WO2008043264A1

WO2008043264A1 - Light-emitting component package, light-emitting component packaging apparatus, and light source device

Info

Publication number: WO2008043264A1
Application number: PCT/CN2007/002840
Authority: WO
Inventors: Ming-Te Lin
Original assignee: Industrial Technology Research Institute
Priority date: 2006-09-28
Filing date: 2007-09-28
Publication date: 2008-04-17
Also published as: WO2008043264A8

Abstract

A light-emitting component package includes a light-emitting component (1511), a heat-conductor (1513), a set of electric-conducting leads (1512), and a heat dissipation base (1052). The light-emitting component (1511) is disposed on the heat-conductor (1513) and electrically coupled to the set of electric-conducting leads (1512). The heat-conductor (1513) is insulated from the set of electric-conducting leads (1512) and inserted in a hole (1523) of the heat dissipation base (1052). Meanwhile, the set of electric-conducting leads (1512) is located between at least two heat-conducting portions of the heat-conductor (1513) to form the package with heat outside and electricity inside. A light-emitting component packaging apparatus including a leadframe and a molding base, and a light source device are provided.

Description

LIGHT-EMITTING COMPONENT PACKAGE, LIGHT-EMITTING COMPONENT PACKAGING APPARATUS, AND LIGHT SOURCE

DEVICE

BACKGROUND OF THE INVENTION

Field of the Invention

[0001] The present invention relates to a light-emitting component package, a light-emitting component packaging apparatus, and a light source device.

Description of Related Art

[0002] FIG. 1 shows a light-emitting diode (LED) package disclosed in the US

6,476,549, which dissipates the heat generated by the LED chip in operation by merely exposing part of the leads 1011 and 1012 to the atmosphere to conduct thermal convection. Therefore, the heat dissipation efficiency of high power LEDs is low. When the temperature of the component becomes too high, the component may easily fail or even be damaged. [0003] FIG. 2A is a schematic view of another LED heat dissipation package disclosed in US Patent US6,799,870. The LED heat dissipation package includes a metal case 1047 having an axial extending groove 1470 formed along the axial direction of the metal case 1047; a printed circuit board (PCB) 1046 fixed in the metal case 1047; and a plurality of LED packages 1040 arranged adjacent to each other inside the axial extending groove 1470. Referring to FIG. 2B, each of the LED packages 1040 has a support member 1041 with a cup 1410 disposed on one end of the support member 1041 ; a heat sink 1042 disposed on the other end of the support member 1041 ; electrode terminals 1043 disposed on two sides of the support member 1041; an LED chip 1044 disposed in the cup 1410; a conductive wire 1045 electrically coupling the LED chip 1044 and the electrode terminals 1043; and a molding compound 1048 encapsulating the LED chip 1044, the conductive wire 1045, and a part of the support member 1041 and the electrode terminals 1043. A lens 1480 is disposed on the molding compound 1048. Thus, the LED packages 1040 may slide into the axial extending groove 1470 along the sides of the metal case 1047. For each of the LED packages 1040, the parts of the electrode terminals 1043, the support member 1041, and the heat sink 1042 exposed outside the molding compound 1048 are accommodated in the axial extending groove 1470 of the metal case 1047. The electrode terminals 1043 are electrically coupled to the PCB 1046 embedded in the metal case 1047. And, the lens 1480 is exposed outside the axial extending groove 1470.

[0004] Though the heat-conducting area of each of the LED packages 1040 may be expanded by embedding the heat sink 1042 into the metal case 1047, the LED packages 1040 are accommodated in the axial extending groove 1470 of the metal case 1047 in a manner of sliding along the sides of the metal case 1047. Thus, the above method is inconvenient in operation. Meanwhile, as the LED packages 1040 accommodated in the metal case 1047 are not positioned relative to the left and right sides, the problem of offset may easily occur, resulting in a poor optical performance in the follow-up process. Further, an opening must be additionally formed to accommodate the PCB 1046 inside the metal case 1047. As a result, the opening for accommodating the PCB 1046 forms a hollow portion inside the metal case 1047, which may reduce the heat-conducting efficiency.

[0005] Therefore, it is the problem in urgent need of solutions in this field to provide a technical solution to solve the problems of poor heat dissipation efficiency, impossibility to effectively position, low light-emitting power, and inconvenient operation, etc. of the LED package.

[0006] Referring to FIG. 3, a conventional LED packaging apparatus has a leadframe 2001 with a plurality of leads 2011 for performing the injection-molding packaging. The leads 2011 are arranged at an interval and transversely connected by two connecting sheets 2013, and are electrically coupled to the LED. The molding base 2002 includes a silicon steel sheet 2021 for the leadframe 2001 to insert; a plurality of molding cups 2023 arranged at an interval and fixed on the silicon steel sheet 2021 for containing the molding compound; a plurality of V-shaped stands 2025 standing on the silicon steel sheet 2021 and between any two opposite molding cups 2023; and guide pillars 2027 standing on two sides of the silicon steel sheet 2021. Each of the guide pillars 2027 has a trench 2271 for guiding the leadframe 2001. [0007] After the leadframe 2001 is inserted in the molding base 2002 and positioned, a molding compound is injected into each of the molding cups 2023, and then baked and released, thus completing the molding operation. However, the leads 2011 of the leadframe 2001 are disposed across the stand 2025 through a connecting sheet 2013, and are positioned in front, back, left, right, and down directions through the trenches 2271 of the guide pillars 2027 at two sides. That is, the leadframe 2001 is not directly positioned on the silicon steel sheet 2021. This indirect positioning manner may easily cause the position offset of the LED chip in the molding compound due to accumulated error of all the components. Particularly, the guide pillars 2027 are made of a plastic material, and the precision of plastic injection can merely reach 0.2 mm. When baking, the difference between the expansion coefficients of the silicon steel sheet 2021 and the guide pillars 2027 and the slight softening deformation of the guide pillars 2027 further aggravate the position offset of the LED chip. Moreover, as the plastic guide pillars 2027 are abraded due to the repeated mold releasing, the position offset of the LED chip will surely become worse. As a result, the packaging yield turns out to be too low, and the manufacturing cost is relatively higher.

[0008] TW Patent No. 326250 discloses a design of a positioning structure for an LED packaging apparatus. As shown in FIG. 4, the molding base 2004 includes a silicon steel sheet 2041 for a leadframe 2003 to insert, a plurality of molding cups 2043 arranged at an interval and fixed on the silicon steel sheet 2041 for containing a molding compound, and a plurality of Y-shaped stands 2045 standing on the silicon steel sheet 2041 and between any two opposite molding cups 2043. The guide pillars 2027 in FIG. 3 are omitted. In the leadframe 2003, the leads 2031 are arranged at an interval and transversely connected by two connecting sheets 2033, and a clamping sheet 2035 is formed by punching between two adjacent leads 2031. The leadframe 2003 is disposed across the stand 2045 through a connecting sheet 2033, and is positioned in the front, back, left, right, and down directions by the cross-clamping of the clamping sheet 2035 and the Y-shaped stand 2045. Though this conventional art uses a simple structure design to achieve a positioning effect, the leadframe 2003 is not stably positioned due to the lack of the guide pillars at the two sides, so the leadframe 2003 may easily sway or shake. Meanwhile, as the leadframe is not positioned in the up direction, the position offset problem of the LED chip that the depth variance of the leads 2031 aggravates occurs, which may result in the widening or narrowing of the overall light-emitting angle.

[0009] TW Patent No. M285041 discloses a design with a restrictor. The leadframe 2001 and the molding base 2002 used in FIG. 5 are the same as those in the conventional art in FIG. 3. The apparatus is constituted by a molding base 2002 and a bottom base 2029 for carrying the molding base 2002. The molding base 2002 includes a silicon steel sheet 2021, molding cups 2023, V-shaped stands 2025, and guide pillars 2027. Each of the guide pillars 2027 has a trench 2271 for guiding the leadframe 2001. This patent is characterized by adding a restrictor 2028 has also having a trench 2281. The restrictor 2028 presses the top of the leadframe 2001 and is fixed to the guide pillars 2027. Though this patent uses the restrictor 2028 to achieves a positioning effect in the up and down directions, the problem of the accumulated error is still not solved. That is, the leadframe 2001 is not directly positioned on the silicon steel sheet 2021, so the position offset of the LED chip in the molding compound still exists. As such, deficiencies of low mass production and high cost are induced. [0010] FIG. 6A is a three-dimensional view of a conventional package with "heat inside and electricity outside," and FIG. 6B is a cross-sectional view of a convention package with "heat inside and electricity outside." An LED 3003 is configured in a cup 3222 above a heat dissipation base 3002. A set of electric-conducting leads 3001 extending downward outside the heat dissipation base 3002 serve as the first electric-conducting lead of the LED 3003, and another set of electric-conducting leads 3011 configured on the other side of the heat dissipation base 3002 serve as a second electric-conducting lead of the LED 3003. This package has the electric-conducting leads 3001, 3011 distributed on the periphery of the LED 3003, so the heat dissipation base 3002 is enclosed by the electric-conducting leads 3001 , 3011. Therefore, the heat dissipation base 3002 is restricted by the surrounding electric-conducting leads 3001 , 3011, and cannot be expanded outward, so the heat dissipation efficiency cannot be significantly enhanced. A molding compound 3005 encapsulates and protects the LED 3003 and a conductive wire 3004, and positions and combines the top end of the electric-conducting leads 3011 and the heat dissipation base 3002. As the molding compound 3005 encapsulates most of the area of the upper portion of the heat dissipation base 3002, the effective heat dissipation area of the heat dissipation base 3002 is greatly reduced. [0011] FIG. 7 is a schematic view of a conventional inductive LED package disclosed in Japanese Laid-open Patent No. 2005-71867. The inductive LED package 4100 is constituted by an LED 4004, a secondary coil 4005, and a primary coil 4006. Two electrodes of the LED 4004 are electrically coupled to the secondary coil 4005. A secondary current is induced in the secondary coil 4005 by sensing the variation of the magnetic field source of the primary coil 4006, for lighting the LED 4004. [0012] The primary coil 4006 surrounds outside one body 4031, and the body 4031 has a hole 4030 in the center. A lamp 4002 is constituted by an LED 4004 with two electric-conducting leads 4021 disposed on a substrate 4008. After being inserted in the hole 4030, the LED 4004 is supplied with the induced secondary current to emit light. The flower appearance 4020 is the ornament.

[0013] The disadvantage of the above conventional art is that the magnetic fields generated by the primary coil 4006 and the secondary coil 4005 are open magnetic fields, the magnetic lines of force are scattered to the outside of the product, and the power of the magnetic lines of force is increased with the increase of the power supply, indicated by the broken lines in FIG. 7. As lamps are widely used in people's daily life, the magnetic fields scattered outside the lamps have a long-term impact on the users along with the illumination of the lamps, and the accumulated effect of the electromagnetic field may do harm to the health of the users. Further, the scattered magnetic fields may also affect the performance of some electronic components. For example, when those implanted with an electronic device like pace maker get close to a lamp of the conventional art, the pace maker may be interfered by the open magnetic field and causes error or even fails, which will put the user's life in danger.

SUMMARY OF THE INVENTION

[0014] The present invention provides a light-emitting component package with good heat dissipation effect.

[0015] The present invention further provides a molding base of a light-emitting component packaging apparatus, which has excellent positioning effect. [0016] The present invention also provides a leadframe of a light-emitting component packaging apparatus, which has excellent positioning effect.

[0017] The present invention further provides a light-emitting component packaging apparatus, which has a high process yield and is suitable for mass production. [0018] The present invention further provides a light source device, which prevents an open electromagnetic field from doing harm to the human health. [0019] The present invention also provides a light-emitting component package, which prevents an open electromagnetic field from doing harm to the human health.

[0020] The present invention further provides a power supplier, for providing power to a light-emitting component package, and preventing an open electromagnetic field from doing harm to the human health. [0021] In an embodiment of the present invention, a light-emitting component package includes a light-emitting component, a heat-conductor, a set of electric-conducting leads, and a heat dissipation base. The light-emitting component has at least two electrodes. The heat-conductor has a carrier portion for carrying the light-emitting component. The set of electric-conducting leads are electrically coupled to the electrodes of the light-emitting component, and are electrically insulated from the heat-conductor. The heat dissipation base has at least one hole, and the heat-conductor is inserted in the hole.

[0022] In an embodiment of the present invention, a molding base of a light-emitting component packaging apparatus has a body and a plurality of molding cups. The body has a plurality of accommodation openings arranged at an interval for fixing the corresponding molding cups. The molding cups are used to contain a molding compound, and at least one first positioning hole is formed beside each of the molding cups.

[0023] In an embodiment of the present invention, a leadframe of a light-emitting component packaging apparatus has plural sets of electric-conducting leads, a plurality of positioning pins, and at least one connecting sheet. Each set of electric-conducting leads are electrically coupled to at least two electrodes of a light-emitting component. The connecting sheet connects the sets of electric-conducting leads, and the positioning pins are connected to the connecting sheet or the electric-conducting leads. At least one positioning pin is disposed beside each set of electric-conducting leads. [0024] In an embodiment of the present invention, a light-emitting component packaging apparatus includes a leadframe and a molding base. The leadframe has plural sets of electric-conducting leads, a plurality of positioning pins, and at least one connecting sheet. Each set of electric-conducting leads are electrically coupled to at least two electrodes of a light-emitting component. The connecting sheet connects the sets of electric-conducting leads, and the positioning pins are connected to the connecting sheet or the electric-conducting leads. At least one positioning pin is disposed beside each set of electric-conducting leads. The leadframe is inserted in the molding base. The molding base has a body and a plurality of molding cups for containing a molding compound and holding one end of each set of electric-conducting leads. The body has a plurality of accommodation openings arranged at an interval for fixing the corresponding molding cups. At least one first positioning hole is formed beside each molding cup, for a corresponding positioning pin to insert.

[0025] In another embodiment of the present invention, a light-emitting component package includes a light-emitting component, a heat-conductor, and a set of electric-conducting leads. The light-emitting component has at least two electrodes. The heat-conductor has at least two heat-conducting portions and a carrier portion. The carrier portion is connected to the heat-conducting portions, and carries the light-emitting component. The set of electric-conducting leads electrically coupled to the electrodes of the light-emitting component are located between the heat-conducting portions of the heat-conductor and are electrically insulated from the heat-conductor, so as to form the package with heat outside and electricity inside. [0026] In an embodiment of the present invention, a light source device includes a power supplier and a light-emitting component package. The power supplier includes a primary coil and a primary magnetic inductive unit. An alternating electromagnetic field is induced after a current passes through the primary coil. The primary magnetic inductive unit has two ends and is wound by the primary coil, so as to induce an alternating electromagnetic field. The light-emitting component package includes a light-emitting component, a secondary coil, and a secondary magnetic inductive unit. The light-emitting component has at least two electrodes. The secondary coil has two ends electrically coupled to the electrodes. The secondary magnetic inductive unit has two ends magnetically coupled with the two ends of the primary magnetic inductive unit, so as to form a closed magnetic field loop. The secondary magnetic inductive unit is used to sense the alternating electromagnetic field induced by the primary magnetic inductive unit, and the secondary magnetic inductive unit is wound by the secondary coil. An electromotive force is induced in the secondary coil by sensing the alternating electromagnetic field.

[0027] In another embodiment of the present invention, a light-emitting component package is powered by a power supplier. The power supplier includes a primary coil and a primary magnetic inductive unit. An alternating electromagnetic field is induced after a current passes through the primary coil. The primary magnetic inductive unit has two ends and is wound by the primary coil, so as to induce an alternating electromagnetic field. The light-emitting component package includes a light-emitting component, a secondary coil, and a secondary magnetic inductive unit. The light-emitting component has at least two electrodes. The secondary coil has two ends electrically coupled to the electrodes. The secondary magnetic inductive unit has two ends magnetically coupled with the two ends of the primary magnetic inductive unit, so as to form a closed magnetic field loop. The secondary magnetic inductive unit is used to sense the alternating electromagnetic field induced by the primary magnetic inductive unit, and the secondary magnetic inductive unit is wound by the secondary coil. An electromotive force is induced in the secondary coil by sensing the alternating electromagnetic field.

[0028] In an embodiment of the present invention, a light-emitting component package is powered by a power supplier. The light-emitting component package includes a light-emitting component, a secondary coil, and a secondary magnetic inductive unit. The light-emitting component has at least two electrodes. The secondary coil has two ends electrically coupled to the electrodes. The secondary magnetic inductive unit has two ends and is wound by the secondary coil. The power supplier includes a primary coil and a primary magnetic inductive unit. An alternating electromagnetic field is induced after a current passes through the primary coil. The primary magnetic inductive unit has two ends and is wound by the primary coil, so as to induce an alternating electromagnetic field. The two ends of the secondary magnetic inductive unit are magnetically coupled with the two ends of the primary magnetic inductive unit, so as to form a closed magnetic field loop. The secondary magnetic inductive unit is used to sense the alternating electromagnetic field induced by the primary magnetic inductive unit. An electromotive force is induced in the secondary coil by sensing the alternating electromagnetic field. [0029] In view, of the above, the light-emitting component package according to an embodiment of the present invention can achieve the positioning and heat dissipation effect at the same time by combining the heat-conductor and the heat dissipation base. The light-emitting component packaging apparatus according to an embodiment of the present invention can improve the process yield and mass production by combining the positioning pins of the leadframe and the positioning holes of the molding base. The light-emitting component package according to another embodiment of the present invention is the package with heat outside and electricity inside, so the heat dissipation efficiency can be enhanced by expanding the heat dissipation base outward. The light source device according to an embodiment of the present invention adopts an inductive power supply, thus avoiding problems of loose contact or current leakage. As the induced electromagnetic field is closed, the human health will not be influenced. [0030] In order to make the aforementioned and other objectives, features, and advantages of the .present invention comprehensible, embodiments accompanied with figures are described in detail below.

[0031] It is to be understood that both the foregoing general description and the following detailed description are exemplary, and are intended to provide further explanation of the invention as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

[0032] The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention. [0033] FIG. 1 is a schematic view of an LED package disclosed in TW Patent No.

477466.

[0034] FIG. 2 A is a schematic view of an LED heat dissipation package disclosed in

US Patent US6,799,870.

[0035] FIG. 2B is a schematic view of an LED package disclosed by US Patent US6,799,870.

[0036] FIG. 3 is a cross-sectional view of a conventional LED packaging apparatus.

[0037] FIG. 4 is a schematic view of an LED packaging apparatus disclosed in TW Patent No. 326250.

[0038] FIG. 5 is a schematic view of an LED packaging apparatus disclosed in TW

Patent No. M285041.

[0039] FIGs. 6A to 6B are a three-dimensional view and a cross-sectional view of a conventional package with heat outside and electricity inside.

[0040] FIG. 7 is a schematic view of a conventional inductive LED package.

[0041] FIGs. 8A and 8B are schematic three-dimensional views of a light-emitting component package according to an embodiment of the present invention.

[0042] FIG. 9 is a schematic cross-sectional view of the light-emitting component package in FIG. 8A.

[0043] FIG. 10 is a schematic view of the light-emitting component package in FIG.

8A with additional optical devices.

[0044] FIG. 11 is a schematic three-dimensional view of a light-emitting component package according to another embodiment of the present invention. [0045] FIG. 12 is a schematic three-dimensional view of a light-emitting component package according .to another embodiment of the present invention.

[0046] FIG. 13 is a schematic three-dimensional view of a light-emitting component package without a heat dissipation base according to another embodiment of the present invention. [0047] FIG. 14A is a schematic three-dimensional view of a light-emitting component package according to another embodiment of the present invention.

[0048] FIG. 14B is a schematic cross-sectional view of the light-emitting component package in FIG. 14A without a power supply connector.

[0049] FIGs. 15A and 15B are a schematic three-dimensional view and a schematic cross-sectional view of a light-emitting component package according to another embodiment of the present invention.

[0050] FIGs. 16A and 16B are a schematic three-dimensional view and a schematic cross-sectional view of a light-emitting component package according to another embodiment of the. present invention. [0051] FIG. 17 is a schematic view of a leadframe of a light-emitting component packaging apparatus according to an embodiment of the present invention.

[0052] FlG. 18A is a schematic view of a molding base of a light-emitting component packaging apparatus according to an embodiment of the present invention.

[0053] FIG. 18B is a schematic partial view of a body of the molding base of the light-emitting component packaging apparatus in FIG. 18A.

[0054] FIGs. 18C and 18D are cross-sectional views of partial of the molding base in FIG 18 A.

