CN101174518A - Minitype inertial electrical switch capable of regulating and controlling contact time - Google Patents

Minitype inertial electrical switch capable of regulating and controlling contact time Download PDF

Info

Publication number
CN101174518A
CN101174518A CNA2007100476836A CN200710047683A CN101174518A CN 101174518 A CN101174518 A CN 101174518A CN A2007100476836 A CNA2007100476836 A CN A2007100476836A CN 200710047683 A CN200710047683 A CN 200710047683A CN 101174518 A CN101174518 A CN 101174518A
Authority
CN
China
Prior art keywords
mass
micron
poroelasticity
electrical switch
spring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CNA2007100476836A
Other languages
Chinese (zh)
Other versions
CN100536055C (en
Inventor
丁桂甫
杨卓青
蔡豪刚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shanghai Jiaotong University
Original Assignee
Shanghai Jiaotong University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Jiaotong University filed Critical Shanghai Jiaotong University
Priority to CNB2007100476836A priority Critical patent/CN100536055C/en
Publication of CN101174518A publication Critical patent/CN101174518A/en
Application granted granted Critical
Publication of CN100536055C publication Critical patent/CN100536055C/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Abstract

The invention relates to a minitype inertia electrical switch which can adjust the contact time, belonging to the micro electromechanical system technical field. The invention is characterized in that: a mass block electrode with a cantilever beam array comprises a mass block and a cantilever beam array fixed to the mass block; the cantilever beam array is positioned below a fixed electrode of a porous elastic beam; a support layer is positioned above an insulated base and below the mass block; the support unit of a spring and the support unit of the porous elastic beam fixed to the insulated base are positioned around the mass block; a joint snake shaped spring connected with the mass block is hung in the air by the support unit of the spring; the fixed electrode of the porous elastic beam positioned above the mass block is hung in the air by the support unit of the porous elastic beam, and a gap is positioned between the fixed electrode of the porous elastic beam and the cantilever beam array. The invention has the advantages of improving the contact effect of the movable mass electrode and the fixed electrode of the elastic beam, adjusting the contact time of the two electrodes of the minitype inertia switch conveniently, and improving the coordination of the movement of the mass block with the joint snake shaped spring caused by the outside acceleration.

