CN101186020A - Polishing apparatus, polishing brush and manufacturing method of disk-shaped substrate - Google Patents
Polishing apparatus, polishing brush and manufacturing method of disk-shaped substrate Download PDFInfo
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- CN101186020A CN101186020A CN 200710186662 CN200710186662A CN101186020A CN 101186020 A CN101186020 A CN 101186020A CN 200710186662 CN200710186662 CN 200710186662 CN 200710186662 A CN200710186662 A CN 200710186662A CN 101186020 A CN101186020 A CN 101186020A
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Abstract
The invention provides a method for producing a grinding device, a grinding brush and a disk-shaped substrate. The method can promote the feeding of grinding liquid towards to the grinding operation region, and the grinding can be evenly achieved on the overlapping direction of an overlapped processing body. The grinding brush is inserted by a grinding mechanism into the center hole of the overlapped processing body which is supported on a rotary operating table, and the grinding liquid is fed to the upper surface of the overlapped processing body from a grinding liquid feeding nozzle so as to drive the overlapped processing body to rotate. The grinding brush is driven to do reciprocated motions with a preset routine on the axial direction (upward-downward direction) at the same time of rotating, thereby grinding the inner periphery of the center hole (the inner periphery of the disk-shaped substrate). The overlapped processing body overlaps the disk-shaped substrate into a plurality of sheets and then clamp-mounts a grinding liquid lead-in element which is used for feeding grinding liquid to the center hole from the outer periphery with a predetermined quantity of sheets. The grinding liquid lead-in body is supported on a holding rack. Besides, a cover is mounted so as to cover the overlapping part of the disk-shaped substrate. When in grinding, the grinding liquid flowing at the inner side of the cover is fed to the center hole through the grinding liquid lead-in element.
Description
Technical field
The present invention relates to lapping device that the interior Zhou Jinhang to disc wafers such as for example glass base plate for magnetic recording carrier grinds etc.
Technical background
Along with raising, in recent years, begin to enliven as the manufacturing of the disc board of disc wafer as the needs of recording medium.As the magnetic disc substrate of one of this disc board, be extensive use of aluminium base and glass substrate.Aluminium base has speciality on high and cheap this aspect of processability, on the other hand, glass substrate has speciality on good this aspect of flatness, flatness on intensity, surface.Particularly nearest, the miniaturization of disc board and the requirement of densification are significantly increased, thereby the surface roughness of substrate is little and can realize that the noticeable degree of the glass substrate of densification improves.
As the prior art of the communique relevant record with the manufacturing installation of this magnetic disc substrate, the technology (for example, with reference to patent documentation 1,2) that exists the inner peripheral surface to glass plate to grind with centre bore.
In this patent documentation 1, the laminated glass dish after will be glass plate stacked is arranged to and can be rotated around central shaft, and will have in the centre bore of tape spool abrasive brush insert layer laminated glass dish of countless bristles around axle.And then, while make this tape spool abrasive brush move back and forth opposite spin to the direction of rotation of laminated glass dish, thus the inner peripheral surface of laminated glass dish is ground.
In addition, in patent documentation 2, proposed such Ginding process: by glass substrate is impregnated in the lapping liquid that contains the abrasive particle that swims, thereby it is not enough and grind bad can not cause using up the grinding that causes by liquid.In addition, in this patent documentation 2, following technology being disclosed: rotates and grind by making shape in the shape of a spiral plant bristle on rotating shaft, thereby all the time to being supplied with fresh lapping liquid by the abradant surface circulation, improve grinding efficiency, repeatability and precision.
In Figure 17, represent that existing inner peripheral surface to disc wafer carries out an example of abrasive method.
In Ginding process shown in Figure 17, with disc wafer 10 at central axis direction stacked many and the stacked processome 501 that constitutes serving as vertically to be installed on the not shown rotary table axially.In the centre bore 501A of stacked processome 501, insert and dispose the abrasive brush 502 that the upper end is connected to the axle shape on the not shown rotating driveshaft.In addition, at the upside of stacked processome 501, dispose the nozzle 503 of supplying with the lapping liquid that contains abrasive particle.
And then, supply with lapping liquid from nozzle 503 to the upper surface of stacked processome 501 on one side, make stacked processome 501 rotations on one side, and abrasive brush 502 is moved back and forth while rotating on it is axial, come inner peripheral surface (being the inner peripheral surface of disc wafer 10) to grind the centre bore 501A of stacked processome 501.
The brush of abrasive brush 502 row have predetermined space (brush gap) and with preset space length in the shape of a spiral shape be located at a core around.Thus, the brush gap also forms helical form with the spacing identical with the brush row.
In this Ginding process shown in Figure 17, the lapping liquid of upper surface that is fed into stacked processome 501 flows like that shown in arrow among Figure 17 and supplies to grinding operation zone (between the inner peripheral surface of abrasive brush 502 and stacked processome 501) in grinding operation.That is, lapping liquid flows into the centre bore 501A of stacked processome 501, by the brush gap arrival grinding operation face of abrasive brush 502.And this lapping liquid moves to the bottom by means of the screw action in the brush gap that rotation produced of abrasive brush 502.And then, finally discharge from the lower ends downward side of the centre bore 501A of stacked processome 501.
Patent documentation 1: Japanese kokai publication hei 11-33886 communique
Patent documentation 2: Japanese kokai publication hei 11-221742 communique
Here, in the Ginding process of above-mentioned the sort of existing inner peripheral surface, grinding efficiency is different because of abrasive brush whole rigidity (brush hardness).
That is,, can promptly grind by using the high abrasive brush of brush hardness.Consequently, can improve operating efficiency, and can enhance productivity, help to reduce cost.On the other hand, if the brush hardness of abrasive brush is too high, then grinding can produce deviation and cause machining accuracy to descend.
Therefore, in order to stablize and carry out efficiently high-precision grinding operation, need to use the abrasive brush of the suitable brush hardness that does not have deviation.
But the brush hardness of abrasive brush not only changes according to each key elements such as the material of bristle material, line footpath, length, also changes according to the structure of tying up bristle material.Therefore, even the brush that uses material, line footpath, length to for example bristle material to manage also can produce the situation that can not carry out stable grinding.
In addition, in the Ginding process of above-mentioned the sort of existing inner peripheral surface, on above-below direction, be difficult to supply with evenly and fully lapping liquid, therefore exist on the above-below direction of stacked processome and grind uneven problem as the stacked processome in grinding operation zone.
That is, as mentioned above, in grinding operation, the lapping liquid that is fed into the upper surface of stacked processome arrives the grinding operation zone from this upper surface by narrow brush gap, and moves downwards gradually when carrying out grinding operation.Therefore, the amount of the lapping liquid of supplying with to grinding operation zone is defined and the donor site of lapping liquid only is upper surface, differs widely because of stacked position is different so grind the amount of employed lapping liquid.Consequently, the grinding state that grinds in interior week is different because of the stacked position in the stacked processome, and each disc wafer that constitutes stacked processome is difficult to carry out interior all grinding that deviation is few and precision is high.
Summary of the invention
Main purpose of the present invention provide can promote lapping liquid to the supply in grinding operation zone and can stacked direction at stacked processome on the lapping device that evenly grinds etc.
In addition, another purpose provides the abrasive brush that can stablize and carry out high-precision grinding operation efficiently.
Lapping device of the present invention grinds the inner peripheral surface that has the disc wafer of perforate at central part, it is characterized in that, this lapping device possesses: holding unit, and it keeps the stacked processome after many described disc wafers are stacked; Abrasive brush, it inserts in the described perforate of described disc wafer of described stacked processome and rotation; Cap assembly, it covers described stacked processome; And lapping liquid inflow unit, it makes in the described perforate of lapping liquid inflow by the described disc wafer of the described stacked processome of described cap assembly covering.
Lapping device is characterised in that described abrasive brush possesses: the axle core; Be wound on the brush matrix material on the described axle core; With become beam bending and be installed in bristle material on the described brush matrix material, described bristle material is crooked and be installed on the described brush matrix material in the mode of an end side of bundle and the other end side closure.
Lapping device is characterised in that, the clamping between the described disc wafer of being installed of described holding unit imports body and keeps described stacked processome, this importing body possesses perforate and this perforate and peripheral part are communicated with at the center interconnecting part, described lapping liquid flow into the unit makes lapping liquid flow into the described perforate of described stacked processome via described interconnecting part.
Lapping device is characterised in that, described cap assembly forms lapping liquid is directed to described importing body along the outer peripheral face of described stacked processome.
Lapping device is characterised in that, described cap assembly with and the outer peripheral face of described stacked processome between have a predetermined space mode cover this stacked processome.
Lapping device is characterised in that described cap assembly forms cylindric, and possesses the tap of lapping liquid near this end cylindraceous.
Lapping device of the present invention grinds the inner peripheral surface that has the disc wafer of perforate at central part, it is characterized in that, this lapping device possesses: holding unit, and it keeps the stacked processome after many described disc wafers are stacked; Abrasive brush, it inserts in the described perforate of described disc wafer of described stacked processome and rotation; And lapping liquid flows into the unit, and it flows in the described perforate of described disc wafer of described stacked processome lapping liquid, and described abrasive brush possesses: the axle core; Be wound on the brush matrix material on the described axle core; With become beam bending and be installed in bristle material on the described brush matrix material, described bristle material is crooked and be installed on the described brush matrix material in the mode of an end side of bundle and the other end side closure.
Lapping device is characterised in that, described abrasive brush possesses the core of the bending that limits this bristle material in the curved interior of described bristle material, and described brush matrix material is involved in this core and this bristle material wherein installs this bristle material.
Abrasive brush of the present invention is used for having at central part the grinding of the disc wafer of perforate, it is characterized in that, this abrasive brush possesses: the axle core; Be wound on the brush matrix material on the described axle core; With become beam bending and be installed in bristle material on the described brush matrix material, described bristle material is crooked and be installed on the described brush matrix material in the mode of an end side of bundle and the other end side closure.
Abrasive brush is characterised in that, the described brush matrix material that described bristle material is installed shape in the shape of a spiral is wound on the described axle core, and a described end side and described the other end side of this bristle material are radial extension from this core.
Abrasive brush is characterised in that, also possesses the core of the bending that limits this bristle material in the curved interior of described bristle material, and described brush matrix material is involved in described core and described bristle material wherein installs this bristle material.
Abrasive brush is characterised in that an end side of the described bundle of described bristle material and the other end side are crooked under the state that the central part of this core is concentrated from the position of being limited by described core.
The manufacture method of disc wafer of the present invention is ground the inner peripheral surface that has the disc wafer of perforate at central part and is made disc wafer, it is characterized in that the manufacture method of this disc wafer has following operation: to the maintenance operation that the stacked processome after stacked keeps as the described disc wafers that grind object with many; Utilize cap assembly to cover the operation of the outer peripheral face of the described stacked processome that keeps by described maintenance operation; And in the described perforate of the described disc wafer of the described stacked processome that covers by described cap assembly and keep by described maintenance operation, insert abrasive brush and make this abrasive brush rotation, so that lapping liquid flows into the grinding step that grinds in this perforate.
The manufacture method of disc wafer is characterised in that the described abrasive brush that is used for described grinding step possesses: the axle core; Be wound on the brush matrix material on the described axle core; With become beam bending and be installed in bristle material on the described brush matrix material, described bristle material is crooked and be installed on the described brush matrix material in the mode of an end side of bundle and the other end side closure.
The manufacture method of disc wafer is characterised in that, described maintenance operation will import body and be clipped between the described disc wafer of being installed, this importing body possesses perforate and this perforate and peripheral part are communicated with at the center interconnecting part, described grinding step uses described cap assembly, makes lapping liquid flow into the described perforate of described disc wafer via the described interconnecting part of described importing body.
The manufacture method of disc wafer is characterised in that described maintenance operation is installed in this disc wafer stacked and keeps on the substrate retainer of described disc wafer.
According to the present invention who as above constitutes like that, compare with the situation that does not adopt these structures, can be more equably supply with lapping liquid, and can be suppressed at the unequal of grinding on the stacked direction of stacked processome to the grinding operation zone.
In addition, grinding operation be stablized and be carried out expeditiously to the abrasive brush of the application of the invention can to disc wafer.
In addition,, compare, owing to stablizing and carrying out high-precision grinding operation efficiently, so can obtain the abrasive brush of the few suitable brush hardness of deviation with the situation that does not adopt these structures according to the present invention.
Description of drawings
Figure 1A～Fig. 1 H is the figure of the manufacturing process of the expression disc wafer (disc board) that present embodiment was suitable for.
Fig. 2 is the stereoscopic figure of lapping device.
Fig. 3 is the figure in the vertical section of expression grinding mechanism.
Fig. 4 A is the overall perspective view of the employed abrasive brush of grinding mechanism.
Fig. 4 B is the stereogram of the manufacturing process of expression abrasive brush.
Fig. 5 is the overall perspective view of stacked processome.
Fig. 6 is the stereogram of the lamination process of expression disc wafer.
Fig. 7 A is that expression is installed in the stereogram that slurry in the stacked way of disc wafer imports body.
Fig. 7 B is the profile that slurry imports body.
Fig. 8 is the figure of explanation to stacked processome mounting cup.
Fig. 9 is the profile that is in the stacked processome of grinding operation state.
Figure 10 is the flow chart of the flow process of all grinding steps in the expression.
Figure 11 A is the figure that expression utilizes the experimental result after the application's structure is ground.
Figure 11 B is the figure of the experimental result after expression utilizes comparative example to grind.
Figure 12 is the profile that the axial part of abrasive brush is amplified.
Figure 13 A is the amplification profile that turns upside down and represent along the II-II line of Fig. 4 B.
Figure 13 B is the vertical view of Figure 13 A.
Figure 14 A is corresponding with Figure 13 A, is the amplification profile of expression as the comparative example of prior art.
Figure 14 B is the vertical view of Figure 14 A.
Figure 15 A is the outside drawing of the high abrasive brush of brush hardness.
Figure 15 B is the enlarged drawing of the brush row of Figure 15 A.
Figure 16 A is the outside drawing of the low existing abrasive brush of brush hardness.
Figure 16 B is the enlarged drawing of the existing brush row shown in Figure 16 A.
Figure 17 is the figure of an example of the existing structure that the inner peripheral surface of disc wafer is ground of expression.
Symbol description
10 disc wafers; 150 abrasive brush; 151 cores; 152 brush row; 154 bristle materials; 154L, 154R hair end (end); 155 arbors (core); 156 base metal parts (brush matrix material).
