JP6018405B2 - Imprint apparatus, imprint method, and article manufacturing method - Google Patents

Description

  The present invention relates to an imprint apparatus, an imprint method, and an article manufacturing method.

  Imprint technology is attracting attention as a new technology that replaces photolithography technology. The imprint technique is a technique in which a resin is applied to a substrate and the pattern of the mold is transferred to the resin by curing the resin while the mold is in contact with the resin.

  It is known that when air bubbles are present in the resin applied to the substrate, a defect occurs in the resin pattern formed by imprinting. Patent Documents 1 and 2 disclose a method of filling the space between the substrate and the mold with helium or carbon dioxide having high diffusibility and / or solubility in a resin as a countermeasure against such a problem.

Special table 2007-509769 gazette JP 2009-532245 A

  The gas can be supplied to the space between the substrate and the mold by a gas supply unit arranged around the mold. In addition, the application of the resin to the substrate or the shot region of the substrate can be performed by an application unit disposed at a position away from the mold. Therefore, when the substrate is driven so that the resin applied to the substrate is positioned under the mold, the gas supplied onto the substrate by the gas supply unit also moves together with the gas, The surrounding air is mixed. Therefore, the concentration of the gas supplied onto the substrate by the gas supply unit is lowered, and there is a possibility that a desired effect relating to bubble suppression may not be obtained.

  The present invention has been made in recognition of the above problems, and an object of the present invention is to provide an advantageous technique for replacing the air in the space between the substrate and the mold with another gas.

An imprint apparatus according to one aspect of the present invention includes a mold driving unit that brings a mold into contact with a resin on a substrate or pulls the mold away from the resin, a substrate driving unit that drives the substrate, A curing unit configured to cure the resin in a state where the mold is in contact with the resin on the substrate; and a gas supply unit configured to supply a gas onto the substrate, wherein the gas supply unit is provided on the substrate. Gas is supplied onto the substrate during a period in which the substrate driving unit drives the substrate so that the resin is positioned under the mold, and the mold driving unit is configured to supply the substrate by the gas supply unit. After the gas supply to the substrate is started, the substrate and the mold are in a period in which the substrate driving unit drives the substrate so that the resin on the substrate is positioned under the mold. Gap between the substrate and the mold in a state of facing each other Smaller.

  According to the present invention, an advantageous technique is provided for replacing the air in the space between the substrate and the mold with another gas.

The figure explaining the imprint apparatus in 1st Embodiment of this invention, and its operation | movement. The operation of the comparative example will be described. The figure explaining the imprint apparatus in 2nd Embodiment of this invention, and its operation | movement. The figure explaining the imprint apparatus in 3rd Embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

  An imprint apparatus 100 according to a first embodiment of the present invention will be described with reference to FIG. The imprint apparatus 100 includes a coating unit 5, a substrate driving unit 20, a mold driving unit 4, a curing unit 16, a gas supply unit 7, and a control unit CNT. The control unit CNT controls the coating unit 5, the substrate driving unit 20, the mold driving unit 4, the curing unit 16, and the gas supply unit 7.

  The application unit 5 applies a resin to the substrate 1. The substrate driving unit 20 drives the substrate 1. The substrate driving unit 20 can include, for example, a substrate stage 6 having a chuck that holds the substrate 1 and an actuator 15 (for example, a linear motor) that drives the substrate stage 6. The mold driving unit 4 brings the mold 3 (more specifically, the pattern portion P of the mold 3) into contact with the resin 2 applied to the substrate 1 by the applying unit 5, or from the cured resin 2 to the mold 3 ( The mold 3 is driven so as to separate the pattern portion P).

  The curing unit 16 cures the resin 2 in a state where the mold 3 is in contact with the resin 2. For example, the curing unit 16 cures the resin 2 by irradiating the resin 2 with light. In the case where an ultraviolet curable resin is used for the resin 2, the curing unit 16 includes a light source that irradiates ultraviolet rays. A light source can be determined according to the kind of resin 2 to be used. The gas supply unit 7 supplies the gas G onto the substrate 1 so that the gas G is supplied to the space between the substrate 1 and the mold 3 (particularly, the pattern portion P of the mold 3). The gas G is, for example, a gas having higher diffusibility and / or solubility in the resin 2 than air, and may be, for example, helium gas or carbon dioxide gas. For example, the gas supply unit 7 may be disposed between the mold driving unit 4 and the coating unit 5.

  Here, the reason why the gas G is supplied to the space between the substrate 1 and the mold 3 (particularly, the pattern portion P of the mold 3) will be described. If the resin 2 is cured by the curing unit 16 in a state where bubbles are present in the resin 2 applied to the substrate 1 by the application unit 5, defects may occur in the pattern formed by the resin 2. For example, bubbles may be generated when the application unit 5 applies the resin 2 to the substrate 1 or when the mold driving unit 4 drives the mold 3 to bring the pattern portion P of the mold 3 into contact with the resin 2. The pattern portion P has a concave portion and a convex portion constituting the pattern, and air existing in the concave portion can move into the resin 2 after the pattern portion P is brought into contact with the resin 2 to form bubbles. Therefore, it is desired to suppress the generation of bubbles by replacing air with a gas having higher diffusibility and / or solubility in the resin than air.

  The operation of the imprint apparatus 100 according to the first embodiment of the present invention will be described below with reference to FIG. This operation is controlled by the control unit CNT. First, as shown in FIG. 1A, the resin 2 is applied to the shot area of the imprint target (pattern formation target) of the substrate 1 by the application unit 5 under the control of the control unit CNT. Thereafter, as shown in FIGS. 1A and 1B, the substrate driving unit 20 is arranged so that the resin 2 above the shot region is located in the region below the mold 3 (more specifically, the pattern portion P). Thus, the substrate driving operation is performed. The substrate driving operation is shown as an arrow SDRV. The substrate driving operation is an operation of driving the substrate 1 so as to position the shot area at a target position (a position below the mold 3) based on the coordinates of the shot area to be imprinted on the substrate 1.

  The gas supply unit 7 supplies the gas G onto the substrate 1 at least during a part of the period of the substrate driving operation. Here, the gas supply unit 7 may supply gas onto the substrate 1 before the start of the substrate driving operation, or may supply gas onto the substrate 1 even after the substrate driving operation ends. However, from the viewpoint of reducing the amount of gas G used, it is preferable that the gas supply unit 7 stop supplying the gas G after supplying a certain amount of gas G. The substrate 1 is driven by the substrate driver 20 as indicated by the arrow SDRV in a state where the gas G exists on the substrate 1, whereby the gas G is guided to the space between the substrate 1 and the mold 3.

As shown in FIGS. 1B and 1C, under the control of the control unit CNT, the mold driving unit 4 causes the gas G to be applied onto the substrate 1 by the gas supply unit 7 during the substrate driving operation period. In a first period after the start of supply, the distance (gap) between the mold 3 and the substrate 1 is reduced from d to d−. This operation is indicated by the arrow MD. The distance d is, for example, the distance between the mold 3 and the substrate 1 when the coating unit 5 applies the resin 2 to the substrate 1, and the distance d− is after the substrate driving operation is completed, and the mold 3 and the substrate It may be the distance between the mold 3 and the substrate 1 before starting precise alignment with one shot region. The precise alignment between the mold 3 and the shot area of the substrate 1 is based on the mark formed on the mold 3 and the mark formed on the substrate 1 while the mold driving unit 4 brings the mold 3 and the substrate 1 close to each other. This is an operation for aligning the shot area and the mold 3.

  The first period may be a period after the gas G supplied onto the substrate 1 by the gas supply unit 7 enters the region under the mold 3 by driving the substrate 1 by the substrate driving unit 20. By reducing the distance between the substrate 1 and the mold 3 from the distance d to the distance d− in the first period, the substrate 1 and the mold 3 are driven in the state where the substrate 1 is driven as indicated by the arrow SDRV by the substrate driving unit 20. The space between is made positive pressure. As a result, it is possible to suppress the concentration of the gas G from being lowered by the air being drawn into the space between the substrate 1 and the mold 3 by driving the substrate 1 by the substrate driving unit 20. Accordingly, the generation of bubbles in the resin 2 is suppressed.

  After the substrate driving operation, the mold driving unit 4 drives the mold 3 so that the mold 3 comes into contact with the resin 2 under the control of the control unit CNT, as shown in FIG. This operation is indicated by an arrow IMP. At this time, as described above, precise alignment between the mold 3 and the shot region of the substrate 1 as described above is performed. After the mold 3 comes into contact with the resin 2, energy (for example, light) for curing the resin 2 is supplied to the resin 2 by the curing unit 16, and the resin 2 is cured. The above operation can be performed for all of the plurality of shot regions of the substrate 1.

  In the present embodiment, the form in which the imprint apparatus 100 includes the application unit 5 that applies the resin 2 on the substrate 1 has been described. However, the imprint apparatus 100 may not include the application unit 5. For example, a substrate coated with resin by another apparatus may be carried into the imprint apparatus 100. The gas supply unit 7 supplies the gas G so that the gas G is filled at least between the shot region where the pattern is formed and the pattern P under the control of the control unit CNT. The first period can be after the gas supply is started to the shot area where the pattern is formed.

  The above-described first period in which the distance between the substrate 1 and the mold 3 is reduced may be before the substrate driving operation ends or at the same time as the substrate driving operation ends.

  Hereinafter, as a comparative example, an operation for maintaining a constant distance between the substrate 1 and the mold 3 in the first period will be described with reference to FIG. First, as shown in FIG. 2A, the resin 2 is applied to the shot area of the imprint target (pattern formation target) of the substrate 1 by the application unit 5. Thereafter, as shown in FIGS. 2A, 2B, and 2C, the gas G is supplied onto the substrate 1 by the gas supply unit 7, and the resin 2 (shot region) is the mold 3 ( The substrate driving operation is performed by the substrate driving unit 20 so as to be located in the region under the pattern portion P). The substrate driving operation is shown as an arrow SDRV.

  The gas G is guided to the space between the substrate 1 and the mold 3 by the substrate driving operation. At this time, in the comparative example, since the distance between the substrate 1 and the mold 3 is maintained constant (distance d), the space between the substrate 1 and the mold 3 does not become a positive pressure. Peripheral air A can flow into the. For this reason, the concentration of the gas G in the space between the substrate 1 and the mold 3 becomes lower than that in the first embodiment shown in FIG.

  After the substrate driving operation, as shown in FIG. 2 (d), the mold driving unit 4 drives the mold 3 so that the mold 3 contacts the resin 2 (arrow IMP), and then the curing unit 16 removes the resin 2. Harden.

  Hereinafter, a second embodiment of the present invention will be described with reference to FIG. Here, matters not mentioned in the second embodiment can follow the first embodiment. In the second embodiment, the gas supply unit 7 supplies the gas G onto the substrate 1 even before the above-described substrate driving operation period by the substrate driving unit 20. Then, as shown in FIGS. 3A and 3B, the mold driving unit 4 is in a state where the gas G is supplied onto the substrate 1 by the gas supply unit 7 before the substrate driving operation period. The distance between the substrate 1 and the mold 3 is increased from the distance d to the distance d +. The distance d is, for example, the distance between the mold 3 and the substrate 1 when the coating unit 5 applies the resin 2 to the substrate 1, and the distance d + is the distance between the mold 3 and the substrate 1 immediately before starting the substrate driving operation. It can be a distance. The gas supply by the gas supply unit 7 is continued even after the distance between the substrate 1 and the mold 3 reaches the distance d +.

  Before the substrate driving operation period, the distance between the substrate 1 and the mold 3 is increased by increasing the distance between the substrate 1 and the mold 3 while the gas G is supplied onto the substrate 1 by the gas supply unit 7. Inflow of gas G into the space can be facilitated.

  Thereafter, as shown in FIG. 3B and FIG. 3C, the distance between the substrate 1 and the mold 3 is increased from the distance d + by the mold driving section 4 while performing the substrate driving operation (arrow SDRV) by the substrate driving section 20. The distance is reduced to d-. By reducing the distance between the substrate 1 and the mold 3 from the distance d + to the distance d− in the first period, the space between the substrate 1 and the mold 3 is made positive. As a result, it is possible to suppress the air G from being drawn into the space between the substrate 1 and the mold 3 to reduce the concentration of the gas G. Thereafter, as shown in FIG. 3D, the mold driving unit 4 drives the mold 3 so that the mold 3 contacts the resin 2 (arrow IMP), and the curing unit 16 cures the resin 2.

  Hereinafter, a third embodiment of the present invention will be described with reference to FIG. Matters not mentioned in the third embodiment can follow the first or second embodiment. Further, the third embodiment can be implemented with the features of the first or second embodiment. The imprint apparatus 100 according to the third embodiment additionally includes a wall 8 surrounding the gas injection port 71 and the mold 3 of the gas supply unit 7. The wall 8 may be driven so as to move with the mold 3 or may be fixedly supported by a support member (not shown). By providing the wall 8, the amount of the gas G flowing out from the space between the substrate 1 and the mold 3 can be reduced, and the concentration of the gas G in the space can be increased.

  Reducing the outflow of the gas G from the space between the substrate 1 and the mold 3 is to reduce measurement errors caused by the outflow of the gas G into the optical path 12 of the measuring instrument that measures the position of the substrate stage 6. It is advantageous. The measuring instrument may include, for example, a laser interferometer 11 and a mirror 10 provided on the substrate stage 6, but may be another type of measuring instrument (for example, an encoder). Here, if a gas G other than air exists in the optical path 12, an error may occur in the measurement result of the laser interferometer 11 due to the difference in refractive index between the air and the gas G.

  The imprint apparatus 100 according to the third embodiment may further include a gas suction unit 9 that sucks gas outside the wall 8. By providing the gas suction part 9, the gas leaked from the inside of the wall 8 to the outer space can be sucked. Thereby, for example, a measurement error of a measuring instrument that measures the position of the substrate stage 6 can be reduced. Further, by providing the gas suction portion 9, air is sucked in the space outside the wall 8, so that the space becomes negative pressure. Thereby, the concentration of the gas G in the space inside the wall 8, that is, the space between the substrate 1 and the mold 3 can be increased.

  The imprint apparatus 100 may include either the wall 8 or the gas suction unit 9 described above, or may include both.

  In any of the embodiments, when the space between the substrate 1 and the mold 3 is reduced to make the space between the substrate 1 and the mold 3 positive pressure, the mold driving unit 4 is driven (arrow MD). However, the substrate stage 6 may be driven toward the mold 3. In this case, in the first period, the substrate stage 6 moves toward the mold 3 while performing the substrate driving operation (arrow SDRV). Alternatively, the distance between the substrate 1 and the mold 3 may be reduced by driving both the mold driving unit 4 and the substrate stage 6.

  Similarly, when the pattern P of the mold 3 is brought into contact with the resin 2, the case where the mold driving unit 4 is driven (arrow IMP) has been described, but the substrate stage 6 may be driven toward the mold 3. The operation of the imprint apparatus can be controlled by a control unit.

  Hereinafter, an article manufacturing method for manufacturing an article using the above imprint apparatus will be described. This article manufacturing method includes a step of forming a resin pattern on a substrate using the imprint apparatus and a step of processing (for example, etching) the substrate on which the pattern is formed. The article can be, for example, a device such as a semiconductor device, a liquid crystal display device, or a micromachine.

Claims (9)

A mold driving unit for bringing the mold into contact with the resin on the substrate or pulling the mold away from the resin;
A substrate driving unit for driving the substrate;
A curing portion for curing the resin in a state where the mold is in contact with the resin on the substrate ;
A gas supply unit for supplying a gas onto the substrate,
The gas supply unit, in a period in which the resin on the substrate is the substrate driving unit so as to be positioned under the mold is driving the substrate, supplying a gas onto the substrate,
After the gas supply unit starts supplying the gas onto the substrate, the substrate driving unit moves the substrate so that the resin on the substrate is positioned under the mold. In the driving period, the gap between the substrate and the mold is reduced in a state where the substrate and the mold face each other.
An imprint apparatus characterized by that. The type drive unit, the substrate and the mold following their entry into the region below the mold gas supplied onto the substrate by the gas supply unit by driving the substrate by the substrate drive unit Reducing the gap ,
The imprint apparatus according to claim 1. The mold driving unit is configured to bring the mold into contact with the resin on the substrate after the operation of the substrate driving unit to drive the substrate so that the resin on the substrate is positioned under the mold ;
The imprint apparatus according to claim 1 or 2, wherein It further comprises an application part for applying a resin on the substrate,
The gas supply unit is disposed between the mold driving unit and the coating unit.
Imprint apparatus according to any one of claims 1 to 3, characterized in that. The gas supply unit supplies gas onto the substrate even before the substrate driving unit starts driving the substrate so that the resin on the substrate is located under the mold ,
The mold driving unit is configured to supply gas on the substrate by the gas supply unit before the substrate driving unit starts driving the substrate so that the resin on the substrate is located under the mold . Increasing the gap between the substrate and the mold in the supplied state,
The imprint apparatus according to claim 1, wherein the apparatus is an imprint apparatus. An application part for applying a resin on the substrate;
Further comprising a wall surrounding the gas injection port and the type of the gas supply unit,
The application part is disposed outside the wall,
The imprint apparatus according to any one of claims 1 to 3 , wherein: A gas suction part for sucking a gas outside the wall;
The imprint apparatus according to claim 6. Contacting the mold to the resin on the substrate, the type curing the resin in contact with the resin, a imprint method of forming a pattern by separating the mold from the cured the resin,
A substrate driving step the resin on the substrate you drive the substrate to be located under the mold,
A gas supply step of supplying a gas onto the substrate during a period in which the substrate is driven such that a resin on the substrate is positioned under the mold in the substrate driving step ;
In the period in which the substrate is driven so that the resin on the substrate is positioned under the mold in the substrate driving step after gas supply is started on the substrate in the gas supplying step. Reducing the gap between the substrate and the mold in a state where the substrate and the mold face each other ;
The imprint method characterized by having. An article manufacturing method for manufacturing an article, comprising:
Forming a pattern on a substrate by the imprint apparatus according to claim 1;
Processing the substrate on which the pattern is formed;
An article manufacturing method comprising: