CN103280507B - The device for automatically molding of the direct insertion LED with altitude location and method - Google Patents
The device for automatically molding of the direct insertion LED with altitude location and method Download PDFInfo
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- CN103280507B CN103280507B CN201310183183.0A CN201310183183A CN103280507B CN 103280507 B CN103280507 B CN 103280507B CN 201310183183 A CN201310183183 A CN 201310183183A CN 103280507 B CN103280507 B CN 103280507B
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Abstract
The invention discloses device for automatically molding and the method for the direct insertion LED of band altitude location, the former comprises direct insertion LED body and is fixed on the altitude location adhesive tape of the insulation on two pin, the bottom surface of all altitude location adhesive tape is plane, and is all in the same level vertical with pin.The latter is by applying loading pressure to upper and lower altitude location adhesive tape relative to the direct insertion LED body in braid, upper and lower altitude location adhesive tape is reliably adhered to the pin of direct insertion LED all in braid on the front and back, finally the position between the adjacent direct insertion LED body of upper and lower altitude location adhesive tape in braid is thrust, to form each direct insertion LED of band altitude location.By altitude location adhesive tape bonding on the pin of direct insertion LED body, namely complete autopatching by automatic insertion equipment, this kind of mode without the need to changing former braid mode, on element function also without impact.
Description
Technical field
The invention belongs to electronic technology field, particularly relate to can directly by automatic insertion equipment with predetermined height plug-in mounting to the device for automatically molding of direct insertion (DIP) LED of the band altitude location in the pad hole of pcb board and automatic forming method.
Background technology
LED obtains general use in the electron trades such as household electrical appliance, automobile, Aero-Space, the consumer goods, medical treatment, industrial automation equipment and instrument, industry use various direct insertion LED be all by product structure requirement for height on the pin of LED by hand operating type add wear suitable LED support after be plugged in the pad hole of PCB by handwork again, along with cost of labor increase and automatic insertion equipment are popularized, manual work mode has govern production efficiency and the product quality of electronic circuit board.
Existing automatic insertion equipment can complete the action that will be directly inserted into through direct insertion LED in the pad hole of PCB, but the pin due to direct insertion LED there is no altitude location part, therefore, direct insertion LED can only be inserted into the end by automatic insertion equipment, is namely inserted into the position making to be close to pcb board at the bottom of the resin of direct insertion LED; If direct insertion LED is inserted into the end can produce following problem: one is that encapsulation is easily pulled due to potting resin reason by the direct insertion LED that diameter is less than 5mm, causes quality hidden danger; Two be with during the welding of crest tin stove easily because of the direct insertion LED of high temperature failure, be embodied in when adopting lead-free solder (general is 260 DEG C ± 5 DEG C without slicker solder stove welding temperature) especially; Three is the requirements that cannot meet product structure height, but will be determined the design height of complete machine erecting of panel PCBA part by the packaging height of direct insertion LED, this provides for improved the requirement to product casing design.
At present, industry is sampled the object that following two kinds of modes realize automatically being plugged in by the requirement for height of product structure by direct insertion LED by automatic insertion equipment in the pad hole of PCB usually, one is be inserted in the pad hole of PCB with automatic insertion equipment again after " K " point (being commonly called as: frog leg) the pin equipment of direct insertion LED being made needs, there is certain application limitation in this kind of locate mode, this is embodied in: the height of LED bottom legs must be more than or equal to 3mm, otherwise beats the equipment stress that " K " put and easily the drawing crack of LED body resin is caused quality hidden danger; When the height of LED bottom legs to be more than or equal to after 6mm with automatic insertion equipment, because automatic insertion equipment is generally catch component pin with claw, after using the pad hole of illumination equipment Alignment pcb board again, from element crests stress application, component pin is thrown into the pad hole of pcb board, LED pin and pcb board just only put the strong point on two sides by " K ", at this moment the stress that LED body weight resin and automatic insertion equipment apply just easily causes LED luminous point to depart from, and affects installation and the visual effect of PCBA.Two is by direct insertion LED by the different packaging height of product structure requirement for height, and the defect that this kind of mode exists is: material is special, and LED cost of manufacture is high; Buying, storage difficulty, be not suitable for multi-model small lot batch manufacture.
