JP2011171574A - Method of forming conductor pattern, and device for ejecting droplet - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of forming a conductor pattern, and the like, capable of forming a high-reliability conductor pattern by preventing occurrence of a crack, disconnection or the like. <P>SOLUTION: This method of forming a conductor pattern includes: a conductor pattern precursor formation process of ejecting, by a droplet ejection method, droplets of ink onto a base material to be dried to form a precursor of a conductor pattern including a pad part and a wiring part to be connected to the pad part on the base material; and a baking process. A pad part formation region includes a first region located on an extension line of a wiring part formation region, second regions located on both sides of the first region through the first region, and third regions located in side parts of the respective second regions on the side opposite to the first region. In the conductor pattern precursor formation process, the droplets of the ink are ejected in the pad part formation region so that density of attaching points in the second region for attaching the droplets of the ink thereto is set lower than those of both the first and third regions. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a method for forming a conductor pattern and a droplet discharge device.

  For example, a photolithography method is used for manufacturing a wiring used for an electronic circuit or an integrated circuit. In this photolithography method, a photosensitive material called a resist is coated on a substrate coated with a conductive film in advance, a circuit pattern is irradiated and developed, and the conductive film is etched according to the resist pattern, thereby forming a wiring made of a conductor pattern. Is formed. This photolithography method requires large-scale equipment such as a vacuum apparatus and a complicated process, and the material use efficiency is about several percent, and most of it must be discarded, and the manufacturing cost is high.

  On the other hand, a method of forming a conductor pattern (wiring) by using a droplet discharge method in which a liquid material is discharged from a liquid discharge head in the form of droplets, a so-called inkjet method has been proposed (for example, see Patent Document 1). ). In this method, a conductive pattern forming ink in which conductive fine particles are dispersed is directly applied to a substrate, and then the solvent is removed to obtain a conductive pattern precursor, which is then converted into a conductive pattern by sintering. According to this method, there is an advantage that photolithography is not required, the process is greatly simplified, and the amount of raw materials used is reduced. Further, according to this method, it is possible to form a fine conductor pattern as compared with the conventional method, which is advantageous in improving the circuit density.

However, conventionally, when a conductor pattern having a pair of pad portions and a wiring portion for connecting each pad portion is formed on a substrate, the method using the ink jet method has cracks or breaks in the formed conductor pattern. May occur.
The reason is as follows. First, when forming a relatively thick conductor pattern precursor, a large amount of conductor pattern forming ink must be ejected onto the substrate. For this reason, the conductor pattern forming ink is continuously applied onto the substrate. It is necessary to repeat. In this case, a difference in film thickness is likely to occur in the ink on the substrate due to ink flow during or after drawing due to surface tension or internal pressure, and the part corresponding to the pad part of the conductor pattern precursor and the part corresponding to the wiring part Then, the thickness of the part corresponding to a pad part will become thick. This is more conspicuous as the size of the pad portion (diameter if the pad portion is circular, side if square), and conversely, the thinner the wiring portion, that is, the greater the difference between the pad size and wiring width is. is there. This is a phenomenon unique to low-viscosity inks, which is difficult to occur with high-viscosity pastes and the like. In addition, due to the internal pressure, there is a pattern dependency such that the shorter the distance between the pad parts and the larger the number of wiring parts, the greater the difference in film thickness.

  The portion corresponding to the wiring portion of the thinned conductor pattern precursor is weak against stress, and the portion corresponding to the wiring portion is easily cracked by the thermal expansion and contraction stress of the substrate during firing, and the conductor pattern is It may break. Also, in the high-temperature firing process when manufacturing ceramic circuit boards, etc., the wiring part formed of metal nanoparticles partially evaporates and the thickness decreases, so the wiring part becomes even thinner. Further, it becomes easier to disconnect, and the resistance greatly increases. Thus, conventionally, it has been difficult to sufficiently increase the reliability and yield of the conductive pattern (wiring substrate) to be formed.

JP 2007-84387 A

  An object of the present invention is to provide a method for forming a conductor pattern capable of preventing the occurrence of cracks, disconnections, etc. and forming a highly reliable conductor pattern, and to be suitably used for forming the conductor pattern. An object of the present invention is to provide a droplet discharge device that can be used.

Such an object is achieved by the present invention described below.
The conductor pattern forming method of the present invention is a method of discharging a conductor pattern forming ink droplet onto a substrate by a droplet discharge method, and drying and connecting a pad portion on the substrate and a wiring portion connected to the pad portion. A conductor pattern precursor forming step of forming a conductor pattern precursor comprising:
Firing the precursor and forming the conductor pattern,
In the conductor pattern precursor forming step, the density of attachment points for attaching droplets of the conductor pattern forming ink is relatively high in the pad portion forming region for forming the pad portion on the substrate. Discharging the conductive pattern forming ink droplets so that the region and the low-density region are formed,
The low-density region is provided in a strip shape in parallel with an extension line of a wiring part forming region that forms the wiring part on the base material.
Thereby, the difference in thickness between the portion corresponding to the pad portion of the conductor pattern precursor (conductor pattern precursor) and the portion corresponding to the wiring portion can be reduced, and the surface of the conductor pattern precursor can be made flat. This makes it possible to efficiently form a highly reliable conductor pattern in which the occurrence of cracks, disconnections, and the like is prevented.

In the conductor pattern forming method of the present invention, it is preferable that the conductor pattern forming ink droplets are not ejected toward the low density region in the conductor pattern precursor forming step.
Thereby, the difference in thickness between the portion corresponding to the pad portion of the conductor pattern precursor and the portion corresponding to the wiring portion can be further reduced.
The conductor pattern forming method of the present invention is a method of discharging a conductor pattern forming ink droplet onto a substrate by a droplet discharge method, and drying and connecting a pad portion on the substrate and a wiring portion connected to the pad portion. A conductor pattern precursor forming step of forming a conductor pattern precursor comprising:
Firing the precursor and forming the conductor pattern,
The pad part forming region for forming the pad part on the base material includes a first region located on an extension line of the wiring part forming region for forming the wiring part on the base material, and the first region. A second region located on both sides of the first region, and a third region located on the side of the second region opposite to the first region,
In the conductor pattern precursor forming step, the density of the attachment points for attaching the droplets of the conductor pattern forming ink to the pad portion forming region is higher than any of the first region and the third region. The conductive pattern forming ink droplets are ejected so that the second region is lower.
Thereby, the difference in thickness between the portion corresponding to the pad portion of the conductor pattern precursor and the portion corresponding to the wiring portion can be reduced, and the surface of the conductor pattern precursor can be flattened. In addition, it is possible to efficiently form a highly reliable conductor pattern in which occurrence of cracks, disconnections, and the like is prevented.

In the conductor pattern forming method of the present invention, it is preferable that the conductor pattern forming ink droplets are not ejected toward the second region in the conductor pattern precursor forming step.
Thereby, the difference in thickness between the portion corresponding to the pad portion of the conductor pattern precursor and the portion corresponding to the wiring portion can be further reduced.
In the method for forming a conductor pattern of the present invention, in the conductor pattern precursor forming step, the density of attachment points for attaching the droplets of the conductor pattern forming ink is higher in the third region than in the first region. It is preferable that the conductive pattern forming ink droplets be ejected so that the direction is lower.
Thereby, the difference in thickness between the portion corresponding to the pad portion of the conductor pattern precursor and the portion corresponding to the wiring portion can be further reduced.

The method for forming a conductor pattern according to the present invention is a bitmap showing a bitmap having a plurality of pixels arranged in a matrix based on design data of a conductor pattern having a pad portion and a wiring portion connected to the pad portion. Bitmap data creation process to create data,
A conductor pattern precursor that forms a conductor pattern precursor on the substrate by discharging droplets of a conductor pattern forming ink onto the substrate by a droplet discharge method based on the bitmap data, and drying the conductor pattern precursor. Forming process;
Firing the precursor and forming the conductor pattern,
The part of the bitmap corresponding to the pad part includes a first part located on an extension line of the part corresponding to the wiring part of the bitmap, and the first part via the first part. A second part located on both sides, and a third part located on the side of the second part opposite to the first part,
In the bitmap data creation step, the density of the pixel corresponding to the position where the droplet of the conductive pattern forming ink is attached is higher than the second part than the first part and the third part. The pixel is arranged such that the pixel is lower.
Thereby, the difference in thickness between the portion corresponding to the pad portion of the conductor pattern precursor and the portion corresponding to the wiring portion can be reduced, and the surface of the conductor pattern precursor can be flattened. In addition, it is possible to efficiently form a highly reliable conductor pattern in which occurrence of cracks, disconnections, and the like is prevented.

In the method for forming a conductor pattern of the present invention, the pitch of the pixels is equal to or less than ½ of the diameter of the conductor pattern forming ink droplet after landing on the substrate (however, 0 is not included). It is preferable.
Thereby, a highly reliable conductor pattern can be formed.
In the method for forming a conductor pattern according to the present invention, the ratio of the area occupied by the pixel corresponding to the position where the droplet of the conductor pattern forming ink is deposited is 10% in the portion corresponding to the pad portion of the bitmap. It is preferable that it is 95% or less.
Thereby, the difference in thickness between the portion corresponding to the pad portion of the conductor pattern precursor and the portion corresponding to the wiring portion can be further reduced.

In the method for forming a conductor pattern of the present invention, the ratio of the area occupied by the pixel corresponding to the position where the droplet of the ink for forming the conductor pattern is attached in the first portion is 30% or more and 100% or less. It is preferable.
Thereby, the difference in thickness between the portion corresponding to the pad portion of the conductor pattern precursor and the portion corresponding to the wiring portion can be further reduced.

In the method for forming a conductor pattern of the present invention, in the second portion, the ratio of the area occupied by the pixel corresponding to the position where the droplet of the conductor pattern forming ink is attached is 0% or more and 50% or less. It is preferable.
Thereby, the difference in thickness between the portion corresponding to the pad portion of the conductor pattern precursor and the portion corresponding to the wiring portion can be further reduced.

In the conductor pattern forming method of the present invention, it is preferable that the second portion is not provided with the pixel corresponding to the position where the droplet of the conductor pattern forming ink is attached.
Thereby, the difference in thickness between the portion corresponding to the pad portion of the conductor pattern precursor and the portion corresponding to the wiring portion can be further reduced.
In the method for forming a conductor pattern of the present invention, the ratio of the area occupied by the pixel corresponding to the position where the droplet of the conductor pattern forming ink is attached in the third portion is 40% or more and 100% or less. It is preferable.
Thereby, the difference in thickness between the portion corresponding to the pad portion of the conductor pattern precursor and the portion corresponding to the wiring portion can be further reduced.

In the conductor pattern forming method of the present invention, in the bitmap data creating step, the density of the pixel corresponding to the position where the ink droplet for forming the conductor pattern is attached is higher than that of the first portion. It is preferable to arrange the pixels so that the portion of the region is lower.
Thereby, the difference in thickness between the portion corresponding to the pad portion of the conductor pattern precursor and the portion corresponding to the wiring portion can be further reduced.

