CN101089616A - Substrates support table and substrates examination device with same - Google Patents

Substrates support table and substrates examination device with same Download PDF

Info

Publication number
CN101089616A
CN101089616A CNA2007101108687A CN200710110868A CN101089616A CN 101089616 A CN101089616 A CN 101089616A CN A2007101108687 A CNA2007101108687 A CN A2007101108687A CN 200710110868 A CN200710110868 A CN 200710110868A CN 101089616 A CN101089616 A CN 101089616A
Authority
CN
China
Prior art keywords
substrate
camera
indenture
liner
inspecting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CNA2007101108687A
Other languages
Chinese (zh)
Other versions
CN101089616B (en
Inventor
崔裕灿
洪旋珠
朴珉镐
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SFA Engineering Corp
Original Assignee
SFA Engineering Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020060052916A external-priority patent/KR100797571B1/en
Priority claimed from KR1020060134764A external-priority patent/KR20070118939A/en
Priority claimed from KR1020070029577A external-priority patent/KR100837599B1/en
Application filed by SFA Engineering Corp filed Critical SFA Engineering Corp
Publication of CN101089616A publication Critical patent/CN101089616A/en
Application granted granted Critical
Publication of CN101089616B publication Critical patent/CN101089616B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/30Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
    • G01B11/306Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces for measuring evenness
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8851Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/89Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles
    • G01N21/892Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles characterised by the flaw, defect or object feature examined
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/89Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles
    • G01N21/892Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles characterised by the flaw, defect or object feature examined
    • G01N2021/8924Dents; Relief flaws

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Textile Engineering (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Signal Processing (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

The present invention discloses a substrate supporting table and a substrate examining device with the substrate supporting table. The substrate table includes the following components: a table, the top surface of which is stably installed with a substrate, the substrate becomes the examining goal, wherein it does dent checking and flaw checking to the TAB area which is connected with one side of the substrate; at least one dent checking camera which does photography to the TAB area in order to check whether a dent appears in the TAB; at least one flaw checking camera which does photography to the TAB area in order to check whether a flaw appears on the TAB area of the substrate; and a optic system moving unit which supports the dent checking camera and the flaw checking camera in order to move correspondingly relative to the table.

Description

Substrate support pedestal and inspecting substrate equipment with substrate support pedestal
Technical field
The present invention relates to a kind of substrate support pedestal and a kind of inspecting substrate equipment with described substrate support pedestal.More particularly, the present invention relates to a kind of substrate support pedestal and a kind of inspecting substrate equipment with described substrate support pedestal, it can be by improving checking efficiency and reducing the amount of production time (tact time) and improve throughput rate, and by preventing to need unnecessary peripheral unit, and by using single checkout facility jointly to carry out indenture inspection (dent inspection) and flaw detection (crackinspection) reduces work space and various loss.
Background technology
Substrate is the assembly of image display device.Substrate comprises semiconductor substrate and flat-panel monitor (FlatPanel Display, FPD) substrate.The FPD substrate comprises LCD (Liquid CrystalDisplay, LCD) substrate, Plasmia indicating panel (Plasma Display Panel, PDP) substrate, Organic Light Emitting Diode (Organic Light Emitting Diode, OLED) substrate and analog.
The LCD substrate will be described to the example of FPD substrate.The general manufacturing process of LCD is divided into TFT technology, cell process and module process.In described technology, module process be with various electronic packages be attached to the LCD substrate with completed knocked down products and the driver IC that will be used to drive the LCD substrate be attached to the technology of described LCD substrate.
In order to carry out this technology, in correlation technique, used the technology that directly lead-in wire of driver IC is installed to the LCD substrate.
Yet, because made recently and had high-resolution LCD product, so the driver IC that is difficult to have a large amount of lead-in wires is installed to the LCD substrate, and therefore use TAB (Tape AutomatedBonding, coil type engages automatically) usually as a kind of field engineering.
Specifically, (tape carrier package, TAB TCP) form figuratum band rather than lead frame by the centre driver IC to be engaged encapsulation technology that (hereinafter as " compression " and " attached ") arrives the LCD substrate to carry encapsulation as one type band.Yet TAB also represents to be attached to the correspondence position of LCD substrate so that form the band of signal wire or the whole zone of described band in the LCD substrate with compressing.In the following description, the latter is called as " TAB ".
Before TAB is attached to the LCD substrate, at first in the LCD substrate, use usually anisotropic conductive film (anisotropic conductive film, ACF).Anisotropic conductive film has the structure that is similar to double-sided belt (two-sided tape), and wherein bonding agent that will harden by heat and small conducting sphere are mixed with each other.This anisotropic conductive film is the material that uses in mounting process usually.
If anisotropic conductive film joins the LCD substrate in the corresponding position, TAB can be attached to the surface of anisotropic conductive film so.At this moment, the electrode pattern of the electrode pattern of TAB and LCD substrate need be attached to one another exactly.The conducting sphere that is used to make LCD substrate and TAB have electric conductivity also needs to locate exactly.
If anisotropic conductive film and TAB are attached to the LCD substrate, under the condition of high temperature, enough pressure is applied to LCD substrate and TAB so, make the liner of circuit pattern of LCD substrate and TAB contact with each other.At this moment, when the conducting sphere of contact site office in the anisotropic conductive film was destroyed, electric current flowed between two liners, and remaining bonding agent is filled in uneven surface rather than two liners, and sclerosis therein.In this way, the TAB attach process is finished.
After the TAB attach process is finished, the LCD substrate is carried out various inspections.For instance, carry out whether the indenture inspection is attached to the LCD substrate exactly with the electrode pattern of checking TAB electrode pattern, and whether the shape of conducting sphere and position are preferred, and carry out flaw detection to check when compressing TAB, whether occur the crack in the LCD substrate.
By convention, indenture inspection and flaw detection are carried out by indenture checkout facility and flaw detection equipment respectively.Indenture inspection and flaw detection have similar structure, are that indenture and crack all are examined in the TAB zone.
At first, will conventional indenture checkout facility be described.
Fig. 1 is the perspective schematic view of explanation according to the indenture checkout facility of correlation technique.
Referring to Fig. 1, comprise according to the indenture checkout facility 1 of correlation technique: area array cameras (areacamera) 10, it is taken a picture to the indenture inspection area; With platform 20, FPD substrate 5 is installed above.In FPD substrate 5, TAB 7a and 7b are attached to minor face 7a and long limit 7b.
Area array cameras 10 is fixed to the camera fixture (camera fixingdie) 50 in the indenture checkout facility 1, and is taken a picture in the indenture inspection area of the FPD substrate 5 that is attached with TAB 7a and 7b.Area array cameras 10 has automatic focus function, and when platform 20 moves at the interval of TAB 7a and 7b, can carry out the photograph and the inspection of precision by automatic focusing to the indenture image of indenture inspection area.For this purpose, area array cameras 19 is with respect to the plate surface direction (as by shown in the arrow Z) of FPD substrate 5 and vertical uplift and decline.
Platform 20 is provided above area array cameras 10, and becomes indenture and check that the FPD substrate 5 of target stably is installed on the end face of platform 20.The platform 20 that FPD substrate 5 stably is installed moves on two-dimensional directional (X and Y direction) as shown by arrows by independent driver element (not shown), and FPD substrate 5 is positioned at stationary plane array camera 10 tops.
1 pair of indenture checkout facility with structure mentioned above becomes the FPD substrate 5 execution indenture inspections that indenture is checked target.In general, indenture checkout facility 1 is carried out the indenture inspection at the zone of the TAB 7a of the minor face that is attached to FPD substrate 5, and then carries out the indenture inspection at the zone of the TAB 7b that is attached to long limit.
At first, in order to check the zone of the TAB 7a that is attached to minor face, platform 20 moves on by the direction shown in the arrow X linearly, makes area array cameras 10 take a picture to the indenture inspection area sequentially and check.After inspection was attached to the zone of TAB 7a of minor face, indenture checkout facility 1 was checked the inspection surface in the zone of the TAB 7b that is attached to long limit.In the case, platform 20 rotates on by the direction shown in the arrow theta, makes area array cameras 10 to take a picture to the indenture inspection area.
Simultaneously, when 10 pairs of area array cameras became indenture and check to take a picture in the zone of the TAB 7a of FPD substrate 5 of target and 7b, platform 20 repeated to move and stop.In this process, in order to obtain the image of indenture inspection area, area array cameras 10 also repeats automatic focusing, and it regulates focus together with FPD substrate 5.
As indicated above, have following structure according to the indenture checkout facility 1 of correlation technique: wherein platform 20 is with respect to stationary plane array camera 10 and mobile FPD substrate 5, and carries out the indenture inspection.The reason that platform 20 has to move is, although the automatic focusing following range of stationary plane array camera 10 at about 0.2mm in the scope of 0.8mm because handle and assembling process in error cause and can not keep automatic focusing following range.
With the flaw detection equipment of describing according to correlation technique.
Although do not illustrate among the figure, but it is opposite with indenture checkout facility 1 mentioned above, flaw detection equipment according to correlation technique has following structure: wherein when camera (not shown) is mobile under the fixing state of platform (not shown), flaw detection equipment inspection FPD substrate 5 corresponding to whether occurring the crack in the part in TAB zone.
Yet in correlation technique, although carry out indenture inspection and flaw detection in a similar fashion, platform and camera move with dissimilar.For this reason, can not be single checkout facility with indenture checkout facility and flaw detection equipment integration, checking efficiency reduces, and the increase of the amount of production time, and this has reduced throughput rate.In addition, owing to be necessary by using two checkout facilities to come moving substrate, thus need additionally provide unnecessary peripheral unit increasing work space, thus various losses caused.
In the indenture checkout facility of describing with reference to figure 11, owing to platform 20 moves, so equipment ratio and installation space increase according to correlation technique.After the interval of TAB 7a and 7b is moved and stopped platform 20, carry out focusing automatically once more, and carry out and check that this has increased the amount of production time.When the flatness of FPD substrate 5 because sinking (because cause that size increases) of FPD substrate 5 and when irregular, because the sinkage of FPD substrate 5 surpasses focusing following range automatically, so need to use function of search, this has reduced checking efficiency.
In the indenture checkout facility of describing with reference to figure 11 according to correlation technique, because area array cameras 10 is fixed to camera fixture 50, and the platform 20 of large-size moves, so equipment ratio and installation space increase.Two area array cameras 10 in addition, are fit to moving of platform 20, so only can be installed simultaneously owing to area array cameras 10 need be provided as.Therefore, be difficult to reduce the amount of production time.
Simultaneously, after the substrate support pedestal support of FPD substrate 5, carry out inspection by correspondence proving equipment.Will be with reference to figure 2 and 3 substrate support pedestal of describing according to correlation technique.Except that checkout facility mentioned above, when carrying out various technology mentioned above, can use the substrate support pedestal shown in Fig. 2 and 3.
Fig. 2 and 3 is explanation synoptic diagram according to the structure of the substrate support pedestal of correlation technique.
As shown in Figure 2, in substrate support pedestal, provide support a plurality of liners 30 and the 30a of substrate G1 and G2 regularly according to the example of correlation technique.Certainly, described a plurality of liner 30 and 30a are arranged to same intervals H1 away from each other.In the substrate support pedestal shown in Fig. 2, have (for example) 30 inches size small size substrate G1 and have that the large-size substrate G2 of size of (for example) 46 inches is common to use described.
Yet, when small size substrate G1 is installed on the substrate support pedestal shown in Fig. 2, and when supporting by substrate support pedestal, the limit of substrate G1 may with the liner 30a collision that is positioned at the place, both sides, and substrate G1 may damage.Specifically, because liner 30 and 30a be fixed on the substrate support pedestal shown in Fig. 2, so substrate support pedestal is difficult to stably support the substrate (not shown) with the different size except that 30 inches and 46 inches mentioned above.In order to use substrate (not shown) with the different size except that 30 inches and 46 inches, the substrate support pedestal corresponding to different size need be provided individually, this causes the loss in the technology.
Simultaneously, as shown in Figure 3, in substrate support pedestal, provide support a plurality of liners 40 and the 40a of substrate G3 according to another example of correlation technique.In liner 40 and 40a, central pad 40 is fixing, moves on by the direction shown in the arrow and be positioned at the liner 40a that locates on both sides.Under the situation of Fig. 3, owing to the liner 40a that is positioned at the place, both sides is removable, so except that substrate G1 shown in Fig. 2 and G2, can support the substrate G3 bigger effectively than the substrate G2 shown in Fig. 2.
Yet, when the liner 40a that is positioned at both sides places when moving to by the position shown in the dotted line by position shown in the solid line and supporting substrate G3, produce difference among interval H1 between liner 40 and the 40a and the H2.Specifically since navigate to both sides and move its position liner 40a near generation than large-spacing H2, so substrate G3 may be in the corresponding region excessive settlement.If substrate G3 excessive settlement under employed the situation, error may occur checking so in the checkout facility (referring to Fig. 1) of checking FPD substrate 5 (referring to Fig. 1).
Summary of the invention
The purpose of this invention is to provide a kind of substrate support pedestal and a kind of inspecting substrate equipment with described substrate support pedestal, it can improve throughput rate by improving checking efficiency and reducing the amount of production time, and by preventing to need unnecessary peripheral unit, and by using single checkout facility jointly to carry out the indenture inspection and flaw detection reduces work space and various loss.
According to another object of the present invention, a kind of substrate support pedestal and a kind of inspecting substrate equipment with described substrate support pedestal are provided, it can reduce to carry out the total amount that indenture is checked the required production time, and the automatic focusing of increase following range, even in the flatness of substrate because sinking (because cause that size increases) of substrate and also can carry out effective inspection when irregular, and reduce equipment ratio and installation space.
According to another target of the present invention, a kind of substrate support pedestal and a kind of inspecting substrate equipment with described substrate support pedestal are provided, it can reduce equipment ratio and installation space, and the respective surface with respect to substrate is installed camera, thereby has reduced to carry out the total amount that indenture is checked the required production time.
According to another target of the present invention, a kind of substrate support pedestal and a kind of inspecting substrate equipment with described substrate support pedestal are provided, it can stably support the substrate with various sizes, prevents that simultaneously substrate damage and supported substrate from sinking.
Additional advantage of the present invention, purpose and feature will partly state in following description content, and partly will become concerning the those skilled in the art after studying hereinafter obviously, and can learn by putting into practice the present invention.
According to a first aspect of the invention, provide a kind of inspecting substrate equipment, it comprises: the top platform that substrate stably is installed, and described substrate becomes the inspection target, wherein indenture inspection and flaw detection is carried out in the zone that is attached to described substrate TAB on one side; At least one indenture is checked camera, and it is taken a picture to the TAB zone, so that check whether occur indenture among the described TAB; At least one flaw detection camera, it is taken a picture to the TAB zone, so that the crack whether occurs in the TAB zone of inspection substrate; With the optical system mobile unit, it supports described indenture and checks camera and described flaw detection camera, so that relatively move with respect to described.
According to a second aspect of the invention, provide a kind of inspecting substrate equipment, it comprises: the top platform that substrate stably is installed, and described substrate becomes the inspection target, wherein indenture inspection and flaw detection is carried out in the zone that is attached to described substrate TAB on one side; At least one camera, take a picture in its indenture inspection area to substrate; The optical system mobile unit, it is coupled to described camera and with respect to described and relatively moves described camera; At least one displacement transducer, it measures the displacement of substrate; And control module, it controls moving of camera on the basis of the information that is obtained by displacement transducer.
According to a third aspect of the invention we, a kind of inspecting substrate equipment is provided, it comprises: the top fixed station that substrate stably is installed, described substrate becomes indenture and checks target, wherein the indenture inspection is carried out in the zone that is attached to described substrate TAB on one side, described fixed station is fixedly mounted in the precalculated position; At least one camera, take a picture in its indenture inspection area to substrate; With the optical system mobile unit, it is coupled to described camera, and relatively moves described camera with respect to fixed station, makes camera take a picture to the indenture inspection area of the substrate on the fixed station.
According to a forth aspect of the invention, provide a kind of substrate support pedestal, it comprises: a plurality of liners, its supporting substrate; With mobile support section, it supports described a plurality of liner movably, makes described a plurality of liner closer to each other and with rule at interval away from each other.
Description of drawings
Read following detailed description in conjunction with the drawings, above and other objects of the present invention, feature and advantage will be more obvious, wherein:
Fig. 1 is the perspective schematic view of explanation according to the indenture checkout facility of the example of correlation technique.
Fig. 2 and 3 is explanation synoptic diagram according to the structure of the substrate support pedestal of correlation technique.
Fig. 4 is the skeleton view of explanation inspecting substrate equipment of first one exemplary embodiment according to the present invention.
Fig. 5 is the skeleton view that the explanation substrate stably is installed in the state on the platform of the inspecting substrate equipment shown in Fig. 4.
Fig. 6 is the planimetric map of Fig. 5.
Fig. 7 is the part enlarged drawing of Fig. 6.
Fig. 8 is the schematic side elevational view of Fig. 7.
Fig. 9 is the controlling party block diagram of the support checkout facility shown in Fig. 4.
Figure 10 is the schematic block diagram of explanation inspecting substrate equipment of second one exemplary embodiment according to the present invention.
Figure 11 is the perspective schematic view of explanation inspecting substrate equipment shown in Figure 10.
Figure 12 is the enlarged perspective of the main element of the inspecting substrate equipment shown in explanation Figure 11.
Figure 13 is the figure of the operation of the inspecting substrate equipment shown in explanation Figure 10.
Figure 14 is the perspective schematic view of explanation inspecting substrate equipment of the 3rd one exemplary embodiment according to the present invention.
Figure 15 and 16 is skeleton views of explanation inspecting substrate equipment of the 4th one exemplary embodiment according to the present invention.
Figure 17 and 18 is planimetric maps of the inspecting substrate equipment shown in Figure 15 and 16.
Figure 19 is the skeleton view of explanation inspecting substrate platform of the 5th one exemplary embodiment according to the present invention.
Figure 20 and 21 is skeleton views of explanation substrate support pedestal of the 6th one exemplary embodiment according to the present invention.
Figure 22 and 23 is planimetric maps of the substrate support pedestal of the 7th one exemplary embodiment according to the present invention.
Embodiment
Hereinafter, with preferred embodiments of the present invention will be described in detail with reference to the annexed drawings.By with reference to the embodiment that treats to describe in detail referring to accompanying drawing, aspect of the present invention and feature and be used to realize that the method for described aspect and feature will become obvious.Yet, the embodiment that the present invention is not limited to hereinafter to be disclosed, but can multi-formly implement.Describe the content (for example detailed construction and element) that is defined in the content and just be provided to auxiliary those skilled in the art's complete understanding specific detail of the present invention, and the present invention only defines within the scope of the appended claims.In whole description content of the present invention, in each figure, identical referenced drawings label is used for components identical all the time.
For the purpose of reference, hereinafter the substrate of describing is meaned LCD (LCD) substrate, PDP (Plasmia indicating panel) substrate and OLED (Organic Light Emitting Diode) substrate.Yet for the ease of explaination, substrate mentioned above is called as FPD (flat-panel monitor) substrate.
In addition, for the ease of explaination, each of TAB and optical system mobile unit is represented by different reference numbers in each position, and camera is represented by same reference number.
Fig. 4 is the skeleton view of explanation inspecting substrate equipment of first one exemplary embodiment according to the present invention, Fig. 5 is the skeleton view that the explanation substrate stably is installed in the state on the platform of the inspecting substrate equipment shown in Fig. 4, Fig. 6 is the planimetric map of Fig. 5, Fig. 7 is the part enlarged drawing of Fig. 5, Fig. 8 is the schematic side elevational view of Fig. 7, and Fig. 9 is the controlling party block diagram of the inspecting substrate equipment shown in Fig. 4.
As shown in FIG., the inspecting substrate equipment 101 of first one exemplary embodiment comprises checkout facility main body 110 according to the present invention; Platform 120, it is provided in the checkout facility main body 110 and the top FDP substrate 105 (examine) that stably is equipped with; Optical system mobile unit 130, it is coupled to the top of checkout facility main body 110, and support hereinafter the indenture of describing is checked camera 140 and flaw detection camera 150, make indenture check that camera 140 and flaw detection camera 150 move in the horizontal direction, and rise and descend; Indenture is checked camera 140, and it checks when optical system mobile unit 130 moves whether the TAB 107a that is provided in the FPD substrate 105 has indenture to 107c; Flaw detection camera 105, whether what it checked FPD substrate 105 occurs the crack corresponding to TAB 107a in the part in the zone of 107c; Displacement transducer 160, it measures the displacement between indenture inspection camera 140 and flaw detection camera 150 and the FDP substrate 105; With control module 170, its control indenture on the basis of the information that displacement transducer 160 obtains is checked moving of camera 140 and flaw detection camera 150.
Checkout facility main body 110 is the parts that form the outside of the inspecting substrate equipment 101 of first one exemplary embodiment according to the present invention.In some cases, checkout facility main body 110 can be described as the inspection worktable.Referring to accompanying drawing, only checkout facility main body 110 is depicted as box-like shape for the ease of explaination.
Therefore, can below checkout facility main body 110, provide wheel (not shown), and can in checkout facility main body 110, be provided for a succession of mechanical hook-up of operating optical system mobile unit 130 with mobile checkout facility main body 110.Yet, with the detailed description of omitting above device.In addition, can be provided for showing the monitor (not shown) of a succession of checking process on one side in checkout facility main body 110.
Platform 120 is coupled to the top of checkout facility main body 110, and supports FPD substrate 105, makes the FPD substrate 105 of examine stably be installed on the end face of platform 120.As shown in FIG., platform 120 can form the shape of the rectangular slab with predetermined thickness, and is manufactured with the area littler than FPD substrate 105 usually.
Therefore, if FPD substrate 105 stably is installed on the end face of platform 120, the TAB 107a of examine may be exposed to platform 120 outsides to the zone of 107c so.Therefore, can check that the photograph of camera 140 and flaw detection camera 150 carries out indenture and the flaw detection to the zone of 107c to TAB107a by the indenture that is arranged on platform 120 belows.
For the purpose of reference, in the accompanying drawings, FPD substrate 105 is directly installed on the platform 120, but provides a plurality of jacking pins (not shown) usually on the end face of platform.Therefore, when FPD substrate 105 is loaded on the platform 120 by independent transfer robot, the bottom surface of rising of jacking pin and support FPD substrate 105.Then, if the jacking pin descends, FPD substrate 105 can be loaded on the end face of platform 120 so.When extracting FPD substrate 105, under the state that the jacking pin rises, extract FPD substrate 105.
Have the area bigger if platform 120 manufactured than FPD substrate 105, and FPD substrate 105 is loaded on the end face of platform 120, platform 120 need be formed by transparent material so, so that the TAB 107a of the FPD substrate 105 on the bottom surface of platform 120 is taken a picture to the zone of 107c.Yet, when platform 120 is formed by transparent material, can carry out flaw detection to a certain extent, and may be difficult to carry out exactly the indenture inspection.Therefore, as indicated above, preferably platform 120 is manufactured and have the area littler than FPD substrate 105.
Yet when platform 120 being manufactured when having than the big area of FPD substrate 105, FPD substrate 105 stably is installed on the end face of platform 1 20, makes TAB 107a be exposed to platform 120 outsides to the zone of 107c.In this way, indenture inspection camera 140 and flaw detection camera 150 can be taken a picture to FPD substrate 105 safely.
Certainly, platform 120 can have cylindrical shape, rectangular block shape and polygon mat shape.Yet in the case, after the FPD of costliness substrate 105 stably was installed on the end face of platform 120, FPD substrate 105 should not separate with platform 120 during checking process or fall from platform 120.Therefore, preferred platform 120 supports FPD substrate 105 with vacuum suction method or similar approach.
In this embodiment, inspecting substrate equipment 101 has following structure: wherein check camera 140 and flaw detection camera 150 with respect to fixed station 120 and when mobile when indenture, to the TAB 107a that stably is installed in the FPD substrate 105 on the platform 120 zone execution indenture and the flaw detection to 107c.Therefore, platform 120 coupling and be fixed to the top of checkout facility main body 110.
Yet, in the case, independent substrate transfer robot (not shown) need stably be installed in the FPD substrate 105 of examine the pre-position of the end face of platform 120, otherwise, can not take a picture to the zone of 107c to TAB 107a exactly along indenture inspection camera 140 and flaw detection camera 150 that optical system mobile unit 130 moves.That is to say that if FPD substrate 105 is not mounted in the pre-position of the end face of platform 120, indenture inspection camera 140 and flaw detection camera 150 can not be taken a picture to the zone of 107c to TAB 107a exactly so.
Therefore, platform 120 is manufactured fixing in fact, and platform 120 need be rotatably driven in the predetermined angle scope, makes that the FPD substrate 105 on the end face that stably is installed in platform 120 is aimed in the pre-position, and this is carried out by the platform rotary unit 122 that is provided at platform 120 belows.Certainly, when design, can omit platform rotary unit 122.
Thus because platform 120 is fixing in fact, so might reduce in according to the indenture checkout facility of correlation technique, to move described (not shown) required than the large equipment ratio with than the large equipment installing space.In addition, particle contamination that takes place when relatively large platform moves or the physical impact that is applied to FPD substrate 105 can prevent in advance that this from having promoted the improvement of productive rate.Yet the present invention is not limited thereto, and platform 120 is removable.When using translational table 120, can use the substrate support pedestal (not shown) of the 4th to the 7th one exemplary embodiment that to describe after a while according to the present invention.
Optical system mobile unit 130 is that indenture is checked camera 140 and flaw detection camera 150 and displacement transducer 160 part so as to supporting and moving.Optical system mobile unit 130 supports indenture and checks camera 140 and flaw detection camera 150, makes indenture check that camera 140 and flaw detection camera 150 can relatively move with respect to platform 120.
As indicated above, in inspecting substrate equipment 101, along with indenture is checked camera 140 and flaw detection camera 150 and moved and carry out indenture and flaw detection according to this embodiment.Optical system mobile unit 130 is responsible for mobile indenture and is checked camera 140 and flaw detection camera 150.
Optical system mobile unit 130 comprises: a plurality of horizontal component 131a are to 131c; The first vertical component 132a is to 132c, and it is coupled to described horizontal component 131a to 131c, and supports indenture movably and check camera 140 and displacement transducer 160; With the second vertical component 133a to 133c, its movably supporting crack check and to be independent of camera 150 the first vertical component 132a simultaneously and to move to 132c.
For the purpose of reference, because the size by the FPD substrate of checking according to the inspecting substrate equipment 101 of this embodiment 105 is bigger, so TAB 107a and 107b attached (compression also engages) are to two minor faces of FPD substrate 105, and a succession of TAB 107c is attached to a long limit of FPD substrate 105.That is to say that TAB 107a is attached to three limits except that another long limit of FPD substrate 105 to 107c.Therefore, provide optical system mobile unit 130, displacement transducer 160 and indenture check camera 140 and flaw detection camera 150 with corresponding to TAB 107a to 107c.
Horizontal component 131a is coupled to the top of checkout facility main body 110 to 131c, and is provided in three parts, so that corresponding to being formed at TAB 107a in the FPD substrate 105 to 107c.That is to say, provide two horizontal component 131a and 131b, and provide a horizontal component 131c with a long limit corresponding to FPD substrate 105 with two minor faces corresponding to FPD substrate 105.As shown in FIG., horizontal component 131a can be separated from one another to 131c, and can be integrated into " U " shape each other.
The first and second vertical component 132a are coupled to horizontal component 131a respectively to 131c to 132c and 133a to 133c.The first and second vertical component 132a can move to 131c along horizontal component 131a to one side of 133c to 132c and 133a, and it supports the displacement transducer 160 that corresponding indenture is checked camera 140 and flaw detection camera 150 and correspondence in the limit in addition.
At the first vertical component 132a to 132c and the second vertical component 133a between the 133c, support indenture and check that the first vertical component 132a of camera 140 and displacement transducer 160 can rise and descend to 132c on the corresponding position.That is, the first vertical component 132a rises and descends to 132c, make indenture check camera 140 can near and away from FPD substrate 105.Certainly, rising and step-down operation are by control module 170 controls.Referring to Figure 4 and 5, first vertical component of being represented by reference number 132a is in propradation, and first vertical component of being represented by reference number 132b and 132c is in the decline state.The first vertical component 132a can collinearity motion or telescopic sleeve structure rising and decline to 132c.
