CN102789509B - A kind of mark does not weld the method and system of device - Google Patents
A kind of mark does not weld the method and system of device Download PDFInfo
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- CN102789509B CN102789509B CN201110125570.XA CN201110125570A CN102789509B CN 102789509 B CN102789509 B CN 102789509B CN 201110125570 A CN201110125570 A CN 201110125570A CN 102789509 B CN102789509 B CN 102789509B
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Abstract
The invention provides a kind of method that mark does not weld device, said method comprising the steps of: S1, the parameter of extraction device from pcb board, the parameter of described device comprises device name, device value and device profile title; S2, judge the device value of described device with preset the device value of not welding device whether identical; If the device value of the described device of S3 is identical with the device value of not welding device preset, then judge that whether device name is consistent with device profile title; If the described device name of S4 is consistent with device profile title, then make a mark in the contour area of described device.The present invention also provides a kind of mark not weld the system of device.Mark provided by the invention does not weld in the method for device, the process that its parameter extraction, judgement and contour area mark is all that processor processes automatically, improve the work efficiency that ECAD slip-stick artist's mark does not weld device, thus also improve the efficiency of the output device location drawing.
Description
Technical field
The invention belongs to electrical design field, particularly relate to the method and system that a kind of mark does not weld device.
Background technology
Electrical Design Software (ECAD, Electronics Computer Aid Design) is the power engineering CAD software design run on microcomputer, and this software can carry out power engineering once and the drafting of secondary drawing, calculating and generation easily.ECAD slip-stick artist completes a printed circuit board (PCB) (PCB, Printed Circuit Board) drafting after, making sheet file can be sent to pcb board manufacturer to make pcb board, after pcb board completes, the device of needs can be welded on pcb board according to the designing requirement of slip-stick artist by SMT producer, at this moment just need ECAD slip-stick artist to export a device position figure to need to weld which device to illustrate in pcb board, do not need to weld which device, thus ensure SMT everything goes well with your work errorless carrying out.
Device position figure is ECAD slip-stick artist's combination principle figure, to print not needing the device welded to make a mark with document form, such as with the file printout of PDF out, and reference when weld for SMT.But in the ECAD instrument of current main flow, all there is no the mark function for not welding device in SMT, manual handle can only complete, ECAD slip-stick artist namely can only be leaned on to search out respective devices one by one by quick (Allegro) instrument, then manually add mark.
But inventor finds: manually mark one by one and do not weld device, inefficiency.Increasingly sophisticated in existing hardware product design, when device is various, this situation is particularly outstanding.
Summary of the invention
The object of this invention is to provide the method and system that a kind of mark does not weld device, realize automatic mark and do not weld device, make ECAD slip-stick artist mark the work efficiency of not welding device and greatly improve.
The object of the invention is to be achieved through the following technical solutions:
Mark does not weld a method for device, said method comprising the steps of:
S1, from pcb board the parameter of extraction device, the parameter of described device comprises device name, device value and device profile title;
S2, judge the device value of described device with preset the device value of not welding device whether identical;
If the device value of the described device of S3 is identical with the device value of not welding device preset, then judge that whether device name is consistent with device profile title;
If the described device name of S4 is consistent with device profile title, then make a mark in the contour area of described device.
The present invention also provides a kind of mark not weld the system of device, and described system comprises:
Parameter extraction unit, for the parameter of extraction device from pcb board, the parameter of described device comprises device name, device value and device profile title;
First judging unit, for judging that whether the device value of described device is identical with the device value of not welding device preset;
Second judging unit, during for judging that at described first judging unit the device value of described device is identical with the device value of not welding device preset, judges that whether device name is consistent with device profile title;
Device markings unit, for when described second judging unit judges that device name is consistent with device profile title, makes a mark in the contour area of described device.
Mark provided by the invention does not weld in the method for device, the parameter of extraction device from pcb board, and described parameter comprises device name, device value and device profile title; Judge that whether the device value of described device is identical with the device value of not welding device preset; If the device value of described device is identical with the device value of not welding device preset, then judge that whether device name is consistent with device profile title again; If described device name is consistent with device profile title, then make a mark in the contour area of described device.The process that in described method, parameter extraction, judgement and contour area mark is all that processor processes automatically, improves the work efficiency that ECAD slip-stick artist's mark does not weld device, thus also improves the efficiency of the output device location drawing.
Accompanying drawing explanation
Fig. 1 is the method flow schematic diagram that mark provided by the invention does not weld device.
Fig. 2 is the system architecture schematic diagram that mark provided by the invention does not weld device.
Embodiment
In order to make technical matters solved by the invention, technical scheme and beneficial effect clearly understand, below in conjunction with embodiment, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
Please refer to shown in Fig. 1, a kind of mark does not weld the method for device, said method comprising the steps of:
S1, from pcb board the parameter of extraction device, the parameter of described device comprises device name, device value and device profile title;
S2, judge the device value of described device with preset the device value of not welding device whether identical;
If the device value of the described device of S3 is identical with the device value of not welding device preset, then judge that whether device name is consistent with device profile title;
If the described device name of S4 is consistent with device profile title, then make a mark in the contour area of described device.
Mark provided by the invention does not weld in the method for device, the parameter of extraction device from pcb board, and described parameter comprises device name, device value and device profile title; Judge that whether the device value of described device is identical with the device value of not welding device preset; If the device value of described device identical with the device value of not welding device preset (i.e. described device belong to do not weld class device), then judge that whether device name is consistent with device profile title; If described device name is consistent with device profile title, then make a mark in the contour area of described device.The process that in described method, parameter extraction, judgement and contour area mark is all that processor processes automatically, improves the work efficiency that ECAD slip-stick artist's mark does not weld device, thus also improves the efficiency of the output device location drawing.
By by specific embodiment, the method that the present invention's mark does not weld device is described in detail below.
In a particular embodiment, the PCB welding device is all needed for wiring layer top layer and bottom, in described step S4, when described device name is consistent with device profile title, also specifically can judge device whether mirror image, if device is not mirror image, then make a mark in the contour area of device wire layer top layer; If device is mirror image, then make a mark in the contour area of device wire layer bottom.Wherein, device profile region normally just completes when creating device package; it belongs to certain device; particularly: when (Allegro) instrument encapsulates certain device fast; usual meeting adds a region at assembling (Assembly) layer; this region realizes by adding profile (Shape), and this region can guarantee can not produce interference between device and device, improves observability during device layout.In the present embodiment, determined the region made marks by this profile.
By judging device whether mirror image, accurately can determining the wiring layer at the device place needing mark, not needing user's secondary to verify, for user provides the mark to not welding device rapidly and accurately.
For step S2, the described default device value of not welding device can be set to " NF " or " DNP ".Particularly, in the design of ECAD, capital relates to the encapsulation of device, when schematic diagram at Design PCB, designer can will not need the device value of welding device with a certain character representation, preset a certain definite value namely to the device value of not welding device, such as the described default device value of not welding device is " NF " or " DNP ".Certainly, it will be understood by those of skill in the art that the described default device value of not welding device can at will define, be not only confined to as " NF " or " DNP ", if ensure all do not weld device arrange device value identical.
In a particular embodiment, if to be the device value of described device identical with the default device value of not welding device for the result that described step S2 judges, then further device can be carried out highlighted display, manually to carry out On line inspection and confirmation.
In a particular embodiment, if to be the device value of described device identical with the default device value of not welding device for the result that described step S2 judges, then can further the information of described device be exported, so that designer carries out checking and confirming.Particularly, the device information of described output comprises: the coordinate of the quantity of device, the title of device, device value, device and the wiring layer (top layer or bottom) at device place; Wherein, the coordinate clicking described device by mouse checks the particular location of respective devices, for device search and confirmation provides conveniently.
Particularly, for step S4, make a mark in the contour area of described device, be specifically as follows: make fork at the contour area of described device, change described device profile color or in described device profile region Fill Color.Certainly, it will be understood by those of skill in the art that the mode made a mark in the contour area of described device is not limited thereto, other mark also can be adopted to identify, such as adopt and make hook or draw the marks such as circle, as long as can when follow-up SMT welding, operating personnel easily recognize.
After completing the mark not welding device in pcb board, can will do markd device top layer or bottom is defined as a specific layer, such as item layer; When the corresponding design sketch of needs printout, the whole layer comprising item layer can be opened.
Please refer to shown in Fig. 2, the present invention also provides a kind of mark not weld the system of device, and described system comprises:
Parameter extraction unit 11, for the parameter of extraction device from pcb board, the parameter of described device comprises device name, device value and device profile title;
First judging unit 12, for judging that whether the device value of described device is identical with the device value of not welding device preset;
Second judging unit 13, during for judging that at described first judging unit the device value of described device is identical with the device value of not welding device preset, judges that whether device name is consistent with device profile title;
Device markings unit 14, for when described second judging unit judges that device name is consistent with device profile title, makes a mark in the contour area of described device.
Mark provided by the invention does not weld in the system of device, the parameter of extraction device from pcb board, and described parameter comprises device name, device value and device profile title; Judge that whether the device value of described device is identical with the device value of not welding device preset; If the device value of described device identical with the device value of not welding device preset (i.e. described device belong to do not weld class device), then judge that whether device name is consistent with device profile title; If described device name is consistent with device profile title, then make a mark in the contour area of described device.The process that in described method, parameter extraction, judgement and contour area mark is all that processor processes automatically, improves the work efficiency that ECAD slip-stick artist's mark does not weld device, also improves the efficiency of the output device location drawing.
By by specific embodiment, the system that the present invention's mark does not weld device is described in detail below.
In an embodiment, the PCB welding device is all needed for wiring layer bottom and top layer, can specifically comprise in described device markings unit 14:
Mirror image judge module, for judging device whether mirror image;
Device markings module, for when mirror image judge module judges that device is not mirror image, makes a mark in the contour area of device wire layer top layer; When device is mirror image, make a mark in the contour area of device wire layer bottom.
Wherein, device profile region normally just completes when creating device package; it belongs to certain device; particularly: when (Allegro) instrument encapsulates certain device fast; usual meeting adds a region at assembling (Assembly) layer; this region realizes by adding profile (Shape), and this region can guarantee can not produce interference between device and device, improves observability during device layout.In the present embodiment, the region made marks is determined by this profile.
By judging device whether mirror image, accurately can determining the wiring layer at the device place needing mark, not needing user's secondary to verify, for user provides the mark to not welding device rapidly and accurately.
In the first judging unit 12, the described default device value of not welding device can be set to " NF " or " DNP ".Particularly, in the design of ECAD, relate to the encapsulation of device, when schematic diagram at Design PCB, designer will not need the device value of welding device with a certain character representation, preset a certain definite value namely to the device value of not welding device, the device value of not welding device such as preset is " NF " or " DNP ".Certainly, it will be understood by those of skill in the art that the described default device value of not welding device can self-defining, be not only confined to as " NF " or " DNP ", as long as ensure that all not weld the device value that device arranges identical.
In a particular embodiment, described mark does not weld device system also can comprise highlighted display unit, during for judging that at described first judging unit the device value of described device is identical with the device value of not welding device preset, device is carried out highlighted display, manually to carry out On line inspection and confirmation.
In a particular embodiment, described mark does not weld device system also can comprise information output unit, during for judging that at described first judging unit the device value of described device is identical with the device value of not welding device preset, the information of described device is exported, so that designer carries out checking and confirming.Particularly, the device information of described output can comprise: the coordinate of the quantity of device, the title of device, device value, device and the wiring layer (top layer or bottom) at device place; Wherein, the coordinate clicking described device by mouse checks the particular location of respective devices, for device search and confirmation provides conveniently.
Further, in described device markings unit 14, make a mark in the contour area of described device and be specifically as follows: make fork at the contour area of described device, change described device profile color or in described device profile region Fill Color.Certainly, it will be understood by those of skill in the art that the mode made a mark in the contour area of described device is not limited thereto, other mark also can be adopted to identify, such as adopt and make hook or draw the marks such as circle, as long as can when follow-up SMT welding, operating personnel easily recognize.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any amendments done within the spirit and principles in the present invention, equivalent replacement and improvement etc., all should be included within protection scope of the present invention.
Claims (9)
1. mark does not weld a method for device, it is characterized in that, said method comprising the steps of:
S1, from pcb board the parameter of extraction device, the parameter of described device comprises device name, device value and device profile title;
S2, judge the device value of described device with preset the device value of not welding device whether identical;
If the device value of the described device of S3 is identical with the device value of not welding device preset, then judge that whether device name is consistent with device profile title;
If the described device name of S4 is consistent with device profile title, then make a mark in the contour area of described device, described step S4 is specially: judge device whether mirror image, if device is not mirror image, then make a mark in the contour area of device wire layer top layer; If device is mirror image, then make a mark in the contour area of device wire layer bottom.
2. mark according to claim 1 does not weld the method for device, it is characterized in that, in described step S2, the described default device value of not welding device is " NF " or " DNP ".
3. mark according to claim 1 does not weld the method for device, it is characterized in that, if to be the device value of described device identical with the default device value of not welding device for the result that described step S2 judges, then comprises further:
Device is carried out highlighted display.
4. mark according to claim 1 does not weld the method for device, it is characterized in that, if to be the device value of described device identical with the default device value of not welding device for the result that described step S2 judges, then comprises further:
The information of described device is exported.
5. mark according to claim 1 does not weld the method for device, it is characterized in that, in described step S4, make a mark in the contour area of described device, be specially: make fork at the contour area of described device, change described device profile color or in described device profile region Fill Color.
6. mark does not weld a system for device, and it is characterized in that, described system comprises:
Parameter extraction unit, for the parameter of extraction device from pcb board, the parameter of described device comprises device name, device value and device profile title;
First judging unit, for judging that whether the device value of described device is identical with the device value of not welding device preset;
Second judging unit, during for judging that at described first judging unit the device value of described device is identical with the device value of not welding device preset, judges that whether device name is consistent with device profile title;
Device markings unit, for when described second judging unit judges that device name is consistent with device profile title, makes a mark in the contour area of described device; Described device markings unit comprises: mirror image judge module, for judging device whether mirror image; Device markings module, for when mirror image judge module judges that device is not mirror image, makes a mark in the contour area of device wire layer top layer; When device is mirror image, make a mark in the contour area of device wire layer bottom.
7. mark according to claim 6 does not weld the system of device, it is characterized in that, in described first judging unit, the described default device value of not welding device is " NF " or " DNP ".
8. mark according to claim 6 does not weld the system of device, it is characterized in that, also comprising highlighted display unit, during for judging that at described first judging unit the device value of described device is identical with the device value of not welding device preset, device being carried out highlighted display.
9. mark according to claim 6 does not weld the system of device, it is characterized in that, also comprising information output unit, during for judging that at described first judging unit the device value of described device is identical with the device value of not welding device preset, the information of described device being exported.
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| CN201110125570.XA CN102789509B (en) | 2011-05-16 | 2011-05-16 | A kind of mark does not weld the method and system of device |
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| CN201110125570.XA CN102789509B (en) | 2011-05-16 | 2011-05-16 | A kind of mark does not weld the method and system of device |
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| CN102789509B true CN102789509B (en) | 2015-09-02 |
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| CN104077376B (en) * | 2014-06-24 | 2017-04-12 | 长春光华微电子设备工程中心有限公司 | Press-welding target identifying and positioning method and system of full-automatic aluminum wire press welder |
| CN105700844A (en) * | 2016-02-23 | 2016-06-22 | 珠海格力电器股份有限公司 | Display method and device for specific device |
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