In the method for forming a conductor pattern of the present invention, the pixel corresponding to the position where the droplet of the ink for forming the conductor pattern in the first portion is attached, and the liquid for the conductor pattern forming ink in the third portion. It is preferable that the pixel corresponding to the position where the droplet is adhered is isolated by the pixel corresponding to the position where the droplet of the conductive pattern forming ink is not adhered in the second portion.
Thereby, the difference in thickness between the portion corresponding to the pad portion of the conductor pattern precursor and the portion corresponding to the wiring portion can be further reduced.

In the method for forming a conductor pattern according to the present invention, it is preferable that the ratio of the area occupied by the pixel in the second part is 10% or more and 70% or less in the part corresponding to the pad portion of the bitmap.
Thereby, the difference in thickness between the portion corresponding to the pad portion of the conductor pattern precursor and the portion corresponding to the wiring portion can be further reduced.

In the method for forming a conductor pattern of the present invention, in the bitmap data creation step, the aggregate of pixels corresponding to the position where the droplet of the conductor pattern forming ink is attached in the third portion is a plurality of lines. It is preferable to arrange the pixels so as to form a shape formed by arranging the bodies at predetermined intervals.
Thereby, the difference in thickness between the portion corresponding to the pad portion of the conductor pattern precursor and the portion corresponding to the wiring portion can be further reduced.

In the method for forming a conductor pattern of the present invention, it is preferable that a portion of the precursor corresponding to the pad portion is formed continuously.
Thereby, a highly reliable conductor pattern can be formed.
In the method for forming a conductor pattern of the present invention, the maximum thickness of the portion corresponding to the pad portion of the precursor is a, and the maximum thickness of the portion corresponding to the wiring portion of the precursor is b. In this case, it is preferable that | a−b | / a is 0.3 or less (including 0).
Thereby, generation | occurrence | production of the crack, disconnection, etc. in a conductor pattern can be prevented, and a highly reliable conductor pattern can be formed.

In the conductor pattern forming method of the present invention, in the conductor pattern precursor forming step, the droplet discharge head while relatively moving the droplet discharge head for discharging the droplet of the conductor pattern forming ink and the substrate. Discharging droplets of the conductor pattern forming ink from the head onto the substrate;
In a first scan, the conductor pattern forming ink droplets are ejected so that the two adjacent droplets are separated from each other with the conductor pattern forming ink droplets landing on the substrate. It is preferable to do.
Thereby, it can prevent that the conductor pattern formation ink on a base material concentrates locally, Thereby, the site | part corresponding to the pad part of a conductor pattern precursor, and the site | part corresponding to a wiring part, The difference in thickness can be further reduced.

In the method for forming a conductor pattern of the present invention, the ink for forming a conductor pattern includes metal particles and a dispersion medium in which the metal particles are dispersed,
In the conductor pattern precursor forming step, it is preferable that the substrate is heated to a temperature higher than the temperature at which the conductor pattern forming ink is discharged and lower than the boiling point of the dispersion medium.
Thereby, the conductor pattern forming ink on the substrate can be quickly dried without bumping, and the conductor pattern forming ink on the substrate can be prevented from being concentrated locally, Thereby, the difference in thickness between the portion corresponding to the pad portion of the conductor pattern precursor and the portion corresponding to the wiring portion can be further reduced.

In the method for forming a conductor pattern of the present invention, the base material is a ceramic molded body made of a material containing a ceramic material and a binder,
In the firing step, it is preferable that the ceramic molded body and the precursor are fired to form the conductor pattern on a ceramic substrate.
As a result, a highly reliable conductor pattern in which the occurrence of cracks, disconnections and the like is prevented can be formed on the ceramic substrate.
The wiring board of the present invention is characterized by having a conductor pattern formed using the method for forming a conductor pattern of the present invention.
As a result, it is possible to provide a highly reliable wiring board having a highly reliable conductor pattern in which the occurrence of cracks, disconnections, and the like is prevented.

The droplet discharge device of the present invention includes a table for supporting a substrate,
A droplet discharge head for discharging droplets of conductive pattern forming ink to the base material supported by the table;
A moving mechanism for relatively moving the table and the droplet discharge head;
Control means for controlling the operation of the droplet discharge head and the moving mechanism,
The control means controls the operation of the droplet discharge head and the moving mechanism when forming a conductor pattern having a pad portion and a wiring portion connected to the pad portion on the base, and the moving mechanism While the table and the droplet discharge head are relatively moved, an attachment point for attaching the droplet of the conductor pattern forming ink to the pad portion forming region for forming the pad portion on the base material. It is configured to discharge the droplets of the conductor pattern forming ink from the droplet discharge head so that a high density region having a relatively high density and a low low density region are formed,
The low-density region is provided in a strip shape in parallel with an extension line of a wiring part forming region that forms the wiring part on the base material.
Accordingly, it is possible to provide a droplet discharge device that can be suitably used for forming a highly reliable conductor pattern in which occurrence of cracks, disconnection, and the like is prevented.

The droplet discharge device of the present invention includes a table for supporting a substrate,
A droplet discharge head for discharging droplets of conductive pattern forming ink to the base material supported by the table;
A moving mechanism for relatively moving the table and the droplet discharge head;
Bitmap data creation means for creating bitmap data indicating a bitmap having a plurality of pixels arranged in a matrix based on design data of a conductor pattern having a pad portion and a wiring portion connected to the pad portion; ,
Control means for controlling the operation of the droplet discharge head and the moving mechanism,
The bitmap data creation means includes a first portion located on an extension line of a portion corresponding to the wiring portion of the bitmap, and a first portion corresponding to the pad portion of the bitmap. A second part located on both sides of the first part, and a third part located on the side opposite to the first part of the second part, and the conductor The density of the pixel corresponding to the position where the ink droplet for pattern formation is attached is such that the second part is lower than the first part and the third part. Is configured to place
The control means controls the operation of the droplet discharge head and the moving mechanism based on the bitmap data, and moves the table and the droplet discharge head relative to each other while moving the table and the droplet discharge head relative to each other. The droplet discharge head is configured to discharge the conductor pattern forming ink droplets onto the substrate.
Accordingly, it is possible to provide a droplet discharge device that can be suitably used for forming a highly reliable conductor pattern in which occurrence of cracks, disconnection, and the like is prevented.

It is sectional drawing which shows the structural example of the wiring board (ceramics circuit board) of this invention. 1 is a perspective view illustrating an outline configuration of an embodiment of an inkjet apparatus (droplet discharge apparatus) according to the present invention. It is a schematic diagram for demonstrating schematic structure of the inkjet head (droplet discharge head) of the inkjet apparatus shown in FIG. It is explanatory drawing which shows the outline process of the manufacturing method of the wiring board (ceramics circuit board) shown in FIG. It is manufacturing process explanatory drawing of the wiring board (ceramics circuit board) shown in FIG. 3 is a flowchart for explaining an embodiment of a conductor pattern forming method of the present invention (showing a control operation of the ink jet apparatus shown in FIG. 2). It is a figure which shows the structural example of a conductor pattern. It is a figure which shows the structural example of a conductor pattern precursor. It is a figure which shows typically the structural example (1st Embodiment) of a bitmap. It is a figure which shows the pad part formation area and wiring part formation area on a ceramic green sheet. It is a figure for demonstrating division | segmentation drawing. It is a figure for demonstrating division | segmentation drawing. It is a figure which shows typically the structural example (2nd Embodiment) of a bitmap. It is a figure which shows typically the structural example (3rd Embodiment) of a bitmap.

Hereinafter, preferred embodiments of the present invention will be described in detail.
[First Embodiment]
FIG. 1 is a cross-sectional view showing a configuration example of a wiring board (ceramic circuit board) of the present invention, and FIG. 2 is an embodiment of an ink jet apparatus (droplet discharge apparatus) of the present invention, and is a perspective view showing a schematic configuration thereof. 3 is a schematic diagram for explaining a schematic configuration of an ink jet head (droplet discharge head) of the ink jet apparatus shown in FIG. 2, and FIG. 4 is a method for manufacturing the wiring board (ceramic circuit board) shown in FIG. FIG. 5 is an explanatory view showing the manufacturing process of the wiring board (ceramic circuit board) shown in FIG. 1, and FIG. 6 is a view for explaining an embodiment of the method for forming a conductor pattern of the present invention. FIG. 7 is a diagram showing a configuration example of a conductor pattern, FIG. 8 is a diagram showing a configuration example of a conductor pattern precursor, and FIG. 9 is a bitmap. Constitution FIG. 10 schematically shows (first embodiment), FIG. 10 shows a pad portion forming region and a wiring portion forming region on the ceramic green sheet, and FIGS. 11 and 12 are respectively for explaining divided drawing. FIG.

  A conductor pattern forming method and a wiring board manufacturing method according to the present embodiment include a bitmap data creating step for creating bitmap data indicating a bitmap based on design data of a conductor pattern (wiring pattern), and the bitmap A conductor pattern that forms a conductor pattern precursor (conductor pattern precursor) on a substrate by discharging droplets of a conductor pattern forming ink onto the substrate by a droplet discharge method based on data. A precursor forming step, and a firing step of firing the conductor pattern precursor to form a conductor pattern.

First, a conductive pattern forming ink (hereinafter also simply referred to as “ink”) will be described.
<Conductor pattern forming ink>
The conductive pattern forming ink is an ink used to form a conductive pattern precursor (hereinafter referred to as a “conductive pattern precursor”) by a droplet discharge method.
In the present embodiment, a case where a dispersion liquid in which silver particles as metal particles are dispersed in an aqueous dispersion medium is used as the conductor pattern forming ink 200 will be representatively described.

Hereinafter, each component of the conductive pattern forming ink 200 will be described in detail.
[Aqueous dispersion medium]
In the present embodiment, the conductor pattern forming ink 200 includes an aqueous dispersion medium.
In the present invention, the “aqueous dispersion medium” refers to a liquid composed of water and / or a liquid having excellent compatibility with water (for example, a liquid having a solubility in 100 g of water at 25 ° C. of 30 g or more). As described above, the aqueous dispersion medium is composed of water and / or a liquid having excellent compatibility with water, but is preferably composed mainly of water. It is preferably 70 wt% or more, more preferably 90 wt% or more. Thereby, the effect mentioned above is exhibited more notably.

Specific examples of the aqueous dispersion medium include, for example, water, methanol, ethanol, butanol, propanol, isopropanol and other alcohol solvents, 1,4-dioxane, tetrahydrofuran (THF) and other ether solvents, pyridine, pyrazine, pyrrole and the like. Aromatic heterocyclic compound solvents, amide solvents such as N, N-dimethylformamide (DMF) and N, N-dimethylacetamide (DMA), nitrile solvents such as acetonitrile, and aldehyde solvents such as acetaldehyde. Of these, one or a combination of two or more can be used.
Further, the content of the aqueous dispersion medium in the conductor pattern forming ink 200 is preferably 25 wt% or more and 70 wt% or less, and more preferably 30 wt% or more and 60 wt% or less. Thereby, while making the viscosity of the ink 200 suitable, the change of the viscosity by volatilization of a dispersion medium can be made small.

[Silver particles]
Next, silver particles (metal particles) will be described.
Silver particles are a main component of the conductor pattern 20 to be formed, and are components that impart conductivity to the conductor pattern 20.
The silver particles are dispersed in the ink.

The average particle diameter of the silver particles is preferably 1 nm or more and 100 nm or less, and more preferably 10 nm or more and 30 nm or less. As a result, the ink ejection stability can be further improved, and a fine conductor pattern can be easily formed. In the present specification, the “average particle size” means a volume-based average particle size unless otherwise specified.
In the ink 200, the average interparticle distance between silver particles is preferably 1.7 nm or more and 380 nm or less, and more preferably 1.75 nm or more and 300 nm or less. Thereby, the viscosity of the ink 200 for forming a conductor pattern can be made more appropriate, and the discharge stability is particularly excellent.

In addition, the content of silver particles (silver particles (metal particles) in which the dispersant is not adsorbed on the surface) contained in the ink 200 is preferably 0.5 wt% or more and 60 wt% or less, and is preferably 10 wt% or more and 45 wt%. % Or less is more preferable. Thereby, the disconnection of the conductor pattern 20 can be prevented more effectively, and the conductor pattern 20 with higher reliability can be provided.
The silver particles (metal particles) are preferably dispersed in an aqueous dispersion medium as silver colloid particles (metal colloid particles) having a dispersant attached to the surface thereof. Thereby, the dispersibility of the silver particles in the aqueous dispersion medium is particularly excellent, and the ejection stability of the ink 200 is particularly excellent.

Although it does not specifically limit as a dispersing agent, it has 3 or more of COOH groups and OH groups, and the number of COOH groups is the same as that of OH groups, or contains hydroxy acid or its salt more than it. Is preferred. These dispersants adsorb on the surface of silver particles to form colloidal particles, and the colloidal liquid is stabilized by uniformly dispersing silver colloidal particles in an aqueous solution by the electric repulsive force of COOH groups present in the dispersant. Has the function of As described above, since the silver colloid particles are stably present in the ink 200, the fine conductor pattern 20 can be more easily formed. Further, the silver particles are uniformly distributed in the pattern (conductor pattern precursor 30) formed by the ink 200, and cracks, disconnections, and the like are less likely to occur. On the other hand, if the number of COOH groups and OH groups in the dispersant is less than 3 or the number of COOH groups is less than the number of OH groups, the dispersibility of the silver colloid particles cannot be sufficiently obtained. There is a case.
Examples of such a dispersing agent include citric acid, malic acid, trisodium citrate, tripotassium citrate, trilithium citrate, triammonium citrate, disodium malate, tannic acid, gallotannic acid, and pentaploid tannin. Of these, one or a combination of two or more can be used.

  Further, the dispersant may contain mercapto acid or a salt thereof having two or more COOH groups and SH groups. In these dispersants, mercapto groups are adsorbed on the surface of silver fine particles to form colloidal particles, and colloidal particles are uniformly dispersed in an aqueous solution by the electric repulsive force of COOH groups present in the dispersant. Has the function of stabilizing As described above, since the silver colloid particles are stably present in the ink 200, the fine conductor pattern 20 can be more easily formed. Further, the silver particles are uniformly distributed in the pattern (conductor pattern precursor 30) formed by the ink 200, and cracks, disconnections, and the like are less likely to occur. On the other hand, when the number of COOH groups and SH groups in the dispersant is less than 2, that is, only one, the dispersibility of the silver colloidal particles may not be sufficiently obtained.

  Examples of such dispersants include mercaptoacetic acid, mercaptopropionic acid, thiodipropionic acid, mercaptosuccinic acid, thioacetic acid, sodium mercaptoacetate, sodium mercaptopropionate, sodium thiodipropionate, disodium mercaptosuccinate, Examples include potassium mercaptoacetate, potassium mercaptopropionate, potassium thiodipropionate, dipotassium mercaptosuccinate, and the like, and one or more of these can be used in combination.

  The content of the silver colloid particles in the ink 200 is preferably 1 wt% or more and 60 wt% or less, more preferably 5 wt% or more and 50 wt% or less. When the content of the silver colloid particles is less than the lower limit, the silver content is small, and when the conductive pattern 20 is formed, it is necessary to apply the coating multiple times when a relatively thick film is formed. On the other hand, when the content of the silver colloidal particles exceeds the upper limit, the silver content increases and the dispersibility decreases. To prevent this, the frequency of stirring increases.

  Further, the heat loss to 500 ° C. in the thermogravimetric analysis of the silver colloid particles is preferably 1 wt% or more and 25 wt% or less. When the colloidal particles (solid content) are heated to 500 ° C., the dispersant adhering to the surface, the reducing agent (residual reducing agent) described later and the like are oxidized and decomposed, and most of them are gasified and disappear. Since the amount of the residual reducing agent is considered to be small, the weight loss due to heating up to 500 ° C. is considered to substantially correspond to the amount of the dispersant in the silver colloid particles. When the loss on heating is less than 1 wt%, the amount of the dispersant with respect to the silver particles is small, and the sufficient dispersibility of the silver particles is lowered. On the other hand, when it exceeds 25 wt%, the amount of the residual dispersant with respect to the silver particles increases, and the specific resistance of the conductor pattern increases. However, the specific resistance can be improved to some extent by heating and sintering after formation of the conductor pattern 20 to decompose and disappear organic components. Therefore, it is effective for a ceramic substrate that is sintered at a higher temperature.

[Organic binder]
Further, the conductor pattern forming ink 200 may contain an organic binder. The organic binder prevents aggregation of silver particles in the conductor pattern precursor 30 formed using the conductor pattern forming ink 200. That is, in the formed conductor pattern precursor 30, the organic binder is present between the silver particles, whereby the silver particles can be prevented from agglomerating and cracking (cracking) occurring in a part of the pattern. Further, at the time of sintering, the organic binder can be decomposed and removed, and the silver particles in the conductor pattern precursor 30 are bonded to form the conductor pattern 20.

  Further, since the conductive pattern forming ink 200 contains an organic binder, the adhesion of the conductive pattern precursor 30 to the ceramic molded body (ceramic green sheet) 7 can be made particularly excellent. The flow of the metal particles constituting 30 to the unintentional part is more reliably prevented. As a result, the occurrence of cracks, disconnections, short circuits, etc. can be more effectively prevented, and the conductor pattern 20 can be formed with higher accuracy. That is, the reliability of the finally obtained conductor pattern 20 can be made particularly high.

  Although it does not specifically limit as an organic binder, For example, polyethyleneglycol # 200 (weight average molecular weight 200), polyethyleneglycol # 300 (weight average molecular weight 300), polyethyleneglycol # 400 (average molecular weight 400), polyethyleneglycol # 600 ( Weight average molecular weight 600), polyethylene glycol # 1000 (weight average molecular weight 1000), polyethylene glycol # 1500 (weight average molecular weight 1500), polyethylene glycol # 1540 (weight average molecular weight 1540), polyethylene glycol # 2000 (weight average molecular weight 2000), etc. Polyethylene glycol, polyvinyl alcohol # 200 (weight average molecular weight: 200), polyvinyl alcohol # 300 (weight average molecular weight: 300), polyvinyl alcohol # 400 (average molecular weight: 400), polyvinyl alcohol # 600 (weight average molecular weight: 600), polyvinyl alcohol # 1000 (weight average molecular weight: 1000), polyvinyl alcohol # 1500 (weight average molecular weight: 1500), polyvinyl alcohol # Polyglycerin compounds having a polyglycerin skeleton such as polyvinyl alcohol such as 1540 (weight average molecular weight: 1540), polyvinyl alcohol # 2000 (weight average molecular weight: 2000), polyglycerin, polyglycerin ester, etc. Alternatively, two or more kinds can be used in combination. Examples of polyglycerol esters include polyglycerol monostearate, tristearate, tetrastearate, monooleate, pentaoleate, monolaurate, monocaprylate, polycinnolate, sesquistearate, decaoleate, and sesquioleate. Etc.

Among these, when a polyglycerin compound is used as the organic binder, the following effects can be obtained.
The polyglycerin compound particularly suitably prevents the conductor pattern precursor 30 from cracking when the conductor pattern precursor 30 formed using the conductor pattern forming ink 200 is dried (dedispersing medium). be able to. This is considered as follows. By including the polyglycerin compound in the conductive pattern forming ink 200, a polymer chain exists between the silver particles (metal particles), and the polyglycerin compound makes the distance between the silver particles moderate. be able to. Furthermore, since the polyglycerin compound has a relatively high boiling point, it is not removed when the aqueous dispersion medium is removed, and adheres around the silver particles. As described above, at the time of removing the aqueous dispersion medium, the polyglycerin compound continuously encapsulates the silver particles, and as a result, rapid volume shrinkage due to volatilization of the aqueous dispersion medium is avoided and silver grain growth (aggregation) is hindered. It is considered that generation of cracks in the conductor pattern precursor 30 is suppressed.

  In addition, the polyglycerin compound can more reliably prevent the occurrence of disconnection during sintering when the conductor pattern 20 is formed. This is considered as follows. Polyglycerin compounds have a relatively high boiling point or decomposition temperature. For this reason, in the process of forming the conductor pattern 20 from the conductor pattern precursor 30, the conductor pattern is not evaporated or thermally (oxidized) decomposed to a relatively high temperature after the aqueous dispersion medium evaporates. It can be present in the precursor 30. Therefore, until the polyglycerin compound evaporates or is thermally (oxidized) decomposed, the polyglycerin compound exists around the silver particles, and the approach and aggregation of the silver particles can be suppressed, and the polyglycerin compound is decomposed. Later, the silver particles can be joined more uniformly. Furthermore, a polymer chain (polyglycerin compound) exists between silver particles (metal particles) in the pattern during sintering, and the polyglycerin compound can keep the distance between the silver particles. Moreover, this polyglycerin compound has moderate fluidity | liquidity. For this reason, by including the polyglycerin compound, the conductor pattern precursor 30 has excellent followability to expansion / contraction due to temperature change of the ceramic molded body 7.

From the above, it is considered that disconnection of the formed conductor pattern 20 can be more reliably prevented.
Moreover, by including such a polyglycerin compound, the viscosity of the ink 200 can be made more appropriate, and the ejection stability from the inkjet head 110 can be improved more effectively. In addition, film formability can be improved.

  Among the above-mentioned polyglycerin compounds, polyglycerin is preferably used. Polyglycerin is particularly excellent in the ability to follow expansion and contraction due to temperature changes of the ceramic molded body 7 and is a component that can be more reliably removed from the conductor pattern 20 after the ceramic molded body 7 is sintered. . As a result, the electrical characteristics of the conductor pattern 20 can be made higher. Furthermore, since polyglycerin has high solubility in an aqueous dispersion medium, it can be suitably used.

  The organic binder preferably has a weight average molecular weight of 300 or more and 3000 or less, more preferably 400 or more and 1000 or less, and still more preferably 400 or more and 600 or less. Thereby, when the pattern formed using the conductor pattern forming ink 200 is dried, the generation of cracks can be more reliably prevented. On the other hand, when the weight average molecular weight of the organic binder is less than the lower limit, depending on the composition of the organic binder, the organic binder tends to be decomposed when removing the aqueous dispersion medium, thereby preventing the occurrence of cracks. The effect is reduced. When the weight average molecular weight of the organic binder exceeds the upper limit, the solubility and dispersibility in the ink 200 may be reduced due to the excluded volume effect or the like depending on the composition of the organic binder.

  Further, the content of the organic binder in the ink 200 is preferably 1 wt% or more and 30 wt% or less, and more preferably 5 wt% or more and 20 wt% or less. This makes it possible to more effectively prevent the occurrence of cracks and disconnections while making the ejection stability of the ink 200 particularly excellent. On the other hand, when the content of the organic binder is less than the lower limit, the effect of preventing the occurrence of cracks may be reduced depending on the composition of the organic binder. Further, when the content of the organic binder exceeds the upper limit, it may be difficult to make the viscosity of the ink 200 sufficiently low depending on the composition of the organic binder.

(Drying inhibitor)
Further, the conductor pattern forming ink 200 may contain a drying inhibitor. The drying inhibitor prevents unintended volatilization of the aqueous dispersion medium in the ink 200. As a result, the aqueous dispersion medium can be prevented from volatilizing in the vicinity of the ejection portion of the ink jet apparatus, and the increase in viscosity and drying of the ink 200 can be suppressed. As a result of including such a drying inhibitor, the conductive pattern forming ink 200 has excellent discharge stability of the droplets of the ink 200. That is, the variation in the weight of the droplets of ink 200 is small, and clogging, flight bending, and the like are small. In particular, even after the ink jet device is filled with the conductor pattern forming ink 200 and the ink jet device is in a standby state without being operated for a long period of time (for example, five days), the conductor pattern forming ink is used. In a uniform amount, it can be accurately discharged to a target position.
Examples of such a drying inhibitor include compounds represented by the following formula (I), alkanolamines, sugar alcohols, and the like, and one or more of them can be used in combination.

（ただし、Ｒ、Ｒ’は、それぞれ、Ｈまたはアルキル基である。）

(However, R and R ′ are each H or an alkyl group.)

The compound represented by the above formula (I) is a component having a high hydrogen bonding property. For this reason, it has a high affinity with water, can retain an appropriate amount of water, and can prevent the volatilization of the aqueous dispersion medium of the conductive pattern forming ink 200.
Further, the compound is relatively easily combusted and can be more easily removed (oxidative decomposition) from the conductor pattern 20 when the conductor pattern 20 is formed.
In addition, when the metal particles (silver particles) are colloidal particles having a dispersant attached to the surface as described above, the compound as described above is bonded to the surface dispersant by hydrogen bonding, and the dispersion stability of the metal particles. Has the effect of improving. Accordingly, the ejection stability of the conductor pattern forming ink 200 is excellent, and the storage stability is also excellent.

  As described above, R and R ′ in the compound represented by the above formula (I) used in the present invention are each hydrogen or an alkyl group, but R and R ′ are both hydrogen. preferable. That is, urea is preferable. As a result, the moisture retention as described above can be made particularly high, and particularly excellent ejection stability can be obtained. Further, when the metal particles are present as colloidal particles as described above, particularly excellent dispersion stability is exhibited.

  The content of the compound represented by the above formula (I) in the ink is preferably 5 wt% or more and 25 wt% or less, more preferably 8 wt% or more and 20 wt% or less, and 10 wt% or more and 18 wt% or less. % Or less is more preferable. Thereby, unintentional drying of the conductor pattern forming ink 200 can be prevented more efficiently. As a result, the ejection stability of the ink 200 can be made particularly excellent.

Alkanolamine is a highly moisturizing component, and when the metal particles are colloidal particles as described above, the functional group of the dispersant on the surface of the colloidal particles can be activated, and the dispersion stability of the metal particles Can be higher.
Examples of the alkanolamine include monoethanolamine, diethanolamine, triethanolamine, monopropanolamine, dipropanolamine, and tripropanolamine.

The alkanolamine is preferably a tertiary amine. Tertiary amines have particularly high moisture retention among alkanolamines, and can make the above effects more remarkable.
Among tertiary amines, it is particularly preferable to use triethanolamine from the viewpoints of ease of handling, high moisture retention, and the like.
The content of alkanolamine in the conductor pattern forming ink 200 is preferably 1 wt% or more and 10 wt% or less, and more preferably 3 wt% or more and 7 wt% or less. Thereby, the ejection stability of the conductor pattern forming ink 200 can be more effectively improved.

Sugar alcohol is obtained by reducing aldehyde groups and ketone groups of sugars.
Sugar alcohol is a compound having high moisture retention. In addition, since sugar alcohol has a large number of oxygen per molecular weight, it is easily decomposed and removed when the atmosphere reaches the decomposition temperature of sugar alcohol. For this reason, when the conductor pattern 20 is formed, the sugar alcohol is reliably removed from the formed conductor pattern 20 by oxidizing the temperature of the conductor pattern precursor 30 higher than the decomposition temperature of the sugar alcohol (oxidative decomposition). )can do.

  Examples of sugar alcohols include threitol, erythritol, pentaerythritol, dipentaerythritol, tripentaerythritol, arabitol, ribitol, xylitol, sorbitol, mannitol, threitol, glycol, tallitol, galactitol, allitol, altritol, dolitol, iditol. Glycerin (glycerol), inositol, maltitol, isomaltitol, lactitol, tranitol and the like, and one or more of these can be used in combination.

  The content of the sugar alcohol in the conductor pattern forming ink 200 as described above is preferably 3 wt% or more and 20 wt% or less, and more preferably 5 wt% or more and 15 wt% or less. Thereby, volatilization of the aqueous dispersion medium of the conductor pattern forming ink 200 can be more reliably suppressed, and the conductor pattern forming ink 200 has particularly excellent droplet ejection stability over a longer period of time.

[Surface tension modifier]
Further, the conductor pattern forming ink 200 may contain a surface tension adjusting agent.
The surface tension adjusting agent has a function of adjusting the contact angle between the conductor pattern forming ink 200 and the ceramic molded body 7 to a predetermined angle.
As the surface tension adjusting agent, various surfactants can be used, and one or a combination of two or more types can be used, but it is preferable to include an acetylene glycol compound.

  The contact angle between the conductive pattern forming ink 200 and the ceramic molded body 7 can be adjusted to a predetermined range with a small addition amount of the acetylene glycol compound. Thus, the finer conductor pattern 20 can be formed by adjusting the contact angle between the conductor pattern forming ink 200 and the ceramic molded body 7 within a predetermined range. Further, even when bubbles are mixed in the discharged droplets, the bubbles can be quickly removed. As a result, generation of cracks and disconnections in the formed conductor pattern 20 can be more effectively prevented.

Examples of acetylene glycol compounds include Surfynol 104 series (104E, 104H, 104PG-50, 104PA, etc.), Surfynol 400 series (420, 465, 485, etc.), Olphine series (EXP4036, EXP4001, E1010, etc.). ("Surfinol" and "Orphine" are trade names of Nissin Chemical Industry Co., Ltd.) and the like, and one or more of these can be used in combination.
The ink 200 preferably contains two or more acetylene glycol compounds having different HLB values. The contact angle between the conductive pattern forming ink 200 and the ceramic molded body 7 can be easily adjusted within a predetermined range.

  In particular, the difference between the HLB value of the acetylene glycol compound having the highest HLB value and the HLB value of the acetylene glycol compound having the lowest HLB value among two or more acetylene glycol compounds contained in the ink 200 is as follows. It is preferably 4 or more and 12 or less, and more preferably 5 or more and 10 or less. Thereby, the contact angle between the conductor pattern forming ink 200 and the ceramic molded body 7 can be easily adjusted within a predetermined range with a smaller amount of the acetylene glycol compound added.

When the ink 200 contains two or more acetylene glycol compounds, the HLB value of the acetylene glycol compound having the highest HLB value is preferably 8 or more and 16 or less, and 9 or more and 14 or less. Is more preferable.
When the ink 200 contains two or more acetylene glycol compounds, the HLB value of the acetylene glycol compound having the lowest HLB value is preferably 2 or more and 7 or less, and is 3 or more and 5 or less. More preferably.
The content of the surface tension adjusting agent contained in the ink 200 is preferably 0.001 wt% or more and 1 wt% or less, and more preferably 0.01 wt% or more and 0.5 wt% or less. As a result, the contact angle between the conductor pattern forming ink 200 and the ceramic molded body 7 can be more effectively adjusted to a predetermined range.

[Other ingredients]
The constituent components of the conductor pattern forming ink 200 are not limited to the above components, and may include components other than those described above.
Examples of such components include humectants such as thiourea, trimethylolpropane, and 2-pyrrolidinone, pH adjusters such as triethylamine and trimethylamine, other antiseptics, and fungicides.

  The viscosity of the conductive pattern forming ink 200 is not particularly limited, but is preferably 1 mPa · s or more and 25 mPa · s or less, and more preferably 3 mPa · s or more and 15 mPa · s or less. As a result, the discharge stability of the droplets can be improved, and the unintentional wetting and spreading of the ink 200 that has landed on the ceramic molded body 7 can be more reliably prevented, and the fine line width can be reduced. The conductor pattern precursor 30 can be formed.

<Inkjet device>
Next, the ink jet apparatus (droplet discharge apparatus) 100 of this embodiment will be described.
In the present embodiment, the conductive pattern forming ink 200 as described above can be discharged by using, for example, the ink jet apparatus (droplet discharge apparatus) 100 shown in FIGS. Hereinafter, the ink jet apparatus 100 and droplet discharge using the ink jet apparatus 100 will be described.

In FIG. 2, the X-axis direction is the left-right direction of the base 130, the Y-axis direction is the front-rear direction, and the Z-axis direction is the up-down direction.
The ink jet device 100 is a device that ejects ink droplets by an ink jet method. The inkjet apparatus 100 ejects droplets of ink 200 as shown in FIG. 3 (droplet ejection head; hereinafter simply referred to as “head”) 110, base 130, table 140, and control device (control). Means) 190, table positioning means 170, and head positioning means 180. Note that the inkjet apparatus 100 normally includes a head unit including a plurality of inkjet heads 110, but here, a case where a single inkjet head 110 is typically described will be described.

The base 130 is a table that supports each component of the droplet discharge device 100 such as the table 140, the table positioning unit 170, and the head positioning unit 180.
The table 140 is installed on the base 130 via the table positioning means 170. The table 140 is used to place (support) the base material S (the ceramic green sheet 7 in the present embodiment).
A rubber heater (heating means) 150 for heating the ceramic green sheet 7 is disposed on the back surface of the table 140. The entire surface of the ceramic green sheet 7 placed on the table 140 is heated to a predetermined temperature by the rubber heater 150.

  The table positioning unit 170 includes a first moving unit 171 and a motor 174. The table positioning means 170 determines the position of the table 140 in the base 130 in the Y-axis direction (the direction perpendicular to the X-axis direction and in the horizontal direction) and the rotational position in the θz direction (the direction around the Z-axis). The position of the ceramic green sheet 7 in the base 130 in the Y-axis direction and the rotational position in the θz direction are determined.

The first moving means 171 includes two rails 172 provided along the Y-axis direction, a support base 173 movably installed along the rail 172, and a motor (not shown). ing. The support base 173 supports the table 140 via the motor 174.
By driving the motor of the first moving means 171, the support base 173 moves along the rail 172, and the table 140 on which the substrate S is placed is moved and positioned in the Y-axis direction.

The motor 174 supports the table 140, and the table 140 is swung and positioned in the θz direction by driving the motor 174.
The head positioning unit 180 includes a second moving unit 181, a linear motor (third moving unit) 186, and motors 187, 188 and 189. The head positioning unit 180 determines the positions of the head 110 in the Y-axis direction and the Z-axis direction (the direction perpendicular to the X-axis direction and the Y-axis direction, that is, the vertical direction).

  The second moving means 181 is supported between the two support columns 182 erected from the base 130 and the two support columns 182, and is provided along the X-axis direction (horizontal one direction) 2. It has a rail base 183 having a rail 184, a support member 185 movably installed along the rail 184, and a motor (not shown). The support member 185 supports the head 110 via the linear motor 186.

By driving the motor of the second moving means 181, the support member 185 moves along the rail 184, and the linear motor 186 and the head 110 are moved and positioned in the X-axis direction.
The linear motor 186 supports the head 110, and the head 110 is moved and positioned in the Z-axis direction by driving the linear motor 186.
Further, by driving the motors 187, 188 and 189, the head 110 swings in the α direction (direction around the Z axis), β direction (direction around the Y axis) and γ direction (direction around the X axis), respectively. And be positioned.

  By the table positioning unit 170 and the head positioning unit 180 as described above, the ink jet apparatus 100 can accurately control the relative position and posture of the ink ejection surface 115P of the head 110 and the base material S on the table 140. It is like that. The first moving unit 171 and the second moving unit 181 constitute a moving mechanism (moving unit) that relatively moves the table 140 and the head 110.

  As shown in FIG. 3, the head 110 ejects ink 200 from a nozzle (ejection unit) 118 by an inkjet method (droplet ejection method). The droplets of the ink 200 are ejected from the nozzles 118 of the head 110 and adhere (land) on the substrate S placed on the table 140. In the present embodiment, the head 110 uses a piezo method in which the ink 200 is ejected using a piezo element 113 as a piezoelectric element. The piezo method has an advantage that the composition of the material is not affected because heat is not applied to the ink 200.

The head 110 has a head body 111, a diaphragm 112, and a piezo element 113.
The head main body 111 has a main body 114 and a nozzle plate 115 on the lower end surface thereof. Then, the main body 114 is sandwiched between the plate-like nozzle plate 115 and the vibration plate 112 to form a reservoir 116 as a space and a plurality of ink chambers 117 branched from the reservoir 116.

Ink 200 is supplied to the reservoir 116 from an ink tank (not shown). The reservoir 116 forms a flow path for supplying the ink 200 to each ink chamber 117.
The nozzle plate 115 is attached to the lower end surface of the main body 114 and constitutes an ink ejection surface 115P. In the nozzle plate 115, a plurality of nozzles 118 that discharge the ink 200 are formed corresponding to the ink chambers 117. An ink flow path is formed from each ink chamber 117 toward the corresponding nozzle 118.

The diaphragm 112 is attached to the upper end surface of the head body 111 and constitutes the wall surface of each ink chamber 117. The diaphragm 112 can vibrate according to the vibration of the piezo element 113.
The piezo element 113 is provided corresponding to each ink chamber 117 on the opposite side of the vibration plate 112 from the head body 111. The piezo element 113 is obtained by sandwiching a piezoelectric material such as quartz with a pair of electrodes (not shown). The pair of electrodes is connected to the drive circuit 191.

  When an electric signal is input from the drive circuit 191 to the piezo element 113, the piezo element 113 is expanded or contracted. When the piezo element 113 contracts and deforms, the pressure in the ink chamber 117 decreases, and the ink 200 flows from the reservoir 116 into the ink chamber 117. When the piezo element 113 expands and deforms, the pressure in the ink chamber 117 increases and the ink 200 is ejected from the nozzle 118. Note that the amount of deformation of the piezo element 113 can be controlled by changing the applied voltage. Further, the deformation speed of the piezo element 113 can be controlled by changing the frequency of the applied voltage. That is, by controlling the voltage applied to the piezo element 113, the ejection conditions of the ink 200 can be controlled.

The control device 190 includes, for example, a motor of the first moving unit 171, a motor 174, a motor of the second moving unit 181, a linear motor 186, motors 187, 188 and 189, a rubber heater 150, a drive circuit 191, etc. Control the operation of each part. For example, the control device 190 controls the ejection conditions of the ink 200 by adjusting the waveform of the applied voltage generated by the drive circuit 191, and operates the head positioning unit 180 and the table positioning unit 170, for example. By controlling, the ejection position of the ink 200 onto the substrate S is controlled. The control device 190 achieves the main function of the bitmap data creation means. The function of the bitmap data creation means of the control device 190 will be described in detail later.
By using the ink jet apparatus 100 as described above, the ink 200 can be accurately ejected to a desired place on the ceramic green sheet 7 (base S) with a desired amount.

Next, a conductor pattern, a method for forming the conductor pattern, a ceramic circuit board (wiring board) having the conductor pattern, and a method for manufacturing the ceramic circuit board will be described.
As shown in FIG. 1, a ceramic circuit board (wiring board) 1 includes a laminated board 3 in which a large number (for example, about 10 to 20) of ceramic boards 2 are laminated, and an outermost layer of the laminated board 3, that is, one of them. Alternatively, it is formed with a circuit 4 made of fine wiring or the like formed on the surfaces on both sides.

The laminated substrate 3 includes a circuit (conductor pattern) 20 formed with conductive pattern forming ink between the laminated ceramic substrates 2 and 2.
Further, contacts (vias) 6 connected to these circuits 20 are formed. With this configuration, the circuit 20 is electrically connected by the contact 6 between the circuits 20 and 20 arranged above and below. In addition, the circuit 4 is also formed with the conductive pattern forming ink, like the circuit 20.

Next, a method for manufacturing the ceramic circuit board 1 will be described with reference to a schematic process diagram of FIG.
First, as a raw material powder, ceramic powder made of alumina (Al ₂ O ₃ ), titanium oxide (TiO ₂ ) or the like having an average particle diameter of about 1 to 2 μm, borosilicate glass having an average particle diameter of about 1 to 2 μm, etc. Are prepared and mixed at an appropriate mixing ratio, for example, a weight ratio of 1: 1.

Next, a suitable binder (binder), a plasticizer, an organic solvent (dispersant), etc. are added to the obtained mixed powder, and a slurry is obtained by mixing and stirring. Here, polyvinyl butyral is preferably used as the binder, but it is insoluble in water and easily dissolved or swelled in a so-called oil-based organic solvent.
Next, the obtained slurry is formed into a sheet on a PET film using a doctor blade, reverse coater, etc., and formed into a sheet having a thickness of several μm to several hundred μm depending on the production conditions of the product. Wind it on a roll.

Subsequently, the sheet is cut according to the use of the product, and further cut into a sheet having a predetermined size. In this embodiment, for example, it is cut into a square shape having a side length of 200 mm.
Next, a through hole is formed at a predetermined position by drilling with a CO ₂ laser, a YAG laser, a mechanical punch or the like as required. Then, by filling the through hole with a thick film conductive paste in which metal particles are dispersed, a portion to be the contact 6 is formed. Further, a terminal portion (not shown) is formed at a predetermined position by screen printing of the thick film conductive paste. Thus, the ceramic green sheet (ceramic molded body) 7 is obtained by forming the contact 6 and the terminal portion. As the thick film conductive paste, the above-described conductor pattern forming ink can be used.

  On the surface of one side of the ceramic green sheet (ceramic molded body) 7 obtained as described above, a conductor pattern (circuit) 20 precursor (conductor pattern precursor) is formed continuously with the contact. To do. That is, as shown in FIG. 5A, the conductor pattern forming ink 200 as described above is applied to the ceramic green sheet 7 by a droplet discharge (inkjet) method and dried to provide a conductor to be the circuit 20. A pattern precursor 30 is formed.

  Here, as shown in FIG. 7, the conductor pattern (wiring pattern) 20 has at least one pad portion and at least one wiring portion connected to the pad portion. In the illustrated configuration, the conductor pattern 20 includes pad portions 21 and 22 and a wiring portion 23 that connects the pad portion 21 and the pad portion 22. In addition, the conductor pattern 20 is not limited to this, For example, the some wiring part may be connected to the one pad part. Further, the number of pad portions may be one, or three or more.

The pad portions 21 and 22 each have a circular shape in plan view. In addition, the shape of each pad part 21 and 22 is not limited to this, respectively, For example, an ellipse, polygons, such as a rectangle, etc. are mentioned, for example. Further, the shape of the pad portion 21 and the shape of the pad portion 22 may be different.
Moreover, the wiring part 23 has comprised linear form (strip | belt shape) by planar view. In addition, the shape of the wiring part 23 is not limited to this, For example, a curved shape, a broken line shape, etc. are mentioned, For example, the shape which combined these may be sufficient.

In the present embodiment, a case where the illustrated conductor pattern 20 is formed will be typically described.
In the present embodiment, the conductive pattern forming ink is ejected using the inkjet apparatus (droplet ejection apparatus) 100 shown in FIG. 2 and the inkjet head (droplet ejection head) 110 shown in FIG. Based on the data.

(Bitmap data creation process)
First, as shown in FIG. 6, prior to the formation of the conductor pattern precursor 30, design data such as CAD data of the conductor pattern 20 is input to the ink jet apparatus 100. As a result, the control device 190 of the ink jet apparatus 100 creates bitmap data indicating the bitmap 8 having the plurality of pixels 81 arranged in the matrix shown in FIG. 9 based on the design data (step S101). .
In the present embodiment, the shape of each pixel 81 of the bitmap 8 is a square (quadrangle), but it is needless to say that the shape is not limited to that shape.

  The pixel 81 of the bitmap 8 corresponds to the first pixel 811 corresponding to the position (attachment point) (landing point) where the ink droplet is attached (landing) and the position where the ink droplet is not attached (landing). The second pixel 812 includes the second pixel 812. “Corresponding to the position where the ink droplets are attached” means that the ink is not finally attached but is a target position when the ink droplets are landed. Hereinafter, when the first pixel 811 and the second pixel 812 are distinguished from each other, the pixels are referred to as “first pixel 811” and “second pixel 812” as described above. This is referred to as “pixel 81”.

  The pitch (distance between the centers) of the pixels 81 is smaller than the diameter after the ink droplets have landed on the ceramic green sheet 7 as a base material (however, 0 is not included), and is appropriately set according to various conditions. The Specifically, the pitch of the pixels 81 is preferably 1/2 or less (however, 0 is not included) of the diameter after the ink droplets have landed on the ceramic green sheet 7, and is 1/3 or less. More preferably. As a result, the droplets of ink ejected in one ejection operation spread out and adhere to the positions corresponding to the plurality of pixels 81, thereby preventing the ink from adhering to the site where the ink is to be adhered, A highly reliable conductor pattern 20 can be formed.

  The wiring portion corresponding portion 84 corresponding to the wiring portion 23 of the bitmap 8 has a shape corresponding to the wiring portion 23, that is, a belt shape. In the wiring portion corresponding portion 84, the first pixel 811 and the second pixel 812 may be arranged in any pattern, or only the first pixel 811 may be arranged. Note that the thickness and the like of the wiring portion 23 can be adjusted by adjusting the ratio of the area occupied by the first pixel 811 and the area occupied by the second pixel 812 in the wiring portion corresponding portion 84. The ratio of the area occupied by the first pixel 811 and the area occupied by the second pixel 812 is equal to the ratio between the number of the first pixels 811 and the number of the second pixels 812.

On the other hand, the pad portion corresponding portions 82 and 83 corresponding to the pad portions 21 and 22 of the bitmap 8 respectively have shapes corresponding to the pad portions 21 and 22, that is, circular shapes.
Each of the pad portion corresponding portions 82 and 83 includes a first portion 85 located on the extension line of the wiring portion corresponding portion 84 and first portions 85 located on both sides of the first portion 85 via the first portion 85. 2 parts 86 and a third part 87 located on the side opposite to the first part 85 of each second part 86. In other words, each pad portion corresponding portion 82, 83 is divided into a first portion 85, a second portion 86, and a third portion 87, respectively. The first portion 85 has a band shape. Moreover, the 2nd site | part 86 has comprised strip | belt shape. The first part 85 and the second part 86 are arranged so as to be parallel to the wiring part corresponding part 84 (extension line of the wiring part corresponding part 84).

In each of the pad portion corresponding portions 82 and 83, the density of the first pixels 811 is lower in the second portion 86 than in either the first portion 85 or the third portion 87. The first pixel 811 is arranged.
Thereby, the part (henceforth "the pad part precursor") 31 and 32 corresponding to the pad parts 21 and 22 of the precursor (conductor pattern precursor) 30 of the conductor pattern 20 and the part (henceforth the following) ) (Referred to as “wiring portion precursor”) 33 can be reduced, and the surface of the conductor pattern precursor 30 can be flattened (see FIG. 8). Thereby, the highly reliable conductor pattern 20 in which the occurrence of cracks, disconnections, and the like is prevented can be efficiently formed.

In particular, the difference in thickness between the pad portion precursors 31 and 32 and the wiring portion precursor 33 can be reduced regardless of whether the dimensions of the pad portions 21 and 22 are large or small.
Such an effect cannot be obtained by simply thinning out the first pixels 811 in the pad portion corresponding portions 82 and 83 of the bitmap 8 (for example, staggered arrangement).
Further, in the pad portion corresponding regions 82 and 83 of the bitmap 8, the ratio of the area occupied by the pixel 81 of the second portion 86 is preferably 10% or more and 70% or less, and 20% or more and 50% or less. It is more preferable. Thereby, the difference in thickness between the pad part precursors 31 and 32 and the wiring part precursor 33 can be further reduced.

The length L1 of the second part 86 in the direction perpendicular to the longitudinal direction of the first part 85 is preferably 5% or more and 35% or less of the diameter of the pad portion corresponding regions 82 and 83, More preferably, it is 10% or more and 25% or less. Thereby, the difference in thickness between the pad part precursors 31 and 32 and the wiring part precursor 33 can be further reduced.
In the pad portion corresponding portions 82 and 83 of the bitmap 8, the ratio of the area occupied by the first pixel 811 is preferably 10% or more and 95% or less, and 25% or more and 85% or less. Is more preferable. Thereby, the difference in thickness between the pad part precursors 31 and 32 and the wiring part precursor 33 can be further reduced.

  In the first region 85, the ratio of the area occupied by the first pixel 811 is preferably 30% or more and 100% or less, and more preferably 50% or more and 100% or less. In the present embodiment, this makes it possible to further reduce the difference in thickness between the pad portion precursors 31 and 32 and the wiring portion precursor 33. In the present embodiment, the second pixel 812 is not provided in the first portion 85.

  In the second portion 86, the ratio of the area occupied by the first pixel 811 is preferably 0% or more and 50% or less, and more preferably 0% or more and 30% or less. In particular, in the present embodiment, the first pixel 811 is not provided in the second portion 86. Further, the first pixel 811 in the first part 85 and the first pixel 811 in the third part 87 are isolated by the second pixel 812 in the second part 86. Thereby, the difference in thickness between the pad part precursors 31 and 32 and the wiring part precursor 33 can be further reduced.

  In the third region 87, the ratio of the area occupied by the first pixel 811 is preferably 40% or more and 100% or less, and more preferably 50% or more and 100% or less. Thereby, the difference in thickness between the pad part precursors 31 and 32 and the wiring part precursor 33 can be further reduced. In the present embodiment, the second pixel 812 is not provided in the third portion 87. That is, the first pixel 811 is arranged so that the first portion 85 and the third portion 87 have the same density of the first pixel 811.

(Conductor pattern precursor formation process)
Next, based on the bitmap data, ink droplets are ejected onto the ceramic green sheet 7 using the ink jet apparatus 100 and dried, and the ceramic green sheet 7 is shown in FIG. Conductive pattern precursor 30 is formed (step S102).
In this case, the control device 190 of the ink jet apparatus 100 operates each part of the ink jet apparatus 100 such as the first moving means 171, the second moving means 181, the head 110, and the rubber heater 150 based on each information including bitmap data. To control.

  Then, the ink jet apparatus 100 moves the ceramic green sheet 7 placed on the table 140 in the Y-axis direction (the head 110 and the table 140 are relatively moved) by the operation of the first moving unit 171. While passing under the head 110, based on the bitmap data, droplets of the ink 200 are ejected from the predetermined nozzle 118 of the head 110 and are attached (landed) at a predetermined position on the ceramic green sheet 7. Operates as follows. Hereinafter, this operation is also referred to as “main scanning of the head 110 and the ceramic green sheet 7 (base material S)” or simply “main scanning”.

  The main scanning of the head 110 and the ceramic green sheet 7 and the movement of the head 110 in the X-axis direction by the operation of the second moving means 181 (this is referred to as “sub-scanning”) are alternately repeated. Ink droplets are attached (landed) in the conductor pattern forming region for forming the conductor pattern 20 (conductor pattern precursor 30) on the green sheet 7. At this time, ink droplets adhere (land) in the pad portion forming regions 41 and 42 (see FIG. 10) for forming the pad portions 21 and 22 (pad portion precursors 31 and 32) on the ceramic green sheet 7. Ink droplets are ejected so that a high-density region and a low-density region with relatively high density of attachment points (landing points) are formed. In this embodiment, ink droplets are not ejected toward the low density region. The low density region is provided in a strip shape parallel to (in parallel with) the wiring portion forming region 43 (see FIG. 10) that forms the wiring portion 23 on the ceramic green sheet 7.

  More specifically, first, as shown in FIG. 10, the pad portion formation regions 41 and 42 are provided via a first region 44 located on an extension line of the wiring portion formation region 43 and the first region 44. It has the 2nd field 45 located in the both sides of the 1st field 44, and the 3rd field 46 located in the side opposite to the 1st field 44 of each 2nd field 45. . The first region 44 and each second region 45 each have a strip shape.

  In this step, the density of the attachment points for attaching the ink droplets in the pad portion formation regions 41 and 42 is higher in the second region 45 than in either the first region 44 or the third region 46. Ink droplets are ejected so that they are lower. In the present embodiment, ink droplets are not ejected toward the second region 45. Each first region 44 and each third region 46 are the high-density regions, and the second region 45 is the low-density region.

Thereby, as described above, the difference in thickness between the pad portion precursors 31 and 32 and the wiring portion precursor 33 can be reduced, and the surface of the conductor pattern precursor 30 can be flattened. Thereby, the highly reliable conductor pattern 20 in which the occurrence of cracks, disconnections, and the like is prevented can be efficiently formed.
The order in which the ink droplets are attached is not particularly limited.

In the present embodiment, the operation of the rubber heater 150 heats the table 140, and the ceramic green sheet 7 is heated via the table 140 so that the entire upper surface of the ceramic green sheet 7 reaches a predetermined temperature. ing.
At least a part of the aqueous dispersion medium evaporates from the surface side of the ink 200 that has landed on the ceramic green sheet 7. At this time, since the ceramic green sheet 7 is heated, the evaporation of the aqueous dispersion medium is promoted, and the content of the aqueous dispersion medium in the layer (conductor pattern precursor 30) in which the metal particles are concentrated is effectively reduced. Is done.

  The heating temperature of the ceramic green sheet 7 is not particularly limited and is appropriately set according to various conditions, but is higher than the temperature at the time of discharging the ink 200 and less than the boiling point of the aqueous dispersion medium of the ink 200 (aqueous dispersion). When the medium contains a plurality of liquids, the temperature is preferably a temperature lower than the lowest boiling point. Specifically, for example, the heating temperature of the ceramic green sheet 7 is preferably 40 ° C. or higher and lower than 100 ° C., and more preferably 50 ° C. or higher and 70 ° C. or lower. As a result, the ink 200 can be dried quickly without causing the aqueous dispersion medium to boil (boiling).

The formed conductor pattern precursor 30 may be further subjected to a drying process. The drying process can be performed under the same conditions as the heating temperature of the ceramic green sheet 7 when the droplets are discharged.
In this way, the conductor pattern precursor 30 is formed on the ceramic green sheet 7.

The pad portion precursors 31 and 32 of the conductor pattern precursor 30 are continuously formed. The wiring portion precursor 33 is also formed continuously. That is, the entire conductor pattern precursor 30 is continuously formed. Thereby, the highly reliable conductor pattern 20 can be formed.
Further, when the maximum thickness of the pad portion precursors 31 and 32 is a and the maximum thickness of the wiring portion precursor 33 is b, the difference between a and b is 10 μm or less (however, 0 Preferably 5 μm or less (including 0). Thereby, generation | occurrence | production of the crack in the conductor pattern 20, a disconnection, etc. can be prevented, and the highly reliable conductor pattern 20 can be formed.

In addition, | a−b | / a is preferably 0.3 or less (including 0), and more preferably 0.2 or less (including 0). Thereby, generation | occurrence | production of the crack in the conductor pattern 20, a disconnection, etc. can be prevented, and the highly reliable conductor pattern 20 can be formed.
Here, in this embodiment, as shown in FIG. 11, an aggregate of a plurality of pixels 81 of the bitmap 8 is defined as one unit. In the configuration shown in the figure, 16 pixels 81 arranged in a matrix of 4 in the row direction and 4 in the column direction are defined as one unit. Hereinafter, typically, the 16 pixels 81 are defined as one unit. The case will be described.

In this configuration, the ink liquids are arranged in the order of the numbers shown so that the adhesion of the ink onto the ceramic green sheet 7 corresponding to one unit of the aggregate of the pixels 81 is completed in 16 main scans. Drops are ejected (divided drawing is performed).
That is, ink droplets are ejected to the pixels 81 labeled “N” in the Nth (N is an integer from 1 to 16) main scan. However, in the case of the second pixel 812 corresponding to the position where the ink is ejected and the ink droplet is not adhered only when the pixel 81 is the first pixel 811 corresponding to the position where the ink droplet is adhered, the ink is ejected. Do not discharge.

  Taking the case where all the 16 pixels 81 for one unit are all the first pixels 811 as an example, first, as shown in FIG. 11, in the first main scan, the ink droplet 51 is the same as the droplet 51. In a state of landing on the ceramic green sheet 7, the two adjacent droplets 51 are discharged so as to be separated from each other. Thereby, it is possible to prevent the ink from being concentrated locally on the ceramic green sheet 7 due to the two adjacent liquid droplets 51 attracting each other due to surface tension or the like. Thereby, the difference in thickness between the pad portion precursors 31 and 32 and the wiring portion precursor 33 can be further reduced.