[0055] FIGs. 19A and 19B are a schematic exploded view and a schematic assembly view of a light-emitting component packaging apparatus according to an embodiment of the present invention.

[0056] FIG. 20 is a schematic view of a molding base of a light-emitting component packaging apparatus according to another embodiment of the present invention.

[0057] FIGs. 21 and 22 respectively show a molding base of a light-emitting component packaging apparatus and a light-emitting component packaging apparatus adopting the molding base according to another embodiment of the present invention.

[0058] FIG. 23 is a schematic view showing an application of a leadframe of a light-emitting component packaging apparatus according to another embodiment of the present invention.

[0059] FIG. 24A is a three-dimensional view of a light-emitting component package according to an embodiment of the present invention.

[0060] FIG. 24B is a cross-sectional view of the light-emitting component package in FIG 24A.

[0061] FIG. 25 A is a three-dimensional view of a light-emitting component package according to another embodiment of the present invention.

[0062] FIG. 25B is a cross-sectional view of the light-emitting component package in FIG. 25A. [0063] FIG. 26 is an assembly view of the light-emitting component package in FIG.

24A with a power supply connector.

[0064] FIG. 27 is an assembly view of the light-emitting component package in FIG.

24 A with the power supply connector of another type.

[0065] FIG. 28 is a schematic exploded view of a light-emitting component package according to another embodiment of the present invention.

[0066] FIG. 29A is a three-dimensional view of a light-emitting component package according to another embodiment of the present invention. [0067] FIG. 29B is a cross-sectional view of the light-emitting component package in FIG. 29A.

[0068] FIG. 30A is a three-dimensional view of a light-emitting component package according to another embodiment of the present invention. [0069] FIG. 30B is a cross-sectional view of the light-emitting component package in FIG 3OA.

[0070] FIGs. 31A and 3 IB show statuses before and after a heat-conductor in FIG.

3OA is inserted in a heat dissipation base.

[0071] FIG. 32 is a three-dimensional view of a light-emitting component package according to another embodiment of the present invention.

[0072] FIG. 33 is a three-dimensional view of a light-emitting component package according to another embodiment of the present invention.

[0073] FIG. 34 is an assembly view of a light-emitting component package according to another embodiment of the present invention. [0074] FIG. 35 is an assembly view of a light-emitting component package according to another embodiment of the present invention.

[0075] FIG. 36 is a top view of another heat dissipation base adopted by the present invention.

[0076] FIG. 37 is a schematic view of a light source device according to an embodiment of the present invention.

[0077] FIG. 38 is a cross-sectional exploded view taken along Line A-A in FIG. 37.

[0078] FIG. 39 is a schematic view of a light source device according to another embodiment of the present invention.

[0079] FIG. 40 is a cross-sectional exploded view taken along Line A-A in FIG. 39. [0080] FIG. 41 is a schematic view of a light source device according to another embodiment of the present invention.

[0081] FIG. 42 is a schematic view of a light source device according to another embodiment of the present invention.

[0082] FIG. 43 is a schematic view of a light source device according to another embodiment of the present invention.

[0083] FIG. 44 is a schematic view of a light source device according to another embodiment of the present invention. DESCRIPTION OF EMBODIMENTS

[0084] Referring to FIG. 8A, a light-emitting component package according to an embodiment of the present invention is shown. The light-emitting component package of this embodiment includes a light-emitting component 1511 , a heat-conductor 1513, a set of electric-conducting leads 1512, and a heat dissipation base 1052. The light-emitting component 1511 has at least two electrodes (not shown). The electrodes of the light-emitting component 1511 are electrically coupled to the electric-conducting leads 1512. The. heat-conductor 1513 carries the light-emitting component 1511. Besides, the light-emitting component package of this embodiment includes a molding compound 1514 encapsulating the light-emitting component 1511 and a part of the electric-conducting leads 1512 and the heat-conductor 1513. The heat dissipation base 1052 has an upper surface 1521 and a lower surface 1522 opposite to the upper surface 1521, and a hole 1523 is formed in the upper surface, for the heat-conductor 1513 to be perpendicularly inserted and accommodated in the hole 1523. The heat dissipation base 1052 may be integrally formed with a hole 1523 opened therein, or may be assembled by at least two combination blocks, so that the light-emitting component 1511 is clamped with the heat dissipation base 1052 and is accommodated in the hole 1523 of the assembled heat dissipation base 1052, as shown in FIG. 8B. The heat-conductor 1513 of this embodiment may be a metal plate or other appropriate heat-conductors, and the light-emitting component 1511 may be an LED or other light-emitting components.

[0085] Referring to FIG. 9, a schematic cross-sectional view of the light-emitting component package in FIG. 8 A is shown. The light-emitting component 1511 is an LED. The material of the electric-conducting leads 1512 may be a metal, and the light-emitting component 1511 may be electrically coupled to the electric-conducting leads 1512 through a conductive wire.

[0086] The heat-conductor 1513 has a carrier portion 1513a and heat-conducting portions 1513b. The carrier portion 1513a is for carrying the light-emitting component 1511, and heat-conducting portions 1513b extends outward from the carrier portion 1513a for conducting heat. In this embodiment, the carrier portion 1513a protrudes from the center. The upper portion of the set of electric-conducting leads 1512 is located on both sides of the carrier portion 1513a, and the lower portion of the set of electric-conducting leads 1512 is bent to be disposed beside the heat-conducting portions 1513b and is electrically insulated from the heat-conducting portions 1513b. [0087] Moreover, a bowl-shaped recess (not shown) may be formed on the carrier portion 1513a of the heat-conductor 1513, so as to condense the light emitted by the light-emitting component 1511. Furthermore, the heat-conducting portions 1513b of the heat-conductor 1513 may be formed in the shape of continuous bends, rectangle, ellipse, or circle according to practical requirements. [0088] The molding compound 1514 is used to fix the light-emitting component 1511 on the carrier portion 1513a of the heat-conductor 1513, and protect the light-emitting component 1511 , so as to achieve the fixed relative position between the electric-conducting leads 1512 and the heat-conductor 1513. The material of the molding compound 1514 is, for example, a light-transmissive material such as resin or silica gel. In this embodiment, the molding compound 1514 is designed in the shape of a light bulb, and a lens 1514a is disposed at the front end of the molding compound 1514. The lens 1514a is optionally used to modify the light emitted by the light-emitting component 1511. The shape of the molding compound 1514 is not limited herein and may be altered according to the practical requirements. [0089] As the heat-conductor 1513 is perpendicularly accommodated in the hole 1523, the relative position between the light-emitting component 1151 and the heat dissipation base 1052 is fixed. The heat dissipation base 1052 may be a metal block with a plurality of heatsink fins formed on its surface or have a heat pipe (not shown) embedded therein. [0090] Furthermore, the electric-conducting leads 1512 may be inserted in the hole 1523, and one end of the electric-conducting leads 1512 are exposed out of the lower surface 1522 of the heat dissipation base 1052. A circuit board 1053 may be configured on the lower surface 1522 of the heat dissipation base 1052, for electrically coupling the electric-conducting leads 1512 to the circuit board 1053. [0091] Referring to FIG. 10, the heat-conducting portions 1513b of the heat-conductor 1513 extends upward to form a positioning pin 1515, so that the positioning pin 1515 is exposed out of the heat dissipation base 1052 when the heat-conductor 1513 together with the light-emitting component 1511 is inserted into the heat dissipation base 1052. Thus, the heat-conductor 1513 is positioned in the opening of the optical device 1054 through the positioning pin 1515, so as to fix the relative position between the light-emitting component 1511 and the optical device 1054. The optical device 1054 converges the light emitted by the light-emitting component 1511. Meanwhile, if the optical device 1054 is made of a heat-conducting material, for example, a metal, a preferred heat dissipation efficiency can be achieved. [0092] Referring to FIG. 11, a schematic view of a light-emitting component package according to another embodiment of the present invention is shown. This embodiment is similar to the above one, and the main difference is described as follows. A front-mounted heat dissipation base 1062 is adopted. The front-mounted heat dissipation base 1062 has an upper surface 1621 and a lower surface 1622 opposite to the upper surface 1621, and a hole is formed in the lower surface 1622 for the heat-conductor 1613 to be inserted therein. In particular, a positioning pin 1615 of the heat-conductor 16i 3 is inserted in the hole of the heat dissipation base 1062, and the relative position between the light-emitting component 1611 and the heat dissipation base 1062 is fixed through the positioning pin 1615. The heat dissipation base 1062 further has a through hole 1625, and the wall of the through hole 1625 is a light reflecting surface. The light-emitting component 1611 is suitable to be assembled in the through hole 1625, and the light reflecting surface converges the light emitted by the light-emitting component 1611. Meanwhile, if the front-mounted heat dissipation base 1062 is made of a heat-conducting material, for example, a metal, thereby achieving a preferred heat dissipation efficiency.

