CN102779196B - A kind of method and system of processing overlapping Copper Foil - Google Patents
A kind of method and system of processing overlapping Copper Foil Download PDFInfo
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- CN102779196B CN102779196B CN201110123104.8A CN201110123104A CN102779196B CN 102779196 B CN102779196 B CN 102779196B CN 201110123104 A CN201110123104 A CN 201110123104A CN 102779196 B CN102779196 B CN 102779196B
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- copper foil
- network attribute
- electrical layer
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 285
- 239000011889 copper foil Substances 0.000 title claims abstract description 284
- 238000000034 method Methods 0.000 title claims abstract description 41
- 238000000605 extraction Methods 0.000 claims description 7
- 238000010586 diagram Methods 0.000 description 4
- CNQCVBJFEGMYDW-UHFFFAOYSA-N lawrencium atom Chemical compound [Lr] CNQCVBJFEGMYDW-UHFFFAOYSA-N 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
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- Parts Printed On Printed Circuit Boards (AREA)
- Management, Administration, Business Operations System, And Electronic Commerce (AREA)
Abstract
The invention provides a kind of method of processing overlapping Copper Foil, said method comprising the steps of: S11, all Copper Foils in arbitrary electrical layer to be extracted; S12, the network attribute of Copper Foil processed as required, choose the Copper Foil identical with the network attribute of described need Copper Foil to be processed; S13, the Copper Foil identical to network attribute that is all in the described electrical layer chosen and described need Copper Foil to be processed carry out or computing, obtain the region that these Copper Foils cover; S14, Copper Foil identical for network attributes all and described need Copper Foil to be processed in the described described electrical layer chosen to be deleted, in described region, generate new Copper Foil; S15, to Copper Foil newly-generated in described electrical layer add network attribute.The present invention also provides a kind of system of processing overlapping Copper Foil.In the method for processing overlapping Copper Foil provided by the invention, achieve the overlapping Copper Foil automatically processed in every layer of electrical layer, improve the reaction velocity of presto tool, the work efficiency of ECAD slip-stick artist's processing overlapping Copper Foil is improved greatly.
Description
Technical field
The invention belongs to electrical design field, particularly relate to a kind of method and system of processing overlapping Copper Foil.
Background technology
Electrical Design Software (ECAD, ElectronicsComputerAidDesign) is the power engineering CAD software design run on microcomputer, and this software can carry out power engineering once and the drafting of secondary drawing, calculating and generation easily.ECAD slip-stick artist is in the process of design printed circuit board (PCB) (PCB, a PrintedCircuitBoard) project, and all can relate to the process to Copper Foil, such as impedance line place is to the process etc. of zone network Copper Foil.Therefore, need repeatedly to hollow out Copper Foil and fill up, many independently zone network Copper Foils can be produced thus, these zone network copper foil section are divided and is in overlap condition, even there will be the phenomenon of large area with network Copper Foil overlap, thus have impact on quick (Allegro) instrument to the travelling speed of Copper Foil process, instrument is slowly reacted, greatly reduces work efficiency.
For the problem of aforementioned described Copper Foil overlap, ECAD slip-stick artist adopts current ECAD instrument, is normally manually deleted successively by Copper Foil overlapping one by one, improves the reacted slow situation of (Allegro) instrument fast.
But inventor finds: manual processing overlapping Copper Foil one by one, inefficiency.Increasingly sophisticated in hardware product design, in the increasing situation of pcb board layer, reacted our work efficiency that can make slowly of presto tool reduces greatly.
Summary of the invention
The object of this invention is to provide a kind of method of processing overlapping Copper Foil, realize automatic processing overlapping Copper Foil, improve the reaction velocity of presto tool, the work efficiency of ECAD slip-stick artist's processing overlapping Copper Foil is improved greatly.
The object of the invention is to be achieved through the following technical solutions:
A method for processing overlapping Copper Foil, said method comprising the steps of:
S11, all Copper Foils in arbitrary electrical layer to be extracted;
S12, the network attribute of Copper Foil processed as required, choose the Copper Foil identical with the network attribute of described need Copper Foil to be processed;
S13, the Copper Foil identical to network attribute that is all in the described electrical layer chosen and described need Copper Foil to be processed carry out or computing, obtain the region that these Copper Foils cover;
S14, Copper Foil identical for network attributes all and described need Copper Foil to be processed in the described described electrical layer chosen to be deleted, in described region, generate new Copper Foil;
S15, to Copper Foil newly-generated in described electrical layer add network attribute.