  Then, as shown in FIG. 12, in the second main scan, the ink droplet 52 is positioned between two adjacent droplets 51 attached on the ceramic green sheet 7 in the first main scan. Discharged. Thereby, two adjacent droplets 51 adhering in the first main scanning are connected by the droplet 52 adhering in the second main scanning. In this case, since the droplet 51 is dry compared to the state immediately after landing, there is no problem even if it contacts the droplet 52, and it is possible to prevent the ink from being concentrated locally. The liquid droplets 52 are discharged so that the two adjacent liquid droplets 52 are separated from each other in a state where the liquid droplets 52 have landed on the ceramic green sheet 7 in the same manner as the liquid droplets 51. The description in the subsequent main scanning is omitted.

  Adjustment of the thickness of the conductor pattern precursor 30 can be performed by setting the discharge conditions of the ink 200. That is, when forming a portion where the thickness of the conductor pattern precursor 30 is large, the discharge amount (or the number of droplets) of the ink 200 per area of the portion is made large, while the conductor pattern precursor 30 is formed. In the case where a portion having a small thickness is formed, the discharge amount (or the number of droplets) of the ink 200 per area of the portion can be reduced.

In addition, when the drying inhibitor is included in the ink 200 after the dispersion medium is evaporated, there is no possibility that the pattern is washed away even when the formed conductor pattern precursor 30 is not completely dried. Accordingly, it is possible to apply the ink 200 once, dry it, leave it for a long time, and then apply the ink 200 again.
In addition, when the ink 200 includes the organic binder as described above, the organic binder (particularly, the polyglycerin compound) is a chemically and physically stable compound. Even if the ink 200 is left for a long time, the ink 200 does not change in quality, and the ink 200 can be applied again, and a more uniform pattern can be formed. Thereby, there is no possibility that the conductor pattern precursor 30 itself has a multilayer structure, and as a result, there is no possibility that the specific resistance between the layers increases and the specific resistance of the entire conductor pattern 20 increases.

Through the above steps, the conductor pattern 20 of the present embodiment can be formed thicker than a conductor pattern formed by a conventional ink. More specifically, a film having a thickness of 5 μm or more can be formed.
After the conductor pattern precursor 30 is formed in this way, the required number of ceramic green sheets 7 on which the conductor pattern precursor 30 is formed, for example, about 10 to 20 are produced by the same process.

(Lamination process)
Next, the PET film is peeled off from these ceramic green sheets 7 and these are laminated to obtain a laminate 12.
At this time, the ceramic green sheets 7 to be laminated are arranged so that the respective conductor pattern precursors 30 are connected via the contacts 6 between the ceramic green sheets 7 stacked one above the other as necessary.
Thereafter, the ceramic green sheets 7 are pressed against each other while being heated to a glass transition point or higher of the binder constituting the ceramic green sheets 7. Thereby, the laminated body 12 is obtained.

(Baking process)
When the laminate 12 is formed in this way, for example, heat treatment (firing treatment) is performed by a belt furnace or the like. As a result, the ceramic green sheets 7 are sintered to form the ceramic substrate 2 as shown in FIG. 5B, and the conductive pattern precursor 30 is composed of silver particles (metal particles) constituting the ceramic substrate 2. Sintering into a circuit (conductor pattern) 20 composed of a wiring pattern or an electrode pattern (the circuit 4 is the same). And the laminated body 12 becomes the laminated substrate 3 by heat-processing the laminated body 12 in this way.

  Here, it is preferable that the heating temperature (firing temperature) of the laminated body 12 is equal to or higher than the softening point of the glass contained in the ceramic green sheet 7, and specifically, 600 ° C. or higher and 900 ° C. or lower. preferable. As heating conditions, the temperature is raised and lowered at an appropriate rate, and the maximum heating temperature, that is, the temperature of 600 ° C. to 900 ° C. is maintained for an appropriate time according to the temperature. To do.

  Thus, the glass component of the obtained ceramic substrate 2 can be softened by raising the heating temperature to a temperature equal to or higher than the softening point of the glass, that is, the temperature range. Therefore, after cooling to room temperature and hardening the glass component, the ceramic substrate 2 constituting the laminated substrate 3 and the circuit (conductor pattern) 20 are more firmly fixed.

In particular, the ceramic substrate 2 obtained by heating at a temperature of 900 ° C. or lower becomes a low-temperature fired ceramic (LTCC).
Here, the metal particles constituting the conductor pattern precursor 30 provided on the ceramic green sheet 7 are fused to each other by heat treatment and become conductive by being continuous.

  By such heat treatment, the circuit 20 is directly connected to the contact 6 in the ceramic substrate 2 and is made conductive. Here, if the circuit 20 is merely placed on the ceramic substrate 2, the mechanical connection strength to the ceramic substrate 2 is not ensured, and therefore there is a possibility that the circuit 20 may be damaged by an impact or the like. However, in this embodiment, as described above, the circuit 20 is firmly fixed to the ceramic substrate 2 by once softening the glass in the ceramic green sheet 7 and then curing it. Therefore, the formed circuit 20 has a high mechanical strength.

In such a method of manufacturing the ceramic circuit board 1, the conductive pattern forming ink 200 is applied to the ceramic green sheet 7 as described above, particularly when manufacturing the ceramic substrates 2 constituting the multilayer substrate 3. Thus, the conductor pattern 20 having a desired shape can be reliably formed with high accuracy.
Therefore, according to the present invention, it is possible not only to meet the demand for miniaturization of electronic components that are components of electronic equipment, but also to fully meet the needs for high-mix low-volume production.

  Moreover, since the heating temperature at the time of heat-treating the ceramic green sheet 7 is set to be equal to or higher than the softening point of the glass contained in the ceramic green sheet 7, it is formed when the ceramic green sheet 7 is made into the ceramic substrate 2 by the heat treatment. The conductive pattern 20 is firmly fixed on the ceramic substrate 2 (ceramic green sheet 7) by the softened glass, and therefore the mechanical strength of the conductive pattern 20 can be increased.

In the conductive pattern 20 of the ceramic circuit board 1 obtained by using the method as described above, silver particles are bonded to each other, and the silver particles are bonded to each other at least on the surface of the conductive pattern 20 without a gap.
The specific resistance of the conductor pattern 20 is preferably less than 20 μΩcm, and more preferably 15 μΩcm or less. The specific resistance at this time refers to the specific resistance after heating and drying at 160 ° C. after ink application. When the specific resistance is 20 μΩcm or more, it becomes difficult to use it for applications requiring electrical conductivity, that is, for electrodes formed on a circuit board.

The conductor pattern 20 as described above is used for high-frequency modules, interposers, MEMS (Micro Electro Mechanical Systems), acceleration sensors, surface acoustic wave elements, antennas, comb electrodes, and the like of mobile telephones such as mobile phones and PDAs. The present invention can be applied to deformed electrodes and other electronic parts such as various measuring devices.
The ceramic circuit board 1 as described above is an electronic component used in various electronic devices, and includes circuit patterns composed of various wirings and electrodes, a multilayer ceramic capacitor, a multilayer inductor, an LC filter, and a composite high-frequency component. Etc. are formed on a substrate.

[Second Embodiment]
FIG. 13 is a diagram schematically illustrating a configuration example (second embodiment) of a bitmap.
Hereinafter, the second embodiment will be described with a focus on the differences from the first embodiment described above, and the description of the same matters will be omitted.
As shown in FIG. 13, in the second embodiment, the first pixel 811 and the second pixel 812 are added to the third portion 87 of the pad portion corresponding portions 82 and 83 of the bitmap 8 in the bitmap data creation step. Provide. Then, the first pixel 811 is arranged so that the density of the first pixel 811 is lower in the third portion 87 than in the first portion 85. Thereby, the difference in thickness between the pad part precursors 31 and 32 and the wiring part precursor 33 can be further reduced.

In the third region 87, the ratio of the area occupied by the first pixel 811 is preferably 30% or more and 90% or less, and more preferably 40% or more and 80% or less. Thereby, the difference in thickness between the pad part precursors 31 and 32 and the wiring part precursor 33 can be further reduced.
In addition, when the dimension of the pad parts 21 and 22 is comparatively large, it is preferable to make the ratio of the area which the 1st pixel 811 occupies in the 3rd site | part 87 comparatively small.

In the conductor pattern precursor forming step, the main scanning and the sub scanning are alternately repeated, so that the ink pattern is formed in the conductor pattern forming region for forming the conductor pattern 20 (conductor pattern precursor 30) on the ceramic green sheet 7. A droplet is deposited (landed). At this time, in the pad portion formation regions 41 and 42 on the ceramic green sheet 7, the density of attachment points (landing points) for attaching (landing) ink droplets is a third density higher than that in the first region 44. Ink droplets are ejected so that the region 46 is lower. In the present embodiment, ink droplets are not ejected toward the second region 45. Thereby, the difference in thickness between the pad part precursors 31 and 32 and the wiring part precursor 33 can be further reduced.
According to the present embodiment, the same effects as those of the first embodiment described above can be obtained.

[Third Embodiment]
FIG. 14 is a diagram schematically illustrating a configuration example (third embodiment) of a bitmap.
Hereinafter, the third embodiment will be described with a focus on differences from the second embodiment described above, and description of similar matters will be omitted.
As shown in FIG. 14, in the third embodiment, in the bitmap data creation step, the assembly of the first pixels 811 includes a plurality of lines in the third portion 87 of the pad portion corresponding portions 82 and 83 of the bitmap 8. The first pixels 811 are arranged so as to form a shape formed by arranging the objects 88 at predetermined intervals. In this case, each linear body 88 forms a straight line and is disposed along the first portion 85 so as to be perpendicular to the first portion 85 (wiring portion corresponding portion 84).

  In the conductor pattern precursor forming step, the main scanning and the sub scanning are alternately repeated, so that the ink pattern is formed in the conductor pattern forming region for forming the conductor pattern 20 (conductor pattern precursor 30) on the ceramic green sheet 7. A droplet is deposited (landed). At this time, in the third regions 46 of the pad portion forming regions 41 and 42 on the ceramic green sheet 7, the attachment points for attaching the ink droplets are formed by arranging a plurality of linear bodies at predetermined intervals. Ink droplets are ejected so that In the present embodiment, ink droplets are not ejected toward the second region 45. Thereby, the difference in thickness between the pad part precursors 31 and 32 and the wiring part precursor 33 can be further reduced.

According to the present embodiment, the same effects as those of the second embodiment described above can be obtained.
As mentioned above, although this invention was demonstrated based on suitable embodiment, this invention is not limited to this. Moreover, the other arbitrary processes may be added to this invention.
Further, the present invention may be a combination of any two or more configurations (features) of the above embodiments.

For example, in the above-described embodiment, the case where a colloidal liquid is used as the conductor pattern forming ink has been described as a representative example.
In the above-described embodiment, the conductor pattern forming ink is described as having silver particles dispersed therein, but may be other than silver. As a metal which comprises a metal particle, silver, copper, palladium, platinum, gold | metal | money, or these alloys etc. are mentioned, for example, These can be used 1 type or in combination of 2 or more types. When the metal particles are an alloy, the metal is mainly used, and an alloy containing another metal may be used. Moreover, the alloy which the said metals mixed with arbitrary ratios may be sufficient. Further, mixed particles (for example, particles in which silver particles, copper particles, and palladium particles are present in an arbitrary ratio) may be dispersed in a liquid. Since these metals have a low resistivity and are stable and are not oxidized by heat treatment, it is possible to form a stable conductor pattern with a low resistance by using these metals.

