CN101174102A - Exposure device - Google Patents

Exposure device Download PDF

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Publication number
CN101174102A
CN101174102A CNA2007101540717A CN200710154071A CN101174102A CN 101174102 A CN101174102 A CN 101174102A CN A2007101540717 A CNA2007101540717 A CN A2007101540717A CN 200710154071 A CN200710154071 A CN 200710154071A CN 101174102 A CN101174102 A CN 101174102A
Authority
CN
China
Prior art keywords
film mask
mask
substrate
mentioned
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2007101540717A
Other languages
Chinese (zh)
Inventor
五十岚晃
今井洋之
川俣晴男
杉田健一
江部克己
田口阳介
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ADITECH ENGINEERING Co Ltd
Adtec Engineering Co Ltd
Original Assignee
ADITECH ENGINEERING Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ADITECH ENGINEERING Co Ltd filed Critical ADITECH ENGINEERING Co Ltd
Publication of CN101174102A publication Critical patent/CN101174102A/en
Pending legal-status Critical Current

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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216Mask projection systems
    • G03F7/7035Proximity or contact printers

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

The invention provides an exposure device which is high in accuracy and can have the exposure time shortened. A lighthouse (1) is elevated so as to contact a film mask (2) to a substrate (90) and then to form an enclosed place (40). A pressure reducing pump (60) is used for reducing the pressure. A one-time enclosure between the film mask (2) and the substrate (90) is conducted. Then, a pressurized air with a pressure ranging from 1kPa to 20kPa is led in from a guide hole (52), thus forming a pressuring space (25) between the film mask (2) and a piece of glass (30). The film mask (2) and the substrate (90) are further sealed, thus completing a second enclosure. As the first enclosure has made the film mask (2) and the substrate (90) sealed, a small amount of air in the guide hole (52) can be led in, and also a small amount of air is blown out under the inflation during the pressurizing. So the inside guide of the air can be fulfilled in a short period of time, without such defect as the deformation due to the inflation of the film mask (2).

Description

Exposure device
Technical field
The present invention relates to be used for the exposure device of printed circuit board.
Background technology
Printed circuit board was to use exposure device to make in recent years, use photoengraving (photolithography) method as manufacture method, this method is to burn by the sensitization on the substrate surface that has been coated with photoresist photosensitive materials such as (photoresist) of this exposure device to go up predetermined pattern, forms pattern by etching work procedure on substrate afterwards.
In this exposure device, generally speaking, mainly use resin film mask as the master of describing the former figure of pattern, on the mask keeper of glass, keep this film mask to use.And, adopt vacuumizing the so-called vacuum adhesion method that makes their driving fits between the two mostly in order to improve the adaptation between this film mask and the substrate.
This vacuum driving fit mode is effectively under the smooth situation of substrate surface, if but on substrate surface, have concavo-convex or rise and fall, then mask is not followed substrate and is caused installing bad sometimes.
Therefore proposed to attempt the vacuum driving fit after unlimited and make the film mask follow the method for substrate (patent documentation 1) and the method (patent documentation 2) of before the vacuum driving fit, pressurizeing to the rear side importing air of film mask in advance etc. between film mask and the mask keeper towards atmosphere.
Patent documentation 1: Japanese kokai publication hei 5-333555 communique
Patent documentation 2: Japanese kokai publication hei 8-50357 communique
But, adopting under the situation that makes the method for opening wide towards atmosphere between film mask and the mask keeper of patent documentation 1, have owing to insufficient pressure and can't obtain the problem of driving fit film mask sufficiently.And can only use the pressure of this constant pressure of atmospheric pressure, it is difficult by changing pressure obtains best adaptation according to various conditions problem to exist.
On the other hand, constituting under the situation of in advance rear side of film mask being pressurizeed before the vacuum seal of employing patent documentation 2, has the elongated problem of time of the operation of causing the driving fit film owing to the pressurization meeting is consuming time.And there is a problem with possibility that film mask elongation etc. produces distortion etc.
Summary of the invention
The objective of the invention is to solve above-mentioned problem of the prior art.
For reaching above-mentioned purpose, exposure device of the present invention is characterised in that this exposure device has: the exposure desk of the substrate that mounting is exposed; Described to treat the film mask of exposing patterns at the substrate that is exposed; The mask keeper, it keeps this film mask on the face of above-mentioned exposure desk side, and driving fit film mask around, can import fluid between itself and the film mask; Make above-mentioned exposure desk and the approaching propulsion system of mask keeper; Packoff, it near the space that seals between above-mentioned exposure desk and the mask keeper, forms the seal cavity that holds aforesaid substrate and film mask by above-mentioned; 1 driving fit unit, it reduces pressure to above-mentioned seal cavity, and makes above-mentioned film mask and substrate carry out 1 driving fit; And 2 driving fit unit, it imports fluid with predetermined pressure between above-mentioned film mask and aforementioned mask keeper after above-mentioned decompressing unit has been carried out 1 driving fit, make above-mentioned film mask and the further driving fit of substrate.
In said structure since under the state that makes film mask and substrate driving fit by 1 driving fit unit by 2 driving fit unit importing fluids, so the import volume of fluid is less, can significantly shorten the importing time.And since under the state of driving fit to film mask pressurization, so be difficult to produce the elongation of film mask or distortion etc.
And,, obtain best adaptation thereby can tackle various conditions by changing the predetermined pressure of the fluid that is imported.
Above-mentioned predetermined pressure is more than the 1kPa and below the 20kPa.This be because, if 1kPa can't obtain sufficient sealing property with next, and when being the danger that 20kPa has glass breakage etc. when above.
And then, more preferably select in the scope more than 2kPa and below the 10kPa.As mentioned above, select hydrodynamic pressure, but can obtain best adaptation in the scope more than 2kPa and below the 10kPa according to various conditions.
Also preferably have the pressure more than the 1kPa and below the 20kPa is remained constant regulator.
According to exposure device of the present invention, owing to can be best thereby make the adaptation of film mask and substrate, so can carry out high-precision exposure by changing the pressure of the fluid that is imported according to condition.And import sealing down owing to can also carry out fluid with the short time, so the time shutter also can shorten, have the effect of the elongation that is difficult for generation film mask or distortion etc.
Description of drawings
Fig. 1 is the synoptic diagram of expression an embodiment of the invention.
Fig. 2 is the key diagram of the action of expression an embodiment of the invention.
Fig. 3 is the key diagram of the action of expression an embodiment of the invention.
Fig. 4 is the key diagram of the action of expression an embodiment of the invention.
Fig. 5 is the synoptic diagram of expression another embodiment of the present invention.
Symbol description
1: exposure desk; 2: film mask (film mask); 3: the mask keeper; 4: the driving fit parts; 5: pressue device; 6: reliever; 7: the pressurization film; 8: control device; 9: light source; 20: driving fit portion; 25: pressurization space; 30: glass; 40: seal cavity; 50: air source; 51: regulator; 52: entrance hole; 60: drawdown pump; 61: vent; 90: substrate; 91: recess.
Embodiment
With reference to the accompanying drawings the embodiment that is used to make the exposure device of printed circuit board of the present invention is described below.
In Fig. 1, be applied in the substrate 90 that the printed wiring of photoresist is used, be positioned on the exposure desk 1.Exposure desk 1 can move on the XY direction, and can lifting on above-below direction.It can also rotate in the horizontal direction.Omission about these move, the explanation of lifting and rotating mechanism.
The film mask 2 of describing circuit pattern is provided with facing to substrate 90, makes this film mask 2 and substrate 90 driving fits, by burning circuit pattern on the substrate 90 from the exposure of light source 9.
And, though in Fig. 1, on above-below direction, set exposure desk 1 and substrate 90, being not limited to this, also can set on the contrary, perhaps also can take exposure desk 1 and substrate 90 are vertically erect the structure that is configured.
In addition, moving substrate 90 and moving exposure platform 1 can not constitute yet and move the two.
Film mask 2 is maintained at substrate 90 sides of mask keeper 3.Mask keeper 3 has glass 30 at central portion, constitutes to make from the light transmission glass 30 of light source 9 and burning the pattern of describing on the substrate 90 on film mask 2.
With 3 driving fits of mask keeper, can between film mask 2 and mask keeper 3 (glass 30), import fluid in film mask 2 driving fit portion 20 around it.
Can between film mask 2 and mask keeper 3, import the air of predetermined pressure by pressue device 5.Entrance hole 52 is opened on the inboard of above-mentioned driving fit portion 20, and this entrance hole 52 is connected with air source 50 via regulator 51.Import between glass 30 and the film mask 2 from entrance hole 52 by the air of regulator 51 predetermined pressure.Film mask 2 constitutes: with 3 driving fits of mask keeper, the central part side is a seal cavity in driving fit portion 20, bloats to the expansion of substrate 90 directions by this air that is imported into, and has formed pressurization space 25.
Pressue device 5 constitutes: controlled device 8 controls, between the air importing glass 30 and film mask 2 with predetermined pressure, keep this pressure in the given time.
The pressure of the air that is imported is selected in the scope more than 1kPa and below the 20kPa as mentioned above, is preferably in the scope more than 2kPa and below the 10kPa to select.
Also constitute by pressue device 5 this pressure is maintained to end exposure till.
Constitute and around exposure desk 1, be provided with seal member 4, the space between exposure desk 1 and the mask keeper 3 is formed seal cavity 40.That is, if exposure desk 1 is risen towards mask keeper 3 directions, then seal member 4 contacts with mask keeper 3, and sealing between exposure desk 1 and the mask keeper 3 is formed seal cavity 40.
Be connected with reliever 6 on exposure desk 1, vent 61 is opened in the seal cavity 40.Vent 61 is connected with drawdown pump 60, constitutes by the driving of drawdown pump 60 seal cavity 40 decompressions.Also controlled device 8 controls of reliever 6.
In said structure, when mounting substrate 90 on exposure desk 1,, substrate 90 and film mask 2 are positioned to XY and θ direction moving exposure platform 1.Next promote exposure desk 1, seal member 4 is contacted with mask keeper 3 form seal cavity 40, film mask 2 is contacted with substrate 90, control reliever 6 again and drive drawdown pump 60, seal cavity 40 decompressions.Come film mask 2 and substrate 90 are carried out 1 driving fit by decompression.
Fig. 3 schematically shows the state of 1 driving fit.If there is recess 91 etc. on substrate 90, then only film mask 2 can't driving fit on the part of recess 91 with the decompression to seal cavity 40.
Then, start pressue device 5, as shown in Figure 2,, between film mask 2 and glass 30, form pressurization space 25, further make film mask 2 and substrate 90 driving fits from the air of entrance hole 52 importing predetermined pressures.2 driving fits that Here it is.Fig. 4 schematically shows the state of 2 driving fits, and film mask 2 is also followed recess 91 and driving fit.
Because by 1 driving fit, film mask 2 is in the state of driving fit with substrate 90, so seldom get final product from the air import volume of entrance hole 52, can finish importing at short notice.And because film mask 2 is in the state of sealing, so add the swell increment depressed also seldom, the volume of pressurization space 25 is also very little.Thereby there is not a drawback of distortion due to the expansion of film mask 2 etc.
Control device 8 control regulators 51 are kept the pressure of pressurization space 25, keep the closed state of film mask 2.
And, can control regulator 51 to adjust the pressure of the air that is imported according to the various conditions such as state on substrate 90 surfaces, can realize 2 driving fits of the best of the condition that is suitable for.
Under the state of Fig. 2, expose by light from light source 9, stop the driving of pressue device 5 and reliever 6, exposure desk 1 is fallen, take off substrate 90, deliver to subsequent processing, finish exposure.
Fig. 5 represents another embodiment.Constitute in the present embodiment: use pressurization film 7, in the driving fit portion 20 pressurization film 7 is being attached on the mask keeper 3, film mask 2 is installed on the pressurization film 7.
Under this structure and since need not to make film mask 2 around with 3 driving fits of mask keeper, so be easy to install and take off film mask 2, have and change easy advantage.

Claims (4)

1. an exposure device is characterized in that, this exposure device has:
The exposure desk of the substrate that mounting is exposed;
Described to treat the film mask of exposing patterns at the substrate that is exposed;
The mask keeper, it keeps this film mask on the face of above-mentioned exposure desk side, and driving fit film mask around, can import fluid between itself and the film mask;
Make above-mentioned exposure desk and the approaching propulsion system of mask keeper;
Packoff, it near the space that seals between above-mentioned exposure desk and the mask keeper, forms the seal cavity that holds aforesaid substrate and film mask by above-mentioned;
1 driving fit unit, it reduces pressure to above-mentioned seal cavity, and makes above-mentioned film mask and substrate carry out 1 driving fit; And
2 driving fit unit, it imports fluid with predetermined pressure between above-mentioned film mask and aforementioned mask keeper after above-mentioned decompressing unit has been carried out 1 driving fit, make above-mentioned film mask and the further driving fit of substrate.
2. exposure device according to claim 1 is characterized in that, above-mentioned predetermined pressure is more than the 1kPa and below the 20kPa.
3. exposure device according to claim 1 is characterized in that, above-mentioned 2 driving fit unit also have regulator, and this regulator imports more than the 1kPa and the fluid of the predetermined pressure below the 20kPa, and this pressure is kept constant.
4. exposure device according to claim 1 is characterized in that, this exposure device also has pressurization and uses film, and this pressurization is arranged between above-mentioned film mask and the mask keeper with film, is used for to substrate pushing film mask.
CNA2007101540717A 2006-10-30 2007-09-13 Exposure device Pending CN101174102A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006294405 2006-10-30
JP2006294405A JP2008111969A (en) 2006-10-30 2006-10-30 Exposure apparatus

Publications (1)

Publication Number Publication Date
CN101174102A true CN101174102A (en) 2008-05-07

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Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2007101540717A Pending CN101174102A (en) 2006-10-30 2007-09-13 Exposure device

Country Status (4)

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JP (1) JP2008111969A (en)
KR (1) KR20080039202A (en)
CN (1) CN101174102A (en)
TW (1) TW200819921A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101943866A (en) * 2009-07-03 2011-01-12 株式会社日立高新技术 Exposure device
CN101996919A (en) * 2009-08-25 2011-03-30 佳能安内华股份有限公司 Substrate holding apparatus, mask alignment method, and vacuum processing apparatus

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101600810B1 (en) 2014-05-12 2016-03-08 주식회사 옵티레이 Roll to roll exposure device
JP6494360B2 (en) * 2015-03-25 2019-04-03 株式会社ディスコ Expansion unit
DE102019130021A1 (en) * 2019-11-07 2021-05-12 Bayerische Motoren Werke Aktiengesellschaft Method for producing a hologram on a curved substrate wafer, resulting substrate wafer with hologram and a wafer composite containing this, in particular a vehicle window

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63226925A (en) * 1987-03-16 1988-09-21 Nec Corp Mask contact printer
JP3099841B2 (en) * 1991-11-21 2000-10-16 株式会社アドテックエンジニアリング Exposure equipment using film mask
JPH05333555A (en) * 1992-05-29 1993-12-17 Iwasaki Electric Co Ltd Exposure method for printed circuit board
JPH0850357A (en) * 1994-08-05 1996-02-20 Adtec Eng:Kk Exposing device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101943866A (en) * 2009-07-03 2011-01-12 株式会社日立高新技术 Exposure device
CN101943866B (en) * 2009-07-03 2012-10-10 株式会社日立高新技术 Exposure device
CN101996919A (en) * 2009-08-25 2011-03-30 佳能安内华股份有限公司 Substrate holding apparatus, mask alignment method, and vacuum processing apparatus
CN101996919B (en) * 2009-08-25 2012-07-25 佳能安内华股份有限公司 Substrate holding apparatus, mask alignment method, and vacuum processing apparatus

Also Published As

Publication number Publication date
JP2008111969A (en) 2008-05-15
TW200819921A (en) 2008-05-01
KR20080039202A (en) 2008-05-07

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Open date: 20080507