TWI360623B - Light emitted module, its reflective cover and ass - Google Patents

Description

1360623 IX. Description of the Invention: [Technical Field] The present invention relates to a light-emitting module, and more particularly to a light-emitting module having a heat-dissipating function and a manufacturing method thereof. [Prior Art] The well-known Light Emitted Diode (LED) has the characteristics of local brightness and small volume, and can be set in various current-carrying

In the device, the combination of electrons and holes is used to emit photons, and the brightness is higher than that of the conventional bulbs in the incandescent state. Since the past LEDs are only used for status indication, it is not necessary to consider the heat dissipation design after packaging. However, in recent years, the LED unit is applied to the backlight source of the liquid crystal display, and the LED unit needs a sufficient amount. The light-emitting diode chip is provided to provide sufficient illumination brightness. In addition, the brightness and power of these light-emitting one-pole wafers are greatly improved, and relatively high-temperature heat is released. I* At this time, if there is no suitable heat-dissipating design, the light-emitting diodes generate high heat together when emitting light. The life of the light-emitting diode is reduced and the brightness is attenuated. Therefore, the manufacturer has a heat-dissipating pad on the package structure of the light-emitting diode unit, and is equipped with a metal core printed circuit board. Referring to the McpcB circuit board, the high heat generated by the LED unit is conducted by the contact of the heat dissipation pad with the circuit board. However, the aforementioned thermal pad has limited heat transfer efficiency, and the thermal pad and MCPCB circuit board increase the cost of the total material. Therefore, the industry still maintains a lower cost but high efficiency heat dissipation design to reduce the total material cost and improve heat transfer. SUMMARY OF THE INVENTION It is an object of the present invention to provide a simple heat dissipation design that reduces the complexity of the heat dissipation structure of a light emitting diode unit. Another object of the present invention is to increase the heat dissipation surface of the light emitting diode unit

The product is used to improve the heat dissipation efficiency of the light-emitting diode unit, thereby maintaining the average life of the light-emitting diode unit. Still another object of the present invention is to reduce the material cost of the heat dissipation structure of the light emitting diode unit. According to the above object, the present invention provides a light-emitting module having a heat-dissipating function, which comprises a light-emitting diode unit, a heat sink and a circuit board. The light-emitting diode unit is located on the circuit board and has at least a heat-conducting pin. The heat sink has a break. The light emitting diode unit contacts the first surface of the heat sink while

The heat-conductive folding foot-end portion protrudes from the break and f-folds to contact the second surface of the heat sink. Based on the above description, the present invention will disclose embodiments of two types of lighting modules to further clarify the technical features of the present invention. In a first embodiment of the present invention, the light emitting diode unit may be a side-emitting type light emitting diode package module. The heat sink is a reflector, and the - u-shaped body has an open receiving space and a protruding portion, and the inner surface of the protruding portion (four) body. The light emitting diode unit is disposed in the accommodating space of the reflector to contact the protruding portion. The inner surface of the above-mentioned first-table (four) 6 1360623, the second surface is the outer surface of the u-shaped body. The breach in the first embodiment is formed by the upper end edge of the upper body of the υ-shaped body toward (4)% of the body. The other break in the first embodiment is located at the upper end of the upper end of the U-shaped body, and the rising portion of the upper portion and the rising portion of the first embodiment is disposed at the upper end of the U-shaped body, and the other side is adjacent to the convex portion. unit. In this way, the high temperature emitted by the side-emitting type of the LED unit can be simultaneously applied to the two bodies of the heat-transfer leg and the light-emitting diode unit to achieve rapid heat dissipation. Conducted to υ _ 纟 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The heat sink can be a flat plate body, such that the side of the light-emitting diode unit with the thermal conductivity can contact the first surface of the flat plate body. In the first embodiment, the first surface and the second surface are respectively located on two corresponding sides of the planar plate body, so that the heat conductive folding foot can protrude beyond the opening ‘ and bendly contact the second surface of the planar plate body. In addition, the heat sink and the light-emitting diode unit further comprise a loose glue 'body' heat-dissipating gel not only can fill the gap between the heat sink and the light-emitting diode unit, but also increase the contact between the heat sink and the light-emitting diode unit. The area increases the heat transfer efficiency of the heat sink. π The invention can connect the heat sink fins, the heat pipe or the metal back plate to the heat sink, and the like, so that the high heat added by the light emitting diode unit can be quickly transmitted, and the heat transfer efficiency of the two heat sinks is further improved. It is still another object of the present invention to provide a simple heat dissipation design of a light emitting diode unit that reduces the complexity of the heat dissipation structure with which the light emitting diode unit is coupled. 7 1360623 A reflective cover according to the present invention is provided for the purpose of placing the above-described light-emitting diode unit, the reflector comprising a u-shaped body, a projection and a reflective layer. The U-shaped body has an open accommodating space for arranging the illuminating diode unit, and a break is formed in the U-shaped body, and the rupture is formed for the above-mentioned heat-conducting folding foot to protrude and bendly contact the U-shaped body. The outer surface. The projection is located on the inner surface of the U-shaped body. The reflective layer is attached to all inner surfaces but excludes the position of the projections. The upper end edge of the upper end of the u-shaped body is provided with a rising portion, one side of the rising portion extends upwardly from the upper end of the U-shaped body, and the other side abuts the protruding portion, and the broken portion is located between the protruding portion and the rising portion. Another aspect of the present invention provides a method of assembling a light emitting module, the method comprising the steps of providing a side-emitting type of light emitting diode unit, wherein the light emitting diode unit has at least one heat conductive folding leg. A reflector is provided wherein at least one break is formed in the reflector. The light-emitting diode unit is fed into the reflector, and the light-emitting diode unit is in contact with one of the inner surfaces of the reflector and the heat-conductive folding legs of the light-emitting diode unit are protruded beyond the reflector. The heat-conductive folding leg outside the reflector is bent to contact one of the outer surfaces of the reflector. In another aspect of the present invention, in order to provide an assembly of a light-emitting module, the method includes the steps of: providing a surface-emitting diode unit, wherein the side of the photodiode unit has at least one heat-dissipating leg. Provide at least one :: hot: where the heat sink is already open at least - broken. The heat sink, = light: the polar body unit until the light emitting diode unit contacts the heat sink a η surface and the heat conductive folding foot protrudes. The freshening foot outside the heat sink is bent to contact a second surface of the heat sink, wherein the first surface and the second surface of the first surface are respectively located on two corresponding sides of the heat dissipation month. [Embodiment] The present invention discloses a light-emitting module having a heat-dissipating function and an assembly method thereof. Please refer to FIG. 1 , and FIG. 1 is a concept of the light-emitting module of the present invention. The lighting module of the present invention conceptually includes at least a light emitting diode unit 3, a heat sink 2, and a circuit board 6. The LED unit 3 is located on the circuit board 6 and electrically connected to the circuit board 6, and the LED unit 3 extends out of the at least one heat-dissipating leg 332. The heat sink 2 is provided with at least one break 21 (such as the second notch 217 of Fig. 1). The light-emitting diode unit 3 extends the heat-dissipating leg 332 out of the break 21, so that the light-emitting diode unit 3 can contact the first surface 201 of the heat sink 2 while extending one end of the heat-transfer leg 332 outside the break 21 The portion is bendably contacted with the second surface 2〇2 of the heat sink 2. Thus, the light emitting diode unit 3 itself contacts the first surface 2〇1 of the heat sink 2 and the heat conductive folding leg 332 of the light emitting diode unit 3 contacts the second surface 2〇2 of the heat sink 2 to increase the light emission. The surface area of the polar body unit 3 contacting the heat sink 2 is increased by Φ to improve the heat dissipation efficiency of the light-emitting diode unit 3, thereby maintaining the average life of the light-emitting diode unit 3, so as to improve the utilization ratio of the light-emitting diode unit 3. In the invention, please refer to FIG. 2A, and FIG. 2A is an exploded view of the light-emitting module of the present invention in the first embodiment. The light-emitting diode unit 3 is not limited to the type of the light-emitting diode unit 3, and may be, for example, a side-emitting type light-emitting diode package module or a surface-emitting type light-emitting diode package module. The light-emitting diode unit 3 of the present invention generally includes a package body 31, a heat-conducting sheet 9 1360623 331 and two electrical pins (not shown). The heat-conducting sheet 331 is located on one side of the package body and is connected to the heat-transfer fold. Feet 332. The package body 31 is embedded with a plurality of light-emitting devices. The diode chip 32 extends out of the electrical pin and is electrically connected to the circuit board. The illuminating diode chip 32 is used to provide sufficient illumination light. The illuminating diode chips 32 are preferably arranged in a single juxtaposition to form what is known as a LED Light Bar. However, the present invention does not limit the arrangement of the light-emitting diode chips 32. It is worth mentioning that the heat conductive sheet 331 is preferably integrally formed with the heat conductive folding foot 332 and the electrical pin on a lead frame (not shown in the figure). After the lead frame is formed, the heat conducting piece 331 and the electrical pin can respectively protrude from the outside of the package body 31, and the heat conducting piece 331 can be attached to the surface of the package body 31 after being bent, and at least one end portion of the heat conducting piece 33 can be The direction of the outside of the package body 31 is bent to form a heat conductive folding leg 332. The electrical pins can be electrically connected to the circuit board 6 after being bent. Referring to Figures 2 and 2, a second diagram is a cross-sectional view of the light-emitting module of the present invention in the first embodiment. In the first embodiment of the present invention, when the illuminating diode unit 3 is a side-emitting type LED package module 4 (referred to as the LED package module 4), the LED chip 32 faces to the side. The direction emits light, and the bottom surface thereof contacts the circuit board 6. The heat conducting piece 331 is located on the top surface of the side-emitting type LED package module 4, and the heat-dissipating leg 332 is bent from one end of the guiding piece 31 to the LED package module 4, so that the heat-dissipating leg 332 can be self-contained. The top surface of the side-emitting LED package module 4 protrudes in a direction facing away from the LED package module 4 . The number of the heat conductive folding legs 332 is not limited in this embodiment. When the number of the heat conductive folding legs 332 is 1360623, the heat conductive folding legs 332 can be parallel to each other (as shown in the figure).

See Fig. 2B, the heat sink 2 is a reflector 210 that reflects the light of the LED package module 4. The reflector 21 is attached to the body: mainly. The u-shaped body 211 has an open receiving space 2i2 and a protruding portion 213. The convex portion 213 is located on the inner surface of the u-shaped body 211 (ie, the first surface 2〇1 of the present invention), preferably is disposed on the inner surface of the upper end of the body 211, and generally the protruding portion 213 is for the u-shaped body 211. Made by stamping operations. The tU-shaped body 211 has a cross-sectional type (10) u-word opening, and its range can be expanded to a V, L, J or "U" shape, and the like, which has a function of reflecting light, is within the scope of the present invention. The first opening 217 can be located on the cutout portion 213 and the rising portion 214 at the same time. The rising portion 14 sighs at the upper end edge of the upper end of the U-shaped body 211, and the side thereof faces the υ-shaped body 2 i [extends above the upper end and the other side is adjacent to the protruding portion 2 丨 3 β when the LED package module 4 is located at the U-shaped body When the space 211 of the 211 is received, the heat-dissipating leg 332 of the LED package module 4 can be extended by the first notch 217, so that the heat-conducting sheet 331 of the LED package module 4 contacts the protruding portion 213 of the U-shaped body 211 and the heat-conductive folding leg. The 332 is bent to contact the outer surface of the u-shaped body 211. In this manner, in addition to the heat-dissipating leg 332 of the LED package module 4, the LED package module 4 can be fixed in the dome-shaped body 211, and the rising portion 214 can be used to limit the lED package module 4. mobile. However, the shape and size of the first notch 217 are not limited in the first embodiment as long as the heat-dissipating leg 332 can be extended. Then, the present invention discloses the side-emitting type of the light-emitting diode 11 package module of the first embodiment. The disk is reversed. # + 2Α图m图: The cover is installed, please refer to the same at the same time. The third embodiment of the present invention is a combination process of the light-emitting module of the present invention in the first embodiment. The main steps of the present invention include: y-step () providing a light-emitting diode package module 4 with a heat-conductive folding leg 332:

The LED sealing module 4 provided in the fourth step of the present invention has a heat-dissipating leg 332 which can be bent toward the upper side of the package according to the design of the lead frame. The step (3〇2) provides a U with a first notch 217. Reflector 210: The reflector 210 to be provided in this step is as described above, wherein the reflector 210 has been opened with at least a first notch 217. On the other hand, the π 217 on the reflector can be subjected to the above-described change order processing by means of infrared laser cutting. Step (3〇1) and step (3〇2) do not limit the order. Step (303), the LED package module 4 is sent into the reflector cover 21, and the heat conduction fold 332 is extended out of the reflector cover 21 through the first gap 217:

In this step, the LED package module 4 is sent into the accommodating space 212 of the u-shaped body 211, and when the thermal conductive sheet 331 contacts the protruding portion 213, the thermal conductive folding leg 332 of the LED package module 4 can directly pass through a notch 217 extends out of the reflector 2 1; the step (3〇4) bends the heat-transducing leg 332 outside the reflector 210 to contact the outer surface of the reflector 210: since the present invention utilizes bending The heat-dissipating leg 332 is used to fix the LED package module 4 in the u-shaped body 211. Therefore, in this step, the heat-dissipating leg 332 outside the reflector cover 21 is bent to contact the reflector cover 21 12 12 1360623 surface. In addition, the step (3〇2) is to make a 罝-土^ 01Λ, and the other steps of the 缺口-shaped reflection 214 of the younger notch 217 are steps (丨) one, (1) one hundred prior to the plane piece (the order is not A reflective layer 215 is attached to one side of the substrate.牛 i7) ¢, . . . , . v (1)) by means of infrared laser cutting, the pre-twisted position on the plane of the plane 011 (for example, the upper end edge of the self-shaped body 211 toward the υ-shaped body A hole breaking procedure is performed between the direction of the Λβ^ strand U or the position of the predetermined protrusion ^3 and the rising portion 214 to generate the first π 2^ step (iii) by means of a stamping procedure in the corresponding plane The sheet body is intended to contact the position of the LED package module 4, and a protruding button is punched out. And step (5) performing a -f folding process on the flat W body, so that the flat sheet body can form a U-shaped reflecting cover 21〇. The rising portion 214 is formed by folding the rising position of the position f of the flat sheet and the position f of the long: notch (1) when the step (iv) is performed, so that the rising portion 214 has a partial second gap. 217, after the 俟 is formed into the rising portion 214, the other portion of the planar sheet is bent and the reflecting portion of the slab is formed. ^ The reflective layer attached to the reflecting cover 210 is said to increase the radiant effect of the LED package rib 4. (9), in order to effectively enhance the heat transfer effect between the enamel package module 4 and the protruding portion 213, therefore, in the first embodiment, the position of the inner surface of the protruding portion 2USU-shaped body 211 can be prevented from being posted. A reflective layer 215 is provided. That is, the reflective layer 215 is attached to the inner surface of the u-shaped body (1) but excludes the position of the projection 213. The manufacturing method can be performed before the detailed step (1) of the step (302) is completed, and the material of the reflective layer 215 is removed for attaching to the planar sheet. The predetermined contact rib package module 13 is: the manufacturing method can be performed in the step (3). °2) Detailed step static (1) Using a high-temperature hot melt procedure to remove the flat sheet on the predetermined

The portion of the reflective layer 215 corresponding to the package module 4, such that the high temperature emitted by the LED module 4 can simultaneously conduct the u-shaped body 2 ιι via the heat-transfer leg and the heat-conducting sheet 331 to achieve rapid The effect of heat dissipation.

For a second embodiment of the present invention, please refer to FIG. 4A to FIG. 4C at the same time, and with FIG. 5, FIG. 4A to FIG. 4C are exploded, schematic, and side views of the light emitting module in the second embodiment. view. FIG. 5 is an exploded perspective view showing another variation of the light-emitting module of the present invention in the second embodiment. The illuminating _ polar body unit 3 is a one-side type LED package module and 5 (referred to as an LED package module). 5), the light-emitting diode chip 32 is emitted directly above (four), the bottom surface of the light-emitting diode chip 32 is in contact with the circuit board 6, and the heat-conducting sheet 331 is located on the side of the light-emitting diode package module 5, and the heat-conductive folding leg 332 is made of the heat-conductive sheet 331 The end is bent toward one side of the LED package module 5 such that the heat conductive fold 332 can extend in a direction facing one side of the LED package module 5. It should be noted that, in the second embodiment, the number of the heat conductive folding legs 332 is not limited. When the number of the heat conductive folding legs 332 is plural, the heat conductive folding legs 332 may be parallel to each other (as shown in FIG.

Due to the different designs of the lead frame, the heat conducting sheet 331 can be attached to the package body 31 according to different bending directions, and the heat conductive folding legs 332 bent on the heat conducting sheet 331 can also be short along the sealing body 31. The edge (as shown in Fig. 4A) or the direction of the long side (as in Fig. 5) extends outward, as long as it is convenient for each of the heat conduction folds 3 3 2 to protrude into the corresponding break 21 . 14 1360623 In this regard, please refer to FIG. 4A and FIG. 5 at the same time, the heat sink 2 can be only a flat plate body 220 or 22 〇, and the second notch on the flat plate body 22 恰 corresponds to and matches the 4A map. The heat conduction fold 332 in the middle. The flat plate body 22 〇, the third portion of the upper portion 222 corresponds to and matches the heat-conductive folding leg 332 in FIG. Then, please refer to FIG. 4A and FIG. 6 simultaneously. FIG. 6 is a combination flow chart of the light-emitting module of the present invention in the second embodiment, and the main steps thereof include: step (6〇1) providing a heat conduction Folding the foot of the face of the coffee-type package module 5: This step needs to provide the above-mentioned surface-emitting type LED package module 'the heat-conducting folding leg 332 can be led to the LED package module according to the design of the lead frame 5 is bent on one side; step (602) provides a planar plate 220 having a second notch 221 or a third notch 222: the planar plate 220 or 220 to be provided in this step is opened as described above There is at least a second notch 221 or a third notch 222. The second notch 221 or the third notch 222 can be processed by, for example, infrared laser cutting in accordance with the above changes. Step (601) and step (6〇2) do not limit the order. Step (603), the planar board 220 or 22 is closed, close to the LED package mold, and 5, until the LED package module 5 contacts the flat surface 220 or 220, the first surface 201' and the heat conductive folding leg 332 thereof The second notch 221 or the third notch 222 protrudes from the planar plate 220 or 220; the step (604) bends the planar plate 220 or 22〇, and the outer thermal conductive leg 15 1360623 332 'contacts the rear surface of the heat sink 2 LED package module surface 2〇2. In the second embodiment, the second surface 2 of the first surface 2〇1 is located on the two corresponding sides of the planar plate body 220 “220”. In the above embodiments, please refer to the second and eighth embodiments, in order to avoid the heat-dissipating sheet 33 of the first surface 201 and the light-emitting pole figure of the heat sink 2! 3 light diode unit to create a gap, heat sink 2 and hair can not only fill Li two body 2〇3, heat sink body 203, between the true heat breaking sheet 2 and the light emitting diode unit 3 to increase the heat sink 2 and the light-emitting diode unit 3 ' " sheet 2 heat transfer efficiency. The contact area 'increased heat dissipation. 2 when two light-emitting diode units 3 generate excessive heat, such as the heat sink 2 back The surface of the light-emitting diode unit 3 (for example, connected to the small-two second surface 2〇2) is insulated by heat conduction (not shown). The fin 204, the heat pipe 2〇5 or / With the metal back plate 2〇6 and the like: the high heat added by the diode unit 3 can be quickly transmitted to the heat transfer efficiency of the two heat sinks 2. The disclosed embodiments are not used in the above embodiments. The present invention is limited to those skilled in the art without departing from the spirit and scope of the present invention. The above-mentioned and other objects, features, and advantages of the present invention are more obvious. The detailed description of the drawings is as follows: 16 is a schematic diagram of a light-emitting module of the present invention. FIG. 2B is an exploded perspective view of the light-emitting module of the present invention in a first embodiment. FIG. 2B is a diagram showing a light-emitting module of the present invention. Figure 3 is a cross-sectional view showing the combination of the light-emitting module of the present invention in the first embodiment. Figure 4A is a schematic exploded view of the light-emitting module of the present invention in a second embodiment. 4 is a side view of the light-emitting module of the present invention in a second embodiment. FIG. 5 is a second side view of the light-emitting module of the present invention. FIG. 6 is a combined flow diagram of the light-emitting module of the present invention in the second example. [Main component symbol description] 1: Light-emitting module 2: heat sink 21: Broken 2〇1: first surface 215: reflective layer 220' 22 0': planar plate body 221: second notch 222: third notch 17 1360623 202: second surface 3: light-emitting diode unit 203: heat-dissipating gel 31: package 204: heat-dissipating fin 32: light-emitting diode chip 205: heat pipe 331: heat conductive sheet 206: metal back plate 332: heat conductive folding foot 2 1 0: reflector 4: side-emitting type light emitting diode package module 211: U-shaped body 5: surface-emitting type light Pole package module 212: open accommodating space 6: circuit board 213: bulging portion 301-304: step 214: rising portion 217: first notch 601-604: step 18

Claims (1)

Ten's patent application scope: 1. A lighting module with heat dissipation function, including: • 'circuit board; * political hot film with a broken opening; - light emitting diode unit, located on the circuit board, And contacting the first surface of the heat sink; and at least one heat-transfer foot on the light-emitting diode unit, the heat-radiating Lu foot protruding from the break and bendingly contacting the heat sink-- surface. 2. The light-emitting module of claim 1, wherein the light-emitting diode unit is a side-emitting type light-emitting diode package module having a bottom surface and a bottom surface, wherein the bottom surface contacts the circuit board, and The heat conductive folding foot protrudes from the top surface of the side-emitting LED package module. 3. The illuminating module of claim 2, wherein the heat sink is a reflective g hood. The reflector comprises: a U-shaped body having an open accommodating space, wherein the illuminating diode package module Located in the open accommodating space, the first surface is an inner surface of the U-shaped body, and the second surface is the same. The outer surface of the shaped body; and a projection on the inner surface and contacting the light emitting diode sealing module. 4. The lighting module of claim 3, wherein a reflective layer is attached to the inner surface of the u-shaped body and not at the position of the protruding portion. 5. The illuminating module of claim 3, wherein the upper end edge of the 本体-shaped body has a rising portion, one side of the rising portion is extended toward the upper end of the upper end of the 本体-shaped body, and the other side Adjacent to the protrusion, the break is located on the protrusion and the riser at the same time. Such as. The lighting module of item 3, wherein the protruding portion is formed by stamping the U-shaped body. The light-emitting module of claim 1, wherein the light-emitting diode unit: the light-emitting diode package module has a bottom surface and a side surface, wherein the bottom surface contacts the circuit board, and the heat-dissipating leg Extending from the side of the LED package. 8. If the request item board is the first corresponding side. The illuminating module of claim 7, wherein the heat sink is a plane surface and the second surface is located at two of the plane plates respectively, two = 3 -:;: r - 10, 苐 as β seeking 3 or The surface of the light-emitting module and the light-emitting diode unit further include a heat-dissipating gel of one of the heat-dissipating fins. The illuminating module of claim 1, wherein the illuminating diode unit comprises: a package on the circuit board, wherein the plurality of illuminating diode chips are present; The package body extends from one side of the package body and is connected to the heat conductive folding leg; and two electrical pins extend from the package body and are electrically connected to the circuit board. U. A reflector, suitable for placing a light emitting diode unit, the light emitting diode unit having at least one heat conductive folding leg, comprising: a U-shaped body having an open receiving space thereon and Providing a break, the open accommodating space is for placing the light emitting diode unit, the break is for the heat conductive folding foot to protrude and bendly contact an outer surface of the body; the protruding 邛 is located at the An inner surface of the u-shaped body for contacting the light-emitting diode unit; and a reflective layer attached to the inner surface and not at the position of the protruding portion. 13. The reflector of claim 12, wherein the upper end edge δ of the (four)-shaped body further has a rising portion, one side of the rising portion extends upwardly above the upper end of the dome-shaped body, and the other side abuts the protruding portion. The break is located at both the projection and the rise. 21 1360623 14. A method for assembling a light emitting module, comprising: providing a side-emitting type of light emitting diode unit, wherein the light emitting diode unit has at least one heat conductive folding leg; and providing a u-shaped reflecting cover, wherein the At least one break is opened on the reflector; the light emitting diode unit is sent into the reflector, and the light emitting unit is in contact with the inner surface of the reflector, and the light emitting diode unit The heat conductive folding foot protrudes outside the reflective cover through the break; and the heat conductive folding leg outside the reflective cover is bent to contact an outer surface of the reflective cover. The method of claim 14, wherein the reflecting cover is further provided: providing a piece of body; attaching a reflective layer to one side of the piece; and performing a hole breaking process on the piece; . By means of stamping, a protruding portion is punched out at a position corresponding to the predetermined contact of the light-emitting diode with the sheet body; and the sheet is folded into the U-shaped reflecting cover. The method of claim 15, wherein the affixing the reflective layer to one side of the sheet further comprises: removing the illuminating unit on the sheet by a warm-melting method. Corresponding partial reflection layer. The method of claim 15, wherein the reflecting layer is disposed in front of one of the sheets, the method further comprising: removing the reflective layer material for attaching to the sheet body to contact the light emitting diode unit Part. The method of claim 15, wherein when the sheet is bent into the dome-shaped reflector, the method further comprises: bending one of the ends of the sheet and corresponding to the position of the opening to bend The rising portion has a portion of the break; and the remaining portion of the sheet is bent into the U-shaped reflector. Iy: an assembly method of a light-emitting module with a heat-dissipating function, comprising: ... providing a surface-emitting type of light-emitting diode unit, wherein the light-emitting diode is earlier than the side-having at least one heat-transfer leg; a heat sink, wherein the heat sink has been opened with at least a broken 1::: the heat sheet is close to the side ' until the side contacts the heat sink. ^, and the heat conductive folding foot extends the break; and the bend Fold the 敎 敎 敎 Μ ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° The surface is located at the 23