[0093] Referring to FIG. 12, a schematic view of a light-emitting component package according to another embodiment of the present invention is shown. This embodiment is similar to the above one, and the main difference is described as follows. Instead of being inserted in the opening of the heat dissipation base 1072, a plurality of electric-conductors^' 1712 is bent to be electrically coupled to a circuit board 1073 on the upper surface of the heat dissipation base 1072. [0094] Moreover, a positioning pin 1713b' of the heat-conductor 1713 is exposed out of the heat dissipation base 1072, so as to be positioned in the optical device 1054 as shown in FIG. 10. [0095] Referring to FIG. 13, a schematic three-dimensional view of a light-emitting component package without a heat dissipation base according to another embodiment of the present invention is shown. In FIG. 13, the heat-conductor 1813 of this embodiment is plate-shaped and is bent. A carrier portion 1813a of the heat-conductor 1813 carries a light-emitting component 1811 and is connected with the heat-conducting portions 1813b. The heat-conducting portions 1813b are inserted in a hole of a heat dissipation base (not shown). The heat-conducting portions 1813b extend upward to form a positioning pin 1815, which can be positioned in the optical device 1054 in FIG. 10. [0096] Referring to FIG. 14A, a schematic view of a light-emitting component package according to another embodiment of the present invention is shown, and FIG. 14B is a schematic cross-sectional view of the light-emitting component package in FIG. 14A without a power supply connector. In this embodiment, electric-conducting leads 1912 are bent into a substantially U-shape, so as to be electrically coupled to a power supply connector 1094. As such, the contact area between the heat-conductor 1913 and the heat dissipation base 1092 is expanded when heat-conductor 1913 is inserted in the heat dissipation base 1092, thereby enhancing the heat dissipation efficiency. [0097] Referring to FIGs. 15 A and 15B, a schematic three-dimensional view and a schematic cross-sectional view of a light-emitting component package according to another embodiment of the present invention are shown. In FIGs. 15 A and 15B, the light-emitting component package of this embodiment is applicable to an illuminating apparatus, for example, a lamp. The illuminating apparatus has a light reflecting cover 1102, and a heat dissipation base 1103 is transversely disposed at a light outlet of the light reflecting cover 1102. The heat-conductor 1013 is inserted in the heat dissipation base 1103 so as to conduct heat. Moreover, a power supply connector 1104 is further disposed in the heat dissipation base 1103, and is electrically coupled to the electric-conducting leads 1012 for the input of power. The light reflecting cover 1102 and the heat dissipation base 1103 may be made of the same material, and the two may even be integrally formed to enhance the heat dissipation efficiency. [0098] Referring to FIGs. 16A and 16B, a schematic three-dimensional view and a schematic cross-sectional view of a light-emitting component package according to another embodiment of the present invention are shown. In FIGs. 16A and 16B, the light-emitting component package of this embodiment is applicable to an illuminating apparatus, for example, a shadowless lamp for medical purpose. The illuminating apparatus has a light reflecting cover 1112, and a heat dissipation base 1118 disposed at a light outlet of the light reflecting cover 11 12. The heat-conductor 1113 is inserted in the heat dissipation base 1118 and is plate-shaped. A light-emitting component (not shown) is disposed on the heat-conductor 1113 at the side facing a light reflecting surface of the light reflecting cover 1112, such that the light may directly cast on the light reflecting surface of the reflecting cover 1112. Electric-conducting leads 11 16 are bent into a substantially U-shape, so as to be electrically coupled to a power supply connector 1114 for the input of power. Meanwhile, the heat-conductor 1113 inserted in the heat dissipation base 1118 may be in full contact with the heat dissipation base 1118, thus enhancing the heat-conducting efficiency.

[0099] In each light-emitting component package of the above embodiments, a light-emitting component is combined with a heat-conductor, and the heat-conductor is perpendicularly inserted in a hole of a heat dissipation base, such that the heat generated by the light-emitting component can be directly transferred from the heat-conductor to the heat dissipation base, thus greatly enhancing the heat dissipation efficiency. Meanwhile, the relative position between the light-emitting component and the heat dissipation base may be effectively fixed without using any complicated positioning device. Moreover, the heat-conductor is further provided with positioning pins extending upward, so as to be positioned to an optical device through the positioning pins, and besides, the positioning pins may also provide a way to dissipate heat. [0100] Referring to FIG. 17, a schematic view of a leadframe of a light-emitting component packaging apparatus according to an embodiment of the present invention is shown. In FIG. 17, the leadframe 2005 includes plural sets of electric-conducting leads 2051, a plurality of positioning pins 2055, at least one connecting sheet 2053. Each set of electric-conducting leads 2051 are electrically coupled to at least two electrodes of a light-emitting component (not shown). At least one positioning pin 2055 is disposed beside each set of electric-conducting leads 2051 , and the connecting sheet 2053 connects each set of electric-conducting leads 2051 and the positioning pins 2055. The light-emitting component packaging apparatus of this embodiment is applied to, for example, an LED or other light-emitting components. [0101] In this embodiment, two positioning pins 2055 are formed between every set of electric-conducting leads 2051, and the positioning pins 2055 are merely connected by one connecting sheet 2053. However, the number and connection position can be altered by those of ordinary skill in the art according to the practical requirements, and will not be limited to this embodiment. For example, only one positioning pin 2055 may be formed between every set of electric-conducting leads 2051 , or the positioning pins 2055 may be directly connected to the outer side of the electric-conducting leads 2051.

[0102] Referring to FIG. 18 A, a schematic view of a molding base of a light-emitting component packaging apparatus according to an embodiment of the present invention is shown. In FIG. 18 A, the molding base 2006 includes a body 2061 and a plurality of molding cups 2063. The body 2061 may be sheet-like, and has a plurality of accommodation openings 2062 arranged at an interval. Each molding cup 2063 is used to contain a molding compound, and fixed in each of the accommodation openings 2062 correspondingly. A first positioning hole 2631 is disposed on at least one side of each molding cup 2063. Though in this embodiment, two first positioning holes 2631 are disposed between every molding cup 2063, it is possible that only one first positioning hole 2631 is disposed between every molding cup 2063 to achieve the same positioning effect, which is not limited to this embodiment. The number of the positioning holes can be altered by those of ordinary skill in the art according to the practical requirements, and will not be described by another embodiment and the accompanying drawing.

[0103] Referring to FIGs. 18A and 18B, the above sheet-like body 2061 is a silicon steel sheet. Each molding cup 2063 has flanges 2633 on both sides thereof, and first positioning holes 2631 penetrating the body 2061 are respectively formed in the two flanges 2633. Though in this embodiment, flanges 2633 and first positioning holes 2631 are respectively disposed on both sides of each molding cup 2063, the number and connection position of the flange and the first positioning hole can be altered by those of ordinary skill in the art according to the practical requirements, and will not be limited to this embodiment. For example, a flange 2633 may be disposed on only one side of the molding cup 2063, and a first positioning hole 2631 penetrating the body 2061 is formed in the flange 2633. [0104] Further, in order to provide a better positioning effect, the body 2061 may further have at least one support portion 2064 disposed between any two of the accommodation openings 2062, for supporting the leadframe 2005 in FIG. 17. In this embodiment, the support portion 2064 is a stand protruding from the body 2061, and a Y-shaped guide joint 2641 is formed on the top of the support portion 2064 for piloting and supporting the leadframe. Definitely, the guide joint 2641 may also be in the V-shape or other shapes. Furthermore, for the use of a restrictor (will be described later), a second positioning hole 2065 may be respectively disposed on both sides of the body 2061 for the restrictor to insert. [0105] The accommodation openings 2062 are through holes which shapes are corresponding to the shape of the molding cups 2063. In this embodiment, the shape of accommodation opening 2062 is the combined shape of a molding cup 2063 and a first positioning holes 2631 as shown in FIG. 18B. A restrictor is inserted in the second positioning hole 2065 which is rectangular-shaped as shown in FIG. 18B. However, in practice, before the body 2061, for example, a silicon steel sheet, is punched, usually the corners are perforated first to avoid stress concentration. Besides, the folding edge formed after punching are partially remained, and the depth of the second positioning hole 2065 is properly extended, so as to increase the precision and enhance the stability of insertion of the restrictor. The first positioning hole 2631 may be processed in the same manner. As shown in FIG. 18C, the first positioning hole 2631 and the accommodation openings 2062 are formed at the same time by punching the body 2061, and the folding edge formed after the accommodation openings 2062 are formed by punching are partially remained according to the precision requirements of the first positioning hole 2631. Meanwhile, the flange 2633 on the side of the molding cup 2063 is formed by injection molding in follow-up process. Then, the flange 2633 is cut to align with the accommodation openings 2062. With this design, the first positioning hole 2631 takes the body 2061 as the positioning reference, so as to solve the problem of the accumulated error in the conventional art.

[0106] The design that the first positioning holes 2631 takes the body 2061 as the positioning reference, so as to solve the problem caused of the accumulated error in the conventional art is not limited to the embodiment in FIG. 18C. As shown in FIG. 18D, the first positioning hole 2631 is formed when the body 2061 is punched to form the accommodation opening 2062, and the folding edge formed after punching can be partially remained. Meanwhile, the flange 2633' on the side of the molding cup 2063 formed by injection molding in the follow-up process entirely encapsulates the accommodation opening 2062. With this design, the first positioning hole 2631 takes both the body 2061 and the molding cup 2063 as the positioning reference, thereby solving the problem of the accumulated error in the conventional art.

[0107] Referring to FIGs. 19A and 19B, a schematic exploded view and a schematic assembly view of a light-emitting component packaging apparatus according to an embodiment of the present invention are shown. In FIGs. 19A and 19B, the packaging apparatus is for insertion of the leadframe 2005 with plural sets of electric-conducting leads 2051 as shown in FIG. 17, so as to perform injection molding packaging. A positioning pin 2055 is formed on at least one side of each set of electric-conducting leads 2051, and the packaging apparatus includes a molding base 2006 as shown in FIG. 18A and a restrictor 2007. The molding base 2006 further includes a bottom base 2066, and the bottom base 2066 has a disposing portion 2661 for the body 2061 to be disposed horizontally. In this embodiment, the cross-section of the bottom base 2066 is U-shaped, and the disposing portion 2661 is near the top, for example, is a slot opened horizontally along one side of the bottom base 2066. The light-emitting component packaging apparatus of this embodiment is applied to, for example, an LED or other light-emitting components. [0108] The restrictor 2007 is a frame with a positioning trench 2071 in the inner edge, so as to position the leadframe 2005 through the positioning trench 2071. The material of the restrictor 2007 may be a metal, and has insertion portions 2073 at both ends for being correspondingly inserted in the second positioning holes 2065 of the body 2061. In this embodiment, the widths of the insertion portions 2073 are smaller than that of other portions of the restrictor 2007, and thus the positioning depth of the insertion portions 2073 in the second positioning holes 2065 may be precisely controlled. [0109] Before the light-emitting component packaging apparatus of this embodiment is used to perform the injection molding packaging process of light-emitting components, the leadframe 2005 is inserted in the molding base 2006 in advance. The design of using the positioning pins 2055 in the leadframe 2005 together with the first positioning holes 2631 of the body 2061 achieves a direct positioning effect in the front, back, left, and right directions with the body 2061 as the reference point. Besides, the support portion 2064 is employed to support the connecting sheet 2053, thereby solving the problem of the position offset of the light-emitting component caused by accumulated error due to indirect positioning in the conventional art. As the restrictor 2007 is inserted in the second positioning holes 2065 of the body 2061 to achieve a direct height positioning effect in the up and down directions, the position offset of the light-emitting component caused by the accumulated error due to indirect positioning in the conventional art can be solved, thus improving the positioning precision and relatively improving the probability of mass production. [01 10] Though in the molding base 2006 of the above embodiment, the body 2061 of a sheet-like structure is disposed in a bottom base 2066 for illustration, the present invention is not limited to use the bottom base 2066 in actual injection molding packaging, and the body 2061 of a sheet-like structure can be disposed on the bases of other types, which will not influence the injection molding packaging. Therefore, in spite of the material cost, the body may be integrated with the function of the bottom base. The molding base shown in FIG. 20 includes a body 2061" of a block structure and a plurality of molding cups 2063. The body 2061" also has a plurality of accommodation openings 2062 arranged at an interval. Each molding cup 2063 is used for containing a molding compound, and is fixed in each corresponding accommodation opening 2062. A first positioning hole 2631 is formed on at least one side of each molding cup 2063. A flange 2633 is formed on at least one side of each molding cup 2063 respectively, and a first positioning hole 2631 penetrating the body 2061 is formed in the flange 2633 respectively. The material of the body 2061" of the block structure is ceramics, steel, or aluminum. [0111] FIGs. 21 and 22 show a molding base of a light-emitting component packaging apparatus and a light-emitting component packaging apparatus adopting the molding base according to another embodiment of the present invention. The same or like numbers indicates the same or like parts appearing in the above embodiments and therefore explanation of such parts are omitted hereinafter. [01 12] As shown in FIGs. 21 and 22, in order to achieve the purpose of insertion, a protrusion 2065' (for example, integrated with a support portion) is disposed on both sides of the body 2061 ' respectively, so as to be inserted in insertion portions 2073' of a restrictor 2007'. Definitely, the insertion portions 2073' are holes having a width greater than the positioning trench 2071' and corresponding to the protrusions 2065'. [01 13] Further, though the above leadframe 2005 has a single-layered structure as shown in FIG. 17, when applied to package a high power light-emitting component, the leadframe usually adopts a laminated structure to enhance the heat dissipation effect. As shown in FIG. 23, the leadframe may include a heat-conductor 2057 combined on one side of the electric-conducting leads 2051. In this design, the heat-conductor 2057 extends to form the positioning pins 2055, and the electric-conducting leads 2051 are separated from the heat-conductor 2057. The structure in FIG. 23 is substantially the same as that in FIG. 8A, except that the structure in FIG. 23 does not have a heat dissipation base.

[0114] For the light-emitting component packaging apparatus and its molding base and leadframe in the above embodiments, the positioning pins in the leadframe are used together with the positioning holes of the molding base, so as to achieve a direct positioning effect with the molding base as the reference point, such that the position offset of the light-emitting component caused by the accumulated error due to indirect positioning in the conventional art can be solved, thus substantially improving the positioning precision and relatively increasing the probability of mass production. [0115] FIG. 24A is a three-dimensional view of a light-emitting component package according to an embodiment of the present invention. The light-emitting component 3060 has at least two electrodes. The heat-conductor 3610 has at least two heat-conducting portions 3611, 3612 and a carrier portion 3613. The light-emitting component 3060 is configured on the carrier portion 3613, and the carrier portion 3613 connects the heat-conducting portions 3611 , 3612. The electric-conducting leads 3631 , 3632 are configured between the heat-conducting portions 3611 , 3612. The material of the electric-conducting leads 3631, 3632 may be metal or other suitable electric-conducting materials. The material of the heat-conductor 3610 may be metal or other suitable heat-conducting materials. One electrode of the light-emitting component 3060 is electrically coupled to the electric-conducting leads 3632 through a metal wire 3062. The other electrode of the light-emitting component 3060 is electrically coupled to the electric-conducting leads 3631 through another metal wire (not shown). The electric-conducting leads 3631, 3632 and the heat-conductor 3610 are fixed by a molding compound 3068, so as to maintain the predetermined relative position. A lens 3682 is configured at a light-emitting end of the light-emitting component 3060, so as to modify the emitted light and protect the light-emitting component 3060. The light-emitting component 3060 may be an LED or other light-emitting components. [0116] FIG. 24B is a cross-sectional view of the light-emitting component package in FIG. 24A. In FIG. 24B, the electric-conducting leads 3632 are configured between the heat-conducting portions 3611, 3612. That is, the light-emitting component package of this embodiment is the package with heat outside and electricity inside. The electric-conducting leads 3631, 3632 and the heat-conducting portions 3611, 3612 are fixed by the molding compound 3068, so as to maintain a certain relative position. The molding compound 3068 may be a light-transmissive molding compound or an opaque molding compound.

[01 17] FIG. 25A is a three-dimensional view of a light-emitting component package according to another embodiment of the present invention. The electric-conducting leads 3631 , 3632 and the heat-conductor 3610 are fixed by a reinforced compound 3683. The material of the reinforced compound 3683 is different from that of the molding compound 3068. . The reinforced compound 3683 can enhance the capability of the electric-conducting leads 3631, 3632 and the heat-conducting plate to resist deformation during assembly. [01 18] FIG. 25B is a cross-sectional view of the light-emitting component package in FIG. 25A. In FIG. 25B, the electric-conducting leads 3631, 3632 and the heat-conducting portions 3611, 3612 are fixed by the reinforced compound 3683, so as to maintain a certain relative position. [0119] FIG. 26 is an assembly view of the light-emitting component package in FIG. 24A with a power supply connector. The power supply connector 3065 has holes 3651. 3652, for the electric-conducting leads 3631, 3632 to be inserted therein, and is electrically coupled to an end of a power line 3066. The other end of the power line 3066 is electrically coupled to an external power source (not shown). The profile of the power supply connector 3065 is designed to match the space between the heat-conducting portions 3611, 3612, such that the power supply connector 3065 may be inserted in the space between the heat-conducting portions 3611, 3612. [0120] FIG. 27 is an assembly view of the light-emitting component package in FlG. 24A with another power supply connector. In this embodiment, at least one bump 3067 is disposed on the side surface of the power supply connector 3065'. As such, after being inserted between the heat-conducting portions 361 1, 3612, the power supply connector 3065' is better retained. Meanwhile, the bump 3067 pushes the heat-conducting portions 3611, 3612 outward, so as to ensure that the heat-conducting portions 3611, 3612 are attached onto the corresponding contact surface of a heat dissipation base (not shown) assembled on the outer side in a manner of surface contact. [0121] FIG. 28 is a schematic exploded view of a light-emitting component package according to another embodiment of the present invention. In this embodiment, the light-emitting component package further includes a heat dissipation base 3069. The heat dissipation base 3069 is combined with the heat-conductor 3610. The heat dissipation base 3069 has a through hole 3692. The size of the through hole 3692 is designed according to the size of the heat-conducting portions 3611, 3612, such that after the heat-conducting portions 3611, 3612 are inserted in the through hole 3692, the contact area between the heat-conducting portions 3611, 3612 and the heat dissipation base 3069 is increased, thus facilitating the heat conduction.

[0122] FIG. 29A is a three-dimensional view of a light-emitting component package according to another embodiment of the present invention. In this embodiment, the cross-section of the heat-conductor 3620 is designed approximately into an M-shape, so as to improve the elastic contact of the heat-conductor 3620. An outward retaining force is provided when the heat-conductor 3620 is inserted into the heat dissipation base 3069 in FIG. 28, thus ensuring that the heat-conducting portions 3611, 3612 are in close contact with the inner surface of the through hole 3692 of the heat dissipation base 3069. [0123] FIG. 29B is a cross-sectional view of the light-emitting component package in FIG. 29 A. The heat-conductor 3620 with a substantially M-shaped cross-section has three bends. One bend is between the left heat-conducting portion 3621 and the carrier portion 3623. The right side is symmetric to the left side and also has a bend. These bends provide elastic buffer. When the M-shaped heat-conductor 3620 is inserted in the through hole 3692 of the heat dissipation base 3069 in FIG. 28, the elasticity of the heat-conductor 3620 provides a retaining force. [0124] FIG. 30A is a three-dimensional view of a light-emitting component package according to another embodiment of the present invention. In this embodiment, the cross-section of the heat-conductor 3670 is designed approximately into a W-shape, which has the similar effect as the M-shaped heat-conductor in the preceding embodiment. [0125] FIG. 30B is a cross-sectional view of the light-emitting component package in FlG. 3OA. The W-shaped heat-conductor 3670 has two bends between the heat-conducting portion 3671 and the carrier portion 3673, so as to provide elastic buffer. When the heat-conductor 3670 is inserted and fixed in the through hole 3692 of the heat dissipation base 3069 in FIG. 28, the elasticity of the heat-conductor 3670 provides a retaining force.

[0126] FIGs. 3 IA and 3 I B show statuses before and after the heat-conductor in FlG. 3OA is inserted in the heat dissipation base. FIG. 31 A shows the status before insertion. The space between the two heat-conducting portions of the heat-conductor 3670 is slightly greater than the diameter of the through hole 3692 of the heat dissipation base 3069. FIG. 3 IB shows the status after the insertion. The two heat-conducting portions of the heat-conductor 3670 get close to the middle, and then are inserted in the through hole 3692. Partial area of the heat-conductor 3670 deform to provide elasticity Therefore, the two sides of the heat-conductor 3670 may be closely attached onto the inner surface of the through hole 3692 of the heat dissipation base 3069. [0127] FIG. 32 is a three-dimensional view of a light-emitting component package according to another embodiment of the present invention. In this embodiment, the profile of the heat-conductor 3640 is designed into a annular shape, thus forming the heat-conductor 3640 with the substantially H -shaped cross-section. Therefore, the corresponding through hole of the heat dissipation base must be designed into a circular through hole (not shown).

[0128] FIG. 33 is a three-dimensional view of a light-emitting component package according to another embodiment of the present invention. In this embodiment, the profile of the heat-conductor 3650 is rectangular-shaped, the heat-conductor 3650 with the substantially H -shaped the cross-section is formed, so the corresponding through hole of the heat dissipation base must be designed into a rectangular through hole (not shown). [0129] FIG. 34 is an assembly view of a light-emitting component package according to another embodiment of the present invention. In this embodiment, the heat-conductor 3660 is designed into a cap, and the heat-conductor 3660 has L-shaped heat-conducting portions 3661, 3662, for covering the external periphery of the heat dissipation base 3069. Identical to those in the above embodiment, the electric-conducting leads 3631, 3632 are designed between the heat-conducting portions 3661, 3662. After the light-emitting component is inserted in the through hole 3692 of the heat dissipation base 3069, the electric-conducting leads 3631, 3632 may be configured inside the through hole 3692. [0130] FIG. 35 is an assembly view of a light-emitting component package according to another embodiment of the present invention. In this embodiment, a sliding slot 3694 is formed in the two arms of the U-shaped heat dissipation base 3690 respectively, such that the heat-conducting portions 3661, 3662 of the heat-conductor 3660 in FIG. 34 slide into and are retained in the sliding slots. [0131] In the above embodiments, the heat dissipation base is of simple geometric shapes for illustration. However, as shown in FIG. 36, in practice, the heatsink fins may be added around of the heat dissipation base 3070, so as to enhance the heat dissipation effect. Besides, though in the above embodiments, the number of the electric-conducting leads is two, the number of the electric-conducting leads may be increased or reduced according to the practical requirements. [0132] In the light-emitting component package of the above embodiments, the heat-conductor is not limited by any electric components outside, so other heat dissipation components can be transversely added on the heat-conductor freely, so as to meet different heat dissipation requirements. Thus, the heat dissipation efficiency of the light-emitting component can be improved. [0133] FIG. 37 is a schematic view of a light source device according to an embodiment of the present invention. The light source device 4200 includes a power supplier 4200a and a light-emitting component package 4200b. The light-emitting component package 4200b includes a light-emitting component 4051. The light-emitting component 4051 is, for example, but not limited to, an LED. The power supplier 4200a is electrically coupled to an external power source 4050, and cooperates with the light-emitting component package 4200b to supply power for lighting the light-emitting component 4051. [0134] The power supplier 4200a includes a primary coil 4531 and a primary magnetic inductive unit 4541. The primary coil 4531 is a power supply coil, and has two ends 4561, 4562 electrically coupled to the external power source 4050. The primary magnetic inductive unit 4541 has two ends 5411, 5412, and is wound by the primary coil 4531, such that an alternating electromagnetic field is induced after a current passes through the primary coil 4531.

[0135] The light-emitting component package 4200b further includes a secondary magnetic inductive unit 4542 and a secondary coil 4532. The secondary magnetic inductive unit 4542 has two ends 5421, 5422 respectively magnetically coupled with the two ends 5411, 5412 of the primary magnetic inductive unit 4541 , so as to form a closed magnetic field loop. The secondary magnetic inductive unit 4542 is wound by the secondary coil 4532. When the secondary magnetic inductive unit 4542 senses the alternating electromagnetic field induced by the primary magnetic inductive unit 4541 , a secondary current is induced in the secondary coil 4532 by sensing the alternating magnetic field of the secondary magnetic inductive unit 4542.

[0136] The secondary coil 4532 has two ends, and the light-emitting component 4051 has two corresponding electrodes. The two ends of the secondary coil 4532 are electrically coupled to the two electrodes of the light-emitting component 4051 through conductive wires 4521, 4522 respectively. When the secondary current is induced in the secondary coil 4532, the light-emitting component 4051 is powered to emit light.

[0137] Though in this embodiment, the light-emitting component 4051 has two surface electrodes for illustration, in practice, a light-emitting component using flip chip technique with two bottom electrodes, or a light-emitting component having one upper electrode and one lower electrode may also be used. [0138] Moreover, the ratio between the turns Nl of the primary coil 4531 and the turns N2 of the secondary coil 4532 is usually a fixed value. However, generally speaking, during the fabrication of the chip of the light-emitting device chips, the forward voltages of the products in different batches are possibly different. Therefore, when the turns Nl of the primary coil 4531 is fixed, the turns N2 of the secondary coil 4532 may be changed to adjust the output voltage of the secondary coil 4532 according to the forward voltage grading of the chip of the light-emitting component 4051, thereby solving the problem of the difference in forward bias. [0139] In this embodiment, the power supplier 4200a may further include a cup base 4551. The cup base 4551 can package and fix the primary coil 4531 and the primary magnetic inductive unit 4541 at a specific position. The light-emitting component package 4200b may further include an electrically insulative base 4552. The electrically insulative base 4552 may package and fix the secondary coil 4532 and the secondary magnetic inductive unit 4542 at a specific position.

[0140] For example, one cup 4058 is disposed on the upper portion of the cup base 4551, so that the light-emitting component package 4200b is disposed in the cup 4058. When the light-emitting component 4051 is inserted and positioned in the cup 4058 of the cup base 4551 along with the electrically insulative base 4552, the two ends 541 1. 5412 of the primary magnetic inductive unit 4541 respectively contact the two ends 5421, 5422 of the secondary magnetic inductive unit 4542, so as to form a closed magnetic field loop, such that an alternating electromagnetic field is confined and operates between the primary magnetic inductive unit 4541 and the secondary magnetic inductive unit 4542.

[0141] In this embodiment, a molding compound 4511 may encapsulate the periphery and the upper portion of the light-emitting component 4051. The molding compound 4511 may package and protect the conductive wires 4521, 4522 and the light-emitting component 4051, so as to improve the reliability of the product. [0142] FIG. 38 is a cross-sectional exploded view taken along Line A-A in FIG. 37. The light-emitting component package 4200b is ready to be inserted in the cup 4058 of the cup base 4551 of the power supplier 4200a. After insertion, the two ends 5421, 5422 (as shown in FIG. 37) of the secondary magnetic inductive unit 4542 in the light-emitting component package 4200b will approach or contact the two ends 541 1 , 5412 (as shown in FIG. 37) of the primary magnetic inductive unit 4541 in the power supplier 4200a. Thus, a primary magnetic field generated by the primary magnetic inductive unit 4541 and a secondary magnetic field generated by the secondary magnetic inductive unit 4542 may be confined to form a closed magnetic field loop. [0143] FIG. 39 is a schematic view of a light source device according to another embodiment of the present invention. Referring to FIGs. 37 and 39, this embodiment is similar to the preceding embodiment, and the difference is described as follow. The light source device 4300 of this embodiment further includes a heat-conductor 4057, for carrying the light-emitting component 4051 and conducting heat. [0144] FIG. 40 is a cross-sectional exploded view taken along Line A-A in FIG. 39. Referring to FIG. 40, the heat-conductor 4057 has a heat-conducting portion 4057a extending out of the light-emitting component 4051 for conducting the heat generated by the light-emitting component 4051 to the outside. In this embodiment, besides the electrically insulative substrate located in the center, the cup base 4551 of the light source device 4300 further has a heat dissipation portion 4059 cladded on the exterior of the electrically insulative substrate. The electrically insulative substrate and the heat dissipation portion 4059 form a cup 4058. When the light-emitting component 4051 is inserted in the cup 4058 of the power supplier 4300a along with the electrically insulative base 4552, the heat-conducting portion 4057a of the heat-conductor 4057 may be used to retain the component, so as to make the light-emitting component 4051 retained in the cup 4058 of the cup base 4551 through the heat-conducting portion 4057a. [0145] After the light-emitting component 4051 is inserted and positioned in the cup 4058 along with the electrically insulative base 4552, the heat-conductor 4057 contacts the heat dissipation portion 4059 of the power supplier 4300a, so as to conduct the heat generated by the light-emitting component 4051 to the heat dissipation portion 4059 through the heat-conductor 4057. As the heat dissipation area is enlarged, the overall heat dissipation efficiency is enhanced. Moreover, in another embodiment (not shown), heatsink fins (not shown) may be added outside the heat dissipation portion 4059, thereby further enhancing the heat dissipation efficiency.

[0146] In this embodiment, the secondary magnetic inductive unit 4542 in FIG. 39 is arc-shaped with the opening downward, and the primary magnetic inductive unit 4541 is arc-shaped with the opening upward. The primary magnetic inductive unit 4541 and the secondary magnetic inductive unit 4542 are coupled, so as to form a closed ring. In practice, the primary magnetic inductive unit 4541 may be designed into a U-shape with the opening downward, and the secondary magnetic inductive unit 4542 may be designed into a U-shape with the opening upward. The two magnetic inductive units may be combined- into, but not limited to, a closed arc-shaped or rectangular-shaped ring. [0147] FIG. 41 is a schematic view of a light source device according to another embodiment of the present invention. In FIG. 41, a light-emitting component package 4400b of the light source device 4400 includes a light-emitting component 4051, a secondary coil 4632, and a secondary magnetic inductive unit 4642. The light-emitting component 4051 has two electrodes. The secondary coil 4632 has two ends electrically coupled to the two electrodes of the light-emitting component 4051 through the conductive wires 4521, 4522 respectively. The secondary magnetic inductive unit 4642 is E-shaped, and has two ends 6421 , 6422 and a middle extending portion 6423. The middle extending portion 6423 is wound by the secondary coil 4632. The electrically insulative base 4652 may package and fix the secondary coil 4632 and the secondary magnetic inductive unit 4642 at a specific position.

[0148] The power supplier 4400a of the light source device 4400 includes a primary coil 4631 and a primary magnetic inductive unit 4641. An alternating electromagnetic field is induced after the current passes through the primary coil 4631. The primary magnetic inductive unit 4641 may be E-shaped and has two ends 6411, 6412 and a middle extending portion 6413. The middle extending portion 6413 is wound by the primary coil 4631. The two ends 6411, 6412 and the middle extending portion 6413 are respectively magnetically coupled with the two ends 6421, 6422 and a middle extending portion 6423 of the secondary magnetic inductive unit 4642. The primary magnetic inductive unit 4641 and the secondary magnetic inductive unit 4642 are in opposite E-shapes, so as to constitute a closed magnetic field loop. An electromotive force is induced and a secondary current are induced in the secondary coil 4632 by sensing an alternating magnetic field, for lighting the light-emitting component 4051. [0149] The power supplier 4400a of this embodiment may further include a cup base 4651. The cup base 4651 may package and fix the primary coil 4631 and the primary magnetic inductive unit 4641 at a specific position. The primary coil 4631 is a power supply coil having two ends 4661, 4662 electrically coupled to the external power source 4050. One cup 4058 is formed on the upper portion of the cup base 4651, so that the light-emitting component package 4400b is disposed in the cup 4058. When the light-emitting component package 4400b is inserted and positioned in the cup 4058, the two ends 6411, 6412 and the middle extending portion 6413 of the primary magnetic inductive unit 4641 respectively approach or contact the two ends 6421, 6422 and the middle extending portion 6423 of the secondary magnetic inductive unit 4642. When the current passes through the primary coil 4631 , the alternating electromagnetic field is confined by the magnetic lines of force of the primary magnetic inductive unit 4641 and the secondary magnetic inductive unit 4642 to form a closed magnetic field loop. [0150] FlG 42 is a schematic view of a light source device according to another embodiment of the present invention. This embodiment is similar to the embodiment of FIG. 37, and only the difference is described as follows. The light source device 4500 of this embodiment may further include a capacitor 4060 connected in parallel with two electrodes of the light-emitting component 4051 , so as to improve the power factor. [0151] FIG. 43 is a schematic view of a light source device according to another embodiment of the present invention. This embodiment is similar to the embodiment of FIG. 37, and only the difference is described as follows. The light source device 4600 of this embodiment may further include a surge absorber 4070 connected in parallel with the two electrodes of the light-emitting component 4051 , for absorbing the transient voltage surge, thereby improving the reliability of the products.

