CN101090601A - Punching hole pad structure for circuit board and its hole punching method - Google Patents
Punching hole pad structure for circuit board and its hole punching method Download PDFInfo
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- CN101090601A CN101090601A CN 200610091873 CN200610091873A CN101090601A CN 101090601 A CN101090601 A CN 101090601A CN 200610091873 CN200610091873 CN 200610091873 CN 200610091873 A CN200610091873 A CN 200610091873A CN 101090601 A CN101090601 A CN 101090601A
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- hole
- circuit board
- hole punching
- die
- punching
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Abstract
This invention relates to a gasket structure used in punching hole or edge of CB or wafer load board and its method, before punching, which predesigns place of hole or edge on the insulation layer and prepares an elastic gasket material then punches the material as the beginning of punching hole or edge by a mechanical punching method and finishes the work.
Description
Technical field
This relates to the gasket construction on a kind of hole punching or die-cut limit and the method on hole punching or die-cut limit thereof, refers to that especially the present invention is used for the hole punching of circuit board or wafer carrier or gasket material structure and the hole punching or the die-cut limit method on die-cut limit.
Background technology
Circuit board or wafer carrier are divided into hard circuit board or wafer carrier and flexible circuit board or wafer carrier according to its pliability.The manufacturing process of one deck, two layers or multilayer circuit board or wafer carrier is to be parent material with the substrate, makes internal layer circuit earlier.This makes in internal layer circuit, must be via pre-treatment, that is go up steps such as photoresist, exposure, development, etching and removing photoresistance, and then form required circuit.Pass through then with melanism or brown processing procedure alligatoring copper surface, the now of increase and insulating resin is then with the film pressing.Machinery or laser hole punching or die-cut limit are then used in interlayer conduction hole between the ectonexine, again the conductive path through between electroplating process formation substrate.Circuit board skin after finishing circuit manufacture procedure is coated with anti-solder ink again, and when avoiding soldering of electronic components, scolding tin overflow to adjacent lines causes short circuit, and this also is isolated substrate and airborne aqueous vapor and oxidation.Be coated with circuit board or wafer carrier behind the anti-solder ink, according to actual requirement, done surperficial anti-oxidant treatment again, to strengthen Hangzhoupro, top layer oxidability.It is being become small pieces with the mode of side washing (routing) or the mode of die-cut (Punching).
In the above-mentioned processing procedure, mode with machinery die-cut (Punching), in the process on mechanical hole punching or die-cut limit, easily because impact the phenomenon that strength causes fragmentation or the small leafing of internal resin, and around in the hole or other machining positions present slight crack (Crack), white edge (haloing) on every side.
Summary of the invention
The present invention's main purpose provides a kind of hole punching (circular port, elongated hole or irregular hole) or the gasket construction on limit and method on hole punching or die-cut limit thereof that is used for circuit board or wafer carrier
Belong to the hole punching of liner material or the gasket material on die-cut limit by prior formation, and the impulsive force in buffer mechanism hole punching or the die-cut limit process, and then avoid slight crack, white edge to occur.
Based on above-mentioned purpose, the present invention is used for the hole punching of circuit board or wafer carrier or gasket construction and the hole punching or the die-cut limit method on die-cut limit, at having insulating barrier, fiberglass layer, layer made of paper, the circuit board of line layer or wafer carrier, all can be on its insulating barrier before carrying out hole punching or die-cut limit preboarding become the position of hole, form in advance and belong to the hole punching of elastic material or the gasket material on die-cut limit, begin hole punching or die-cut limit by mechanical hole punching or die-cut limit method by the gasket material on hole punching or die-cut limit, and actual predetermined hole or the die-cut limit of finishing.Because elastic force, cushioning effect that gasket material provided can be avoided in the process on mechanical hole punching or die-cut limit, cause circuit board or wafer carrier to have slight crack (Crack), white edge (haloing) to occur.
Advantage about the present invention can be further understood by following detailed Description Of The Invention and accompanying drawing with spirit.
Description of drawings
Figure 1A-1E is used for the enforcement schematic diagram of the method on the gasket construction on the hole punching of circuit board or wafer carrier or die-cut limit and hole punching or die-cut limit for the present invention.
Embodiment
See also Figure 1A-1E, Figure 1A-1E is used for the enforcement schematic diagram of the method on the gasket construction on the hole punching of circuit board or wafer carrier or die-cut limit and hole punching or die-cut limit for the present invention.Shown in Figure 1A, at first, the substrate 1 (being insulating barrier) that provides thickness to be about 0.8mm, and formation thickness is about the metal level 3 of 5-12 μ m on substrate 1.The material of substrate 1 is generally selected BismaleimideTriazine (BT) or other organic materials for use, even is ceramic material.
At the core substrate through hole 5 (be hole) of formation shown in Fig. 1 D before, preboarding becomes the position of core substrate through-hole 5 on the substrate 1 of insulating barrier, forms to belong to the hole punching of elastic material or the gasket material 4 on die-cut limit (can be dry film or the flexible material of other tools) shown in Figure 1B.Then, shown in Fig. 1 C,, and run through metal level 3 and substrate 1, form the core substrate through hole 5 (core through hole) that width is about 100-250 μ m, shown in Fig. 1 D with mechanical hole punching or die-cut limit 10 (only depicting its drift represents).Then, form material can be μ m electroplated metal layer 7 that copper and thickness is about 10-20 on the metal level 3 and core substrate through hole 5 sidewalls on, shown in Fig. 1 E.
