CN112551474A - MEMS movable structure with in-plane stop - Google Patents
MEMS movable structure with in-plane stop Download PDFInfo
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- CN112551474A CN112551474A CN202011449368.8A CN202011449368A CN112551474A CN 112551474 A CN112551474 A CN 112551474A CN 202011449368 A CN202011449368 A CN 202011449368A CN 112551474 A CN112551474 A CN 112551474A
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- stop block
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0009—Structural features, others than packages, for protecting a device against environmental influences
- B81B7/0016—Protection against shocks or vibrations, e.g. vibration damping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00642—Manufacture or treatment of devices or systems in or on a substrate for improving the physical properties of a device
- B81C1/0065—Mechanical properties
- B81C1/00658—Treatments for improving the stiffness of a vibrating element
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00841—Cleaning during or after manufacture
- B81C1/00849—Cleaning during or after manufacture during manufacture
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0228—Inertial sensors
- B81B2201/0235—Accelerometers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0228—Inertial sensors
- B81B2201/0242—Gyroscopes
Abstract
The invention relates to an MEMS (micro-electromechanical system) movable structure with an in-plane stop, which comprises a fixed anchor area, an elastic beam of the movable structure, a mass block frame, a mass block, an elastic beam of the stop, a stop block, comb teeth of the mass block, drive comb teeth and anchor points of the drive comb teeth. The elastic beam is adopted to support the stop block, and when the mass block is excessively displaced and collides with the elastic beam, the elastic beam deforms to provide buffering, so that structural damage is avoided. The stop block and the mass block are connected on the same fixed anchor area and have the same electric potential, so that no electrical short circuit occurs. The elastic beam is provided with the stop blocks with different sizes at different positions, when the displacement of the mass block is overlarge, the mass block is firstly contacted with the stop block with the largest elongation, and when the displacement is continuously increased, the mass block is contacted with other stop blocks, so that the rigidity of the elastic beam of the stop block under large impact is improved, the impact displacement is reduced, the impact stop requirements of different sizes are met, and the structural damage is avoided. Reduce the area of contact between backstop structure and the quality piece, avoid the structure to cause because liquid surface tension adsorbs the adhesion in the cleaning process.
Description
Technical Field
The invention belongs to the technical field of manufacturing of Micro Electro Mechanical Systems (MEMS), and particularly relates to an MEMS device structure.
Background
MEMS devices are a new type of micromechanical instrument developed over the last two decades that utilizes semiconductor processing techniques to fabricate micromechanical structures. A typical MEMS device comprises a movable mass block structure, a spring beam, an anchor point, an electrode and the like, and can realize the measurement of physical quantities such as force, displacement, angular velocity and the like through different structural designs, and can also realize the functions of a resonator, a filter and the like so as to meet the requirements of different applications.
The resonant MEMS device controls the movement of the movable MEMS structure through the driving electrode, thereby meeting a certain specific requirement. MEMS gyroscopes and MEMS resonant accelerometers are typical of these. When the movable MEMS structure is impacted by the outside or the driving force is too large, large displacement can be generated in the moving direction, and the structure can be broken due to the too large displacement. The stop structure is designed in the moving direction of the movable MEMS structure, so that overlarge displacement can be avoided, and the structure damage is prevented. In addition, in the cleaning link of the movable MEMS structure after etching, adsorption is easy to generate due to the surface tension of the liquid. Due to the adoption of the design of the elastic stop block, the stop area is small, and the adsorption and adhesion of the structure can be avoided.
Disclosure of Invention
The technical problems solved by the invention are as follows: the invention provides an MEMS movable structure with an in-plane stop, which can avoid the structure fracture caused by overlarge structure displacement when the movable MEMS structure is subjected to large impact or large driving force in the moving direction. Meanwhile, the problem of structural adsorption adhesion caused by the surface tension of the liquid in the cleaning link of the movable structure after etching is avoided.
The technical scheme adopted by the invention is as follows:
an MEMS movable structure with an in-plane stop comprises a fixed anchor area, a movable structure elastic beam, a mass block frame, a mass block, a stop elastic beam, a first stop block, a second stop block, a third stop block, mass block comb teeth, drive comb teeth and drive comb tooth anchor points;
the mass block is connected to the fixed anchor region through the mass block frame and the movable structure elastic beam, is fixed on the substrate and is led out of the structure through the electrode; the first stop block, the second stop block and the third stop block are sequentially arranged on the stop block elastic beam from far to near from the fixed anchor area, and the stop block elastic beam is connected to the fixed anchor area;
the driving comb teeth are connected to the driving comb tooth anchor points, fixed on the substrate and led out of the structure through the electrodes; the mass block frame is connected with mass block comb teeth, and a drive capacitor with variable dead area is formed between the mass block comb teeth and the drive comb teeth.
Furthermore, high-voltage direct current and high-frequency alternating current signals are applied to a driving capacitor formed by the mass block comb teeth and the driving comb teeth, and electrostatic force is provided for the mass block frame and the mass block to enable the mass block frame and the mass block to vibrate in the horizontal direction; and adjusting the frequency of the high-frequency alternating current signal to be consistent with the natural vibration frequency of the structure, generating resonance and achieving the maximum amplitude.
Further, the natural vibration frequency of the structure is determined by the total mass of the elastic beam and the movable structure of the movable structure.
Further, when the MEMS movable structure is impacted or the driving force is too large in the horizontal direction, and the displacement is too large, the mass block can be contacted with the first stop block, the second stop block and the third stop block; the elastic beam of the stop block is elastically deformed, so that the effects of buffering and reducing impact force are achieved, the structural damage is avoided, and the structural adhesion is prevented.
Furthermore, the first stop block, the second stop block, the third stop block and the mass block are connected on the same fixed anchor area and have the same electric potential, and no electrical short circuit occurs when the structure is impacted.
Further, the first stop block, the second stop block and the third stop block have different sizes, the stop block which is farther away from the fixed anchor area extends out of the elastic beam of the stop block for a longer length, when the mass block moves and displaces excessively, the mass block firstly contacts the first stop block, the first stop block provides supporting force, and meanwhile, the elastic beam of the stop block bends to buffer;
the displacement is continuously increased, the mass block contacts the second stop block, the first stop block and the second stop block jointly improve the supporting force, the deformation of the stop block elastic beam between the first stop block and the second stop block is kept, and the deformation quantity is equal to the length difference of the two stop blocks extending out of the stop block elastic beam; the deformation between the second stop block and the fixed anchor area is continuously increased, and the rigidity of the elastic beam is improved;
when the displacement is further increased, the mass block is contacted with the third stop block, the three stop blocks jointly provide supporting force, the deformation between the first stop block and the third stop block is kept, the deformation amount is equal to the length difference of the elastic beam of the stop blocks extending out of the two stop blocks, the deformation between the first stop block and the fixed anchor block is continuously increased, and the rigidity of the elastic beam is further improved.
Further, the first stop block, the second stop block and the third stop block extend out of the elastic beam of the stop block by a length proportional to the distance between the elastic beam and the fixed anchor area.
Further, the first stop block, the second stop block and the third stop block are arranged at equal intervals.
Compared with the prior art, the invention has the beneficial effects that:
(1) the elastic beam is adopted to support the stop block structure, when the mass block collides with the stop block, the elastic beam deforms to provide buffering, impact force is reduced, and structural damage is avoided.
(2) The stop block and the mass block are connected on the same fixed anchor area, and the stop block and the mass block have the same electric potential and cannot generate electrical short circuit.
(3) The stop blocks with different sizes are designed at different positions of the elastic beam, when the displacement of the mass block is overlarge, the mass block is firstly contacted with the stop block with the largest elongation, and when the displacement is continuously increased, the mass block is contacted with other stop blocks. The rigidity of the elastic beam of the stop block is improved under large impact, the impact displacement is reduced, the requirements of impact stops of different sizes are met, and the structural damage is avoided.
(4) Reduce the area of contact between structure and the quality piece of keeping off, avoid the structure to cause because liquid surface tension adsorbs the adhesion in the cleaning process.
Drawings
FIG. 1 is a schematic diagram of a MEMS moveable structure with in-plane stops according to the present invention
Detailed Description
The invention is further explained with reference to the drawings.
As shown in fig. 1, the present invention provides an MEMS movable structure with an in-plane stop, which includes a fixed anchor region 1, a movable structure elastic beam 2, a mass frame 3, a mass 4, a stop elastic beam 5, a first stop block 6, a second stop block 7, a third stop block 8, a mass comb 9, a driving comb 10, and a driving comb anchor point 11;
the mass block 4 is connected to the fixed anchor region 1 through the mass block frame 3 and the movable structure elastic beam 2, is fixed on the substrate and is led out of the structure through the electrodes; the first stop block 6, the second stop block 7 and the third stop block 8 are sequentially arranged on the stop block elastic beam 5 from far to near from the fixed anchor area 1, and the stop block elastic beam 5 is connected to the fixed anchor area 1;
the driving comb 10 is connected to a driving comb anchor point 11, fixed on the substrate and led out of the structure through an electrode; the mass block frame 3 is connected with mass block comb teeth 9, and a driving capacitor with variable dead area is formed between the mass block comb teeth 9 and the driving comb teeth 10.
Applying high-voltage direct current and high-frequency alternating current signals to a driving capacitor formed by the mass block comb teeth 9 and the driving comb teeth 10 to provide electrostatic force for the mass block frame 3 and the mass block 4 so as to enable the mass block to vibrate in the horizontal direction; and adjusting the frequency of the high-frequency alternating current signal to be consistent with the natural vibration frequency of the structure, generating resonance and achieving the maximum amplitude.
Preferably, the natural frequency of the structure is determined by the total mass of the movable structure elastic beam 2 and the movable structure.
Preferably, the MEMS movable structure with the in-plane stopper in the embodiment of the present invention is a symmetrical structure, which is symmetrical up and down and symmetrical left and right along the axis passing through the center of the mass. The upper side and the lower side of the mass block 4 are both connected with mass block frames 3, and the mass block frames 3 are connected to the fixed anchor area 1 through stop block elastic beams 5 to form electric communication.
Preferably, when the MEMS movable structure is impacted or the driving force is too large in the horizontal direction, causing too large displacement, the mass 4 will come into contact with the first, second and third stop blocks 6, 7, 8; the elastic beam 5 of the stop block is elastically deformed, so that the effects of buffering and reducing impact force are achieved, the structural damage is avoided, and the structural adhesion is prevented.
The invention adopts the structure that the elastic beam supports the stop block, and when the mass block collides with the stop block, the elastic beam deforms to provide buffer, thereby reducing the impact force and avoiding the structural damage.
Preferably, the first stop 6, the second stop 7, the third stop 8 are coupled to the mass 4 on the same fixed anchoring zone 1, having the same electrical potential, and the structure does not electrically short upon impact.
Preferably, the first stop block 6, the second stop block 7 and the third stop block 8 have different sizes, the stop block farther from the fixed anchor region 1 extends out of the stop block elastic beam 5 for a longer length, and when the mass block 4 moves and displaces excessively, the first stop block 6 is contacted first, the first stop block 6 provides a supporting force, and the stop block elastic beam 5 bends to buffer;
the displacement continues to increase, the mass block 4 contacts the second stop block 7, the first stop block 6 and the second stop block 7 jointly improve the supporting force, the deformation of the stop block elastic beam 5 between the first stop block 6 and the second stop block 7 is kept, and the deformation quantity is equal to the length difference of the two stop blocks extending out of the stop block elastic beam 5; the deformation between the second stop block 7 and the fixed anchor area 1 is continuously increased, and the rigidity of the elastic beam is improved;
when the displacement is further increased, the mass block 4 is contacted with the third stop block 8, the three stop blocks jointly provide supporting force, the deformation between the first stop block 6 and the third stop block 8 is kept, the deformation amount is equal to the length difference of the two stop blocks extending out of the stop block elastic beam 5, the deformation between the first stop block 6 and the fixed anchor area 1 is continuously increased, and the rigidity of the elastic beam is further improved.
Preferably, the first, second and third stop blocks 6, 7, 8 extend beyond the stop block spring beam 5 by a length proportional to its distance from the anchor region 1.
Preferably, the first stop block 6, the second stop block 7 and the third stop block 8 are arranged at equal intervals.
According to the invention, the stop blocks with different sizes are designed at different positions of the elastic beam, when the displacement of the mass block is overlarge, the mass block is firstly contacted with the stop block with the largest elongation, and when the displacement is continuously increased, the mass block is contacted with other stop blocks. The rigidity of the elastic beam of the stop block is improved under large impact, the impact displacement is reduced, the requirements of impact stops of different sizes are met, and the structural damage is avoided. Meanwhile, the contact area between the supporting and blocking structure and the mass block can be reduced due to the design of the three stop blocks, and the adsorption adhesion of the structure due to the surface tension of the liquid in the cleaning process is avoided.
The above description is only for the best mode of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention.
Parts of the present invention not described in detail in the specification are within the common general knowledge of those skilled in the art.
Claims (8)
1. A MEMS moveable structure having an in-plane stop, characterized by: the device comprises a fixed anchor area (1), a movable structure elastic beam (2), a mass block frame (3), a mass block (4), a stop elastic beam (5), a first stop block (6), a second stop block (7), a third stop block (8), mass block comb teeth (9), driving comb teeth (10) and driving comb tooth anchor points (11);
the mass block (4) is connected to the fixed anchor region (1) through a mass block frame (3) and the movable structure elastic beam (2), is fixed on the substrate and is led out of the structure through electrodes; the first stop block (6), the second stop block (7) and the third stop block (8) are sequentially arranged on the stop block elastic beam (5) from far to near from the fixed anchor area (1), and the stop block elastic beam (5) is connected to the fixed anchor area (1);
the driving comb teeth (10) are connected to driving comb tooth anchor points (11), fixed on the substrate and led out of the structure through electrodes; the mass block frame (3) is connected with mass block comb teeth (9), and a drive capacitor with variable dead area is formed between the mass block comb teeth (9) and the drive comb teeth (10).
2. The MEMS moveable structure with in-plane stop of claim 1 wherein: high-voltage direct current and high-frequency alternating current signals are applied to a driving capacitor formed by the mass block comb teeth (9) and the driving comb teeth (10), and electrostatic force is provided for the mass block frame (3) and the mass block (4) to enable the mass block frame to vibrate in the horizontal direction; and adjusting the frequency of the high-frequency alternating current signal to be consistent with the natural vibration frequency of the structure, generating resonance and achieving the maximum amplitude.
3. The MEMS moveable structure with in-plane stop of claim 2 wherein: the natural vibration frequency of the structure is determined by the total mass of the movable structure elastic beam (2) and the movable structure.
4. The MEMS moveable structure with in-plane stop of claim 2 wherein: when the MEMS movable structure is impacted or the driving force is too large in the horizontal direction, so that the displacement is too large, the mass block (4) can be contacted with the first stop block (6), the second stop block (7) and the third stop block (8); the stop block elastic beam (5) is elastically deformed, so that the effects of buffering and reducing impact force are achieved, the structural damage is avoided, and the structural adhesion is prevented.
5. The MEMS moveable structure with in-plane stop of claim 4 wherein: the first stop block (6), the second stop block (7), the third stop block (8) and the mass block (4) are connected on the same fixed anchor area (1) and have the same electric potential, and no electrical short circuit occurs when the structure is impacted.
6. The MEMS moveable structure with in-plane stop of claim 5 wherein: the first stop block (6), the second stop block (7) and the third stop block (8) have different sizes, the farther the stop block is away from the fixed anchor area (1), the longer the stop block extends out of the stop block elastic beam (5), when the mass block (4) moves and displaces excessively, the first stop block (6) is contacted first, the first stop block (6) provides supporting force, and meanwhile, the stop block elastic beam (5) bends to buffer;
the displacement is continuously increased, the mass block (4) is contacted with the second stop block (7), the first stop block (6) and the second stop block (7) jointly improve the supporting force, the deformation of the stop block elastic beam (5) between the first stop block (6) and the second stop block (7) is kept, and the deformation quantity is equal to the length difference of the two stop blocks extending out of the stop block elastic beam (5); the deformation between the second stop block (7) and the fixed anchor area (1) is continuously increased, and the rigidity of the elastic beam is improved;
when the displacement is further increased, the mass block (4) is contacted with the third stop block (8), the three stop blocks provide supporting force together, the deformation between the first stop block (6) and the third stop block (8) is kept, the deformation amount is equal to the length difference of the two stop blocks extending out of the stop block elastic beam (5), the deformation between the first stop block (6) and the fixed anchor area (1) is continuously increased, and the rigidity of the elastic beam is further improved.
7. The MEMS moveable structure with in-plane stop of claim 6 wherein: the length of the first stop block (6), the second stop block (7) and the third stop block (8) extending out of the stop block elastic beam (5) is proportional to the distance between the first stop block and the fixed anchor area (1).