Summary of the invention
One object of the present invention provides the device for automatically molding of a kind of direct insertion LED with altitude location, and its requirement for height by product structure is plugged in the pad hole of PCB by automatic insertion equipment by direct insertion LED wherein automatically.
The technical scheme of the present invention's sampling is: the device for automatically molding of a kind of direct insertion LED with altitude location, comprises upper and lower adhesive tape and glue press mechanism, for the injector of spray adhesive, thrusts head and drives the elevating mechanism thrusting head lifting;
Described upper adhesive tape is glued press mechanism and is comprised upper applicator wheel for being wound around upper altitude location adhesive tape, the actuator being installed on the upper sticky pressure roller directly over braid conveying device and driving upper sticky pressure roller to rotate, wherein, the rotating shaft of upper sticky pressure roller is orthogonal with the throughput direction of braid conveying device, the upper altitude location adhesive tape that upper sticky pressure roller transports for receiving upper applicator wheel, described sticky pressure roller is formed with the top roll location notch that width matches with the width of upper altitude location adhesive tape on its excircle, the degree of depth of described top roll location notch is less than or equal to the thickness of altitude location adhesive tape, contact with the front of the pin of the direct insertion LED body in braid to make the adhesive surface exposed of upper altitude location adhesive tape entered in top roll location notch,
Described lower adhesive tape is glued press mechanism and is comprised lower applicator wheel for being wound around lower altitude location adhesive tape, the actuator being installed on the lower sticky pressure roller immediately below braid conveying device and driving lower sticky pressure roller to rotate, wherein, the rotating shaft of lower sticky pressure roller is orthogonal with the throughput direction of braid conveying device, the lower altitude location adhesive tape that lower sticky pressure roller transports for receiving lower applicator wheel, the lower roll location notch that the width that described lower sticky pressure roller is formed with width and lower altitude location adhesive tape on its excircle matches, the degree of depth of described lower roll location notch is less than or equal to the thickness of lower altitude location adhesive tape, touch with the back face of the pin making the direct insertion LED body in the adhesive surface exposed of the lower altitude location adhesive tape entered in lower roll location notch and braid,
Described injector comprise for by the compression pump of fluid binder boil down to gaseous state adhesive and, lower injector head, on described, lower injector head is connected with compression delivery side of pump by pipeline, the gaseous state adhesive spray that the installation site of described upper injector head makes injector head compressed pump can be formed in upper applicator wheel and on upper altitude location adhesive tape between sticky pressure roller adhesive surface on, the gaseous state adhesive spray that the installation site of lower injector head makes lower injector head compressed pump can be formed is on the adhesive surface of the lower altitude location adhesive tape between lower applicator wheel and lower sticky pressure roller,
Describedly thrust the front that head is positioned at upper and lower sticky pressure roller on the throughput direction of braid conveying device, the upper and lower altitude location adhesive tape completing sticky pressure is thrust between adjacent direct insertion LED body, form the direct insertion LED of band altitude location, wherein, what be adhered to two altitude location adhesive tape on the pin of described direct insertion LED is plane for the bottom surface contacted with pcb board, and the described bottom surface of two altitude location adhesive tape is in the same level vertical with pin; And,
Described device for automatically molding also comprises the actuator that driving drives upper and lower sticky pressure roller to rotate respectively, the electric control system of compression pump and elevating mechanism coordination.
Preferably, described upper adhesive tape is glued press mechanism and is also comprised at least one and be arranged at upper guide roller between applicator wheel and upper sticky pressure roller, and described lower adhesive tape is glued press mechanism and also comprised at least one and be arranged at lower steering roll between lower applicator wheel and lower sticky pressure roller.The positioning precision of upper and lower altitude location adhesive tape is can further improve by arranging upper and lower guide roller.
Preferably, described device for automatically molding also comprises the nice and warm machine being arranged at upper and lower sticky pressure roller and thrusting between head, makes braid to complete the bonding direct insertion LED body of upper and lower altitude location adhesive tape and thrusts head place by way of nice and warm machine arrival.The binding speed of upper and lower altitude location adhesive tape can be accelerated by arranging nice and warm machine.
Preferably, the degree of depth correspondence of described upper and lower roll location notch is less than the thickness of upper and lower altitude location adhesive tape.
Preferably, described upper injector head jet face with upper applicator wheel with on the adhesive surface of upper altitude location adhesive tape between sticky pressure roller parallel; The jet face of described lower injector head is parallel with the adhesive surface of the lower altitude location adhesive tape between lower applicator wheel with lower sticky pressure roller.The adhesive of gaseous state accurately can be injected directly on the adhesive surface of upper and lower altitude location adhesive tape like this.
Preferably, the setting position that upper adhesive tape glues press mechanism make upper applicator wheel and on upper altitude location adhesive tape between sticky pressure roller there is vertical delivery section, described upper injector head is relative with the vertical delivery section of upper altitude location adhesive tape; The setting position that lower adhesive tape glues press mechanism makes the lower altitude location adhesive tape between lower applicator wheel and lower sticky pressure roller have vertical delivery section, and described lower injector head is relative with the vertical delivery section of lower altitude location adhesive tape.
The actuator of described upper and lower sticky pressure roller is same actuator, and described actuator drives upper and lower sticky pressure roller along contrary direction synchronous axial system by gear drive; Described device for automatically molding also comprises position adjusting mechanism, the horizontal mobile mechanism that described position adjusting mechanism comprises the mounting panel for installing described actuator and gear drive and drives mounting panel to move in the rotor shaft direction of upper and lower sticky pressure roller.
Another object of the present invention is to provide the automatic forming method of a kind of direct insertion LED of above-mentioned band altitude location.
The technical solution used in the present invention is: the automatic forming method of direct insertion LED of band altitude location is: by electric control system drive to lay respectively at directly over braid and immediately below upper, lower sticky pressure roller and braid conveying device synchronization action, the upper altitude location adhesive tape of the volume insulation be wound in upper applicator wheel to be glued by upper sticky pressure roller the pre-position in the front of the pin of each direct insertion LED body be pressed in braid according to the transporting velocity of braid conveying device, and by lower sticky pressure roller, the lower altitude location adhesive tape of the volume insulation be wound in lower applicator wheel is glued the pre-position at the back side of the pin of each direct insertion LED body be pressed in braid according to the transporting velocity of braid conveying device, wherein, electric control system controls injector by gaseous state adhesive spray to the bonding plane from the upper applicator wheel upwards upper altitude location adhesive tape of sticky pressure roller motion and from the bonding plane of the lower applicator wheel lower altitude location adhesive tape of sticky pressure roller motion downwards,
Described electric control system controls elevating mechanism and drives and thrust head and will arrive thrusting completing the upper and lower altitude location adhesive tape between bonding adjacent direct insertion LED body immediately below it, to form the direct insertion LED of band altitude location, wherein, what be adhered to two altitude location adhesive tape on the pin of described direct insertion LED is plane for the bottom surface contacted with pcb board, and the described bottom surface of two altitude location adhesive tape is in the same level vertical with pin.
Preferably, complete bonding direct insertion LED body arrive again by way of nice and warm machine described in thrust head place, in order to accelerate binding speed and to soften upper and lower altitude location adhesive tape, the ambient temperature that described nice and warm machine provides is lower than the melting temperature of upper and lower altitude location adhesive tape.
Preferably, described upper and lower altitude location bar is made of plastics.
Preferably, described gaseous state adhesive is the oxolane of gaseous state.
Beneficial effect of the present invention is: by direct insertion LED body (in the present invention, direct insertion LED body refers to the direct insertion LED without altitude location part of the prior art) pin on bonding altitude location adhesive tape, namely autopatching is completed by automatic insertion equipment, this kind of mode without the need to changing former braid mode, on element function also without impact.In addition, the limited bayonet that sticky pressure thrusts rear formation can effectively be guaranteed not affect later process, and, after in the pad hole direct insertion LED being plugged in pcb board, altitude location adhesive tape support is on the front of pcb board, and the part that pin is worn to the pcb board back side is converted into clubfoot with to be welded, like this, direct insertion LED is just clamped on pcb board by altitude location adhesive tape and clubfoot, this can ensure that the welding of tin stove is front and weld rear direct insertion LED and keep original height and angle, and the problem that luminous point departs from can not occur.
In addition, method of the present invention also has the following advantages: adjustable for height advantage, and minimum is direct insertion LED body or the height adding height locating glue bar, is up to the 23mm of applicable automatic insertion equipment; Altitude location adhesive tape can adopt extrusion way, facilitates the sticky pressure of machine automatization.
Accompanying drawing explanation
Fig. 1 shows the front view of processing method on the pin of direct insertion LED body after bonding upper and lower altitude location adhesive tape according to direct insertion LED of the present invention;
Fig. 2 shows the binding site relation between two pins of altitude location adhesive tape and direct insertion LED body.
Fig. 3 shows the front view of the device for automatically molding of direct insertion LED of the present invention;
Fig. 4 shows the end view of sticky pressure roller in Fig. 3.
Embodiment
Below in conjunction with accompanying drawing, the specific embodiment of the present invention is described further.
As illustrated in fig. 1 and 2, direct insertion LED of the present invention comprises direct insertion LED body 1 and is adhered to the altitude location adhesive tape of the insulation on two pins 11 of direct insertion LED body 1, the bottom surface of all altitude location adhesive tape is plane, and the bottom surface of all altitude location adhesive tape is all in the same level 13 vertical with pin.At this, as long as the link position of altitude location adhesive tape can make direct insertion LED body in the effect lower support of automatic insertion equipment on pcb board.In the present embodiment, the cross section of this altitude location adhesive tape is square.
In order to simplify moulding process, embodiment as shown in Figure 2 have employed two altitude location adhesive tape 21a, 22a, and altitude location adhesive tape 21a is connected with the front of two pins 11, and altitude location adhesive tape 22a is connected with the back side of two pins 11.
Above altitude location adhesive tape can be adhered to the material of pin 11 by the adhesive matched by plastics, rubber etc., wherein, plastics can be PP, PVC, ABS, PE, PC etc., and plastics are by being such as that the adhesive of oxolane carries out bonding.
The direct insertion LED of above band altitude location is processed into automatically by following device for automatically molding.
As shown in Figure 3, this device for automatically molding can comprise upper and lower adhesive tape and glue press mechanism, for the injector of spray adhesive, thrusts 9 and drive the elevating mechanism (not shown) thrusting head lifting, on this, adhesive tape is glued press mechanism and is comprised upper applicator wheel 6a for being wound around upper altitude location adhesive tape 21, what be installed on upper sticky pressure roller 3a directly over braid conveying device and drive upper sticky pressure roller 3a to rotate is such as the actuator of motor, wherein, the rotating shaft of upper sticky pressure roller 3a is orthogonal with the throughput direction P of braid conveying device, consistent with throughput direction P in the tangential direction of the minimum point of closing on braid conveying device to ensure upper sticky pressure roller 3a, the upper altitude location adhesive tape 21 that upper sticky pressure roller 3a transports for receiving upper applicator wheel 6a, and be pressed on the precalculated position in the front of the pin of the direct insertion LED body be transported to immediately below it by sticky for altitude location adhesive tape on this 21, can be pressed on pin 11 by reliably sticky for upper altitude location adhesive tape 21 to make upper sticky pressure roller 3a, as shown in Figure 4, sticky pressure roller 3 as pressure roller 3a sticky on this is formed with the top roll location notch 31 that width matches with the width of upper altitude location adhesive tape 21 on its excircle, the degree of depth of top roll location notch 31 is less than or equal to the thickness of altitude location adhesive tape 21, the adhesive surface exposed that such guarantee enters the upper altitude location adhesive tape 21 in top roll location notch 31 can contact with the front of the pin 11 of the direct insertion LED body in braid, in the present embodiment, the degree of depth of top roll location notch 31 is less than the thickness of altitude location adhesive tape 21, make a part for the upper altitude location adhesive tape 21 of spacing side plate 32 clamping of top roll location notch 31 both sides, can prevent spacing side plate 32 from contacting with pin 11 like this, it can be avoided the wearing and tearing of pin 11, also adhesive can be prevented to be spilled in the process of sticky pressure on the edge of spacing side plate 32.
This lower adhesive tape is glued press mechanism and is comprised lower applicator wheel 6b for being wound around lower altitude location adhesive tape 22, the actuator being installed on the lower sticky pressure roller 3b immediately below braid conveying device and driving lower sticky pressure roller 3b to rotate, for the ease of making upper and lower sticky pressure roller 3b synchronization action, same actuator can be adopted to drive upper and lower sticky pressure roller action by transmission mechanism simultaneously, the relative position relation that upper and lower adhesive tape as shown in Figure 3 glues each part of press mechanism requires the direction of rotation of upper and lower sticky pressure roller, therefore, above-mentioned transmission mechanism can adopt gear drive.In like manner, the rotating shaft of this lower sticky pressure roller 3b is orthogonal with throughput direction P, the lower altitude location adhesive tape 22 that lower sticky pressure roller 3b transports for receiving lower applicator wheel 6b, the lower roll location notch that the width that lower sticky pressure roller 3b is formed with width and lower altitude location adhesive tape 22 on its excircle matches, the degree of depth of lower roll location notch is less than or equal to the thickness of lower altitude location adhesive tape, touches with the back face of the pin 11 making the direct insertion LED body 1 in the adhesive surface exposed of the lower altitude location adhesive tape 22 entered in lower roll location notch and braid.In the present embodiment, upper and lower altitude location adhesive tape adopts the adhesive tape with same shape and size, and therefore, each part that upper and lower adhesive tape glues press mechanism can have identical physical dimension.
Injector comprise for by the compression pump 4 of fluid binder boil down to gaseous state adhesive and, lower injector head 41a, 41b, on, lower injector head 41a, 41b is connected by the outlet of pipeline with compression pump 4, the gaseous state adhesive spray that the installation site of upper injector head 41a makes injector head compressed pump 4 can be formed in upper applicator wheel 6a and on upper altitude location adhesive tape 21 between sticky pressure roller 3a adhesive surface (outer surface) on, the gaseous state adhesive spray that the installation site of lower injector head 41b makes lower injector head compressed pump 4 can be formed is on the adhesive surface (outer surface) of the lower altitude location adhesive tape 22 between lower applicator wheel 6b and lower sticky pressure roller 3b.In the embodiment shown in fig. 3, upper applicator wheel 6a and on upper altitude location adhesive tape 21 between sticky pressure roller 3a there is vertical delivery section, on this, injector head 4a is relative with its vertical delivery section, in like manner, lower altitude location adhesive tape 22 between lower applicator wheel 6b and lower sticky pressure roller 3b also has vertical delivery section, and this lower injector head 4b is relative with its vertical delivery section.In addition, the jet face of upper injector head 41a can be parallel with the adhesive surface of the upper altitude location adhesive tape 21 of position in contrast, even if the axis of upper injector head 41a is vertical with adhesive surface on the other side, in like manner, the jet face of lower injector head 41b can be parallel with the adhesive surface of the lower altitude location adhesive tape 22 of position in contrast, is so not only convenient to the accuracy installing but also can ensure eject position.
More than thrust the front that 9 are positioned at upper and lower sticky pressure roller in the conveying directionp, the upper and lower altitude location adhesive tape completing sticky pressure to be thrust between adjacent direct insertion LED body, form the direct insertion LED of each band altitude location as shown in Figure 2.
In addition, device for automatically molding of the present invention also comprises the actuator that driving drives upper and lower sticky pressure roller 3a, 3b to rotate respectively, the electric control system of compression pump 4 and elevating mechanism coordination.
For the ease of by upper, lower sticky pressure roller 3a, 3b is adjusted to can by upper, lower altitude location adhesive tape 21, 22 sticky are depressed on the precalculated position (it is corresponding with the height of direct insertion LED on pcb board after plug-in mounting of requirement) of pin, this device for automatically molding also can comprise for regulating simultaneously, lower sticky pressure roller 3a, the position adjusting mechanism of the position of 3b in the rotor shaft direction vertical with throughput direction P, this position adjusting mechanism can comprise for being installed, lower sticky pressure roller 3a, the horizontal mobile mechanism that the mounting panel of the actuator of 3b and drive mounting panel move in rotor shaft direction, in addition, in order to ensure the accuracy of the mounting panel direction of motion, can be this mounting panel and arrange a guide rail arranged along rotor shaft direction be slidably matched with it, this horizontal mobile mechanism can adopt screw nut driven secondary, synchronizing wheel and synchronous belt drive mechanism etc., for the latter by needing for mounting panel is configured for the drag chain of guiding.Alternatively, this device for automatically molding also comprises the upper and lower position adjusting mechanism for regulating upper and lower sticky pressure roller 3a, 3b position in the rotor shaft direction vertical with throughput direction P respectively, upper and lower position adjusting mechanism all can adopt bolt and nut transmission, and this bolt and nut transmission can be driven by motor also can Non-follow control.
As shown in Figure 3, in the present embodiment, upper adhesive tape is glued press mechanism and is also comprised at least one and be arranged at upper guide roller 5a between applicator wheel 6a and upper sticky pressure roller 3a, and in like manner, lower adhesive tape is glued press mechanism and also comprised at least one and be arranged at lower steering roll 5b between lower applicator wheel 6b and lower sticky pressure roller 3b.Upper and lower guide roller 5a, 5b, except raising positioning precision, also can play the effect in the conveying orientation changing the upper and lower altitude location adhesive tape 21,22 in conveying as required.
On accelerating, lower altitude location adhesive tape 21, binding speed between 22 and pin 11, this device for automatically molding also can upper, lower sticky pressure roller 3a, an a 3b and nice and warm machine 8 is set between thrusting 9, improve (implication of raising is namely higher than room temperature 25 degree) by nice and warm machine and complete the upper of sticky pressure, ambient temperature residing for lower altitude location adhesive tape, wherein, the ambient temperature that nice and warm machine provides is lower than upper, the melting temperature of lower altitude location adhesive tape, maximum temperature is selected usually about the half of melting temperature, on ensureing, bottom shape and the position of lower altitude location adhesive tape do not change substantially, at this, those skilled in the art can select concrete heating-up temperature according to the performance parameter of the material of the altitude location adhesive tape chosen.Should be understood that, upper and lower altitude location adhesive tape 21,22 can be made completely at room temperature or lower than under the condition of room temperature to bond, just the bonding time is longer, but does not affect enforcement and the final effect of automatic moulding.In addition, nice and warm machine 8 is set and also has and upper and lower altitude location adhesive tape 21,22 can be softened, be convenient to the effect thrust.
At this, as upper and lower altitude location adhesive tape 21,22 adopts PVC, then this heating-up temperature is not usually higher than 150 degree, and the heating-up temperature chosen in the present embodiment is 65 degree to 85 degree, as heating-up temperature being set as 80 degree.
The structure of an altitude location adhesive tape and the above a kind of device for automatically molding processing this kind of direct insertion LED provided respectively is pasted for the above front and back at pin, present invention also offers a kind of automatic forming method for this kind of direct insertion LED, be specially: by electric control system drive to lay respectively at directly over braid B and immediately below upper, lower sticky pressure roller 3a, 3b and braid conveying device synchronization action, altitude location adhesive tape 21 on the volume be wound on upper applicator wheel 6a to be glued by upper sticky pressure roller 3a the pre-position in the front of the pin 11 of each direct insertion LED body 1 be pressed on braid B according to the transporting velocity of braid conveying device, and by lower sticky pressure roller 3b, altitude location adhesive tape 22 under the volume be wound on lower applicator wheel 6b is glued the pre-position at 11 back sides of pin of each direct insertion LED body 1 be pressed on braid B according to the transporting velocity of braid conveying device, wherein, electric control system controls injector by gaseous state adhesive spray on upper applicator wheel the 6a upwards bonding plane of upper altitude location adhesive tape 21 that moves of sticky pressure roller 3a and from the lower applicator wheel 6b bonding plane of lower altitude location adhesive tape 22 that sticky pressure roller 3b moves downwards.
Meanwhile, electric control system controls elevating mechanism and drives and thrust 8 and will arrive thrusting, to form the direct insertion LED of each band altitude location as shown in Figure 2 completing the upper and lower altitude location adhesive tape between bonding adjacent direct insertion LED body immediately below it.
The foregoing is only the present invention's preferably execution mode, be not used for limiting practical range of the present invention, as long as the equivalence change done in protection scope of the present invention and modification, all should think and fall in protection scope of the present invention.
Claims (10)
1. a device for automatically molding of the direct insertion LED with altitude location, is characterized in that, comprises upper and lower adhesive tape and glues press mechanism, for the injector of spray adhesive, thrusts head and drives the elevating mechanism thrusting head lifting;
Described upper adhesive tape is glued press mechanism and is comprised upper applicator wheel for being wound around upper altitude location adhesive tape, the actuator being installed on the upper sticky pressure roller directly over braid conveying device and driving upper sticky pressure roller to rotate, wherein, the rotating shaft of upper sticky pressure roller is orthogonal with the throughput direction of braid conveying device, the upper altitude location adhesive tape that upper sticky pressure roller transports for receiving upper applicator wheel, described sticky pressure roller is formed with the top roll location notch that width matches with the width of upper altitude location adhesive tape on its excircle, the degree of depth of described top roll location notch is less than or equal to the thickness of altitude location adhesive tape, contact with the front of the pin of the direct insertion LED body in braid to make the adhesive surface exposed of upper altitude location adhesive tape entered in top roll location notch,
Described lower adhesive tape is glued press mechanism and is comprised lower applicator wheel for being wound around lower altitude location adhesive tape, the actuator being installed on the lower sticky pressure roller immediately below braid conveying device and driving lower sticky pressure roller to rotate, wherein, the rotating shaft of lower sticky pressure roller is orthogonal with the throughput direction of braid conveying device, the lower altitude location adhesive tape that lower sticky pressure roller transports for receiving lower applicator wheel, the lower roll location notch that the width that described lower sticky pressure roller is formed with width and lower altitude location adhesive tape on its excircle matches, the degree of depth of described lower roll location notch is less than or equal to the thickness of lower altitude location adhesive tape, touch with the back face of the pin making the direct insertion LED body in the adhesive surface exposed of the lower altitude location adhesive tape entered in lower roll location notch and braid,
Described injector comprise for by the compression pump of fluid binder boil down to gaseous state adhesive and, lower injector head, on described, lower injector head is connected with compression delivery side of pump by pipeline, the gaseous state adhesive spray that the installation site of described upper injector head makes injector head compressed pump can be formed in upper applicator wheel and on upper altitude location adhesive tape between sticky pressure roller adhesive surface on, the gaseous state adhesive spray that the installation site of lower injector head makes lower injector head compressed pump can be formed is on the adhesive surface of the lower altitude location adhesive tape between lower applicator wheel and lower sticky pressure roller,
Describedly thrust the front that head is positioned at upper and lower sticky pressure roller on the throughput direction of braid conveying device, the upper and lower altitude location adhesive tape completing sticky pressure is thrust between adjacent direct insertion LED body, form the direct insertion LED of band altitude location, wherein, what be adhered to two altitude location adhesive tape on the pin of described direct insertion LED is plane for the bottom surface contacted with pcb board, and the described bottom surface of two altitude location adhesive tape is in the same level vertical with pin; And,
Described device for automatically molding also comprises the actuator that driving drives upper and lower sticky pressure roller to rotate respectively, the electric control system of compression pump and elevating mechanism coordination.
2. device for automatically molding according to claim 1, it is characterized in that, described upper adhesive tape is glued press mechanism and is also comprised at least one and be arranged at upper guide roller between applicator wheel and upper sticky pressure roller, and described lower adhesive tape is glued press mechanism and also comprised at least one and be arranged at lower steering roll between lower applicator wheel and lower sticky pressure roller.
3. device for automatically molding according to claim 1, it is characterized in that, also comprise the nice and warm machine being arranged at upper and lower sticky pressure roller and thrusting between head, make braid to complete the bonding direct insertion LED body of upper and lower altitude location adhesive tape and thrust head place by way of nice and warm machine arrival.
4. device for automatically molding according to claim 1, is characterized in that, the degree of depth correspondence of described upper and lower roll location notch is less than the thickness of upper and lower altitude location adhesive tape.
5. device for automatically molding according to claim 1, is characterized in that, the jet face of described upper injector head with upper applicator wheel with on the adhesive surface of upper altitude location adhesive tape between sticky pressure roller parallel; The jet face of described lower injector head is parallel with the adhesive surface of the lower altitude location adhesive tape between lower applicator wheel with lower sticky pressure roller.
6. device for automatically molding according to claim 1 or 5, it is characterized in that, the setting position that upper adhesive tape glues press mechanism make upper applicator wheel and on upper altitude location adhesive tape between sticky pressure roller there is vertical delivery section, described upper injector head is relative with the vertical delivery section of upper altitude location adhesive tape; The setting position that lower adhesive tape glues press mechanism makes the lower altitude location adhesive tape between lower applicator wheel and lower sticky pressure roller have vertical delivery section, and described lower injector head is relative with the vertical delivery section of lower altitude location adhesive tape.
7. device for automatically molding according to any one of claim 1 to 5, is characterized in that, the actuator of described upper and lower sticky pressure roller is same actuator, and described actuator drives upper and lower sticky pressure roller along contrary direction synchronous axial system by gear drive; Described device for automatically molding also comprises position adjusting mechanism, the horizontal mobile mechanism that described position adjusting mechanism comprises the mounting panel for installing described actuator and gear drive and drives mounting panel to move in the rotor shaft direction of upper and lower sticky pressure roller.
8. the automatic forming method of the direct insertion LED with altitude location, it is characterized in that, by electric control system drive to lay respectively at directly over braid and immediately below upper, lower sticky pressure roller and braid conveying device synchronization action, the upper altitude location adhesive tape of the volume insulation be wound in upper applicator wheel to be glued by upper sticky pressure roller the pre-position in the front of the pin of each direct insertion LED body be pressed in braid according to the transporting velocity of braid conveying device, and by lower sticky pressure roller, the lower altitude location adhesive tape of the volume insulation be wound in lower applicator wheel is glued the pre-position at the back side of the pin of each direct insertion LED body be pressed in braid according to the transporting velocity of braid conveying device, wherein, electric control system controls injector by gaseous state adhesive spray to the bonding plane from the upper applicator wheel upwards upper altitude location adhesive tape of sticky pressure roller motion and from the bonding plane of the lower applicator wheel lower altitude location adhesive tape of sticky pressure roller motion downwards,
Described electric control system controls elevating mechanism and drives and thrust head and will arrive thrusting completing the upper and lower altitude location adhesive tape between bonding adjacent direct insertion LED body immediately below it, to form the direct insertion LED of band altitude location, wherein, what be adhered to two altitude location adhesive tape on the pin of described direct insertion LED is plane for the bottom surface contacted with pcb board, and the described bottom surface of two altitude location adhesive tape is in the same level vertical with pin.
9. automatic forming method according to claim 8, it is characterized in that: complete bonding direct insertion LED body arrive again by way of nice and warm machine described in thrust head place, in order to accelerate binding speed and to soften upper and lower altitude location adhesive tape, the ambient temperature that described nice and warm machine provides is lower than the melting temperature of upper and lower altitude location adhesive tape.
10. automatic forming method according to claim 8, is characterized in that: described upper and lower altitude location bar is made of plastics.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310183183.0A CN103280507B (en) | 2013-05-17 | 2013-05-17 | The device for automatically molding of the direct insertion LED with altitude location and method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310183183.0A CN103280507B (en) | 2013-05-17 | 2013-05-17 | The device for automatically molding of the direct insertion LED with altitude location and method |
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| CN103280507A CN103280507A (en) | 2013-09-04 |
| CN103280507B true CN103280507B (en) | 2015-09-09 |
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| CN113299815B (en) * | 2021-05-25 | 2022-05-31 | 深圳市奥蕾达科技有限公司 | LED lamp bead |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101471418A (en) * | 2006-12-27 | 2009-07-01 | 财团法人工业技术研究院 | Lead wire holder of LED |
| CN201349019Y (en) * | 2008-12-18 | 2009-11-18 | 珠海华冠光电技术有限公司 | LED support conveying device |
| CN201898150U (en) * | 2010-10-29 | 2011-07-13 | 中山市晶明光电科技有限公司 | Light emitting diode support |
| CN202695531U (en) * | 2012-06-18 | 2013-01-23 | 东莞市钜晶光电有限公司 | Small direct-inserting LED lamp bead |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008043264A1 (en) * | 2006-09-28 | 2008-04-17 | Industrial Technology Research Institute | Light-emitting component package, light-emitting component packaging apparatus, and light source device |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101471418A (en) * | 2006-12-27 | 2009-07-01 | 财团法人工业技术研究院 | Lead wire holder of LED |
| CN201349019Y (en) * | 2008-12-18 | 2009-11-18 | 珠海华冠光电技术有限公司 | LED support conveying device |
| CN201898150U (en) * | 2010-10-29 | 2011-07-13 | 中山市晶明光电科技有限公司 | Light emitting diode support |
| CN202695531U (en) * | 2012-06-18 | 2013-01-23 | 东莞市钜晶光电有限公司 | Small direct-inserting LED lamp bead |
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| CN103280507A (en) | 2013-09-04 |
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