CN101102628B - 有机发光器件及其制造方法 - Google Patents
有机发光器件及其制造方法 Download PDFInfo
- Publication number
- CN101102628B CN101102628B CN2007101274598A CN200710127459A CN101102628B CN 101102628 B CN101102628 B CN 101102628B CN 2007101274598 A CN2007101274598 A CN 2007101274598A CN 200710127459 A CN200710127459 A CN 200710127459A CN 101102628 B CN101102628 B CN 101102628B
- Authority
- CN
- China
- Prior art keywords
- substrate
- organic light
- emitting device
- organic
- sealing layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 239000000758 substrate Substances 0.000 claims abstract description 134
- 238000005520 cutting process Methods 0.000 claims abstract description 17
- 238000000034 method Methods 0.000 claims description 32
- 239000000565 sealant Substances 0.000 claims description 32
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 238000000638 solvent extraction Methods 0.000 claims 8
- 238000007789 sealing Methods 0.000 abstract description 139
- 238000005336 cracking Methods 0.000 abstract description 13
- 239000010410 layer Substances 0.000 description 202
- 239000010408 film Substances 0.000 description 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 17
- 238000011156 evaluation Methods 0.000 description 14
- 230000000052 comparative effect Effects 0.000 description 12
- 150000002894 organic compounds Chemical class 0.000 description 12
- 230000006378 damage Effects 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 238000002834 transmittance Methods 0.000 description 7
- 239000007789 gas Substances 0.000 description 6
- 229910052581 Si3N4 Inorganic materials 0.000 description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 5
- 230000008859 change Effects 0.000 description 5
- 230000007797 corrosion Effects 0.000 description 5
- 238000005260 corrosion Methods 0.000 description 5
- 238000002955 isolation Methods 0.000 description 5
- 239000001301 oxygen Substances 0.000 description 5
- 229910052760 oxygen Inorganic materials 0.000 description 5
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 5
- 230000035882 stress Effects 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 230000008569 process Effects 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 230000002745 absorbent Effects 0.000 description 2
- 239000002250 absorbent Substances 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 239000007772 electrode material Substances 0.000 description 2
- 230000005525 hole transport Effects 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000012044 organic layer Substances 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 230000005283 ground state Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000005871 repellent Substances 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 230000003685 thermal hair damage Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006185784 | 2006-07-05 | ||
| JP2006-185784 | 2006-07-05 | ||
| JP2006185784 | 2006-07-05 | ||
| JP2007146707 | 2007-06-01 | ||
| JP2007146707A JP4869157B2 (ja) | 2006-07-05 | 2007-06-01 | 有機発光装置の製造方法 |
| JP2007-146707 | 2007-06-01 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101102628A CN101102628A (zh) | 2008-01-09 |
| CN101102628B true CN101102628B (zh) | 2010-06-09 |
Family
ID=39100757
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007101274598A Expired - Fee Related CN101102628B (zh) | 2006-07-05 | 2007-07-05 | 有机发光器件及其制造方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US7641531B2 (https=) |
| JP (1) | JP4869157B2 (https=) |
| KR (1) | KR100906716B1 (https=) |
| CN (1) | CN101102628B (https=) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4750727B2 (ja) * | 2006-03-28 | 2011-08-17 | キヤノン株式会社 | 有機発光装置及びその製造方法 |
| US7977867B2 (en) * | 2007-06-13 | 2011-07-12 | Canon Kabushiki Kaisha | Organic EL panel |
