TW201620694A - Imprint method, imprint apparatus, mold, and article manufacturing method - Google Patents

Abstract

Provided is an imprint method that molds an uncured resin applied to a substrate by a pattern portion formed on a mold and cures the uncured resin so as to form the pattern of the resin cured on the substrate. The imprint method includes a step of releasing the pattern portion from the resin such that two opposed boundaries are brought closer to each other to progress peeling while maintaining a parallel state after curing of the resin based on the assumption that the boundary at which the pattern portion is peeled from the resin is linear.

Description

Imprint method, imprinting apparatus, mold and article manufacturing method

The present invention relates to an imprint method, an imprint apparatus, a mold, and an article manufacturing method.

The microfabrication technique forms a pattern of an imprint material on a substrate by an imprint process for molding an imprint material applied to the substrate using a mold. This technique is also referred to as "imprint technique" whereby a fine pattern (structure) having a size of a few nanometers is formed on the substrate. An example of an imprint technique includes a photocuring method. First, an imprinting apparatus using a photocuring method supplies a resin (photocurable resin) as an imprint material to one of the shot forming areas on the substrate. Next, the photocurable resin on the substrate is molded using a mold. After the photocurable resin is irradiated with light for curing, the cured resin is released from the mold, thereby forming a resin pattern on the substrate. Imprinting techniques include not only photocuring methods, but also thermal curing methods for curing the resin using, for example, heat.

However, in this imprint technique, the mold is in direct contact with the resin, which can A pattern defect such as a transfer failure occurs when the mold is released from the curing resin (release). For example, the occurrence of defects typically directly affects device performance during the manufacture of semiconductor devices or similar devices, and acceptable defect densities are very stringent.

Therefore, Japanese Patent Laid-Open No. 2011-77529 discloses an imprint apparatus which applies stress to an interface by pressing a rear surface of a substrate or a mold into a convex shape when the mold is released, and reduces the release of the mold. Force to suppress the generation of defects. Japanese Patent Laid-Open Publication No. 2007-296683 discloses a pattern forming method for suppressing occurrence of defects by aligning a linear direction with a peeling direction within a specific range. Japanese Patent Laid-Open No. 2013-207180 discloses an imprint method which reduces the occurrence of defects by setting the separation speed between the mold holder and the substrate holder to zero at the start of mold release.

With regard to the development of defect suppression technology, it has been clarified in recent years that the defect density tends to increase particularly in the central portion of the molding region. One of the reasons for this is that the area where the defect density is increased is the area where the mold is in contact with the resin until the stage after the mold release step, and the peeling progress speed becomes very high in this area, thereby causing the occurrence of the occurrence more easily. The required stress is applied to the resin pattern or mold. In particular, in the technique disclosed in Japanese Patent Laid-Open No. 2011-77529 and Japanese Patent Laid-Open No. 2013-207180, it is also conceivable to peel off isotropic (substantially circular) from molding when the mold is released. The peripheral portion of the region proceeds toward the central portion, and the peeling progress speed increases as the length of the peeling boundary decreases, resulting in frequent occurrence of defects in the central region. The other side The application range of the technique disclosed in Japanese Patent Laid-Open No. 2007-296683 is limited to the orientation pattern and it is not clear whether the technique can suppress the occurrence of defects in the central portion of the molding region. In addition, in the technique disclosed in Japanese Patent Laid-Open No. 2013-207180, the mold releasing operation after the start of the mold release is performed by the spring force generated from the elastic deformation of the mold or the substrate, according to the case where the releasing force of the mold is large, The mold structure, or the like, does not begin to peel until the mold release operation is completed.

For example, the present invention provides an imprint method that is advantageously used to suppress the occurrence of pattern defects.

According to an aspect of the present invention, there is provided an imprint method for forming a pattern on an imprint material applied to a substrate by using a mold, the method comprising the steps of: releasing the mold from the imprint material such that the mold is peeled off from the imprint material based on the mold The boundary is a straight line hypothesis, the two opposite boundaries are close together and remain in a straight line after the imprint material has solidified.

Other features of the present invention will become apparent from the following description of the exemplary embodiments.

100‧‧‧imprint equipment

101‧‧‧ Window Board

102‧‧‧Mold chuck

103‧‧‧Mold

103a‧‧‧ pattern part

103b‧‧‧ recessed part

104‧‧‧Resin

105‧‧‧ Wafer

106‧‧‧Substrate chuck

107‧‧‧Lighting system

108‧‧‧Base platform

109‧‧‧Mold shape controller

110‧‧‧ Wafer shape controller

111‧‧‧Drive Control Circuit

112‧‧‧Resin curing control circuit

114‧‧‧Mold shape variable mechanism

115‧‧‧Variable wafer shape mechanism

117‧‧‧Mold holding mechanism

118‧‧‧ dispenser

119‧‧‧ Controller

120‧‧‧ tube

121‧‧‧ tube

201‧‧‧Contact area

209‧‧‧Mold shape controller

210‧‧‧ Wafer Shape Controller

214‧‧‧Mold shape variable mechanism

215‧‧‧Variable wafer shape mechanism

309‧‧‧Mold shape controller

314‧‧‧Mold shape variable mechanism

501‧‧‧High rigidity part

1021‧‧‧First mold holding unit

1022‧‧‧Second mold holding unit

1 is a schematic diagram illustrating a configuration of an imprint apparatus according to a first embodiment of the present invention; and FIG. 2 is a diagram illustrating a state of a member or the like during an imprint process in a time series manner; 3A is a diagram illustrating a state before a mold is brought into contact with a resin; FIG. 3B is a diagram illustrating a state in which the mold is in contact with a resin; and FIG. 3C is a diagram illustrating that the mold is completely filled by bringing the mold into contact with the resin. FIG. 3D is a schematic diagram illustrating a state in which the mold is in contact with the resin at the start of the mold releasing step; FIG. 4A is a sectional view showing a configuration of the imprint apparatus according to the second embodiment of the present invention; 4B is a perspective view showing a configuration of an imprint apparatus according to a second embodiment of the present invention; and FIG. 4C is a sectional view showing a configuration of an imprint apparatus according to a second embodiment of the present invention; A schematic view of a configuration of an imprint apparatus according to a third embodiment of the present invention; FIG. 6A is a plan view illustrating how peeling is performed in the mold releasing step in the comparative example; and FIG. 6B is a diagram illustrating mold release in the comparative example. FIG. 6C is a cross-sectional view showing how the peeling is performed in the mold releasing step in the comparative example; FIG. 7A is a view illustrating the length of the peeling boundary; FIG. 7B is a diagram illustrating the peeling development. Figure of speed; Figure 8 illustrates the comparative example and the same in the same time series BRIEF DESCRIPTION OF THE DRAWINGS FIG. 9 is a schematic diagram illustrating a substrate chuck; FIG. 10 is a diagram illustrating a mold chuck used in an imprint apparatus according to a fourth embodiment of the present invention; 11A is a diagram illustrating a state before a mold is brought into contact with a resin; FIG. 11B is a diagram illustrating a state in which the mold is in contact with a resin; and FIG. 11C is a diagram illustrating that the mold is completely filled by bringing the mold into contact with the resin. A simplified diagram of the state of the resin; FIG. 11D is a diagram illustrating a state in which the mold is in contact with the resin at the start of the mold releasing step; FIG. 11E is a diagram illustrating a state in which the mold releasing step is completed; FIG. 12 is a time series manner A diagram illustrating the state of the member or the like during the imprint process; FIG. 13A is a diagram illustrating a state before the mold is in contact with the resin; and FIG. 13B is a diagram illustrating a state when the mold is in contact with the resin; A diagram illustrating a state in which a mold is completely filled with a resin by bringing a mold into contact with a resin; FIG. 13D is a diagram illustrating a state in which the mold is in contact with the resin at the start of the mold releasing step; FIG. 13E is a diagram illustrating the mold. Schematic diagram of the state in which the release step is completed; FIG. 14 is a schematic diagram illustrating the state of the components and the like during the imprint process in a time series manner; FIG. 15 is a diagram illustrating the substrate chuck; FIG. 16A is a diagram illustrating contact between the mold and the resin. Simple state of the previous state Fig. 16B is a diagram illustrating a state in which the mold is in contact with the resin; Fig. 16C is a diagram illustrating a state in which the mold is completely filled with the resin by bringing the mold into contact with the resin; Fig. 16D is a diagram illustrating the start of the mold releasing step A diagram of a state in which the mold is in contact with the resin; Fig. 16E is a diagram illustrating a state in which the mold releasing step is completed; and Fig. 17 is a diagram illustrating a state of the member or the like during the imprinting process in a time series manner.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