The present invention also provides the method for another kind of processing overlapping copper, said method comprising the steps of:
S21, all Copper Foils in arbitrary electrical layer to be extracted;
S22, Copper Foils all in described electrical layer to be carried out or computing, obtain the region that these Copper Foils cover;
S23, all Copper Foil in described electrical layer to be deleted, in described region, generate new Copper Foil;
S24, to Copper Foil newly-generated in described electrical layer add network attribute.
The present invention also provides a kind of system of processing overlapping Copper Foil, and described system comprises:
Copper Foil extraction unit, for extracting all Copper Foils in arbitrary electrical layer;
Network attribute chooses unit, for the network attribute of Copper Foil processed as required, chooses the Copper Foil identical with the network attribute of described need Copper Foil to be processed;
Copper Foil arithmetic element, carries out or computing for the Copper Foil identical to network attribute that is all in the described electrical layer chosen and described need Copper Foil to be processed, obtains the region that these Copper Foils cover;
New Copper Foil generation unit, for being deleted by Copper Foil identical for network attributes all and described need Copper Foil to be processed in the described described electrical layer chosen, generates new Copper Foil in described region;
Network attribute adding device, for adding network attribute to Copper Foil newly-generated in described electrical layer.
The present invention also provides the system of another kind of processing overlapping Copper Foil, and described system comprises:
Copper Foil extraction unit, for extracting all Copper Foils in arbitrary electrical layer;
Copper Foil arithmetic element, for carrying out or computing Copper Foils all in described electrical layer, obtains the region that these Copper Foils cover;
New Copper Foil generation unit, for being deleted by Copper Foils all in described electrical layer, generates new Copper Foil in described region;
Network attribute adding device, adds network attribute to Copper Foil newly-generated in described electrical layer.
In the method and system of processing overlapping Copper Foil provided by the invention, all overlapping Copper Foil in arbitrary electrical layer is extracted, the network attribute of the Copper Foil then processed as required, choose the Copper Foil of identical network attribute in described electrical layer, then the Copper Foil chosen is carried out or computing, draw the region that these Copper Foils cover, and all Copper Foils chosen are deleted, in described region, generate new Copper Foil, add network attribute finally to newly-generated Copper Foil.By the method and system of processing overlapping Copper Foil provided by the invention, achieve the overlapping Copper Foil automatically processed in every layer of electrical layer, improve the reaction velocity of presto tool, the work efficiency of ECAD slip-stick artist's processing overlapping Copper Foil is improved greatly.
Accompanying drawing explanation
Fig. 1 is the method flow schematic diagram of the first processing overlapping Copper Foil that the embodiment of the present invention provides.
Fig. 2 is the method flow schematic diagram of the second processing overlapping Copper Foil that the embodiment of the present invention provides.
Fig. 3 is the system architecture schematic diagram of the first processing overlapping Copper Foil that the embodiment of the present invention provides.
Fig. 4 is the system architecture schematic diagram of the second processing overlapping Copper Foil that the embodiment of the present invention provides.
Embodiment
In order to make technical matters solved by the invention, technical scheme and beneficial effect clearly understand, below in conjunction with embodiment, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
Please refer to shown in Fig. 1, be the method for the first processing overlapping Copper Foil provided by the invention, said method comprising the steps of:
S11, all Copper Foils in arbitrary electrical layer to be extracted;
S12, the network attribute of Copper Foil processed as required, choose the Copper Foil identical with the network attribute of described need Copper Foil to be processed;
S13, the Copper Foil identical to network attribute that is all in the described electrical layer chosen and described need Copper Foil to be processed carry out or computing, obtain the region that these Copper Foils cover;
S14, Copper Foil identical for network attributes all and described need Copper Foil to be processed in the described described electrical layer chosen to be deleted, in described region, generate new Copper Foil;
S15, to Copper Foil newly-generated in described electrical layer add network attribute.
In the method for processing overlapping Copper Foil provided by the invention, all Copper Foils in arbitrary electrical layer are extracted, the network attribute of the Copper Foil then processed as required, choose the Copper Foil of identical network attribute in described electrical layer, then the Copper Foil chosen is carried out or computing, draw the region that these Copper Foils cover, and all Copper Foils chosen are deleted, in described region, generate new Copper Foil, add network attribute finally to newly-generated Copper Foil.By the method for processing overlapping Copper Foil provided by the invention, achieve the overlapping Copper Foil automatically processed in every layer of electrical layer, improve the reaction velocity of presto tool, the work efficiency of ECAD slip-stick artist's processing overlapping Copper Foil is improved greatly.