| JP5017584B2 (ja) * | 2007-08-02 | 2012-09-05 | 株式会社ジャパンディスプレイイースト | 有機el表示装置 |
| KR101621297B1 (ko) * | 2010-03-04 | 2016-05-16 | 엘지디스플레이 주식회사 | 유기전계 발광소자 |
| KR20120109081A (ko) | 2011-03-24 | 2012-10-08 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 |
| KR101801913B1 (ko) * | 2012-03-23 | 2017-11-28 | 삼성디스플레이 주식회사 | 유기 발광 디스플레이 장치와, 이의 제조 방법 |
| US9356256B2 (en) | 2013-07-31 | 2016-05-31 | Samsung Display Co., Ltd. | Flexible display device and manufacturing method thereof |
| JP2015072770A (ja) * | 2013-10-02 | 2015-04-16 | 株式会社ジャパンディスプレイ | 有機エレクトロルミネッセンス装置及びその製造方法 |
| CN104576688B (zh) | 2013-10-10 | 2018-11-09 | 精工爱普生株式会社 | 发光装置以及电子设备 |
| WO2017210092A1 (en) | 2016-06-01 | 2017-12-07 | Microvention, Inc. | Improved reinforced balloon catheter |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1662590A1 (en) * | 2004-11-25 | 2006-05-31 | Samsung SDI Co., Ltd. | Electroluminescent display device and method of manufacturing the same |
| US20060220550A1 (en) * | 2005-03-31 | 2006-10-05 | Sanyo Electric Co., Ltd. | Process of producing light emitting panel, process of producing display panel and display panel |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5257783A (en) | 1975-11-06 | 1977-05-12 | Toshiba Corp | Semiconductor wafer |
| JP3042192B2 (ja) * | 1992-07-29 | 2000-05-15 | 三星ダイヤモンド工業株式会社 | 貼り合せガラス基板の裁断方法及びその装置 |
| JP4222312B2 (ja) * | 1996-10-22 | 2009-02-12 | セイコーエプソン株式会社 | 液晶パネル用基板、液晶パネル及びそれを用いた電子機器並びに投射型表示装置 |
| JP2000258745A (ja) * | 1999-03-08 | 2000-09-22 | Optrex Corp | 液晶表示素子の製造方法 |
| JP4255187B2 (ja) * | 1999-10-22 | 2009-04-15 | スタンレー電気株式会社 | 有機el表示装置の製造方法および該方法により製造された有機el表示装置 |
| TWI226205B (en) | 2000-03-27 | 2005-01-01 | Semiconductor Energy Lab | Self-light emitting device and method of manufacturing the same |
| US6992439B2 (en) * | 2001-02-22 | 2006-01-31 | Semiconductor Energy Laboratory Co., Ltd. | Display device with sealing structure for protecting organic light emitting element |
| JP2002352951A (ja) * | 2001-05-24 | 2002-12-06 | Tohoku Pioneer Corp | 有機el表示パネル及びその製造方法 |
| JP2003181825A (ja) * | 2001-12-19 | 2003-07-02 | Sony Corp | 基板分断方法及び有機elディスプレイの製造方法 |
| JP2003255362A (ja) * | 2002-03-05 | 2003-09-10 | Citizen Watch Co Ltd | セルとその製造方法およびそのセルを用いた液晶光学素子 |
| JP2003282236A (ja) * | 2002-03-22 | 2003-10-03 | Nippon Seiki Co Ltd | 有機elパネル及びその製造方法 |
| KR100477745B1 (ko) * | 2002-05-23 | 2005-03-18 | 삼성에스디아이 주식회사 | 유기 전계발광 소자의 봉지방법 및 이를 이용하는 유기전계발광 패널 |
| JP2004303425A (ja) * | 2003-03-28 | 2004-10-28 | Tohoku Pioneer Corp | 有機elパネル及びその形成方法 |
| JP4533392B2 (ja) | 2006-03-22 | 2010-09-01 | キヤノン株式会社 | 有機発光装置 |
-
2007
- 2007-06-01 JP JP2007146707A patent/JP4869157B2/ja not_active Expired - Fee Related
- 2007-06-13 US US11/762,354 patent/US7641531B2/en not_active Expired - Fee Related
- 2007-07-04 KR KR1020070066891A patent/KR100906716B1/ko not_active Expired - Fee Related
- 2007-07-05 CN CN2007101274598A patent/CN101102628B/zh not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1662590A1 (en) * | 2004-11-25 | 2006-05-31 | Samsung SDI Co., Ltd. | Electroluminescent display device and method of manufacturing the same |
| US20060220550A1 (en) * | 2005-03-31 | 2006-10-05 | Sanyo Electric Co., Ltd. | Process of producing light emitting panel, process of producing display panel and display panel |
Also Published As
| Publication number | Publication date |
|---|---|
| US20080042559A1 (en) | 2008-02-21 |
| US7641531B2 (en) | 2010-01-05 |
| KR20080004385A (ko) | 2008-01-09 |
| CN101102628A (zh) | 2008-01-09 |
| KR100906716B1 (ko) | 2009-07-14 |
| JP4869157B2 (ja) | 2012-02-08 |
| JP2008034364A (ja) | 2008-02-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100609 Termination date: 20210705 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |