CN103280507A - Dual in-line package (DIP) LED (Light Emitting Diode) automatic forming device capable of positioning height and DIP LED automatic forming method - Google Patents
Dual in-line package (DIP) LED (Light Emitting Diode) automatic forming device capable of positioning height and DIP LED automatic forming method Download PDFInfo
- Publication number
- CN103280507A CN103280507A CN2013101831830A CN201310183183A CN103280507A CN 103280507 A CN103280507 A CN 103280507A CN 2013101831830 A CN2013101831830 A CN 2013101831830A CN 201310183183 A CN201310183183 A CN 201310183183A CN 103280507 A CN103280507 A CN 103280507A
- Authority
- CN
- China
- Prior art keywords
- adhesive tape
- pressure roller
- sticking
- height
- sticking pressure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
The invention discloses a dual in-line package (DIP) LED (Light Emitting Diode) automatic forming device capable of positioning height and a DIP LED automatic forming method. The device comprises DIP LED bodies and height positioning rubber bars which are fixedly connected to two pins of each DIP LED body, wherein the bottom surfaces of all the height positioning rubber bars are planes and are located on the same plane vertical to the pins; the method comprises the steps of applying bonding force on the DIP LED bodies on opposite braids of the upper and lower height positioning rubber bars; reliably bonding the upper and lower height positioning rubber bars on the front faces and back faces of all the DIP LED bodies on the braids; and finally punching the positions of the upper and lower height positioning rubber bars between two adjacent DIP LED bodies on the braids to form each DIP LED capable of positioning height. Automatic plugging can be completed through an automatic plug-in device in the way that the height positioning rubber bars on the pins of the DIP LED bodies, an original braiding mode is not needed to be changed, and no influence is caused on the element performance.
Description
Technical field
The invention belongs to electronic technology field, relate in particular to device for automatically molding and the automatic forming method of direct insertion (DIP) LED that can be directly highly locatees with predetermined height plug-in mounting to the band in the pad hole of pcb board by automatic insertion equipment.
Background technology
LED obtains general use in electron trades such as household electrical appliance, automobile, Aero-Space, the consumer goods, medical treatment, industrial automation equipment and instrument, industry use various direct insertion LED all be by the product structure requirement for height on the pin of LED by hand operating type add and be plugged in the pad hole of PCB by handwork again after wearing suitable led support, along with cost of labor increase and automatic insertion equipment are popularized, manual work mode has restricted production efficiency and the product quality of electronic circuit board.
Existing automatic insertion equipment can be finished the action that will directly be inserted into through direct insertion LED in the pad hole of PCB, but owing to there is no the height keeper on the pin of direct insertion LED, therefore, automatic insertion equipment can only be inserted into the end with direct insertion LED, namely is inserted into the position of being close to pcb board at the bottom of the resin that makes direct insertion LED; If being inserted into the end, direct insertion LED can produce following problem: the one, and diameter owing to the potting resin reason is pulled encapsulation easily, causes quality hidden danger less than the direct insertion LED of 5mm; The 2nd, easy Yin Gaowen damages direct insertion LED when welding with crest tin stove, is embodied in especially when adopting lead-free solder (generally not having slicker solder stove welding temperature is 260 ℃ ± 5 ℃); The 3rd, can't satisfy the requirement of product structure height, but will be determined the complete machine panel that the design height of PCBA part is installed by the packaging height of direct insertion LED, this has just improved the product casing designing requirement.
At present, the industry usually following dual mode realization of sampling is plugged in direct insertion LED by the requirement for height of product structure purpose in the pad hole of PCB automatically by automatic insertion equipment, the one, the pin of direct insertion LED is made " K " point that needs with equipment (be commonly called as: be inserted in the pad hole of PCB with automatic insertion equipment again the frog leg), there is certain application limitation in this kind locate mode, this is embodied in: the height of LED bottom legs must be more than or equal to 3mm, otherwise the equipment stress of beating " K " point causes the drawing crack of LED bulk resin quality hidden danger easily; The height of LED bottom legs more than or equal to 6mm after during with automatic insertion equipment, because automatic insertion equipment generally is to catch component pin with claw, after using the pad hole of illumination Equipment Alignment pcb board again, component pin is thrown into the pad hole of pcb board from element top stress application, LED pin and pcb board just only depend on the strong point on " K " some two sides, at this moment the stress that applies of LED bulk resin weight and automatic insertion equipment just causes the LED luminous point to depart from easily, influences installation and the visual effect of PCBA.The 2nd, with direct insertion LED by the product structure requirement for height with different packaging height, the defective that this kind mode exists is: material special use, LED cost of manufacture height; Buying, storage difficulty are not suitable for the multi-model small lot batch manufacture.
Summary of the invention
One object of the present invention provides a kind of device for automatically molding with the direct insertion LED that highly locatees, and direct insertion LED wherein can be plugged in its requirement for height by product structure in the pad hole of PCB automatically by automatic insertion equipment.
The technical scheme of the present invention sampling is: a kind of with the device for automatically molding of the direct insertion LED of location highly, comprise that upper and lower adhesive tape glue press mechanism, and be used for the injector of spray adhesive, thrust head and thrust the elevating mechanism of a lifting with drive;
The described sticking press mechanism of adhesive tape of going up comprises for the last applicator wheel of highly locating adhesive tape on twining, be installed on the braid conveying device directly over go up sticking pressure roller and drive and go up the actuator that sticking pressure roller rotates, wherein, go up the rotating shaft of sticking pressure roller and the throughput direction quadrature of braid conveying device, go up sticking pressure roller be used for receiving go up that applicator wheel transports on highly locate adhesive tape, described sticking pressure roller its excircle be formed with width with on highly locate the top roll location notch that the width of adhesive tape is complementary, the degree of depth of described top roll location notch is smaller or equal to the thickness of last height location adhesive tape so that enter in the top roll location notch on highly locate adhesive tape the adhesive surface that exposes and braid on the front of pin of direct insertion LED body contact;
The sticking press mechanism of described adhesive tape down comprises the following applicator wheel of highly locating adhesive tape down for twining, be installed on the braid conveying device under following sticking pressure roller and drive the actuator that down sticking pressure roller rotates, wherein, the rotating shaft of following sticking pressure roller and the throughput direction quadrature of braid conveying device, the following height location adhesive tape that applicator wheel transported under sticking pressure roller was used for receiving down, described down sticking pressure roller is formed with the lower roll location notch that width and the width of highly locating adhesive tape down are complementary at its excircle, the degree of depth of described lower roll location notch is smaller or equal to the thickness of highly locating down adhesive tape, so that the back side of the pin of the direct insertion LED body in the adhesive surface that exposes that enters the following height location adhesive tape in the lower roll location notch and the braid contacts;
Described injector comprise for the compression pump of fluid binder boil down to gaseous state adhesive and, following injector head, on described, following injector head is connected with the compression delivery side of pump by pipeline, described installation site of going up injector head makes goes up gaseous state adhesive spray that injector head can form compressed pump in highly locating on the adhesive surface of adhesive tape between last applicator wheel and the sticking pressure roller, the installation site of following injector head makes gaseous state adhesive spray that injector head down can form compressed pump in locating on the adhesive surface of adhesive tape at the following height between applicator wheel and the following sticking pressure roller down;
The described head that thrusts is positioned at the place ahead of upper and lower sticking pressure roller at the throughput direction of braid conveying device, thrust between adjacent direct insertion LED body, will finish sticking upper and lower height location adhesive tape of pressing, form the highly direct insertion LED of location of band, wherein, being adhered to two height on the pin of described direct insertion LED, to locate the bottom surface that is used for contacting with pcb board of adhesive tape be the plane, and the described bottom surface that two height are located adhesive tape is on the same horizontal plane vertical with pin; And,
Described device for automatically molding comprises that also driving drives the actuator that upper and lower sticking pressure roller rotates, the electric control system of compression pump and elevating mechanism coordination respectively.
Preferably, described upward adhesive tape is glued press mechanism and is comprised that also at least one is arranged at applicator wheel and goes up the last guide roller that glues between the pressure roller, and described adhesive tape is down glued press mechanism and comprised that also at least one is arranged at down the lower steering roll between applicator wheel and the following sticking pressure roller.By the positioning accuracy that upper and lower guide roller can further improve upper and lower height location adhesive tape is set.
Preferably, described device for automatically molding also comprises and is arranged at upper and lower sticking pressure roller and thrusts nice and warm machine between the head, makes to finish adhesive tape bonding direct insertion LED body in upper and lower height location in the braid and arrive by way of nice and warm machine and thrust the head place.By the binding speed that nice and warm machine can accelerate upper and lower height location adhesive tape is set.
Preferably, the degree of depth correspondence of described upper and lower roll location notch is less than the thickness of upper and lower height location adhesive tape.
Preferably, the described jet face of going up injector head with last applicator wheel with glue between the pressure roller on highly to locate the adhesive surface of adhesive tape parallel; The jet face of described injector head down is parallel with the adhesive surface of locating adhesive tape at following applicator wheel and the following height between the following sticking pressure roller.The adhesive of gaseous state accurately can be injected directly into like this on the adhesive surface of upper and lower height location adhesive tape.
