CN101154702B - Packaging tool of light emitting diode - Google Patents
Packaging tool of light emitting diode Download PDFInfo
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- CN101154702B CN101154702B CN2006101599468A CN200610159946A CN101154702B CN 101154702 B CN101154702 B CN 101154702B CN 2006101599468 A CN2006101599468 A CN 2006101599468A CN 200610159946 A CN200610159946 A CN 200610159946A CN 101154702 B CN101154702 B CN 101154702B
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- emitting diode
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Abstract
The invention discloses a light emitting diode encapsulation jig, which is used to plug a support frame sheet with a plurality of support frames for adhesive encapsulation operation. The invention comprises a mould base for plugging the support frame sheet and a restricting device for plugging the mould base and positioning the support frame sheet. A positioning pin is formed outside at least oneelectrode pin of the support frame. a mould cup of the mould base is provided with a first positioning hole for plugging the positioning pin so as to improve the precise positioning of the support frame for the mould cup and overcome the drawbacks of the prior art. The invention further provides the mould base of the light emitting diode encapsulation jig and the support frame sheet for the support frame sheet.
Description
Technical field
The present invention relates to a kind of encapsulation technology of light-emitting diode, refer to the die holder of a kind of packaging tool of light emitting diode, packaging tool of light emitting diode and the bracket tablet that is applied to packaging tool of light emitting diode especially.
Background technology
The principle of luminosity that is different from the incandescent lamp heating, light-emitting diode (Light Emitting Diode, but principle of luminosity LED) mainly is to apply electric current on luminescent substance, to reach illumination effect, so light-emitting diode is called as cold light source (Cold light).Because light-emitting diode has advantages such as high-durability, life-span are long, light and handy, power consumption is low, and do not contain harmful substance such as mercury, therefore, make the solid-state illumination of using light-emitting diode become the important research and development target of following global Lighting Industry and semiconductor industry yet.Common application direction then for example comprise white-light illuminating, indicator light, automobile-used signal lamp and red signal lamp used by rail workers, flashlight and light-emitting diode (LED) backlight module, light source of projector, with application such as display.
Exploitation and application along with High Power LED, because volume is little, the optical density height, have the characteristic of maximum light output with unit are, make the illumination Design of light-emitting diode need not use traditional dot matrix LEDs, wherein influence the main cause of the luminous efficiency of High Power LED, promptly be the encapsulating packaging operation of light-emitting diode, particularly be applied to for example automobile-used headlight, during signal lamp or red signal lamp used by rail workers or the like industry, because distribution exists certain regulation limitations and standard with luminous efficiency for luminous intensity distribution, therefore the optics at light-emitting diode just seems especially rigorous with assembling precision.TaiWan, China is announced the relevant design that novel patents such as several M285041 number of No. 326250, bulletin No. 343036 and certificate number promptly disclose packaging tool of light emitting diode.
As shown in Figure 1, existing packaging tool of light emitting diode be used to plant have a plurality of supports 11 bracket tablet 1 for carrying out the encapsulating packaging operation, respectively this support 11 is laterally linked spaced reciprocally by two braces 13, and all has a pair of electrode pin 111 in order to the electrical couplings light-emitting diode.This tool is made of the pedestal (not shown) that a die holder 2 and is used for loading this die holder 2 in fact, this die holder 2 comprises the silicon steel sheet 21 that supplies plant bracket tablet 1, a plurality of fixed interval in being located at V font stand 25 between relative wantonly two mould cups 23 and the upright guide pillar 27 of being located at these silicon steel sheet 21 both sides on this silicon steel sheet 21 for the mould cup 23 of splendid attire packing colloid, a plurality of standing on this silicon steel sheet 21, and this guide pillar 27 also has the groove 271 in order to guide support tablet 1.
Aforementioned this bracket tablet 1 is through being plugged to after this die holder 2 forms the location, by this mould cup 23 is respectively carried out encapsulating, and promptly finishes the sealing operation through baking, the demoulding.But each support 11 of this bracket tablet 1 is cross-placed on this stand 25 by its a connecting piece 13, and provide the location of front, rear, left and right and below by the groove 271 that both sides are inserted in guide pillar 27, be that each bracket tablet 1 is not directly to be positioned this silicon steel sheet 21, therefore, the indirect addressing mode that this method constituted causes encapsulating eccentric and brilliant high unstable problem easily because of the accumulated tolerance of each assembly.Particularly this guide pillar 27 all is to be made by plastic material, and the precision that plastics penetrate can only reach 0.2mm, be not only the cumulative errors of processing compared to the punching precision 0.001mm of silicon steel sheet 1, and the expansion coefficient difference that is produced when toasting and trickle softening transform phenomenon are easier to increase the weight of to encapsulate eccentric phenomena, adding plastic guide pillar 27 causes wearing and tearing more must increase the weight of to encapsulate eccentric phenomena through the demoulding repeatedly, cause the encapsulation qualification rate low excessively, make the manufacturing cost costliness relatively.
In order to improve the shortcoming of aforementioned prior art, TaiWan, China is announced No. 326250 novel patent and is proposed a kind of relevant location structure design of sending out dress diode package tool, as shown in Figure 2, it comprises that equally the pedestal (not shown) that is used for loading this die holder 4 by die holder 4 and is constituted, this die holder 4 comprises the silicon steel sheet 41 for plant bracket tablet 3, a plurality of fixed interval on this silicon steel sheet 41 for the mould cup 43 of splendid attire packing colloid, and a plurality ofly upright be located at the Y font stand 45 between wantonly two mould cups 43 relatively on this silicon steel sheet 41, and omitted the guide pillar 27 of aforementioned prior art.And in the applied bracket tablet 3 with a plurality of supports 31, except this support 31 is respectively laterally linked spaced reciprocally by two braces 33, and all have outside a pair of electrode pin 311 in order to the electrical couplings light-emitting diode, in addition respectively between this adjacent supports 31 punching press form a holding piece 35.So that when this bracket tablet 3 is cross-placed on this stand 45 according to its a connecting piece 33, the clamping that intersects by this holding piece 35 and this Y font stand 45 provides the location of front, rear, left and right and below.Though this prior art utilizes easy structural design that locating effect is provided, but in the positioning design that lacks the both sides guide pillar, the location of bracket tablet 3 also built on the sand, easily producing beat rocks, simultaneously because of there not being location up, also cause the excessive brilliant high unstable problem of support 31 degree of depth variations, cause the lighting angle expansion of light-emitting diode or dwindle.
In order to solve aforementioned prior art problems, the several M285041 number novel patents of TaiWan, China certificate number have proposed to use the design of restriction device, as shown in Figure 3, its applied bracket tablet 1 and die holder 2 are identical with prior art shown in Figure 1, comprise and providing plant to have the bracket tablet 1 of a plurality of supports 11 for carrying out the encapsulating packaging operation, respectively this support 11 is laterally linked spaced reciprocally by two braces 13, and all has a pair of electrode pin 111 in order to the electrical couplings light-emitting diode.And tool is made of the pedestal 29 that a die holder 2 and is used for loading this die holder 2 in fact, this die holder 2 comprises that the silicon steel sheet 21 that supplies plant bracket tablet 1, a plurality of fixed interval are being located at V font stand 25 between relative wantonly two mould cups 23 and the upright guide pillar 27 that is located at these silicon steel sheet 21 both sides on this silicon steel sheet 21 for the mould cup 23 of splendid attire packing colloid, a plurality of standing on this silicon steel sheet 21, and this guide pillar 27 also has the groove 271 in order to guide support tablet 1.The characteristic of this case is to set up a restriction device 28 that has groove 281 equally, in order to the top that is compressed on this bracket tablet 1 and be fixed on this guide pillar 27.
Though this patent utilize restriction device 28 provide upper and lower to locating effect, yet same cumulative errors problem is also unresolved, be that each bracket tablet 1 is not directly to be positioned this silicon steel sheet 21, the indirect addressing mode that it constituted causes encapsulating eccentric and brilliant high unstable problem easily because of the accumulated tolerance of each assembly.Particularly this guide pillar 27 all is to make with plastic material, and the precision that plastics penetrate can only reach 0.2mm, be not only the cumulative errors of processing compared to the punching precision 0.001mm of silicon steel sheet 1, and the expansion coefficient difference that is produced when carrying out about 150 ℃ baking is easier to increase the weight of to encapsulate eccentric phenomena with softening transform phenomenon slightly, adding plastic guide pillar 27 causes wearing and tearing more must increase the weight of to encapsulate eccentric phenomena through the demoulding repeatedly, cause the encapsulation qualification rate low excessively, make the manufacturing cost costliness relatively.
Summary of the invention
One object of the present invention promptly is to provide a kind of packaging tool of light emitting diode and die holder and bracket tablet that promotes positioning accuracy.
Another object of the present invention is to provide a kind of packaging tool of light emitting diode and die holder and bracket tablet that improves production.
For taking off purpose and other purpose on reaching, the invention provides a kind of packaging tool of light emitting diode, be used to have the bracket tablet of angle and the die holder corresponding with this bracket tablet and join and put, this die holder comprises: a body has a plurality of spaced holding parts; And a plurality of mould cups, being used for the splendid attire packing colloid, correspondence is fixed on respectively this holding part, and at least one side of at least two these mould cups is provided with first location hole for corresponding this angle of planting, and this first location hole runs through this body.
At least one side of aforementioned this mould cup can be provided with flange, and this first location hole is positioned at this flange and run through this body.Preferably, the both sides of this mould cup all can have flange, and all form first location hole that runs through this body at two flanges.This holding part can be made as the through hole of corresponding mould cup-shaped; This body is structure or block structure in the form of sheets, and wherein the body of laminated structure can adopt silicon steel sheet, and the body of block structure can be selected from wherein one of ceramic block, bloom and aluminium block; And this body also can have second location hole that is located at both sides, in order to the restriction device of pegging graft.
In addition, this body also can have at least one support portion that is located between wantonly two holding parts, in order to support a bracket tablet.Preferably, this support portion can be the stand that is convexly set in this body, and the top have one the guiding interface, support this bracket tablet in order to correcting; Wherein, this guiding interface can be in the shape of the letter V and the Y font wherein one.
The die holder of packaging tool of light emitting diode provided by the present invention also can comprise a pedestal, has in order to be horizontally disposed with the portion that is provided with of this body.Preferably, this portion of setting can be the slot of offering from this pedestal one side level; Wherein, this pedestal can be ㄩ font section structure, and this portion of setting is adjacent to the top.
For reaching above-mentioned same purpose, the present invention also provides a kind of packaging tool of light emitting diode, being used to have the die holder of location hole and guiding interface and the bracket tablet corresponding with this die holder joins and puts, this bracket tablet comprises: a plurality of supports, arrange the space, and have a pair of electrode pin individually, and form the angle that a correspondence is inserted in this location hole at least one electrode outside of foot of this support respectively in order to the electrical couplings light-emitting diode; And the link piece of at least two these guiding interfaces of corresponding plant, link respectively this support spaced reciprocally.
In a preferred embodiment, respectively two electrode outside of foots of this support all can form an angle.No matter and one or two electrode outside of foots form angle, this angle all can directly be attached at the outside of this electrode pin, or this angle can be attached at this link piece and be positioned at the outside of this electrode pin.In addition, this bracket tablet also can comprise and be combined in the respectively sheet metal of this support one side surface, and this angle is attached at this sheet metal and is positioned at the outside of this electrode pin.
For reaching above-mentioned same purpose, the present invention also provides a kind of packaging tool of light emitting diode, has the bracket tablet of a plurality of supports for carrying out the encapsulating packaging operation for planting, respectively this support all has a pair of electrode pin in order to the electrical couplings light-emitting diode, and respectively at least one electrode outside of foot of this support forms an angle, this tool comprises: die holder, for the plant bracket tablet, at least have a body and a plurality of mould cup for the splendid attire packing colloid, this body is provided with spaced a plurality of holding part with fixing respectively this mould cup of correspondence, and at least one side of at least two these mould cups is provided with first location hole for corresponding plant angle; And the restriction device, be the frame structure that inner edge has positioning groove, with by this positioning groove for this bracket tablet of location, and have the Plug Division at two ends and peg graft for correspondence and be fixed on this body.
At least one side of aforementioned this mould cup can be provided with flange, and this first location hole is positioned at this flange and run through this body.Preferably, the both sides of this mould cup all can have flange, and all form first location hole that runs through this body at two flanges.This holding part can be made as the through hole of corresponding mould cup-shaped; This body is structure or block structure in the form of sheets, and wherein the body of laminated structure can adopt silicon steel sheet, and the body of block structure can be selected from wherein one of ceramic block, bloom and aluminium block; And this body also can have second location hole that is located at both sides, pegs graft for the Plug Division of this restriction device is corresponding, and preferably, this Plug Division is the convex body of a width less than this restriction device.Certainly for reaching the grafting effect, this body also can have the convex body that is located at both sides on the contrary, and for the corresponding grafting in the Plug Division of this restriction device, preferably, this Plug Division is a width greater than positioning groove and corresponding to the jack of this convex body.This restriction device can be the ㄇ font metal framework structure that inner edge has positioning groove.
In addition, this body also can have at least one support portion that is located between wantonly two holding parts, in order to support a bracket tablet.Preferably, this support portion can be the stand that is convexly equipped with at this body, and the top have one the guiding interface, support this bracket tablet in order to correcting; Wherein, this guiding interface can be in the shape of the letter V and the Y font wherein one.
Die holder in the packaging tool of light emitting diode provided by the present invention also can comprise a pedestal, has in order to be horizontally disposed with the portion that is provided with of this body.Preferably, this portion of setting can be the slot of offering from this pedestal one side level; Wherein, this pedestal can be ㄩ font section structure, and this portion of setting is adjacent to the top.
Compared to prior art, the present invention proposes a kind of packaging tool of light emitting diode and die holder and bracket tablet, utilize first location hole design of the angle collocation body in the bracket tablet, providing with the body is the direct locating effect of datum mark, derive accumulated tolerance and cause encapsulating off-centre and the unstable problem of brilliant height so can overcome prior art employing indirect addressing design, reach the lifting positioning accuracy and promote with the essence effect of relative raising production.
Description of drawings
Fig. 1 is that the side that shows traditional packaging tool of light emitting diode is cutd open organigram;
Fig. 2 is the schematic diagram that the demonstration TaiWan, China is announced No. 326250 packaging tool of light emitting diode that novel patent disclosed;
Fig. 3 is the schematic diagram that shows the several M285041 number packaging tool of light emitting diode that novel patent disclosed of TaiWan, China certificate number;
Fig. 4 shows that the present invention is applied to the bracket tablet schematic diagram of packaging tool of light emitting diode;
Fig. 5 A is the schematic diagram that shows the die holder of packaging tool of light emitting diode of the present invention;
Fig. 5 B is the body schematic diagram that shows the die holder of packaging tool of light emitting diode of the present invention;
Fig. 5 C and Fig. 5 D are respectively two kinds of embodiment schematic diagrames that show die holder first location hole of packaging tool of light emitting diode of the present invention;
Fig. 6 is the decomposing state schematic diagram that shows packaging tool of light emitting diode of the present invention;
Fig. 7 A is the assembled state schematic diagram that shows packaging tool of light emitting diode of the present invention;
Fig. 7 B is another die holder embodiment schematic diagram that shows packaging tool of light emitting diode of the present invention;
Fig. 8 is another embodiment schematic diagram that shows the die holder of packaging tool of light emitting diode of the present invention;
Fig. 9 is the packaging tool of light emitting diode assembled state schematic diagram that shows utilization Fig. 8 die holder; And
Figure 10 shows Framework construction embodiment schematic diagram of the present invention.
The main element symbol description
1 bracket tablet
11 supports
111 electrode pin
13 braces
2 die holders
21 silicon steel sheets
23 mould cups
25 stands
27 guide pillars
271 grooves
28 restriction devices
281 grooves
29 pedestals
3 bracket tablets
31 supports
311 electrode pin
33 braces
35 holding pieces
4 die holders
41 silicon steel sheets
43 mould cups
45 stands
5 bracket tablets
51 supports
511 electrode pin
53 link piece
55 angles
6 die holders
61,61 ', 61 " body
62 holding parts
63 mould cups
631 first location holes
633,633 ' flange
64 support portions
641 guiding interfaces
65 second location holes
65 ' convex body
66 pedestals
661 are provided with portion
7,7 ' restriction device
71,71 ' groove
73,73 ' Plug Division
Embodiment
Following conjunction with figs. explanation specific embodiments of the invention are so that those skilled in the art can understand technical characterictic of the present invention easily and reach effect.
See also Fig. 4, it has shown that the present invention is applied to the bracket tablet schematic diagram of packaging tool of light emitting diode, bracket tablet 5 as shown in the figure comprises a plurality of supports 51 and at least two link piece 53, wherein, respectively arrange these support 51 spaces, and have a pair of electrode pin 511 individually, and form an angle 55, and at least two link piece 53 link respectively this support 51 spaced reciprocally at least one electrode pin 511 outsides of this support 51 respectively in order to the electrical couplings light-emitting diode.
In the present embodiment, be to show that respectively two electrode pin, 511 outsides of this support 51 all form an angle 55, and be attached at one link piece 53 and the outside that is positioned at this electrode pin 511 is an example with this angle 55, but those skilled in the art all can be according to its quantity of actual needs change and coupling position, be not to exceed with shown in the present embodiment, for example can only form an angle 55, or this angle 55 can directly be attached at the outside of this electrode pin 511 at one electrode outside of foot.
See also Fig. 5 A, it has shown the schematic diagram of the die holder of packaging tool of light emitting diode of the present invention, die holder 6 as shown in the figure comprises a sheet of body 61 and a plurality of mould cup 63, the body 61 of this sheet has a plurality of spaced holding parts 62, and respectively this mould cup 63 is used for the splendid attire packing colloid, and correspondence is fixed on respectively this holding part 62, and is provided with first location hole 631 at least one side of this mould cup 63 respectively.Though be to be example in the present embodiment to show that respectively at least one side of this mould cup 63 is provided with first location hole 631, yet also can be only be provided with first location hole 631 at least one side of at least two mould cups 63, can reach enough locating effects equally, non-ly exceed with present embodiment, but these dispose quantitative variation and should be that the persons of ordinary skill in the technical field of the present invention can understand and implement according to this, so another enforcement illustration of no longer arranging in pairs or groups is given unnecessary details.
Please cooperate and consult Fig. 5 A Fig. 5 B, the body 61 of aforementioned this sheet can adopt silicon steel sheet, this holding part 62 is made as the through hole of corresponding mould cup 63 shapes, and the both sides of this mould cup 63 all have a flange 633, and all forms first location hole 631 that runs through this body 61 at two flanges 633.Though be in the present embodiment to show that mould cup 63 both sides are equipped with flange 633 and first location hole 631 is an example, but those skilled in the art all can be according to its quantity of actual needs change and coupling position, be not to exceed with shown in the present embodiment, the bracket tablet that can corresponding be used and only be provided with flange 633 and be located at this flange 633 and run through one first location hole 631 of this body 61 for example in a side of this mould cup.
In addition, for the preferred positioning effect is provided, this body 61 also can have at least one support portion 64 that is located between wantonly two holding parts 62, in order to support for example aforesaid bracket tablet 5.In the present embodiment, this support portion 64 can be the stand that is convexly equipped with at this body 61, and the top has the guiding interface 641 of a Y font, supports this bracket tablet in order to correcting, and certainly in other embodiments, this guiding interface 641 also can be in the shape of the letter V.Moreover, using the restriction device in order to arrange in pairs or groups, this body 61 also can have second location hole 65 that is located at both sides, in order to the special restriction device (being detailed later) of pegging graft.
Aforementioned this holding part 62 is made as the through hole of corresponding mould cup 63 shapes shown in Fig. 5 B, promptly comprise the moulded of this mould cup 63 and first location hole 631.And this second location hole 65 is in order to peg graft a special restriction device; its shape generally is the squared design of icon; but when actual body 61 punching presses of for example carrying out to silicon steel sheet; usually can in advance the corner punching be concentrated to prevent stress; and the flanging that forms after the reserve part punching press; the degree of depth of this second location hole 65 of extension that can appropriateness after the ejection formation of arranging in pairs or groups again coats increases the accuracy and firm effect of the restriction device of pegging graft.
Based on the flanging that forms after the reserve part punching press, the ejection formation of arranging in pairs or groups again coats the back appropriateness and extends the degree of depth, with the practice of increase accuracy with firm effect, is equally applicable to this first location hole 631.Shown in Fig. 5 C, this body 61 forms this first location hole 631 in the lump when punching press forms holding part 62, and the accuracy requirement of visual this first location hole 631 and the flanging that when punching press forms this for example for the holding part 62 of through hole, forms after the reserve part punching press, in the flange 633 with mould cup 63 sides of seasonal follow-up ejection formation, coat on it in the mode that trims this holding part 62, design makes that this first location hole 631 is a positioning reference with this body 61, overcomes the problem of the existing cumulative errors of prior art thus.
Similarly, desire makes that this first location hole 631 is a positioning reference with this body 61, and then overcome the design of the existing cumulative errors problem of prior art, be not to exceed with the embodiment shown in aforementioned Fig. 5 C, can be shown in Fig. 5 D, this body 61 forms this first location hole 631 in the lump when punching press forms holding part 62, but and the flanging that forms after the reserve part punching press, in the flange 633 ' with mould cup 63 sides of seasonal follow-up ejection formation, coat this holding part 62 fully, first location hole 631 that gets of designing institute is positioning reference with this body 61 with this mould cup 63 simultaneously thus, can overcome the problem of the existing cumulative errors of prior art.
See also Fig. 6 and Fig. 7 A, it has shown the decomposition and the assembled state schematic diagram of packaging tool of light emitting diode of the present invention respectively, tool as shown in the figure has the bracket tablet 5 of a plurality of supports 51 for carrying out the encapsulating packaging operation for plant is for example aforementioned, respectively this support 51 all has a pair of electrode pin 511 in order to the electrical couplings light-emitting diode, and respectively at least one electrode pin 511 outsides of this support 51 form an angle 55, and this tool comprises a for example aforesaid die holder 6 and a restriction device 7.
This die holder 6 is for plant bracket tablet 5, at least have a body 61 and a plurality of mould cup 63 for the splendid attire packing colloid, this body 61 is provided with spaced a plurality of holding part 62 with fixing respectively this mould cup 63 of correspondence, and respectively at least one side of this mould cup 63 is provided with first location hole 631 for corresponding plant angle 55, and this body 61 also has second location hole 65 that is located at both sides.In addition, this die holder also can comprise a pedestal 66, has in order to be horizontally disposed with the portion that is provided with 661 of this body 61, in the present embodiment, this pedestal is ㄩ font section structure, and this is provided with portion 661 and is adjacent to the top, for example the slot for offering from these pedestal 66 1 side levels.Because in the packaging tool of light emitting diode provided by the present invention, the bracket tablet 5 that is used and die holder 6 in fact with the 4th and embodiment shown in Figure 5 identical, therefore no longer repeat to give unnecessary details identical structural design with change routine.
This restricts device 7, is to be the frame structure that inner edge has positioning groove 71, supplies this bracket tablet 55 of location to pass through this positioning groove 71, and has Plug Division 73 is fixed on this body 61 for the correspondence grafting second location hole 65 at two ends.In the present embodiment, this restriction device 7 is the ㄇ font metal framework structure that inner edge has positioning groove 71, and this Plug Division 73 is width convex bodys less than this restriction device 7, and pegging graft with accurate control Plug Division 73 thus is fixed on the emplacement depth of this second location hole 65.
Before utilization packaging tool of light emitting diode provided by the present invention carries out the encapsulating packaging operation of light-emitting diode envelope, in advance this bracket tablet 5 is plugged in this die holder 6, utilize first location hole, 631 designs of the angle 55 collocation bodies 61 in the bracket tablet 5, providing with body 61 is the direct locating effect that datum mark comprises the front, rear, left and right direction, and be aided with support portion 64 and support one link piece 53, adopt the indirect addressing design to derive accumulated tolerance and cause encapsulating eccentric problem so can overcome prior art; Collocation use restriction device 7 to be plugged to second location hole 65 of fixed this body 61 and provide upper and lower to direct location altitude effect, can overcome prior art employing indirect addressing design and derive accumulated tolerance and cause brilliant high unstable problem, the essence effect that reaches lifting positioning accuracy and relative raising production is promoted.
Though the die holder 6 shown in the aforesaid embodiment, be that to be arranged on a pedestal 66 with the body 61 of structure in the form of sheets be that example describes, but actual be not when carrying out the encapsulating packaging operation to use this pedestal 66 to exceed, also the body 61 of laminated structure can be arranged on the pedestal of other pattern, not influence the operation that it is used to carry out the encapsulating encapsulation.Therefore, under the situation of not considering material cost, also this body can be integrated the function of pedestal, die holder shown in Fig. 7 B comprises the body 61 of a block structure " and a plurality of mould cup 63; this body 61 " have a plurality of spaced holding parts 62 equally, and respectively this mould cup 63 is used for the splendid attire packing colloid, and correspondence is fixed on respectively this holding part 62, and is provided with first location hole 631 at least one side of this mould cup 63 respectively.Aforementioned this holding part 62 is made as the through hole of corresponding mould cup 63 shapes, and the both sides of this mould cup 63 all have a flange 633, and all forms first location hole 631 that runs through this body 61 at two flanges 633.The described body 61 that is block structure " can be selected from wherein one of ceramic block, bloom and aluminium block.
Fig. 8 and Fig. 9 are for according to the die holder of packaging tool of light emitting diode of the present invention and use the accompanying drawing that another embodiment drew of the packaging tool of light emitting diode of this die holder, wherein, the assembly identical or approximate with previous embodiment represented with identical or approximate element numbers, and omit detailed narration, so that the explanation of this case is clearer understandable.
The maximum difference of present embodiment and previous embodiment is that this body in the previous embodiment has second location hole that is located at both sides, and restriction device two ends then have and for example are the Plug Division of convex body, and are then just the opposite in the present embodiment.
As Fig. 8 and shown in Figure 9, for reaching the grafting effect, body 61 ' also can have the convex body 65 ' (for example integrating a support portion) that is located at both sides on the contrary, Plug Division 73 for restriction device 7 ', corresponding pegging graft, certainly, this Plug Division 73 ' need change adopts a width greater than positioning groove 71, and corresponding to the jack of this convex body 65 '.
In addition, though the aforementioned bracket tablet 5 that discloses with utilization is an example with as shown in Figure 4 single layer structure all, when the light-emitting diode that is used in encapsulation belongs to higher power applications, can take laminated construction usually to strengthen its radiating effect.As shown in figure 10, promptly described bracket tablet also can comprise and be combined in the respectively sheet metal 57 of these support 51 1 side surfaces, and in this kind structural design, this angle 55 can directly be attached at this sheet metal 57 and be positioned at the outside of this electrode pin 511.
Comprehensively aforementioned, the present invention proposes a kind of packaging tool of light emitting diode and die holder and bracket tablet, utilize first location hole design of the angle collocation body in the bracket tablet, providing with the body is the direct locating effect of datum mark, adopt the indirect addressing design to derive accumulated tolerance and cause encapsulating eccentric and brilliant high unstable problem so can overcome prior art, the essence effect that reaches lifting positioning accuracy and relative raising production is promoted, and has solved the existing problem of prior art relatively.
The foregoing description is illustrative principle of the present invention and effect thereof only, but not is used to limit the present invention.Those skilled in the art all can be under spirit of the present invention and category, and the foregoing description is modified and changed.Therefore, the scope of the present invention, claim is listed as described later.
Claims (34)
1. packaging tool of light emitting diode comprises:
Bracket tablet has angle; And
Die holder joins with this bracket tablet and to put, and this die holder comprises:
One body has a plurality of spaced holding parts; And
A plurality of mould cups are used for the splendid attire packing colloid, and correspondence is fixed in respectively this holding part, and at least one side of at least two these mould cups is provided with first location hole for corresponding this angle of planting, and this first location hole runs through this body.
2. packaging tool of light emitting diode as claimed in claim 1, wherein, at least one side of this mould cup is provided with flange, and this first location hole is positioned at this flange and run through this body.3. packaging tool of light emitting diode as claimed in claim 1, wherein, the both sides of this mould cup all have flange, and all form first location hole that runs through this body at two flanges.
4. packaging tool of light emitting diode as claimed in claim 1, wherein, this holding part is the through hole of corresponding mould cup-shaped.
5. packaging tool of light emitting diode as claimed in claim 1, wherein, this body in the form of sheets structure and block structure wherein one.
6. packaging tool of light emitting diode as claimed in claim 5, wherein, the body of this laminated structure is a silicon steel sheet.
7. packaging tool of light emitting diode as claimed in claim 1, wherein, this body also has second location hole that is located at both sides, in order to the restriction device of pegging graft.
8. packaging tool of light emitting diode as claimed in claim 1, wherein, this body also has at least one support portion that is located between any two holding parts, in order to support a bracket tablet.
9. packaging tool of light emitting diode as claimed in claim 8, wherein, this support portion is the stand that is convexly set in this body, and the top have one the guiding interface, support this bracket tablet in order to correcting.
10. packaging tool of light emitting diode as claimed in claim 9, wherein, this guiding interface be in the shape of the letter V and the Y font wherein one.
11. packaging tool of light emitting diode as claimed in claim 1 also comprises a pedestal, has in order to be horizontally disposed with the portion that is provided with of this body.
12. packaging tool of light emitting diode as claimed in claim 11, wherein, the slot of this portion of setting for offering from this pedestal one side level.
13. packaging tool of light emitting diode as claimed in claim 11, wherein, this pedestal is ㄩ font section structure, and this system of portion of setting is adjacent to the top.
14. a packaging tool of light emitting diode comprises:
Die holder has location hole and guiding interface; And
Bracket tablet is put with corresponding the joining of this die holder, and this bracket tablet comprises:
A plurality of supports, arrange its space, and have a pair of electrode pin in order to this light-emitting diode of electrical couplings individually, and form the angle that a correspondence is inserted in this location hole at least one this electrode outside of foot of this support respectively; And
At least two corresponding link piece of planting this guiding interface link respectively this support spaced reciprocally.
15. packaging tool of light emitting diode as claimed in claim 14, wherein, respectively two electrode outside of foots of this support all form an angle.
16. as claim 14 or 15 described packaging tool of light emitting diode, wherein, this angle is attached at the outside of this electrode pin.
17. as claim 14 or 15 described packaging tool of light emitting diode, wherein, this angle is attached at this link piece and is positioned at the outside of this electrode pin.
18. as claim 14 or 15 described packaging tool of light emitting diode, comprise also being combined in the respectively sheet metal of this support one side surface that this angle is linked to this sheet metal and is positioned at the outside of this electrode pin.
19. packaging tool of light emitting diode, has the bracket tablet of a plurality of supports for carrying out the encapsulating packaging operation for planting, respectively this support all has a pair of electrode pin in order to the electrical couplings light-emitting diode, and respectively at least one electrode outside of foot of this support forms an angle, and this tool comprises:
Die holder, for the plant bracket tablet, at least have a body and a plurality of mould cup for the splendid attire packing colloid, this body is provided with the spaced holding part of many Ge with fixing respectively this mould cup of correspondence, and at least one side of at least two these mould cups is provided with first location hole for corresponding this angle of planting; And
The restriction device is the frame structure that inner edge has positioning groove, with by this positioning groove for this bracket tablet of location, and have the Plug Division at two ends and peg graft for correspondence and be fixed in this body.
20. packaging tool of light emitting diode as claimed in claim 19, wherein, at least one side of this mould cup is provided with flange, and this first location hole is positioned at this flange and run through this body.
21. packaging tool of light emitting diode as claimed in claim 19, wherein, the both sides of this mould cup all have flange, and all form first location hole that runs through this body at two flanges.
22. packaging tool of light emitting diode as claimed in claim 19, wherein, this holding part is the through hole of corresponding mould cup-shaped.
23. packaging tool of light emitting diode as claimed in claim 19, wherein, this body in the form of sheets structure and block structure wherein one.
24. packaging tool of light emitting diode as claimed in claim 23, wherein, the body of this laminated structure is a silicon steel sheet.
25. packaging tool of light emitting diode as claimed in claim 19, wherein, this body also has at least one support portion that is located between any two holding parts, in order to support a bracket tablet.
26. packaging tool of light emitting diode as claimed in claim 25, wherein, this support portion is the stand that is convexly set in this body, and the top have one the guiding interface, support this bracket tablet in order to correcting.
27. packaging tool of light emitting diode as claimed in claim 26, wherein, this guiding interface be in the shape of the letter V and the Y font wherein one.
28. packaging tool of light emitting diode as claimed in claim 19, wherein, this die holder also comprises a pedestal, has in order to be horizontally disposed with the portion that is provided with of this body.
29. packaging tool of light emitting diode as claimed in claim 28, wherein, the slot of this portion of setting for offering from this pedestal one side level.
30. packaging tool of light emitting diode as claimed in claim 28, wherein, this pedestal is ㄩ font section structure, and this portion of setting is adjacent to the top.
31. packaging tool of light emitting diode as claimed in claim 19, wherein, this body also has second location hole that is located at both sides, pegs graft for the Plug Division of this restriction device is corresponding.
32. packaging tool of light emitting diode as claimed in claim 31, wherein, this Plug Division is the convex body of a width less than the restriction device.
33. packaging tool of light emitting diode as claimed in claim 19, wherein, this body also has the convex body that is located at both sides, pegs graft for the Plug Division of this restriction device is corresponding.
34. packaging tool of light emitting diode as claimed in claim 33, wherein, this Plug Division is a width greater than positioning groove and corresponding to the jack of this convex body.
35. packaging tool of light emitting diode as claimed in claim 19, wherein, this restriction device is the ㄇ font metal framework structure that inner edge has positioning groove.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2006101599468A CN101154702B (en) | 2006-09-28 | 2006-09-28 | Packaging tool of light emitting diode |
| PCT/CN2007/002840 WO2008043264A1 (en) | 2006-09-28 | 2007-09-28 | Light-emitting component package, light-emitting component packaging apparatus, and light source device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2006101599468A CN101154702B (en) | 2006-09-28 | 2006-09-28 | Packaging tool of light emitting diode |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101154702A CN101154702A (en) | 2008-04-02 |
| CN101154702B true CN101154702B (en) | 2010-11-24 |
Family
ID=39256227
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2006101599468A Expired - Fee Related CN101154702B (en) | 2006-09-28 | 2006-09-28 | Packaging tool of light emitting diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101154702B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102569552B (en) * | 2011-12-30 | 2014-08-06 | 广东德豪润达电气股份有限公司 | Production process of LED (light-emitting diode) packaging bracket and glue injection mould |
| CN104033865B (en) * | 2014-06-04 | 2017-04-05 | 漳州立达信光电子科技有限公司 | Bay onet cap body |
| CN108063172B (en) * | 2017-12-20 | 2024-01-23 | 杭州华扬电子有限公司 | Wire bonding jig |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW326250U (en) * | 1995-07-24 | 1998-02-01 | Lite On Electronics Inc | Structure of connecting a lock type holder to a module base |
| TW343036U (en) * | 1997-04-29 | 1998-10-11 | Taiwan Oasis Entpr Co Ltd | Light emitted diode implement with precise alignment |
| TWM285041U (en) * | 2005-08-31 | 2006-01-01 | Leotek Electronics Corp | Package fixture structure of an LED |
-
2006
- 2006-09-28 CN CN2006101599468A patent/CN101154702B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW326250U (en) * | 1995-07-24 | 1998-02-01 | Lite On Electronics Inc | Structure of connecting a lock type holder to a module base |
| TW343036U (en) * | 1997-04-29 | 1998-10-11 | Taiwan Oasis Entpr Co Ltd | Light emitted diode implement with precise alignment |
| TWM285041U (en) * | 2005-08-31 | 2006-01-01 | Leotek Electronics Corp | Package fixture structure of an LED |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101154702A (en) | 2008-04-02 |
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