Further, in the above-described embodiment, the case where the conductive pattern forming ink includes an aqueous dispersion medium as a dispersion medium for dispersing the metal particles has been representatively described. However, as the dispersion medium, water and / or a phase with water is used. A non-aqueous dispersion medium (oil-based dispersion medium) that is a liquid having poor solubility (for example, a liquid having a solubility in 100 g of water at 25 ° C. of less than 30 g) may be included.
In the above-described embodiment, the piezo method is used as the droplet discharge method. However, the present invention is not limited to this. For example, a method of discharging ink by bubbles generated by heating the ink, or an electrostatic actuator is used. Various known techniques such as an electrostatic system to be used can be applied.

  In the embodiment described above, the droplet discharge head moves in the X-axis direction and the table (base material) moves in the Y-axis direction. However, the present invention is not limited to this. It is only necessary that the table (base material) can move relatively in the X-axis direction and the Y-axis direction (the droplet discharge head is relatively in relation to the table in the X-axis direction and the Y-axis direction). As long as you can move to.) Other configuration examples include, for example, a configuration in which the droplet discharge head moves in the Y-axis direction and the table moves in the X-axis direction, a configuration in which the droplet discharge head moves in the X-axis direction and the Y-axis direction, and a table Examples include a configuration that moves in the X-axis direction and the Y-axis direction.

In the above-described embodiment, the wiring board is a multilayer board, but is not limited thereto, and may be a single-layer board, for example.
In addition, the base material (including its precursor) is not particularly limited. For example, it is a substrate made of an alumina sintered body, a polyimide resin, a phenol resin, a glass epoxy resin, glass or the like, a material containing ceramics and a binder. Examples of the sheet-shaped ceramic molded body are as follows.

  DESCRIPTION OF SYMBOLS 1 ... Ceramics circuit board (wiring board) 2 ... Ceramics board 3 ... Laminated board 4 ... Circuit (conductor pattern) 6 ... Contact 7 ... Ceramics green sheet (ceramic molding) 8 ... Bit map 81 ... Pixel 811 ... 1st pixel 812 ... second pixel 82, 83 ... pad portion corresponding portion 84 ... wiring portion corresponding portion 85 ... first portion 86 ... second portion 87 ... third portion 88 ... linear body 12 ... laminated body 20 ... circuit (conductor) Pattern) 21, 22 ... Pad part 23 ... Wiring part 30 ... Conductor pattern precursor 31, 32 ... Pad part precursor 33 ... Wiring part precursor 41, 42 ... Pad part forming region 43 ... Wiring part forming region 44 ... First Area 45 ... second area 46 ... third area 51, 52 ... droplet 100 ... inkjet device (droplet ejection device) DESCRIPTION OF SYMBOLS 110 ... Inkjet head (droplet discharge head, head) 111 ... Head main body 112 ... Vibrating plate 113 ... Piezo element 114 ... Main body 115 ... Nozzle plate 115P ... Ink discharge surface 116 ... Reservoir 117 ... Ink chamber 118 ... Nozzle (discharge unit) DESCRIPTION OF SYMBOLS 130 ... Base 140 ... Table 150 ... Rubber heater 170 ... Table positioning means 171 ... 1st moving means 172 ... Rail 173 ... Support stand 174 ... Motor 180 ... Head positioning means 181 ... 2nd moving means 182 ... Support pillar 183 ... Rail stand 184 ... Rail 185 ... Support member 186 ... Linear motor 187, 188, 189 ... Motor 190 ... Control device 191 ... Drive circuit 200 ... Ink (ink) for forming a conductor pattern S ... Base material S101, S102 ... Step

Claims (20)

Conductor pattern forming ink droplets are ejected onto a substrate by a droplet ejection method and dried to form a conductor pattern precursor having a pad portion and a wiring portion connected to the pad portion on the substrate. A conductor pattern precursor forming step,
Firing the precursor and forming the conductor pattern,
In the conductor pattern precursor forming step, the density of attachment points for attaching droplets of the conductor pattern forming ink is relatively high in the pad portion forming region for forming the pad portion on the substrate. Discharging the conductive pattern forming ink droplets so that the region and the low-density region are formed,
The method of forming a conductor pattern, wherein the low density region is provided in a strip shape in parallel with an extension line of a wiring part forming region that forms the wiring part on the base material.   The method for forming a conductor pattern according to claim 1, wherein in the conductor pattern precursor forming step, droplets of the conductor pattern forming ink are not ejected toward the low density region. Conductor pattern forming ink droplets are ejected onto a substrate by a droplet ejection method and dried to form a conductor pattern precursor having a pad portion and a wiring portion connected to the pad portion on the substrate. A conductor pattern precursor forming step,
Firing the precursor and forming the conductor pattern,
The pad part forming region for forming the pad part on the base material includes a first region located on an extension line of the wiring part forming region for forming the wiring part on the base material, and the first region. A second region located on both sides of the first region, and a third region located on the side of the second region opposite to the first region,
In the conductor pattern precursor forming step, the density of the attachment points for attaching the droplets of the conductor pattern forming ink to the pad portion forming region is higher than any of the first region and the third region. A method of forming a conductor pattern, wherein the conductor pattern forming ink droplets are ejected so that the second region is lower.   The method for forming a conductor pattern according to claim 3, wherein, in the conductor pattern precursor forming step, droplets of the ink for forming the conductor pattern are not ejected toward the second region.   In the conductor pattern precursor forming step, the conductor pattern is formed such that the density of attachment points for attaching droplets of the conductor pattern forming ink is lower in the third region than in the first region. The method for forming a conductor pattern according to claim 3 or 4, wherein droplets of forming ink are ejected. A bitmap data creation step of creating bitmap data indicating a bitmap having a plurality of pixels arranged in a matrix based on design data of a conductor pattern having a pad portion and a wiring portion connected to the pad portion; ,
A conductor pattern precursor that forms a conductor pattern precursor on the substrate by discharging droplets of a conductor pattern forming ink onto the substrate by a droplet discharge method based on the bitmap data, and drying the conductor pattern precursor. Forming process;
Firing the precursor and forming the conductor pattern,
The part of the bitmap corresponding to the pad part includes a first part located on an extension line of the part corresponding to the wiring part of the bitmap, and the first part via the first part. A second part located on both sides, and a third part located on the side of the second part opposite to the first part,
In the bitmap data creation step, the density of the pixel corresponding to the position where the droplet of the conductive pattern forming ink is attached is higher than the second part than the first part and the third part. The method of forming a conductor pattern, wherein the pixels are arranged so as to be lower.   The conductor pattern formation according to claim 6, wherein a pitch of the pixels is ½ or less (however, 0 is not included) of a diameter of the droplet of the conductor pattern forming ink after landing on the substrate. Method.   The ratio of the area occupied by the pixel corresponding to the position where the droplet of the conductive pattern forming ink is deposited at a portion corresponding to the pad portion of the bitmap is 10% or more and 95% or less. 8. A method for forming a conductor pattern according to 7.   9. The ratio of the area occupied by the pixel corresponding to the position where the droplet of the conductive pattern forming ink is attached in the first part is 30% or more and 100% or less. 9. Method for forming a conductor pattern.   The ratio of the area occupied by the pixel corresponding to the position where the droplet of the conductive pattern forming ink is attached in the second portion is 0% or more and 50% or less. Method for forming a conductor pattern.   The method for forming a conductor pattern according to claim 6, wherein the pixel corresponding to the position where the droplet of the conductor pattern forming ink is attached is not provided in the second portion.   The ratio of the area occupied by the pixel corresponding to a position where the droplet of the conductive pattern forming ink is attached in the third portion is 40% or more and 100% or less. Method for forming a conductor pattern.   In the bitmap data creation step, the density of the pixels corresponding to the position where the conductive pattern forming ink droplets are attached is lower in the third part than in the first part. The method for forming a conductor pattern according to claim 6, wherein the pixels are arranged.   The pixel corresponding to the position where the droplet of the conductor pattern forming ink is attached in the first part, and the pixel corresponding to the position where the droplet of the conductor pattern forming ink is attached in the third part. The method for forming a conductor pattern according to claim 6, wherein the pixel pattern is isolated by the pixel corresponding to a position where the droplet of the conductor pattern forming ink is not attached to the second portion.   The conductor pattern according to any one of claims 6 to 14, wherein a ratio of an area occupied by the pixel of the second part is 10% or more and 70% or less in a part corresponding to the pad portion of the bitmap. Forming method.   In the bitmap data creating step, the pixel assembly corresponding to the position where the droplet of the conductive pattern forming ink is attached is arranged with a plurality of linear bodies at predetermined intervals in the third portion. The method for forming a conductor pattern according to claim 6, wherein the pixels are arranged so as to form a shape.   The method of forming a conductor pattern according to any one of claims 1 to 16, wherein a portion of the precursor corresponding to the pad portion is formed continuously.   When the maximum value of the thickness of the portion corresponding to the pad portion of the precursor is a and the maximum value of the thickness of the portion corresponding to the wiring portion of the precursor is b, | a−b | / a The method for forming a conductor pattern according to claim 1, wherein is 0.3 or less (including 0). A table that supports the substrate;
A droplet discharge head for discharging droplets of conductive pattern forming ink to the base material supported by the table;
A moving mechanism for relatively moving the table and the droplet discharge head;
Control means for controlling the operation of the droplet discharge head and the moving mechanism,
The control means controls the operation of the droplet discharge head and the moving mechanism when forming a conductor pattern having a pad portion and a wiring portion connected to the pad portion on the base, and the moving mechanism While the table and the droplet discharge head are relatively moved, an attachment point for attaching the droplet of the conductor pattern forming ink to the pad portion forming region for forming the pad portion on the base material. It is configured to discharge the droplets of the conductor pattern forming ink from the droplet discharge head so that a high density region having a relatively high density and a low low density region are formed,
The liquid droplet ejection apparatus, wherein the low density region is provided in a strip shape parallel to an extension line of a wiring part forming region that forms the wiring part on the base material. A table that supports the substrate;
A droplet discharge head for discharging droplets of conductive pattern forming ink to the base material supported by the table;
A moving mechanism for relatively moving the table and the droplet discharge head;
Bitmap data creation means for creating bitmap data indicating a bitmap having a plurality of pixels arranged in a matrix based on design data of a conductor pattern having a pad portion and a wiring portion connected to the pad portion; ,
Control means for controlling the operation of the droplet discharge head and the moving mechanism,
The bitmap data creation means includes a first portion located on an extension line of a portion corresponding to the wiring portion of the bitmap, and a first portion corresponding to the pad portion of the bitmap. A second part located on both sides of the first part, and a third part located on the side opposite to the first part of the second part, and the conductor The density of the pixel corresponding to the position where the ink droplet for pattern formation is attached is such that the second part is lower than the first part and the third part. Is configured to place
The control means controls the operation of the droplet discharge head and the moving mechanism based on the bitmap data, and moves the table and the droplet discharge head relative to each other while moving the table and the droplet discharge head relative to each other. A droplet discharge device configured to discharge a droplet of the conductor pattern forming ink from a droplet discharge head onto the substrate.

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