CN203339211U - Direct insertion LED with height positioning and automatic forming device thereof - Google Patents

Direct insertion LED with height positioning and automatic forming device thereof Download PDF

Info

Publication number
CN203339211U
CN203339211U CN2013202699007U CN201320269900U CN203339211U CN 203339211 U CN203339211 U CN 203339211U CN 2013202699007 U CN2013202699007 U CN 2013202699007U CN 201320269900 U CN201320269900 U CN 201320269900U CN 203339211 U CN203339211 U CN 203339211U
Authority
CN
China
Prior art keywords
adhesive tape
pressure roller
altitude location
direct insertion
sticky
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2013202699007U
Other languages
Chinese (zh)
Inventor
夏运明
吴群生
吴勇坤
贺白云
莫经海
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dongguan Long Intelligent Electronic Technology Co Ltd
Original Assignee
Shenzhen Long Duo Electronic Science & Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Long Duo Electronic Science & Technology Co Ltd filed Critical Shenzhen Long Duo Electronic Science & Technology Co Ltd
Priority to CN2013202699007U priority Critical patent/CN203339211U/en
Application granted granted Critical
Publication of CN203339211U publication Critical patent/CN203339211U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Landscapes

  • Lining Or Joining Of Plastics Or The Like (AREA)

Abstract

The utility model discloses a direct insertion LED with height positioning and an automatic forming device thereof. The LED comprises a direct insertion LED body and insulated height positioning adhesive tapes fixedly connected with two pins of the LED. The bottom surface of all the height positioning adhesive tapes are flat surfaces, and are all in the same horizontal surface that is vertical to the pins. The automatic forming device comprises an upper adhesive tape pressing mechanism, a lower adhesive tape pressing mechanism, an ejector that is used for jetting an adhesive and a thrust head that is used for thursting an upper and a lower height positioning adhesive tapes disposed between the adhered adjacent direct insertion LED bodies, and a lifting mechanism that drives the thrust head to lift up and down. The height positioning adhesive tapes are adhered to the pins of the direct insertion LED bodies, so that automatic insertion can be achieved by an automatic insertion device. The method does not change the original braiding mode, and component performance is unaffected.

Description

Direct insertion LED and device for automatically molding thereof with altitude location
Technical field
The utility model belongs to electronic technology field, relate in particular to can be directly by automatic insertion equipment with the height plug-in mounting be scheduled to direct insertion (DIP) LED with altitude location in the pad hole of pcb board and the device for automatically molding of this kind of direct insertion LED.
Background technology
LED obtains general use in the electron trades such as household electrical appliance, automobile, Aero-Space, the consumer goods, medical treatment, industrial automation equipment and instrument, industry use various direct insertion LED be all by the product structure requirement for height on the pin of LED by hand operating type add after wearing suitable LED support and be plugged in the pad hole of PCB by handwork again, along with cost of labor increase and automatic insertion equipment are popularized, manual work mode has restricted production efficiency and the product quality of electronic circuit board.
Existing automatic insertion equipment can complete the action will directly be inserted into through direct insertion LED in the pad hole of PCB, but there is no the altitude location part on the pin due to direct insertion LED, therefore, automatic insertion equipment can only be inserted into the end by direct insertion LED, is inserted into the position of being close to pcb board at the bottom of the resin that makes direct insertion LED; If being inserted into the end of to, direct insertion LED can produce following problem: the one, and diameter is less than the direct insertion LED of 5mm because the potting resin reason is easily pulled encapsulation, causes quality hidden danger; The 2nd, while welding with crest tin stove, easy Yin Gaowen damages direct insertion LED, is embodied in especially while adopting lead-free solder (being generally 260 ℃ ± 5 ℃ without slicker solder stove welding temperature); The 3rd, the requirement of product structure height can't be met, but the design height of complete machine erecting of panel PCBA part will be determined by the packaging height of direct insertion LED, this has just improved the requirement to the product casing design.
At present, the industry usually following two kinds of modes of sampling realizes by automatic insertion equipment, direct insertion LED being plugged in automatically by the requirement for height of product structure in the pad hole of PCB, the one, the pin of direct insertion LED is made to " K " point needed with equipment and (be commonly called as: be inserted in the pad hole of PCB with automatic insertion equipment again frog leg), there is certain application limitation in this kind of locate mode, this is embodied in: the height of LED bottom legs must be more than or equal to 3mm, otherwise beat " K " point equipment stress easily the drawing crack of LED bulk resin is caused to quality hidden danger; When the height of LED bottom legs is more than or equal to after 6mm with automatic insertion equipment, because automatic insertion equipment is generally to catch component pin with claw, after using again the pad hole of illumination equipment Alignment pcb board, from element top stress application, component pin is thrown into to the pad hole of pcb board, LED pin and pcb board just only depend on the strong point on " K " some two sides, at this moment the stress that LED bulk resin weight and automatic insertion equipment apply just easily causes the LED luminous point to depart from, and affects installation and the visual effect of PCBA.The 2nd, by direct insertion LED, by different packaging height for the product structure requirement for height, the defect that this kind of mode exists is: the material special use, and the LED cost of manufacture is high; Buying, storage difficulty, be not suitable for the multi-model small lot batch manufacture.
The utility model content
A purpose of the present utility model provides the direct insertion LED with altitude location in a kind of pad hole that can its requirement for height by product structure be plugged in automatically by automatic insertion equipment to PCB.
The technical solution adopted in the utility model is: a kind of direct insertion LED with altitude location, comprise direct insertion LED body and be adhered to the altitude location adhesive tape of the insulation on two pins of direct insertion LED body, the bottom surface for contacting with pcb board of all altitude location adhesive tape is plane, and the described bottom surface of all altitude location adhesive tape is all on the same level vertical with pin.
Preferably, described altitude location adhesive tape is adhered to the front and back of pin.
Preferably, described direct insertion LED has two altitude location adhesive tape, and on the front that wherein is adhered to two pins, another is adhered on the back side of two pins.The direct insertion LED of this kind of structure is easier to by automatically gluing and be installed with for automatically being sticky molding.
Preferably, described altitude location adhesive tape adopts ambroin to make.
Preferably, described altitude location adhesive tape is adhered on described pin by oxolane.
Another purpose of the present utility model is to provide a kind of device for automatically molding of processing the above-mentioned direct insertion LED with altitude location.
The technical scheme of the utility model sampling is: a kind of device for automatically molding of processing the above-mentioned direct insertion LED with altitude location, comprise that upper and lower adhesive tape glues press mechanism, for the injector of spray adhesive, for the head that thrusts that will thrust in the upper and lower altitude location adhesive tape completed between bonding adjacent direct insertion LED body, with drive, thrust the elevating mechanism of a lifting;
The sticky press mechanism of described upper adhesive tape comprises for being wound around the upper applicator wheel of upper altitude location adhesive tape, be installed on the braid conveying device directly over for receiving the upper sticky pressure roller of the upper altitude location adhesive tape that upper applicator wheel transports, and the actuator of the upper sticky pressure roller rotation of drive, wherein, the rotating shaft of upper sticky pressure roller and the throughput direction quadrature of braid conveying device, described sticky pressure roller is formed with the top roll location notch that the width of width and upper altitude location adhesive tape is complementary on its excircle, and the degree of depth of described top roll location notch is less than or equal to the thickness of altitude location adhesive tape;
The sticky press mechanism of described lower adhesive tape comprises for being wound around the lower applicator wheel of lower altitude location adhesive tape, be installed on the braid conveying device under for receiving the lower sticky pressure roller of the lower altitude location adhesive tape that lower applicator wheel transports, and the actuator that under driving, sticky pressure roller rotates, wherein, the rotating shaft of lower sticky pressure roller and the throughput direction quadrature of braid conveying device, the lower roll location notch that the width that described lower sticky pressure roller is formed with width and lower altitude location adhesive tape on its excircle is complementary, the degree of depth of described lower roll location notch is less than or equal to the thickness of lower altitude location adhesive tape;
Described injector comprise for the compression pump by fluid binder boil down to gaseous state adhesive and, lower injector head, on described, lower injector head is connected with the compression delivery side of pump by pipeline, the gaseous state adhesive spray that the installation site of described upper injector head makes injector head compressed pump can be formed in upper applicator wheel with on glue on the adhesive surface of the upper altitude location adhesive tape between pressure roller, the gaseous state adhesive spray that the installation site of lower injector head makes lower injector head compressed pump can be formed is on the adhesive surface of the lower altitude location adhesive tape between lower applicator wheel and lower sticky pressure roller,
The described head that thrusts is positioned at the place ahead of upper and lower sticky pressure roller on the throughput direction of braid conveying device; And,
Described device for automatically molding also comprises that driving drives respectively the actuator that upper and lower sticky pressure roller rotates, the electric control system of compression pump and elevating mechanism coordination.
Preferably, the sticky press mechanism of described upper adhesive tape also comprises that at least one is arranged at the upper guide roller between applicator wheel and upper sticky pressure roller, and the sticky press mechanism of described lower adhesive tape also comprises that at least one is arranged at the lower steering roll between lower applicator wheel and lower sticky pressure roller.
Preferably, described device for automatically molding also comprises and is arranged at upper and lower sticky pressure roller and thrusts the nice and warm machine between head.
Preferably, the jet face of described upper injector head with upper applicator wheel with on the adhesive surface of upper altitude location adhesive tape between sticky pressure roller parallel; The jet face of described lower injector head is parallel with the adhesive surface of lower altitude location adhesive tape between lower applicator wheel and lower sticky pressure roller.
Preferably, the actuator of described upper and lower sticky pressure roller is same actuator, and described actuator drives upper and lower sticky pressure roller by gear drive and synchronously rotates along contrary direction; Described device for automatically molding also can comprise position adjusting mechanism, and described position adjusting mechanism comprises the mounting panel for described actuator and gear drive are installed and drives the horizontal mobile mechanism that mounting panel moves on the rotor shaft direction of upper and lower sticky pressure roller.