Thus, in the hole punching or die-cut limit process on mechanical hole punching shown in Fig. 1 C or die-cut limit 10, because elasticity, cushioning effect hole punching or that limit gasket material 4 is provided can avoid circuit board or wafer carrier to have slight crack (crack), white edge (haloing) to occur.
No matter be substrate 1 or other insulating barrier, its material system is selected from a kind of material in the group that is made up of glass epoxide base resin, two maleic acid vinegar imines and epoxy resin.
In addition, be formed on the hole punching on the substrate 1 of edge layer or the gasket material 4 (preboarding becomes the position of core substrate through-hole 5) on die-cut limit, also can may not be certain only near hole for being formed on metal level 3 on a large scale.
By the detailed description of above preferred embodiment, hope can be known the feature and spirit of describing the present invention more, and is not to come the present invention's category is limited with above-mentioned disclosed preferred embodiment.On the contrary, its objective is that hope can contain in the category of claim of being arranged in of various changes and tool equality institute of the present invention desire application.
Claims (8)
1. hole punching gasket construction that is used for circuit board, this circuit board or wafer carrier comprise an insulating barrier, a fiberglass layer, a layer made of paper, a line layer at least, it is characterized in that the predetermined position that forms a hole has the hole punching that belongs to an elastic material or the gasket material on a die-cut limit on this insulating barrier.
2. the hole punching gasket construction that is used for circuit board as claimed in claim 1, wherein the material of this insulating barrier is selected from a kind of material in the group that is made up of glass epoxide base resin, two maleic acid vinegar imines and epoxy resin.
3. the hole punching gasket construction that is used for circuit board as claimed in claim 1, wherein this elastic material of the gasket material on this hole punching or this die-cut limit can be dry film and wet film.
4. the hole punching gasket construction that is used for circuit board as claimed in claim 1, wherein this hole can be blind hole or through hole.
5. hole punching method that is used for circuit board, this circuit board or wafer carrier comprise an insulating barrier, a fiberglass layer, a layer made of paper, a line layer at least, and this hole punching or die-cut limit method comprise: the gasket material that forms the hole punching that belongs to an elastic material or die-cut limit predetermined position that forms a hole to this insulating barrier; And
Go out this predetermined hole or die-cut limit with mechanical hole punching or die-cut limit by the gasket material on this hole punching or die-cut limit.
6. the hole punching method that is used for circuit board as claimed in claim 5, wherein the material of this insulating barrier is selected from a kind of material in the group that is made up of glass epoxide base resin, two maleic acid vinegar imines and epoxy resin.
7. the hole punching method that is used for circuit board as claimed in claim 5, wherein this elastic material of the gasket material circle on this hole punching or die-cut limit can be dry film and wet film.
8. the hole punching method that is used for circuit board as claimed in claim 5, wherein this hole can be blind hole or through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610091873 CN101090601A (en) | 2006-06-13 | 2006-06-13 | Punching hole pad structure for circuit board and its hole punching method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610091873 CN101090601A (en) | 2006-06-13 | 2006-06-13 | Punching hole pad structure for circuit board and its hole punching method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101090601A true CN101090601A (en) | 2007-12-19 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200610091873 Pending CN101090601A (en) | 2006-06-13 | 2006-06-13 | Punching hole pad structure for circuit board and its hole punching method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101090601A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102711392A (en) * | 2012-06-25 | 2012-10-03 | 广州美维电子有限公司 | Manufacturing method of flexible-rigid circuit board |
| CN103029171A (en) * | 2011-09-14 | 2013-04-10 | 苏州安洁科技股份有限公司 | Machining method for stamping thick hard material |
| CN103533760A (en) * | 2013-10-23 | 2014-01-22 | 广东生益科技股份有限公司 | Fabrication method of non-via holes in inner layer of multilayer PCB |
-
2006
- 2006-06-13 CN CN 200610091873 patent/CN101090601A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103029171A (en) * | 2011-09-14 | 2013-04-10 | 苏州安洁科技股份有限公司 | Machining method for stamping thick hard material |
| CN102711392A (en) * | 2012-06-25 | 2012-10-03 | 广州美维电子有限公司 | Manufacturing method of flexible-rigid circuit board |
| CN102711392B (en) * | 2012-06-25 | 2015-11-25 | 广州美维电子有限公司 | A kind of manufacture method of flexible and hard combined circuit board |
| CN103533760A (en) * | 2013-10-23 | 2014-01-22 | 广东生益科技股份有限公司 | Fabrication method of non-via holes in inner layer of multilayer PCB |
| CN103533760B (en) * | 2013-10-23 | 2016-08-17 | 广东生益科技股份有限公司 | Multi-layer PCB board internal layer is not turned on the preparation method in hole |
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