Particularly, for step S11, extracted by all Copper Foils in any one electrical layer, because the PCB of existing structure is mostly multilayer board, every layer all represents a corresponding electrical layer, is all furnished with the Copper Foil cabling of multiple network type in each electrical layer.
For step S12, the network attribute of Copper Foil to be processed is needed according to us, choose the Copper Foil with this network attribute, as a kind of specific embodiment, if we need the Copper Foil of network attribute (GND_SIGNAL) over the ground to process, therefore need all Copper Foils belonging to zone network attribute all to choose out.
For step S13, all Copper Foils belonging to zone network attribute chosen are carried out or computing, obtain the region that these zone network attribute Copper Foils cover.
For step S14, the described all zone network attribute Copper Foils chosen are deleted, and then generate new Copper Foil in described region.
For step S15, network attribute is added to newly-generated Copper Foil, namely add zone network attribute (GND_SIGNAL).
Further, those skilled in the art it should be understood that user according to actual needs, can add the network attribute thinking other Copper Foil to be processed, such as electric power network attribute (VCC_SIGNAL) etc. voluntarily.
Preferably, the overlapping Copper Foil that step S13 can be only identical to network attribute that is all in the described electrical layer chosen and described need Copper Foil to be processed carries out or computing, obtains the region that these overlapping Copper Foils cover.Particularly, in all Copper Foils identical with zone network attribute chosen, some Copper Foil may not have overlap, and only has part Copper Foil overlapping; The present embodiment only processes overlapping Copper Foil, namely only carries out or computing overlapping Copper Foil, obtains the region that these overlapping Copper Foils cover; Overlapping Copper Foil in these regions is deleted, at the Copper Foil that these Area generation are new by step S14.Therefore, the operand of Copper Foil can be reduced further, improve arithmetic speed.
Certainly, if the number of plies of the PCB of existing structure is less, in every one deck, the network attribute of Copper Foil is all identical, then can screen the network attribute of this layer of Copper Foil, and directly process the Copper Foil in this layer.Please refer to shown in Fig. 2, therefore, present invention also offers the method for another kind of processing overlapping Copper Foil, said method comprising the steps of:
S21, all Copper Foils in arbitrary electrical layer to be extracted;
S22, Copper Foils all in described electrical layer to be carried out or computing, obtain the region that these Copper Foils cover;
S23, all Copper Foil in described electrical layer to be deleted, in described region, generate new Copper Foil;
S24, to Copper Foil newly-generated in described electrical layer add network attribute.
Particularly, for step S21, all Copper Foils in any one electrical layer are extracted, according to explanation above, this kind of method is that the Copper Foil identical to all-network attribute in same electrical layer processes, the network attribute of the Copper Foil therefore extracted is all identical, as a kind of specific embodiment, if described network attribute is all zone network attribute (GND_SIGNAL).
For step S12, the Copper Foil of all zone network attributes is carried out or computing, obtain the region that these zone network attribute Copper Foils cover.
For step S13, the Copper Foil of described all zone network attributes is deleted, and then generate new Copper Foil in described region.
For step S14, network attribute is added to Copper Foil newly-generated in described electrical layer, namely add zone network attribute (GND_SIGNAL).So far, complete the process of Copper Foil overlapping in this electrical layer is operated.
In concrete enforcement, can do to optimize further to such scheme, such as, only the Copper Foil of the zone network attribute of all overlaps is carried out or computing in step s 12, the region that the zone network attribute Copper Foil obtaining these overlaps covers, in step s 13, the Copper Foil of the zone network attribute of described all overlaps is deleted, and then new Copper Foil is generated in described region, thus the operand of Copper Foil can be reduced further, improve arithmetic speed.
Please refer to shown in Fig. 3, the present invention also provides a kind of system of processing overlapping Copper Foil, and described system comprises:
Copper Foil extraction unit 101, for extracting all Copper Foils in arbitrary electrical layer;
Network attribute chooses unit 102, for the network attribute of Copper Foil processed as required, chooses the Copper Foil identical with the network attribute of described need Copper Foil to be processed;
Copper Foil arithmetic element 103, carries out or computing for the Copper Foil identical to network attribute that is all in the described electrical layer chosen and described need Copper Foil to be processed, obtains the region that these Copper Foils cover;
New Copper Foil generation unit 104, for being deleted by Copper Foil identical for network attributes all and described need Copper Foil to be processed in the described described electrical layer chosen, generates new Copper Foil in described region;
Network attribute adding device 105, for adding network attribute to Copper Foil newly-generated in described electrical layer.
In the system of processing overlapping Copper Foil provided by the invention, all Copper Foils in arbitrary electrical layer are extracted, the network attribute of the Copper Foil then processed as required, choose the Copper Foil of identical network attribute in described electrical layer, then the Copper Foil chosen is carried out or computing, draw the region that these Copper Foils cover, and all Copper Foils chosen are deleted, in described region, generate new Copper Foil, add network attribute finally to newly-generated Copper Foil.By the system of processing overlapping Copper Foil provided by the invention, achieve the overlapping Copper Foil automatically processed in every layer of electrical layer, improve the reaction velocity of presto tool, the work efficiency of ECAD slip-stick artist's processing overlapping Copper Foil is improved greatly.
Particularly, for Copper Foil extraction unit 101, all Copper Foils in any one electrical layer are extracted, because the PCB of existing structure is mostly multilayer board, every layer all represents a corresponding electrical layer, is all furnished with the Copper Foil cabling of multiple network type in each electrical layer.
Unit 102 is chosen for network attribute, the network attribute of Copper Foil to be processed is needed according to us, choose the Copper Foil of identical network attribute in described electrical layer, as a kind of specific embodiment, if we need the Copper Foil of network attribute (GND_SIGNAL) over the ground to process, therefore need all Copper Foils belonging to zone network attribute all to choose out.
For Copper Foil arithmetic element 103, all Copper Foils belonging to zone network attribute chosen are carried out or computing, obtain the region that these zone network attribute Copper Foils cover.
For new Copper Foil generation unit 104, the described all zone network attribute Copper Foils chosen are deleted, and then generate new Copper Foil in described region.
For network attribute adding device 105, network attribute is added to Copper Foil newly-generated in described electrical layer, namely add zone network attribute (GND_SIGNAL).
Further, those skilled in the art it should be understood that user according to actual needs, can add the network attribute thinking other Copper Foil to be processed, such as electric power network attribute (VCC_SIGNAL) etc. voluntarily.
Preferably, the overlapping Copper Foil that Copper Foil arithmetic element 103 can be only identical to network attribute that is all in the described electrical layer chosen and described need Copper Foil to be processed carries out or computing, obtains the region that these overlapping Copper Foils cover.Particularly, in all Copper Foils identical with zone network attribute chosen, some Copper Foil may not have overlap, and only has part Copper Foil overlapping; The present embodiment only processes overlapping Copper Foil, namely only carries out or computing overlapping Copper Foil, obtains the region that these overlapping Copper Foils cover; Overlapping Copper Foil in these regions is deleted, at the Copper Foil that these Area generation are new by new Copper Foil generation unit 104.Therefore, the operand of Copper Foil can be reduced further, improve arithmetic speed.
Certainly, if the number of plies of the PCB of existing structure is less, in every one deck, the network attribute of Copper Foil is all identical, then can screen the network attribute of this layer of Copper Foil, and directly process the Copper Foil in this layer.Please refer to shown in Fig. 4, therefore, present invention also offers the system of another kind of processing overlapping Copper Foil, described system comprises:
Copper Foil extraction unit 201, for extracting all Copper Foils in arbitrary electrical layer;
Copper Foil arithmetic element 202, for carrying out or computing Copper Foils all in described electrical layer, obtains the region that these Copper Foils cover;
New Copper Foil generation unit 203, for being deleted by Copper Foils all in described electrical layer, generates new Copper Foil in described region;
Network attribute adding device 204, adds network attribute to Copper Foil newly-generated in described electrical layer.
Particularly, for Copper Foil extraction unit 201, all Copper Foils in any one electrical layer are extracted, according to explanation above, this kind of system is that the Copper Foil identical to all-network attribute in same electrical layer processes, the network attribute of the Copper Foil therefore extracted is all identical, as a kind of specific embodiment, if described network attribute is all zone network attribute (GND_SIGNAL).
For Copper Foil arithmetic element 202, the Copper Foil of all zone network attributes is carried out or computing, obtain the region that these zone network attribute Copper Foils cover.
For new Copper Foil generation unit 203, the Copper Foil of described all zone network attributes is deleted, and then generate new Copper Foil in described region.
For network attribute adding device 204, network attribute is added to Copper Foil newly-generated in described electrical layer, namely add zone network attribute (GND_SIGNAL).So far, complete the process of Copper Foil overlapping in this electrical layer is operated.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any amendments done within the spirit and principles in the present invention, equivalent replacement and improvement etc., all should be included within protection scope of the present invention.