The beneficial effects of the utility model are: by direct insertion LED body (in the utility model, direct insertion LED body refers to the direct insertion LED that does not have the altitude location part of the prior art) pin on bonding altitude location adhesive tape, can complete autopatching by automatic insertion equipment, this kind of mode be without changing former braid mode, on element function also without affecting.In addition, sticky pressure thrusts the limited bayonet of rear formation can effectively guarantee not affect later process, and, after in the pad hole that direct insertion LED is plugged in to pcb board, the altitude location adhesive tape support is on the front of pcb board, and pin is worn to the part at the pcb board back side and is converted into clubfoot with to be welded, like this, direct insertion LED just is clamped on pcb board by altitude location adhesive tape and clubfoot, this can guarantee that the front rear direct insertion LED of welding that reaches of tin stove welding keeps original height and angle, the problem that luminous point departs from can not occur.
In addition, method of the present utility model also has the following advantages: adjustable for height advantage, and minimum is direct insertion LED body or the height that adds height locating glue bar, is up to the 23mm that is applicable to automatic insertion equipment; The altitude location adhesive tape can adopt extrusion way, facilitates the sticky pressure of machine automatization.
The accompanying drawing explanation
Fig. 1 shows the processing method front view after bonding upper and lower altitude location adhesive tape on the pin of direct insertion LED body according to direct insertion LED described in the utility model;
Fig. 2 shows the binding site relation between two pins of altitude location adhesive tape and direct insertion LED body.
Fig. 3 shows the front view of the device for automatically molding of direct insertion LED of the present utility model;
Fig. 4 shows the end view of sticky pressure roller in Fig. 3.
Embodiment
Below in conjunction with accompanying drawing, embodiment of the present utility model is described further.
As illustrated in fig. 1 and 2, direct insertion LED of the present utility model comprises direct insertion LED body 1 and is adhered to the altitude location adhesive tape of the insulation on two pins 11 of direct insertion LED body 1, the bottom surface of all altitude location adhesive tape is plane, and the bottom surface of all altitude location adhesive tape is all on the same level vertical with pin 13.At this, if the link position of altitude location adhesive tape can make direct insertion LED body in the effect lower support of automatic insertion equipment on pcb board.In the present embodiment, the cross section of this altitude location adhesive tape is square.
In order to simplify moulding process, embodiment has as shown in Figure 2 adopted two altitude location adhesive tape 21a, 22a, and altitude location adhesive tape 21a is connected with the front of two pins 11, and altitude location adhesive tape 22a is connected with the back side of two pins 11.
Above altitude location adhesive tape can be by the polymer adhesive that is complementary in the material of pin 11 by plastics, rubber etc., and wherein, plastics can be PP, PVC, ABS, PE, PC etc., and plastics can be by being for example that the adhesive of oxolane carries out bonding.
The above direct insertion LED with altitude location can be processed into automatically by following device for automatically molding.:
As shown in Figure 3, this device for automatically molding can comprise that upper and lower adhesive tape glues press mechanism, for the injector of spray adhesive, thrusts 9 and drive the elevating mechanism (not shown) that thrusts a lifting, should comprise for being wound around the upper applicator wheel 6a of upper altitude location adhesive tape 21 by the sticky press mechanism of upper adhesive tape, be installed on the braid conveying device directly over upper sticky pressure roller 3a and what drive that sticky pressure roller 3a rotates is for example the actuator of motor, wherein, the rotating shaft of upper sticky pressure roller 3a and the throughput direction P quadrature of braid conveying device, consistent with throughput direction P in the tangential direction of the minimum point of closing on the braid conveying device to guarantee upper sticky pressure roller 3a, upper sticky pressure roller 3a is for receiving the upper altitude location adhesive tape 21 that applicator wheel 6a transports, and will go up on the precalculated position in the sticky front that is pressed on the pin that is transported to the direct insertion LED body under it of altitude location adhesive tape 21, in order to make upper sticky pressure roller 3a upper altitude location adhesive tape 21 can be glued and be pressed on pin 11 reliably, as shown in Figure 4, be formed with as the sticky pressure roller 3 of sticky pressure roller 3a on this top roll location notch 31 that the width of width and upper altitude location adhesive tape 21 is complementary on its excircle, the degree of depth of top roll location notch 31 is less than or equal to the thickness of altitude location adhesive tape 21, the adhesive surface exposed that guarantee enters the upper altitude location adhesive tape 21 in top roll location notch 31 like this can contact with the front of the pin 11 of direct insertion LED body in braid, in the present embodiment, the degree of depth of top roll location notch 31 is less than the thickness of altitude location adhesive tape 21, make the part of altitude location adhesive tape 21 in 32 clampings of spacing side plate of top roll location notch 31 both sides, can prevent that so spacing side plate 32 from contacting with pin 11, can avoid its wearing and tearing to pin 11, also can prevent that adhesive is spilled on the edge of spacing side plate 32 in sticky process of pressing.
This time the sticky press mechanism of adhesive tape comprises for being wound around the lower applicator wheel 6b of lower altitude location adhesive tape 22, be installed on the braid conveying device under lower sticky pressure roller 3b and drive the actuator that lower sticky pressure roller 3b rotates, for the ease of making upper and lower sticky pressure roller 3b synchronization action, can adopt same actuator to drive upper and lower sticky pressure roller action by transmission mechanism simultaneously, the relative position relation of each part of the sticky press mechanism of upper and lower adhesive tape as shown in Figure 3 requires the direction of rotation of upper and lower sticky pressure roller, therefore, above-mentioned transmission mechanism can adopt gear drive.In like manner, the rotating shaft of this time sticky pressure roller 3b and throughput direction P quadrature, lower sticky pressure roller 3b is for receiving the lower altitude location adhesive tape 22 that lower applicator wheel 6b transports, the lower roll location notch that the width that lower sticky pressure roller 3b is formed with width and lower altitude location adhesive tape 22 on its excircle is complementary, the degree of depth of lower roll location notch is less than or equal to the thickness of lower altitude location adhesive tape, so that enter the adhesive surface exposed of the lower altitude location adhesive tape 22 in the lower roll location notch, with the back side of the pin 11 of direct insertion LED body 1 in braid, contacts.In the present embodiment, upper and lower altitude location adhesive tape adopts has identical shaped and adhesive tape size, and therefore, each part of the sticky press mechanism of upper and lower adhesive tape can have identical physical dimension.
Injector comprise for the compression pump 4 by fluid binder boil down to gaseous state adhesive and, lower injector head 41a, 41b, on, lower injector head 41a, 41b is connected with the outlet of compression pump 4 by pipeline, the gaseous state adhesive spray that the installation site of upper injector head 41a makes injector head compressed pump 4 can be formed in upper applicator wheel 6a with on glue on the adhesive surface (outer surface) of the upper altitude location adhesive tape 21 between pressure roller 3a, the gaseous state adhesive spray that the installation site of lower injector head 41b makes lower injector head compressed pump 4 can be formed is on the adhesive surface (outer surface) of the lower altitude location adhesive tape 22 between lower applicator wheel 6b and lower sticky pressure roller 3b.In the embodiment shown in fig. 3, upper applicator wheel 6a and on upper altitude location adhesive tape 21 between sticky pressure roller 3a there is vertical delivery section, above injector head 4a is relative with its vertical delivery section, in like manner, lower altitude location adhesive tape 22 between lower applicator wheel 6b and lower sticky pressure roller 3b also has vertical delivery section, and this time injector head 4b is relative with its vertical delivery section.In addition, the jet face of upper injector head 41a can be parallel with the adhesive surface of upper altitude location adhesive tape 21 of position in contrast, even the axis of upper injector head 41a is vertical with adhesive surface on the other side, in like manner, the jet face of lower injector head 41b can be parallel with the adhesive surface of lower altitude location adhesive tape 22 of position in contrast, so is convenient to installation and can guarantees the accuracy of eject position again.
More than thrust 9 and be positioned at the place ahead of upper and lower sticky pressure roller on throughput direction P, thrust will complete sticky upper and lower altitude location adhesive tape of pressing between adjacent direct insertion LED body, form as shown in Figure 2 respectively with the direct insertion LED of altitude location.
In addition, device for automatically molding of the present utility model also comprises that driving drives respectively the actuator that upper and lower sticky pressure roller 3a, 3b rotate, the electric control system of compression pump 4 and elevating mechanism coordination.
For the ease of by upper, lower sticky pressure roller 3a, 3b is adjusted to can be by upper, lower altitude location adhesive tape 21, 22 glue on the precalculated position (it is corresponding with the direct insertion LED height after plug-in mounting on pcb board required) that is depressed into pin, this device for automatically molding also can comprise for regulate simultaneously, lower sticky pressure roller 3a, the position adjusting mechanism of the position of 3b on the rotor shaft direction vertical with throughput direction P, this position adjusting mechanism can comprise for installing, lower sticky pressure roller 3a, the horizontal mobile mechanism that the mounting panel of the actuator of 3b and drive mounting panel move on rotor shaft direction, this horizontal mobile mechanism can adopt the screw nut driven pair, synchronizing wheel and synchronous belt drive mechanism etc., for the latter by being configured for for mounting panel the drag chain of guiding.
As shown in Figure 3, in the present embodiment, the sticky press mechanism of upper adhesive tape also comprises that at least one is arranged at the upper guide roller 5a between applicator wheel 6a and upper sticky pressure roller 3a, and in like manner, the sticky press mechanism of lower adhesive tape also comprises that at least one is arranged at the lower steering roll 5b between lower applicator wheel 6b and lower sticky pressure roller 3b.Upper and lower guide roller 5a, 5b, except improving positioning precision, also can play the effect that changes as required the conveying orientation of the upper and lower altitude location adhesive tape 21,22 in carrying.
On accelerating, lower altitude location adhesive tape 21, 22 and the binding speed of 11 of pins, this device for automatically molding also can be upper, lower sticky pressure roller 3a, 3b and thrust 9 between a nice and warm machine 8 is set, improve (implication of raising is higher than room temperature 25 degree) by nice and warm machine and complete sticky press upper, the residing ambient temperature of lower altitude location adhesive tape, wherein, the ambient temperature that nice and warm machine provides is lower than upper, the melting temperature of lower altitude location adhesive tape, maximum temperature is chosen in half left and right of melting temperature usually, on guaranteeing, bottom shape and the position of lower altitude location adhesive tape do not change substantially, at this, those skilled in the art can select concrete heating-up temperature according to the performance parameter of the material of the altitude location adhesive tape of choosing.Should be understood that, can make upper and lower altitude location adhesive tape 21,22 fully at room temperature or bonding lower than carrying out under the condition of room temperature, be the bonding time long, but do not affect enforcement and the final effect of automatic moulding.In addition, nice and warm machine 8 being set also has and upper and lower altitude location adhesive tape 21,22 can be softened, the effect of being convenient to thrust.
At this, as upper and lower altitude location adhesive tape 21,22 adopts PVC, this heating-up temperature is not usually higher than 150 degree, and the heating-up temperature of choosing in the present embodiment is 65 degree to 85 degree, as heating-up temperature is set as to 80 degree.
Structure and the above a kind of device for automatically molding of processing this kind of direct insertion LED provided of an altitude location adhesive tape respectively are provided for the above front and back at pin, the utility model also provides a kind of automatic forming method for this kind of direct insertion LED, be specially: by electric control system drive lay respectively at directly over braid B and under upper, lower sticky pressure roller 3a, 3b and braid conveying device synchronization action, glue the pre-position in the front of the pin 11 that is pressed on each the direct insertion LED body 1 on braid B according to the transporting velocity of braid conveying device will be wound in altitude location adhesive tape 21 on the volume on upper applicator wheel 6a by upper sticky pressure roller 3a, and will be wound in the pre-position according to 11 back sides of the sticky pin that is pressed on each the direct insertion LED body 1 on braid B of the transporting velocity of braid conveying device of altitude location adhesive tape 22 under the volume on lower applicator wheel 6b by lower sticky pressure roller 3b, wherein, electric control system control injector by the gaseous state adhesive spray to from the upwards sticky pressure roller 3a motion of applicator wheel 6a upper altitude location adhesive tape 21 bonding plane and from applicator wheel 6b downwards on the bonding plane of the lower altitude location adhesive tape 22 of sticky pressure roller 3b motion.
Simultaneously, electric control system is controlled elevating mechanism and is driven and thrust the 8 upper and lower altitude location adhesive tape completing between bonding adjacent direct insertion LED body that will arrive under it and thrust, with formation as shown in Figure 2 respectively with the direct insertion LED of altitude location.
The foregoing is only preferably execution mode of the utility model, not be used for limiting practical range of the present utility model, the equivalence of in every case doing in protection range of the present utility model changes and modifies, and all should think and fall in protection range of the present utility model.

Claims (10)

1. the direct insertion LED with altitude location, it is characterized in that, comprise direct insertion LED body and be adhered to the altitude location adhesive tape of the insulation on two pins of direct insertion LED body, the bottom surface for contacting with pcb board of all altitude location adhesive tape is plane, and the described bottom surface of all altitude location adhesive tape is all on the same level vertical with pin.
2. direct insertion LED according to claim 1, is characterized in that, described altitude location adhesive tape is adhered to the front and back of pin.
3. direct insertion LED according to claim 2, is characterized in that, described direct insertion LED has two altitude location adhesive tape, and on the front that wherein is adhered to two pins, another is adhered on the back side of two pins.
4. direct insertion LED according to claim 3, is characterized in that, described altitude location adhesive tape adopts ambroin to make.
5. direct insertion LED according to claim 4, is characterized in that, described altitude location adhesive tape is adhered on described pin by oxolane.
6. the device for automatically molding of direct insertion LED according to claim 3, it is characterized in that, comprise that upper and lower adhesive tape glues press mechanism, for the injector of spray adhesive, for the head that thrusts that will thrust in the upper and lower altitude location adhesive tape completed between bonding adjacent direct insertion LED body, with drive, thrust the elevating mechanism of a lifting;
The sticky press mechanism of described upper adhesive tape comprises for being wound around the upper applicator wheel of upper altitude location adhesive tape, be installed on the braid conveying device directly over for receiving the upper sticky pressure roller of the upper altitude location adhesive tape that upper applicator wheel transports, and the actuator of the upper sticky pressure roller rotation of drive, wherein, the rotating shaft of upper sticky pressure roller and the throughput direction quadrature of braid conveying device, described sticky pressure roller is formed with the top roll location notch that the width of width and upper altitude location adhesive tape is complementary on its excircle, and the degree of depth of described top roll location notch is less than or equal to the thickness of altitude location adhesive tape;
The sticky press mechanism of described lower adhesive tape comprises for being wound around the lower applicator wheel of lower altitude location adhesive tape, be installed on the braid conveying device under for receiving the lower sticky pressure roller of the lower altitude location adhesive tape that lower applicator wheel transports, and the actuator that under driving, sticky pressure roller rotates, wherein, the rotating shaft of lower sticky pressure roller and the throughput direction quadrature of braid conveying device, the lower roll location notch that the width that described lower sticky pressure roller is formed with width and lower altitude location adhesive tape on its excircle is complementary, the degree of depth of described lower roll location notch is less than or equal to the thickness of lower altitude location adhesive tape;
Described injector comprise for the compression pump by fluid binder boil down to gaseous state adhesive and, lower injector head, on described, lower injector head is connected with the compression delivery side of pump by pipeline, the gaseous state adhesive spray that the installation site of described upper injector head makes injector head compressed pump can be formed in upper applicator wheel with on glue on the adhesive surface of the upper altitude location adhesive tape between pressure roller, the gaseous state adhesive spray that the installation site of lower injector head makes lower injector head compressed pump can be formed is on the adhesive surface of the lower altitude location adhesive tape between lower applicator wheel and lower sticky pressure roller,
The described head that thrusts is positioned at the place ahead of upper and lower sticky pressure roller on the throughput direction of braid conveying device; And,
Described device for automatically molding also comprises that driving drives respectively the actuator that upper and lower sticky pressure roller rotates, the electric control system of compression pump and elevating mechanism coordination.
7. device for automatically molding according to claim 6, it is characterized in that, the sticky press mechanism of described upper adhesive tape also comprises that at least one is arranged at the upper guide roller between applicator wheel and upper sticky pressure roller, and the sticky press mechanism of described lower adhesive tape also comprises that at least one is arranged at the lower steering roll between lower applicator wheel and lower sticky pressure roller.
8. device for automatically molding according to claim 6, is characterized in that, also comprises and be arranged at upper and lower sticky pressure roller and thrust the nice and warm machine between head.
9. device for automatically molding according to claim 6, is characterized in that, the jet face of described upper injector head with upper applicator wheel with on the adhesive surface of upper altitude location adhesive tape between sticky pressure roller parallel; The jet face of described lower injector head is parallel with the adhesive surface of lower altitude location adhesive tape between lower applicator wheel and lower sticky pressure roller.
10. according to the described device for automatically molding of any one in claim 6 to 9, it is characterized in that, the actuator of described upper and lower sticky pressure roller is same actuator, and described actuator drives upper and lower sticky pressure roller by gear drive and synchronously rotates along contrary direction; Described device for automatically molding also comprises position adjusting mechanism, and described position adjusting mechanism comprises the mounting panel for described actuator and gear drive are installed and drives the horizontal mobile mechanism that mounting panel moves on the rotor shaft direction of upper and lower sticky pressure roller.
CN2013202699007U 2013-05-17 2013-05-17 Direct insertion LED with height positioning and automatic forming device thereof Expired - Fee Related CN203339211U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2013202699007U CN203339211U (en) 2013-05-17 2013-05-17 Direct insertion LED with height positioning and automatic forming device thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2013202699007U CN203339211U (en) 2013-05-17 2013-05-17 Direct insertion LED with height positioning and automatic forming device thereof

Publications (1)

Publication Number Publication Date
CN203339211U true CN203339211U (en) 2013-12-11

Family

ID=49707871

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2013202699007U Expired - Fee Related CN203339211U (en) 2013-05-17 2013-05-17 Direct insertion LED with height positioning and automatic forming device thereof

Country Status (1)

Country Link
CN (1) CN203339211U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103762295A (en) * 2014-01-21 2014-04-30 韩刚 Method for packaging signal receiving and sending diode
CN106211735A (en) * 2016-08-25 2016-12-07 深圳振华富电子有限公司 Electronic component rubberizing positioning fixture and sticking method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103762295A (en) * 2014-01-21 2014-04-30 韩刚 Method for packaging signal receiving and sending diode
CN103762295B (en) * 2014-01-21 2016-06-01 韩刚 The method for packing of a kind of signal transmitting and receiving diode
CN106211735A (en) * 2016-08-25 2016-12-07 深圳振华富电子有限公司 Electronic component rubberizing positioning fixture and sticking method
CN106211735B (en) * 2016-08-25 2022-08-19 深圳振华富电子有限公司 Electronic component rubberizing positioning fixture and rubberizing method

Similar Documents

Publication Publication Date Title
CN203982026U (en) LCM module assembly machine pastes ACF film device
CN203339211U (en) Direct insertion LED with height positioning and automatic forming device thereof
CN204182527U (en) A kind of PCB point glue equipment
CN203936944U (en) A kind of circuit board cutter sweep of tape guide
CN204196357U (en) The full-automatic mounting device of a kind of packing box magnetic clasp
CN203982029U (en) Intelligence LCM module assembly machine
CN107716215B (en) Capacitor body gluing method based on capacitor body gluing equipment
CN203934121U (en) The die-cut coiled strip reinforcement of two platform flexible circuit board machine
CN104669685A (en) Handle manufacturing machine
CN104202908A (en) FPC (Flexible Printed Circuit) reinforcing sheet pasting head device
CN103280507B (en) The device for automatically molding of the direct insertion LED with altitude location and method
CN105501561A (en) Tableware pasting device
CN204498473U (en) A kind of reinforcement steel disc pastes head group part
CN207954827U (en) A kind of corrugated board corner protector cuts gluing all-in-one machine
CN203368944U (en) Automatic adhesive tape coating device of PCB plates
CN202702791U (en) Wet method sticking film machine
CN203982032U (en) LCM module assembly machine ACF film pay-off
CN102832527B (en) Automatic assembling machine for outer covers of connectors
CN204505937U (en) Packing box four sides press
CN209599974U (en) A kind of automatic mounting lining machine
CN203765256U (en) Conveying mechanism
CN202652713U (en) Printed circuit board connecting finger high temperature protective tape pasting device
CN204975675U (en) A ultrasonic welding machine for welding keyboard flexible circuit board
CN204793575U (en) Device is guaranteed to car connector stitch position degree
CN202527331U (en) Plastic film dispensing equipment

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20151022

Address after: 6-7 building, building A, No. 1, Shahu Road, Tangxia Town, Dongguan, Guangdong, 523710

Patentee after: Dongguan long Intelligent Electronic Technology Co., Ltd.

Address before: 518000, building six, 1-4 new industrial zone, crane Chau, West Village, Baoan District, Shenzhen, Guangdong

Patentee before: Shenzhen Long Duo Electronic Science & Technology Co., Ltd.

CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20131211

Termination date: 20210517

CF01 Termination of patent right due to non-payment of annual fee