(First Embodiment)

First, an explanation will be given of an imprint method and an imprint apparatus according to a first embodiment of the present invention. FIG. 1 is a schematic block diagram showing an imprint apparatus 100 according to the present embodiment. The imprint apparatus 100 is used to manufacture an apparatus as an article such as a semiconductor device or the like. The uncured resin (imprint material) 104 applied to the wafer (substrate) 105 is brought into contact with the mold 103 to mold the resin 104, thereby forming a pattern of the resin 104 on the wafer 105. It should be noted that the imprint apparatus 100 uses a photocuring method by way of example. In the drawings, the Z-axis is arranged in the vertical direction (vertical direction), and the mutually orthogonal X-axis and Y-axis are arranged in a plane perpendicular to the Z-axis. The imprint apparatus 100 includes a lighting system 107 and a mold holding machine Structure (mold holder) 117, substrate stage (substrate holder) 108, dispenser 118 and controller 119.

The illumination system 107 is a resin curing unit that irradiates the mold 103 with light (for example, ultraviolet light) by adjusting ultraviolet light emitted from a light source (not shown) to light suitable for curing the resin 104. The light source may be any light source as long as it emits not only ultraviolet light but also light having a wavelength that penetrates the mold 103 and cures the resin 104. For example, when a thermal curing method is employed, a heating unit for curing the thermosetting resin instead of the illumination system 107 as a resin curing unit is disposed near the substrate platform 108. On the other hand, when a thermosetting resin is used instead of the thermosetting resin, the resin curing unit is, for example, a cooling unit which is disposed near the substrate platform.

The mold 103 includes a pattern portion 103a on which a three-dimensional concavo-convex pattern to be transferred, such as a circuit pattern or the like, is formed on a surface opposite to the wafer 105. The mold 103 includes a concave portion 103b provided in a central region of the surface at the side opposite to the surface on which the pattern portion 103a is provided. As the material of the mold 103, any light-transmitting material such as quartz glass, sapphire glass or the like can be used in the case of using the photo-curing method, but a wide variety of types can be selected in the case of using a heat curing method or a thermoplastic method. Materials such as metals, tantalum, ceramics, and the like.

The mold holding mechanism 117 has a mold chuck 102 for holding the mold 103, a mold driving mechanism (not shown) for supporting and moving the mold chuck 102, and a mold shape variable mechanism (mold shape variable unit) 114. The mold 103 can be deformed. The mold chuck 102 can be used by using The suction or electrostatic force suctions or attracts the peripheral region of the surface of the mold 103 to be irradiated with ultraviolet light to hold the mold 103. In addition, each of the mold chuck 102 and the mold driving mechanism has a hole area at the central portion (ie, inside thereof) such that ultraviolet light emitted from the illumination system 107 is guided to the wafer by passing through the mold 103. 105. The hole area communicates with the recessed portion 103b formed in the mold 103. The mold driving mechanism moves the mold 103 in the Z-axis direction to selectively cause the mold 103 to contact the resin 104 on the wafer 105 or release the mold 103 from the resin 104. It should be noted that the contact and release operations performed during the imprint process can be performed by moving the mold 103 in the Z-axis direction. The same operation can also be performed by moving the wafer 105 in the Z-axis direction under the driving of the substrate platform 108 or by moving the mold 103 and the wafer 105 relatively, simultaneously or sequentially. The mold shape variable mechanism 114 causes the shape of the mold 103 to be changed by applying a force (deformation force) to the mold 103 held by the mold chuck 102.

Here, the mold shape variable mechanism 114 in the present embodiment is a fluid pressure applying unit that uses a method of applying fluid pressure, which is a pressure of a gas or a liquid, and in the present embodiment, the fluid pressure applying unit is particularly used. A method of changing the shape of the mold 103 by applying air pressure. It should be noted that, for example, in the case of using a photocurable resin or in the case where it is required to add a majority of an optical sensor, an imaging system, or the like for fine flow management, a method of applying fluid pressure is advantageous because This method easily produces a transmission path of ultraviolet light in the imprint apparatus 100. The mold shape variable mechanism 114 further has: a window The plate 101 is for sealing a space including the recessed portion 103b and the above-described hole region; a mold shape controller 109; and a tube 120 for communicating the mold shape controller 109 with the sealed space. Since it is necessary to transmit ultraviolet light therethrough in the mold 103, the material of the window plate 101 is, for example, quartz glass. The mold shape controller 109 adjusts the pressure in the sealed space formed by the recessed portion 103b as a part based on the command given by the controller 119 and is, for example, a pump to perform pressurization or decompression. Although the mold shape variable mechanism 114 uses air pressure in the present embodiment, the mold shape variable mechanism 114 may provide pressure control using a gas such as nitrogen or helium, or may provide liquid pressure control using a liquid such as water or oil. .

The wafer (substrate) 105 is a substrate to be processed, and is composed of, for example, a single crystal germanium. In order to use an article other than a semiconductor device which is a substrate material, an optical glass such as quartz may be employed for the optical element, and GaN, SiC or the like may be employed for the light-emitting element.

The substrate platform 108 holds the wafer 105 and performs positional alignment between the mold 103 and the wafer 105 when the mold 103 is in contact with the resin 104 on the wafer 105. The substrate platform 108 has a substrate chuck 106 for holding the wafer 105, a platform driving mechanism (not shown) for supporting the substrate chuck 106 so as to be moved along the XYZ axis; and the wafer shape can be The variable mechanism (substrate shape variable unit) 115 can deform the wafer 105. In the present embodiment, in the wafer shape variable mechanism 115, the substrate chuck 106 is, for example, a vacuum chuck. Using the method, the substrate chuck 106 divides the adsorption region into a plurality of adsorption regions, and changes the shape of the wafer 105 by increasing/decreasing the adsorption pressure applied to each of the individual adsorption regions. here, In order to deform the shape of the wafer 105 into a shape different from that of a general wafer during the mold releasing step (which will be described later in detail), the plurality of adsorption regions may be separated by a fixed width in the X-axis direction, but in the Y-axis direction. Connected throughout the adsorption zone. It should be noted that, when in the mold mold shape controller 109, the pressure adjustment unit in each adsorption region may include a wafer mold shape controller 110 and a tube 121 as pumps for performing pressurization and decompression for adjustment air pressure.

The dispenser 118 applies (supplied) the resin 104 to a shot region as a pattern forming region preset on the wafer 105, the pattern forming region having a desired applied pattern. The resin 104 as an imprint material needs to have fluidity when it is filled between the mold 103 and the wafer 105, and becomes solid after molding to maintain its shape. In particular, in the present embodiment, the resin 104 is an ultraviolet curable resin (photocurable resin), and the resin 104 exhibits such curing property upon exposure to ultraviolet light, but heat may be used according to various conditions such as article manufacturing processing. Resin, thermoplastic resin or the like to replace the photocurable resin.

The controller 119 is constituted by, for example, a computer or the like and is connected to components of the imprint apparatus 100 through a line to control the operation and adjustment of the parts by a program or the like. In particular, in the present embodiment, the controller 119 includes a drive control circuit 111 and a resin cure control circuit 112. The drive control circuit 111 controls the operation of the mold shape variable mechanism 114. The drive control circuit 111 controls the operation of the mold holding mechanism 117, the substrate stage 108, the mold shape controller 109, and the wafer shape controller 110 particularly during a contact operation or release operation. Resin curing control circuit 112 controls illumination from illumination Irradiation of system 107. Note that the controller 119 may be integrated with the rest of the imprint apparatus 100 (disposed in a common housing) or may be disposed separately from the rest of the imprint apparatus 100 (disposed in the respective housings).

Next, an imprint process (imprint method) performed by the imprint apparatus 100 will be explained. First, the controller 119 places and attaches the wafer 105 to the substrate chuck 106. Next, the controller 119 drives the substrate platform 108 such that it appropriately changes the position of the wafer 105 and causes an alignment measurement system (not shown) to measure the alignment marks on the wafer 105 to detect the crystal with high accuracy. The position of the circle 105. Then, the controller 119 determines an array of the shot regions formed on the substrate based on the detection result. Here, as a flow of patterning on one shot area, the controller 119 first causes the substrate stage 108 to perform positioning of the application position on the wafer 105 below the resin fill port of the dispenser 118. Then, the dispenser 118 applies the resin 104 to the shot filling area (application step). Next, the controller 119 causes the substrate stage 108 to move the wafer 105 such that the shot area is in a contact position directly below the pattern portion 103a to achieve positioning. Next, the controller 119 performs positional alignment between the pattern portion 103a and the shot region on the substrate, shape correction of the pattern portion 103a, and the like, and then drives the mold holding mechanism 117 such that the pattern portion 103a is applied to the shot filling region. The resin 104 is contacted to fill the resin 104 in the pattern portion 103a (filling step). In this state, as a curing step, the controller 119 causes the illumination system 107 to emit ultraviolet light from the rear surface (upper surface) of the mold 103 for a predetermined time, and is cured by the ultraviolet light curing resin 104 that has been conveyed through the mold 103. Next, after the resin 104 is cured, the controller 119 drives the mode. The holding mechanism 117 is provided to release the pattern portion 103a from the cured resin 104 by enlarging the interval between the mold 103 and the wafer 105 (mold release step). Through the above steps, a three-dimensional resin pattern conforming to the pattern portion 103a is formed on the shot region. This series of imprint operations is performed two or more times while changing the shot area under the driving of the substrate stage 108, so that the imprint apparatus 100 can form a plurality of resin patterns on one wafer 105.

2 is a schematic cross-sectional view showing the state (shape) of the resin 103 on the mold 103, the wafer 105, and the wafer 105 in a series of steps illustrating the above-described imprint process in a time series manner. In FIG. 2, a cross-sectional view (X cross-sectional view) along the X-axis direction and a cross-sectional view (Y cross-sectional view) along the Y-axis direction by the position of the center of gravity of the mold 103 are arranged in parallel in a time series manner. In addition, in Fig. 2, an arrow indicates the direction in which the pressure is applied. 3A to 3D are schematic plan views illustrating changes in the state of the resin 104 at a certain time interval due to contact between the mold 103 and the resin 104 on the wafer 105. First, at the start of the imprint process, the mold 103 and the wafers 105 having the resin 104 applied to the surface thereof are disposed to face each other.

Next, as shown in a part (i) of FIG. 2, the mold shape variable mechanism 114 deforms the shape of the mold 103 into a substantially spherical convex shape such that the central portion of the pattern portion 103a of the mold 103 is closer to the resin 104 side. At this time, since the mold 103 and the resin 104 are in a state before the contact, the state of the resin 104 shown in Fig. 3A does not change.

Next, as shown in part (ii) of FIG. 2, the mold 103 and the wafer 105 gradually approach each other with the filling step, and then the mold 103 (Fig. Case portion 103a) begins to contact the resin 104. At this time, the mold shape variable mechanism 114 keeps the shape of the mold 103 convex. In this manner, as shown in FIG. 3B, the contact region 201 becomes circular and the filling of the resin 104 proceeds from the central portion of the pattern portion 103 toward the outer peripheral region while replacing the air therein, from the viewpoint of suppressing the entrapment of the bubble. It is ideal. In FIGS. 3B to 3D, the hatched area indicates a region (contact region 201) in which the mold 103 is in contact with the resin 104.

Next, as shown in part (iii) of Fig. 2, after the resin 104 is completely filled over the entire pattern portion 103a (see Fig. 3C), the illumination system 107 is irradiated with ultraviolet light of, for example, 100 mJ/cm ² in the curing step. The illuminating resin 104 cures the resin 104. Here, the mold shape variable mechanism 114 is controlled such that the deformation of the mold 103 is gradually released as the filling of the resin 104 progresses (the progress of the filling operation) so that the shape of the mold 103 returns to its original shape upon completion of the filling of the resin 104. . From the viewpoint of suppressing strain of the resin pattern due to deformation of the mold 103, although it is desirable that the mold shape variable mechanism 114 releases the deformation of the mold 103, if the degree of strain is acceptable, it is possible to maintain the application of the deformation force to the mold. The state of 103.

Next, as shown in the part (iv) of FIG. 2, the wafer shape variable mechanism 115 causes the shape of the wafer 105 to be convex along the cylindrical shape so that the wafer 105 is parallel to one direction in the plane (behind the text) The "deformation reference direction" is closer to the side of the mold 103 (substrate deformation step). It should be noted that the term "cylindrical shape" in the present embodiment means not only a strict cylindrical shape but also a so-called "general cylindrical shape". On the other hand, the mold shape variable mechanism 114 deforms the shape of the mold 103 into a concave shape so that the mold 103 is The central portion is isotropic away from the resin 104. In this case, the shape of the mold 103 is cylindrical so as to conform to the shape of the wafer 105 (mold deformation step). Here, since the Y-axis direction is defined as the deformation reference direction (the direction along which the axis of the cylindrical shape extends), only the central portion of the wafer 105 floats the substrate chuck 106 in the X-sectional view, and the Y cross-sectional view The entire wafer 105 floats out of the substrate chuck 106.

Next, as shown in a part (v) of Fig. 2, in the mold releasing step, the resin 104 on the mold 103 and the wafer 105 are gradually released from each other. At this time, both the mold 103 and the wafer 105 have a cylindrical deformed shape. Therefore, as shown in FIG. 3D, the boundary (interface) when the mold 103 is peeled off from the cured resin 104 is two straight lines along the deformation reference direction. The peeling is performed such that the two opposite peeling boundaries are close to each other while being in a straight line state (perpendicular to the direction of the deformation reference direction). It should be noted that this state is maintained from the start of the mold release to the end of the mold release.

As shown in the sub-figure (vi) of FIG. 2, after the mold releasing step is completed, the mold shape variable mechanism 114 and the wafer shape variable mechanism 115 stop applying the deformation force, and then the shapes of the mold 103 and the wafer 105 are respectively restored. In its original shape, the imprint process is completed.

Next, it will be specifically explained by using a comparative example of numerical values to specifically clarify the effect of implementing the above-described mold releasing step. For the mold releasing step in the comparative example, the elements having the same configuration as those of the printing apparatus 100 according to the present embodiment are denoted by the same reference numerals. First, as a common condition between the present embodiment and the comparative example, the mold 103 is composed of synthetic quartz having a thickness of 5 mm (dimension in the Z-axis direction) and And including a concave portion having an outer size (planar size) having a diameter Φ of 65 mm and a depth of 4 mm at a surface on the side opposite to the surface on which the pattern portion 103a is provided. The pattern portion 103a is a convex portion, and the outer size of the convex portion has a length of 33 mm in the X-axis direction, a length of 26 mm in the Y-axis direction, and a height at the central portion of the surface (dimension in the Z-axis direction). It is 0.1mm. The pattern portion 103a has a microstructure composed of a concavo-convex pattern formed on the entire surface thereof, and has a size of an average width of 50 nm and an average depth (dimension in the Z-axis direction) of 100 nm. A plurality of adsorption regions formed on the substrate chuck 106 as the wafer shape variable mechanism 115 are separated by a width of 70 mm in the X-axis direction around the portion facing the pattern portion 103a shown by the hatched portion in FIG. 9, but in Y The entire adsorption region is connected in the axial direction.

6A to 6C are schematic views illustrating how peeling of the resin 104 is performed in the mold releasing step in the comparative example. In the drawings, Fig. 6A is a plan view. Fig. 6B is a cross-sectional view taken along the line X, in which the state at this time in the state of the imprint process of the present embodiment shown in Fig. 2 particularly corresponds to the X cross-sectional view of (v). On the other hand, Fig. 6C is a Y sectional view in which the state at this time in the state of the imprint process of the present embodiment shown in Fig. 2 particularly corresponds to the Y cross-sectional view of (v). In the deformation step performed after the curing step and before the mold releasing step, both the mold shape variable mechanism 114 and the wafer shape variable mechanism 115 apply an air pressure of +10 kPa to surround the mold 103 and the wafer 105 toward the pattern portion. Partial deformation of 103a. It should be noted that, in the case of the comparative example, the mold shape variable mechanism 114 deforms the shape of the mold 103 in a convex shape so that the central portions of the mold 103 are each It is closer to the wafer 105 side. In this state, the molds 103 and the resin 104 on the wafer 105 are released from each other at a speed of 100 μm/s in the mold releasing step. In this manner, the mold 103 is isotropically deformed as shown in FIGS. 6B and 6C so as not to follow the cylindrical shape of the wafer 105. Therefore, the contact region 201 becomes a circular shape (substantially circular shape) as shown in FIG. 6A during the mold releasing step, and the peeling is performed isotropically from the outer circumference of the pattern portion 103a toward the center.

In contrast, in the present embodiment, in the deforming step, for example, the mold shape variable mechanism 114 applies an air pressure of -10 kPa to deform the mold 103. On the other hand, the wafer shape variable mechanism 115 applies an air pressure of +10 kPa to deform the wafer 105. Here, the wafer shape variable mechanism 115 deforms the shape of the wafer 105 into a cylindrical shape as described above. At this time, as shown in the X sectional view of the sub-figure (iv) in FIG. 2, the wafer shape variable mechanism 115 pressurizes the adsorption region including the portion facing the pattern portion 103a along the X-axis direction, but adsorbs (subtracts Press) another adsorption zone. On the other hand, as shown in the Y sectional view of the sub-figure (iv) in Fig. 2, the entire region including the portion facing the pattern portion 103a along the Y-axis direction in the Y-axis direction is in a pressurized state. In contrast, the entire region (not shown) in the Y-axis direction at both ends in the X-axis direction excluding the portion facing the pattern portion 103a is in an adsorption state. From this state, it is assumed that in the mold releasing step, the resin 103 on the mold 103 and the wafer 105 are released from each other at a speed of 100 μm/s as in the comparative example. In this manner, the mold 103 is peeled off from the wafer 105 as described above with reference to the sub-graph (v) in FIG. 2 and FIG. 3D.

7A and 7B are diagrams respectively illustrating the length of the peeling boundary and the peeling speed with respect to the mold release time for the peeling of the resin 104 in the comparative example and the peeling progress of the present embodiment, by the above conditions. The high speed camera takes a photograph of the peeled state and performs image analysis to obtain the above length and the above-described progress speed. Meanwhile, FIG. 7A shows the length of the peeling boundary, and FIG. 7B shows the peeling progress speed. In FIGS. 7A and 7B, the solid line indicates the value in the present embodiment and the broken line indicates the value in the comparative example.

First, when the mold releasing step is carried out by providing the imprint method according to the present embodiment, two straight line boundaries are formed, and therefore, the boundary length shown in Fig. 7A is maintained at a substantially fixed level of about 52 mm, which is a pattern portion The short side of the 103a is twice the length (26mm). On the other hand, the peeling progress speed shown in Fig. 7B is slightly raised in the early and late stages of the mold releasing step, but maintains a substantially fixed level of 30 mm/s or less. In the resin pattern formed on the wafer 105 using this imprint method, there is no particular change in the defect density in the portion formed on the central portion of the pattern portion 103a as compared with the other portions.

Next, when the mold releasing step is performed by the imprint method in the comparative example, the boundary length shown in FIG. 7A rapidly decreases as the radius of the contact region 201 decreases. On the other hand, the peeling progress speed shown in Fig. 7B is slightly reduced in the early stage of the mold releasing step, and increases in the intermediate stage and rises sharply in the later stage, and finally shows about 120 mm/s or higher. High value. In the comparative example, an imprint method is used to form a resin pattern on the wafer 105, which is formed in the pattern portion 103a. The defect density in the portion on the central portion is three times the defect density of the peripheral portion. Further, in other portions, the defect density in the portion formed in the central portion of the pattern portion 103a is 1.2 times that of the case of the present embodiment. During the mold release step, in the case where only the wafer shape variable mechanism 115 is at atmospheric pressure and only the mold shape variable mechanism 114 is at atmospheric pressure, the comparative example obtains the same result.

Fig. 8 is a schematic plan view showing the peeling of the resin 104 (change in the contact region 201) in the comparative example and the present embodiment in the same time series. The sub-picture (i) in Fig. 8 corresponds to the case in the comparative example, and the sub-picture (ii) in Fig. 8 corresponds to the case of the present embodiment. Referring to the relationship with the mold release time shown in Figs. 7A and 7B, first, in the comparative example, the contact area 201 is sharply reduced in the later stage of the mold releasing step. In contrast, in the case of the present embodiment, as shown in the graphs of Figs. 7A and 7B, the peeling progress speed slightly changes while the peeling-off boundary length is substantially maintained during the mold releasing step.

As described above, the imprint method and the imprint apparatus 100 according to the present embodiment have the following advantages. First, the length of the peeling boundary for supporting the peeling force is suppressed during the mold releasing step, so that the speed of the peeling progress can be suppressed. In particular, in the above example, the boundary of the rectangular molded area is formed while keeping the two opposite sides parallel to each other, keeping the length of the boundary a fixed length. In this way, the number of regions in which the defect density is increased in the molding region (the region where the peeling progress is high) is reduced, resulting in suppressing the occurrence of pattern defects as much as possible. Even if the molded area presents other shapes (for example, circles, polygons, or the like) or has different sides The boundary angle, although the length of the boundary changes, the length of the boundary is not extremely reduced as explained in the comparative example, thereby providing the same effect as described above. This results in the elimination of complex and high speed speed control, which helps to cut costs by simplifying equipment control. As shown in a part (iv) of FIG. 2, the mold 103 and the wafer 105 having the radii of curvature close to each other are peeled off in the same direction in the vicinity of the boundary, and are hardly compared with the comparative example. Interference caused by a mismatch in the shape of the pattern may occur. Therefore, the stress applied to the resin pattern in the direction of the molding surface for the above reasons is suppressed. In the present embodiment, the peeling is performed symmetrically along the two boundaries, canceling the force applied to the two boundaries along the direction of the molding surface, suppressing the molding along the molding as compared with the case where the peeling is performed from one side in the comparative example. The stress applied to the resin pattern in the surface direction. This has led to helping to cut costs by simplifying the rigidity of the equipment. In addition, the imprint method and the imprint apparatus 100 according to the present embodiment are easily modified from the imprint apparatus of the conventional structure, and therefore, the imprint method and the imprint apparatus 100 according to the present embodiment have wide applications.

As described above, according to the present embodiment, it is possible to provide an imprint method which is advantageous in suppressing occurrence of pattern defects.

(Second embodiment)

Next, an imprint method and an imprint apparatus according to a second embodiment of the present invention will be explained. The case where the mold 103 or the wafer 105 is deformed by using the air pressure (fluid pressure) and the mold shape variable mechanism 114 and the wafer shape variable mechanism 115 has been described in the first embodiment. Compared with this, this The embodiment is characterized by the fact that the mold shape variable mechanism and the wafer shape variable mechanism use a method of bringing the drive mechanism into contact with an object to be moved so that a mechanical external force is applied to the object.

4A to 4C are diagrams showing a configuration of a mold shape variable mechanism 214 and a wafer shape variable mechanism 215 in the imprint apparatus according to the present embodiment. In FIGS. 4A to 4C, FIG. 4A is an X sectional view, FIG. 4B is a perspective view, and FIG. 4C is a X sectional view illustrating still another example. In the present embodiment, components corresponding to those in the first embodiment or components similar to those in the first embodiment are denoted by the same reference numerals, and thus the description thereof will be omitted.

The mold shape variable mechanism 214 is a column made of, for example, quartz glass having a diameter of 5 mm and adhered to the opposite side (rear surface side) of the central portion of the pattern portion 103a of the mold 103, wherein the column shape The central axis of the object is parallel to the Z axis. In this case, the mold mold shape controller 209 is a drive unit that moves the cylindrical body in the Z-axis direction (linear movement). A linear motor, an air pressure actuator or the like can also be used as the drive mechanism.

The wafer shape variable mechanism 215 is a push-up member that can push up the wafer 105 held on the substrate chuck 106 by contacting from the rear surface of the wafer 105. If the Y-axis direction is defined as the deformation reference direction, the push-up member is a rectangular parallelepiped member having a width of 5 mm in the X-axis direction and a length in the Y-axis direction larger than the length of the wafer 105. In order to prevent the wafer 105 from being damaged during contact (push up), the section of the portion where the push-up member is in contact with the rear surface of the wafer 105 is trimmed into a circular arc shape. here In the case, the wafer shape controller 210 is a drive unit that moves the push-up member in the Z-axis direction. As the drive mechanism, a linear motor, an air pressure actuator or the like can also be used. In order for the wafer shape variable mechanism 215 to perform this push-up operation, the substrate chuck 106 has an opening 106a having a width of 70 mm in the X-axis direction but a portion surrounding the pattern portion 103a extending in the Y-axis direction. The wafer shape variable mechanism 215 is movable through the opening 106a in a non-contact manner.

With the above configuration, in the mold releasing step of the present embodiment, the mold shape variable mechanism 214 deforms the mold 103 by moving the mold 103 by 20 μm in the direction away from the resin 104 on the wafer 105. On the other hand, the wafer shape variable mechanism 215 deforms the wafer 105 by moving the wafer 105 toward the mold 103 by 20 μm. In this manner, in the present embodiment, the peeling of the resin 104 proceeds as in the first embodiment, and therefore, the same effect as that of the first embodiment can be obtained. In particular, according to the present embodiment, the deformation amount of the mold 103 and the wafer 105 in the mold releasing step is uniquely defined due to mechanical limitation, and the change in the mold release behavior is due to the material of the resin 104 and the state of the transfer pattern. This is especially effective when the analog or the like is large. Further, both of the shape variable mechanisms 214, 215 are solid members, which is particularly effective when performing an imprint process in a vacuum.

In the present invention, the method of applying the mechanical external force generated by the contact in the mold releasing step is not limited to the above method. For example, the wafer shape variable mechanism 215 may be configured such that the substrate chuck 106 itself is bent substantially in a cylindrical shape as shown in the X sectional view in FIG. 4C. In other words, in this case, the substrate chuck 106 also functions as the wafer shape variable mechanism 215.

(Third embodiment)

Next, an imprint method and an imprint apparatus according to a third embodiment of the present invention will be explained. In the first embodiment, the case where the mold shape variable mechanism 114 uses air pressure (fluid pressure) to deform the mold 103 has been explained. In contrast, the present embodiment is characterized by the fact that the mold shape variable mechanism or the wafer shape variable mechanism uses this method, which applies a remote force by generating an electric field or a magnetic field. Hereinafter, the case where the mold shape variable mechanism is a remote force applying unit will be described by way of example, and the remote force applying unit uses a method of applying a remote force by generating an electric field.

FIG. 5 is a schematic block diagram (X cross-sectional view) illustrating the mold shape variable mechanism 314 and the wafer shape variable mechanism 115 in the configuration of the imprint apparatus according to the present embodiment. In the present embodiment, components corresponding to those in the first embodiment or components similar to those in the first embodiment are denoted by the same reference numerals, and thus the explanation thereof is omitted. The mold shape variable mechanism 314 is a circular metal plate having a diameter of, for example, 50 mm, and the mold shape variable mechanism 314 is disposed to face the pattern portion 103a on the light emitting side of the mold 103. On the other hand, an ITO layer as a transparent electrode is deposited on the rear surface of the mold 103 facing the metal plate. In this case, the mold shape controller 309 is a voltage source (voltage applying unit) that is connected via electric wires to the metal plate as the mold shape variable mechanism 314 and the ITO layer on the rear surface of the mold 103. It should be noted that the wafer shape variable mechanism 115 is the same as that of the first embodiment.

With the above configuration, in the mold releasing step of the embodiment, the wafer The shape variable mechanism 115 deforms the wafer 105 by applying air pressure of +10 kPa as in the first embodiment. Subsequently, the mold mold shape controller 309 applies a voltage of the opposite polarity to the mold shape variable mechanism 314 and the ITO layer so that the mold 103 is deformed by the maximum displacement of 20 μm as in the first embodiment to conform to the wafer. 105 shape. In this manner, in the present embodiment, the peeling of the resin 104 is progressed as in the first embodiment, and therefore, the same effect as that of the effect of the first embodiment can be obtained. In particular, according to the present embodiment, the deformation of the mold 103 is performed by an electric signal and a physical field, which is effective in the case where a high speed response is required in the case of the snap press processing. The mold shape variable mechanism 314 is not in contact with the mold 103 as an article to be deformed, and is particularly effective depending on the imprint processing method, particularly when the imprint process is performed in a vacuum.

In the above embodiment, in the mold releasing step, the wafer shape variable mechanism deforms the shape of the wafer 105 into a convex shape along the cylindrical shape, and the mold shape variable mechanism deforms the mold 103 so as to conform to the wafer 105. shape. However, the present invention is not limited to this method or structural configuration as long as the peeling can be performed such that the two opposite peeling boundaries are close to each other while the straight state is maintained in the parallel state based on the assumption that the peeling boundary is a straight line. In other words, contrary to the above, the present invention can also be applied to the method or structural configuration such that in the mold releasing step, the mold shape variable mechanism can deform the shape of the mold 103 along the cylindrical shape into a convex shape, and the crystal The circular shape variable mechanism can deform the wafer 105 to conform to the shape of the mold 103. The wafer 105 can also be deformed under the control of the mold holding mechanism 117.

(Fourth embodiment)

Next, an imprint method and an imprint apparatus according to a fourth embodiment of the present invention will be explained. In the first to third embodiments, the shape and wafer of the mold 103 have been described by using air pressure (first embodiment), mechanical external force (second embodiment), or remote force (third embodiment). The shape deformation amount of 105. In contrast, the present embodiment is characterized by the fact that the shape change of the mold 103 is performed due to the difference in rigidity between the X direction and the Y direction of the outer circumference of the mold 103. In the following embodiments, components corresponding to or similar to those of the above embodiment are denoted by the same reference numerals, and thus the explanation thereof will be omitted.

FIG. 10 is a schematic block diagram illustrating the mold chuck 102 applied to the imprint method and the imprint apparatus according to the present embodiment. The mold chuck 102 is different from the above embodiment in that the first mold holding unit 1021 and the second mold holding unit 1022 are disposed at positions around the hole area on the contact surface in contact with the mold 103. The first mold holding unit 1021 has an elongated shape along the Y direction in FIG. 10, and the second mold holding unit 1022 has an elongated shape along the X direction in FIG. The first mold holding unit 1021 and the second mold holding unit 1022 are vacuum chucks that can independently switch suction and release with respect to the mold 103. It should be noted that, for application in the present embodiment, the mold 103 is composed of synthetic quartz stone having a thickness of 1 mm and has a square shape of 100 mm ² in the longitudinal direction and the lateral direction when viewed from above.

FIG. 11 is a schematic plan view illustrating changes in the state of the resin 104 with time intervals due to contact between the mold 103 and the resin 104 on the wafer 105. Figure 12 is a time series diagram illustrating one of the above imprint processes A schematic cross-sectional view of the state (shape) of the mold 103, the wafer 105, and the resin 104 on the wafer 105 in the series of steps. The meanings of the coordinate axes and the arrow directions are the same as those of the coordinate axes and arrows of the first embodiment. FIG. 11A is a schematic view showing a state before the mold 103 is in contact with the resin 104. At this time, as shown in FIG. 12A, the rear surface of the mold 103 is sucked to the mold chuck 102 by the first mold holding unit 1021 and the second mold holding unit 1022. The mold shape variable mechanism 114 deforms the central portion of the pattern portion 103a into a substantially spherical convex shape so as to be closer to the resin 104 side.

11B and 12B are schematic views illustrating this state in which the pattern portion 103a comes into contact with the resin 104. As in the above embodiment, the contact region 201 is substantially circular, so that the resin filling is performed isotropically from the central portion of the pattern portion 103a toward the peripheral region. 11C and 12C are schematic views illustrating a state in which the resin 104 is completely filled over the entire pattern portion 103a. As in the first embodiment, the resin 104 is cured under the control of the mold shape variable mechanism 114. Then, the rear surface of the mold 103 is sucked only to the mold chuck 102 by the first mold holding unit 1021. This causes the outer peripheral stiffness of the mold 103 along the Y direction to be greater than the stiffness along the X direction.

11D and 12D are schematic views illustrating the state in which the mold releasing step is performed. Unlike the above embodiment, the wafer shape variable mechanism 115 and the mold shape variable mechanism 114 are not used. As shown in FIG. 12D, when the pattern portion 103a is deformed into a substantially cylindrical shape extending in the Y direction in FIG. 11D, the mold releasing step is performed. At this time, a pattern is formed between the pattern portion 103a and the resin 104 in two straight lines as shown in FIG. 11D and along Y. The peeling interfaces in which the axes are parallel to each other are then peeled off to bring the peeling interfaces closer to each other, and FIGS. 11E and 12E are schematic views illustrating a state in which the mold releasing step is completed. The mold releasing force applied to deform the mold 103 is lost, so that the shape of the mold 103 returns to the original state. The imprint apparatus having the above configuration also provides the same effects as the above embodiment.

In the present embodiment, a general object having a planar shape can be used as the mold 103. Therefore, the present embodiment is particularly suitable for the case where it is required to reduce the manufacturing cost of the mold 103, the case where a material which is difficult to machine (such as sapphire) is used as a mold, or the like.

(Fifth Embodiment)

Next, an imprint method and an imprint apparatus according to a fifth embodiment of the present invention will be explained. In the fourth embodiment, the rigidity between the X direction and the Y direction of the outer circumference of the mold 103 is different due to the configuration of the mold chuck 102. In contrast, the present embodiment is characterized in that rigidity is different due to the configuration of the mold 103 itself.

FIG. 13 is a schematic plan view illustrating changes in the state of the resin 104 with time intervals due to contact between the mold 103 and the resin 104 on the wafer 105. Figure 14 is a schematic cross-sectional view showing the state (shape) of the resin 104 on the mold 103, the wafer 105, and the wafer 105 in a series of steps of the above-described imprint process in a time series manner. The meanings of the coordinate axes and the arrow directions are the same as those of the coordinate axes and arrows of the first embodiment. FIG. 13A is a schematic view showing a state before the mold 103 is in contact with the resin 104. At this time, as shown in FIG. 14A, the mold shape variable mechanism 114 causes the pattern portion The central portion of the minute 103a is deformed into a substantially spherical convex shape so as to be closer to the resin 104 side. The wafer shape variable mechanism 115 deforms the wafer 105 into a cylindrical convex shape extending in the X direction in FIG. 14A so as to be closer to the resin 104 side.

Among the four side portions of the mold 103, two opposite sides which are parallel to each other along the Y direction in Fig. 13A are two high rigidity portions 501 whose rigidity increases with thickness And increase. Each of the high rigidity portions 501 has a thickness of 10 mm and a width of 20 mm. This structure makes the outer circumference rigidity of the mold 103 in the Y direction higher than the rigidity in the X direction. The mold chuck 102 is a mechanical chuck that mechanically limits the high rigidity portion 501. In addition, a rubber bellows (not shown) prevents gas from entering from the end surface of the thin portion of the mold 103 toward the Y direction in Fig. 13A. The substrate chuck 106 is a vacuum chuck. As shown in FIG. 15, the substrate chuck 106 has this structure in which the X-axis and the Y-axis are reversed with respect to the X-axis and the Y-axis in FIG.

13B and 14B are schematic views illustrating a state in which the pattern portion 103a starts to come into contact with the resin 104. As in the above embodiment, the contact region 201 becomes substantially circular, and the resin filling is performed isotropically from the central region of the pattern portion 103a toward the outer peripheral region. 13C and 14C are schematic views illustrating a state in which the resin 104 is completely filled over the entire pattern portion 103a. As in the above embodiment, the cured resin 104 is irradiated with ultraviolet light after completion of filling. Subsequently, the mold shape variable mechanism 114 stops the force applied to the mold 103, at which time the entire rear surface of the wafer 105 is attracted to the wafer chuck 106.

13D and 14D are schematic views illustrating a state in which the mold releasing step is in progress. As shown in Fig. 14D, the mold releasing step is performed while the pattern portion 103a is deformed into a substantially cylindrical shape extending in the Y direction in Fig. 14D. At this time, a peeling interface formed in the two straight lines and parallel to each other on the Y-axis as shown in FIG. 13D is produced between the pattern portion 103a and the resin 104, and then peeling proceeds to bring the peeling interfaces closer to each other, FIGS. 11E and 12E It is a schematic diagram illustrating the state in which the mold release step is completed. The mold releasing force applied to deform the mold 103 is lost, so that the shape of the mold 103 returns to the original state. The imprint apparatus having the above configuration also provides the same effects as the above embodiment.

In the present embodiment, the high rigidity portion 501 of the mold 103 can be used as a so-called "clamping edge". Therefore, the present embodiment is particularly suitable for the case where the vacuum chuck or the electrostatic chuck is disengaged due to a particularly large mold releasing force, a case where molding is performed in a vacuum, or a case where strong mechanical restrictions are required to be performed.

(Sixth embodiment)

Next, an imprint method and an imprint apparatus according to a sixth embodiment of the present invention will be explained. In the fifth embodiment, in the four side portions of the mold 103, the peripheral rigidity of the mold 103 in the Y direction is set to be higher than In the X direction, the thickness of the opposite side portions parallel to each other increases in the Y direction. In contrast, the present embodiment is characterized by the fact that the difference between the rigidity of the outer circumference of the mold 103 in the X direction and the Y direction is small, but a certain rigidity is secured to the outer circumference of the mold 103 in the X direction.

FIG. 16 is a schematic plan view illustrating changes in the state of the resin 104 with time intervals due to contact between the mold 103 and the resin 104 on the wafer 105. Fig. 17 is a schematic cross-sectional view showing a state (shape) of the resin 104 on the mold 103, the wafer 105, and the wafer 105 in a series of steps of the above-described imprint process in a time series manner. The meaning of the coordinate axes and the arrow directions is the same as that of the first embodiment. FIG. 16A illustrates a state before the mold 103 is in contact with the resin 104. At this time, as shown in FIG. 17A, the mold shape variable mechanism 114 deforms the mold 103 into a substantially elliptical shape which is convex toward the resin 104 and whose major axis extends in the Y direction in FIG. 16A. Unlike the above embodiment, the mold 103 is not cylindrical due to its poor rigidity.

In the four side portions of the mold 103 in the present embodiment, the size of each of the high-rigidity portions 501 disposed at the two opposite sides of the two mutually parallel sides in the Y direction in FIG. 16A Each having a thickness of 10 mm and a width of 30 mm, and each of the high-rigidity portions 501 disposed at two opposite sides parallel to each other along the X direction in FIG. 16A has a thickness of 10 mm and The width is 10mm. The peripheral rigidity of the mold 103 in the Y direction is higher than the peripheral rigidity in the X direction due to the difference in width between the high rigidity portion 501 in the X direction and the high rigidity portion 501 in the Y direction. It should be noted that there is no rigidity difference as in the fifth embodiment. The mold chuck 102 is a vacuum chuck that holds the high rigidity portion 501 by suction. The substrate chuck 106 is a vacuum chuck having the configuration shown in FIG.

16B and 17B are schematic views illustrating a state in which the pattern portion 103a starts to come into contact with the resin 104. The contact area 201 becomes substantially elliptical, and its main The shaft extends in the Y direction in Fig. 16B, and the resin filling is performed isotropically from the central portion of the pattern portion 103a toward the outer peripheral region. 16C and 17C are schematic views illustrating a state in which the resin 104 is completely filled over the entire pattern portion 103a. As in the above embodiment, the cured resin 104 is irradiated with ultraviolet light after the filling is completed. Subsequently, the mold shape variable mechanism 114 stops the force applied to the mold 103. In the steps described so far, the entire rear surface of the wafer 105 is attracted to the wafer chuck 106.

16D and 17D are simplified diagrams illustrating the state in which the mold releasing step is in progress. As shown in Fig. 17D, the mold 103 is deformed into a substantially elliptical shape which is convex when viewed from the resin 104, and the mold releasing step is performed while the wafer 105 is deformed to be substantially extended in the Y direction in Fig. 16D. To the cylindrical shape. At this time, the wafer shape variable mechanism 115 applies a force to the wafer 105 in the Z-axis direction. The difference in the amount of deformation of the mold 103 due to the difference in rigidity is supplemented by the amount of deformation of the wafer 105, and a peeling interface is formed between the pattern portion 103a and the resin 104, which is formed in two straight lines and is parallel to each other along the Y-axis ( As shown in Fig. 16D), the peeling is then performed so that the peeling interfaces become closer to each other. 16E and 17E are schematic views illustrating a state in which the mold releasing step is completed. The mold releasing force applied to deform the mold 103 is lost, and the shape of the mold 103 returns to its original state. The imprint apparatus having the above configuration also provides the same effects as the above embodiment.

In the present embodiment, since the entire outer circumference of the mold 103 is constituted by the high rigidity portion 501, the mold 103 as a whole exhibits a very high rigidity. Therefore, this embodiment is particularly useful when high positional accuracy is required for the entire pattern. It is suitable for the case where the strain in the mold 103 is caused by the strong holding force of the mold chuck 102.

It should be noted that the wafer 105 may be selected instead of the mold 103 as a member having a difference in rigidity, or both the mold 103 and the wafer 105 may have a rigidity difference. The mold 103 and the wafer 105 can also assist in deformation when the peeling riser is not a sufficiently straight line. As a method of making the rigidity different, a method of adjusting the thickness of the mold 103 (a method of providing a thickness distribution of the mold 103) can be used in combination with a method of adjusting the suction force generated by the mold chuck 102.

(Article manufacturing method)

A method for forming a device (semiconductor integrated circuit component, liquid crystal display element, or the like) into an article may include the step of using the above-described imprint apparatus on a substrate (wafer, glass plate, film substrate, or the like) Form a pattern. In addition, the manufacturing method may include the step of etching the substrate on which the pattern has been formed. When manufacturing an article such as a patterned medium (storage medium), an optical element, or the like, in place of the etching step, the manufacturing method may include another step of processing the substrate on which the pattern has been formed. An advantage of the device manufacturing method of the present embodiment is at least one of performance, quality, productivity, and production cost of the article as compared with the conventional method.

While the invention has been described with reference to exemplary embodiments, it is understood that the invention is not limited to the disclosed embodiments. The scope of the patent application after the text should be interpreted broadly to cover all modifications and equivalent structures and functions.

The present application claims the benefit of the Japanese Patent Application No. 2014-229177 filed on Nov. 11, 2014, and the Japanese Patent Application No. 2015-172018 filed on Sep. 1, 2015, the entire disclosure of Incorporated herein.

103‧‧‧Mold

103a‧‧‧ pattern part

104‧‧‧Resin

105‧‧‧ Wafer

106‧‧‧Substrate chuck

114‧‧‧Mold shape variable mechanism

115‧‧‧Variable wafer shape mechanism

Claims (22)

An imprint method for forming a pattern on an imprint material applied to a substrate using a mold, the imprint method comprising the steps of: releasing the mold from the imprint material such that a boundary from which the mold is peeled off based on the mold is The assumption of a straight line is that the two opposite boundaries are close to each other and remain in a straight line after the imprint material has solidified. The embossing method of claim 1, wherein in the step, the mold is deformed such that when viewed from an axial direction in the boundary, the mold is deformed into a convex shape along a cylindrical shape and toward the substrate, The cylindrical shape has an axis extending parallel to the plane of the mold. The imprint method of claim 2, wherein in the step, the substrate is deformed such that when viewed from the substrate, the substrate is deformed into a concave shape from the mold to correspond to the convexity of the mold. The deformed part. The imprint method of claim 1, wherein in the step, the substrate is deformed such that the substrate is deformed into a convex shape along the cylindrical shape and toward the mold when viewed from an axial direction in the boundary. The cylindrical shape has an axis extending parallel to a plane of the substrate. The embossing method of claim 4, wherein in the step, the mold is deformed such that when viewed from the mold, the mold is deformed to be concave from the substrate to correspond to the convexity of the mold. Out of the deformation part. The imprint method of claim 1, wherein in the step, the mold is deformed by adjusting the rigidity of the mold to release the mold from the imprint material. For example, the imprint method of claim 1 of the patent scope, wherein, in this step In the step, at least one of the mold or the substrate is deformed by using fluid pressure to release the mold from the imprint material. The imprint method of claim 1, wherein in the step, at least one of the mold or the substrate is deformed by using an external force generated by the contact, so that the mold is removed from the imprint material freed. An imprint method according to claim 1, wherein in the step, at least one of the mold or the substrate is deformed by using a remote force generated by an electric field or a magnetic field, so that the mold is pressed from the pressure The printed material is released. The imprint method of claim 6, wherein the rigidity of the mold is adjusted by adjusting the suction force of the mold holder for holding the mold. The imprint method of claim 6, wherein the rigidity of the mold is adjusted by adjusting the thickness of the mold. An imprint apparatus for forming a pattern on an imprint material applied to a substrate by using a mold, the imprint apparatus comprising: a mold holder that is configured to hold the mold; and a substrate holder that is configured to hold the substrate; the mold shape is variable a unit configured to deform the mold held by the mold holding member; a substrate shape variable unit configured to deform the substrate held by the substrate holding member; and a controller, the controller group configured to pre-control the mold holding member The mold At least one of the shape variable unit or the substrate shape variable unit is based on the assumption that the boundary at which the mold is peeled off from the imprint material is a straight line, the two opposite edges are close to each other while being maintained while the mold is released from the imprint material Straight line status. An imprint apparatus according to claim 12, wherein the controller controls at least one of the mold holder or the mold shape variable unit such that when the mold is released from the imprint material, from the boundary Viewed in the axial direction, the mold is deformed into a convex shape along the cylindrical shape and toward the substrate, the cylindrical shape having an axis extending parallel to the plane of the mold. The imprint apparatus of claim 13, wherein the controller controls the substrate shape variable unit such that when viewed from the substrate, the substrate is deformed to be concave from the mold so as to correspond to the The convex deformation portion of the mold. An imprint apparatus according to claim 12, wherein the controller controls at least one of the mold holder or the substrate shape variable unit such that when the mold is released from the imprint material, from the boundary Viewed in the axial direction, the substrate is deformed into a convex shape along the cylindrical shape and toward the mold, the cylindrical shape having an axis extending parallel to the plane of the substrate. The imprinting apparatus of claim 15, wherein the controller controls at least one of the mold holder or the mold shape variable unit such that when viewed from the mold, the mold is deformed from the substrate The concave shape is concave so as to correspond to the convex deformation portion of the mold. The imprint apparatus of claim 12, wherein the controller deforms the mold by adjusting a suction force of the mold holder for holding the mold. The imprinting apparatus of claim 12, wherein the mold shape variable unit or the substrate shape variable unit is a fluid pressure applying unit configured to deform the mold or the substrate using fluid pressure . The imprinting apparatus of claim 12, wherein the mold shape variable unit or the substrate shape variable unit drive unit constitutes an external force generated by contact to cause the mold or the substrate Deformation. The imprinting apparatus of claim 12, wherein the mold shape variable unit or the substrate shape variable unit is a remote force applying unit, and the remote force applying unit group is configured to use a far distance generated by an electric field or a magnetic field. The force forces deform the mold or the substrate. A mold for use in an imprint apparatus that uses the mold to form a pattern on an imprint material applied to the substrate, wherein the mold has a thickness distribution such that a boundary based on the mold is peeled off from the imprint material As a straight line hypothesis, the two opposing boundaries are close together and remain in a straight line as the mold is released from the imprint material. A method of manufacturing an article, the method comprising the steps of: using the imprinting method according to any one of claims 1 to 11 or using the imprinting apparatus according to any one of claims 12 to 20 or Forming on the substrate using a mold as in claim 21 Patterning; and processing the substrate on which patterning has been performed during the forming process.