 is directed to the X arrow on one side. When the droplet Fb is ejected at the ejection interval, the droplet Fb sprayed on the green sheet 4G is quickly dried. The first spray is as shown in Fig. 8(b), and when the liquid is in another liquid When the drop Fb is fixed in the state of the green sheet 4G, the secondary ridge piece 'will be sprayed on the position where the dash of 1 o'clock in Fig. 8(c) is not attached, so that the squat is overlapped. A droplet Fb before being in a fixed state. At this time, the droplet Fb in the solid state I is moved in the green sheet 4g, so it is not pulled to the sub-drop Fh, and overlaps the front - '' The X droplet Fb can be dried by the part which is not overlapped by itself, and can be quickly dried and quickly dried, and is in a fixed state. Therefore, the sub-drop Fb is not pulled forward. Do droplets. As a result, each of the successive positions of the cut in the droplet formed by the wires 6 (iv)
Fb會分別被乾燥而不致於由喷附之位置偏移。因此，液滴 喷出裝置20如圖杯* + , -Tiiy丄 ()所不可形成内部佈線ό用之佈線用圖 案ρ而且’滴喷出裝置2〇加熱生胚片4G ’並使用通氣性 板之生胚片4G ’故可使噴附之液滴Fb迅速乾燥而固定於 生胚片4G °此結果’液滴喷出裝置2G可縮短液滴Fb之喷出 間隔時間’故可在短時間形成内部佈線6用之佈線用圖案 p另外，液滴喷出裝置2〇將生胚片4G之溫度控制於未滿 液滴Fb之沸點之溫度’故可避免喷附之液滴几之突然沸The Fb will be dried separately without being offset by the position of the spray. Therefore, the droplet discharge device 20 does not form the wiring pattern ρ for the internal wiring as shown in the cup * + , -Tiiy 丄 (), and the 'drip ejection device 2 〇 heats the green sheet 4G ' and uses the air permeable sheet The green sheet 4G' can be used to quickly dry the sprayed droplet Fb and fix it to the green sheet 4G. As a result, the 'droplet ejection device 2G can shorten the ejection interval of the droplet Fb', so it can be in a short time. In addition, the droplet discharge device 2 is configured to control the temperature of the green sheet 4G to a temperature lower than the boiling point of the droplet Fb, so that the sudden boiling of the droplets to be sprayed can be avoided.
126255.doc -19· C 1356661 騰’確實形成佈線用圖案P。 控制裝置50係使喷出頭30向X箭號方向掃描（往動）而完 成第1次之液滴Fb之動作。接著，控制裝置5〇為了將液滴 Fb喷出至形成内部佈線6用之生胚片4G上之新位置，經由 Y軸馬達驅動電路53驅動Y軸馬達厘丫，向γ方向搬送台23 特定量後，使噴出頭30向反X箭號方向掃描（復動）。 喷出頭30之掃描（復動）開始時，與前述同樣地，控制裝 置50依據位元對映資料BD，經由喷出頭驅動電路“驅動 各壓電元件ΡΖ»而’控制裝置5〇係在每當喷出頭3〇位於形 成内部佈線6用之各位置時，由被選擇之喷嘴]^喷出液滴 Fb。在此情形，也與前述同樣地，先噴附於生胚片之液 滴Fb可立即開始乾燥而迅速乾燥。而，當液滴扑呈現被固 疋於生胚片4G之狀態時，控制裝置5〇喷附次一液滴Fb而使 其本身之一部分重疊於處於固定狀態之液滴Fb。 其後，控制裝置50使喷出頭3〇向又箭號方向及反χ箭號 方向往復移動，並向Y箭號方向搬送台23。而，控制裝置 50在噴出頭30之往復移動中，以依據位元對映資料]31)之 時點重複施行喷出液滴Fb之動作。藉此，液滴喷出裝置2〇 可在生胚片4G上利用液滴Fb形成内部佈線6用之佈線用圖 案P。 其次，如上述所構成之第丨實施型態之效果如以下所記 載。 (1)依據上述實施型痣，由於生胚片4(}之溫度已被加熱 至喷出時之液滴Fb之溫度以上，故可使喷附之液滴Fb迅速 126255.doc -20. ^56661 乾燥。因此，液滴喷出裝置20可縮短液滴Fb之噴出間隔時 間’故可在短時間形成佈線用圖案p。 (2) 依據上述實施型態，由於生胚片4G為通氣性基板， 故液滴Fb可通過生胚片4G内蒸發，因此可進一步促進乾 燥。從而，液滴噴出裝置20可進一步縮短液滴Fb之喷出間 隔時間，可在更短時間形成佈線用圖案p。 (3) 依據上述實施型態’由於生胚片4G之加熱溫度被控 制在未滿液滴Fb之沸點溫度，故噴附之液滴Fb不會突然沸 騰。因此，液滴喷出裝置20可形成高密度、高精細之佈線 用圖案P » (4)依據上述實施型態，由於液滴喷出裝置2〇係在先哨 附之液滴Fb處於固定狀態時，喷附其次之液滴几，而與其 —部分重疊。因此，處於固定狀態之前一液滴几不會被拉 向以本身之-部分重疊方式喷附之其次之液滴扑。故液滴 嘴出裝置20可形成高密度、高精細之佈線用圖案p。 ⑴依據上述實施型態，液滴喷出裝置2〇可藉橡膠加熱 Μ，均句地加熱生胚片扣之上面全體。因此，在喷附在 生胚片4G之液滴以會由本身之外周部蒸發，使外周部之固 ^份（粒子）濃度比中央部更快達到飽和濃度。其結果，喷 附之液滴Fb會停止沿著生胚片 I。女b ^ <囟万向之本身之濕潤擴 欢亦即’噴附之液滴Fb合由 雄姓4 * θ由外周部處於固定狀態，故可 維持喷附時之外形形狀。苴姓 高密产古接έ 狀—果，液滴喷出襄置20可形成 巧在度、间精細之圖案。 (6)依據上述實施型態， 貨襞置2〇可利用喷附之 126255.doc 丄丄 液滴Fb固疋以前之時門—凡索哈 月j义時間6又疋喷出間隔時間，故可在前一液 滴確實處於固定狀態後，再噴出次一液滴。 (第二實施型態） ▲以下，依照圖9〜圖u說明將本發明具體化之第二實施型 第實細*型態係變更第一實施型態之台u之實施型 態。因此’以下詳述其變更點。 在圖9中，台23具有台本體23a、配設於台本體23a之上 面之橡膠加熱器H'及構成配置於橡膠加熱器上面之 載置部之台板23b。台本體23a係配設於基台21之上面而在 受到Y軸馬達MY之驅動力時，可向γ箭號方向及反γ箭號 方向移動。橡膠加熱器Η配置於台本體23 a與台板23 b之 間’用於將載置於台板23b上面之生胚片4G加熱至特定溫 度。台板23b係陶瓷基板且具有通氣性之多孔質性基板， 在其上面載置生胚片4G»載置於台板23 b之生胚片4G透過 台板23b而接受到來自橡膠加熱器η之熱時，可使本身之上 面全體升溫至特定溫度。 台23如圖9之虛線所示，具有由台本體23a之内部延伸至 橡膠加熱器Η之上面之吸引通路23c。吸引通路23c係配設 於其一端開口部在台板23b之下面而與所載置之生胚片4G 相對向之位置。吸引通路23c係被連結於其他端開口部連 結於台本體23a之側面之未圖示之吸引管。吸引管係藉由 連接於吸引泵VP(參照圖11)而經由吸引管及吸引通路23c 將台板2 3 b之下側減壓。此時，台板2 3 b為具有通氣性之多 孔質性基板，故吸引泵VP之吸引力可通過台板23b内到達 126255.doc •22- 1356661 生胚片4G之下面全體。到達生胚片4G之下面之吸引力可 將生胚片4G吸附於台板23b。 在圖10中’喷附至生胚片4G之金屬墨水F(液滴Fb)會由 本身之表面蒸發溶媒或分散媒之一部分。此時，因生胚片 4G被加熱，故可促進液滴Fb所含之溶媒或分散媒之蒸發。 更由於生胚片4G為通氣性基板，故如圖1〇所示，喷附至生 胚片4G之液滴Fb在與生胚片4G接觸之側，也會透過生胚 片4G而蒸發溶媒或分散媒之一部分。因此，噴附在生胚片 4G之液滴Fb可進一步縮短本身乾燥所需之時間。 而且，生胚片4G被載置於通氣性之台板23b，故本身之 下面可被經由台板23b之吸引泵VP之吸引力所吸引。噴附 在生胚片4G之液滴Fb因受到吸引泵VP之吸引力，故可使 溶媒或分散媒進一步向生胚片4G内擴散◊其結果，噴附在 生胚片4G之液滴Fb可進一步縮短乾燥時間。 又，在本實施型態中，將噴附在生胚片4G(通氣性基板） 之液滴Fb之接觸角、生胚片4G之氣孔率、及達到生胚片 4G之下面之吸引力等設定在特定範圍時，噴附在生胚片 4G之液滴Fb不會滲透至生胚片4G内。 其次，依照圖11 ’說明如上述所構成之液滴噴出裝置2〇 之電氣的構成。 在圖11中，控制裝置5〇依照所儲存之各種資料及各種控 制私式t仃台23之搬送處理 '支架29之搬送處理、喷出 頭30之液滴噴出處理、橡膠加熱器η之加熱處理、生胚片 4G之下側之減壓處理等。 126255.doc •23- (S ) 1356661 在控制裝置50，連接吸引泵驅動電路％。控制裝置5〇係 將驅動控制信號輪出至吸引泵驅動電路56。吸引泵驅動電 路56回應來自控制裝置5〇之驅動控制信號而驅動吸引泵 vp。藉此，將載置於台板2313之生胚片4(}載置固定成特定 之減壓狀態。 欲形成佈線圖案時，控制裝置50驅動設於台本體23a之 橡膠加熱器H，將載置於台板23b之生胚片4G之全體均勻 地加熱至前述特定溫度。即，將生胚片4(}之喷出面4Ga控 制於由喷出頭30噴出時之金屬墨水F之溫度以上，且未滿 金屬墨水F所含之液體組成中沸點（未滿液體組成中之沸點 最低之組成之溫度）之溫度。另外，控制裝置5〇係經由吸 引泵驅動電路56驅動吸引泵VP，將載置於台板23b之生胚 片4G之下侧狀態。因此，生胚片4G之下側處於減壓狀 態，故可進一步促進向生胚片4G内之液滴抑之蒸氣之擴 散，藉此，進一步縮短液滴Fb之乾燥時間。 其次，如上述所構成之第二實施型態之效果如以下所記 (7) 依據上述實施型態，由於生胚片之下側處於減壓 狀態，故噴附於生胚片4G之金屬墨水ρ可進一步促進向生 胚片4G内之蒸氣之擴散’其結果，噴附於生胚片之金 屬墨水F可進一步縮短乾燥時間。 (8) 而且，由於將生胚片4g载置於具有通氣性之多孔質 性之台板23b。因此，可經由多孔質性之台板231?減壓生胚 片4G之下側，故生胚片4G之下侧全體可被均勻減壓。此 126255.doc •24· 1356661 結果，嗔附至生胚片4G之液滴巧不會受喷到之位置所左 右’而可毫無不均地均_地使與生^4g接觸之側之蒸發 擴散。 ⑺另外，由液⑽蒸發之蒸氣會經由吸引通路23。而被 吸引泵vp集中，故液滴喷出裝置2〇可降低蒸氣之污染。 又，上述實施型態也可如以下方式加以變更。 •在上述第二實施型態中，台板23b為通氣性之多孔質 陶究基板。台板23b並不限定於此，只要是具有通氣性即 可，例如也可為具有通氣性之燒結金屬。 在上述實％型態中，台23係在台本體Ua積層橡膠加 熱器H、與通氣性之多孔f陶竟基板構成之台板咖。但例 如也可採用在台本體23a之上面具有凹部，在該凹部之底 部配設橡膠加執考Η，& y· η® …、器 而在該橡膠加熱器Η之上部配設台 板23b之構成。 σ 23之全體既可為具有通氣性之多孔質陶瓷，也可 為具有通氣性之多孔質燒結金屬。 a ·在上述實施型，態中’對前一液滴巧，局部重疊而喷附 商b之際’液滴喷出裝置2〇係在前一液滴Fb在生胚 片4G成為固定狀態後’再噴附次-液滴Fb。但不限定於 —液=喷出襄置2G也可在前—液滴巧在生胚片4G成為固 定狀態前，喷附次一液滴Fb。 述實施型態中’對前一液滴Fb，以本身局部重疊 方式嘴附次-液滴Fb。但不限^於此，也可採用次一液滴 Μ一部分不與前-液滴扑重養而噴附之構成。 126255.doc •25- 丄乃6661 -•在上述實施型態中，前一液紐與次—液滴Fb係以喷 附徑之一半之間距重叠，但其重疊之比率也可適宜地予以 變更而實施。 ,·在上述實施型態中，複數液滴Fb係依嘴出順序重疊而 • ㊉成佈線用圖案p”旦不限定於此，例如也可如圖 - U(a)〜（f)所示之順序喷出而形成佈線用圖案P。 . 即二如圖12⑷所示，為形成圖案，在前一液滴Fb喷附 • 在特定位置時，使次一液滴Fb噴附在離開已喷附之液滴Fb 之1點短劃線所示之噴附位置A1。液滴巧喷附在喷附位置 辦’使次-液滴㈣本身之—部分重疊於最初喷附之液 滴抑之方式喷附在圖12(b)所示之〗點短劃線所示之喷附位 置A2。 液滴扑喷附在喷附位置八2時，使次一液滴扑以本身之 一部分重疊於喷附在喷附位置幻之液滴別之方式噴附在圖 12(c)所不心點短劃線所示之噴附位置A3。錢，同樣地 φ ㈣圖12(d)、⑷所示之順序，將液滴巧噴附配置在喷附 位置Α4、Α5。藉此’也可採用形成如圖12⑴所示之佈線 用圖案Ρ之構成。 •在上述實施型態中’利用橡膠加熱器Η加熱生胚片 4G ’但也可利用其他加熱器機構加熱生胚片4G。 在上述實施型態中，將功能液具體化成為金屬墨水 卜但不限定於^匕’例如也可將功能液具體化成為含液晶 材料之功月b液。也就是說’功能液只要是被喷出用來形成 126255.doc • 26 · 1356661 述實施型態中，將基體具體化成為生胚片4G。但 不限定於此’基板只要是通氣性芙拓而 女疋逋虱f生丞扳而不會立即滲透液滴 之基板’任何基板皆可。 •在上述實施型態中 元件驅動方式之液滴喷 頭也可具體化成為電阻 頭。 ，將液滴喷出機構具體化成為壓電 出頭30。但不限定於此，液滴噴出 加熱方式或靜電驅動方式之噴出 【圖式簡單說明】126255.doc -19· C 1356661 Teng' does form a wiring pattern P. The control device 50 causes the discharge head 30 to scan (move) in the direction of the X arrow to complete the operation of the first droplet Fb. Next, the control device 5 drives the Y-axis motor centistoke via the Y-axis motor drive circuit 53 to eject the liquid droplet Fb to a new position on the green sheet 4G for forming the internal wiring 6, and to specify the γ-direction transfer table 23 After the amount, the ejection head 30 is scanned (re-shifted) in the direction of the reverse X arrow. At the start of scanning (duplication) of the ejection head 30, the control device 50 "drives each piezoelectric element" and "control device 5" via the ejection head driving circuit in accordance with the bit mapping data BD in the same manner as described above. When the ejection head 3 is located at each position for forming the internal wiring 6, the droplet Fb is ejected from the selected nozzle. In this case, as in the foregoing, the ejection is first performed on the green sheet. The droplet Fb can be immediately dried and quickly dried. However, when the droplet is present in the state of being fixed to the green sheet 4G, the control device 5 〇 sprays the next droplet Fb to partially overlap itself. The droplet Fb in the fixed state. Thereafter, the control device 50 reciprocates the ejection head 3 in the direction of the arrow direction and the arrow direction, and transports the table 23 in the direction of the Y arrow. The control device 50 is ejected. In the reciprocating movement of the head 30, the action of ejecting the droplets Fb is repeatedly performed at the time point according to the bit mapping data 31). Thereby, the droplet ejecting apparatus 2 can utilize the droplets Fb on the green sheets 4G. The wiring pattern P for the internal wiring 6 is formed. Next, the third embodiment configured as described above The effect of the state is as follows. (1) According to the above-described embodiment, since the temperature of the green sheet 4 is heated to be higher than the temperature of the droplet Fb at the time of ejection, the droplet Fb can be sprayed. Rapidly 126255.doc -20. ^56661 is dried. Therefore, the droplet discharge device 20 can shorten the discharge interval of the droplets Fb', so that the wiring pattern p can be formed in a short time. (2) According to the above embodiment, Since the green sheet 4G is an air permeable substrate, the droplet Fb can be evaporated in the green sheet 4G, so that the drying can be further promoted. Therefore, the droplet discharge device 20 can further shorten the ejection interval of the droplet Fb, which can be further improved. The pattern p for wiring is formed in a short time. (3) According to the above embodiment, since the heating temperature of the green sheet 4G is controlled to the boiling temperature of the liquid droplet Fb, the sprayed droplet Fb does not suddenly boil. The liquid droplet ejecting apparatus 20 can form a high-density, high-definition wiring pattern P » (4) According to the above embodiment, since the liquid droplet ejecting apparatus 2 is attached to the whistle attached to the droplet Fb in a fixed state , spraying the next few droplets, but partially overlapping them. Before the liquid is in a fixed state, a droplet is not pulled toward the next droplet which is sprayed in a partial-partially overlapping manner. Therefore, the droplet discharge device 20 can form a high-density, high-definition wiring pattern p. (1) According to the above embodiment, the liquid droplet ejecting apparatus 2 can heat the crucible by the rubber to uniformly heat the entire upper surface of the green sheet buckle. Therefore, the droplets sprayed on the green sheet 4G can be used by itself. The outer peripheral portion evaporates so that the concentration of the solid portion (particles) in the outer peripheral portion reaches the saturation concentration faster than the central portion. As a result, the sprayed droplet Fb stops along the green sheet I. Female b ^ < The wet expansion of the itself, that is, the "sprayed droplet Fb" is fixed by the outer peripheral portion 4* θ from the outer peripheral portion, so that the outer shape at the time of spraying can be maintained. The surname is high-density, and the squirting of the sputum-like fruit can form a pattern of fineness and fineness. (6) According to the above-mentioned embodiment, the 襞 〇 126 126 126 126 126 126 126 126 126 126 126 126 126 126 126 126 126 126 126 126 126 126 126 126 126 126 126 126 126 126 126 126 126 126 126 126 126 126 126 126 126 126 126 126 The next drop can be ejected after the previous drop is indeed in a fixed state. (Second Embodiment) Hereinafter, the second embodiment of the present invention will be described with reference to Fig. 9 to Fig. 9 to change the embodiment of the first embodiment. Therefore, the changes are detailed below. In Fig. 9, the table 23 has a table main body 23a, a rubber heater H' disposed on the upper surface of the table main body 23a, and a platen 23b constituting a mounting portion disposed on the rubber heater. The stage main body 23a is disposed on the upper surface of the base 21 and is movable in the direction of the γ arrow direction and the reverse γ arrow direction when the driving force of the Y-axis motor MY is received. The rubber heater Η is disposed between the stage body 23a and the platen 23b for heating the green sheet 4G placed on the platen 23b to a specific temperature. The platen 23b is a ceramic substrate and has a porous substrate having a gas permeability. The green sheet 4G is placed thereon, and the green sheet 4G placed on the platen 23b is transmitted through the platen 23b to receive the rubber heater η. When it is hot, the entire upper surface of itself can be heated to a specific temperature. The stage 23 has a suction passage 23c extending from the inside of the table main body 23a to the upper side of the rubber heater 所示 as shown by a broken line in Fig. 9 . The suction passage 23c is disposed at a position where the one end opening portion is located below the platen 23b and faces the placed green sheet 4G. The suction passage 23c is connected to a suction pipe (not shown) which is connected to the other side opening portion and is connected to the side surface of the table main body 23a. The suction pipe is decompressed by the lower side of the platen 2 3 b via the suction pipe and the suction passage 23c by being connected to the suction pump VP (see Fig. 11). At this time, the platen 2 3 b is a porous substrate having a gas permeability, so that the suction force of the suction pump VP can reach the entire lower surface of the 126255.doc • 22-1356661 green sheet 4G through the platen 23b. The attraction to the underside of the green sheet 4G can adsorb the green sheet 4G to the platen 23b. The metal ink F (droplet Fb) sprayed onto the green sheet 4G in Fig. 10 evaporates a part of the solvent or dispersion medium from the surface itself. At this time, since the green sheet 4G is heated, evaporation of the solvent or dispersion medium contained in the droplet Fb can be promoted. Further, since the green sheet 4G is a gas permeable substrate, as shown in FIG. 1A, the droplet Fb sprayed onto the green sheet 4G is also on the side in contact with the green sheet 4G, and also passes through the green sheet 4G to evaporate the solvent. Or part of the dispersion. Therefore, the droplet Fb sprayed on the green sheet 4G can further shorten the time required for itself to dry. Further, the green sheet 4G is placed on the permeable platen 23b, so that it can be attracted by the suction force of the suction pump VP of the platen 23b. Since the droplet Fb sprayed on the green sheet 4G is attracted by the suction pump VP, the solvent or the dispersion medium can be further diffused into the green sheet 4G, and the droplet Fb is sprayed on the green sheet 4G. The drying time can be further shortened. Further, in the present embodiment, the contact angle of the droplet Fb sprayed on the green sheet 4G (air permeable substrate), the porosity of the green sheet 4G, and the attraction force below the green sheet 4G are obtained. When set to a specific range, the droplet Fb sprayed on the green sheet 4G does not penetrate into the green sheet 4G. Next, the electrical configuration of the droplet discharge device 2A configured as described above will be described with reference to Fig. 11'. In Fig. 11, the control device 5 is configured to carry out the transfer processing of the holder 29, the droplet discharge processing of the ejection head 30, and the heating of the rubber heater η in accordance with the stored various materials and the various transfer processes for controlling the private tray 23 Treatment, decompression treatment on the lower side of the green sheet 4G, and the like. 126255.doc •23- (S) 1356661 In the control unit 50, the suction pump drive circuit % is connected. The control unit 5 turns the drive control signal to the suction pump drive circuit 56. The suction pump drive circuit 56 drives the suction pump vp in response to a drive control signal from the control unit 5〇. Thereby, the green sheet 4 (} placed on the platen 2313 is placed and fixed in a specific decompressed state. When the wiring pattern is to be formed, the control device 50 drives the rubber heater H provided in the stage main body 23a, and will carry The entire green sheet 4G placed on the platen 23b is uniformly heated to the above specific temperature. That is, the ejection surface 4Ga of the green sheet 4 is controlled to be higher than the temperature of the metallic ink F when ejected from the ejection head 30. And the temperature of the boiling point of the liquid composition contained in the metallic ink F (the temperature of the composition having the lowest boiling point among the liquid compositions). Further, the control device 5 drives the suction pump VP via the suction pump drive circuit 56. It is placed on the lower side of the green sheet 4G of the platen 23b. Therefore, the lower side of the green sheet 4G is in a reduced pressure state, so that the diffusion of the vapor into the green sheet 4G can be further promoted. Further, the drying time of the droplet Fb is further shortened. Next, the effect of the second embodiment configured as described above is as follows (7). According to the above embodiment, since the lower side of the green sheet is in a decompressed state, Therefore, the metallic ink ρ sprayed on the green sheet 4G can further promote As a result, the diffusion of the vapor into the green sheet 4G, as a result, the metal ink F sprayed on the green sheet can further shorten the drying time. (8) Moreover, since the green sheet 4g is placed on the porous body having air permeability Therefore, the platen 23b can be decompressed via the porous platen 231?, so that the lower side of the green plate 4G can be uniformly decompressed. This 126255.doc •24· 1356661 As a result, the droplets attached to the green sheets 4G are not left and right by the position where they are sprayed, and the evaporation of the side contacting the raw 4g can be spread without unevenness. (7) In addition, The vapor evaporated by the liquid (10) passes through the suction passage 23 and is concentrated by the suction pump vp, so that the droplet discharge device 2 can reduce the contamination of the vapor. Further, the above-described embodiment can be changed as follows. In the second embodiment, the platen 23b is a porous ceramic substrate having a gas permeability. The platen 23b is not limited thereto, and may have a gas permeable property, for example, a sintered metal having air permeability. In the % type, the table 23 is laminated on the table body Ua with a rubber heater H and aeration The porous f-ceramics are formed by a substrate. However, for example, a recess may be formed on the upper surface of the base body 23a, and a rubber-added tester, & y·η® ... is disposed at the bottom of the recessed portion. The platen 23b is disposed on the upper portion of the rubber heater 。. The entire σ 23 may be a porous ceramic having air permeability or a porous sintered metal having air permeability. In the case of 'the previous droplet, the partial overlap and the sprayer b', the droplet ejection device 2 is in the previous droplet Fb after the green sheet 4G becomes a fixed state. Fb. However, it is not limited to - liquid = spouting 2G can also be in front - the droplets are sprayed with the next droplet Fb before the green sheet 4G is in a fixed state. In the embodiment, the previous droplets Fb are attached to the droplets Fb in a manner of partial overlap. However, it is not limited to this, and it is also possible to use a composition in which a part of the next droplet is not replenished with the front-droplet. 126255.doc •25- 丄乃6661 -• In the above embodiment, the former liquid phase and the second liquid droplet Fb overlap with one-half of the spray diameter, but the ratio of overlap may be appropriately changed. And implementation. In the above embodiment, the plurality of droplets Fb are superimposed in the order of the nozzles, and the tenth wiring pattern p" is not limited thereto, and for example, as shown in Fig. U(a) to (f) The pattern is ejected to form the wiring pattern P. As shown in Fig. 12 (4), in order to form a pattern, the previous droplet Fb is sprayed. • At a specific position, the next droplet Fb is sprayed off the sprayed Attached to the spray position A1 indicated by the one-dot dash of the droplet Fb. The droplet is sprayed in the spray position to make the sub-drop (four) itself partially overlap the initially sprayed droplet. The method is sprayed at the spray position A2 indicated by the dashed line shown in Fig. 12(b). When the droplet is sprayed at the spray position 八2, the next drop is partially overlapped with itself. The spray is attached to the spray position at the spray position, and is attached to the spray position A3 shown by the dash line in Fig. 12(c). Money, similarly φ (4) Fig. 12(d), (4) In the order shown, the droplets are sprayed and disposed at the spraying positions Α4 and Α5. Thus, it is also possible to form a wiring pattern 如图 as shown in Fig. 12 (1). The rubber heater heats the green sheet 4G. However, the green sheet 4G may be heated by other heater means. In the above embodiment, the functional liquid is embodied as a metal ink, but is not limited to The functional liquid is embodied as a liquid-liquid material containing liquid crystal material. That is to say, 'the functional liquid is sprayed out to form 126255.doc • 26 · 1356661. In the embodiment, the substrate is embodied as a green sheet. 4G. However, the substrate is not limited to this. Any substrate can be used as long as it is a ventilating device and can not penetrate the liquid droplets immediately. The droplet discharge head can also be embodied as a resistor head. The droplet discharge mechanism is embodied as a piezoelectric head 30. However, the present invention is not limited thereto, and the droplet discharge heating method or the electrostatic driving method is performed [simplified description of the drawing]
圖1係電路模組之側剖面圖。 圖2係液滴喷出裝置之全體立體圖。 圖3係液滴喷出頭由生胚片側所見之下面圖 圖4係液滴喷出頭之要部側剖面圖。 圖5係說明液滴喷出 圖0 裝置之電氣的構成用 之電氣區塊Figure 1 is a side cross-sectional view of a circuit module. Fig. 2 is a perspective view of the entire liquid droplet ejecting apparatus. Fig. 3 is a bottom view of the liquid droplet ejection head as seen from the side of the green sheet. Fig. 4 is a side sectional view of the main portion of the liquid droplet ejection head. Figure 5 is a diagram showing the electrical block for the electrical discharge of the device of Figure 0.
圖6係說明生胚片用之剖面構造之模式圖。 圖7係說明圖案形成用之作用之說明圖。 _〜⑷係表示圖案形成之液滴之喷出順序 圖9係說明台之構成用之說明圖。 之圖 圖10係說明生Μ用之剖面構造之模式圖 圖η係說明液滴噴出裝置之電氡的構成用 路圖。 之電氣區塊電 圖12(a)〜(f)係表示其他順序之圖 【主要元件符號說明】 1 電路模組 案之形成之圖 〇 126255.doc •27· 1356661 2 LTCC多層基板 4 低溫燒成基板 4G 作為基體之生胚片 6 内部佈線 20 液滴喷出裝置. 23 台 23a 台本體 23b 台板 30 液滴噴出頭 50 控制裝置 F 作為功能液之金屬墨水 Fb 液滴 PZ 壓電元件 P 圖案 H 橡膠加熱器 VP 吸引泵 126255.doc -28-Fig. 6 is a schematic view showing a sectional structure for a green sheet. Fig. 7 is an explanatory view for explaining the action of pattern formation. _~(4) shows the ejection sequence of the droplets formed by the pattern. Fig. 9 is an explanatory view for explaining the configuration of the stage. Fig. 10 is a schematic view showing a cross-sectional structure for oysters. Fig. η is a view showing a configuration of an electric raft for a liquid droplet ejecting apparatus. Electrical block diagrams 12(a) to (f) show the other sequence diagrams [Main component symbol description] 1 Circuit module case formation diagram 〇 126255.doc • 27· 1356661 2 LTCC multilayer substrate 4 low temperature burning Substrate 4G as the base of the green sheet 6 Internal wiring 20 Droplet ejection device. 23 Table 23a Stage body 23b Platen 30 Droplet ejection head 50 Control device F Metal ink Fb as a functional liquid Droplet PZ Piezoelectric element P Pattern H rubber heater VP suction pump 126255.doc -28-
Claims (1)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006321264 | 2006-11-29 | ||
| JP2006321263 | 2006-11-29 | ||
| JP2007189151A JP5141121B2 (en) | 2006-11-29 | 2007-07-20 | PATTERN FORMING METHOD, DROPLET DISCHARGE DEVICE, AND CIRCUIT BOARD |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200913826A TW200913826A (en) | 2009-03-16 |
| TWI356661B true TWI356661B (en) | 2012-01-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW96144825A TWI356661B (en) | 2006-11-29 | 2007-11-26 | Patterning method, droplet discharging device and |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5141121B2 (en) |
| KR (1) | KR100927364B1 (en) |
| CN (1) | CN101193499B (en) |
| TW (1) | TWI356661B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3119531A4 (en) * | 2014-03-19 | 2018-01-17 | Utilight Ltd. | Printing high aspect ratio patterns |
| JP2020136549A (en) * | 2019-02-22 | 2020-08-31 | 株式会社Ｓｃｒｅｅｎホールディングス | Pattern formation device, pattern formation method, and discharge data formation method |
| US20230138349A1 (en) * | 2021-10-29 | 2023-05-04 | Industrial Technology Research Institute | Embedded packaging structure |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW442945B (en) * | 1998-11-20 | 2001-06-23 | Sony Computer Entertainment Inc | Integrated circuit chip, integrated circuit device, printed circuit board and electronic machine |
| GB2379414A (en) * | 2001-09-10 | 2003-03-12 | Seiko Epson Corp | Method of forming a large flexible electronic display on a substrate using an inkjet head(s) disposed about a vacuum roller holding the substrate |
| JP3948247B2 (en) * | 2001-10-29 | 2007-07-25 | セイコーエプソン株式会社 | Method for forming a film pattern |
| JP2005057140A (en) * | 2003-08-06 | 2005-03-03 | Seiko Epson Corp | Multilayer wiring board and its manufacturing method |
| JP2006239565A (en) * | 2005-03-03 | 2006-09-14 | Konica Minolta Holdings Inc | Coating method |
-
2007
- 2007-07-20 JP JP2007189151A patent/JP5141121B2/en not_active Expired - Fee Related
- 2007-11-26 KR KR20070120657A patent/KR100927364B1/en not_active IP Right Cessation
- 2007-11-26 TW TW96144825A patent/TWI356661B/en not_active IP Right Cessation
- 2007-11-28 CN CN 200710196105 patent/CN101193499B/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2008155196A (en) | 2008-07-10 |
| CN101193499A (en) | 2008-06-04 |
| KR20080048940A (en) | 2008-06-03 |
| TW200913826A (en) | 2009-03-16 |
| CN101193499B (en) | 2011-12-07 |
| KR100927364B1 (en) | 2009-11-19 |
| JP5141121B2 (en) | 2013-02-13 |
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