[0152] FIG. 44 is a schematic view of a light source device according to another embodiment of the present invention. This embodiment is similar to the embodiment of FIG. 37, and only the difference is described as follows. The light source device 4700 of this embodiment may further include a rectifier 4080 connected in series between the light-emitting component 4051 and the secondary coil 4532. The two ends of the secondary coil 4532 are respectively electrically coupled to the first contact W and the second contact X of the rectifier 4080. The two electrodes of the light-emitting component 4051 are respectively electrically coupled to the third contact Y and the fourth contact Z of the rectifier 4080. The rectifier 4080 converts the alternating current into a direct current for lighting the light-emitting component 4051. The rectifier 4080 may be a bridge rectifier or a diode rectifier.

[0153] The light source device of the above embodiments at least has the following advantages. [0154] 1. The primary magnetic inductive unit in the power supplier and the secondary magnetic inductive unit in the light-emitting component package form a closed magnetic field loop, and thus the magnetic lines of force will not be scattered to the outside, so as to prevent the user from being influenced by the magnetic field. [0155] 2. An electromotive force is induced by sensing the variation of an electromagnetic field induced by the power supplier, so as to make the LED to emit light. Therefore, the electrical contact is not required between the light-emitting component package and the power supplier, so the problems of loose contact caused by dusts or vibration and the problems of current leakage between contacts under high voltage can be eliminated.

[0156] 3. The turns of the secondary coil can be adjusted by the forward bias grading of the light-emitting device chip. Therefore, in the condition of the same power supplier, the light-emitting device chip with different forward bias grade can be used, thus improving the flexibility.

[0157] It will be apparent to those skilled in the art that various modifications and variations can be made to the structure of the present invention without departing from the scope or spirit of the invention. In view of the foregoing, it is intended that the present invention cover modifications and variations of this invention provided they fall within the scope of the following claims and their equivalents.

Claims

1. A light-emitting component package, comprising: a light-emitting component, having at least two electrodes; a heat-conductor, having a carrier portion, wherein the carrier portion carries the light-emitting component; a set of electric-conducting leads, electrically coupled to the electrodes of the light-emitting component, and electrically insulated from the heat-conductor; and a heat dissipation base, having at least one hole, wherein the heat-conductor is inserted in the hole.

2. The light-emitting component package as claimed in claim 1, wherein the heat dissipation base is integrally formed.

3. The light-emitting component package as claimed in claim 1 , wherein the heat dissipation base is assembled by at least two combination blocks, and the hole is located between the combination blocks.

4. The light-emitting component package as claimed in claim 1, wherein the light-emitting component is a light-emitting diode (LED).

5. The light-emitting component package as claimed in claim 1 , further comprising a lens configured at a light-emitting end of the light-emitting component, so as to modify the emitted light.

6. The light-emitting component package as claimed in claim 1, wherein the heat dissipation base is surrounded by heatsink fins.

7. The light-emitting component package as claimed in claim 1, wherein the set of electric-conducting leads are inserted in the hole, and one end of the set of electric-conducting leads far away from the light-emitting component is exposed outside the heat dissipation base.

8. The light-emitting component package as claimed in claim 1 , further comprising a circuit board configured on the heat dissipation base, wherein the set of electric-conducting leads are bent to be electrically coupled to the circuit board.

9. The light-emitting component package as claimed in claim 1, wherein the heat-conductor further comprises at least two heat-conducting portions inserted in the hole and connected by the carrier portion.

10. The light-emitting component package as claimed in claim 9, wherein each of the heat-conducting portions further extends outward to form at least one positioning pin.

11. The light-emitting component package as claimed in claim 1, wherein the set of electric-conducting leads are bent to form a substantially U-shape.

12. The light-emitting component package as claimed in claim 1, wherein the heat dissipation base is a component of an illuminating apparatus, the illuminating apparatus further comprises a light reflecting cover, and the heat dissipation base is disposed at a light outlet of the light reflecting cover.

13. The light-emitting component package as claimed in claim 1, wherein the heat dissipation base is a component of an illuminating apparatus, the illuminating apparatus further comprises a light reflecting cover connecting the heat dissipation base, the heat-conductor is plate-shaped, and the light-emitting component is disposed on the heat-conductor at a side facing a light reflecting surface of the light reflecting cover.

14. The light-emitting component package as claimed in claim 1, further comprising a power supply connector electrically coupled to the set of electric-conducting leads.

15. The light-emitting component package as claimed in claim 1, wherein a portion of the carrier portion for carrying the light-emitting component is recessed in a bowl shape, so as to condense the light emitted by the light-emitting component.

16. The light-emitting component package as claimed in claim 1, wherein a material of the set of electric-conducting leads is a metal.

17. The light-emitting component package as claimed in claim 1, wherein a cross-section of the heat-conductor is substantially in a shape of continuous bends, rectangle, ellipse, or circle.

18. The light-emitting component package as claimed in claim 1, wherein the heat-conductor further has at least two heat-conducting portions, each of the heat-conducting portions extends outward to form at least one positioning pin, the positioning pins are inserted in the hole, the heat dissipation base further has a through hole, and a wall of the through hole is a light reflecting surface, the light-emitting component is located in the through hole, and the light reflecting surface converges the light emitted by the light-emitting component.

19. A molding base of a light-emitting component packaging apparatus, having a body and a plurality of molding cups, wherein the body has a plurality of accommodation openings arranged at an interval for fixing the corresponding molding cups, the molding cups are used to contain a molding compound, and at least one first positioning hole is formed beside each of the molding cups.

20. The molding base as claimed in claim 19, wherein at least one side of each of the molding cups has a flange, and the first positioning holes are located in the flanges and penetrate the body.

21. The molding base as claimed in claim 19, wherein the accommodation openings are through holes corresponding to a shape of the molding cups.

22. The molding base as claimed in claim 19, wherein the body is of a sheet-like or block structure.

23. The molding base as claimed in claim 22, wherein the body of a sheet-like structure is a silicon steel sheet.

24. The molding base as claimed in claim 19, wherein the body further has second positioning holes disposed on two sides thereof for a restrictor to insert.

25. The molding base as claimed in claim 19, wherein the body further has at least one support portion disposed between any two of the accommodation openings, for supporting a leadframe.

26. The molding base as claimed in claim 25, wherein the support portion is a stand protruding from the body, and the support portion has a guide joint formed on the top thereof for piloting and supporting the leadframe.

27. The molding base as claimed in claim 26, wherein the guide joint is

V-shaped or Y-shaped.

28. The molding base as claimed in claim 19, further having a bottom base, wherein the bottom base has a disposing portion for the body to be horizontally disposed.

29. The molding base as claimed in claim 28, wherein the disposing portion is a slot opened horizontally along one side of the bottom base.

30. The molding base as claimed in claim 28, wherein a cross-section of the bottom base is substantially U-shaped, and the disposing portion is adjacent to the top of both sides of the bottom base.

31. A leadframe of a light-emitting component packaging apparatus, having plural sets of electric-conducting leads, a plurality of positioning pins, and at least one connecting sheet, wherein each set of electric-conducting leads are electrically coupled to at least two electrodes of a light-emitting component, the connecting sheet connects the sets of electric-conducting leads, the positioning pins connect the connecting sheet or the electric-conducting leads, and at least one of the positioning pins is disposed beside each set of electric-conducting leads.

32. A light-emitting component packaging apparatus, comprising: a leadframe, having plural sets of electric-conducting leads, a plurality of positioning pins, and at least one connecting sheet, wherein each set of electric-conducting leads are electrically coupled to at least two electrodes of a light-emitting component, the connecting sheet connects the sets of electric-conducting leads, the positioning pins connect the connecting sheet or the electric-conducting leads, and at least one of the positioning pins is disposed beside each set of electric-conducting leads; and a molding base, for the leadframe to insert, having a body and a plurality of molding cups for containing a molding compound and holding one end of each set of electric-conducting leads, wherein the body has a plurality of accommodation openings arranged at an interval for fixing the corresponding molding cups, and at least one first positioning hole is formed beside each of the molding cups for one of the positioning pins to insert correspondingly.

33. The light-emitting component packaging apparatus as claimed in claim 32, further comprising a restrictor, wherein the restrictor is of a frame structure with a positioning trench in the inner edge, so as to position the leadframe through the positioning trench, and has insertion portions at both ends thereof for the body to insert correspondingly.

34. The light-emitting component packaging apparatus as claimed in claim 33, wherein the body further has second positioning holes disposed on two sides, for the insertion portions of the restrictor to insert correspondingly.

35. The light-emitting component packaging apparatus as claimed in claim 33, wherein the body further has protrusions disposed on two sides so as to be inserted in the insertion portions of the restrictor correspondingly.

36. The light-emitting component packaging apparatus as claimed in claim 35, wherein the insertion portions are holes having a width greater than that of the positioning trench and corresponding to the protrusions.

37. The light-emitting component packaging apparatus as claimed in claim 33, wherein the restrictor is a frame with a positioning trench in the inner edge.

38. The light-emitting component packaging apparatus as claimed in claim 32, wherein each of the molding cups has a flange formed on at least one side thereof, and the first positioning holes are located in the flanges and penetrate the body.

39. The light-emitting component packaging apparatus as claimed in claim 32, wherein the accommodation openings are through holes corresponding to the shape of the molding cups.

40. The light-emitting component packaging apparatus as claimed in claim 32, wherein the body is of a sheet-like or block structure.

41. The light-emitting component packaging apparatus as claimed in claim 40, wherein the body of a sheet-like structure is a silicon steel sheet.

42. The light-emitting component packaging apparatus as claimed in claim 32, wherein the body further has at least one support portion disposed between any two of the accommodation openings, for supporting the leadframe.

43. The light-emitting component packaging apparatus as claimed in claim 42, wherein the support portion is a stand protruding from the body, and has a guide joint formed on the top thereof for piloting and supporting the leadframe.

