CN101122747A - Slit coating apparatus - Google Patents
Slit coating apparatus Download PDFInfo
- Publication number
- CN101122747A CN101122747A CNA2007100976038A CN200710097603A CN101122747A CN 101122747 A CN101122747 A CN 101122747A CN A2007100976038 A CNA2007100976038 A CN A2007100976038A CN 200710097603 A CN200710097603 A CN 200710097603A CN 101122747 A CN101122747 A CN 101122747A
- Authority
- CN
- China
- Prior art keywords
- pressurizing block
- guide groove
- coating apparatus
- slit coating
- nozzle body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
- B05B1/30—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to control volume of flow, e.g. with adjustable passages
- B05B1/3033—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to control volume of flow, e.g. with adjustable passages the control being effected by relative coaxial longitudinal movement of the controlling element and the spray head
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Coating Apparatus (AREA)
Abstract
Description
Claims (5)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060075121 | 2006-08-09 | ||
KR10-2006-0075121 | 2006-08-09 | ||
KR1020060075121A KR100756563B1 (en) | 2006-08-09 | 2006-08-09 | Slit coating apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101122747A true CN101122747A (en) | 2008-02-13 |
CN101122747B CN101122747B (en) | 2010-08-11 |
Family
ID=38736904
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2007100976038A Active CN101122747B (en) | 2006-08-09 | 2007-04-20 | Slit coating apparatus |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR100756563B1 (en) |
CN (1) | CN101122747B (en) |
TW (1) | TWI322715B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115518828A (en) * | 2021-06-24 | 2022-12-27 | 株式会社斯库林集团 | Slit nozzle, method for adjusting slit nozzle, and substrate processing apparatus |
WO2023237452A1 (en) * | 2022-06-08 | 2023-12-14 | Carl Zeiss Smt Gmbh | Component for a projection exposure apparatus for semiconductor lithography and projection exposure apparatus |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100969358B1 (en) * | 2008-06-30 | 2010-07-09 | 주식회사 디엠에스 | Slit nozzle |
KR100987184B1 (en) | 2008-08-22 | 2010-10-11 | 주식회사 디엠에스 | Slit nozzle |
JP7054810B2 (en) * | 2019-04-01 | 2022-04-15 | パナソニックIpマネジメント株式会社 | Inkjet head |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100619399B1 (en) * | 2004-06-03 | 2006-09-08 | 동부일렉트로닉스 주식회사 | Apparatus for coating substrate with resist materials |
-
2006
- 2006-08-09 KR KR1020060075121A patent/KR100756563B1/en active IP Right Grant
-
2007
- 2007-04-20 CN CN2007100976038A patent/CN101122747B/en active Active
- 2007-04-24 TW TW096114381A patent/TWI322715B/en not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115518828A (en) * | 2021-06-24 | 2022-12-27 | 株式会社斯库林集团 | Slit nozzle, method for adjusting slit nozzle, and substrate processing apparatus |
WO2023237452A1 (en) * | 2022-06-08 | 2023-12-14 | Carl Zeiss Smt Gmbh | Component for a projection exposure apparatus for semiconductor lithography and projection exposure apparatus |
Also Published As
Publication number | Publication date |
---|---|
TW200808461A (en) | 2008-02-16 |
KR100756563B1 (en) | 2007-09-07 |
TWI322715B (en) | 2010-04-01 |
CN101122747B (en) | 2010-08-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: WEIHAI DIANMEISHI OPTO-MECHATRONICS CO., LTD. Effective date: 20140227 |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20140227 Address after: Gyeonggi Do, South Korea Patentee after: Display Production Service Co., Ltd. Patentee after: Weihai dianmei Shiguang electromechanical Co Ltd Address before: Gyeonggi Do, South Korea Patentee before: Display Production Service Co., Ltd. |
|
CP03 | Change of name, title or address | ||
CP03 | Change of name, title or address |
Address after: 264205 No. 88-1, Bekaert Road, Weihai Economic and Technological Development Zone, Weihai City, Shandong Province Patentee after: WEIHAI DMS OPTICAL ELECTROMECHANICAL Co.,Ltd. Patentee after: DMS Co.,Ltd. Address before: Gyeonggi Do, South Korea Patentee before: DMS Co.,Ltd. Patentee before: WEIHAI DMS OPTICAL ELECTROMECHANICAL Co.,Ltd. |