Claims (5)
1. a method for processing overlapping Copper Foil, is characterized in that, said method comprising the steps of:
S11, all Copper Foils in arbitrary electrical layer to be extracted;
S12, the network attribute of Copper Foil processed as required, choose the Copper Foil identical with the network attribute of described need Copper Foil to be processed;
S13, the overlapping Copper Foil identical to network attribute that is all in the described electrical layer chosen and described need Copper Foil to be processed carry out or computing, obtain the region that these overlapping Copper Foils cover;
S14, overlapping Copper Foil identical for network attributes all and described need Copper Foil to be processed in the described described electrical layer chosen to be deleted, in the region that described overlapping Copper Foil covers, generate new Copper Foil;
S15, to Copper Foil newly-generated in described electrical layer add network attribute.
2. the method for processing overlapping Copper Foil according to claim 1, is characterized in that, in described step S12, the network attribute of described need Copper Foil to be processed is zone network attribute.
3. a method for processing overlapping Copper Foil, is characterized in that, said method comprising the steps of:
S21, all Copper Foils in arbitrary electrical layer to be extracted;
S22, overlapping Copper Foils all in described electrical layer to be carried out or computing, obtain the region that these overlapping Copper Foils cover;
S23, overlapping Copper Foils all in described electrical layer to be deleted, in the region that described overlapping Copper Foil covers, generate new Copper Foil;
S24, to Copper Foil newly-generated in described electrical layer add network attribute.
4. a system for processing overlapping Copper Foil, is characterized in that, described system comprises:
Copper Foil extraction unit, for extracting all Copper Foils in arbitrary electrical layer;
Network attribute chooses unit, for the network attribute of Copper Foil processed as required, chooses the Copper Foil identical with the network attribute of described need Copper Foil to be processed;
Copper Foil arithmetic element, carries out or computing for the overlapping Copper Foil identical to network attribute that is all in the described electrical layer chosen and described need Copper Foil to be processed, obtains the region that these Copper Foils cover;
New Copper Foil generation unit, for being deleted by overlapping Copper Foil identical for network attributes all and described need Copper Foil to be processed in the described described electrical layer chosen, generates new Copper Foil in described region;
Network attribute adding device, for adding network attribute to Copper Foil newly-generated in described electrical layer.
5. the system of processing overlapping Copper Foil according to claim 4, is characterized in that, described network attribute chooses unit, and the network attribute of the described need Copper Foil to be processed chosen is zone network attribute.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201110123104.8A CN102779196B (en) | 2011-05-13 | 2011-05-13 | A kind of method and system of processing overlapping Copper Foil |
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| CN201110123104.8A CN102779196B (en) | 2011-05-13 | 2011-05-13 | A kind of method and system of processing overlapping Copper Foil |
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| CN102779196B true CN102779196B (en) | 2016-03-09 |
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| CN109977602B (en) * | 2019-04-10 | 2022-08-19 | 苏州浪潮智能科技有限公司 | Copper sheet hollowing method and equipment |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1728159A (en) * | 2004-07-27 | 2006-02-01 | 明基电通股份有限公司 | Text area recognition method of document image, computer storage medium and system |
| CN1940908A (en) * | 2005-09-29 | 2007-04-04 | 鸿富锦精密工业（深圳）有限公司 | System and method for merging homogeneous hole in workpiece image files |
| CN101383048A (en) * | 2008-09-12 | 2009-03-11 | 北大方正集团有限公司 | A method and device for creating an object area on a layout |
| CN101742824A (en) * | 2008-11-26 | 2010-06-16 | 富葵精密组件(深圳)有限公司 | Circuit board manufacturing method and copper-clad substrate suitable for the manufacturing method |
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2011
- 2011-05-13 CN CN201110123104.8A patent/CN102779196B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1728159A (en) * | 2004-07-27 | 2006-02-01 | 明基电通股份有限公司 | Text area recognition method of document image, computer storage medium and system |
| CN1940908A (en) * | 2005-09-29 | 2007-04-04 | 鸿富锦精密工业（深圳）有限公司 | System and method for merging homogeneous hole in workpiece image files |
| CN101383048A (en) * | 2008-09-12 | 2009-03-11 | 北大方正集团有限公司 | A method and device for creating an object area on a layout |
| CN101742824A (en) * | 2008-11-26 | 2010-06-16 | 富葵精密组件(深圳)有限公司 | Circuit board manufacturing method and copper-clad substrate suitable for the manufacturing method |
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