The specific embodiment
Below, come embodiments of the present invention are described in detail with reference to accompanying drawing.
Figure 1A～Fig. 1 H is the figure of the manufacturing process of the expression disc wafer (disc board) that present embodiment was suitable for.
In this manufacturing process, at first, in a rough lapping (lap) operation shown in Figure 1A, with the raw material mounting of disc wafer (processome) 10 on platform 21, the plane 11 of grinding disc wafer 10.At this moment, on mounting has the surface of platform 21 of disc wafer 10, disperse and embed for example adamantine abrasive particle.Then, in the interior periphery grinding process shown in Figure 1B, grinding is carried out in the perforate (hole) 12 that is arranged on the center of disc wafer 10 with 22 pairs in interior all grinding stones, utilizes the periphery 13 of 23 pairs of disc wafers 10 of periphery grinding stone to carry out grinding.At this moment, the inner peripheral surface and the outer peripheral face that utilize interior all grinding stones 22 and periphery grinding stone 23 to clip disc wafer 10 are processed simultaneously, are easy to guarantee the axiality of internal diameter and external diameter thus.And, in the periphery grinding step shown in Fig. 1 C, use periphery to grind with the periphery 13 of brushing 24 sand disc shape substrates 10.Then, in the secondary rough lapping operation shown in Fig. 1 D, with disc wafer 10 mountings on platform 21, the further plane 11 of grinding disc wafer 10.
Then, in the interior all grinding steps shown in Fig. 1 E, abrasive brush 150 is inserted in the perforate at center of disc wafers 10 perforate 12 of sand disc shape substrate 10.At this moment, use the abrasive brush 150 that satisfies predetermined condition.That is,, has the inspection operation of abrasive brush 150 as the initial process of all grinding steps in this.Check operation for this, will be described in detail later.
Then, in the stock removal polishing operation shown in Fig. 1 F, disc wafer 10 mountings on platform 21, are polished the plane 11 of disc wafer 10.In the grinding at this moment, use the hard polisher as for example nonwoven (abrasive cloth).And then, in the second polishing operation shown in Fig. 1 G, used the plane lapping of soft polisher.Then, in the final cleaning/inspection operation shown in Fig. 1 H, clean and check, make disc wafer (disc board) 10.
Then, the lapping device that uses in all grinding steps in above-mentioned is described.
Fig. 2 is the stereogram of the outward appearance of expression lapping device 100, and Fig. 3 is the figure in the vertical section (part) of expression grinding mechanism 110.In addition, the SBR before the grinding operation above the grinding head 120 of expression grinding mechanism 110 is positioned in Fig. 2, the state in the operation after expression grinding head 120 descends in Fig. 3.Therefore, the position of the grinding head 120 among Fig. 2 and Fig. 3 is inconsistent.
Fig. 2 and lapping device 100 shown in Figure 3 are equipped with the stacked processome 140 (being described in detail later) that is laminated as the disc wafer 10 that grinds the object parts by many, and this stacked processome 140 is carried out grinding operation.
Lapping device 100 possesses grinding mechanism 110L, the 110R of pair of right and left arranged side by side on pedestal 101.Thus, can carry out grinding operation simultaneously to two groups of stacked processomes 140.In addition, about grinding mechanism 110L, 110R be identical structure, describe as grinding mechanism 110 below.
On pedestal 101, be equipped with and hold the slurry jar 102 that contains the abrasive particle that swims as the slurry of lapping liquid.In addition, though not shown, be provided with circulation and drive the pump of the slurry of holding in the slurry jar 102 and the control device of lapping device etc.
The open cover cylindraceous 122 of downside cover chucks 121 and further hang down into predetermined altitude and be arranged on chuck 121 around.And, in cover 122 inboard, with chuck 121 in abutting connection be provided with slurry supply nozzle 123.This slurry supply nozzle 123 is towards the upper surface open that is installed in the stacked processome 140 on the rotary table 130.
Rotary table 130 constitutes utilization and is formed by the disc-shaped part that predetermined diameter constitutes, but the Worker's Stadium 140 of surface mounting layer stack thereon.This rotary table 130 is equipped on the downside of grinding head 120, is driven by predetermined rotating speed rotation by not shown driver elements such as motor.Rotary table 130 is formed with the opening 131 of predetermined diameter in the central, and portion and rotary table 130 are provided with spring bearing 132 independently within it.This spring bearing 132 is supported for the front end of abrasive brush 150 can rotate.
In addition, be provided with the slurry receiver 133 that the round-ended cylinder shape is arranged of top opening in the mode that reaches downside on every side that covers this rotary table 130.In addition, be provided with the cover cylindraceous 134 of upper and lower opening at the upside of slurry receiver 133.In the face side of this cover 134, can be provided with door 135 with opening and closing.
The slurry supply nozzle 123 that is provided with on the grinding head 120 be connected by not shown pipe arrangement with the slurry jar 102 that on pedestal 101, is provided with respectively at the slurry receiver 133 that is provided with on the rotary table 1 30.And then, the slurry that the inside of slurry jar 102 holds to be supplied with to slurry supply nozzle 123, the slurry that slurry receiver 133 is received is recovered in the slurry jar 102.That is, slurry circulates to slurry jar 102 to 123 circulations of slurry supply nozzle and from slurry receiver 133 from slurry jar 102.
As shown in Figure 3, this grinding mechanism 110 is supported on the upper surface of rotary table 130 with stacked processome 140, and the upper end of abrasive brush 150 is supported on the chuck 121 of grinding head 120.This abrasive brush 150 uses qualified product in the inspection operation that describes in detail in the back.
And, in the centre bore 141 of the following general who has surrendered's abrasive brush 150 insert layers stack the Worker's Stadium 140 by grinding head 120 (brush inserts operation), and make the lower end of abrasive brush 150 become the state that is supported on the spring bearing 132.Under this state, supply with from slurry supply nozzle 123 ejection slurry and to the upper surface of stacked processome 140, and make rotary table 130 (stacked processome 140) rotation, and abrasive brush 150 rotate on its axial (above-below direction) move back and forth on one side with the stroke of being scheduled to.Thus, the inner peripheral surface (inner peripheral surface of disc wafer 10) to the centre bore 141 of stacked processome 140 grinds (grinding step).In the present embodiment, the direction of rotation of stacked processome 140 (rotary table 130) is set at from the upside observation and centers on counterclockwise, and the direction of rotation of abrasive brush 150 is set at from upside and observes around clockwise in contrast.
In addition, in the present embodiment,,, carry out grinding operation to cover the mode mounting cup 300 at the stacked position of disc wafer 10 with respect to stacked processome 140.
Fig. 4 A is the overall perspective view of grinding mechanism 110 employed abrasive brush 150, and Fig. 4 B is the stereogram of the manufacturing process of expression abrasive brush 150.
Shown in Fig. 4 A, Fig. 4 B, abrasive brush 150 around the axle core 151 that constitutes by predetermined diameter that utilizes formation such as unoxidizable alloy steel, with predetermined spacing in the shape of a spiral shape be provided with as the brush row 152 of brushing matrix material.Between brush row 152, be provided with predetermined interval (brush gap 153).Also shape is continuous in the axial direction equally in the shape of a spiral with brush row 152 in this brush gap 153.In addition, the hand of spiral of brush row 152 (brush gap 153) be so-called left-handed (around counterclockwise away from direction), and can with around clockwise rotation from the slurry of upside in downside (distolateral forward) drive brush gap 153 from base end side.
The external diameter of the size that is included in hair end of abrasive brush 150 is diameter 13mm with respect to the internal diameter 12mm of the perforate 12 of disc wafer 10 for example.
For the detailed structure and the inspection thereof of this abrasive brush 150, will describe in detail in the back.
Then, stacked processome 140 is described.
Fig. 5 is the overall perspective view of stacked processome 140, and Fig. 6 is the stereogram that is illustrated in the lamination process of disc wafer 10 when forming stacked processome 140.Fig. 7 A is that expression is installed in the stereogram that the slurry of adjusting in the crack in the ranks of going forward side by side in the stacked way of disc wafer 10 imports body 160, and Fig. 7 B is the profile that slurry imports body 160.
The upper support disk 210 of upside is the discoid of predetermined thickness, is formed with in the central to be used for the disc wafer after stacked 10 is installed on inner perforate 211.
The lower support disk 220 of downside side below the round plate 221 of predetermined thickness possesses the mounting flange 222 in big footpath.Be formed with the perforate 223 that is used to make the slurry circulation and runs through in the central for abrasive brush 150.The diameter of round plate 221 is set at the big scheduled volume of diameter than upper support disk 210.
To be diameters identical substantially with upper support disk 210 and by the disc-shaped part that predetermined thickness constitutes for fixed disc 240, is formed with the embedded hole 241 chimeric with top described later pressing piece 233 in the central.And fixed disc 240 is at the upper surface of upper support disk 210, so that the mode of center unanimity is by bolting.
In this retainer 200, as shown in Figure 6, use the disc wafer 10 that comes the mounting layer poststack as the centration axis 232 of stacked instrument.
That is, on centration axis 232, insert bottom pressing piece 231 also is installed, then chimeric successively disc wafer 10 is a stacked disc wafer 10 under the benchmark state of locating in the perforate 12 with its center thus.And then, at last top pressing piece 233 is inserted and is installed on the centration axis 232.Thus, be entrenched on the centration axis 232 and stacked after disc wafer 10 become and be clipped between bottom pressing piece 231 and the top pressing piece 233.
Top pressing piece 233 forms minor diameter part 233B at the upside of the main part 233A that external diameter and disc wafer 10 equate substantially, forms two sections profile.Be formed with the perforate 233C that is used to make the slurry circulation and runs through in the central for abrasive brush 150.
These top pressing pieces 233 and bottom pressing piece 231 are formed by resins such as for example polyacetals.
Centration axis 232 has the large-diameter portion 232A in the perforate 223 (with reference to Fig. 9) that is embedded in lower support disk 220 in the lower end; Has middle footpath portion (not shown) in the internal diameter that is fitted to bottom pressing piece 231 at the upside of large-diameter portion 232A.Be provided with the location axial region 232B chimeric in that more going up of middle footpath portion is edge-on with disc wafer 10.
As mentioned above, the disc wafer 10 that is entrenched on the centration axis 232 and after stacked inserts the inside that is configured in retainer 200 from the upside of Fig. 5 via the perforate (with reference to the perforate 211 of Fig. 9 described later) of upper support disk 210.And, by the fixed disc 240 of the upside that is fastened on upper support disk 210 by being pressed on the lower support disk 220, thereby the disc wafer after stacked 10 is fixed.At this moment, the embedded hole 241 of fixed disc 240 is fitted on the minor diameter part 233B of top pressing piece 233.
After stacked disc wafer 10 is fixed, extract centration axis 232 from the downside of Fig. 5.
Thus, the perforate 12 by the disc wafer after stacked 10 forms centre bore 141 (with reference to Fig. 5, Fig. 9 described later).The upper end of this centre bore 141 is connected to the perforate 233C of the open top pressing piece 233 in top, and the lower end of centre bore 141 is connected to the inside diameter (not shown) of bottom pressing piece 231 and the perforate 223 of lower support disk 220.
Here, between the disc wafer 10 in being laminated in retainer 200, according to predetermined number slurry is set and imports body 160.This is provided with by sandwich slurry importing body 160 according to predetermined number when disc wafer 10 being entrenched in successively on the above-mentioned centration axis 232.In the present embodiment, clamp two slurry in mode and import body 160 whole stacked thickness trisection.For example under the situation of stacked 150 disc wafers 10, for example per 50 clamp a slurry importing body 160.
Then, cover 300 grinding operation and describe having used.
Fig. 8 is the figure of explanation to stacked processome 140 mounting cups 300.In addition, Fig. 9 is the profile that is in the stacked processome 140 of grinding operation state.
In the present embodiment, many disc wafers 10 are stacked and be contained in the retainer 200 and on the stacked processome 140 that forms, carry out grinding operation with the mode mounting cup 300 that covers the stacked position of this disc wafer 10.
This cover 300 forms cylindric (straight tube-like) by for example laminar resin molding etc. in the open mode of upper and lower side.This cover 300 is except from forming at first the situation cylindraceous, also can be for example when mounted the resin film of rectangle curved circle and two ends are engaged and form.And its internal diameter almost seamlessly is entrenched on the round plate 221 of lower support disk 220 of retainer 200.Cover 300 height setting is than the high scheduled volume of height from the upper surface of the mounting flange 222 of the lower support disk 220 of retainer 200 to the upper surface of upper support disk 210.In addition, at (lower edge near) near cover 300 the end, on Zhou Fangxiang, have the tap 301 of a plurality of predetermined diameters with predetermined space.
As shown in Figure 8, the cover 300 of Xing Chenging to be being inserted on the stacked processome 140 outside the mode of the upside cover layer of stacked processome 140 stack the Worker's Stadium 140 as described above, and the lower end is fitted on the round plate 221 of lower support disk 220 of retainer 200 almost very close to each otherly and installs.
And then under cover 300 states that are installed on the stacked processome 140, the last ora terminalis of cover 300 is than the high scheduled volume of upper surface of stacked processome 140.In addition, as shown in Figure 9, between the lateral circle surface of cover 300 interior week and upper support disk 210, be formed with the circulation gap 142 of preset width.This diameter that is based on the round plate 221 of lower support disk 220 forms greatly than the diameter of upper support disk 210, and covers 300 straight tube-like that form with the chimeric diameter of the round plate 221 of lower support disk 220.In addition, form in the retainer 200 of same diameter at the round plate 221 of upper support disk 210 and lower support disk 220, preference forms the taper that top broadens and forms circulation gap 142 as covering 300.
In addition, the tap 301 that is formed on cover 300 bottom and can discharges slurry is positioned under the installment state of cover 300 than the upper surface of the round plate 221 of lower support disk 220 more by the position of upside.
As mentioned above, cover 300 is provided with the tap 301 that can discharge slurry, on the other hand, cover 300 as lower support disk 220 sealings of the lower openings portion of lower end by retainer 200, form cover layer stack the Worker's Stadium 140 around (stacked processome 140 is contained in inside) and to the cylindrical vessel shape of the top opening of cover 300.
And, utilize bolted to the rotary table 130 of grinding mechanism 110 by mounting flange 222 with the lower support disk 220 of retainer 200, thereby such as mentioned above, the stacked processome 140 that cover 300 is installed is installed on the rotary table 130.Explanation before this disc wafer 10 is stacked and be supported in the retainer 200 and the structure that is installed on the rotary table 130 is one of function of holding unit.In addition, the installation procedure of cover 300 is not limited to this, also can become and will cover 300 operations that cover on the stacked processome 140 after being installed in stacked processome 140 on the rotary table 130.
Then, come the mobile of the slurry in grinding operation and the grinding operation described with reference to Fig. 9.
Grinding operation is following carrying out: supply with from slurry supply nozzle 123 ejection slurry and to the upper surface of stacked processome 140, make rotary table 130 rotations, simultaneously, while make abrasive brush 150 rotate its axially on (above-below direction) move back and forth with predetermined stroke.
The slurry of upper surface that is fed into stacked processome 140 shown in arrow among Fig. 9 like that, flow into the centre bore 141 of stacked processome 140 from the perforate 233C of the top pressing piece 233 opened to the top of retainer 200, and flow into the periphery of stacked processome 140 and cover between 300 by circulation gap 142.The residue slurry that does not have to flow into wherein spills into the outside from covering 300 upper limb, flows down through outer peripheral face.
The slurry that flows in the centre bore 141 of stacked processome 140 is carried downwards by the bristle material (with reference to the bristle material 154 of Figure 12 described later) and the rotation of this abrasive brush 150 and then the deadweight of slurry etc. that form spiral helicine abrasive brush 150, from perforate 223 outflows of lower support disk 220.In addition, flow into the periphery of stacked processome 140 and the slurry of covering between 300 flows down through the outer surface of stacked processome 140 by circulation gap 142, its part flows out from the tap 301 that covers 300 bottom.
Slurry is flowed, thereby also supply with slurry to centre bore 141 from this outer surface.Thus,, be not only the slurry that flows into from the perforate 211 of upper support disk 210, also supply with slurry from outer circumferential side for abrasive brush 150 formed grinding operation zones (inner peripheral surface of centre bore 141).
Promptly, because the caused pressure that relatively moves of abrasive brush 150 and stacked processome 140 changes, shown in the arrow X among Fig. 9, the slurry that is present in the outer circumferential side of stacked processome 140 is supplied with via the perforation supply hole 163 of slurry importing body 160 and to the grinding operation zone.
Thus, not only from the upper end of stacked processome 140, also supply with fresh slurry midway to the grinding operation zone of (for example per 50) bottom from stacked processome 140.Therefore, the inner peripheral surface (inner peripheral surface of disc wafer 10) to the centre bore 141 of stacked processome 140 can grind on above-below direction more equably.In addition, owing to supply with more slurry,, can shorten the grinding operation time so grinding operation efficient improves to the grinding operation zone.
Here, if having slurry in the outside that connects supply hole 163, then the slurry of supplying with to the grinding operation zone via the perforation supply hole 163 of this slurry importing body 160 is enough.Therefore, in the present embodiment, as long as slurry flows to the position that has two slurry importing bodies 160 through the outer peripheral face of stacked processome 140.That is it is whole and stacked processome 140 is immersed wherein fully, not need slurry to be full of this cover 300.
The diameter and the quantity of near the tap 301 that makes slurry flow into the interval in the periphery of stacked processome 140 and the circulation gap 142 of cover between 300 and form the lower edge of cover 300 are set at, and supply with slurry well by this effect.
Then, interior all grinding steps of carrying out in above-mentioned lapping device 100 are described in more detail.
Figure 10 is the flow chart of the flow process of all grinding steps in the expression.
In interior all grinding steps, at first, disc wafer 10 is inserted erecting tools (centration axis 232) upward stack gradually (step 101).
Here,, clamp slurry and import body 160 (step 102), finish stacked (step 103) of the predetermined number (for example 150) of disc wafer 10 according to the predetermined number (for example 50) of disc wafer 10.
Then, be arranged on the retainer 200 and form stacked processome 140 (step 104) piling up and be layered in disc wafer 10 on the erecting tools.
Then, mounting cup 300 (step 105) on this stacked processome 140.
And then, will be equipped with on the rotary table 130 that cover 300 stacked processome 140 longitudinally is installed in lapping device 100 (step 106).
In above operation, stacked processome 140 finishes to the installation of lapping device 100.
In addition, as mentioned above, after the operation on the operation of mounting cup 300 on the stacked processome 140 also can the rotary table 130 that stacked processome 140 is installed in lapping device 100 in step 106 of step 105.In addition, the installation of abrasive brush 150 on the grinding head 120 of lapping device 100 (based on controlling of the abrasive brush 150 of chuck 121) suitably is set in before and after the above-mentioned operation.
Then, driving pump is supplied with slurry (step 107) with from the upper surface ejection slurry of slurry supply nozzle 123 to stacked processome 140.And then, in slurry to the centre bore 141 of stacked processome 140 and cover under the state that 300 inside (outer peripheral face of stacked processome 140) flows down, the grinding head 120 of grinding mechanism 110 is descended, in the centre bore 141 of the Worker's Stadium 140 that will superpose by abrasive brush 150 insert layers that this grinding head 120 supports (step 108).
Under this state, make abrasive brush 150 to predetermined direction (first direction) rotation while supplying with slurry, and make stacked processome 140 (rotary table 130) grind (step 109) to opposite direction (second direction) rotation of abrasive brush 150 with retainer 200.In addition, at this moment, shown in the white arrow of Fig. 9, make abrasive brush 150 on axial (above-below direction) of stacked processome 140, move back and forth (step 110).By abrasive brush 150 is moved back and forth, thereby make the change in location of the abrasive brush 150 that contacts with stacked processome 140, prevent to utilize the caused abrasion error in same position of the same position grinding layer stack the Worker's Stadium 140 of abrasive brush 150, can carry out the more grinding of homogenising.Carry out this grinding operation (step 111) according to predefined milling time, when through milling time, make lapping device stop (step 112).Do not have in milling time under the situation of process, turn back to step 109 and reprocessing.
Then, stacked processome 140 is taken off (step 113) from rotary table 130, and then, disc wafer 10 (step 114) taken off from retainer 200 with operation opposite when installing.
Then, result after structure (hereinafter referred to as the application's structure) to present embodiment and the comparative example as existing structure shown in Figure 17 compare experiment is described.
Experiment is carried out grinding operation with following condition, then, to the disc wafer 10 of entire quantity or predetermined quantity sample measure in the week diameter.
In the application's structure, 150 disc wafers 10 are stacked, clamp slurry according to per 50 and import body 160.That is, use two slurry to import body 160.
Figure 11 A is the figure that expression utilizes the experimental result after the application's structure is ground.Figure 11 B is the figure of the experimental result after expression utilizes comparative example to grind.Transverse axis is represented the position (top～bottom) of stacked disc wafer 10, and the longitudinal axis is represented by the internal diameter of abradant surface (internal diameter of disc wafer 10).Implement a-1～a-9 for the application's structure and amount to 9 experiments, implement b-1～b-3 for comparative example and amount to 3 experiments.
Experiment condition (jointly) is as follows:
(I) disc wafer (1.89 inches glass disks)
Material: sintered glass ceramics
External diameter: 48mm
Internal diameter: 12mm
Thickness: 0.7mm
(II) stacked processome
The quantity of stacked disc wafer: 150
Working sample quantity: 55 (extraction)～150 (entire quantity)
Rotating speed: 55rpm
(III) use abrasive brush
External diameter: 13mm
Material: 66 nylon
Line footpath: 0.90mm
Rotating speed: 1500rpm
Swing speed: 240mm/ branch
(IV) the abrasive brush amount of feeding
0.5mm
This abrasive brush amount of feeding is to make the center of abrasive brush 150 move the amount of (feeding) with respect to the center of stacked processome 140.
(V) slurry (lapping liquid)
Proportion: 1.2
(VI) process time
14～28 minutes (predetermined amount of grinding is set at benchmark)
Experimental result is that in the comparative example shown in (b) (existing structure), at the allocation position (upper and lower) of disc wafer 10, internal diameter produces the poor of about 5/1000mm.Relative therewith, in the structure of having used present embodiment, the difference in internal diameters of upper and lower can be suppressed at below about 2.5/1000mm.In addition, for the needed time of processing of predetermined amount of grinding, comparative example average out to 25.3 minutes, and relative therewith, be 19.2 minutes in the present embodiment, can shorten to about 75%.Thus, can confirm the validity of this structure.
In addition, even the application's structure, the tendency that also has the internal diameter of the disc wafer 10 of bottom to diminish.This can be provided with quantity and promote slurry to wait to the supply of bottom and improve by clamp position deflection downside and the increase that makes slurry import body 160.
Then, the abrasive brush 150 for present embodiment is suitable for uses above-mentioned Fig. 4 A, 4B and Figure 12 to Figure 14 to describe in detail.
Figure 12 is the profile that the axial part of abrasive brush 150 is amplified.Figure 13 A is that Figure 13 B is the vertical view of Figure 13 A along the amplification profile of the II-II line of Fig. 4 B (representing but turn upside down).In addition, Figure 14 A is the amplification profile of the comparative example corresponding with Figure 13 A, and Figure 14 B is the vertical view of the comparative example corresponding with Figure 13 B.
Shown in Fig. 4 B, abrasive brush 150 be with brush row 152 with predetermined interval in the shape of a spiral shape reel and be fixed on a core 151 around after, be that predetermined outer diameter forms with the hair end-grain cutting of brush row 152.
Shown in Figure 12 and Figure 13 A, Figure 13 B, part is reeling as the mode doubling of the arbor (core gold) 155 of the core of limit flexion (with an end side of the bundle of bristle material 154 and the mode bending of the other end side closure) in the central for the bristle material 154 that brush row 152 make predetermined length, and the sweep of this arbor 155 of will reeling is used as the brush matrix material from the outside base metal part 156 is riveted (caulking).That is, base metal part 156 is involved in arbor 155 and bristle material 154 and is integrated.Arbor 155 is formed by wire rods such as unoxidizable alloy steel.Thus, the bristle material 154 of brush row 152 is fixed on the arbor 155 integratedly, and forms the row shape with respect to axle core 151 as shown in Figure 12.Thus, hair end 154L, 154R are radial extension from arbor 155.
Bristle material 154 forms diameter 0.1mm by for example nylon etc.Around arbor 155, front ( hair end 154L, 154R) erects with free state from the front-end edge 156A of base metal part 156 this bristle material 154 in the part that is covered by base metal part 156.
Here, utilize the clinching method of base metal part 156, make the hair of the both sides of bristle material 154 hold the attitude of 154L, 154R to change.Specifically, the attitude that erects angle etc. of hair end 154L, the 154R of bristle material 154 and the two open angle θs of front-end edge 156A on the Zhou Fangxiang of arbor 155 of base metal part 156 change accordingly.
In the abrasive brush 150 of present embodiment, shown in Figure 13 A, Figure 13 B, the open angle θ of base metal part 156 is set at, and hair end 154L, the 154R of bristle material 154 both sides become in mutual butt of front end and close attitude.Thus, hair end 154L, the 154R of the many bristle materials 154 of both sides are in all direction sets of arbor 155.That is, an end side of the bundle of bristle material 154 ( hair end 154L or 154R) and the other end side ( hair end 154R or 154L) closure, and become the state of concentrating to the central part of arbor 155.
The abrasive brush 150 of this structure is compared with the abrasive brush 250 of the comparative example shown in Figure 14 A, Figure 14 B, even use identical bristle material 154 also can improve brush hardness.
Can consider that this is because even one one rigidity of bristle material 154 is identical, because hair end 154L, the 154R of many bristle materials 154 concentrate, thereby be subjected at a bristle material 154 that many bristle materials 154 also are out of shape under the situation of deformation force.
For the abrasive brush 250 of comparative example, the open angle θ of its base metal part 156 is bigger than the abrasive brush 150 of present embodiment, and hair end 154L, the 154R of bristle material 154 separate on Zhou Fangxiang.Like this, in the abrasive brush 250 that hair end 154L, 154R separate on Zhou Fangxiang, 154 independences of bristle material and separately distortion, so hardness is brushed in the simple addition of their distortion rigidity exactly.In other words, the brush hardness of the abrasive brush 250 of this structure is minimum state (hereinafter referred to as ground state) in the abrasive brush of the identical bristle material 154 that uses identical radical.In the abrasive brush 150 of present embodiment, because hair end 154L, the 154R of bristle material 154 both sides are concentrated, so brush hardness ratio ground state height.
In addition, even brush hardness is in the abrasive brush 250 of the comparative example of ground state,, also can improve brush hardness by improving the rigidity of each bristle material 154.That is, as long as use the material of high rigidity in bristle material 154, or its line of overstriking directly gets final product.But under the situation of the rigidity that improves each bristle material 154, each mao end 154L, 154R become big to the butt pressure of abradant surface.Consequently, produce amount of grinding because of the uneven unfavorable condition in the position of abradant surface.
In the abrasive brush 150 of present embodiment, owing to the rigidity that does not improve each bristle material 154 improves as a whole brush hardness, so can suppress the deviation of amount of grinding and can carry out grinding operation efficiently.
Then, the inspection whether this abrasive brush 150 is had predetermined brush hardness describes.
In interior all grinding operations of above-mentioned disc wafer 10, create a difference in the required time at the grinding same amount because the brush hardness of abrasive brush 150 is different, can influence grinding operation efficient.That is, when the brush hardness of abrasive brush 150 is hanged down, thereby grind spended time grinding operation decrease in efficiency.
By using appropriateness and not having the abrasive brush 150 of the brush hardness of deviation, shortened and constant the grinding operation time, can carry out rational grinding operation.
For this reason, need to check abrasive brush 150 and abrasive brush with predetermined brush hardness and the abrasive brush that does not have predetermined brush hardness are differentiated, only use to have the predetermined abrasive brush 150 of brushing hardness.In the present embodiment, can differentiate simply by its form feature.
That is, observe the outward appearance of abrasive brush 150, whether hair end 154L, 154R that investigation constitutes bristle material 154 both sides of these brush row 152 concentrate on the central authorities of brushing row 152.
Thus, can confirm that abrasive brush 150 has the above brush hardness of ground state.At this moment, can whether can see that arbor 155 is judgment standard (an inspection benchmark) with central authorities at brush row 152.That is, an end side of halved tie ( hair end 154L or 154R) and the other end side (hair is held 154R or 154L) focus on that arbor 155 is covered by bristle material 154 and the situation of invisible degree is investigated.
And then, cannot see under the situation of arbor 155 in the central authorities of brushing row 152, hair end 154L, the 154R of bristle material 154 both sides concentrate on the central authorities of brushing row 152.This abrasive brush 150 is differentiated for having predetermined above brush hardness.
On the contrary, can see under the situation of arbor 155, not concentrate thereby hair end 154L, the 154R of bristle material 154 both sides keep clear of the central authorities of brush row 152 in the central authorities of brushing row 152.It is that ground state does not have predetermined brush hardness that this abrasive brush 150 is differentiated for brushing hardness.
In addition, when judging brush hardness, can use amplifying units such as microscope, as long as observe with suitable multiple (for example 10 times).
Figure 15 A, Figure 15 B, Figure 16 A and Figure 16 B represent the photo of concrete example.Figure 15 A is the outward appearance of the high abrasive brush 150 of brush hardness, and Figure 15 B is the enlarged photograph of these brush row 152.In addition, Figure 16 A is the outward appearance of the low abrasive brush 250 of brush hardness, and Figure 16 B is the enlarged photograph of these brush row 152.In addition, to the label at each position, so can carry out reference owing in above-mentioned Figure 13 A, Figure 13 B and Figure 14 A, Figure 14 B, also be marked with same numeral.
In the high abrasive brush 150 of the brush hardness shown in Figure 15 A, as above-mentioned judgment standard, hair end 154L, the 154R of bristle material 154 both sides concentrates on the central authorities of brushing row 152 and intensive, and shown in Figure 15 B, can not see arbor 155.Relative with it, in the low abrasive brush 250 of the brush hardness shown in Figure 16 A, shown in Figure 16 B, the central authorities of brush row 152 have the gap of the hair end 154L, the 154R that there are not bristle material 154 both sides, and can see arbor 155 from this gap.
Use these abrasive brush 150,250, carry out the grinding operation in the interior week of above-mentioned disc wafer 10, measure the required time of grinding of 13～20 μ m with the same terms.Consequently, average out to is 16 minutes in the abrasive brush 150 of present embodiment, and average out to is 32 minutes in the abrasive brush 250 of comparative example.In addition, about abradant surface, the abrasive brush 150 of using present embodiment is good, can see striped at abradant surface with 250 of the abrasive brush of comparative example.Like this, the abrasive brush 150 of present embodiment can be finished grinding operation with half milling time of the pact of the abrasive brush 250 of comparative example.Abradant surface is also good, can confirm the validity of this structure.In addition, can see that the reason of striped can think at abradant surface with the abrasive brush 250 of the low comparative example of brush hardness, in the trickle crackle that the hair end of thin and soft bristle material 154 forms when invading in last operation with the inner peripheral surface of the perforate 12 of interior all grinding stones 22 (with reference to Figure 1B) grinding disc wafer 10, owing to abrasive action makes crackle expansion.
The specification of the abrasive brush 150,250 shown in Figure 15 A and Figure 16 A is as follows:
Brush external diameter: 13mm
The diameter of axle core 151: 4mm
The material of bristle material 154: 66 nylon
The diameter of bristle material 154: 0.1mm
The density of the bristle material 154 in the brush row 152: 400～500/cm
The diameter of arbor 155: 0.6mm
As above describe in detail like that, according to the abrasive brush 150 of present embodiment, can obtain not having the abrasive brush 150 of the suitable brush hardness of deviation.In addition, can easily differentiate abrasive brush 150 from outward appearance with this brush hardness.And then, by using this abrasive brush 150, can carry out stable grinding operation with high-accuracy high-efficiency ground.
In addition, the application's invention is not limited to the structure shown in the above-mentioned embodiment, can suitably change.
Claims (16)
1. lapping device, this lapping device grinds the inner peripheral surface that has the disc wafer of perforate at central part, it is characterized in that, and this lapping device possesses:
Holding unit, it keeps the stacked processome after many described disc wafers are stacked;
Abrasive brush, it inserts in the described perforate of described disc wafer of described stacked processome and rotation;
Cap assembly, it covers described stacked processome; And
Lapping liquid flows into the unit, and it makes in the described perforate of lapping liquid inflow by the described disc wafer of the described stacked processome of described cap assembly covering.
2. lapping device according to claim 1 is characterized in that,
Described abrasive brush possesses: the axle core; Be wound on the brush matrix material on the described axle core; With become beam bending and be installed in bristle material on the described brush matrix material, described bristle material is crooked and be installed on the described brush matrix material in the mode of an end side of bundle and the other end side closure.
3. lapping device according to claim 1 is characterized in that,
The clamping between the described disc wafer of being installed of described holding unit imports body and keeps described stacked processome, and this importings body possesses perforate and with the interconnecting part of this perforate and peripheral part connection at the center,
Described lapping liquid flows into the unit makes lapping liquid flow into the described perforate of described stacked processome via described interconnecting part.
4. lapping device according to claim 3 is characterized in that,
Described cap assembly forms lapping liquid is directed to described importing body along the outer peripheral face of described stacked processome.
5. lapping device according to claim 1 is characterized in that,
Described cap assembly with and the outer peripheral face of described stacked processome between have a predetermined space mode cover this stacked processome.
6. lapping device according to claim 5 is characterized in that,
Described cap assembly forms cylindric, and possesses the tap of lapping liquid near this end cylindraceous.
7. lapping device, this lapping device grinds the inner peripheral surface that has the disc wafer of perforate at central part, it is characterized in that, and this lapping device possesses:
Holding unit, it keeps the stacked processome after many described disc wafers are stacked;
Abrasive brush, it inserts in the described perforate of described disc wafer of described stacked processome and rotation; And
Lapping liquid flows into the unit, and it flows in the described perforate of described disc wafer of described stacked processome lapping liquid,
Described abrasive brush possesses:
The axle core;
Be wound on the brush matrix material on the described axle core; With
Become beam bending and be installed in bristle material on the described brush matrix material,
Described bristle material is crooked and be installed on the described brush matrix material with an end side of bundle and the mode of the other end side closure.
8. lapping device according to claim 7 is characterized in that,
Described abrasive brush possesses the core of the bending that limits this bristle material in the curved interior of described bristle material, and described brush matrix material is involved in this core and this bristle material wherein installs this bristle material.
9. abrasive brush, the grinding that it is used for having at central part the disc wafer of perforate is characterized in that, this abrasive brush possesses:
The axle core;
Be wound on the brush matrix material on the described axle core; With
Become beam bending and be installed in bristle material on the described brush matrix material,
Described bristle material is crooked and be installed on the described brush matrix material with an end side of bundle and the mode of the other end side closure.
10. abrasive brush according to claim 9 is characterized in that,
The described brush matrix material that described bristle material is installed shape in the shape of a spiral is wound on the described axle core, and a described end side and described the other end side of this bristle material are radial extension from this core.
11. abrasive brush according to claim 9 is characterized in that,
Also possess the core of the bending that limits this bristle material in the curved interior of described bristle material,
Described brush matrix material is involved in described core and described bristle material wherein installs this bristle material.
12. abrasive brush according to claim 9 is characterized in that,
One end side of the described bundle of described bristle material and the other end side are crooked under the state that the central part of this core is concentrated from the position of being limited by described core.
13. the manufacture method of a disc wafer, it grinds the inner peripheral surface that has the disc wafer of perforate at central part and makes disc wafer, it is characterized in that the manufacture method of this disc wafer has following operation:
To the maintenance operation that the stacked processome after stacked keeps as the described disc wafers that grind object with many;
Utilize cap assembly to cover the operation of the outer peripheral face of the described stacked processome that keeps by described maintenance operation; And
In the described perforate of the described disc wafer of the described stacked processome that covers by described cap assembly and keep, insert abrasive brush and make this abrasive brush rotation, so that lapping liquid flows into the grinding step that grinds in this perforate by described maintenance operation.
14. the manufacture method of disc wafer according to claim 13 is characterized in that,
The described abrasive brush that is used for described grinding step possesses:
The axle core;
Be wound on the brush matrix material on the described axle core; With
Become beam bending and be installed in bristle material on the described brush matrix material,
Described bristle material is crooked and be installed on the described brush matrix material with an end side of bundle and the mode of the other end side closure.
15. the manufacture method of disc wafer according to claim 13 is characterized in that,
Described maintenance operation will import body and be clipped between the described disc wafer of being installed, this importing body possesses perforate and this perforate and peripheral part are communicated with at the center interconnecting part,
Described grinding step uses described cap assembly, makes lapping liquid flow into the described perforate of described disc wafer via the described interconnecting part of described importing body.
16. the manufacture method of disc wafer according to claim 13 is characterized in that,
Described maintenance operation is installed in this disc wafer stacked and keeps on the substrate retainer of described disc wafer.
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006-316342 | 2006-11-22 | ||
| JP2006316342 | 2006-11-22 | ||
| JP2006316342A JP4252087B2 (en) | 2006-11-22 | 2006-11-22 | Polishing apparatus and disk-shaped substrate manufacturing method |
| JP2006-329255 | 2006-12-06 | ||
| JP2006329255 | 2006-12-06 | ||
| JP2006329255A JP4351697B2 (en) | 2006-12-06 | 2006-12-06 | Manufacturing method of disk-shaped substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101186020A true CN101186020A (en) | 2008-05-28 |
| CN101186020B CN101186020B (en) | 2013-04-17 |
Family
ID=39478755
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200710186662 Expired - Fee Related CN101186020B (en) | 2006-11-22 | 2007-11-21 | Polishing apparatus and manufacturing method of disk-shaped substrate |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP4252087B2 (en) |
| CN (1) | CN101186020B (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102485423A (en) * | 2010-12-01 | 2012-06-06 | 财团法人金属工业研究发展中心 | Grinding and polishing device and grinding and polishing method thereof |
| CN103158060A (en) * | 2011-12-16 | 2013-06-19 | 旭硝子株式会社 | Grinding brush, grinding method of end surface of glass substrate, production method of glass substrate |
| CN105980104A (en) * | 2014-08-05 | 2016-09-28 | 新东工业株式会社 | Brush polishing device and polishing method |
| CN108907904A (en) * | 2018-07-25 | 2018-11-30 | 四川中科海科技有限责任公司 | The surface grinding process of low-carbon steel part |
| CN111975468A (en) * | 2020-08-28 | 2020-11-24 | 天津津航技术物理研究所 | Quartz deep hole polishing device and polishing method |
| CN111993258A (en) * | 2020-08-19 | 2020-11-27 | 广东长盈精密技术有限公司 | Polishing jig, polishing device and polishing method of mobile phone middle frame |
| CN112008503A (en) * | 2020-08-19 | 2020-12-01 | 广东长盈精密技术有限公司 | Middle polishing method |
| CN112008504A (en) * | 2020-08-19 | 2020-12-01 | 广东长盈精密技术有限公司 | Coarse polishing method |
| CN112091802A (en) * | 2020-08-19 | 2020-12-18 | 广东长盈精密技术有限公司 | Fine polishing method |
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| JP5041030B2 (en) * | 2010-04-30 | 2012-10-03 | 旭硝子株式会社 | Work holder for glass substrate laminate, method for producing glass substrate using this work holder, glass substrate produced by this production method, method for producing glass substrate for magnetic recording medium using this work holder, and magnetic recording medium Glass substrate |
| JP5573401B2 (en) * | 2010-06-18 | 2014-08-20 | 旭硝子株式会社 | WORK HOLDER FOR GLASS SUBSTRATE LAMINATE, GLASS SUBSTRATE MANUFACTURING METHOD USING THE WORK HOLDER, AND MAGNETIC RECORDING MEDIUM GLASS SUBSTRATE PRODUCED BY THE MANUFACTURING METHOD |
| CN103454134B (en) * | 2013-09-18 | 2016-04-20 | 核工业理化工程研究院 | The sample polishing of rack-and-pinion is adopted to assist harness |
| CN107571344A (en) * | 2017-10-19 | 2018-01-12 | 浙江粤强家具科技有限公司 | A kind of timber punch device with polishing function |
| CN113059443B (en) * | 2021-04-22 | 2022-11-22 | 国网甘肃省电力公司酒泉供电公司 | Power wire and cable clamp chuck machining machine and machining method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4276674A (en) * | 1980-02-04 | 1981-07-07 | Milwaukee Dustless Brush Co. | Rotary broom for sweeper |
-
2006
- 2006-11-22 JP JP2006316342A patent/JP4252087B2/en not_active Expired - Fee Related
-
2007
- 2007-11-21 CN CN 200710186662 patent/CN101186020B/en not_active Expired - Fee Related
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102485423A (en) * | 2010-12-01 | 2012-06-06 | 财团法人金属工业研究发展中心 | Grinding and polishing device and grinding and polishing method thereof |
| CN103158060A (en) * | 2011-12-16 | 2013-06-19 | 旭硝子株式会社 | Grinding brush, grinding method of end surface of glass substrate, production method of glass substrate |
| CN105980104A (en) * | 2014-08-05 | 2016-09-28 | 新东工业株式会社 | Brush polishing device and polishing method |
| CN105980104B (en) * | 2014-08-05 | 2019-06-14 | 新东工业株式会社 | Brush grinding device and grinding method |
| CN108907904A (en) * | 2018-07-25 | 2018-11-30 | 四川中科海科技有限责任公司 | The surface grinding process of low-carbon steel part |
| CN111993258A (en) * | 2020-08-19 | 2020-11-27 | 广东长盈精密技术有限公司 | Polishing jig, polishing device and polishing method of mobile phone middle frame |
| CN112008503A (en) * | 2020-08-19 | 2020-12-01 | 广东长盈精密技术有限公司 | Middle polishing method |
| CN112008504A (en) * | 2020-08-19 | 2020-12-01 | 广东长盈精密技术有限公司 | Coarse polishing method |
| CN112091802A (en) * | 2020-08-19 | 2020-12-18 | 广东长盈精密技术有限公司 | Fine polishing method |
| CN112008503B (en) * | 2020-08-19 | 2022-02-08 | 广东长盈精密技术有限公司 | Middle polishing method |
| CN112008504B (en) * | 2020-08-19 | 2022-02-08 | 广东长盈精密技术有限公司 | Coarse polishing method |
| CN111975468A (en) * | 2020-08-28 | 2020-11-24 | 天津津航技术物理研究所 | Quartz deep hole polishing device and polishing method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4252087B2 (en) | 2009-04-08 |
| JP2008126380A (en) | 2008-06-05 |
| CN101186020B (en) | 2013-04-17 |
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