CN106211735B - Electronic component rubberizing positioning fixture and rubberizing method - Google Patents
Electronic component rubberizing positioning fixture and rubberizing method Download PDFInfo
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- CN106211735B CN106211735B CN201610726617.0A CN201610726617A CN106211735B CN 106211735 B CN106211735 B CN 106211735B CN 201610726617 A CN201610726617 A CN 201610726617A CN 106211735 B CN106211735 B CN 106211735B
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- rubberizing
- electronic component
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0015—Orientation; Alignment; Positioning
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0092—Treatment of the terminal leads as a separate operation
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention relates to an electronic component rubberizing positioning fixture and a rubberizing method. Electronic component rubberizing positioning fixture includes: the bottom plate is provided with at least two first grooves; and the positioning plate is provided with a second groove which corresponds to the first groove in position and is used for matching and clamping the electronic element body. When the electronic component rubberizing positioning fixture is used, the adhesive tape can be quickly and accurately pasted on the pins along the edge of the positioning plate, the operation is convenient, the rubberizing is neat, the rubberizing time is shortened, the cost is saved, the batch rubberizing is easy to realize, and the paint spraying appearance qualified rate of a product which is subjected to rubberizing by using the electronic component rubberizing positioning fixture can reach more than 98%.
Description
Technical Field
The invention relates to the field of electronic components, in particular to an electronic component rubberizing positioning fixture and a rubberizing method.
Background
Generally, an electronic component such as an integrally molded inductor includes an electronic component body and a lead, and the electronic component is usually required to be painted for surface rust prevention. In the process of painting, a colored adhesive tape is generally pasted on the pins in advance to protect the pins from painting. The existing operation mode adopts the steps of manually and directly sticking an adhesive tape on a pin, and then performing subsequent related process flows such as paint spraying, baking, cooling and the like. However, the electronic element has a small volume and is not easy to control by hand, so that the tape is not high in stability, low in speed, easy to re-stick and the like, and finally, the electronic element is low in working efficiency, high in cost and poor in product appearance.
Disclosure of Invention
Therefore, it is necessary to provide a positioning fixture for gluing an electronic component, which is simple and convenient in gluing and high in accuracy, aiming at the problems of low speed and low accuracy in bare-handed gluing of the electronic component.
The specific technical scheme is as follows:
an electronic component rubberizing positioning fixture for clamping an electronic component comprising an electronic component body and pins, comprising:
the bottom plate is provided with at least two first grooves;
and the positioning plate is provided with a second groove which corresponds to the first groove in position and is used for matching and clamping the electronic element body.
In one embodiment, the number of the second grooves is equal to the number of the first grooves.
In one embodiment, the electronic component fixing device further comprises an auxiliary positioning piece, and fixing positions corresponding to the number and positions of the first grooves and used for fixing the electronic component are arranged on the auxiliary positioning piece.
In one embodiment, the bottom plate is further provided with a positioning column, and the positioning plate is provided with a positioning hole corresponding to the positioning column.
In one embodiment, the first grooves are arranged along a straight line.
In one embodiment, the first grooves are arranged in a rectangular array.
In one embodiment, the edges of the second groove are chamfered.
In one embodiment, the electronic component rubberizing positioning fixture is made of synthetic stone.
Another object of the present invention is to provide a method for attaching a paste to an electronic component including an electronic component body and a lead.
A rubberizing method for an electronic component including an electronic component body and a pin, comprising the steps of:
providing a bottom plate with a first groove and a positioning plate with a second groove;
placing the electronic component in the first recess;
pressing the second groove on the first groove to clamp the electronic element body;
and sticking adhesive tapes on the pins outside the bottom plate and the second groove.
In one embodiment, before the electronic components are placed in the first grooves, the electronic components are connected into a whole side by side, and after the pins are pasted with adhesive tapes, painting, baking, cooling and separation are carried out.
The invention has the following beneficial effects:
when the electronic component rubberizing positioning fixture is used, a plurality of electronic components can be fixed on corresponding fixing positions of the auxiliary positioning piece, the electronic components are quickly and conveniently placed in the first grooves of the bottom plate through the auxiliary positioning piece, then the second grooves of the positioning plate are quickly and accurately matched with the first grooves to clamp the electronic component body through the matching of the positioning columns and the positioning holes, the pins are located outside the first grooves and the positioning plate, the adhesive tape can be quickly and accurately rubberized on the pins along the edges of the positioning plate, the operation is convenient, the rubberizing is neat, the rubberizing time is shortened, the cost is saved, and batch rubberizing is easy to realize.
Drawings
FIG. 1 is a schematic structural view of an electronic component taping positioning fixture according to an embodiment;
FIG. 2 is a schematic view of a bottom plate of an electronic component taping positioning fixture according to an embodiment;
FIG. 3 is a top view of a base plate of an exemplary embodiment of an electronic component taping positioning fixture;
FIG. 4 is a schematic diagram illustrating a positioning plate of the electronic component gluing positioning fixture according to an embodiment;
FIG. 5 is a side view of a positioning plate of an electronic component taping positioning jig according to an embodiment;
fig. 6 is a schematic view illustrating an electronic component being pasted with an electronic component pasting positioning fixture according to an embodiment.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "mounted on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "coupled" to another element, it can be directly coupled to the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
An electronic component rubberizing positioning fixture of an embodiment is shown in fig. 1, and includes a bottom plate 10, a positioning plate 20 and an auxiliary positioning member 30, and this embodiment is used for rubberizing and positioning an integrally formed inductor of SPI0603, where SPI0603 includes an electronic component body 41 and pins 42, and the size of electronic component body 41 is 6.9mm × 6.8mm × 3.85 mm.
As shown in fig. 2 and 3, the bottom plate 10 is provided with 8 first grooves 11, which are arranged in a straight line, wherein the length a of each first groove is 7.0mm, the width B of each first groove is 7.2mm, the depth of each first groove is 2.0mm, and the distance between the centers of the adjacent first grooves 11 is 15.05 mm. It can be understood that the number of the first grooves 11 is at least two, and the arrangement mode can be adjusted according to the requirement, for example, the first grooves can be arranged in a rectangular array and arranged in multiple columns to increase the number of electronic components that can be placed on the bottom plate.
As shown in fig. 4 and 5, the positioning plate 20 is provided with 8 second recesses 21 corresponding to the positions of the first recesses 11, and configured to cooperate with the first recesses 11 to clamp the electronic component body 41, the pins 42 are located outside the first recesses 11 and the positioning plate 20, the length C is 7.0mm, the width D is 6.85mm, the depth is 2.2mm, and the distance between the centers of the adjacent second recesses 21 is 15.05 mm. It will be appreciated that the second recess 21 may be one and the length C is equal to the length of the row of first recesses 11 in the base plate 10. Preferably, the edge of the second recess 21 is further provided with a chamfer 23 to prevent the edge of the electronic component from being damaged when the positioning plate 20 is pressed down to clamp the electronic component.
The auxiliary positioning member 30 is provided with 8 fixing positions corresponding to the positions of the first grooves 11 and used for fixing the electronic elements, after the electronic elements are fixed on the auxiliary positioning member, the distance between the centers of the electronic element bodies 41 of the adjacent electronic elements is 15.05mm, so that the electronic elements can be conveniently and quickly placed in the first grooves 11 of the bottom plate 10 accurately, and the efficiency is further improved. It will be appreciated that the auxiliary positioning member 30 is not essential, and for example, the electronic components may be placed one by one in the first recess 11 by bare hands. It is understood that the electronic components can be directly and integrally formed with the auxiliary positioning member 30, and can be more conveniently placed in the first recess 11 in batches.
Preferably, two positioning columns 12 are further disposed on the bottom plate 10, two positioning holes 22 corresponding to the positioning columns 12 are further disposed on the positioning plate 20, and the bottom plate and the positioning plate are assisted by the cooperation of the positioning columns 12 and the positioning holes 22 to clamp the electronic component quickly and accurately, so that efficiency is further improved. It will be appreciated that the number of positioning posts 12 and positioning holes 22 can be adjusted as desired.
Preferably, the electronic component rubberizing positioning fixture is mainly made of synthetic stone, is high temperature resistant, does not deform at high temperature, and is low in cost and easy to process.
Preferably, a buffer member such as a foot pad (not shown) is disposed on a side of the base plate 10 away from the first groove 11, so that the device is stable and does not easily slip during use.
Preferably, the edges of the bottom plate 10 and the positioning plate 20 are provided with chamfers, which effectively remove the machining residual burrs and prevent the edges from being too sharp.
When the electronic component rubberizing positioning fixture is used, firstly, a plurality of electronic components can be fixed on the auxiliary positioning piece 30 to be connected into a whole side by side, so that the plurality of electronic components can be conveniently and quickly and accurately placed in the first groove 11 of the bottom plate 10, then the positioning plate 20 and the bottom plate 10 can be quickly and correctly positioned through the positioning column 12 and the positioning hole 22, the positioning plate 20 is pressed downwards to enable the first groove 11 and the second groove 21 to be matched and clamp the electronic component body 41, the pins 42 are located outside the first groove 11 and the positioning plate 20, then as shown in fig. 6, the adhesive tape 50 can be quickly and accurately pasted on the pins 42 of the plurality of electronic components along the edge of the positioning plate, and then the subsequent process flows of painting, baking, cooling, separating and the like can be carried out.
The electronic component rubberizing positioning fixture is used for rubberizing work of an electronic component, a rubberizing point can be accurately and quickly found, rubberizing stability is improved, rubberizing time is shortened, cost is saved, the electronic component rubberizing positioning fixture is convenient to operate and suitable for batch production, and the product painting appearance qualification rate of rubberizing by using the electronic component rubberizing positioning fixture can reach more than 98%.
The invention also provides a rubberizing method for an electronic element comprising an electronic element body 41 and pins 42, which comprises the following steps:
s10, providing the bottom plate 10 with the first recess 11, and the positioning plate 20 with the second recess 21.
Preferably, a plurality of electronic components are connected side by side as a unit before this step.
S20, placing the electronic component in the first groove 11.
S30, pressing the second groove 21 on the first groove 11 to clamp the electronic component body 41.
S40, attaching the lead 42 outside the bottom plate 10 and the second groove 21 with an adhesive tape.
Further, after the lead 42 is attached with the tape, the subsequent processes such as painting, baking, cooling and separating are performed.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that various changes and modifications can be made by those skilled in the art without departing from the spirit of the invention, and these changes and modifications are all within the scope of the invention. Therefore, the protection scope of the present patent should be subject to the appended claims.
Claims (8)
1. A method for gluing an electronic component, which is characterized in that an electronic component gluing positioning fixture is used for clamping the electronic component comprising an electronic component body and pins, and the electronic component gluing positioning fixture comprises:
the bottom plate is provided with at least two first grooves;
the positioning plate is provided with a second groove which corresponds to the first groove in position and is used for clamping the electronic element body in a matching manner; the second groove and the first groove of the positioning plate are matched for clamping an electronic element body of the electronic element and enabling the pins to be positioned outside the first groove and the positioning plate;
the electronic component rubberizing positioning fixture further comprises auxiliary positioning pieces, and fixing positions which correspond to the positions and the number of the first grooves and are used for fixing the electronic components are arranged on the auxiliary positioning pieces;
the rubberizing method comprises the following steps:
fixing a plurality of electronic elements on the fixing positions of the auxiliary positioning pieces respectively so as to be connected into a whole side by side, and then placing the electronic elements in the first groove;
pressing the second groove on the first groove to clamp the electronic element body;
and sticking adhesive tapes on the pins outside the bottom plate and the second groove.
2. The method of claim 1, wherein the number of second grooves is equal to the number of first grooves.
3. The method according to claim 1, wherein the bottom plate is further provided with a positioning column, and the positioning plate is provided with a positioning hole corresponding to the positioning column.
4. The method of claim 1, wherein the first grooves are aligned in a straight line.
5. The method of rubberizing according to claim 1, wherein the first recesses are arranged in a rectangular array.
6. The method of claim 1, wherein edges of the second groove are chamfered.
7. The method of rubberizing according to claim 1, made of synthetic stone.
8. The method of claim 1, wherein the taping, baking, cooling and separating are performed after the lead is taped.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610726617.0A CN106211735B (en) | 2016-08-25 | 2016-08-25 | Electronic component rubberizing positioning fixture and rubberizing method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610726617.0A CN106211735B (en) | 2016-08-25 | 2016-08-25 | Electronic component rubberizing positioning fixture and rubberizing method |
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| CN106211735A CN106211735A (en) | 2016-12-07 |
| CN106211735B true CN106211735B (en) | 2022-08-19 |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106773213B (en) * | 2017-01-03 | 2020-02-18 | 京东方科技集团股份有限公司 | Display panel, preparation method thereof and display device |
| CN109036146B (en) * | 2018-09-14 | 2020-10-20 | 合肥福映光电有限公司 | Auxiliary rubberizing equipment for display rubber frame |
| CN112046824B (en) * | 2018-12-29 | 2021-09-28 | 翟如相 | Packaging jig of capacitor |
| CN116782527B (en) * | 2023-07-18 | 2023-11-28 | 怡景(上海)五金制品有限公司 | Back plate LED lamp strip heat dissipation film rubberizing device |
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| CN106211735A (en) | 2016-12-07 |
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