JP2013026573A - Imprint device and manufacturing method for article - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an imprint device advantageous in a standpoint of throughput.SOLUTION: The imprint device includes: a substrate holding section 1 for holding a substrate 2; a mold holding section 7 for holding a mold 5; a separating section SP which includes a plate member 3 that surrounds a side of a projection 51 and is arranged to face a peripheral section 52 and separates a space between the substrate holding section and the peripheral section of the mold into a first space 21 on a side of the substrate holding section and a second space 22 on a side of the mold holding section; and a gas supply section 6. The plate member has an opening and a gap G is formed between the side of the projection of the mold and an inner face of the opening. The gas supply section supplies gas for promoting inflow of resin R to a recess of a pattern to the first space from the second space via the gap and supplies the gas to the second space so that the gas is supplied to a space between the projection and the substrate.

Description

  The present invention relates to an imprint apparatus and a manufacturing method for manufacturing an article using the imprint apparatus.

  The imprint technique is being put into practical use as a new technique for manufacturing articles such as magnetic storage media and semiconductor devices. The imprint technique is a technique in which a pattern formed on the mold is transferred to the resin by applying the resin to a substrate and curing the resin in a state where the mold is in contact with the resin.

JP 2007-103684 A

  In the imprint technique, it is desired that the resin quickly flows into the concave portions of the pattern formed in the mold in order to improve the throughput. Therefore, the resin and the mold can be contacted in a gas that is permeable to the resin or the mold. Among the resins used for imprinting, there is an ultraviolet curable resin that cures when irradiated with ultraviolet light. Such resins are generally those that prevent curing in the presence of oxygen, and imprinting in a gas that is permeable to the resin is effective in preventing inhibition of curing by oxygen. It is.

  Patent Document 1 discloses a method for performing imprinting in a chamber. Specifically, in this method, after UV curable resin is applied to the substrate, the substrate is placed on a substrate holding table in the chamber, the substrate and the mold (mold) are opposed, and nitrogen gas is introduced into the chamber. Air is exhausted from the chamber while being introduced. Thereafter, the mold is brought into close contact with the substrate and is cured by irradiating the ultraviolet curable resin with ultraviolet light. In the method described in Patent Document 1, since the entire air in the chamber is replaced with nitrogen gas, a long time is required for the replacement, which is disadvantageous in terms of throughput.

  An object of the present invention is to provide an imprint apparatus that is advantageous in terms of throughput.

  One aspect of the present invention relates to an imprint apparatus in which a resin is applied to a substrate and the resin is cured in a state where the resin is in contact with the resin. The mold includes a protrusion having a pattern and the protrusion. The imprint apparatus includes a substrate holding unit that holds the substrate, a mold holding unit that holds the mold, a side surface of the convex portion, and the peripheral portion. A space between the substrate holding portion and the peripheral portion of the mold is defined as a first space on the substrate holding portion side and a second on the mold holding portion side. A separation part configured to be separated into a space; and a gas supply part, wherein the plate member has an opening, and a gap is provided between a side surface of the convex part of the mold and an inner surface of the opening. And the gas supply part promotes the inflow of the resin into the recesses of the pattern. Gas is supplied from the second space to the first space through the gap, and is further supplied to the space between the convex portion and the substrate. .

  According to the present invention, an imprint apparatus that is advantageous in terms of throughput is provided.

The figure which shows typically the structure of the imprint apparatus of 1st Embodiment of this invention. The figure which shows typically the structure of the imprint apparatus of 1st Embodiment of this invention. The figure which shows the structural example of a type | mold. The figure which shows typically the structure of the imprint apparatus of 2nd Embodiment of this invention. The figure which shows typically the structure of the imprint apparatus of 3rd Embodiment of this invention. Sectional drawing which shows typically the structure of the pattern in which the type | mold was formed.

  The configuration and operation of the imprint apparatus 100 according to the first embodiment of the present invention will be described with reference to FIGS. Here, FIG. 1 is a cross-sectional view schematically showing the configuration of the imprint apparatus 100 of the first embodiment, FIG. 2 is a cross-sectional view of a part of FIG. 1, and FIGS. FIG. 6 is a side view and a plan view showing a configuration example of a mold 5. The imprint apparatus 100 is configured to cure the resin R in a state where the resin R is applied to the substrate 2 such as a wafer and the mold 5 is in contact with the resin R.

  The imprint apparatus 100 includes a substrate holding unit 1 that holds the substrate 2 and a mold holding unit 7 that holds the mold 5. Here, typically, the imprint apparatus 100 includes a positioning mechanism that positions the substrate holding unit 1, and positions the shot region of the substrate 2 and the mold 5 by the positioning mechanism. The positioning mechanism drives, for example, a measuring instrument 9 that measures the position of the substrate holding unit 1, a driving unit (not shown) that drives the substrate holding unit 1, and the driving unit based on the output of the measuring unit 9. And a control unit (not shown). The measuring instrument 9 can be, for example, a laser interferometer that measures the position of the substrate holding unit 1 using a mirror 20 provided in the substrate holding unit 1.

  The imprint apparatus 100 can include a drive unit 29 that drives the mold holding unit 7 so that the mold 5 contacts the resin R applied to the substrate 2. The drive unit 29 can be configured to drive the mold holding unit 7 with the reference member 8 as a reference, for example. The driving unit 29 may be configured to drive the substrate holding unit 1 so that the convex portion 51 of the mold 5 contacts the resin R applied to the substrate 2.

  The imprint apparatus 100 can include a light source LS as a curing unit for curing the resin. The light source LS generates light for curing the resin, typically ultraviolet light, and this light can be applied to the resin R through the mold 5. The curing unit may include, for example, a heat source that generates heat for curing the resin instead of the light source LS.

  The mold 5 can be made of a material that transmits light (for example, quartz). The mold 5 includes a convex portion 51 on which a pattern is formed, and a peripheral portion 52 disposed around the convex portion 51. The convex portion 51 is a portion protruding from the peripheral portion 52. The peripheral portion 52 can also be understood as a support portion that supports the convex portion 51. As schematically shown in FIG. 6, the pattern P has a recess C. In other words, the pattern P is configured by forming the recess C on a flat surface. When the convex part 51 of the mold 5 is brought into contact with the resin, the resin flows into the concave part C. At this time, the gas in the recess C is dissolved in the resin, so that the resin can flow into the depth of the recess C.

  In one example, the height D1 of the convex portion 51 is in the range of 15 to 50 μm, the dimension D2 in the x direction of the convex portion 51 is in the range of 25 to 33 mm, and the dimension D3 in the y direction of the convex portion 51 is 25 to 33 mm. Can be in range. In one example, the thickness D4 of the peripheral part 52 may be 6.35 mm, the dimension D5 in the x direction of the peripheral part 52 may be 152 mm, and the dimension D6 in the y direction of the peripheral part 52 may be 152 mm. The dimensions of the projection 51 in the x direction and the y direction are equal to the areas formed in one imprint (resin curing), that is, the dimensions of the shot area in the x direction and the y direction. The reason why the pattern is formed on the convex portion 51 is that when the mold 5 is brought into contact with the shot area where the pattern is to be formed, the pattern already formed in the shot area adjacent to the shot area is crushed. This is to prevent it.

  The imprint apparatus 100 separates the space between the substrate holding unit 1 and the mold holding unit 7 into a first space 21 on the substrate holding unit 1 side and a second space 22 on the mold holding unit 7 side. A configured separation unit SP is provided. The separation part SP includes a plate member 3 that is disposed so as to surround the side surface 53 (see FIG. 2) of the convex part 51 and to face the peripheral part 52. The plate member 3 has an opening, and a gap G is formed between the side surface 53 of the convex portion 51 of the mold 5 and the inner surface of the opening of the plate member 3. The separation part SP includes a support member 4 disposed so as to surround the mold 5 held by the mold holding part 7, and the plate member 3 can be supported by the support member 4. The thickness of the plate member 3 is smaller than the height D1 of the convex portion 51 of the mold 5.

  The imprint apparatus 100 includes a gas supply unit 6. In the gas supply unit 6, a gas (hereinafter referred to as a replacement gas) for promoting the inflow of the resin R into the concave portions of the pattern formed in the convex portion 51 of the mold 5 passes through the gap G from the second space 22 to the first. A replacement gas is supplied to the second space 22 so as to be supplied to the space 21. The replacement gas supplied to the first space 21 replaces the gas (in the case where the imprint apparatus 100 is disposed in the air) that is present in the space 23 between the convex portion 51 and the substrate 2. . In FIG. 1 and FIG. 2, the flow of the replacement gas is schematically shown by a thick black arrow. The imprint apparatus 100 may further include a suction unit 15 and / or a suction unit 16 that sucks the replacement gas supplied to the first space 21 through the gap G. The suction part 15 can include a suction port 151 (see FIG. 2) configured to surround the plate member 3. The suction unit 16 can be formed on the substrate holding unit 1 so as to surround the substrate 2. The replacement gas supplied to the first space 21 through the gap G is a gas that is easily dissolved in the resin R or a gas that easily penetrates the mold, and may be a gas having a low molecular weight such as hydrogen gas or helium gas.

  In the first embodiment, the replacement gas is supplied to the first space 21 that is the space on the substrate holding part 1 side through the gap G formed between the side surface 53 of the convex part 51 of the mold 5 and the inner surface of the opening of the plate member 3. Is supplied. According to such a configuration, the replacement gas is more efficiently supplied to the space between the convex portion 51 of the mold 5 and the substrate 2 through the gas supply port arranged outside the peripheral portion 52 of the mold 5. The replacement gas can be supplied to the space. The concave portion of the pattern formed on the convex portion 51 is filled with the replacement gas. This replacement gas dissolves in the resin R when the convex portion 51 comes into contact with the resin R, thereby promoting the inflow of the resin R into the concave portion of the pattern.

  In addition, according to the first embodiment, the suction part 15 including the suction port 151 configured to surround the plate member 3 and / or the suction part 16 arranged to surround the substrate 2 can be provided. Thereby, it can suppress that the replacement gas supplied to the 1st space 21 disturbs the atmosphere of the measurement optical path 91 of the measuring instrument 9, and can reduce the measurement error by the measuring instrument 9. When the atmosphere of the measurement optical path 91 is air whose temperature and pressure are controlled, the position of the substrate holder 1 can be measured with high accuracy by the measuring instrument 9. However, when the replacement gas is mixed into this atmosphere, the refractive index of the atmosphere of the measurement optical path 91 changes thereby, which causes a measurement error.

  Further, in the first embodiment, it is easier to fill the replacement gas in the space facing the mold as compared to the method of performing imprinting in a chamber into which nitrogen gas is introduced as described in Patent Document 1. Therefore, it is advantageous in terms of throughput.

  The imprint apparatus 101 according to the second embodiment will be described with reference to FIG. Matters not mentioned here can follow the first embodiment. In the second embodiment, the plate member 3 is configured to be removable. The separation part SP includes a support member 4 disposed so as to surround the mold 5 held by the mold holding part 7, and the plate member 3 can be attached to the support member 4 by magnetic force, for example. For example, as illustrated in FIG. 4, the magnet 31 is coupled to the plate member 3, and the plate member 3 can be attached to the support member 4 by the magnetic force generated by the magnet 31. Alternatively, the magnet 31 may be coupled to the support member 4. The plate member 3 can be removed by, for example, a robot 70 having a chuck 71 that holds the plate member 3. The chuck 71 can be, for example, a vacuum chuck or a mechanical chuck. 4A schematically shows a state in which the plate member 3 is chucked by the chuck 71, and FIG. 4B schematically shows a state in which the plate member 3 is detached from the support member 4 (or the imprint apparatus 100) by the robot 70. Show. The plate member 3 can be removed from the support member 4 when, for example, the mold 5 is replaced or the plate member 3 is replaced.

  An imprint apparatus 101 according to the third embodiment will be described with reference to FIG. Matters not mentioned here can follow the first embodiment and / or the second embodiment. The separation part SP connects the support member 4 and the plate member 3 so that the support member 4 arranged so as to surround the mold 5 and the plate member 3 can move relative to the support member 4. The elastic member 32 may be included. The elastic member 32 can be, for example, a bellows. When the mold holding unit 7 is driven by the driving unit 29 so that the mold 5 comes into contact with the resin R applied to the substrate 2, the peripheral part 52 of the mold 5 and the plate member 3 of the separation part SP come into contact with each other. FIG. 4A schematically shows a state before the mold 5 is brought into contact with the resin R applied to the substrate 2, that is, a state before the peripheral portion 52 of the mold 5 and the plate member 3 of the separation portion SP are brought into contact with each other. Is shown. FIG. 4B schematically shows a state in which the mold 5 is in contact with the resin R applied to the substrate 2, that is, a state in which the peripheral portion 52 of the mold 5 and the plate member 3 of the separation portion SP are in contact. Show.

  Before the mold 5 is brought into contact with the resin R applied to the substrate 2, that is, before the peripheral portion 52 of the mold 5 is brought into contact with the plate member 3 of the separation part SP, the replacement gas passes through the gap G from the second space 22. The first space 21 and further the space 23 are supplied. On the other hand, in a state in which the mold 5 is in contact with the resin R applied to the substrate 2, that is, in a state in which the peripheral portion 52 of the mold 5 and the plate member 3 of the separation portion SP are in contact, the first space 22 The supply of the replacement gas to the space 21 (and the space 23) is interrupted, or the supply amount is reduced. The imprint apparatus 102 according to the third embodiment adjusts the pressure in the second space 22 in order to prevent the pressure in the second space 22 from fluctuating (rising) excessively in the operation as described above. Can be provided. For example, the regulator 80 may be configured to release the gas in the second space 22 to the external space when the pressure in the second space 22 rises to a set value. When the mold 5 is brought into contact with the resin R applied to the substrate 2, the imprint apparatus 102 may be configured to stop the supply of gas by the gas supply unit 6 or reduce the supply amount.

  A method for manufacturing an article using the above imprint apparatus will be described. This manufacturing method includes a step of forming a resin pattern on a substrate using the above-described imprint apparatus, and a step of processing (for example, etching) the substrate on which the pattern is formed. The article can be, for example, a device such as a semiconductor device, a liquid crystal display device, or a micromachine.

Claims (10)

An imprint apparatus for applying a resin to a substrate and curing the resin in a state in which the mold is in contact with the resin, wherein the mold is disposed around a convex portion on which a pattern is formed and the convex portion. A peripheral part, the imprint apparatus,
A substrate holder for holding the substrate;
A mold holding unit for holding the mold;
A plate member that surrounds the side surface of the convex portion and is disposed so as to face the peripheral portion; and a space between the substrate holding portion and the peripheral portion of the mold is a first on the substrate holding portion side. A separation part configured to separate the space and the second space on the mold holding part side;
A gas supply unit,
The plate member has an opening, and a gap is formed between a side surface of the convex portion of the mold and an inner surface of the opening,
In the gas supply unit, a gas for promoting the inflow of the resin into the concave portion of the pattern is supplied from the second space to the first space through the gap, and further, between the convex portion and the substrate. Supplying the gas to the second space so as to be supplied to the space;
An imprint apparatus characterized by that. The height of the convex portion is in the range of 15 to 50 μm, and the thickness of the plate member is smaller than the height of the convex portion.
The imprint apparatus according to claim 1. The separation unit is
A support member arranged to surround the mold;
A stretchable member that connects the support member and the plate member so that the plate member can move relative to the support member;
The imprint apparatus according to claim 1, wherein the imprint apparatus according to claim 1. A drive unit that drives the mold holding unit so that the mold contacts the resin applied to the substrate;
The peripheral part of the mold and the plate member of the separating part come into contact with each other when the mold holding part is driven by the driving part so that the mold contacts the resin applied to the substrate;
The imprint apparatus according to claim 3. The plate member is removable;
The imprint apparatus according to claim 1, wherein the apparatus is an imprint apparatus. The separation part further includes a support member arranged so as to surround the mold, and the plate member is attached to the support member by a magnetic force.
The imprint apparatus according to any one of claims 1, 2, and 4.   The imprint apparatus according to claim 1, further comprising a suction unit that sucks the gas supplied to the first space through the gap. The suction part includes a suction port configured to surround the plate member,
The imprint apparatus according to claim 7. The gas is hydrogen gas or helium gas.
The imprint apparatus according to claim 8. Forming a resin pattern on a substrate using the imprint apparatus according to any one of claims 1 to 9,
Processing the substrate on which the pattern is formed;
A method for producing an article comprising: