1307179 *九、發明說明： 【發明所屬之技術領域】 本發明係有關於一種發光元件之散熱模組，尤指一種 發光二極體（LED)封裝件之散熱模組結構。 【先前技術】 由於發光二極體（Light Emitting Diode，LED)具有 長使用舞命、低耗電量及高亮度等優點，因此其可廣泛應 用於如指示燈、車燈等發光電子產品上，藉以取代傳統鎮 _絲燈。 得統發光 ” D體之封衣、纟σ構係包括有一田金屬片沖 壓形成之座體及相對該座體垂直延伸之接腳、接置於該屈 體上之發光晶片、電性連接該發光晶片與接腳之辉線^ 及包覆該發光晶片與銲線之封膠所構成，其中由於 發光二極體於啟動時’功率耗量大且溫度高，甚而在 間使用下，若無法將發光晶片之熱能有效導出，將： 響發光二極體之使用壽命，尤其對於高亮度需求之功率^ 髮光二極體而言，如何避免因輸入於發光晶片之電流 導致溫度上升，甚而f彡詩光效㈣題，實為衫曰加 評估導熱與散熱效率以熱阻公式為主要^ 阻公式如下： / 1刁式，熱1307179 * Nine, invention description: [Technical Field] The present invention relates to a heat dissipation module for a light-emitting element, and more particularly to a heat dissipation module structure of a light-emitting diode (LED) package. [Prior Art] Since the Light Emitting Diode (LED) has the advantages of long life, low power consumption and high brightness, it can be widely used in light-emitting electronic products such as indicator lights and car lights. In order to replace the traditional town _ silk lamp. The sealing body of the D body, the 纟 构 structure includes a seat formed by stamping a metal sheet and a pin extending perpendicularly to the body, a light-emitting chip attached to the body, and electrically connecting the The light-emitting chip and the soldering wire of the pin ^ and the sealing material covering the light-emitting chip and the bonding wire, wherein the light-emitting diode has a large power consumption and a high temperature at the time of starting, even if it is used occasionally, if not Effectively deriving the thermal energy of the illuminating chip, it will: illuminate the service life of the illuminating diode, especially for the high-brightness demand of the light-emitting diode, how to avoid the temperature rise caused by the current input to the illuminating chip, even f彡Poetry light effect (four) questions, in fact, the evaluation of heat conduction and heat dissipation efficiency is based on the thermal resistance formula. The resistance formula is as follows: / 1 刁, heat
Rth-d-f(A*K) (Rth:熱阻單位··KVW，d:厚度單位·⑺ "位：m2，K:熱導係數單位：w/m* κ。） ，.面積單 鑑此，業界無不積極研於久々 研毛各切心降低發光二 1955/ 5 、1307179 與主、被動散熱系統銜接介面熱阻的技術，而其中發光二 極體與主、被動散熱系統銜接介面d:厚度通常介於 一 〇. 〇 1 mm之間，而a :面積約在1 〇 〇腿2左右因此如何在 相同材質有效體積内加大接觸面積成為降低熱阻的 因素。 明參閱第1圖，係為我國專利公告第477466之發光 -極體封袭結構，其包括有兩組各為兩支分開之架腳 11，12，其中一組架腳u與其垂直方向連結一架連1丨〇， 另組木腳12以其垂直方向連結一架片120,該架片12〇 中段近架連處凹設有架杯121 ;接置於該架杯121上之發 光晶片丨3;連結該架連110與發光晶片13之銲線14;以 及包覆該晶片13、銲線14及部分架片12〇與架連ιι〇之 封膠15，其中該架片120之寬度較架腳12為寬，以使該 邰刀罙片120及架腳11，12曝露於大氣中來逸散發光晶片 13運作時所產生之熱量。 • 惟，前述之發光二極體封裝結構中，僅係藉由將部分 •架片及架腳曝露於大氣中進行熱對流，來予以逸散發光晶 片運作日τ所產生之熱量，因此，並對於功率型發光二極體 無法提供良好之散熱效果，故當元件溫度過高肖，則容易 造成元件故障、甚或損壞之情事。 另凊芩閱第2圖，係為我國專利公告第Μ25841β號專 利之發光二極體封裝結構示意圖，其係包括有一具導電引 *腳211及結構支撐部212之支架21 ;連接於該結構支撐 -部212之晶片導熱承載體22 ;設置於該晶片導熱承載體 19557 6 1307179 22上之發光晶片23;以及封裝該發光晶片23並外露部分 晶片$熱承載體22之封裝體25，俾於連接至印刷電路板 2 6 付以使s亥晶片導熱承載體2 2底面抵接於印刷電路 板26或其它散熱件上來逸散發光晶片23之熱量。 1·隹，釗述之第1及第2圖所顯示之發光二極體封裝結 構中，皆無光學定位結構可供精確定位，且熱導路徑往光 源反方向。 —另請參閱第3A、3B圖及第3C圖，係顯示美國專利公 開第US2GG5/G1351G5A1號所揭示之發光二極體封裝結構 之剖面、平面圖及應用示意圖，該發光二極體封裝結構 3〇〇係在發光晶片310下方設置散熱件316，以透過該散 熱:316底面抵接於印刷電路板37()或散熱件予以逸散發 光晶片310運件時所產生之熱量，且其雖以定位凹槽 供發光晶片310及光學元件360相對定位效果，但卻^不且 導熱之功能。 〃 再者雖剛述之接觸式導熱方式可較肖空氣進行熱交 ,方式之散熱效率來得高’惟其進行散熱時僅係藉由利用 晶片導熱承載體或散熱件底面部分與印刷電路板或散孰 觸面積予以導熱’其接觸導熱面積對於功效型哪 、衣、、、。構仍為過小’而無法有效提高散熱效能。 請參閱第4A圖，鑑於前述問題，美國專利第 :6二799:號則揭示另一種發光二極體散熱構裝結構 I;::/:包括有一金屬殼(咖·^ 向形成有—軸向延伸槽孔47〇;固定於該金屬殼π 19557 7 1307179 内之印刷電路板46;以及複數鄰接排列於該轴向延伸延 二孔470内之LED封裝件40，以構成設有複數led之 :官二復請配合參閱第4B圖’其中，各該LED封裝件4。 具有一支撐件（support member)41，且於該支撐件Ο 一 :設有碗狀部41〇;設於該支撐件41另一端之散熱片42; 二於该支撐件41兩側之電極端（terminal)43 ;接置於該 碗狀410之發光晶片44 ;電性連接該發光晶片44與電 =端43之銲線45;以及包覆該發光晶片44、銲線“及 2分支撐件41與電極端43之透光圍束體48，於該圍束 體48上設有一光集中部48〇，俾供該些⑽封裝件別得 =由金屬殼47侧邊滑置於該軸向延伸槽孔47()内，並使 複數LED封裝件40相互鄰接排列，以構成設有複數⑽ 之燈管。該LED封裝件4〇係將其外露出該圍束體48之電 極端43、支樓件41及散熱片42部分容置於該金屬殼u 之轴向延伸槽孔470中’並使該電極端43電性連接至嵌 埋於該金屬殼47内之印刷電路板46，且使其光集中部· 外露出該軸向延伸槽孔47〇。 山雖月ij述散熱構裝結構中，LED封裝件可藉由將散熱片 嵌埋於金屬殼内而加大導熱面積，惟該些L E D封裝件係自 金屬殼側邊以滑移方式而收納於該金屬殼之軸向延伸槽 孔中，不僅操作不便，同時該收納於金屬殼内之LED封曰聲 件相對於左右位置並不具定位作用，而容易發生偏移問、 題，造成後續製程光學效能不佳，再者，為使該印刷電路 板設置於該金屬殼内，亦須額外設置開孔以供收納該電路 19557 8 1307179 板，如此該用以收納印刷電路板之開孔將於該金屬殼内形 成一中空部，造成導熱不良問題，此外，由於前述技術中 係於金屬殼側邊置ALED封裝件及印刷電路板，如此將益 下Μ光學裝置’造成發光效能無法有效提升: 甚者’亦無法往上進行精確定位光學裝置及向上導熱，致 使其組裝品質及散熱效能提升之貢獻亦屬有限。Rth-df(A*K) (Rth: thermal resistance unit··KVW, d: thickness unit·(7) " bit: m2, K: thermal conductivity coefficient unit: w/m* κ.), area The industry is actively researching on the technology of the long-term research and development of the 1955/ 5, 1307179 and the main and passive cooling systems to connect the interface thermal resistance, and the light-emitting diode and the main and passive cooling system interface d: The thickness is usually between one 〇1 mm and a: the area is about 1 〇〇 leg 2 so how to increase the contact area within the effective volume of the same material becomes a factor that reduces the thermal resistance. Referring to FIG. 1 , it is a light-polar body entrapment structure of the Chinese Patent Publication No. 477466, which comprises two sets of two separate legs 11 and 12, wherein a set of legs u are connected to the vertical direction thereof. One set of the wooden legs 12 is connected with a piece of the piece 120 in the vertical direction. The middle part of the frame piece 12 is recessed with a frame cup 121 at the middle of the frame; and the light-emitting chip placed on the frame cup 121 3; a bonding wire 14 connecting the shelf 110 and the light-emitting chip 13; and a sealing 15 covering the wafer 13, the bonding wire 14 and a part of the mounting piece 12 and the ivating frame, wherein the width of the mounting piece 120 is The legs 12 are wide so that the squeegee 120 and the legs 11, 12 are exposed to the atmosphere to dissipate the heat generated by the operation of the luminescent wafer 13. • In the above-mentioned light-emitting diode package structure, the heat generated by the operation day τ of the light-emitting chip is dissipated only by exposing a part of the shelf piece and the leg to the atmosphere for heat convection. The power type light-emitting diode cannot provide a good heat dissipation effect, so when the temperature of the component is too high, it is easy to cause component failure or even damage. FIG. 2 is a schematic diagram of a light-emitting diode package structure of the patent No. 25841β of the Chinese Patent Publication No. 25841β, which includes a support 21 with a conductive lead 211 and a structural support portion 212; - a wafer heat-conducting carrier 22 of the portion 212; an illuminating wafer 23 disposed on the wafer heat-conducting carrier 19557 6 1307179 22; and a package 25 encapsulating the luminescent wafer 23 and exposing a portion of the wafer $-thermal carrier 22 To the printed circuit board 26, the bottom surface of the heat conducting carrier 2 2 is abutted against the printed circuit board 26 or other heat sink to dissipate the heat of the light emitting chip 23. 1. In the light-emitting diode package structure shown in Figures 1 and 2, there is no optical positioning structure for precise positioning, and the thermal conduction path is opposite to the light source. - Referring to Figures 3A, 3B, and 3C, there is shown a cross-sectional, plan view, and application schematic of a light-emitting diode package structure disclosed in U.S. Patent Publication No. 2G5/G1351G5A1, which is incorporated herein by reference. The heat dissipation member 316 is disposed under the light-emitting chip 310 to transmit heat generated by the heat-dissipating surface of the printed circuit board 37 () or the heat sink to dissipate the heat generated when the light-emitting chip 310 is transported. The groove is used for the relative positioning effect of the light-emitting chip 310 and the optical element 360, but does not have the function of heat conduction. 〃 Although the contact-type heat conduction method just described can be heat-crossed compared with the Xiao air, the heat dissipation efficiency of the method is high. However, the heat dissipation is only by using the wafer heat-conducting carrier or the bottom surface portion of the heat sink and the printed circuit board or The contact area is heat-conducted. Its contact heat-conducting area is suitable for the type of clothing, clothing, and. The structure is still too small to effectively improve heat dissipation. Referring to FIG. 4A, in view of the foregoing problems, U.S. Patent No. 6, 799: discloses another type of light-emitting diode heat-dissipating structure I;::/: includes a metal shell (a shaft formed by a shaft) a printed circuit board 46 fixed to the metal shell π 19557 7 1307179; and a plurality of LED packages 40 adjacently arranged in the axially extending second hole 470 to form a plurality of led The second LED is in conjunction with the reference to FIG. 4B, wherein each of the LED packages 4 has a support member 41, and the support member is provided with a bowl portion 41; a heat sink 42 at the other end of the member 41; an electrode terminal 43 on both sides of the support member 41; an illuminating wafer 44 disposed in the bowl 410; electrically connecting the illuminating wafer 44 and the electric terminal 43 a bonding wire 45; and a light-transmitting surrounding body 48 covering the light-emitting chip 44, the bonding wire "and the 2-point supporting member 41 and the electrode end 43, and a light collecting portion 48" is provided on the surrounding body 48, The (10) packages are differently placed in the axially extending slots 47 () by the side of the metal shell 47, and the plurality of LED packages 40 are arranged adjacent to each other. The LED package 4 is configured to receive the electrode end 43 of the surrounding body 48, the branch member 41 and the heat sink 42 partially received in the axial direction of the metal shell u. In the slot 470, the electrode end 43 is electrically connected to the printed circuit board 46 embedded in the metal case 47, and the light concentrated portion is exposed to the axially extending slot 47. In the heat dissipating structure, the LED package can increase the heat transfer area by embedding the heat sink in the metal case, but the LED packages are stored in the sliding manner from the side of the metal case. The axially extending slot of the metal shell is not only inconvenient to operate, but also the LED sealing sound element housed in the metal shell does not have a positioning function with respect to the left and right positions, and is prone to offset problems, resulting in subsequent process optical performance. Poorly, in order to arrange the printed circuit board in the metal case, an additional opening is required for accommodating the circuit 19557 8 1307179, so that the opening for accommodating the printed circuit board will be in the metal A hollow portion is formed in the shell, causing poor heat conduction In addition, since the foregoing technology is based on the side of the metal shell and the ALED package and the printed circuit board, the optical performance of the optical device can not be effectively improved: even 'can't go up to accurately position the optical device and upward The contribution of heat conduction to the improvement of its assembly quality and heat dissipation performance is also limited.
提供一種可解決上述發光二極體之散熱效 一去有效定位、功效無法提升、及操作不便等問 碭之技術方案，實為此產業中，亟待解 【發明内容】 项 繁於以上所述習知技術之問題，本發明之 =提供—種發光元件之散熱模組，以提供良好之導熱效、 果0 種發光元件之散熱模 本發明之另一目的係在提供一 ’以同時提供良好定位效果。 種發光元件之散熱模 種發光元件之散熱模 本發明之又一目的係在提供— 組，以增加導熱面積。 本發明之再一目的係在提供一 組’以提升發光效能。 έ ，本目的係在提供—種發光^件之散熱模 、、且’以提向操作便利性。 、 為達成上揭之主要目的，本於明在据命 ^ ^ ^ 知月係揭路一種發光元件 之政熱杈組，其包括有發光元 且有 — 牛及放熱座，該發光元件係 ，、有先早兀、與該發光單元電性相合之導電件、承載 19557 9 J307179 該發光單元之金屬板、及包覆該發光單元及部分之導電 與金屬板之透光體，該散熱座具有相對上表面及下表“件 且於該上表面形成有開孔，以供發光元件之金屬板垂直办 置於該開孔中，以使該金屬板與例如散熱座之次㈣系= 間具有充分之接觸面積，提供良好之導熱效果。再'者'，、今 金屬板係具有用以承載該發光單元之承載部以及由、 載部向外延伸且用以進行散熱之散熱部，該散熱部復= 應於該發光單元之方向進行延伸，進而形成有—上 以供定位至預設有開口之光學裝置中，以強化 ^ 位與發光效能及提供更多之導熱面積。 疋 f出繼導電件插置於該開孔中並使其-端外 :出=熱座之下表面，以供於該散熱座之下表面接置— ^ 座之外部基材，並使該導電件得以利_ 二!2性耦合至外部基材。亦或於該散熱座表面之上 表面=電路板，並使該導電件電性連接至該電路^上 〇者’於―貫施例中，係可使發光元件接置於-前置 式放熱座中，該前置式散埶 、引置 且於兮丁主二/ …丛/、有相對上表面及下表面， 之」以供該發^件㈣發光單元 下表1之：中 上凸部垂直容置於前 表面之開孔中’該前置式散熱 時強化該光學單元之4 ^子用逆，俾可同 中，該導電件係可朝:該:m。：另-實施例 該金屬板與散熱座得 兀°進仃%、折’藉以使 相較於習知二件:::化導熱效能。 知九7G件之散熱技術，本發明主 19557 1307179 2碰光單元之底端設置金屬板，並使 :直容置於散熱座之上表面開孔中，俾使該發光單元= 充刀應用该金屬板之全部面積與散熱座間接置 散熱效能，並得藉此有效定位於散熱座中，而毋 雜疋位裝置。此外，該金屬板復可設有朝該發光單元凸伸 部，俾可藉由該上凸部與光學裝置進行定 亦仔利用該上凸部增加導熱面積。 寸 【實施方式】 以下係藉由特定的具體實施例說明本發明之實施方 熟習此技藝之人士可由本說明書所揭示之内容輕易地 瞭解本發明之其他優點與功效。 “ Γ先，请參閱第5A圖，係顯示本發明之發光元件之 :…、核組結構’其包括有發光元件51及散熱^ ，該發 先疋件5i具有：發光單元5U、與該發光單元511電^ $合之導電件512、承载該發光單元之金屬板513、 及部分之導電細與金屬板513之透光 —^ 6玄政熱座52具有相對上表面521及下表面522， 且於該上表面形成有開孔523，以供發光元件Η之金屬 反513垂直插設並容置於該開孔523中，其中該，散熱座 之尘式除可採一體成型，且於其中開設有開孔523外， =可利用至少二塊等組合方式，以將發光元件Μ爽固而 '谷置於5亥組合方式所形成之散熱座Μ開孔⑽中，如第 5 A ’圖所示。 復4配合參閱第5B圖，係為本發明之發光元件之散 11 19557 1307179 係可例如為LED發光 其中該發光晶片係可 熱模組剖面示意圖，該發光單元511 晶片；該導電件512係為金屬接腳， 利用銲線而電性連接至該金屬接腳 該金屬板513具有用以承载該發光單元5ιι之 513a以及由該承載部513a向外 熱一於本實施例中，該承載 別端凸出處，該導電#512係設置於該散熱部之一側，例Providing a technical solution capable of solving the above-mentioned heat-dissipating effect of the light-emitting diode, effective positioning, unsatisfactory efficiency, and inconvenient operation, etc., in this industry, it is urgent to solve the problem of the invention. Knowing the problem of the technology, the present invention provides a heat-dissipating module of a light-emitting element to provide a good heat-transfer effect, and a heat-dissipating mold of the light-emitting element of the present invention. Another object of the present invention is to provide a 'to provide good positioning at the same time. effect. A heat-dissipating mold for a light-emitting element of a light-emitting element Another object of the present invention is to provide a group to increase the heat transfer area. A further object of the present invention is to provide a group ' to enhance luminous efficacy. έ This purpose is to provide a heat-dissipating mold for a kind of light-emitting device, and to improve the convenience of operation. In order to achieve the main purpose of the disclosure, Ben Yuming’s political enthusiasm group, which is based on a luminary component, has a luminescent element and has a luminescent element and a radiant element. a conductive member that is electrically connected to the light-emitting unit, a metal plate that carries the light-emitting unit of 19557 9 J307179, and a light-transmitting body that covers the light-emitting unit and a portion of the conductive and metal plate. An opening is formed on the upper surface and the lower surface of the upper surface, so that the metal plate of the light-emitting element is vertically disposed in the opening so that the metal plate has a second (four) system with, for example, a heat sink A sufficient contact area provides a good heat conduction effect. Further, the current metal plate has a load-bearing portion for carrying the light-emitting unit and a heat-dissipating portion extending outward from the carrier portion for heat dissipation. The part should be extended in the direction of the light-emitting unit, and then formed to be positioned in the optical device pre-arranged to enhance the brightness and the luminous efficiency and provide more heat-conducting area. Conductive member insertion The opening is in the outer end of the opening: the lower surface of the hot seat is provided for the lower surface of the heat sink to be attached to the outer substrate of the seat, and the conductive member is facilitated. Coupling to the external substrate, or on the surface of the heat sink surface = circuit board, and electrically connecting the conductive member to the circuit, in the embodiment, the light emitting device can be connected In the front-mounted heat release seat, the front-mounted divergence, the lead-in and the second main/secondary bundle, and the upper surface and the lower surface are provided for the hairpiece (four) light-emitting unit 1: the upper middle convex portion is vertically accommodated in the opening of the front surface. The front-mounted heat dissipation strengthens the optical unit by 4, and the conductive member can be oriented toward: . : OTHER EMBODIMENT The metal plate and the heat sink are 仃°%, folded, so that compared with the conventional two::: heat conduction performance. Knowing the heat dissipation technology of the 9G parts, the main end of the 19557 1307179 2 light-shielding unit of the present invention is provided with a metal plate, and the direct capacity is placed in the opening of the upper surface of the heat sink seat, so that the light-emitting unit=filling knife application The entire area of the metal plate and the heat sink are indirectly disposed to dissipate heat, and thereby effectively position the heat sink in the heat sink, and noisy the clamping device. In addition, the metal plate may be provided with a protruding portion toward the light emitting unit, and the upper convex portion and the optical device may be used to increase the heat transfer area by the upper convex portion. The embodiments of the present invention will be readily understood by those skilled in the art from this disclosure. Γ First, please refer to FIG. 5A, which shows a light-emitting element of the present invention: ..., a nuclear group structure, which includes a light-emitting element 51 and a heat-dissipating unit 5, the light-emitting unit 5i having: a light-emitting unit 5U, and the light-emitting unit The conductive member 512 of the unit 511, the metal plate 513 carrying the light-emitting unit, and the light-transmissive portion of the conductive thin metal plate 513 have a relatively upper surface 521 and a lower surface 522. An opening 523 is formed in the upper surface for vertically inserting and accommodating the metal anti-513 of the illuminating element 中 in the opening 523. Outside the opening 523, = at least two combinations can be used to cool the illuminating element and the valley is placed in the heat sink opening (10) formed by the 5 hai combination method, as shown in Fig. 5A' Referring to FIG. 5B, it is a light-emitting element of the present invention. 11 19557 1307179 can be, for example, LED light-emitting, wherein the light-emitting chip is a heat-generating module, and the light-emitting unit 511 is a wafer; the conductive member The 512 series is a metal pin that is electrically connected to the wire by a bonding wire. The metal plate 513 has a 513a for carrying the light-emitting unit 510a and is heated outward by the 510a. In the embodiment, the conductive end is protruded, and the conductive #512 is disposed in the heat-dissipating portion. One side, example
:位於該散熱部513b之面向側’且非與該散熱部位於同 一水平面上。 另外’該金屬板513之承载都 兮代土一 f戰# 513&上復可對應接置 〜杳先早兀511處設置如碗狀之凹陷（未圖示），以提供兮 發光單元5H所產生之光源聚光出射效果。再者4全屬乂 板⑴之散熱部513b形狀係可依實際需求設置為連續彎 才:、矩形、橢圓以及全圓等形狀。此外，對應實際應用需 求’。该金屬板513係可單純僅用作散熱用途，亦或可與發 _光單元511作電性耦合。 又 -該透光體514係用以固定該發光單元511於該金屬板 • 513之承載部513a上，並保護該發光單元5ιι，且令該導 電件512與該金屬板513間形成相對之固定位置，而該透 光體514之較佳實施方式係由封裝膠體（如 透光材料）形成。於本實施例中’該透光體514== '如燈泡形狀，並於該透光體514前端設有集光部51牦， 該集光部514a可選擇用以修飾及不修飾由該發光單元 511所產生之光源之出射光線之其中一者，該透光體514 19557 12 Ί307179 並非用以限制本發 可實施之形狀係可依實際需求而定 明。 該散熱座52具有相對上表面521及下表面522，且 於該上表面521形成有開孔523,以供接置有發光元件 之金屬板513垂直容置於該開孔523中，進而使該發光元 件51得以定位於例如該散熱座52之次散熱系統中。該散 熱座52係可例如為表面形成複數散熱鰭片之金屬塊或可 埋入熱導管合併使用（未圖示）。 另外復得使該導電件512插置於該開孔如中並使其 -端外露出該散熱座52之下表面522,以供於該散熱座、 2之下表面522接置一例如電路板或基座之外部美材 53,並使該導電件512彳旱以利用插件式方式電土 部基材53。 h >復請配合參閱第6圖，該金屬板513之散熱部51扑 设可對應於該發光單元511之方向進行延伸，進而形成有 一上凸部513b，’以供該發光元件51插置於該散熱座52 中時，得以使該上凸部513b，外露於該散熱座52,藉以供 定位至預設有開π之光學裝置54中，以強化光學元件定 位與發光效能，同時該光學裝置54係可以導熱材質製 成，例如金屬，藉此提供更多之導熱面積。 π 4請參閱第7圖，係為本發明之發光元件之散熱模組第 -貫施例《立體及剖面示意圖，如圖所示，本實施例盥前 述實施：大致相同，主要差異在於改為採用前置式散熱座 62，該前置式散熱座62具有相對上表面621及下表面 19557 13 1307179 ，622 ’且於該下表面622形成有開孔，以供該發光元件μ 以該發光單元61丨之一侧，利用該發光元件61之金屬板 的上凸部βΐ 3b’垂直容置於前置式散熱座下表面 622之開孔中，且該前置式散熱座62具有光學用途，俾 可同時強化該光學元件61之散熱效果及光學元件定位 與發光效能。 . 請參閱第8圖，係為本發明之發光元件之散熱模組第 一只施例之立體示意圖，如圖所示，本實施例與前述實施 例大致相同，主要差異在於發光元件71具有複數導電件 712 ’以於金屬板713插置於散熱座72之開孔時，該導電 件712係未插置於開孔中，而係彎折以電性連接至設於散 熱座72上表面之電路板73。 另外’該金屬板713之上凸部713b，係外露於該散熱 座72’藉以供後續定位至光學裝置中，以強化發光效能， 同日守该光學裝置係可以導熱材質製成，藉此提供更多之導 φ熱面積。 ' 請參閱第9圖，係為本發明之發光元件之散熱模組第 _四實施例中所採用之發光元件立體示意圖，如圖所示，本 λ把例之發光元件具有複數個金屬板813，該些金屬板 813之一端係相互連接而形成承載部813a，以供承載發光 單兀811 ’另該金屬板813亦具有散熱部813b，可供插置 於預設於—散熱座（未圖示）上表面之開孔中，另於該散熱 η 4 813b朝向該發光單元"I處復設有上凸部8i3b，，可 供定位光學裝置及增加散熱接觸面積。 14 19557 1307179 組第2==圖，係為本發明之發光元件之散熱模 a例之立肢及示意圖’以及第刚圖係為本發明 =光^件之散熱模組第五實施例未含連接器之剖面示 所示’本實施例之發光元件9丨係使導電件912 :行，折，藉以電性輕合至一連接器94，俾使該發 全：板金屬板913容置於散熱座92時，得以使該 -屬板㈣與該散熱座92全面接觸，進而強化散熱效能。 另請參閱第m及11B圖，係為本發明之發光元件之 月一…拉組第六實施例之應用立體及剖面示意圖，如圖所 亥發光it件1G1係可選擇前述實施例之發光元件，並 料—例如燈具之照明裝置上，該照明I置設有-光 反射盖102，以及相對橫設於該光反射M 1〇2之反射面一 :的:丈熱座103 ’以供發光元件1〇1之金屬板1〇13插置 :忒政熱座103中，藉以逸散發光元件1〇1之熱量，並使 供電裳置得以透過—電源接頭104而f性連接該發光元 之導電件1〇12，以供輸入電源，其中，該光反射 -可與該散熱I 103採用相同材質，而兼具散熱功能。 ^請參閱請及12B圖，係為本發明之發光元件之 散熱核組第七實施例之應用立體及剖面示意圖，如圖所 :、亥發光7C件111係可選擇前述實施例之發光元件，並 :應用於—例如醫療用無影燈之照明裝置上，該照明裝置 。又有光反射盍112，以及相對連設於該光反射蓋丨丨2 一 端之散熱座113 ’以供發光元件⑴之金屬板1113插置 於/政夂座113中’其中該發光元件J J)中為透光體⑴4 19557 15 J307179 所包覆之發光單元（未圖示）係設於金屬板ΐίΐ3之側邊， 以使光源㈣錢投射线歧射蓋112，且該發光元件 111之導電件i i i 2係朝向該發光單元方向進行彎折，藉 以電性麵合至-電源接頭114 ,以供輸入電源，同時使古亥 插置於散熱座ι13中之金屬板ln3得與該散熱座ιΐ3全 面接觸，強化導熱效能。 ，π _因此，本發明之發光元件之散熱模組主要透過在發光 鲁早兀之底端設置金屬板’並使該金屬板得以垂直容置於散 熱座之上表面開孔中，俾使該發光單元得以充分應用該金 f板之全部面積與散熱座間接置，大幅提高散熱效能，並 得错此有效定位於散熱座中，而毋需使用繁雜定位裝置。 此^ ’該金屬板復可設有朝該發光單元凸伸之上凸部，俾 可藉由該上凸部與光學裝置進行定位，同時亦得利用該上 凸部增加導熱面積。 上述之實施例僅為例示性說明本發明之原理及其功 ♦效^而非用於限制本發明。任何熟習此技藝之人士均可在 不連背本發明之精神及範疇下，對上述實施例進行修飾與 變化。因此，本發明之權利保護範圍，應如後述之申請專 利範圍所列。 【圖式簡單說明】 第1圖係為我國專利公告第477466號所揭示之發光 —極體封裝結構示意圖； 第2圖係為我國專利公告第M258416號所揭示之發光 -二極體封裝結構示意圖； x 19557 16 1307179 第3A及3B圖係為美國專利公開第 US2005/Gmi()5Al號所揭示之發光二極體封裝結構剖面 及平面示意圖； 第3C圖係為美國專利公開第US2005/0135105A1號所 揭示之發光二極體封裝結構應用示意圖； 第4A圖係為美國專利公告第US6, 799, 870號所揭示 之發光二極體散熱構裝結構示意圖； 第4B圖係為美國專利公告第US6,799,87〇號所揭示 之發光二極體封裝件示意圖； 第5 A及5 A圖係為本發明之發光元件之散熱模組第 一實施例之立體示意圖； 5B圖係為本發明之發光^件之散熱模組第一實施例 之剖面示意圖 第6圖係為本發明之發光元件之散熱模組中增設第 二光學裝置之示意圖； •帛7圖係為本發明之發光元件之散熱模組第二實施 例示意圖； 第8圖係為本發明之發光元件之散熱模組第三實施 例示意圖； 第9圖係為本發明之發光元件之散熱模組第四實施 例中所採用之發光元件示意圖； 第10A圖係為本發明之發光元件之散熱模組第五實 施例之立體及示意圖； «⑽圖係為本發明之發光元件之散熱模組第五實 19557 17 J307179 '施例未含連接器之剖面示意圖； 第11A及11B圖係為本發明之發光元件之散熱模組第 六貫施例之應用立體及剖面不意圖；以及 第12A及12B圖係為本發明之發光元件之散熱模組第 七實施例之應用立體及剖面示意圖。 【主要元件符號說明】 11, 12 架腳 110 架連 ^ 120 架片 121 架杯 13 發光晶片 14 銲線 15 封膠 21 支架 211 導電引腳 > 212 結構支撐部 22 晶片導熱承載體 23 發光晶片 25 封裝體 26 印刷電路板 300 發光二極體封裝結構 302 定位凹槽 ' 310 發光晶片 -316 散熱件 18 19557 1307179 360 光學元件 370 印刷電路板 40 LED封裝件 41 支撐件 410 碗狀部 42 散熱片 43 電極端 44 發光晶片 45 銲線 46 印刷電路板 47 金屬殼 470 軸向延伸槽孔 48 圍束體 480 光集中部 51 發光元件 I 511 發光單元 512 導電件 513 金屬板 513a 承載部 513b 散熱部 513b， 上凸部 514 透光體 ，514a 集光部 -52 散熱座 19 19557 1307179 521 上表面 522 下表面 523 開孔 53 外部基材 61 發光元件 611 發光單元 613 金屬板 613b， 上凸部 62 前置式散熱座 621 上表面 622 下表面 71 發光元件 712 導電件 713 金屬板 713b， 上凸部 丨72 散熱座 73 電路板 811 發光單元 813 金屬板 813a 承載部 813b 散熱部 813b， 上凸部 '91 發光元件 •912 導電件 -1307179 913 金屬板 92 散熱座 94 連接器 101 發光元件 1012 導電件 1013 金屬板 102 光反射蓋 103 散熱座 104 電源接頭 111 發光元件 1112 導電件 1113 金屬板 1114 透光體 112 光反射蓋 113 散熱座 114 電源接頭: Located on the side facing side of the heat dissipating portion 513b and not at the same level as the heat dissipating portion. In addition, the bearing of the metal plate 513 is 兮 土 一 一 f f# 513 & can be connected to the 杳 杳 兀 兀 兀 511 at the 511 place such as a bowl-shaped depression (not shown) to provide the 兮 illuminating unit 5H The generated light source has a concentrated light emission effect. Furthermore, the shape of the heat dissipating portion 513b of the panel 4 (1) can be continuously curved, rectangular, elliptical, and full-circle. In addition, it corresponds to the actual application needs'. The metal plate 513 can be used only for heat dissipation purposes, or can be electrically coupled to the light-emitting unit 511. Moreover, the light-transmitting body 514 is configured to fix the light-emitting unit 511 on the bearing portion 513a of the metal plate 513, and protect the light-emitting unit 5 ι, and the conductive member 512 and the metal plate 513 are oppositely fixed. The preferred embodiment of the light transmissive body 514 is formed from an encapsulant such as a light transmissive material. In the present embodiment, the light-transmitting body 514==' is in the shape of a bulb, and a light collecting portion 51 is provided at the front end of the light-transmitting body 514, and the light collecting portion 514a can be selected to modify and not modify the light-emitting portion. One of the light rays emitted from the light source generated by the unit 511, the light transmitting body 514 19557 12 Ί 307179 is not intended to limit the shape of the hair can be implemented according to actual needs. The heat dissipation seat 52 has an opposite upper surface 521 and a lower surface 522, and an opening 523 is formed in the upper surface 521, so that the metal plate 513 to which the light-emitting component is disposed is vertically received in the opening 523, thereby The light-emitting element 51 is positioned in a secondary heat dissipation system such as the heat sink 52. The heat sink 52 can be, for example, a metal block having a plurality of heat sink fins formed on its surface or a buried heat pipe (not shown). In addition, the conductive member 512 is inserted into the opening, and the outer surface 522 of the heat sink 52 is exposed outside the end of the heat sink, and the lower surface 522 of the heat sink 2 is connected to a circuit board. Or the external beauty material 53 of the susceptor, and the conductive member 512 is drowned to utilize the plug-type electric field substrate 53. h > Referring to FIG. 6 , the heat dissipating portion 51 of the metal plate 513 is extended in a direction corresponding to the light emitting unit 511 , and an upper convex portion 513 b is formed to insert the light emitting element 51 . In the heat sink 52, the upper convex portion 513b is exposed to the heat sink 52 for positioning into the optical device 54 pre-disposed with π to enhance optical component positioning and luminous performance, and the optical The device 54 can be made of a thermally conductive material, such as metal, thereby providing more heat transfer area. π 4 Please refer to FIG. 7 , which is a schematic diagram of a three-dimensional embodiment of a heat dissipation module of a light-emitting component of the present invention. As shown in the figure, the embodiment is substantially the same as the foregoing embodiment, and the main difference is that A front heat sink 62 is disposed. The front heat sink 62 has an opposite upper surface 621 and a lower surface 19557 13 1307179 , 622 ′ and an opening is formed in the lower surface 622 for the light emitting element to be the light emitting unit. One side of the 61 丨, the upper convex portion β ΐ 3b ′ of the metal plate of the illuminating element 61 is vertically received in the opening of the lower surface 622 of the front heat sink, and the front heat sink 62 has optical use. The heat dissipation effect of the optical component 61 and the positioning and illuminating performance of the optical component can be enhanced at the same time. Please refer to FIG. 8 , which is a perspective view of the first embodiment of the heat dissipation module of the light-emitting element of the present invention. As shown in the figure, the embodiment is substantially the same as the foregoing embodiment, and the main difference is that the light-emitting element 71 has a plurality of When the metal plate 713 is inserted into the opening of the heat sink 72, the conductive member 712 is not inserted into the opening, but is bent to be electrically connected to the upper surface of the heat sink 72. Circuit board 73. In addition, the convex portion 713b of the metal plate 713 is exposed to the heat sink 72' for subsequent positioning into the optical device to enhance the luminous performance. On the same day, the optical device can be made of a heat conductive material, thereby providing more More than φ thermal area. Please refer to FIG. 9 , which is a perspective view of a light-emitting element used in the fourth embodiment of the heat-dissipating module of the present invention. As shown in the figure, the light-emitting element of the present embodiment has a plurality of metal plates 813. One end of the metal plates 813 are connected to each other to form a bearing portion 813a for carrying the light-emitting unit 811'. The metal plate 813 also has a heat-dissipating portion 813b, which can be inserted into the preset heat sink (not shown). In the opening of the upper surface, the heat dissipation η 4 813b is provided with an upper convex portion 8i3b toward the light-emitting unit "I, which can be used for positioning the optical device and increasing the heat-dissipating contact area. 14 19557 1307179 The second == diagram of the group is a vertical limb and a schematic diagram of the heat dissipation module a of the light-emitting element of the present invention, and the first embodiment is the fifth embodiment of the heat dissipation module of the invention The cross-section of the connector is shown in the following description. The illuminating element 9 of the present embodiment is such that the conductive member 912 is folded and folded, and electrically connected to a connector 94, so that the slab is placed: the metal plate 913 is placed. When the heat sink 92 is disposed, the base plate (four) can be in full contact with the heat sink 92, thereby enhancing heat dissipation performance. Please refer to the figures m and 11B, which are schematic diagrams of the application of the sixth embodiment of the light-emitting element of the present invention, and the cross-sectional view of the sixth embodiment, as shown in the figure, the light-emitting element of the foregoing embodiment can be selected. And, for example, on the illumination device of the lamp, the illumination I is provided with a light reflection cover 102, and a reflection surface 280 which is transversely disposed on the light reflection M1〇2: a heat seat 103' for illumination The metal plate 1〇13 of the component 1〇1 is inserted: in the hot seat 103, the heat of the light-emitting element 1〇1 is dissipated, and the power supply is transmitted through the power connector 104 to f-connect the light-emitting element. The conductive member 1〇12 is provided for inputting power, wherein the light reflection can be the same material as the heat dissipation I 103, and has a heat dissipation function. ^Please refer to FIG. 12B, which is a perspective view and a cross-sectional view of a seventh embodiment of a heat dissipation core group of a light-emitting element of the present invention, as shown in the figure: a light-emitting 7C member 111 is selected from the light-emitting elements of the foregoing embodiment. And: applied to, for example, a lighting device for medical shadowless lamps, the lighting device. Further, there is a light reflection 盍 112, and a heat sink 113 ′ oppositely connected to one end of the light reflection cover 以 2 for inserting the metal plate 1113 of the light-emitting element (1) into the / sill 113 (where the light-emitting element JJ) The light-emitting unit (not shown) coated in the middle of the light-transmitting body (1) 4 19557 15 J307179 is disposed on the side of the metal plate 以ίΐ3 so that the light source (4) is projected on the wire projection cover 112, and the conductive member of the light-emitting element 111 Iii 2 is bent toward the direction of the light-emitting unit, so as to be electrically connected to the power connector 114 for inputting power, and the metal plate ln3 inserted in the heat sink ι13 is fully integrated with the heat sink ι3 Contact, strengthen thermal conductivity. , π _ Therefore, the heat dissipating module of the illuminating element of the present invention is mainly provided by disposing a metal plate at the bottom end of the illuminating light and allowing the metal plate to be vertically placed in the opening of the upper surface of the heat sink The illuminating unit can fully utilize the entire area of the gold plate and the heat sink to indirectly, thereby greatly improving the heat dissipation performance, and the fault is effectively positioned in the heat sink, and the complicated positioning device is not required. The metal plate may be provided with a convex portion protruding toward the light emitting unit, and the upper portion and the optical device may be positioned by the upper convex portion, and the upper convex portion is also used to increase the heat transfer area. The above-described embodiments are merely illustrative of the principles of the invention and its advantages, and are not intended to limit the invention. Modifications and variations of the above-described embodiments can be made by those skilled in the art without departing from the spirit and scope of the invention. Therefore, the scope of protection of the present invention should be as set forth in the scope of the application patents described below. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic diagram of a light-emitting body package structure disclosed in Chinese Patent Publication No. 477466; FIG. 2 is a schematic diagram of a light-diode package structure disclosed in Chinese Patent Publication No. M258416 x 19557 16 1307179 FIGS. 3A and 3B are a schematic cross-sectional view and a plan view of a light-emitting diode package structure disclosed in US Patent Publication No. US2005/Gmi() No. 5 Al; FIG. 3C is a US Patent Publication No. US 2005/0135105 A1 FIG. 4A is a schematic diagram of a heat-dissipating structure of a light-emitting diode disclosed in US Pat. No. 6,799,870; FIG. 4B is a US Patent Publication No. US6 FIG. 5A and FIG. 5A are perspective views of a first embodiment of a heat dissipation module of a light-emitting element of the present invention; FIG. 5B is a view of the present invention BRIEF DESCRIPTION OF THE DRAWINGS FIG. 6 is a schematic view showing a second optical device added to a heat dissipation module of a light-emitting element of the present invention; A schematic diagram of a second embodiment of a heat dissipation module of a component; FIG. 8 is a schematic view of a third embodiment of a heat dissipation module of a light-emitting component of the present invention; FIG. 10A is a perspective view and a schematic view of a fifth embodiment of a heat dissipation module of a light-emitting element of the present invention; «(10) is a heat dissipation module of the present invention, the fifth embodiment of the heat dissipation module 19557 17 J307179 'The embodiment does not include a cross-sectional view of the connector; the 11A and 11B are the application of the sixth embodiment of the heat-dissipating module of the present invention, and the stereoscopic and cross-sectional views are not intended; and the 12A and 12B drawings are the present invention. A perspective view and a cross-sectional view of a seventh embodiment of a heat dissipation module of a light-emitting element. [Description of main components] 11, 12 legs 110 racks ^ 120 racks 121 racks 13 illuminating wafers 14 soldering wires 15 sealing 21 brackets 211 conductive pins > 212 structural support 22 wafer heat-conducting carrier 23 illuminating wafer 25 Package 26 Printed Circuit Board 300 Light Emitting Diode Package 302 Positioning Groove '310 Light Emitting Chip - 316 Heat Sink 18 19557 1307179 360 Optical Element 370 Printed Circuit Board 40 LED Package 41 Support 410 Bowl 42 Heatsink 43 electrode terminal 44 light-emitting chip 45 bonding wire 46 printed circuit board 47 metal shell 470 axially extending slot 48 surrounding body 480 light concentrated portion 51 light-emitting element I 511 light-emitting unit 512 conductive member 513 metal plate 513a carrying portion 513b heat-dissipating portion 513b , upper convex portion 514 light transmitting body, 514a light collecting portion - 52 heat sink 19 19557 1307179 521 upper surface 522 lower surface 523 opening 53 outer substrate 61 light emitting element 611 light emitting unit 613 metal plate 613b, upper convex portion 62 front Heat sink 621 upper surface 622 lower surface 71 light-emitting element 712 conductive member 713 metal plate 713b, upper convex portion 72 heat sink 73 circuit board 811 light emitting unit 813 metal plate 813a bearing portion 813b heat radiating portion 813b, upper convex portion '91 light emitting element 912 conductive member -1307179 913 metal plate 92 heat sink 94 connector 101 light Element 1012 Conductive member 1013 Metal plate 102 Light reflecting cover 103 Heat sink 104 Power connector 111 Light-emitting element 1112 Conductive member 1113 Metal plate 1114 Light-transmitting body 112 Light-reflecting cover 113 Heat sink 114 Power connector