CN101175377B - System and method for removing electronic components - Google Patents
System and method for removing electronic components Download PDFInfo
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- CN101175377B CN101175377B CN2006101427419A CN200610142741A CN101175377B CN 101175377 B CN101175377 B CN 101175377B CN 2006101427419 A CN2006101427419 A CN 2006101427419A CN 200610142741 A CN200610142741 A CN 200610142741A CN 101175377 B CN101175377 B CN 101175377B
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Abstract
The present invention discloses a system and a method for electron component removing, which are used in a circuit board design system with at least a circuit layer. An information storing unit is established. An electron component removing requirement information is set and the information is stored in the information storing unit. The electron components on the circuit layers of the circuit board are sensed and the component information of the corresponding electron component is obtained and the information is stored in the information storing unit. The electron component removing requirement information and the component information are picked up from the information storing unit, and whether the component information and the electron component removing requirement information are matched with each other is compared, if so, a removing order is sent out and is used for removing the electron component which the component information is matched with the electron component removing requirement information from the circuit board; else, the electron component which the component information is not matched with the electron component removing requirement information is kept. So the workload for seeking and removing redundant electron components is saved and pretermission is not easy to be generated, which improves the work efficiency.
Description
Technical field
The present invention relates to a kind of removing electronic components system and method, particularly relate to a kind of removing electronic components system and method that is applied in the board design system.
Background technology
High speed development along with electronics technology, light littleization of electronic product become well known development trend, as mobile phone, laptop computer, digital camera (DV) and PDA(Personal Digital Assistant), be the electronic product of current hot topic, but and those electronic products why can be on function more and more rich and varied profile smaller and more exquisite, exactly because making, it adopts than littler in the past electronic building brick, thinner circuit board, thereby can integrated more electronic building brick and circuit board and small product size is all the better little.
Yet, when the circuit board number of plies increases the electronic building brick integrated level and increases, some new problems are also following, because current operating frequency of integrated circuit is very high, have many high speed signals (high_speed) path on the circuit board and be vulnerable to electromagnetic interference, interference source is varied, for example, the hole wall copper facing via hole (PTH) of circuit board and perforation (via) in every circuit layer all have a size greater than boring copper packing (copper pad), if copper packing does not have electric connection in this aspect and other electronic building brick, just not only can form unnecessary stub (stub), but also through hole impedance is changed, HW High Way is caused interference, influence signal quality.
Because every layer all has a large amount of via holes and perforation on the circuit board, corresponding copper packing quantity is also extremely huge, existing technology must be passed through the detection of circuit board successively, thereby remove unnecessary copper packing, not only workload is big, and very easily omits, and efficient is very low, will be made in the circuit board finished product adverse consequences that may cause circuit board need do over again because of interference problem even make again with follow-up board production step and omit the copper packing of not deleting.
In sum, how can high efficiency remove the unnecessary assembly of each layer of circuit board, particularly aforementioned unnecessary copper packing becomes present problem demanding prompt solution then.
Summary of the invention
In view of the shortcoming of above-mentioned prior art, main purpose of the present invention is to provide a kind of removing electronic components system and method, be applied in the board design system, but Auto-Sensing and remove excess electron assembly in the circuit board.
Another object of the present invention is to provide a kind of being easy to realize and high efficiency removing electronic components system and method.
For achieving the above object, the invention provides a kind of removing electronic components system, be to be applied to have in the board design system of circuit board of at least one circuit layer in order to design, this removing electronic components system comprises: setting module, require information in order to set removing electronic components, wherein, this electronic building brick is to be formed at the circuit layer copper packing (copper pad) on every side that this circuit board is provided with hole wall copper facing via hole (PTH) and perforation (via), and this removing electronic components requirement information is meant that this electronic building brick is in there not being the information that electrically connects on this circuit board and between the electronic building brick of residing circuit layer and other circuit layer; Detecting module, in order to detect the electronic building brick on each circuit layer of this circuit board and to obtain to module information that should electronic building brick, wherein, this module information refers to this electronic building brick in whether electric connection is arranged on this circuit board and between the electronic building brick of residing circuit layer and other circuit layer, and whether this electronic building brick is arranged at the information of the top layer and/or the bottom of this circuit board; Information memory cell is in order to store that the removing electronic components that sets by this setting module requires information and this detecting module obtained to module information that should electronic building brick; The contrast module, in order to this information memory cell certainly extract and contrast this module information and this removing electronic components requirement information and in obtain being consistent as a result the time send and remove instruction, wherein, this removes the instruction that instruction comprises the electronic building brick that keeps the top layer be arranged at this circuit board and/or bottom; And remove module, remove instruction in order to receive this, and remove the electronic building brick that instruction should remove according to this and on this circuit board, remove.
By aforementioned removing electronic components of the present invention system, carry out electronic component transfer eliminating method of the present invention and comprise the steps: to set up an information memory cell; Set that removing electronic components requires information and with this information stores to this information memory cell, wherein, this electronic building brick is to be formed at the circuit layer copper packing (copper pad) on every side that this circuit board is provided with hole wall copper facing via hole (PTH) and perforation (via), and this removing electronic components requirement information refers to that this electronic building brick is in there not being the information that electrically connects on this circuit board and between the electronic building brick of residing circuit layer and other circuit layer; Electronic building brick on each circuit layer of circuit for detecting plate and obtain to module information that should electronic building brick and with this information stores to this information memory cell, wherein, this module information is meant this electronic building brick in whether electric connection is arranged on this circuit board and between the electronic building brick of residing circuit layer and other circuit layer, and whether this electronic building brick is arranged at the information of the top layer and/or the bottom of this circuit board; Extract this removing electronic components in the self information memory cell and require information and this module information, and contrast this module information and whether be consistent with this removing electronic components requirement information, if, then send and remove instruction, in order to this module information is removed on this circuit board with the electronic building brick that removing electronic components requirement information is consistent, wherein, this removes the instruction that instruction comprises the electronic building brick that keeps the top layer be arranged at this circuit board and/or bottom, is arranged at the top layer of this circuit board and/or the electronic building brick of bottom in order to keep this; If not, then keep the inconsistent electronic building brick of this module information and removing electronic components requirement information and be arranged at the top layer of this circuit board and/or the electronic building brick of bottom in this circuit board.
Than prior art, removing electronic components method and system of the present invention mainly by the module information of the electronic building brick correspondence that arrives of contrast Auto-Sensing and the removing electronic components information of setting, then remove this electronic building brick if be consistent.In view of the above, can save to search the workload that removes the excess electron assembly and be difficult for generation and omit, so can increase work efficiency.
Description of drawings
Fig. 1 is shown as the basic framework block schematic diagram of removing electronic components of the present invention system;
Fig. 2 is shown as the handling process of the required execution of electronic component transfer eliminating method of the present invention.
Description of reference numerals
1 removing electronic components system
10 setting modules
11 detecting modules
12 information memory cells
13 contrast modules
14 remove module
2 board design systems
20 circuit boards
S1～S6 method step
Embodiment
Below by specific instantiation explanation embodiments of the present invention, those skilled in the art can understand other advantage of the present invention and effect easily by the content that this specification disclosed.The present invention also can be implemented or be used by other different instantiation, and the every details in this specification also can be based on different viewpoints and application, carries out various modifications and change under the spirit of the present invention not deviating from.
As shown in Figure 1 in order to the basic framework block schematic diagram of removing electronic components of the present invention system 1 to be described.As shown in the figure, removing electronic components of the present invention system 1, be applied in the board design system 2, this board design system 2 can be for example PCB layout design softwares such as Protel, EDA, allegro etc., the board design system that has the circuit board of at least one circuit layer in order to design, removing electronic components of the present invention system 1 is then to should board design system 2, for plug-in or be built in the plug-in card program of this board design software; Removing electronic components of the present invention system 1 comprises: setting module 10, detecting module 11, information memory cell 12, contrast module 13 and remove module 14.
This setting module 10 requires information in order to set removing electronic components, and in the present embodiment, this setting module 10 comprises a graphic operation interface, uses when setting this removing electronic components requirement information for the user.
This detecting module 11 is in order to the electronic building brick on each circuit layer of detecting this circuit board 20 and obtain module information that should electronic building brick.
This information memory cell 12, in order to store that this removing electronic components requirement information and this detecting module 11 obtained to module information that should electronic building brick, can be for example database, internal memory etc.
This contrasts module 13, in order to this information memory cell 12 certainly extract and contrast this module information and this removing electronic components requirement information and in obtain being consistent as a result the time send and remove instruction.
This removes module 14, removes instruction in order to receive this, and removes instruction according to this this module information is removed on this circuit board 20 with the electronic building brick that this removing electronic components requirement information conforms to.
In the present embodiment, this electronic building brick is to be formed at the circuit layer copper packing (copper pad) on every side that circuit board 20 is provided with hole wall copper facing via hole (PTH) and perforation (via), this removing electronic components requirement information refers to that electronic building brick is in there not being the information that electrically connects on the circuit board 20 and between the electronic building brick of residing circuit layer and other circuit layer, and this module information refers to electronic building brick in whether electric connection is arranged on the circuit board 20 and between the electronic building brick of residing circuit layer and other circuit layer, and whether this electronic building brick is arranged at the information of the top layer and/or the bottom of this circuit board 20.Need supplementary notes, electronic building brick is on the circuit board 20 and whether the information of electric connection arranged between the electronic building brick of residing circuit layer and other circuit layer, by this circuit unit whether have and the electronic building brick of residing circuit layer and other circuit layer between the setup parameter that electrically connects, be criterion.
Brought forward is described, system of the present invention by the electronic building brick that obtained by this detecting module 11 on each circuit layer on 13 pairs of circuit boards 20 of this contrast module module information and set removing electronic components and require information to compare to see whether be consistent, promptly judge this electronic building brick whether with circuit board 20 on other electronic building brick electric connection is arranged, if meet, promptly do not have electric connection, then this electronic building brick is removed from this circuit board 20.
Should be specified, in other embodiments of the invention, this electronic building brick can be for example resistance, one of them of various electronic building bricks such as inductor, and this removing electronic components requires information to set according to actual needs, what of resistance value for example, inductance value what or the like, this module information also to should removing electronic components requiring the change of information and change, not all be exceeded with present embodiment.
The method flow that electronics of the present invention removes method as shown in Figure 2.This method comprises the steps:
In step S1, set up an information memory cell 12 earlier, for example create database etc.Then carry out step S2.
In step S2, sets removing electronic components and require information, that is electronic building brick do not have the information of electric connection between circuit board 20 each layers and other electronic building brick, and with this information stores to this information memory cell 12.In the present embodiment, this electronic building brick is to be formed at the circuit layer copper packing (copper pad) on every side that this circuit board 20 is provided with hole wall copper facing via hole (PTH) and perforation (via), and this removing electronic components requirement information refers to that electronic building brick is in there not being the information that electrically connects on this circuit board 20 and between the electronic building brick of residing circuit layer and other circuit layer.Then carry out step S3.
In step S3, electronic building brick on circuit for detecting plate 20 each circuit layer also obtains module information that should electronic building brick, that is whether electronic building brick do not have the information of electric connection between circuit board 20 each layers and other electronic building brick, and with this information stores to this information memory cell 12.In the present embodiment, this module information refers to this electronic building brick on this circuit board 20 and between the electronic building brick of residing circuit layer and other circuit layer whether electric connection being arranged, and whether this electronic building brick is arranged at the top layer of this circuit board and/or the information of bottom is then carried out step S4.
In step S4, extract and contrast this removing electronic components requirement information in the self information memory cell 12 and remove with this and require information whether to be consistent.If then carry out step S5; Then carry out step S6 if not.
In step S5, the electronic building brick that this module information is consistent with removing electronic components requirement information removes on this circuit board 20, that is remove the pairing electronic building brick of module information that does not have electric connection in circuit board 20 each layers and other electronic building brick, wherein, this removes the instruction that instruction comprises the electronic building brick that keeps the top layer be arranged at this circuit board 20 and/or bottom, is arranged at the top layer of this circuit board and/or the electronic building brick of bottom in order to keep this.
In step S6, keep this module information and the inconsistent electronic building brick of removing electronic components requirement information, and the electronic building brick that is arranged at the top layer of this circuit board 20 and/or bottom is on this circuit board 20.
In sum, electronics removal system of the present invention and method, by aforementioned setting module, detecting module, information memory cell, contrast module and the phase interworking that removes intermodule, the energy detecting meets this electronic building brick that removes requirement and is removed, not only save to search the workload that removes the excess electron assembly and be difficult for generation and omit, so can increase work efficiency.
The foregoing description is illustrative principle of the present invention and effect thereof only, but not is used to limit the present invention.Any those skilled in the art all can be under spirit of the present invention and category, and the foregoing description is made amendment and changed.Therefore, the scope of the present invention, claims are listed as the aforementioned.
Claims (3)
1. removing electronic components system is applied to have in the board design system of circuit board of at least one circuit layer in order to design, it is characterized in that this removing electronic components system comprises:
Setting module, require information in order to set removing electronic components, wherein, this electronic building brick is to be formed at the circuit layer copper packing on every side that circuit board is provided with hole wall copper facing via hole and perforation, and this removing electronic components requirement information is meant that this electronic building brick is in there not being the information that electrically connects on this circuit board and between the electronic building brick of residing circuit layer and other circuit layer;
Detecting module, in order to detect the electronic building brick on each circuit layer of this circuit board and to obtain to module information that should electronic building brick, wherein, this module information refers to this electronic building brick in whether electric connection is arranged on this circuit board and between the electronic building brick of residing circuit layer and other circuit layer, and whether this electronic building brick is arranged at the information of the top layer and/or the bottom of this circuit board;
Information memory cell is in order to store that the removing electronic components that sets by this setting module requires information and this detecting module obtained to module information that should electronic building brick;
The contrast module, in order to this information memory cell certainly extract and contrast this module information and this removing electronic components requirement information and obtain being consistent as a result the time send and remove instruction, wherein, this removes the instruction that instruction comprises the electronic building brick that keeps the top layer be arranged at this circuit board and/or bottom; And
Remove module, remove instruction, and remove the electronic building brick that instruction should remove according to this and on this circuit board, remove in order to receive this.
2. removing electronic components according to claim 1 system is characterized in that, this contrast module obtains removing in this module information and this information memory cell and requires information incongruent as a result the time, does not send and removes instruction.
3. electronic component transfer eliminating method is applied to have in the board design system of circuit board of at least one circuit layer in order to design, it is characterized in that this electronic component transfer eliminating method comprises the steps:
1), sets up an information memory cell;
2), set that removing electronic components requires information and with this information stores to this information memory cell, wherein, this electronic building brick is to be formed at the circuit layer copper packing on every side that this circuit board is provided with hole wall copper facing via hole and perforation, and this removing electronic components requirement information refers to that electronic building brick is in there not being the information that electrically connects on this circuit board and between the electronic building brick of residing circuit layer and other circuit layer;
3), the electronic building brick on each circuit layer of circuit for detecting plate and obtain to module information that should electronic building brick and with this information stores to this information memory cell, wherein, this module information refers to this electronic building brick in whether electric connection is arranged on this circuit board and between the electronic building brick of residing circuit layer and other circuit layer, and whether this electronic building brick is arranged at the information of the top layer and/or the bottom of this circuit board;
4), extract this removing electronic components in the self information memory cell and require information and this module information, and contrast this module information and whether be consistent with this removing electronic components requirement information, if, then proceed to step 5, if not, then proceed to step 6;
5), send and remove instruction, in order to this module information is removed on this circuit board with the electronic building brick that removing electronic components requirement information is consistent, wherein, this removes the instruction that instruction comprises the electronic building brick that keeps the top layer be arranged at this circuit board and/or bottom, is arranged at the top layer of this circuit board and/or the electronic building brick of bottom in order to keep this; And
6), keep the inconsistent electronic building brick of this module information and removing electronic components requirement information and be arranged at the top layer of this circuit board and/or the electronic building brick of bottom on this circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2006101427419A CN101175377B (en) | 2006-10-30 | 2006-10-30 | System and method for removing electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2006101427419A CN101175377B (en) | 2006-10-30 | 2006-10-30 | System and method for removing electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101175377A CN101175377A (en) | 2008-05-07 |
| CN101175377B true CN101175377B (en) | 2010-08-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2006101427419A Active CN101175377B (en) | 2006-10-30 | 2006-10-30 | System and method for removing electronic components |
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| Country | Link |
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| CN (1) | CN101175377B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1437436A (en) * | 2002-02-04 | 2003-08-20 | 华为技术有限公司 | Circuit board design method |
| CN1679032A (en) * | 2002-08-08 | 2005-10-05 | 弗赖斯金属有限公司d/b/a阿尔发金属有限公司 | System and method for modifying electronic design data |
| CN1771501A (en) * | 2004-02-05 | 2006-05-10 | 松下电器产业株式会社 | Printed circuit board return route check method and printed circuit board pattern design CAD device |
-
2006
- 2006-10-30 CN CN2006101427419A patent/CN101175377B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1437436A (en) * | 2002-02-04 | 2003-08-20 | 华为技术有限公司 | Circuit board design method |
| CN1679032A (en) * | 2002-08-08 | 2005-10-05 | 弗赖斯金属有限公司d/b/a阿尔发金属有限公司 | System and method for modifying electronic design data |
| CN1771501A (en) * | 2004-02-05 | 2006-05-10 | 松下电器产业株式会社 | Printed circuit board return route check method and printed circuit board pattern design CAD device |
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| Publication number | Publication date |
|---|---|
| CN101175377A (en) | 2008-05-07 |
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Owner name: STATE GRID SHANGHAI ELECTRIC POWER COMPANY Free format text: FORMER OWNER: YINGYEDA CO., LTD., TAIWAN Effective date: 20140919 Owner name: SHANGHAI HEZE ELECTRIC POWER ENGINEERING DESIGN CO Effective date: 20140919 |
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| C41 | Transfer of patent application or patent right or utility model | ||
| C53 | Correction of patent for invention or patent application | ||
| CB03 | Change of inventor or designer information |
Inventor after: Wang Saiyi Inventor after: Zhou Lijun Inventor after: Xie Qihui Inventor after: Li Hongying Inventor after: Sun Yingying Inventor after: Fan Wengang Inventor after: Wei Qixin Inventor after: Hua Yueshen Inventor after: Wu Zhenghua Inventor after: Yang Chenyan Inventor after: Lv Wenhao Inventor after: Shou Yiru Inventor after: Jia Jianjun Inventor after: Xu Wenjin Inventor after: Zhang Xin Inventor before: Fan Wengang Inventor before: Wei Qixin |
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| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: TAIWAN, CHINA TO: 200002 HUANGPU, SHANGHAI Free format text: CORRECT: INVENTOR; FROM: FAN WENGANG WEI QIXIN TO: WANG SAIYI HUA YUESHEN WU ZHENGHUA YANG CHENYAN LV WENHAO SHOU YIRU JIA JIANJUN XU WENJIN ZHANG XIN ZHOU LIJUN XIE QIHUI LI HONGYING SUN YINGYING FAN WENGANG WEI QIXIN |
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| TR01 | Transfer of patent right |
Effective date of registration: 20140919 Address after: 200002 Nanjing East Road, Shanghai, No. 181, No. Patentee after: State Grid Shanghai Municipal Electric Power Company Patentee after: SHANGHAI HEZE ELECTRIC POWER ENGINEERING DESIGN AND CONSULTING CO., LTD. Address before: Taipei City, Taiwan Chinese Shilin District Hougang Street No. 66 Patentee before: Inventec Corporation |