Description

The minitype inertial electrical switch of adjustable time of contact
Technical field
What the present invention relates to is a kind of microswitch of micro electronmechanical field of engineering technology, is specifically related to the minitype inertial electrical switch of a kind of adjustable time of contact.
Background technology
Be that the inertia switch of basic engineering and manufacturing has because of it that volume is little, cost low and advantage such as batch process receives much concern with the micro electro mechanical system (MEMS) technology.Minitype inertial switch in the past, no matter be vertical drive or horizontal drive, because of its processing method is that development comes on traditional ic manufacturing technology, the preparation of switch is that electroplate on the basis with the silicon substrate under a lot of situations, because inevitable internal stress in the electroplating process, this has just determined that the height of entire device can not be too thick, for being arranged, enough big mass responds to extraneous acceleration effect, finally cause the entire area of device bigger, this problem is more obvious in the inertia switch of horizontal drive.The most forms that adopt cantilever beam or spring quality of connection cube electrode to remove to contact another fixed electrode of the design of minitype inertial electrical switch.But, how to handle contact effect and subsequently the high speed bounce-back problem of mass electrode collide well to another fixed electrode, and guaranteeing that this mechanism of mass acceleration effect outside quick coordination down that cantilever beam or spring connect is the direction that people make great efforts always, the result is various constantly to be suggested in order to the minitype inertial electrical switch design of improving above-mentioned deficiency.
Find through literature search prior art, Ma Wei etc. are at " Journal of Micromechanicsand Microengineering " (" micromechanics and little engineering magazine ", 2003 13 volume the 3rd phase 892-899 pages or leaves) delivered the paper that is entitled as " Design and characterization of inertia-activatedelectrical micro-switches fabricated and packaged using low-temperaturephotoresist molded metal-electroplating technology " (" with design and the sign of low-temperature metal electroplating technology manufacturing ") with the miniature electrical switch of inertia-activated of encapsulation, proposition is based on silicon substrate, the method of plated metal realizes the preparation of minitype inertial switch thereon, this minitype inertial switch be the mass that connects with cantilever beam as one of electrode, another electrode is positioned on the substrate of mass below, perhaps with mass on same plane.The mass electrode is when being located immediately at suprabasil another fixed electrode collision and contacting, because both rigidity is all very big, to such an extent as to the contact effect is bad, and time of contact is of short duration, time of contact is unadjustable, the mass of adding the high speed resilience may cause device impaired without any Border Protection.
Summary of the invention
The objective of the invention is to overcome the deficiencies in the prior art, the minitype inertial electrical switch of a kind of adjustable time of contact is provided, realize, the accidental injury of device is played a protective role the minitype inertial electrical switch adjusting of time of contact.
The present invention is achieved by the following technical solutions, the present invention includes: the mass electrode, poroelasticity beam fixed electrode, conjoined snakelike spring, dielectric substrate, supporting layer, spring supporting seat and the poroelasticity beam supporting seat that have cantilever array.The described mass electrode that has a cantilever array is made of mass and the cantilever array that is fixed on the mass, cantilever array is positioned at poroelasticity beam fixed electrode below, supporting layer is positioned at the dielectric substrate top, the mass below, spring supporting seat and poroelasticity beam supporting seat are fixed on the dielectric substrate, be positioned at around the mass, conjoined snakelike spring links to each other with mass, and it is unsettled by the spring supporting seat, poroelasticity beam fixed electrode is unsettled by poroelasticity beam supporting seat, be positioned at the mass top, gapped between poroelasticity beam fixed electrode and the cantilever array.When the enough big negative acceleration in the external world along dielectric substrate surface normal directive effect during in switch of the present invention, when perhaps enough big positive acceleration acts on switch of the present invention along dielectric substrate lower surface normal direction, the mass electrode that has cantilever array will touch poroelasticity beam fixed electrode, realize the connection to external circuit.
Described dielectric substrate can be dielectric substrate such as quartz substrate, glass substrate.
Described supporting layer metal such as Direct Electroplating nickel or copper on dielectric substrate forms, the short column array that is distributed by a series of vertical and horizontal forms, short column can have different shape and size, the form of array also can have various forms, can make cuboid or cylinder as short column, a part is on dielectric substrate during array, the conjoined snakelike spring below is array vertically, be spaced apart the 80-120 micron, another part is on dielectric substrate, mass below horizontal array becomes 4 row * 5 row, the short column sectional area of supporting layer should not be too little, generally be at least 15 microns * 70 microns, come off when preventing that last device from discharging, highly suitable, be generally the 3-20 micron, can play certain supporting role to conjoined snakelike spring and the mass electrode that rebounds at a high speed.
Described conjoined snakelike spring is by a circle of metals such as electronickelling or copper formation or the structure of multiturn, its live width is the 5-50 micron, thickness is the 4-50 micron, the semicircle internal diameter of serpentine spring sweep is the 20-100 micron, vertical length between the semicircle of connection serpentine spring sweep is the 50-500 micron, and the length of disjunctor is the 10-200 micron between the single spring.Conjoined snakelike spring among the present invention is with respect to single spring or cantilever beam were distributed in mass design on every side in the past, its advantage is after being subjected to extraneous acceleration effect, conjoined snakelike spring is unsettled and the motion mass electrode can keep consistency, harmony, helps the reliable and stable of switch.
Described spring supporting seat is the square or arc column structure that forms by metals such as electronickelling or copper, and its shape and size change because of the change of shape of dielectric substrate.
The described mass electrode that has cantilever array is the square or round structure that forms by metals such as repeatedly lamination electronickelling or copper.
Described mass is positioned at supporting layer top, poroelasticity beam below, connect also unsettled by conjoined snakelike spring, the size and dimension of mass changes because of the change of shape of dielectric substrate, when being cuboid, it is of a size of long 300-1000 micron, wide 300-1000 micron, high 50-500 micron, and the mass electrode can dig out a series of hole therebetween with convenient last release in manufacturing process.
Described cantilever array is the square body structure that forms by metal such as electronickelling or copper on mass, also can form by the method for re-plating after the cambered surface drying glue, its size and dimension changes because of the change of shape of dielectric substrate, when the cantilever beam in the cantilever array is cuboid, it is of a size of long 20-100 micron, wide 10-30 micron, high 5-10 micron, and cantilever array need be done sacrifice layer with positive glue and discharges and obtain in manufacturing process.The cantilever beam supporting seat is used for the cantilever beam in the supporting cantilever beam array, cantilever beam coupling in the shape of cantilever beam supporting seat and structure and the cantilever array, when the cantilever beam supporting seat was cuboid, it was of a size of long 10-50 micron, wide 10-30 micron, high 3-6 micron.Between the two contact stiffness when this cantilever array that is positioned on the mass electrode can reduce the collision of mass electrode and fixed electrode effectively plays certain cushioning effect, helps improving the contact effect of two electrodes.
Described poroelasticity beam fixed electrode, the poroelasticity beam for adopting metals such as electronickelling or copper to make under the room temperature can be one or more, the shape of Liang Hekong and size can have multiple variation.The poroelasticity beam is positioned at the cantilever array top, and be fixed on the poroelasticity beam supporting seat, poroelasticity beam supporting seat exceeds the 10-40 micron than the mass electrode that has cantilever array, as poroelasticity beam fixed electrode and the interelectrode gap of mass that has cantilever array, the typical height dimension of poroelasticity beam supporting seat is the 140-180 micron.This poroelasticity beam has reduced the rigidity of structure of unjointed beam as fixed electrode, when being subjected to the collision of mass electrode, can reduce contact stiffness between the two effectively, play certain cushioning effect, help improving the contact effect of two electrodes, and be convenient to the last release of device in the manufacturing process.
Described poroelasticity beam supporting seat can be made into rectangular-shaped, also can make cylindrical shape, and this shape because of dielectric substrate can be changed to different size and dimensions, also is to adopt repeatedly metal such as lamination electronickelling or copper making under the room temperature.
The present invention adopts the method for repeatedly not disturbing lamination to electroplate whole construction of switch mutually on dielectric substrate such as quartz or glass under the room temperature to make based on the MEMS (micro electro mechanical system) process technology.The present invention is under extraneous acceleration effect, rely on inertia force to drive the unsettled mass electrode movement that has cantilever array of conjoined snakelike spring, thereby touch poroelasticity beam fixed electrode at regular intervals with it, the mass electrode that will have cantilever array subsequently again under acting force of the spring fast retracts, and finally realizes the circuit snap switch.
The present invention is directed in the past, minitype inertial electrical switch is contacting poor effect, the problem that mass electrode movement inaccurate coordination and high speed bounce-back aspect, two electrodes contact back exist, a kind of conjoined snakelike spring that comprises has been proposed, supporting layer, poroelasticity beam fixed electrode and the minitype inertial electrical switch that has the mass electrode of cantilever array, improved the effect that contacts between movable mass electrode and fixed electrode well, promoted had the harmony that the conjoined snakelike spring mass moves under extraneous acceleration effect, also reduced the mass electrode simultaneously and rebounded at a high speed switching device is damaged with causing.Change the size and the flying height of cantilever beam in the mass electrode upper cantilever beam array by design, can regulate the time of contact of minitype inertial electrical switch in the connection process easily.
The traditional minitype inertial electrical switch of poroelasticity beam that do not use as fixed electrode, usually it is delicate that be about 0.1-0.5 its time of contact, and, can't realize the micro switch adjusting of time of contact because its movable electrode and fixed electrode all are the very big rigid bodies of rigidity.The minitype inertial electrical switch of adjustable time of contact of the present invention, adopt the poroelasticity beam as fixed electrode, employing has the mass of cantilever array as movable electrode, can reduce the contact stiffness between two electrodes on the one hand, thereby increase time of contact, usually it is delicate to rise to 20-50 time of contact, on the other hand, adopt to regulate the cantilever array cantilever beam length that is arranged on the mass and the method for flying height, can realize that to the minitype inertial electrical switch regulation and control of time of contact the longest can be risen to 150-200 the time of contact of micro switch delicate.
Description of drawings
Fig. 1 is the minitype inertial electrical switch structural representation that embodiment 1 has the adjustable time of contact of a pair of porous spring beam fixed electrode
Fig. 2 is the mass electrode structure schematic diagram that has cantilever array of embodiment 1
Fig. 3 is the band square hole spring beam fixed electrode structural representation of embodiment 1
Fig. 4 is the supporting layer structural representation of embodiment 1
Fig. 5 is the minitype inertial electrical switch structural representation that embodiment 2 has the adjustable time of contact of a poroelasticity beam fixed electrode
Fig. 6 is the mass electrode structure schematic diagram of the band cantilever array of embodiment 3 with multiturn conjoined snakelike spring
Fig. 7 is that embodiment 4 adopts the minitype inertial electrical switch structural representation of the adjustable time of contact of circular substrate and mass
Fig. 8 is that embodiment 5 adopts the minitype inertial electrical switch structural representation of cantilever array as the adjustable time of contact of fixed electrode
Embodiment
Below in conjunction with accompanying drawing embodiments of the invention are elaborated: present embodiment is being to implement under the prerequisite with the technical solution of the present invention, provided detailed execution mode and concrete operating process, but protection scope of the present invention is not limited to following embodiment.
Embodiment 1 has the minitype inertial electrical switch of the adjustable time of contact of a pair of porous spring beam fixed electrode
As shown in Figure 1, the minitype inertial electrical switch of present embodiment adjustable time of contact comprises: the mass electrode, poroelasticity beam fixed electrode 2, conjoined snakelike spring 3, supporting layer 4, dielectric substrate 5, spring supporting seat 6, the poroelasticity beam supporting seat 8 that have cantilever array; The described mass electrode that has a cantilever array is made of mass 1 and the cantilever array 9 that is fixed on the mass 1.
Supporting layer 4 is positioned at dielectric substrate 5 tops, mass 1 below, spring supporting seat 6 is fixed on the dielectric substrate 5, be positioned at mass 1 both sides, poroelasticity beam supporting seat 8 also is fixed on the dielectric substrate 5, be positioned at mass 1 all the other both sides, conjoined snakelike spring 3 links to each other with mass 1, and it is unsettled by spring supporting seat 6 together, poroelasticity beam fixed electrode 2 is unsettled by poroelasticity beam supporting seat 8, and be positioned at mass 1 top, cantilever array 9 is fixed on the mass 1 and is unsettled by cantilever beam supporting seat 10, the height of cantilever beam supporting seat 10 is the 3-6 micron, and the gap that the 10-40 micron is arranged between the poroelasticity beam fixed electrode 2 is connected with disjunctor 7 between spring between the circle structure of conjoined snakelike spring 3.
Mass 1 is rectangular-shaped, and size is: long 950 microns, wide 950 microns, high 110 microns, adopt repeatedly metal such as lamination electronickelling or copper to make.
Cantilever beam supporting seat 10 is long 10-50 micron, wide 10-30 micron, high 3-6 micron.
Length of cantilever 20-100 micron in the cantilever array 9, wide 10-30 micron, high 5-10 micron, these cantilever beams are on the mass 1, below the poroelasticity beam fixed electrode 2, and array becomes 5 row * 4 row.
The serpentine spring 3 of quality of connection piece 1,10 microns of its live widths, 20 microns of thickness, 20 microns of the interior diameters at spring bending part semicircle place, 40 microns of overall diameters, disjunctor 7 long 20-50 microns between spring.
300 microns of spring supporting seat 6 length, wide 100 microns, high 30 microns.
1300 microns of poroelasticity beam fixed electrode 2 length, wide 160 microns, thick 20 microns, the size in the hole 11 on the poroelasticity beam is 50 microns * 50 microns, with the poroelasticity beam with thick, the poroelasticity beam supporting seat 8 that supports it for long 100 microns * wide 360 microns * high 140 microns, poroelasticity beam supporting seat 8 exceeds the 10-40 micron than the mass electrode of band cantilever array.
Supporting layer 4 short-and-medium column length 100-200 microns, wide 30-60 micron, high 4-8 micron, these short columns can be by different modes at array on the dielectric substrate 5: a part is at vertical array on the substrate, below the conjoined snakelike spring, be spaced apart the 100-120 micron, another part laterally is listed as into 4 row * 5 row in square formation on the substrate, under the mass.
Dielectric substrate 5 is of a size of long 1700-2000 micron, wide 1600-2000 micron, high 50-100 micron.
Fig. 2 is for present embodiment has the perspective view of the mass 1 of cantilever array 9, and the spring supporting seat 6 that is positioned at mass 1 both sides is electroplated on dielectric substrate 5, and conjoined snakelike spring 3 and the mass 1 that is attached thereto is unsettled.Cantilever array 9 is formed by the cantilever array of a series of vertical distributions, and the height of cantilever beam supporting seat 10 is the 3-6 micron.
Fig. 3 is the structural representation of present embodiment as the poroelasticity beam of poroelasticity beam fixed electrode 2, poroelasticity beam supporting seat 8 is electroplated on dielectric substrate 5, poroelasticity beam fixed electrode is fixed on the poroelasticity beam supporting seat 8, a series of square opening 11 is arranged, the consistency of thickness of the thickness in hole 11 and poroelasticity beam fixed electrode on the poroelasticity beam fixed electrode 2.
Fig. 4 is the structural representation of present embodiment supporting layer 4, supporting layer 4 is formed by the short column array that a series of vertical and horizontal distribute as seen from the figure, vertically array is on the dielectric substrate 5, below the conjoined snakelike spring 3, and horizontal array is on the dielectric substrate 5, below the mass 1.
The two poles of the earth of external circuit are connected to the mass 1 and the poroelasticity beam fixed electrode 2 of the minitype inertial electrical switch of above-mentioned adjustable time of contact respectively, after being subjected to the sensitive axes direction (being dielectric substrate 5 normal to a surface directions) that extraneous enough big acceleration acts on this switch here, under the driving of mass 1 inertia force, by the unsettled masses that have cantilever array 91 motion of conjoined snakelike spring 3 to and touch poroelasticity beam fixed electrode 2, drawn back by conjoined snakelike spring 3 again subsequently, thereby realization is to the quick break-make of external circuit.The loose structure of poroelasticity beam fixed electrode 2 has reduced its rigidity, cantilever array 9 on the mass 1 is that the two mutual collisions of hanging down between the rigid components contact contacting with 2 collisions of poroelasticity beam fixed electrode, can promote two interelectrode contact effects like this, and by the distribution in hole 11 and the dimensional structure of cantilever array 9 on the adjusting poroelasticity beam fixed electrode 2, can regulate and control the time of contact of minitype inertial switch easily, the distribution in hole is many more, cantilever beam is soft more, then time of contact long more, otherwise then short more.
Can regulate between 20-150 is delicate the time of contact of minitype inertial electrical switch in the present embodiment.
Embodiment 2 adopts adjustable time of contact of the minitype inertial electrical switch of a poroelasticity beam
Fig. 5 be adopt a poroelasticity beam adjustable time of contact minitype inertial electrical switch perspective view, as shown in the figure, this minitype inertial electrical switch has adopted a perforated baffle beam as poroelasticity beam fixed electrode 2, among the size of this minitype inertial electrical switch and the embodiment 1 adjustable time of contact minitype inertial electrical switch consistent, and except poroelasticity beam fixed electrode 2, the shape of remaining part, size are consistent with embodiment 1.
Can regulate between 20-100 is delicate the time of contact of minitype inertial electrical switch in the present embodiment.
Embodiment 3 has adjustable time of contact of the minitype inertial electrical switch of multiturn conjoined snakelike spring
Fig. 6 is adjustable time of contact of the minitype inertial electrical switch structural representation that present embodiment has the multiturn conjoined snakelike spring, as shown in the figure, the conjoined snakelike spring 3 that this minitype inertial electrical switch adopts is multiturns, and all the other features of this minitype inertial electrode switch are similar to Example 1.
Can regulate between 20-200 is delicate the time of contact of minitype inertial electrical switch in the present embodiment.
Embodiment 4 adopts adjustable time of contact of the minitype inertial electrical switch of circular substrate and mass
Fig. 7 is adjustable time of contact of the minitype inertial electrical switch structural representation that adopts circular substrate and mass, conjoined snakelike spring 3 is the same with the size of conjoined snakelike spring among the embodiment 1, also can be made into the multi-turn structure of conjoined snakelike spring 3 among the embodiment 3.
The mass 1 that has cantilever array is column structure, and 900 microns of its bottom surface diameters are high 100 microns.
Cantilever beam supporting seat 10 is long 10-50 micron, wide 10-30 micron, high 3-6 micron.
Length of cantilever 20-100 micron in the cantilever array 9, wide 10-30 micron, high 5-10 micron, these cantilever beams are on the mass 1, below the poroelasticity beam fixed electrode 2, and array becomes 5 row * 2 row.
Dielectric substrate 5 is a column structure, and 1650 microns of its bottom surface diameters are high 50 microns, can design by similar thereon Fig. 1, and the short column of array certain size shape, array way is with embodiment 1 unanimity.
1650 microns of the length overalls of poroelasticity beam fixed electrode 2, long 900 microns of middle rectangle transition portion, wide 450 microns, thick 20 microns of structure, distribution diameter is of a size of the circular hole of 50-100 micron or 50 microns * 50 microns square hole in the above.
Fan-shaped spring supporting seat 6 is high 20 microns, fan-shaped wide 100 microns, 1450 microns of interior diameters, 1650 microns of overall diameters, fan-shaped angle 30 degree; The fanning beam supporting seat 8 of multi-hole beam is high 160 microns, and is fan-shaped wide 100 microns, 1450 microns of interior diameters, 1650 microns of overall diameters, fan-shaped angle 60 degree.
Can regulate between 20-200 is delicate the time of contact of minitype inertial electrical switch in the present embodiment.
Embodiment 5 adopts cantilever array as fixed electrode and be positioned at adjustable time of contact of the minitype inertial electrical switch of mass below
Fig. 8 adopts cantilever array as fixed electrode and be positioned at adjustable time of contact of the minitype inertial electrical switch structural representation of mass below; as shown in the figure; this minitype inertial electrical switch adopts and is positioned at the cantilever array 9 of mass 1 below, dielectric substrate 5 tops as the flexible fastening electrode; protection after the spring beam baffle plate rebounds as mass 1 collision cantilever array fixed electrode; the short column of the horizontal array that is positioned at mass 1 below in the supporting layer 4 is replaced by cantilever array 9; cantilever array 9 is positioned at the both sides of mass 1 below, is 2 row * 5 row.Among the size of this minitype inertial electrical switch and the embodiment 1 adjustable time of contact minitype inertial electrical switch consistent, and except the cantilever array fixed electrode, the shape of remaining part, size are consistent with embodiment 1.
Can regulate between 20-200 is delicate the time of contact of minitype inertial electrical switch in the present embodiment.

Claims (10)

1. the minitype inertial electrical switch of an adjustable time of contact, comprise: the mass electrode that has cantilever array, poroelasticity beam fixed electrode, conjoined snakelike spring, dielectric substrate, supporting layer, spring supporting seat and poroelasticity beam supporting seat, it is characterized in that, the described mass electrode that has cantilever array is made of mass and cantilever array fixed thereon, cantilever array is positioned at poroelasticity beam fixed electrode below, supporting layer is positioned at the dielectric substrate top, the mass below, spring supporting seat and poroelasticity beam supporting seat are fixed on the dielectric substrate, be positioned at around the mass, conjoined snakelike spring links to each other with mass, and it is unsettled by the spring supporting seat, poroelasticity beam fixed electrode is unsettled by poroelasticity beam supporting seat, be positioned at the mass top, gapped between poroelasticity beam fixed electrode and the cantilever array.
2. the minitype inertial electrical switch of adjustable time of contact according to claim 1 is characterized in that, described dielectric substrate is meant quartz or glass substrate.
3. the minitype inertial electrical switch of adjustable time of contact according to claim 1, it is characterized in that, described cantilever array, length of cantilever wherein be the 20-100 micron, wide for the 10-30 micron, high be the 5-10 micron, these cantilever beams are on the mass, below the poroelasticity beam fixed electrode, and array becomes 5 row * 4 row.
4. the minitype inertial electrical switch of adjustable time of contact according to claim 1, it is characterized in that, described supporting layer is the short column array that the vertical and horizontal on the dielectric substrate distribute, vertically array is on the dielectric substrate, below the conjoined snakelike spring, horizontal array is on the dielectric substrate, below the mass, wherein short column is cuboid or cylinder, and its sectional area is at least 20 microns * 80 microns, highly is the 5-15 micron.
5. the minitype inertial electrical switch of adjustable time of contact according to claim 1 is characterized in that, described spring supporting seat is square or the arc column structure.
6. the minitype inertial electrical switch of adjustable time of contact according to claim 1, it is characterized in that, described conjoined snakelike spring is the structure of a circle or multiturn, its live width is that 5-50 micron, thickness are the 4-50 micron, the internal diameter of spring bending part semicircle is the 20-100 micron, the vertical length that connects between the spring semicircle is the 50-500 micron, and the length of disjunctor is the 10-200 micron between the single spring.
7. the minitype inertial electrical switch of adjustable time of contact according to claim 1, it is characterized in that, described mass is square or the round structure, when being square structure, long for the 300-1000 micron, wide be the 300-1000 micron, high be the 50-500 micron.
8. the minitype inertial electrical switch of adjustable time of contact according to claim 1 is characterized in that, described poroelasticity beam fixed electrode is one or more perforated baffle beam with square hole or circular hole.
9. the minitype inertial electrical switch of adjustable time of contact according to claim 1 is characterized in that, described poroelasticity beam supporting seat is rectangular-shaped or cylindrical shape, and it highly is the 140-180 micron.
10. the minitype inertial electrical switch of adjustable time of contact according to claim 1 is characterized in that, the gap between described poroelasticity beam fixed electrode and the cantilever array is the 10-40 micron.
CNB2007100476836A 2007-11-01 2007-11-01 Minitype inertial electrical switch capable of regulating and controlling contact time Expired - Fee Related CN100536055C (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNB2007100476836A CN100536055C (en) 2007-11-01 2007-11-01 Minitype inertial electrical switch capable of regulating and controlling contact time

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNB2007100476836A CN100536055C (en) 2007-11-01 2007-11-01 Minitype inertial electrical switch capable of regulating and controlling contact time

Publications (2)

Publication Number Publication Date
CN101174518A true CN101174518A (en) 2008-05-07
CN100536055C CN100536055C (en) 2009-09-02

Family

ID=39422937

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2007100476836A Expired - Fee Related CN100536055C (en) 2007-11-01 2007-11-01 Minitype inertial electrical switch capable of regulating and controlling contact time

Country Status (1)

Country Link
CN (1) CN100536055C (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101789329A (en) * 2010-03-19 2010-07-28 上海交通大学 Three-dimensional multidirectional-sensitive micromechanical inertial electrical switch
CN102254741A (en) * 2011-07-06 2011-11-23 重庆大学 Micro-mechanical acceleration switch
CN102426959A (en) * 2011-11-28 2012-04-25 上海交通大学 Three-dimensional multi-directional pressure switch applied to medical intervention and supported by annular spring
CN103840708A (en) * 2014-02-20 2014-06-04 东南大学 Hole-formed cantilever beam vibration and electromagnetism self-powered micro-sensor of internet of things radio frequency receiving-transmitting assembly
CN103840706A (en) * 2014-02-20 2014-06-04 东南大学 Perforated cantilever beam vibration energy self-powered microsensor of Internet-of-things radio frequency transceiving assembly
CN105225887A (en) * 2015-10-15 2016-01-06 上海交通大学 A kind of micro-mechanical inertia switch of tight constraint type level sensitivity
CN107074527A (en) * 2014-06-06 2017-08-18 斯蒂廷Vu-Vumc公司 The MEMS sensor structure of bearing spring is preloaded including machinery
CN107919254A (en) * 2017-10-30 2018-04-17 上海交通大学 A kind of electrostatic locking inertia switch with flexible array contact

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101789329A (en) * 2010-03-19 2010-07-28 上海交通大学 Three-dimensional multidirectional-sensitive micromechanical inertial electrical switch
CN101789329B (en) * 2010-03-19 2012-10-17 上海交通大学 Three-dimensional multidirectional-sensitive micromechanical inertial electrical switch
CN102254741A (en) * 2011-07-06 2011-11-23 重庆大学 Micro-mechanical acceleration switch
CN102254741B (en) * 2011-07-06 2013-12-18 重庆大学 Micro-mechanical acceleration switch
CN102426959A (en) * 2011-11-28 2012-04-25 上海交通大学 Three-dimensional multi-directional pressure switch applied to medical intervention and supported by annular spring
CN102426959B (en) * 2011-11-28 2014-01-15 上海交通大学 Three-dimensional multi-directional pressure switch applied to medical intervention and supported by annular spring
CN103840708A (en) * 2014-02-20 2014-06-04 东南大学 Hole-formed cantilever beam vibration and electromagnetism self-powered micro-sensor of internet of things radio frequency receiving-transmitting assembly
CN103840706A (en) * 2014-02-20 2014-06-04 东南大学 Perforated cantilever beam vibration energy self-powered microsensor of Internet-of-things radio frequency transceiving assembly
CN103840706B (en) * 2014-02-20 2016-04-13 东南大学 Perforate cantilever beam vibrational energy self-powered microsensor in Internet of Things radio-frequency receiving-transmitting assembly
CN103840708B (en) * 2014-02-20 2016-04-13 东南大学 Internet of Things radio-frequency receiving-transmitting assembly perforate cantilever beam vibration electromagnetism self-powered microsensor
CN107074527B (en) * 2014-06-06 2019-12-17 斯蒂廷Vu-Vumc公司 MEMS sensor structure including mechanically preloaded suspension springs
CN107074527A (en) * 2014-06-06 2017-08-18 斯蒂廷Vu-Vumc公司 The MEMS sensor structure of bearing spring is preloaded including machinery
US11267694B2 (en) 2014-06-06 2022-03-08 Stichting Vu-Vumc MEMS sensor structure comprising mechanically preloaded suspension springs
US10710870B2 (en) 2014-06-06 2020-07-14 Stichting Vu-Vumc MEMS sensor structure comprising mechanically preloaded suspension springs
CN105225887A (en) * 2015-10-15 2016-01-06 上海交通大学 A kind of micro-mechanical inertia switch of tight constraint type level sensitivity
CN107919254B (en) * 2017-10-30 2019-12-10 上海交通大学 Electrostatic locking inertial switch with flexible array contact
CN107919254A (en) * 2017-10-30 2018-04-17 上海交通大学 A kind of electrostatic locking inertia switch with flexible array contact

Also Published As

Publication number Publication date
CN100536055C (en) 2009-09-02

Similar Documents

Publication Publication Date Title
CN101174518A (en) Minitype inertial electrical switch capable of regulating and controlling contact time
CN101789329B (en) Three-dimensional multidirectional-sensitive micromechanical inertial electrical switch
CN101048840B (en) Spring structure for MEMS device
CN100477053C (en) Conjoined snakelike spring minimized inertial electrical switch
US20030006858A1 (en) Microelectromechanical (mems) switch using stepped actuation electrodes
CN1602428A (en) Accelerometer
CN106024507A (en) Electrostatic locking vertical sensitive micromechanical inertial switch
CN101699604B (en) Normally closed micro-mechanical inertia electrical switch
US20020145493A1 (en) Micro power switch
EP1672661A3 (en) MEMS switch and method of fabricating the same
CN112551474B (en) MEMS movable structure with in-plane stop
CN101516053A (en) Capacitor type microphone chip
CN109212261A (en) A kind of three axis threshold acceleration meters that can effectively avoid non-sensitive direction false triggering
US6613993B1 (en) Microrelay working parallel to the substrate
CN116364483B (en) High-impact quartz micro-switch
CN107919254B (en) Electrostatic locking inertial switch with flexible array contact
WO2003059805A3 (en) Micro device
CN102064039A (en) Micro-electromechanical system switch, motion sensor and motion sensing method
CN102306583A (en) Miniature pressure switch with three-dimensional multidirectional sensitivity property
CN104170048A (en) Rf micro-electro-mechanical system (MEMS) capacitive switch
CN201163820Y (en) Capacitor type microphone chip
CN207675296U (en) A kind of zigzag tread patterns threshold sensor for using spring structure as fixed electrode contacts
CN103926689B (en) MEMS reflecting systems array, MEMS reflecting systems and preparation method thereof
CN110021497B (en) Universal conduction micro-impact switch and preparation method thereof
CN201063851Y (en) Girder-like diaphragm and the composed microphone chip thereof

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20090902

Termination date: 20121101