44. The light-emitting component packaging apparatus as claimed in claim 43, wherein the guide joint is V-shaped or Y-shaped.

45. The light-emitting component packaging apparatus as claimed in claim 32, wherein the molding base further has a bottom base, and the bottom base has a disposing portion for the body to be disposed horizontally.

46. The light-emitting component packaging apparatus as claimed in claim 45, wherein the disposing portion is a slot opened horizontally along one side of the bottom base.

47. The light-emitting component packaging apparatus as claimed in claim 45, wherein a cross-section of the bottom base is substantially U-shaped, and the disposing portion is adjacent to the top.

48. A light-emitting component package, comprising: a light-emitting component, having at least two electrodes; a heat-conductor, having at least two heat-conducting portions and a carrier portion, wherein the carrier portion connects the heat-conducting portions and carries the light-emitting component; and a set of electric-conducting leads, electrically coupled to the electrodes of the light-emitting component, located between the heat-conducting portions of the heat-conductor, and electrically insulated from the heat-conductor, so as to form a package with heat outside and electricity inside.

49. The light-emitting component package as claimed in claim 48, further comprising a heat dissipation base, wherein the heat-conductor is combined with the heat dissipation base, and the heat-conducting portions are in contact with the heat dissipation base.

50. The light-emitting component package as claimed in claim 49, wherein the heat dissipation base is surrounded by heatsink fins.

51. The light-emitting component package as claimed in claim 49, further comprising a power supply connector electrically coupled to the set of electric-conducting leads.

52. The light-emitting component package as claimed in claim 51, wherein the heat dissipation base has a through hole, and the power supply connector, the heat-conducting portions, and the set of electric-conducting leads are located in the through hole.

53. The light-emitting component package as claimed in claim 49, wherein the heat dissipation base is rectangular-shaped.

54. The light-emitting component package as claimed in claim 49, wherein the heat dissipation base is U-shaped.

55. The light-emitting component package as claimed in claim 54, wherein the U-shaped heat dissipation base further comprises a set of sliding slots formed in two arms of the U-shaped heat dissipation base, and the heat-conductor slides into and is retained in the set of sliding slots.

56. The light-emitting component package as claimed in claim 48, wherein the light-emitting component is an LED.

57. The light-emitting component package as claimed in claim 48, further comprising a lens configured at a light-emitting end of the light-emitting component, so as to modify the emitted light.

58. The light-emitting component package as claimed in claim 48, wherein a cross-section of the heat-conductor is substantially in a shape of D , M, or W.

59. The light-emitting component package as claimed in claim 48, further comprising a molding compound packaging to protect the light-emitting component, the heat-conductor, and the set of electric-conducting leads.

60. The light-emitting component package as claimed in claim 59, wherein the molding compound is a light-transmissive molding compound.

61. The light-emitting component package as claimed in claim 59, wherein the molding compound is an opaque molding compound.

62. The light-emitting component package as claimed in claim 48, further comprising a power supply connector electrically coupled to the set of electric-conducting leads.

63. The light-emitting component package as claimed in claim 48, further comprising a reinforced compound, for packaging and fixing the heat-conductor and the set of electric-conducting leads.

64. A light source device, comprising: a power supplier, comprising: a primary coil, inducing an alternating electromagnetic field after a current passes through the primary coil; a primary magnetic inductive unit, having two ends and wound by the primary coil, for inducing the alternating electromagnetic field; a light-emitting component package, comprising: a light-emitting component, having at least two electrodes; a secondary coil, having two ends electrically coupled to the electrodes; and a secondary magnetic inductive unit, having two ends magnetically coupled to the two ends of the primary magnetic inductive unit, so as to form a closed magnetic field loop, wherein the secondary magnetic inductive unit is used to sense the alternating electromagnetic field induced by the primary magnetic inductive unit, and the secondary magnetic inductive unit is wound by the secondary coil, an electromotive force is induced in the secondary coil by sensing the alternating electromagnetic field.

65. The light source device as claimed in claim 64, wherein the power supplier further comprises a cup base, and the light-emitting component is inserted and positioned in a cup of the cup base.

66. The light source device as claimed in claim 64, wherein the light-emitting component package further comprises: a heat -conductor, having at least two heat-conducting portions and a carrier portion, wherein the carrier portion connects the heat-conducting portions and carries the light-emitting component.

67. The light source device as claimed in claim 66, wherein the power supplier further comprises a cup base, and the light-emitting component is retained in a cup of the cup base through the heat-conducting portions.

68. The light source device as claimed in claim 67, wherein the heat-conducting portions are in contact with a heat dissipation portion of the cup base, such that the heat generated by the light-emitting component is transferred to the heat dissipation portion through the heat-conductor, so as to be dissipated.

69. The light source device as claimed in claim 64, wherein the secondary magnetic inductive unit and the primary magnetic inductive unit are U-shaped.

70. The light source device as claimed in claim 64, wherein the secondary magnetic inductive unit is E-shaped and has a middle extending portion, and the middle extending portion of the secondary magnetic inductive unit is wound by the secondary coil; and the primary magnetic inductive unit is E-shaped and has a middle extending portion, the end of the middle extending portion of the primary magnetic inductive unit is coupled with the end of the middle extending portion of the secondary magnetic inductive unit, and- the middle extending portion of the primary magnetic inductive unit is wound by the primary coil.

71. The light source device as claimed in claim 64, wherein the light-emitting component package further comprises: a capacitor, connected in parallel with the electrodes of the light-emitting component.

72. The light source device as claimed in claim 64, wherein the light-emitting component package further comprises: a surge absorber, connected in parallel with the electrodes of the light-emitting component.

73. The light source device as claimed in claim 64, wherein the light-emitting component package further comprises: a rectifier, connected in series between the electrodes of the light-emitting component and the secondary coil.

74. The light source device as claimed in claim 73, wherein the rectifier is a bridge rectifier circuit or a diode rectifier circuit.

75. The light source device as claimed in claim 64, wherein the light-emitting component is an LED.

76. A light-emitting component package, suitable to be powered by a power supplier, wherein the power supplier comprises a primary coil and a primary magnetic inductive unit, an alternating electromagnetic field is induced after a current passes through the primary coil, the primary magnetic inductive unit has two ends and is wound by the primary coil, so as to induce the alternating electromagnetic field, the light-emitting component package comprises: a light-emitting component, having at least two electrodes; a secondary coil, having two ends, electrically coupled to the electrodes; and a secondary magnetic inductive unit, having two ends magnetically coupled to the two ends of the primary magnetic inductive unit, so as to form a closed magnetic field loop, wherein the secondary magnetic inductive unit is used to sense the alternating electromagnetic field induced by the primary magnetic inductive unit, and the secondary magnetic inductive unit is wound by the secondary coil, an electromotive force is induced in the secondary coil by sensing the alternating electromagnetic field.

77. The light-emitting component package as claimed in claim 76, wherein the power supplier further comprises a cup base, and the light-emitting component is inserted and positioned in a cup of the cup base.

78. The light-emitting component package as claimed in claim 76, further comprising: a heat-conductor, having at least two heat-conducting portions and a carrier portion, wherein the carrier portion connects the heat-conducting portions and carries the light-emitting component.

79. The light-emitting component package as claimed in claim 78, wherein the power supplier further comprises a cup base, and the light-emitting component is retained in a cup of the cup base through the heat-conducting portions.

80. The light-emitting component package as claimed in claim 79, wherein the heat-conducting portions are in contact with a heat dissipation portion of the cup base, such that the heat generated by the light-emitting component is transferred to the heat dissipation portion through the heat-conductor, so as to be dissipated.

81. The light-emitting component package as claimed in claim 76, wherein the secondary magnetic inductive unit and the primary magnetic inductive unit are U-shaped.

82. The light-emitting component package as claimed in claim 76, wherein the secondary magnetic inductive unit is E-shaped and has a middle extending portion, and the middle extending portion of the secondary magnetic inductive unit is wound by the secondary coil; and the primary magnetic inductive unit is E-shaped and has a middle extending portion, the end of the middle extending portion of the primary magnetic inductive unit is coupled with the end of the middle extending portion of the secondary magnetic inductive unit, and the middle extending portion of the primary magnetic inductive unit is wound by the primary coil.

83. The light-emitting component package as claimed in claim 76, further comprising: a capacitor, connected in parallel with the electrodes of the light-emitting component.

84. The light-emitting component package as claimed in claim 76, further comprising: a surge absorber, connected in parallel with the electrodes of the light-emitting component.

85. The light-emitting component package as claimed in claim 76, further comprising: a rectifier, . connected in series between the electrodes of the light-emitting component and the secondary coil.

86. The light-emitting component package as claimed in claim 85, wherein the rectifier is a bridge rectifier circuit or a diode rectifier circuit.

87. The light-emitting component package as claimed in claim 76, wherein the light-emitting component is an LED.

88. A power supplier, adapted to a light-emitting component package to supply electric power, wherein the light-emitting component package comprises a light-emitting component, a secondary coil, and a secondary magnetic inductive unit, the light-emitting component has at least two electrodes, the secondary coil has two ends electrically coupled to the electrodes, the secondary magnetic inductive unit has two ends and is wound by the secondary coil, the power supplier comprises: a primary coil, inducing an alternating electromagnetic field after a current passes through the primary coil; and a primary magnetic inductive unit, having two ends and wound by the primary coil, so as to induce the alternating electromagnetic field, wherein the two ends of the secondary magnetic inductive unit are magnetically coupled with the two ends of the primary magnetic inductive unit, so as to form a closed magnetic field loop, the secondary magnetic inductive unit is used to sense the alternating electromagnetic field induced by the primary magnetic inductive unit, and an electromotive force is induced in the secondary coil by sensing the alternating electromagnetic field.

89. The power supplier as claimed in claim 88, further comprising a cup base, wherein the light-emitting component is inserted and positioned in a cup of the cup base.

90. The power supplier as claimed in claim 88, wherein the secondary magnetic inductive unit and the primary magnetic inductive unit are U-shaped.

91. The power supplier as claimed in claim 88, wherein the secondary magnetic inductive unit is E-shaped and has a middle extending portion, and the middle extending portion of the secondary magnetic inductive unit is wound by the secondary coil; and the primary magnetic inductive unit is E-shaped and has a middle extending portion, the end of the middle extending portion of the primary magnetic inductive unit is coupled with the end of the middle extending portion of the secondary magnetic inductive unit, and the middle extending portion of the primary magnetic inductive unit is wound by the primary coil.