8. The MEMS moveable structure with in-plane stop of claim 7 wherein: the first stop block (6), the second stop block (7) and the third stop block (8) are arranged at equal intervals.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011449368.8A CN112551474B (en) | 2020-12-09 | 2020-12-09 | MEMS movable structure with in-plane stop |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011449368.8A CN112551474B (en) | 2020-12-09 | 2020-12-09 | MEMS movable structure with in-plane stop |
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| CN112551474A true CN112551474A (en) | 2021-03-26 |
| CN112551474B CN112551474B (en) | 2022-05-24 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113280967A (en) * | 2021-05-08 | 2021-08-20 | 杭州电子科技大学 | Three-dimensional decoupling force touch sensor and MEMS (micro-electromechanical systems) preparation method |
| CN114234949A (en) * | 2021-11-16 | 2022-03-25 | 北京航天控制仪器研究所 | Anti-overload MEMS movable structure with strain self-offset function |
| CN115586380A (en) * | 2022-11-03 | 2023-01-10 | 南方电网数字电网研究院有限公司 | Miniature electric field sensor |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010026147A (en) * | 2008-07-17 | 2010-02-04 | Panasonic Electric Works Co Ltd | Movable structure and optical scanning mirror using the same |
| CN101786591A (en) * | 2009-01-27 | 2010-07-28 | 罗伯特·博世有限公司 | Micro-mechanical device and manufacture method thereof |
| CN105480932A (en) * | 2016-01-04 | 2016-04-13 | 歌尔声学股份有限公司 | Adhesion eliminating structure of inertial sensor and method thereof |
| US20170082519A1 (en) * | 2015-09-22 | 2017-03-23 | Murata Manufacturing Co., Ltd. | Semi-flexible proof-mass |
| US20180354780A1 (en) * | 2015-04-09 | 2018-12-13 | Rensselaer Polytechnic Institute | Enhanced control of shuttle mass motion in mems devices |
| CN109188012A (en) * | 2018-11-15 | 2019-01-11 | 中国兵器工业集团第二四研究所苏州研发中心 | A kind of micro- stop configurations of honeycomb |
| CN111766403A (en) * | 2020-07-20 | 2020-10-13 | 西安交通大学 | Comb micro-accelerometer resisting high-g-value impact and preparation method thereof |
-
2020
- 2020-12-09 CN CN202011449368.8A patent/CN112551474B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010026147A (en) * | 2008-07-17 | 2010-02-04 | Panasonic Electric Works Co Ltd | Movable structure and optical scanning mirror using the same |
| CN101786591A (en) * | 2009-01-27 | 2010-07-28 | 罗伯特·博世有限公司 | Micro-mechanical device and manufacture method thereof |
| US20180354780A1 (en) * | 2015-04-09 | 2018-12-13 | Rensselaer Polytechnic Institute | Enhanced control of shuttle mass motion in mems devices |
| US20170082519A1 (en) * | 2015-09-22 | 2017-03-23 | Murata Manufacturing Co., Ltd. | Semi-flexible proof-mass |
| CN105480932A (en) * | 2016-01-04 | 2016-04-13 | 歌尔声学股份有限公司 | Adhesion eliminating structure of inertial sensor and method thereof |
| CN109188012A (en) * | 2018-11-15 | 2019-01-11 | 中国兵器工业集团第二四研究所苏州研发中心 | A kind of micro- stop configurations of honeycomb |
| CN111766403A (en) * | 2020-07-20 | 2020-10-13 | 西安交通大学 | Comb micro-accelerometer resisting high-g-value impact and preparation method thereof |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113280967A (en) * | 2021-05-08 | 2021-08-20 | 杭州电子科技大学 | Three-dimensional decoupling force touch sensor and MEMS (micro-electromechanical systems) preparation method |
| CN114234949A (en) * | 2021-11-16 | 2022-03-25 | 北京航天控制仪器研究所 | Anti-overload MEMS movable structure with strain self-offset function |
| CN115586380A (en) * | 2022-11-03 | 2023-01-10 | 南方电网数字电网研究院有限公司 | Miniature electric field sensor |
| CN115586380B (en) * | 2022-11-03 | 2024-01-23 | 南方电网数字电网研究院有限公司 | Miniature electric field sensor |
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