Preferably, the sticking press mechanism of last adhesive tape arrange the position make between last applicator wheel and sticking pressure roller on highly locate adhesive tape and have vertical transmissions section, it is section relative that described upward injector head and last height are located the vertical transmission of adhesive tape; The position that arranges of the sticking press mechanism of following adhesive tape makes to have vertical transmissions section in applicator wheel down and the following height location adhesive tape between the sticking pressure roller down, and described injector head down and following vertical transmission of highly locating adhesive tape are section relative.
The actuator of described upper and lower sticking pressure roller is same actuator, and described actuator drives upper and lower sticking pressure roller by gear drive and rotates synchronously along opposite direction; Described device for automatically molding also comprises position adjusting mechanism, and described position adjusting mechanism comprises for the mounting panel that described actuator and gear drive are installed and drives the horizontal mobile mechanism that mounting panel moves in the rotor shaft direction of upper and lower sticking pressure roller.
Another object of the present invention provides the automatic forming method of the direct insertion LED that a kind of above-mentioned band highly locatees.
The technical solution used in the present invention is: the band highly automatic forming method of direct insertion LED of location is: by electric control system drive lay respectively at directly over the braid with under on, following sticking pressure roller and braid conveying device synchronization action, with will be wound in by last sticking pressure roller the volume insulation of one on the applicator wheel on highly locate adhesive tape according to the pre-position in the front of the sticking pin that is pressed on each the direct insertion LED body in the braid of the transporting velocity of braid conveying device, and glue the pre-position at the back side of the pin that is pressed on each the direct insertion LED body in the braid according to the transporting velocity of braid conveying device by the following height location adhesive tape that sticking pressure roller down will be wound in down the insulation of the volume of one on the applicator wheel; Wherein, electric control system control injector with the gaseous state adhesive spray to the bonding plane of from the upwards sticking pressure roller motion of last applicator wheel, highly locating adhesive tape and from the bonding plane of the following height location adhesive tape of applicator wheel sticking pressure roller motion downwards down;
Described electric control system control elevating mechanism drives and thrusts head and will arrive locating adhesive tape and thrust finishing upper and lower height between the bonding adjacent direct insertion LED body under it, to form the highly direct insertion LED of location of band, wherein, being adhered to two height on the pin of described direct insertion LED, to locate the bottom surface that is used for contacting with pcb board of adhesive tape be the plane, and the described bottom surface that two height are located adhesive tape is on the same horizontal plane vertical with pin.
Preferably, finish the bonding nice and warm machine of direct insertion LED body approach and arrive the described head place of thrusting again, in order to accelerating binding speed and upper and lower height location adhesive tape is softened, the ambient temperature that described nice and warm machine provides is lower than the melting temperature of upper and lower height location adhesive tape.
Preferably, described upper and lower height positioning strip is made of plastics.
Preferably, the described gaseous state adhesive oxolane that is gaseous state.
Beneficial effect of the present invention is: by at direct insertion LED body (in the present invention, direct insertion LED body refers to the direct insertion LED that does not have the height keeper of the prior art) pin on bonding height location adhesive tape, can finish autopatching by automatic insertion equipment, this kind mode need not to change former braid mode, and element function is not had influence yet.In addition, sticking pressure thrusts the limited bayonet of back formation can effectively guarantee not influence later process, and, after in the pad hole that direct insertion LED is plugged in pcb board, highly locating adhesive tape is supported on the front of pcb board, and pin is worn to the part at the pcb board back side and is converted into clubfoot with to be welded, like this, direct insertion LED just is clamped on the pcb board by highly locating adhesive tape and clubfoot, this can guarantee before the welding of tin stove and the direct insertion LED in welding back keeps original height and angle, the problem that luminous point departs from can not take place.
In addition, method of the present invention also has the following advantages: adjustable for height advantage, minimumly be direct insertion LED body or add the height of highly locating adhesive tape, and be up to the 23mm that is fit to automatic insertion equipment; Highly locate adhesive tape and can adopt extrusion way, convenient machinery is sticking the pressure automatically.
Description of drawings
Fig. 1 shows the front view of processing method after bonding upper and lower height location adhesive tape on the pin of direct insertion LED body according to direct insertion LED of the present invention;
Fig. 2 shows the binding site relation between two pins of highly locating adhesive tape and direct insertion LED body.
Fig. 3 shows the front view of the device for automatically molding of direct insertion LED of the present invention;
Fig. 4 shows the end view of sticking pressure roller among Fig. 3.
Embodiment
Below in conjunction with accompanying drawing the specific embodiment of the present invention is described further.
As illustrated in fig. 1 and 2, direct insertion LED of the present invention comprises direct insertion LED body 1 and is adhered to the height location adhesive tape of the insulation on two pins 11 of direct insertion LED body 1, all bottom surfaces of highly locating adhesive tape are the plane, and all bottom surfaces of highly locating adhesive tape all are on the same horizontal plane 13 vertical with pin.At this, if highly locate the link position of adhesive tape can make direct insertion LED body in the effect lower support of automatic insertion equipment in pcb board.In the present embodiment, this cross section of highly locating adhesive tape is square.
In order to simplify moulding process, embodiment has as shown in Figure 2 adopted two height to locate adhesive tape 21a, 22a, highly locatees adhesive tape 21a and is connected with the front of two pins 11, highly locatees adhesive tape 22a and is connected with the back side of two pins 11.
Above height location adhesive tape can be adhered to the material of pin 11 by plastics, rubber etc. by the adhesive that is complementary, and wherein, plastics can be PP, PVC, ABS, PE, PC etc., and plastics can be by for example being that the adhesive of oxolane carries out bonding.
The direct insertion LED that above band is highly located can be processed into automatically by following device for automatically molding.
As shown in Figure 3, this device for automatically molding can comprise that upper and lower adhesive tape glues press mechanism, is used for the injector of spray adhesive, thrusts 9 and drive and thrust the elevating mechanism (not shown) of a lifting; Should go up the sticking press mechanism of adhesive tape comprises for the last applicator wheel 6a that highly locatees adhesive tape 21 on twining, be installed on the braid conveying device directly over to go up sticking pressure roller 3a and drive what go up that sticking pressure roller 3a rotates for example be the actuator of motor, wherein, go up the rotating shaft of sticking pressure roller 3a and the throughput direction P quadrature of braid conveying device, consistent with throughput direction P in the tangential direction of the minimum point of closing on the braid conveying device to guarantee sticking pressure roller 3a, go up sticking pressure roller 3a be used for receiving go up that applicator wheel 6a transports on highly locate adhesive tape 21, and will be somebody's turn to do and highly locate adhesive tape 21 and glue on the precalculated position in the front that is pressed on the pin that is transported to the direct insertion LED body under it; In order to make sticking pressure roller 3a highly locate adhesive tape 21 sticking being pressed on the pin 11 reliably with going up, as shown in Figure 4, as the sticking pressure roller 3 of sticking pressure roller 3a on this its excircle be formed with width with on highly locate the top roll location notch 31 that the width of adhesive tape 21 is complementary, the degree of depth of top roll location notch 31 is smaller or equal to the thickness of last height location adhesive tape 21, could guarantee like this to enter in the top roll location notch 31 on highly locate adhesive tape 21 the adhesive surface that exposes can contact with the front of pin 11 of direct insertion LED body in the braid, in the present embodiment, the degree of depth of top roll location notch 31 is less than the thickness of last height location adhesive tape 21, make a part of highly locating adhesive tape 21 in 32 clampings of spacing side plate of top roll location notch 31 both sides, can prevent that so spacing side plate 32 from contacting with pin 11, can avoid it to the wearing and tearing of pin 11, can prevent that also adhesive is spilled on the edge of spacing side plate 32 in sticking process of pressing.
The sticking press mechanism of this time adhesive tape comprises the following applicator wheel 6b that highly locatees adhesive tape 22 down for twining, be installed on the braid conveying device under following sticking pressure roller 3b and drive the actuator that down sticking pressure roller 3b rotates, for the ease of making upper and lower sticking pressure roller 3b synchronization action, can adopt same actuator to drive upper and lower sticking pressure roller action simultaneously by transmission mechanism, the relative position relation of each part of the sticking press mechanism of upper and lower adhesive tape as shown in Figure 3 requires the direction of rotation of upper and lower sticking pressure roller, therefore, above-mentioned transmission mechanism can adopt gear drive.In like manner, the rotating shaft of the sticking pressure roller 3b of this time and throughput direction P quadrature, the following height location adhesive tape 22 that applicator wheel 6b transported under sticking pressure roller 3b was used for receiving down, down sticking pressure roller 3b is formed with the lower roll location notch that width and the width of highly locating adhesive tape 22 down are complementary at its excircle, the degree of depth of lower roll location notch is smaller or equal to the thickness of highly locating down adhesive tape, so that the back side of the pin 11 of the direct insertion LED body 1 in the adhesive surface that exposes that enters the following height location adhesive tape 22 in the lower roll location notch and the braid contacts.In the present embodiment, upper and lower height location adhesive tape adopts to be had identical shaped and adhesive tape size, and therefore, each part of the sticking press mechanism of upper and lower adhesive tape can have identical physical dimension.
Injector comprise for the compression pump 4 of fluid binder boil down to gaseous state adhesive and, following injector head 41a, 41b, on, following injector head 41a, 41b is connected by the outlet of pipeline with compression pump 4, gaseous state adhesive spray that injector head can form compressed pump 4 make to be gone up in highly locating on the adhesive surface (outer surface) of adhesive tape 21 in the installation site of last injector head 41a between last applicator wheel 6a and the sticking pressure roller 3a, the installation site of following injector head 41b makes gaseous state adhesive spray that injector head down can form compressed pump 4 in locating on the adhesive surface (outer surface) of adhesive tape 22 at the following height between applicator wheel 6b and the following sticking pressure roller 3b down.In the embodiment shown in fig. 3, highly locate adhesive tape 21 between last applicator wheel 6a and the sticking pressure roller 3a and have vertical transmissions section, it is relative with its vertically transmission section to go up injector head 4a, in like manner, also have vertical transmissions section at following applicator wheel 6b with the following height location adhesive tape 22 between the sticking pressure roller 3b down, this time injector head 4b and its vertical transmission are section relative.In addition, the jet face of last injector head 41a can with phase contraposition with it on highly to locate the adhesive surface of adhesive tape 21 parallel, even the axis of last injector head 41a is vertical with adhesive surface on the other side, in like manner, the jet face of following injector head 41b can be parallel with the adhesive surface of the following height location adhesive tape 22 of phase contraposition with it, so namely is convenient to install and can guarantee the accuracy of eject position.
More than thrust 9 and be positioned at the place ahead of upper and lower sticking pressure roller at throughput direction P, thrust between adjacent direct insertion LED body, will finish sticking upper and lower height location adhesive tape of pressing, form the direct insertion LED that each band as shown in Figure 2 highly is located.
In addition, device for automatically molding of the present invention comprises that also driving drives the actuator that upper and lower sticking pressure roller 3a, 3b rotate, the electric control system of compression pump 4 and elevating mechanism coordination respectively.
For the ease of going up, following sticking pressure roller 3a, 3b be adjusted to can with on, highly locate adhesive tape 21 down, 22 glue on the precalculated position (it is corresponding at the height behind the plug-in mounting on the pcb board with the direct insertion LED that requires) that is depressed into pin, this device for automatically molding also can comprise for regulating simultaneously, following sticking pressure roller 3a, the position adjusting mechanism of the position of 3b on the rotor shaft direction vertical with throughput direction P, this position adjusting mechanism can comprise be used to installing, following sticking pressure roller 3a, the horizontal mobile mechanism that the mounting panel of the actuator of 3b and drive mounting panel move in rotor shaft direction, in addition, in order to guarantee the accuracy of the mounting panel direction of motion, can be this mounting panel and set a guide rail along the rotor shaft direction setting that is slidingly matched with it, this horizontal mobile mechanism can adopt the feed screw nut transmission, synchronizing wheel and synchronous belt drive mechanism etc. are used for the drag chain of guiding for the latter by being the mounting panel configuration.Alternatively, this device for automatically molding also comprises for the upper and lower position adjusting mechanism of regulating upper and lower sticking pressure roller 3a, the position of 3b on the rotor shaft direction vertical with throughput direction P respectively, the upper and lower position adjusting mechanism all can adopt the bolt and nut transmission, and this bolt and nut transmission can also can manually be controlled by motor-driven.
As shown in Figure 3, in the present embodiment, the sticking press mechanism of last adhesive tape comprises that also at least one is arranged at applicator wheel 6a and goes up the last guide roller 5a that glues between the pressure roller 3a, and in like manner, the sticking press mechanism of following adhesive tape comprises that also at least one is arranged at down the lower steering roll 5b between applicator wheel 6b and the following sticking pressure roller 3b.Upper and lower guide roller 5a, 5b also can play the effect in the upper and lower height location adhesive tape 21 that changes as required in carrying, 22 conveying orientation except improving positioning accuracy.
On accelerating, highly locate adhesive tape 21 down, 22 and the binding speed of 11 of pins, this device for automatically molding also can be last, following sticking pressure roller 3a, 3b and thrust 9 between a nice and warm machine 8 is set, by nice and warm machine improve (implication of raising namely is higher than room temperature 25 degree) finish sticking press on, highly locate the residing ambient temperature of adhesive tape down, wherein, on the ambient temperature that nice and warm machine provides is lower than, highly locate the melting temperature of adhesive tape down, maximum temperature is chosen in about half of melting temperature usually, on guaranteeing, bottom shape and the position of highly locating adhesive tape down do not change substantially, at this, those skilled in the art can select concrete heating-up temperature according to the performance parameter of the material of the height chosen location adhesive tape.Should be understood that, can make upper and lower height location adhesive tape 21,22 fully at room temperature or be lower than carry out under the condition of room temperature bonding, be the bonding time long, but do not influence enforcement and the final effect of automatic moulding.In addition, nice and warm machine 8 being set also has and upper and lower height location adhesive tape 21,22 can be softened the effect of being convenient to thrust.
At this, adopt PVC as upper and lower height location adhesive tape 21,22, then this heating-up temperature is not higher than 150 degree usually, and the heating-up temperature of choosing in the present embodiment is that 65 degree are to 85 degree, as heating-up temperature being set at 80 degree.
Respectively paste structure and the above a kind of device for automatically molding of processing the direct insertion LED of this kind that provides that a height is located adhesive tape at above front and back at pin, the present invention also provides a kind of automatic forming method at the direct insertion LED of this kind, be specially: by electric control system drive lay respectively at directly over the braid B and under on, following sticking pressure roller 3a, 3b and braid conveying device synchronization action, highly locate adhesive tape 21 on the applicator wheel 6a a volume according to the pre-position in the front of the sticking pin 11 that is pressed on each the direct insertion LED body 1 on the braid B of the transporting velocity of braid conveying device will be wound in by last sticking pressure roller 3a, and will be wound in down the volume of one on the applicator wheel 6b by sticking pressure roller 3b down and highly locate adhesive tape 22 is glued 11 back sides of the pin that is pressed on each the direct insertion LED body 1 on the braid B according to the transporting velocity of braid conveying device pre-position down; Wherein, electric control system control injector with the gaseous state adhesive spray to the bonding plane of from the upwards sticking pressure roller 3a motion of last applicator wheel 6a, highly locating adhesive tape 21 and from the bonding plane of the following height location adhesive tape 22 of applicator wheel 6b sticking pressure roller 3b motion downwards down.
Simultaneously, electric control system control elevating mechanism drives and thrusts the 8 upper and lower height location adhesive tape finishing between the bonding adjacent direct insertion LED body that will arrive under it and thrust, the direct insertion LED that highly locatees with each band that forms as shown in Figure 2.
The above only is preferred implementation of the present invention, is not to limit practical range of the present invention, and the equivalence of doing in protection scope of the present invention changes and modifies in every case, all should think to have fallen in protection scope of the present invention.
Claims (10)
1. one kind with the device for automatically molding of direct insertion LED of location highly, it is characterized in that, comprises that upper and lower adhesive tape glue press mechanism, is used for the injector of spray adhesive, thrusts head and drive thrusts the elevating mechanism of a lifting;
The described sticking press mechanism of adhesive tape of going up comprises for the last applicator wheel of highly locating adhesive tape on twining, be installed on the braid conveying device directly over go up sticking pressure roller and drive and go up the actuator that sticking pressure roller rotates, wherein, go up the rotating shaft of sticking pressure roller and the throughput direction quadrature of braid conveying device, go up sticking pressure roller be used for receiving go up that applicator wheel transports on highly locate adhesive tape, described sticking pressure roller its excircle be formed with width with on highly locate the top roll location notch that the width of adhesive tape is complementary, the degree of depth of described top roll location notch is smaller or equal to the thickness of last height location adhesive tape so that enter in the top roll location notch on highly locate adhesive tape the adhesive surface that exposes and braid on the front of pin of direct insertion LED body contact;
The sticking press mechanism of described adhesive tape down comprises the following applicator wheel of highly locating adhesive tape down for twining, be installed on the braid conveying device under following sticking pressure roller and drive the actuator that down sticking pressure roller rotates, wherein, the rotating shaft of following sticking pressure roller and the throughput direction quadrature of braid conveying device, the following height location adhesive tape that applicator wheel transported under sticking pressure roller was used for receiving down, described down sticking pressure roller is formed with the lower roll location notch that width and the width of highly locating adhesive tape down are complementary at its excircle, the degree of depth of described lower roll location notch is smaller or equal to the thickness of highly locating down adhesive tape, so that the back side of the pin of the direct insertion LED body in the adhesive surface that exposes that enters the following height location adhesive tape in the lower roll location notch and the braid contacts;
Described injector comprise for the compression pump of fluid binder boil down to gaseous state adhesive and, following injector head, on described, following injector head is connected with the compression delivery side of pump by pipeline, described installation site of going up injector head makes goes up gaseous state adhesive spray that injector head can form compressed pump in highly locating on the adhesive surface of adhesive tape between last applicator wheel and the sticking pressure roller, the installation site of following injector head makes gaseous state adhesive spray that injector head down can form compressed pump in locating on the adhesive surface of adhesive tape at the following height between applicator wheel and the following sticking pressure roller down;
The described head that thrusts is positioned at the place ahead of upper and lower sticking pressure roller at the throughput direction of braid conveying device, thrust between adjacent direct insertion LED body, will finish sticking upper and lower height location adhesive tape of pressing, form the highly direct insertion LED of location of band, wherein, being adhered to two height on the pin of described direct insertion LED, to locate the bottom surface that is used for contacting with pcb board of adhesive tape be the plane, and the described bottom surface that two height are located adhesive tape is on the same horizontal plane vertical with pin; And,
Described device for automatically molding comprises that also driving drives the actuator that upper and lower sticking pressure roller rotates, the electric control system of compression pump and elevating mechanism coordination respectively.
2. device for automatically molding according to claim 1, it is characterized in that, described upward adhesive tape is glued press mechanism and is comprised that also at least one is arranged at applicator wheel and goes up the last guide roller that glues between the pressure roller, and described adhesive tape is down glued press mechanism and comprised that also at least one is arranged at down the lower steering roll between applicator wheel and the following sticking pressure roller.
3. device for automatically molding according to claim 1, it is characterized in that, also comprise being arranged at upper and lower sticking pressure roller and thrusting nice and warm machine between the head, make and finish adhesive tape bonding direct insertion LED body in upper and lower height location in the braid and arrive by way of nice and warm machine and thrust the head place.
4. device for automatically molding according to claim 1 is characterized in that, the degree of depth correspondence of described upper and lower roll location notch is less than the thickness of upper and lower height location adhesive tape.
5. device for automatically molding according to claim 1 is characterized in that, the described jet face of going up injector head with last applicator wheel with glue between the pressure roller on highly to locate the adhesive surface of adhesive tape parallel; The jet face of described injector head down is parallel with the adhesive surface of locating adhesive tape at following applicator wheel and the following height between the following sticking pressure roller.
6. device for automatically molding according to claim 1 or 5, it is characterized in that, the sticking press mechanism of last adhesive tape arrange the position make between last applicator wheel and sticking pressure roller on highly locate adhesive tape and have vertical transmissions section, it is section relative that described upward injector head and last height are located the vertical transmission of adhesive tape; The position that arranges of the sticking press mechanism of following adhesive tape makes to have vertical transmissions section in applicator wheel down and the following height location adhesive tape between the sticking pressure roller down, and described injector head down and following vertical transmission of highly locating adhesive tape are section relative.
7. according to each described device for automatically molding in the claim 1 to 5, it is characterized in that the actuator of described upper and lower sticking pressure roller is same actuator, described actuator drives upper and lower sticking pressure roller by gear drive and rotates synchronously along opposite direction; Described device for automatically molding also comprises position adjusting mechanism, and described position adjusting mechanism comprises for the mounting panel that described actuator and gear drive are installed and drives the horizontal mobile mechanism that mounting panel moves in the rotor shaft direction of upper and lower sticking pressure roller.
8. one kind with the automatic forming method of direct insertion LED of location highly, it is characterized in that, by electric control system drive lay respectively at directly over the braid and under on, following sticking pressure roller and braid conveying device synchronization action, with will be wound in by last sticking pressure roller the volume insulation of one on the applicator wheel on highly locate adhesive tape according to the pre-position in the front of the sticking pin that is pressed on each the direct insertion LED body in the braid of the transporting velocity of braid conveying device, and glue the pre-position at the back side of the pin that is pressed on each the direct insertion LED body in the braid according to the transporting velocity of braid conveying device by the following height location adhesive tape that sticking pressure roller down will be wound in down the insulation of the volume of one on the applicator wheel; Wherein, electric control system control injector with the gaseous state adhesive spray to the bonding plane of from the upwards sticking pressure roller motion of last applicator wheel, highly locating adhesive tape and from the bonding plane of the following height location adhesive tape of applicator wheel sticking pressure roller motion downwards down;
Described electric control system control elevating mechanism drives and thrusts head and will arrive locating adhesive tape and thrust finishing upper and lower height between the bonding adjacent direct insertion LED body under it, to form the highly direct insertion LED of location of band, wherein, being adhered to two height on the pin of described direct insertion LED, to locate the bottom surface that is used for contacting with pcb board of adhesive tape be the plane, and the described bottom surface that two height are located adhesive tape is on the same horizontal plane vertical with pin.
9. automatic forming method according to claim 8, it is characterized in that: finish the bonding nice and warm machine of direct insertion LED body approach and arrive the described head place of thrusting again, in order to accelerating binding speed and upper and lower height location adhesive tape is softened, the ambient temperature that described nice and warm machine provides is lower than the melting temperature of upper and lower height location adhesive tape.
10. automatic forming method according to claim 8, it is characterized in that: described upper and lower height positioning strip is made of plastics.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310183183.0A CN103280507B (en) | 2013-05-17 | 2013-05-17 | The device for automatically molding of the direct insertion LED with altitude location and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310183183.0A CN103280507B (en) | 2013-05-17 | 2013-05-17 | The device for automatically molding of the direct insertion LED with altitude location and method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103280507A true CN103280507A (en) | 2013-09-04 |
| CN103280507B CN103280507B (en) | 2015-09-09 |
Family
ID=49062989
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310183183.0A Expired - Fee Related CN103280507B (en) | 2013-05-17 | 2013-05-17 | The device for automatically molding of the direct insertion LED with altitude location and method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103280507B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113299815A (en) * | 2021-05-25 | 2021-08-24 | 深圳市奥蕾达科技有限公司 | LED lamp bead |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008043264A1 (en) * | 2006-09-28 | 2008-04-17 | Industrial Technology Research Institute | Light-emitting component package, light-emitting component packaging apparatus, and light source device |
| CN101471418A (en) * | 2006-12-27 | 2009-07-01 | 财团法人工业技术研究院 | Lead wire holder of LED |
| CN201349019Y (en) * | 2008-12-18 | 2009-11-18 | 珠海华冠光电技术有限公司 | LED support conveying device |
| CN201898150U (en) * | 2010-10-29 | 2011-07-13 | 中山市晶明光电科技有限公司 | Light emitting diode support |
| CN202695531U (en) * | 2012-06-18 | 2013-01-23 | 东莞市钜晶光电有限公司 | Small direct-inserting LED lamp bead |
-
2013
- 2013-05-17 CN CN201310183183.0A patent/CN103280507B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008043264A1 (en) * | 2006-09-28 | 2008-04-17 | Industrial Technology Research Institute | Light-emitting component package, light-emitting component packaging apparatus, and light source device |
| CN101471418A (en) * | 2006-12-27 | 2009-07-01 | 财团法人工业技术研究院 | Lead wire holder of LED |
| CN201349019Y (en) * | 2008-12-18 | 2009-11-18 | 珠海华冠光电技术有限公司 | LED support conveying device |
| CN201898150U (en) * | 2010-10-29 | 2011-07-13 | 中山市晶明光电科技有限公司 | Light emitting diode support |
| CN202695531U (en) * | 2012-06-18 | 2013-01-23 | 东莞市钜晶光电有限公司 | Small direct-inserting LED lamp bead |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113299815A (en) * | 2021-05-25 | 2021-08-24 | 深圳市奥蕾达科技有限公司 | LED lamp bead |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103280507B (en) | 2015-09-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103707055B (en) | A kind of full automatic rivet magnetic circuit kludge | |
| CN101797545B (en) | Automatic sizing machine | |
| CN104786482A (en) | Embossing machine | |
| CN203339211U (en) | Direct insertion LED with height positioning and automatic forming device thereof | |
| CN103041961B (en) | The sucker jig of point gum machine | |
| CN107638993B (en) | Capacitor body gluing equipment | |
| CN104669685A (en) | Handle manufacturing machine | |
| CN105034350B (en) | Plastic hollow boards foursquare arc edge banding machine and edge sealing forming method | |
| CN103280507A (en) | Dual in-line package (DIP) LED (Light Emitting Diode) automatic forming device capable of positioning height and DIP LED automatic forming method | |
| CN104339678A (en) | Automatic cloth wrapping machine | |
| CN204977434U (en) | Embossing machine | |
| CN204566870U (en) | Be used for being separated the machine of the adhesive tape that flat rigid outer surface adheres to | |
| CN209720856U (en) | High-precision electronic component coding pipeline | |
| CN102832527B (en) | Automatic assembling machine for outer covers of connectors | |
| CN204278520U (en) | A kind of nut hot-press arrangement | |
| CN203982032U (en) | LCM module assembly machine ACF film pay-off | |
| CN203765256U (en) | Conveying mechanism | |
| CN112206948A (en) | Glue spraying reciprocating device and production line thereof | |
| CN205418966U (en) | Conducting strip pay -off line of terminal box paster production | |
| CN104959283B (en) | A kind of improved point gum machine feed mechanism | |
| CN204793575U (en) | Device is guaranteed to car connector stitch position degree | |
| CN205029978U (en) | Automatic edging device of improved generation printed circuit board | |
| CN203997839U (en) | A kind of hard circuit card self-propelled material transporter | |
| CN203388350U (en) | Automatic shoe buckle molding machine | |
| CN203004056U (en) | Architectural circular arc moulding coating machine |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20151103 Address after: 6-7 building, building A, No. 1, Shahu Road, Tangxia Town, Dongguan, Guangdong, 523710 Patentee after: Dongguan long Intelligent Electronic Technology Co., Ltd. Address before: 518000, building six, 1-4 new industrial zone, crane Chau, West Village, Baoan District, Shenzhen, Guangdong Patentee before: Shenzhen Long Duo Electronic Science & Technology Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150909 Termination date: 20210517 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |