CN104077376B - Press-welding target identifying and positioning method and system of full-automatic aluminum wire press welder - Google Patents
Press-welding target identifying and positioning method and system of full-automatic aluminum wire press welder Download PDFInfo
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- CN104077376B CN104077376B CN201410289736.5A CN201410289736A CN104077376B CN 104077376 B CN104077376 B CN 104077376B CN 201410289736 A CN201410289736 A CN 201410289736A CN 104077376 B CN104077376 B CN 104077376B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
Abstract
The invention relates to a press-welding target identifying and positioning method and a press-welding target identifying and positioning system of a full-automatic aluminum wire press welder. The method comprises: firstly defining a frame unit and chips thereon in a layered grading manner, then adjusting the position of a camera to enable a substrate layer and the chips in each layer to be clearly imaged in a field of view and storing the corresponding camera position data into a database corresponding to each layer; when the chips on the certain layer are clearly imaged in the field of view, identifying and positioning the identification features of the chips in the layer, and endowing the corresponding chip in the database of the chip layer with obtained position and angle data. The method and system are not limited in the identification and positioning of the single-layer chips or the chips with single type, and flexibility and adaptability of the system are both greatly improved. Meanwhile, since the layers are processed layer by layer, the background management database of the identification system is distinct and clear; when needing to change, add or delete the chip layer or a lead frame rank, the whole identification system does not need to be set or defined again, thus being simple and rapid in operation process.
Description
Technical field
The present invention relates to a kind of Full-automatic aluminum thread pressure welding machine pressure welding object recognition and detection method and system.
Background technology
The identification alignment system of aluminium wire pressure welding device is used to automatically determine welding region position, makes soldering appliance before bonding wire
It is aligned with solder joint.At present, the identifying system of most pressure welding device is will to be directed to the one single chip target of single model, by chip list
Unit is transferred to field of view, and chi frame is fixed on into current location using fixing device, it is fixed after the completion of by computer into
As system obtains the position of chip and framework and is finally completed chip positioning process.This kind of mode be applied to same chip model,
The welding of single lead frame, one single chip unit.But with the variation of pressure welding object form, occur in that single framework list
Unit includes different model, the chip of multi-form, and multiple rows of multilayer chiop, and this just proposes higher to the identification positioning of chip
Requirement.As, to improve production efficiency, the demand for saving production cost increasingly increases, original identification alignment system on market
The market demand cannot have been met.
The content of the invention
The technical problem to be solved in the present invention is to provide a kind of Full-automatic aluminum thread pressure welding machine pressure welding object recognition and detection method
And system, multiple rows of multilayer can be realized for being identified comprising different model, the chip of multi-form on single frame unit
The identification positioning of secondary chip.
In order to solve above-mentioned technical problem, the Full-automatic aluminum thread pressure welding machine pressure welding object recognition and detection system of the present invention includes
Following modules：
Successively hierarchical definition module：Chip to frame unit and thereon by the way of being successively classified is defined,
Leadframes unit is defined as into Base layers, direct paster chip layer on the lead frames is defined as Bondlayer1 layers,
Each chip of Bondlayer1 layers is respectively defined as Bondlayer1.1, Bondlayer1.2 ... ..., Bondlayer1.N1；
Chip layer of the paster on Bondlayer1 layers is defined as Bondlayer2 layers, and each chip of Bondlayer2 layers is defined respectively
For Bondlayer2.1, Bondlayer2.2 ... Bondlayer2.N2；The rest may be inferred, each chip of BondlayerM layers
BondlayerM.1, BondlayerM.2 are respectively defined as ... BondlayerM.NM；
Base layer locating modules：Adjustment camera position, whether judge blur-free imaging in visual field is Base layers, adjustment camera
Position, whether judge blur-free imaging in visual field is Base layers, is, it is fixed that the identification feature of leadframes unit is identified
Position；If Base layers welding position is lead frame pin, without the need for identification, the position of pin and angle are set to into definite value；
First camera adjusting module：Adjustment camera position makes Bondlayer1 layer chip blur-free imagings in visual field, and will
Camera position data now is deposited in the corresponding database of Bondlayer1 layers；
Bondlayer1 layer chip identify locating modules：From the beginning of Bondlayer1 layers, each core of analysis Bondlayer1 layers
Piece identification feature and position relationship；It is identified positioning respectively if there are multiple separate chips, and by the position of each chip
Put data and be assigned to corresponding chip in Bondlayer1 layer datas storehouse；If Base layer only one of which follows chip, by lead
It is corresponding in Bondlayer1 layer datas storehouse that frame unit follows relative position and angle-data between chip to be assigned to this
The chip, or individually follow chip identification feature to be identified positioning and be assigned to its position and angle-data this
Corresponding chip in Bondlayer1 layer datas storehouse；
I camera adjusting modules：Adjustment camera position makes successively each chip layer blur-free imaging in visual field, by corresponding phase
Machine position data is deposited in the corresponding database of each Bondlayer layers；
BondlayerI layer chip identify locating modules：For arbitrary chip BondlayerI, J, I are the layer that chip is located
Number, J is chip in the sequence number of I floor, if the upper only one of which of chip BondlayerI, J follows chip, then calculates this and follows core
The position of piece identification feature with angle and be assigned to Bondlayer (I+1) layer this it is corresponding follow chip, or calculate should
Chip identification feature and chip BondlayerI, the relative position and angle between J identification features is followed simultaneously to be assigned to
Bondlayer (I+1) layer this corresponding follow chip；If chip BondlayerI, there are at least two separate cores on J
Piece, then be identified respectively positioning to these chips, and the elements of a fix of these chip identification features are assigned to into Bondlayer
(I+1) the corresponding chip of layer；Each chip of each chip layer is traveled through, until the identification positioning of all chips is completed, by all chips
The elements of a fix of identification feature are assigned to the corresponding chip of correspondence chip layer.
The Full-automatic aluminum thread pressure welding machine pressure welding object recognition and detection method of the present invention comprises the steps：
Step one：Chip to frame unit and thereon by the way of being successively classified is defined, by lead frame
Unit is defined as Base layers, and direct paster chip layer on the lead frames is defined as Bondlayer1 layers, Bondlayer1 layers
Each chip be respectively defined as Bondlayer1.1, Bondlayer1.2 ... ..., Bondlayer1.N1；Paster exists
Chip layer on Bondlayer1 layers is defined as Bondlayer2 layers, and each chip of Bondlayer2 layers is respectively defined as
Bondlayer2.1,Bondlayer2.2,……Bondlayer2.N2；The rest may be inferred, each chip point of BondlayerM layers
BondlayerM.1, BondlayerM.2 are not defined as ... BondlayerM.NM；
Step 2：Adjustment camera position, whether judge blur-free imaging in visual field is Base layers, is then to lead frame list
The identification feature of unit is identified positioning；If Base layers welding position is lead frame pin, without the need for identification, by pin
Position and angle be set to definite value；
Step 3：Adjustment camera position makes Bondlayer1 layer chip blur-free imagings in visual field, and by camera now
Position data is deposited in the corresponding database of Bondlayer1 layers；
Step 4：From the beginning of Bondlayer1 layers, each chip identification feature of Bondlayer1 layers and position relationship are analyzed；If
There are multiple separate chips to be then identified positioning respectively, and the position data of each chip is assigned to into Bondlayer1 layers
Corresponding chip in database；If Base layer only one of which follows chip, by leadframes unit 1 and this follow between chip
Relative position and angle-data be assigned to corresponding chip in Bondlayer1 layer datas storehouse, or individually core is followed to this
Piece identification feature is identified positioning and its position and angle-data is assigned to into corresponding in Bondlayer1 layer datas storehouse being somebody's turn to do
Chip；
Step 5：Adjustment camera position makes successively each chip layer blur-free imaging in visual field, by corresponding camera position number
According to being deposited in the corresponding database of each Bondlayer layers；
Step 6：For arbitrary chip BondlayerI, J, I are the level number that chip is located, and J is sequence of the chip in I layers
Number, if the upper only one of which of chip BondlayerI, J follows chip, then calculate the position and angle that follow chip identification feature
Degree and be assigned to Bondlayer (I+1) layer this it is corresponding follow chip, or calculate this follow chip identification feature with should
Relative position and angle between chip BondlayerI, J identification feature are simultaneously assigned to Bondlayer (I+1) layers this pair
That what is answered follows chip；If chip BondlayerI, there are at least two separate chips on J, then to these chip difference
Positioning is identified, and the elements of a fix of these chip identification features are assigned to into the corresponding chip of Bondlayer (I+1) layer；
Each chip of each chip layer is traveled through, until the identification positioning of all chips is completed, by the elements of a fix of all chip identification features
It is assigned to the corresponding chip of correspondence chip layer.
The present invention makes whole system no longer limit to using chip and identification feature with the delamination process of matching process
In single layer of chips target or one chip model, the flexibility of system and adaptability are all greatly improved.Simultaneously as per layer point
Layer is processed, its identifying system back-stage management database clear and definite, when needing to change, dose or delete chip layer or lead frame
When frame is arranged, it is no longer necessary to again whole identifying system is configured or is defined, operating process is simple and quick.
Description of the drawings
The present invention is described in further detail with reference to the accompanying drawings and detailed description.
Fig. 1 is the welding workpiece structural representation with multiple rows of multilayer chiop.
Fig. 2 be chip target with follow chip relative position relation schematic diagram.
Fig. 3 be chip target with follow chip position schematic diagram.
The Full-automatic aluminum thread pressure welding machine pressure welding object recognition and detection system block diagram of Fig. 4 present invention.
Fig. 5 is the Full-automatic aluminum thread pressure welding machine pressure welding object recognition and detection method flow diagram of the present invention.
Specific embodiment
As shown in figure 4, the Full-automatic aluminum thread pressure welding machine pressure welding object recognition and detection system of the present invention includes：It is fixed to be successively classified
Adopted module, Base layer locating modules, first camera adjusting module, Bondlayer1 layer chip identify locating modules, I cameras are adjusted
Mould preparation block, BondlayerI layer chip identify locating modules.
As shown in figure 5, the Full-automatic aluminum thread pressure welding machine pressure welding object recognition and detection method of the present invention is specific as follows：
Step one：It is that different working linings is defined according to the relations of dependence of pressure welding target；As shown in figure 1, lead frame
Frame unit 1 is defined as Base layers, and direct paster chip layer on the lead frames is defined as Bondlayer1 layers, Bondlayer1
Layer has two chips, is respectively defined as Bondlayer1.1, Bondlayer1.2；Chip layer of the paster on Bondlayer1 layers
Bondlayer2 layers are defined as, Bondlayer2 layers have four chips, are respectively defined as Bondlayer2.1,
Bondlayer2.2, Bondlayer2.3, Bondlayer2.4；
Step 2：Adjustment camera position, whether judge blur-free imaging in visual field is Base layers, is then to lead frame list
The position of the identification feature of unit 1 is set to definite value with angle-data.Identification feature can be in four summits A, B, C, D any point and
Its side being located, finds the angle on the point coordinates and its place side, for example, summit A and AB side is found into top as identification feature
Point A and the angle on AB sides；The four of leadframes unit 1 summits and four sides all can also be known as identification feature
Do not position.If Base layers welding position is lead frame pin 4, without the need for identification, the coordinate of pin 4 is to be set to definite value.
Step 3：Adjustment camera position (if camera is varifocal, adjusting the focal length of camera) makes Bondlayer1 layer chips
The blur-free imaging in visual field, and camera position data now is deposited in the corresponding database of Bondlayer1 layers.
Step 4：From the beginning of Bondlayer1 layers, each chip identification feature of Bondlayer1 layers and position relationship are analyzed.If
There are multiple separate chips to be then identified positioning respectively, and by the position of each chip identification feature and angle-data assignment
To corresponding chip in Bondlayer1 layer datas storehouse；If Base layer only one of which follows chip, leadframes unit 1 is known
Other feature and this follow relative position and angle-data between chip identification feature to be assigned in Bondlayer1 layer datas storehouse
Corresponding chip.Described identification feature can be the wire of chip, texture, the printed conductor around welding region or expression
Straight line, asterism of welding region etc..
As shown in figure 1, Bondlayer1 layers there are two separate chips, then need to know the two chips respectively
Do not position.If carrying printed conductor around the welding region of two chips, be able to will print using printed conductor as identification feature
The coordinate on four summits of wire processed and the angle on four sides are assigned to the Bondlayer1.1 in Bondlayer1 layer datas storehouse,
Bondlayer1.2。
Step 5：Adjustment camera position makes Bondlayer2 layer chip blur-free imagings in visual field, and by camera now
Position data is deposited in the corresponding database of Bondlayer2 layers.
Step 6：The chip identification feature and position relationship of analysis Bondlayer2 layers.Divide if chip chamber is separate
Be not identified positioning, and the position of each chip identification feature and angle-data are assigned to it is right in Bondlayer1 layer datas storehouse
The chip answered；If chip chamber follows relation, select the obvious chip of identification feature as identification object, determine identification object
Identification feature and follow the relative position and angular relationship between chip identification feature, and by identification object identification feature with follow
Relative position and angle-data between chip identification feature is assigned to corresponding chip in Bondlayer1 layer datas storehouse.
As shown in figure 1, Bondlayer2 layers there are three separate chips to be located on chip Bondlayer1.1, then need
Respectively the position coordinates and angle of three chip identification features are assigned to into corresponding chip in Bondlayer2 layer datas storehouse
Bondlayer2.1, Bondlayer2.2, Bondlayer2.3.
As shown in Fig. 2 the identification feature of chip Bondlayer1.2 is the printed conductor around welding region, its four tops
Point is A1.2、B1.2、C1.2、D1.2, the identification feature of chip Bondlayer2.4 is two straight line A around welding region2.4D2.4、
B2.4C2.4, Bondlayer1.2 and Bondlayer2.4 follows relation.Because Bondlayer2.4 must be pasted onto
On Bondlayer1.2, therefore when the identification for carrying out Bondlayer1.2 is searched for, without the need for being known in whole field range
Not or matching, plain region is searched using what chip position and the size limitation of Bondlayer1.2 went out Bondlayer2.4.Namely
After chip Bondlayer1.2 positions are found, it is obtained according to Bondlayer1.2 and Bondlayer2.4 position relationships
The position location of Bondlayer2.4.Aluminum steel as welded can affect the feature extraction of Bondlayer2.4, can enter one
Step restricted searching area, makes the identification feature in region of search apparent, but the selection of region of search must ensure in region
Feature has uniqueness.Chip Bondlayer2.4 can determine that it follows position relationship using following methods.
Calculate A on Bondlayer1.21.2Point and A on Bondlayer2.42.4The distance between point Sx1.2、Sy1.2With
A1.2D1.2Side and straight line A2.4D2.4Between angle theta2.4', by Sx1.2、Sy1.2And θ2.4In being assigned to Bondlayer2 layer datas storehouse
Corresponding chip Bondlayer2.4.If straight line A2.4D2.4It is blocked, it is also possible to by straight line B2.4C2.4Calculate two chips
Between position and angular relationship and be assigned to Bondlayer2.4.
As shown in figure 3, chip Bondlayer2.4 can also adopt the method that positioning is individually identified to determine its position and angle
Degree.A can such as be calculated2.4The coordinate and straight line A of point2.4D2.4Angle, θ2.4, or while calculate A2.4Point, B2.4Coordinate and straight
Line A2.4D2.4、B2.4C2.4Angle, θ2.4。
Due to being fixed position on the lead frames, welding coordinate can be set to definite value to the welding region of substrate Base layer,
Need not be by recognizing setting.When welding position on weld layer needs to be adjusted according to chip position, using recognize into
Row positioning.For the chip on Bondlayer1, whether there is position relationship between analysis chip.When each chip is separate,
For each chip definition identification feature or matching process；When relation is followed between target, the obvious chip of feature is selected to make
For identification object.After navigating to the position of identification object, according to find by identification object and the position relationship for following chip with
With the position of chip.In the presence of Bondlayer2, constrained according to the position relationship of Bondlayer1 and Bondlayer2 first
The identification region of search scope of Bondlayer2, then carries out in the region target positioning.To avoid existing bonding wire or spy
The impact of other close targets is levied, is that each identification target arranges area-of-interest, make identification matching work simply feel emerging
Interesting range searching is carried out, and for chip features, some chips is arranged with identification position and identification angle, so that the spy of identification target
Levy more prominent.It is that each basalis arranges identification original position when there is multi-row lead frame frame, and repeats above-mentioned single substrate
The analyzing and processing process of layer.
Claims (2)
1. a kind of Full-automatic aluminum thread pressure welding machine pressure welding object recognition and detection system, it is characterised in that including following modules：
Successively hierarchical definition module：Chip to frame unit and thereon by the way of being successively classified is defined, and will draw
Wire frame unit is defined as Base layers, and direct paster chip layer on the lead frames is defined as Bondlayer1 layers,
Each chip of Bondlayer1 layers is respectively defined as Bondlayer1.1, Bondlayer1.2 ... ..., Bondlayer1.N1；
Chip layer of the paster on Bondlayer1 layers is defined as Bondlayer2 layers, and each chip of Bondlayer2 layers is defined respectively
For Bondlayer2.1, Bondlayer2.2 ... Bondlayer2.N2；The rest may be inferred, each chip of BondlayerM layers
BondlayerM.1, BondlayerM.2 are respectively defined as ... Bondlayer M.NM；
Base layer locating modules：Adjustment camera position, whether judge blur-free imaging in visual field is Base layers, is then to lead frame
The identification feature of frame unit is identified positioning；If Base layers welding position is lead frame pin, without the need for identification, will draw
The position of pin is set to definite value with angle；
First camera adjusting module：Adjustment camera position makes Bondlayer1 layer chip blur-free imagings in visual field, and will now
Camera position data be deposited in the corresponding database of Bondlayer1 layers；
Bondlayer1 layer chip identify locating modules：From the beginning of Bondlayer1 layers, each chip of analysis Bondlayer1 layers is known
Other feature and position relationship；It is identified positioning respectively if there are multiple separate chips, and by the positional number of each chip
According to being assigned to corresponding chip in Bondlayer1 layer datas storehouse；If Base layer only one of which follows chip, by lead frame
Unit follows relative position and angle-data between chip to be assigned to corresponding core in Bondlayer1 layer datas storehouse with this
Piece, or individually follow chip identification feature to be identified positioning and be assigned to its position and angle-data this
Corresponding chip in Bondlayer1 layer datas storehouse；
I camera adjusting modules：Adjustment camera position makes successively each chip layer blur-free imaging in visual field, by corresponding phase seat in the plane
Put data to be deposited in the corresponding database of each Bondlayer layers；
BondlayerI layer chip identify locating modules：For the level number that arbitrary chip BondlayerI.J, I are located for chip, J
It is chip in the sequence number of I floor, if only one of which follows chip on chip BondlayerI.J, calculates this and follow chip to know
The position of other feature with angle and be assigned to Bondlayer (I+1) layer this it is corresponding follow chip, or calculate this and follow
Relative position and angle between chip identification feature and chip BondlayerI.J identification features are simultaneously assigned to
Bondlayer (I+1) layer this corresponding follow chip；If there is at least two separate cores on chip BondlayerI.J
Piece, then be identified respectively positioning to these chips, and the elements of a fix of these chip identification features are assigned to into Bondlayer
(I+1) the corresponding chip of layer；Each chip of each chip layer is traveled through, until the identification positioning of all chips is completed, by all chips
The elements of a fix of identification feature are assigned to the corresponding chip of correspondence chip layer.
2. a kind of Full-automatic aluminum thread pressure welding machine pressure welding object recognition and detection method, it is characterised in that comprise the steps：
Step one：Chip to frame unit and thereon by the way of being successively classified is defined, by leadframes unit
Be defined as Base layers, direct paster chip layer on the lead frames is defined as Bondlayer1 layers, Bondlayer1 layers it is each
Individual chip is respectively defined as Bondlayer1.1, Bondlayer1.2 ... ..., Bondlayer1.N1；Paster is in Bondlayer1
Chip layer on layer is defined as Bondlayer2 layers, and each chip of Bondlayer2 layers is respectively defined as Bondlayer2.1,
Bondlayer2.2,……Bondlayer2.N2；The rest may be inferred, and each chip of BondlayerM layers is respectively defined as
BondlayerM.1,BondlayerM.2,……Bondlayer M.NM；
Step 2：Adjustment camera position, whether judge blur-free imaging in visual field is Base layers, is then to leadframes unit
Identification feature is identified positioning；If Base layers welding position is lead frame pin, without the need for identification, by the position of pin
Put and be set to definite value with angle；
Step 3：Adjustment camera position makes Bondlayer1 layer chip blur-free imagings in visual field, and by camera position now
Data are deposited in the corresponding database of Bondlayer1 layers；
Step 4：From the beginning of Bondlayer1 layers, each chip identification feature of Bondlayer1 layers and position relationship are analyzed；If having many
Individual separate chip is then identified respectively positioning, and the position data of each chip is assigned to into Bondlayer1 layer datas
Corresponding chip in storehouse；If Base layer only one of which follows chip, leadframes unit 1 is followed into the phase between chip with this
Corresponding chip in Bondlayer1 layer datas storehouse is assigned to position and angle-data, or individually follows chip to know this
Other feature is identified positioning and its position and angle-data being assigned to into corresponding chip in Bondlayer1 layer datas storehouse；
Step 5：Adjustment camera position makes successively each chip layer blur-free imaging in visual field, and corresponding camera position data is deposited
Enter in the corresponding database of each Bondlayer layers；
Step 6：For arbitrary chip BondlayerI.J, I is the level number that chip is located, and J is sequence number of the chip in I floor, if
Only one of which follows chip on chip BondlayerI.J, then calculate position and angle and general that this follows chip identification feature
It is assigned to Bondlayer (I+1) layer this it is corresponding follow chip, or calculate this and follow chip identification feature and the chip
Relative position and angle between BondlayerI.J identification features are simultaneously assigned to Bondlayer (I+1) layer this are corresponding
Follow chip；If there are at least two separate chips on chip BondlayerI.J, these chips are carried out respectively
Identification positioning, and the elements of a fix of these chip identification features are assigned to into the corresponding chip of Bondlayer (I+1) layer；Traversal
Each chip of each chip layer, until the identification positioning of all chips is completed, by the elements of a fix assignment of all chip identification features
To the corresponding chip of correspondence chip layer.
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| CN104077376A (en) | 2014-10-01 |
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