Different to 132c with the first vertical component 132a, the second vertical component 133a does not rise and descends to 133c.As mentioned below, because indenture checks that camera 140 only needs TAB 107a is taken a picture to the regional area of 107c, so that critically check and whether have indenture, so because the cause of automatic focusing or analogue, indenture checks that camera 140 need rise and descend with respect to FPD substrate 105.Yet, owing to flaw detection camera 150 need be taken a picture to the big zone of 107c to TAB 107a, so that check whether there is the crack, so flaw detection camera 150 need not rise and decline with respect to FPD substrate 105.
In addition, to 131c, the second vertical component 133a that flaw detection camera 150 is installed above checks the translational speed V2 (see figure 7) of the first vertical component 132a of camera 140 and displacement transducer 160 to 132c faster than the top indenture that is equipped with relatively to the translational speed V1 (see figure 7) of 133c at horizontal component 131a.Therefore, the second vertical component 133a is arranged on the front of the first vertical component 132a to 132c to 133c, and moves quickly to 132c than the first vertical component 132a.
Therefore, in a FPD substrate 105, in the 107c All Ranges, carry out flaw detection at TAB 107a.That is to say, be arranged on the first vertical component 132a to the 132c front and than the flaw detection camera 150 of the first vertical component 132a on by being installed on, in the All Ranges of 107c, carry out flaw detection at TAB 107a to the mobile quickly second vertical component 133a of 132c to 133c.
Yet, different with flaw detection, need precision and carry out the indenture inspection lentamente.For this reason, consider the amount that indenture is checked the required time of carrying out, in the All Ranges of 107c, do not carry out the indenture inspection at TAB 107a.That is to say, be arranged on the second vertical component 133a and check camera 140 to the indenture on the 132c by being installed on, carry out the indenture inspection in the subregion of zone, selecting from TAB 107a to 107c to the 133c back and more relatively slowly than the first vertical component 132a that the second vertical component 133a moves to 133c.
At the first and second vertical component 132a is not separated from one another to 132c and 133a to 133c but after integrated each other, indenture checks that camera 140 and flaw detection camera 150 and displacement transducer 160 can move together.Yet in the case, the amount of supervision time increases, and this has reduced productive rate.
Indenture checks that camera 140 is coupled to first vertical component 132a one side to the top of 132c.Indenture checks that the TAB 107a of 140 pairs of FPD substrates 105 of camera takes a picture to the zone of 107c, so that carry out the indenture inspection, described indenture inspection checks whether TAB 107a is attached to the electrode pattern of FPD substrate 105 exactly to the electrode pattern of 107c, and whether the shape of conducting sphere and position be accurate.As indicated above, indenture inspection camera 140 is only taken a picture to the regional area of 107c to TAB 107a, so that critically check indenture whether occurs.Referring to Fig. 7, narrower by the photo cover that indenture inspection camera 140 is taken a picture.
Flaw detection camera 150 is coupled to second vertical component 133a one side to the top of 133c, and when along corresponding horizontal component 131a when 133c moves, inspection FPD substrate 105 in the part in the zone of 107c whether the crack appears corresponding to TAB107a.
At this moment, different with the camera according to correlation technique, indenture checks that camera 140 and flaw detection camera 150 can be used as line scan camera.
As indicated above, in indenture and flaw detection equipment, when platform (not shown) repeatedly moves and stops, needing to use area array cameras for the purpose of focusing automatically according to correlation technique.Yet in this embodiment, indenture checks that camera 140 and flaw detection camera 150 can be moved by optical system mobile unit 130, and the translational speed of indenture inspection camera 140 and flaw detection camera 150 can individually be controlled by control module 170.Check at indenture under the situation of camera 140, owing to can carry out rising and the step-down operation that is used for focusing automatically, so can use line scan camera.
Thus, in the inspecting substrate equipment 101 that uses line scan camera, because indenture is checked the image that camera 140 and flaw detection camera 150 can obtain to exist in the moving area when mobile, so can carry out continuous and real-time inspection according to this embodiment.That is to say,, can obtain the image of relative high-resolution so if use line scan camera.Therefore, compare with flaw detection equipment according to the indenture of the area array cameras of correlation technique with use, the inspection precision can improve and check that area can increase, and it carries out continuous and real-time inspection.
For the purpose of reference, check the function that camera 140 and flaw detection camera 150 are carried out separately in order to make indenture, indenture checks that camera 140 and flaw detection camera 150 need possess a kind of structure, for example illumination or reflecting plate.Yet, because this structure is general camera structure, so will omit detailed description.
Simultaneously, the almost whole zone of the FPD substrate 105 that is supported by platform 120 is planes, but the flatness of FPD substrate 105 may be irregular, as by shown in the solid line among Fig. 8.
As shown in Figure 8, the flatness of FPD substrate 105 be not rule but under the irregular situation, take a picture to the zone of 107c if indenture is checked camera 140 and 150 couples of TAB 107a of flaw detection camera, be difficult to obtain clearly image so.Under the situation of flaw detection camera 150,, obtain clearly image and carry out flaw detection and neither be difficult to even when the flatness of FPD substrate is irregular.Yet, check at indenture under the situation of camera 140, need to carry out focusing automatically, so that obtain the image of knowing on the corresponding region.At this moment, when the flatness of FPD substrate 105 be not rule but when irregular, need the relatively large time of cost carry out automatic focusing, and therefore be difficult to reduce the production time.
Therefore, in this embodiment, check that at indenture the front of camera 140 provides displacement transducer 160, so that measure the displacement between indenture inspection camera 140 and the FPD substrate 105 in advance.Then, displacement transducer 160 will be about the information transmission of the displacement that measures to control module 170, and control module 170 is on the basis about the information of the displacement that measures, the indenture that driving is moved along optical system mobile unit 130 checks that camera 140 rises and decline (distance H among Fig. 8), make indenture check camera 140 can near and away from FPD substrate 105, this can significantly reduce the amount of required time of focusing automatically of carrying out.
Production type is provided detailed description.Before indenture inspection camera 140 moves or when indenture checks that camera 140 moves, displacement transducer 160 will check that to 107c and indenture the information transmission that the interval between the camera 140 obtain arrives control module 170 by measuring corresponding TAB 107a in advance.Before reaching the essence checkpoint, indenture checks that camera 140 can rise in advance and descend according to the control operation of control module 170.Therefore, the amount of carrying out the required time of focusing automatically reduces, and this has reduced the total amount of production time.In addition, might increase automatic focusing following range, even and in the flatness of FPD substrate 105 because sinking (because cause that size increases) of FPD substrate 105 and when irregular, also might carry out the indenture inspection effectively.
In addition, surpass under the situation of the automatic focusing following range in the correlation technique of using area array cameras in the amount that substrate sink, need to use function of search, this has increased the amount of production time.Yet, in this embodiment, check moving of camera 140 if on the basis of the information that obtains by displacement transducer 160, control indenture in advance, compare with correlation technique so, might increase automatic focusing following range.Therefore, even sinking of FPD substrate 105 because the cause that the size of FPD substrate 105 increases and when serious, also can carry out inspection in real time when carrying out automatic focusing, and need not independent function of search in preset range, this has reduced the amount of production time.
Certainly, can not be only by using optical system mobile unit 130 to realize focusing automatically safely with respect to indenture inspection camera 140.Yet, in the automatic focusing following range that can focus automatically, rising in advance and the decline indenture is checked after the camera 140, indenture checks that 140 pairs of corresponding regions of camera take a picture.In this way, might obtain clearly image, and significantly reduce the amount of production time.For the purpose of reference, when in structure, operating,,, can there be any problem even the following range of focusing automatically may become 4mm or bigger from experiment confirm according to this embodiment yet.
Be repeated in this description as mentioned, displacement transducer 160 is measured the displacement between indenture inspection camera 140 and the FPD substrate 105, and the result transmission that measures is arrived control module 170.Therefore, displacement transducer 160 preferred orientation are checked camera 140 fronts at indenture.Therefore, in this embodiment, check that at displacement transducer 160 and indenture camera 140 is installed under the state on the first vertical component 132a each in the 132c, displacement transducer 160 and indenture check that camera 140 moves together.Yet displacement transducer 160 not necessarily checks that with indenture camera 140 moves, and can individually move and operate.Laser sensor can be used as displacement transducer 160.
Check that at indenture camera 140 arrives TAB 107a to be taken a picture before the zone of 107c, control module 170 is prior from the information of displacement transducer 160 acquisitions about the flatness of FPD substrate 1 05, and controls the moving of indenture inspection camera 140 to the 131c and the first vertical component 132a to 132c by horizontal component 131a.
Specifically, can focus automatically to the regional executed in real time of 107c to TAB 107a in order to make indenture inspection camera 140, control module 170 control indentures are checked cameras 140, make indenture check camera 140 can be on optical system mobile unit 130 near and away from FPD substrate 105.In addition, in order to check the photograph operating period of camera 140 at indenture, acquisition is from the image in the whole zone of the mobile route of indenture inspection camera 140, and control module 170 control indentures check that cameras 140 move continuously.Certainly, the mobile independently flaw detection camera 150 of control module 170.
The operation and the function that hereinafter description are had the inspecting substrate equipment 101 of said structure.
At first, the FPD substrate 105 of examine stably is installed on the platform by independent mechanical arm.That is to say, when independent mechanical arm is loaded in FPD substrate 105 on the platform 120, the bottom surface of rising of jacking pin and support FPD substrate 105.Then, when the jacking pin descended, FPD substrate 105 can load and stably be installed on the end face of platform 120.Then, FPD substrate 105 can be aimed at by platform rotary unit 122.
Then, control module 170 control optical system mobile units 130 make indenture check that camera 140 and flaw detection camera 150 and displacement transducer 160 are removable.That is to say, be coupled to the first and second vertical component 132a and check that to the indenture of 133c camera 140 and displacement transducer 160 and flaw detection camera 150 move on by the direction shown in the arrow A among Fig. 4, B and the C along corresponding horizontal component 131a to 131c respectively to 132c and 133a.As indicated above, the second vertical component 133a that flaw detection camera 150 is installed in the above is equipped with indenture above and checks that the first vertical component 132a of camera 140 and displacement transducer 160 moves to 132c after 133c moves at first at a relatively high speed.
Because flaw detection camera 150 does not need to carry out independent automatic focusing operation, so flaw detection camera 150 can be to the whole zone execution flaw detection of TAB 107a to 107c when mobile at a relatively high speed.Yet, check at indenture under the situation of camera 140, at first, be positioned at indenture and check the displacement transducer 160 measurement indentures inspection cameras 140 of camera 140 fronts and the displacement between the FPD substrate 105, and measurement result is transferred to control module 170.On the basis of the displacement information that is transmitted, the control module 170 controls first vertical component 132a rises and descends to 132c.Therefore, can carry out under the situation of automatic focusing at indenture inspection camera 140, indenture checks that camera 140 TAB 107a to FPD substrate 105 on optical system mobile unit 130 takes a picture to the zone of 107c, so that carry out the indenture inspection.
Specifically, control operation according to control module 170, indenture check camera 140 and flaw detection camera 150 executive level continuously move and rising and descending motion in, TAB 107a to FPD substrate 105 takes a picture to the zone of 107c, move and need not to stop it, so just can realize real-time indenture and flaw detection.
In addition,, indenture only the correspondence position of each side of FPD substrate 105 is taken a picture, so might significantly reduce indenture inspection and the flaw detection amount of required time of carrying out because checking camera 140 and flaw detection camera 150.For the purpose of reference, owing to need cost about 5 seconds 32 inches FPD substrate 105 to be carried out indenture and flaw detection, so compare with correlation technique, the supervision time significantly reduces.Therefore, the amount of production time be can reduce, and can indenture and flaw detection be carried out all products.In addition, might be to sinking serious and the irregular FPD substrate execution of flatness inspection.
Thus, according to the present invention, owing to can jointly carry out indenture inspection and flaw detection by using single checkout facility, so can improve checking efficiency.In addition, can reduce the amount of production time, this has increased throughput rate.
In addition, owing to can prevent to need unnecessary peripheral unit, so can reduce work space.Therefore, compare, can reduce various losses with correlation technique.
For the purpose of reference, in this embodiment,, reduce 50% or more effect so might reach volume with inspecting substrate equipment because single inspecting substrate equipment jointly carries out indenture inspection and flaw detection.In this way, not only can reduce the volume of inspecting substrate equipment, and can reduce the space or the work space of installation base plate checkout facility.Therefore, also can significantly reduce to clean manufacturing cost.
Figure 10 is the schematic block diagram of explanation inspecting substrate equipment of second one exemplary embodiment according to the present invention, Figure 11 is the perspective schematic view of the inspecting substrate equipment shown in explanation Figure 10, Figure 12 is the enlarged perspective of the main element of the inspecting substrate equipment shown in explanation Figure 11, and Figure 13 is the figure of the operation of the inspecting substrate equipment shown in explanation Figure 10.Make description referring to Fig. 1 and Figure 10 to 13.
As shown in FIG., the inspecting substrate equipment 201 of second one exemplary embodiment comprises according to the present invention: platform 220, FPD substrate 205 are stably installed and are supported on the platform 220; Line scan camera 210, take a picture in its indenture inspection area to the FPD substrate 205 that TAB 207a is attached to; Displacement transducer 230, it is provided at the front of line scan camera 210; Optical system mobile unit 250, it moves to platform 220 1 sides with line scan camera 210; With control module 260, the moving of its control line scanning camera 210 is so that executed in real time is focused automatically.
As shown in Figure 10, in the inspecting substrate equipment 201 of second one exemplary embodiment according to the present invention, displacement transducer 230 obtains the information about the flatness that stably is installed in the FPD substrate 205 (examine) on the platform 220 that is fixed in the presumptive area in advance.On the basis of the information that obtains by displacement transducer 230, the moving of control module 260 control line scanning cameras 210, but make line scan camera 210 executed in real time focus automatically.
The line scan camera 210 that has said structure and be installed on the optical system mobile unit 250 can be carried out the indenture inspection when moving continuously in the indenture inspection area.Therefore,, compare, can reduce the amount of production time with the inspecting substrate equipment 1 (referring to Fig. 1) that platform 20 according to correlation technique moves according to this embodiment.In addition, can reduce equipment ratio and installation space.
Production type is described in detail.The displacement transducer 230 that is provided at the front surface portion front of line scan camera 210 transmits the information that obtains by the interval of measuring in advance between TAB 207a and the line scan camera 210, and before line scan camera 210 moves or when line scan camera 210 moves, described information transmission is arrived control module 260.Line scan camera 210 can rise before arriving the checkpoint and descend.Therefore, reduced and carried out the amount of required time of focusing automatically, this has reduced the total amount of production time.
In addition, owing to line scan camera 210 can rise and descend before arriving the checkpoint in advance, so might increase automatic focusing following range.Even in the flatness of FPD substrate 235 because sinking (because cause that the size of FPD substrate 235 increases) of FPD substrate 235 and when irregular, also can carry out effective inspection.
Simultaneously, the TAB 207a of FPD substrate 205 can all kinds be attached to each limit of FPD substrate 205.Yet in this embodiment, at first, only being attached on one side to TAB 207a, the FPD substrate 205 of (minor face) is described.
TAB 207a is being attached in the process of FPD substrate 205, inspecting substrate equipment 201 is checked the indenture that occurs in the anisotropic conductive film (not shown).Therefore, the image on the indenture inspection area that inspecting substrate equipment 201 extraction TAB 207a are attached to, and check the indenture image that is extracted.Inspecting substrate equipment 201 repeats these processes.
The platform 220 of inspecting substrate equipment 201 is stably installed FPD substrate 205, and wherein TAB 207a is attached to one side of FPD substrate 205 and becomes indenture and checks target.In this embodiment, as shown in FIG., platform 220 formed have the size littler, and the bottom surface of FPD substrate stably is installed on the end face of platform 220 than FPD substrate 205.At this moment, FPD substrate 205 is exposed in the zone of TAB 207a under the state of platform 220 outsides, stably is installed on the end face of platform 220.Specifically, under the state that jacking pin (not shown) in being provided at platform 220 rises, transfer robot (not shown) with FPD substrate 205 from the exterior guiding to the platform 220.At this moment, descend,, stably be installed on the platform 220 just FPD substrate 205 is exposed in the zone of TAB 207a under the state of platform 220 outsides so if support the jacking pin of the FPD substrate 205 that is guided.
Therefore, stably be installed in the FPD substrate 205 that makes the zone of TAB 207a be exposed to platform 220 outsides on the platform 220 and be arranged on the position that line scan camera 210 can easily be carried out inspection.
Because platform 220 is the parts that support the FPD substrate 205 of examine, so platform 220 not necessarily has the above-mentioned type.Therefore, platform 220 manufactured have cylindrical shape, square cylindrical shape or rectangular plate shape, and be exposed in the zone of the TAB of FPD substrate 205 207a under the state of platform 220 outsides FPD substrate 205 stably be installed.Like this, platform 220 can have various structures, as long as line scan camera 210 can be checked FPD substrate 205.
In addition, platform 220 can be through structure moving, but in this embodiment, platform 220 is provided as the precalculated position that is fixed to inspecting substrate equipment 201.
Thus, fixed station 220 can solve inspecting substrate equipment 1 (referring to Fig. 1) according to correlation technique and comprises and can go up the variety of issue that moves and take place during the platform 20 of rotation (θ) at two-dimensional directional (X and Y direction).
That is to say, owing in inspecting substrate equipment 1, go up mobile and rotation (θ) at two-dimensional directional (X and Y direction) according to the platform 20 of correlation technique, so because the cause that moves of platform 20, equipment ratio and installation space increase.Simultaneously, in this embodiment because platform 220 is relatively fixing, thus might reduce in the correlation technique owing to platform 20 move cause than the large equipment ratio with than the large equipment installing space.
In addition, because FPD substrate 205 stably is installed on the platform 220 and fixing in this way, so might reduce transfer table in the correlation technique 20 required auxiliary equipment and power consumption.In addition, might prevent when relatively large FPD substrate 205 from moving the particle contamination that takes place in advance or be applied to the physical impact of FPD substrate 205 that this promotes the improvement of productive rate.
Simultaneously, according to the present invention, both all can be used as camera line scan camera 210 and area array cameras (not shown).In this embodiment, line scan camera 210 is used as camera.
In general, line scan camera 210 is mainly used in regional area is taken a picture and scanned.In this embodiment, line scan camera 210 is provided as platform 220 belows that FPD substrate 205 (TAB 207a is attached to FPD substrate 205) stably is installed above being positioned at, and take a picture in 210 pairs of indenture inspection areas of line scan camera.
As indicated above, have to use area array cameras 10 when platform 20 repeats to move and stops, carrying out focusing operation automatically according to the inspecting substrate equipment 1 of correlation technique.Yet in this embodiment, line scan camera 210 can be by moving the optical system mobile unit of describing 250 after a while, and can be by the operation of focusing automatically of displacement transducer 230 executed in real time.Therefore, might use line scan camera 210.
Therefore, in inspecting substrate equipment 201 according to the use line scan camera 210 of this embodiment, because line scan camera 210 can obtain the image on the whole indenture inspection area when mobile, so might optionally carry out checking process to the desired zone of acquisition image.
Thus, if use line scan camera 210, can obtain the photographic image of relative high-resolution so, this compares with the inspecting substrate equipment 1 according to the use area array cameras 10 of correlation technique, has improved the width of checking precision and having increased the inspection area.
As indicated above, displacement transducer 230 is coupled to a side of the front surface of line scan camera 210.
Displacement between displacement or the line scan camera 210 that displacement transducer 230 is measured FPD substrates 205 and the FPD substrate 205 that becomes indenture inspection target.In this embodiment, although the shows in detail displacement transducer 230, but displacement transducer 230 is coupled to a side of the front surface portion of line scan camera 210, makes displacement transducer 230 integrated with line scan camera 210 on the moving direction of line scan camera 210 in fact.
As shown in Figure 12 and 13, the distance between displacement transducer 230 prior measurement FPD substrates 205 and the line scan camera 210 or the displacement of FPD substrate 205, make line scan camera 210 when move continuously the position of the Δ t that advanced, executed in real time is focused automatically.
Carry out automatically after platform 20 arrives the indenture inspection areas according to the area array cameras 10 of correlation technique and to focus, and according to the line scan camera 210 of this embodiment can continuous when mobile executed in real time focus automatically.
This reason is as follows.Because displacement transducer 230 is coupled to a side of the front surface portion of line scan camera 210, so displacement transducer 230 is measured the flatness of FPD substrate 205 in advance, and will arrive control module 260 about the information transmission of flatness, and moving of control module 260 control line scanning cameras 210, but make line scan camera 210 executed in real time focus automatically.
In addition, surpass at sinkage under the situation of automatic focusing following range of area array cameras 10, need to use function of search, and therefore increase the amount of production time according to the FPD substrate 5 (referring to Fig. 1) of correlation technique.Yet in this embodiment, control module 260 is on the basis of the information that is obtained by displacement transducer 230, and control line scanning camera 10 is mobile in advance, and this compares with correlation technique, has increased automatic focusing following range.
Therefore, even sinking because the cause that the size of FPD substrate 205 increases and when serious, also can carry out inspection when executed in real time is focused automatically, and need not independent function of search in preset range, this has reduced the amount of production time.
That is to say, because line scan camera 210 can be focused automatically by using displacement transducer 230 executed in real time, so compare with move inspecting substrate equipment 1 that and stop and after focusing automatically, carrying out inspection according to repeating of correlation technique, might carry out the indenture inspection at a relatively high speed continuously.Therefore, compare, can reduce the amount of production time, can prevent to occur sinking owing to product size increases in the product, and can improve the indenture checking efficiency with correlation technique.
The line scan camera 210 that displacement transducer 230 is coupled to is installed on the optical system mobile unit 250, so that mobile in fact.
Although shows in detail not, in this embodiment, optical system mobile unit 250 is provided at platform 220 belows and the indenture inspection area of the FPD substrate 205 that is attached to TAB 207a be arranged in parallel, so that allow linear movement.Therefore, use optical system mobile unit 250, line scan camera 210 can be carried out the indenture inspection in the continuous indenture inspection area that TAB 207a is attached to FPD substrate 205 when mobile.
In addition, optical system mobile unit 250 allows line scan camera 210 vertically to rise and descend according to the direction shown in the arrow Z among Figure 11 to 13.Therefore, on the basis of the information that is obtained by displacement transducer 230, line scan camera 210 is movable to a position, and described position can be carried out automatic focusing in advance in advance when vertical uplift and decline.
Control module 260 is provided, and moving of its control line scanning camera 210 makes line scan camera 210 to move by optical system mobile unit 250.
Control module 260 moves the basic upper control line scanning camera 210 of the information that is obtained by displacement transducer 230.That is to say, before line scan camera 210 arrives the indenture inspection area of FPD substrate 205, control module 260 is in advance from the information of displacement transducer 230 acquisitions about the flatness of the indenture inspection area of FPD substrate 205, and control line scanning camera 210 is mobile.
Therefore, moving of control module 260 may command line scan cameras 210 makes line scan camera 210 to carry out focusing automatically to the indenture inspection area of FPD substrate 205 in real time.In addition, control module 260 is portable cord scanning camera 210 continuously, so that when taking a picture by line scan camera 210, and the image on the whole zone of the mobile route of acquisition line scan camera 210.
Thus,, move linearly on the direction shown in the arrow X of line scan camera 210 in Figure 11 and 12, and move to the zone of the TAB 207a that becomes indenture inspection target continuously according to the control operation of control module 260.At this moment, according to the control operation of control module 260, line scan camera 210 rises and descend on by the direction shown in the arrow Z, and move to the inspection position in advance, thereby executed in real time is focused automatically on the basis of the information that is obtained by displacement transducer 230.
Therefore, line scan camera 210 continuous when mobile executed in real time focus automatically, and carry out the indenture inspection.Therefore, compare, can reduce the amount of production time, and can improve checking efficiency with the method that repeats to stop with moving and carry out inspection according to correlation technique.
The operation that now description is had the inspecting substrate equipment of said structure.
Hereinafter, will be referring to Figure 10 to 13, especially Figure 13 describes the operation of inspecting substrate equipment.
At first, become indenture and check that the FPD substrate 205 of target stably is installed on the platform 220 of inspecting substrate equipment 201.At this moment, be attached with the upwards setting of zone of the FPD substrate of TAB 207a.Therefore, when line scan camera 210 is positioned at platform 220 belows, might takes a picture to TAB 207a and extract its indenture image with indenture.
In the present invention, if it is also fixed thereon in this way that FPD substrate 205 stably is installed on the platform 220, compare with the inspecting substrate equipment 1 (referring to Fig. 1) that comprises transfer table 20 (referring to Fig. 1) so, can reduce equipment ratio and installation space according to correlation technique.In addition, as indicated above, might prevent particle contamination in advance or be applied to the physical impact of FPD substrate 205 that this has improved productive rate.
Thus, if FPD substrate 205 stably is installed on the platform 220, line scan camera 210 moves so, so that check that to becoming indenture the zone of TAB 207a of the FPD substrate 205 of target takes a picture.That is to say that line scan camera 210 moves by optical system mobile unit 250, makes line scan camera 210 be positioned at platform 220 belows, wherein platform 220 is installed FPD substrate 205, and the TAB 207a of indenture inspection area is attached to FPD substrate 205.
The line scan camera 210 that is arranged in the zone for the treatment of the TAB 207a that at first checks moves to the indenture inspection area on the basis of the information that is obtained by displacement transducer 230 in advance, and when executed in real time is focused automatically the first indenture image is taken a picture and scan.At this moment, displacement transducer 230 is coupled to a side of the front surface portion of line scan camera 210, with the displacement between the FPD substrate 205 of the position slotted line scanning camera 210 of the Δ t that advanced and examine.That is to say that displacement transducer 230 is measured in advance becomes the flatness that indenture is checked the FPD substrate 205 of target, make that line scan camera 210 can be carried out automatic focusing exactly before line scan camera 210 arrives the indenture inspection area.
In general, the less FPD substrate 205 of size is planes, as by shown in the dotted line among Figure 13.Yet under the situation of larger-size FPD substrate 205, even when FPD substrate 205 stably is installed on the platform 220, the part of FPD substrate 205 still can be sunk, as in by the FPD substrate 205S shown in the solid line.
Thus, when the flatness of FPD substrate 205 because sinking (because cause that size increases) of FPD substrate 205 and when irregular, in inspecting substrate equipment (referring to Fig. 1) according to correlation technique, the sinkage of FPD substrate 205 may surpass focusing following range automatically, and therefore may need to carry out function of search.Therefore, may increase the amount of production time.
Therefore, in order to solve the problems referred to above according to correlation technique, in the present invention, even when FPD substrate 205S sink owing to the cause of the size increase of inspecting substrate equipment 201, displacement transducer 230 is also measured the information about the flatness of FPD substrate 205S in advance, and it is transferred to control module 260.Then, control module 260 is portable cord scanning camera 210 in advance, so that increase focusing following range automatically.When line scan camera 210 moved, line scan camera 210 can take a picture to the indenture image when executed in real time is focused automatically and check.
Specifically, the line scan camera 210 shown in Figure 13 (A) receives the information about the flatness of the FPD substrate of the position of the Δ t that advanced from displacement transducer 230, and carries out focusing automatically in the reference position of optical system mobile unit 250.Line scan camera 210 shown in Figure 13 (B) receives indication from displacement transducer 230 information of the state that the FPD substrate 205S of position of Δ t is bent upwards of having advanced, and carries out automatically after optical system mobile unit 250 rises and focus.Line scan camera 210 shown in Figure 13 (C) receives indication from displacement transducer 230 information of the reclinate state of FPD substrate 205S of position of Δ t of having advanced, and carries out automatically after optical system mobile unit 250 descends and focus.
Thus, the displacement transducer 230 of a side that is coupled to the front surface portion of line scan camera 210 is positioned at mobile line scan camera 210 fronts, and obtains the information about the flatness of FPD substrate 205 and 205S in advance, and it is transferred to control module 260.Line scan camera 210 can executed in real time be focused when moving automatically.
Thus, use according to inspecting substrate equipment 201 of the present invention, might be when line scan camera 210 move, the indenture inspection is carried out in the zone of the TAB 207a of FPD substrate 205, and therefore platform 220 does not need to carry out complicated operations, for example moves and rotation.Therefore, compare with correlation technique, can reduce equipment ratio and installation space, this has reduced manufacturing cost.
In addition, line scan camera 210 can be carried out the operation of taking a picture when mobile continuous, makes that line scan camera 210 can be by obtaining to come executed in real time to focus automatically about the information of the flatness of FPD substrate 205 from displacement transducer 230 in advance.Therefore, might reduce and carry out the total amount that indenture is checked the required production time, and increase focusing following range automatically.Even in the flatness of FPD substrate 205 because sinking (because cause that size increases) of FPD substrate 205 and when irregular, also can focus automatically and check by executed in real time, and need not in preset range, to use function of search, this has improved checking efficiency generally.
Figure 14 is the perspective schematic view of explanation inspecting substrate equipment of the 3rd one exemplary embodiment according to the present invention.
To when paying close attention to the part different, the 3rd one exemplary embodiment be described with the part of second one exemplary embodiment.In the 3rd one exemplary embodiment, the element identical with second one exemplary embodiment represented by identical reference number, and different element is represented by the reference number that has added character " a ".
As shown in Figure 14, the inspecting substrate equipment 201a of the 3rd one exemplary embodiment comprises according to the present invention: optical system mobile unit (not shown), and it is configured to allow the linear movement on crisscross; Two line scan cameras 210 and 210a, it moves along the optical system mobile unit, promptly moves on X and Y direction; With two displacement transducers 230 and 230a.
Therefore, different with the inspecting substrate equipment 201 of the FPD substrate 205 that has an inspection surface (minor face) according to checking of second one exemplary embodiment, inspecting substrate equipment 201a according to the 3rd one exemplary embodiment stably is installed in FPD substrate 205a (examine) on the platform 220, and wherein TAB 207a and 207b are attached to two limits (minor face and long limit) of the examine of FPD substrate 205a; And inspection FPD substrate 205a.
In this structure, inspecting substrate equipment 201a can stably be installed in FPD substrate 205a (examine) on the platform 220, and wherein TAB 207a and 207b are attached to two limits (minor face and long limit) of the examine of FPD substrate 205a, and can check FPD substrate 205a.
In addition, inspecting substrate equipment 201a comprises two line scan cameras 210 and 210a and two displacement transducers 230 and 230a, and can check the zone of the TAB 207a that is attached to minor face simultaneously and be attached to the zone of the TAB 207b on long limit.
Therefore, except that effect, can check simultaneously that two are checked the surface, thereby improve inspection speed according to second one exemplary embodiment mentioned above.Therefore, compare, can reduce the amount of production time, and can improve checking efficiency with correlation technique.
Figure 15 and 16 is skeleton views of explanation substrate support pedestal of the 4th one exemplary embodiment according to the present invention, and Figure 17 and 18 is planimetric maps of the substrate support pedestal shown in Figure 15 and 16.
Substrate support pedestal shown in Figure 15 to 18 can be used in the aforesaid substrate checkout facility, or can use in the various device except that described inspecting substrate equipment, so that supporting substrate G.
As shown in Figure 15 to 18, comprise according to the substrate support pedestal of this embodiment: equipment body 301; A plurality of liners 310, its supporting substrate G; Mobile support unit 320, it supports described a plurality of liner 310 movably, makes described a plurality of liner 310 (referring to Figure 16 and 18) closer to each other or with rule at interval (referring to Figure 15 and 17) away from each other; And first and second guide rail 331 and 332.
Equipment body 301 is formation parts according to the outside of the substrate support pedestal of present embodiment.In the present embodiment, owing to only illustrate a plurality of liners 310, mobile support unit 320 and first and second guide rails 331 and 332 among the figure,, equipment body 301 illustrates so being parts.
Yet in fact, except that the assembly shown in the figure, equipment body 301 also systematically is coupled to peripheral unit.For instance, when substrate support pedestal according to the present invention is used in check system, can be further with on/lower unit or a left side/unit that moves right are coupled to equipment body 301.
A plurality of liners 310 are supporting substrate G by the bottom surface of supporting substrate G.Therefore, each of the liner 310 of contact substrate G is all preferably formed by the material that can not apply damage (for example cut) to the substrate G that is made by glass in fact.For instance, can make liner 310 by during aftertreatment, aluminum being carried out anodic oxidation.Like this, when making liner 310 by anode oxidation process, liner can not apply for example damage of cut to the substrate G that is made by glass.
For the purpose of reference, the anode oxidation method that is also referred to as the anodic oxidation coating processes is meant and is forming oxidation film on the metal surface so that prevent from constantly to carry out the technology of oxidation in air by oxide film.Anode oxidation method uses in various fields, but is extensive use of in aluminum, because aluminum has when oxidation because of the crackly characteristic of the cause of weaker materials.And in this embodiment, in the material of liner 310, use anode oxidation method.
Liner 310 shown in the figure is with " U " shape or stepped formation, but the present invention is not limited thereto.That is to say that liner 310 not necessarily has the structure shown in the figure.Be not that each is represented by reference number in the liner 310.When liner 310 forms the shape that has shown in the figure, might prevent that liner 310 is out of shape in the process that supports heavier relatively substrate G.
In this embodiment, the number of liner 310 is 12.Yet the present invention is not limited thereto, and the number of liner 310 can be greater than or less than 12.For the ease of explaination, suppose to provide as shown in FIG. 12 liners 310 to be described.
12 liners 310 can be divided into a pair of fixed-bearing 310a (i.e. two liners), two couples of driving liner 310b (four drive liner) and many to driven liner 310c (that is six driven liners).In the case, described fixed-bearing 310a is provided as located and be fixed in the central area, and drive the two ends that liner 310b are provided at 12 liners 310 two by two described two pairs.Described many driven liner 310c is provided at describedly driven between the liner 310b fixed-bearing 310a and described two pairs.
For following reason, can divide 12 liners 310 by said method.Fixed-bearing 310a is fixed on the corresponding position, and driven liner 310c moves under the state of driven liner 310c and driving liner 310b interlocking.
For the purpose of reference, in the drawings, with fixed-bearing 310a illustrate into area greater than driving liner 310b and driven liner 310c.In addition, among the fixed-bearing 310a each is arranged on from connect the dummy line that drives liner 310b and driven liner 310c to a lateral deviation from the position.Yet, because this structure only is an one exemplary embodiment, so the present invention is not limited thereto.That is to say that fixed-bearing 310a is arranged on and connects on the dummy line that drives liner 310b and driven liner 310c, and have equal area with driving liner 310b and driven liner 310c.
Described fixed-bearing 310a is connected to each other by fixed-bearing coupling part 312a, described two pairs drive the driving liner coupling part 312b of liner 310b by correspondence and are connected to each other, and described many driven liner 310c is connected to each other by the driven liner coupling part 312c of correspondence.Therefore, drive liner coupling part 312b and driven liner coupling part 312c (except the 312a of fixed-bearing coupling part) and drive liner 310b and how mobile driven liner 310c with two pairs.
Simultaneously, 12 liners 310 are at (referring to Figure 16 and 18) closer to each other with support the substrate (not shown) with different size when (referring to Figure 15 and 17) with regular spaced far each other.Thus, provide mobile support section 320 and first and second guide rails 331 and 332, make 12 liners 310 closer to each other and at interval away from each other with rule.
Mobile support section 320 partly links to 312c with above-mentioned liner coupling part 312a.Mobile support section 320 comprises a plurality of link part 323a and 323b, and described a plurality of link portions lease makings are provided with intersected with each other and closer to each other and away from each other; With a plurality of swivel pin part 325a and 325b, it is at the joining place of a plurality of link part 323a and 323b, and the integrally hinged a plurality of link part 323a and 323b and liner coupling part 312a of being coupled to are to 312c.
In this embodiment, a plurality of link part 323a and the 323b that forms mobile support section 320 is divided into a plurality of cell link 320a of group and 320b, it is independently of one another in left side and place, right side based on fixed-bearing coupling part 312a.As shown in Figure 15 to 18, two 320a of cell link group and 320b have same structure, and are symmetrical arranged (mainly referring to Figure 16).
The link part 323a and the 323b that form two 320a of cell link group and 320b have same unit length.Therefore, when two 320a of cell link group and 320b operation, a plurality of liners 310 can (referring to Figure 16 and 18) closer to each other and with same intervals H (referring to Figure 17) (referring to Figure 15 and 17) away from each other.
Swivel pin part 325a ' between a plurality of swivel pin part 325a that are fixed to fixed-bearing coupling part 312a and 325b and 325b ' formation reference point, two separate units link 320a of group and 320b move at described reference point place.In this embodiment, form the swivel pin part 325a ' of the reference point that two separate units link 320a of group and 320b move and 325b ' away from each other position formation (referring to Figure 16) on the 312a of fixed-bearing coupling part.
Simultaneously, a plurality of liners 310 according to the operation of mobile support section 320 and closer to each other and with same intervals H (referring to Figure 17) situation away from each other under, provide first and second guide rails 331 and 332 stably to guide moving of liner 310.
First guide rail 331 is coupled to two pairs and drives liner 310b, and guides described two pairs to drive moving of liner 310b, make two pairs drive liner 310b can be closer to each other at a plurality of liner 310 and direction away from each other on mobile.That is to say that as shown in Figure 15 and 16, two pairs drive liner 310b and can move along the longitudinal direction of first guide rail 331.At this moment, first guide rail 331 can further be coupled to driver element (not shown), described driver element drives two pairs independently and drives liner 310b, promptly drive two pairs and drive liner 310b, make link part 323a and 323b (referring to Figure 16 and 18) closer to each other and predetermined length (Figure 15 and 17) away from each other.
In addition, second guide rail 332 is coupled to many to driven liner 310c, and guides described many moving driven liner 310c.First and second guide rails 331 and 332 can be implemented by linear movement or similar motion.
In order to prevent that relative interference takes place between first and second guide rail 331 and 332, in this embodiment, provide first guide rail 331 in the position that is lower than second guide rail 332 relatively.Thus, be provided at the position that is lower than second guide rail 332 relatively, can drive liner 310b with two pairs and form length greater than many length, as shown in FIG. to driven liner 310c in order to make first guide rail 331.
The operation that now description is had the substrate support pedestal of said structure.
At link part 323a and 323b is closer to each other and the initial position of a plurality of liners 310 (as shown in Figure 16 and 18) closer to each other, be included in the driver element operation in first guide rail 331, so that make link part 323a and 323b away from each other, and make liner 310 away from each other, as shown in Figure 15 and 17 with same intervals H (referring to Figure 17).
At this moment, according to independent control signal, driver element drives two pairs independently and drives liner 310b, makes link part 323a and 323b become predetermined length (referring to Figure 16 and 18) away from each other.
Thus, if two pairs drive liner 310b and move in the opposite direction along first guide rail 331, so much to driven liner 310c according to the operation of link part 323a and 323b also away from each other with two pairs of identical distances of displacement that drive liner 310b.
Therefore, final, as shown in Figure 15 and 17, liner 310 can same intervals H (referring to Figure 17) away from each other.Under this state, substrate G stably is installed on the liner 310 also supported in this way.At this moment, because substrate G can not damage or sink by can not occurring in liner 310 substrate supported,, for example check work so might carry out stable process.
For referring to for the purpose of, if driver element is not provided, the operator can spur two pairs in the opposite direction and drive liner 310b so, is arranged on the desired location place so that drive liner 310b with two pairs.
As indicated above, according to this embodiment, can stably support substrate with different size, can prevent substrate G damage or sagging simultaneously.
Figure 19 is the skeleton view of explanation substrate support pedestal of the 5th one exemplary embodiment according to the present invention.
In above-mentioned one exemplary embodiment, substrate G is directly installed on the end face of a plurality of liners 310 and is supported in this way.Yet, as shown in Figure 19, can further on the end face of a plurality of liners 310, provide support the supplemental support liner 340 of substrate G.
In the case, each in the supplemental support liner 340 can have wide strip, and can be coupled to a pair of liner 310, and promptly a pair of fixed-bearing 310a, two couples drive among the liner 310b each to right with many each among the driven liner 310c.As shown in Figure 19, if independent supplemental support liner 340 further is provided, so might be at broad area upper support substrate G, this has stably supported substrate G.
Figure 20 and 21 is skeleton views of explanation substrate support pedestal of the 6th one exemplary embodiment according to the present invention.
In above-mentioned first and second one exemplary embodiment, form the swivel pin part 325a ' of the reference point that two separate units link 320a of group and 320b move and 325b ' and be provided on the 312a of fixed-bearing coupling part away from each other position (referring to Figure 16).Therefore, not to be connected to each other but under in fact away from each other the state, in equipment body 301, to provide two 320a of cell link group and 320b at two 320a of cell link group and 320b.
Yet, different with first and second one exemplary embodiment, form the swivel pin part 325a ' of the reference point that two separate units link 320a of group and 320b move and 325b ' and can be provided at same position place on the 312a of fixed-bearing coupling part, as shown in Figure 20 and 21.
In the case, link part 323a and the 323b of two 320a of cell link group of formation and 320b can illustrate to it is connected to each other seemingly.This structure can reach effect of the present invention.
Figure 22 and 23 is planimetric maps of the substrate support pedestal of the 7th one exemplary embodiment according to the present invention.
In above-mentioned one exemplary embodiment, a plurality of liner 310 is closer to each other and with same intervals H (referring to Figure 17) away from each other.Yet, as shown in Figure 22 and 23, when link part 323c and 323d are constructed with different units length, a plurality of liners 310 can be closer to each other and with rule H3 and H4 (not being identical distance) be away from each other at interval.In some cases, a plurality of liners 310 can be through structure so that it be closer to each other and with identical distance away from each other.
In above-mentioned first one exemplary embodiment, omitted description, but in the FPD substrate, TAB can be attached to one side, two selected limits or four all limits.In the case, optical system mobile unit, displacement transducer and camera are designed to be provided at the corresponding position according to the TAB that is provided.
In above-mentioned first one exemplary embodiment, indenture inspection camera and flaw detection camera move together along the optical system mobile unit of correspondence.Yet indenture inspection camera and flaw detection camera can be independent of corresponding optical system mobile unit and move.This can be applicable to displacement transducer.In the case, has the advantage that individually to carry out a kind of inspection of between indenture inspection and flaw detection, selecting.
In general, under the situation of flaw detection, on whole interval, carry out flaw detection at a relatively high speed, but under the situation that indenture is checked, because the characteristic that indenture is checked, so but operating part inspection the and simultaneously corresponding region being checked slowly.Therefore, the translational speed of each in indenture inspection camera, flaw detection camera and the displacement transducer can be controlled as friction speed.Specifically, check when indenture that camera is relative with the combination between the displacement transducer and be driven more lentamente and flaw detection camera when being driven independently at a relatively high speed, can carry out inspection.
In above-mentioned first one exemplary embodiment, can be with line scan camera as camera.Yet, owing to camera can as indicated abovely be controlled by displacement transducer and control module, so in some cases can be with area array cameras as camera.
In the above-mentioned second and the 3rd one exemplary embodiment, about the moving direction of line scan camera, be coupled at displacement transducer under the state of a side of front surface portion of line scan camera, displacement transducer moves with line scan camera.Yet, can implement following structure.Displacement transducer can be away from the line scan camera preset distance, and not integrated with line scan camera, and can friction speed individually move.
In above-mentioned the 4th to the 7th one exemplary embodiment, the fixed-bearing in a plurality of liners is provided in the central area, and the driving liner is arranged on both sides.Yet fixed-bearing can be arranged on the end of a plurality of liners, drive liner and can be arranged on the other end of a plurality of liners, and driven liner can be arranged between fixed-bearing and the driving liner.Even in this case, also can obtain same effect.
As indicated above, can produce following effect according to inspecting substrate equipment of the present invention and substrate support pedestal.
The first, because single checkout facility jointly carries out indenture inspection and flaw detection, thus checking efficiency can be improved and the amount of production time can be reduced, thus throughput rate improved.In addition, owing to can prevent to need unnecessary peripheral unit, so can reduce work space, thus compare with correlation technique, reduce various losses.
The second, might reduce and carry out the total amount that indenture is checked the required production time, and increase focusing following range automatically.Even in the flatness of substrate because sinking (because cause that size increases) of substrate and when irregular, also can carry out effective inspection, and can reduce equipment ratio and installation space.
The 3rd, compare with correlation technique, can reduce equipment ratio and installation space, and camera can be installed on each surface of substrate, carry out the total amount that indenture is checked the required production time thereby reduce.
It will be understood by one of ordinary skill in the art that can be under not breaking away from as the situation by the spirit and scope of the present invention that appended claims defined, and it is made various replacements, modification and change on form and the details.Therefore, should be appreciated that embodiment mentioned above only is for purposes of illustration, and should not be interpreted as limitation of the present invention.

Claims (38)

1. inspecting substrate equipment, it comprises:
Platform stably is equipped with substrate above it, described substrate becomes the inspection target, and wherein indenture inspection and flaw detection are carried out in the zone that the coil type on one side of being attached to described substrate is engaged (TAB) automatically;
At least one indenture is checked camera, and it is taken a picture to described TAB zone, so that check whether occur indenture among the described TAB;
At least one flaw detection camera, it is taken a picture to described TAB zone, so that check in the described TAB zone of described substrate the crack whether occurs; And
The optical system mobile unit, it supports described indenture and checks camera and described flaw detection camera, so that relatively move with respect to described.
2. inspecting substrate equipment according to claim 1, it further comprises:
At least one displacement transducer, it measures described substrate when being moved by described optical system mobile unit displacement; And
Control module, it is controlled described indenture and checks moving of camera on the basis of the information that is obtained by described displacement transducer.
3. inspecting substrate equipment according to claim 2, wherein said displacement transducer is arranged on described indenture and checks the camera front, and before described indenture checks that camera arrives the described TAB zone of photograph target, described control module obtains information about the flatness of described substrate from described displacement transducer in advance, and controls described indenture and check moving of camera.
4. inspecting substrate equipment according to claim 3, wherein said control module control described indenture check camera near and away from described substrate, make described indenture check that camera carries out focusing automatically to described TAB zone in real time.
5. inspecting substrate equipment according to claim 2, wherein said control module are independent of described indenture and check camera and control moving of described flaw detection camera.
6. inspecting substrate equipment according to claim 5, wherein said control module allows described indenture to check that camera and flaw detection camera move continuously, so that when described indenture is checked the photograph operation of camera and flaw detection camera, obtain described indenture and check image on the mobile route of camera and flaw detection camera.
7. inspecting substrate equipment according to claim 6, at least one in wherein said indenture inspection camera, described flaw detection camera and the described displacement transducer moves independently.
8. inspecting substrate equipment according to claim 7, wherein said indenture checks that camera and described displacement transducer move together, described flaw detection camera is independent of described indenture to be checked camera and described displacement transducer and moves, and described flaw detection camera is at first mobile at described indenture inspection camera and described displacement transducer front.
9. inspecting substrate equipment according to claim 8, wherein said optical system mobile unit comprises:
A plurality of horizontal components, it is parallel to two minor faces of the described substrate that stably is installed on the described platform and a long limit respectively and is provided with;
A plurality of first vertical components, it is coupled to described horizontal component, so that move along described horizontal component, and supports described indenture and checks camera and described displacement transducer; And
A plurality of second vertical components, it supports described flaw detection camera, and is independent of described a plurality of first vertical component and moves.
10. inspecting substrate equipment according to claim 9, wherein said first vertical component moves along the longitudinal direction of described horizontal component.
11. inspecting substrate equipment according to claim 9, wherein on the horizontal component of correspondence, the translational speed that described second vertical component of described flaw detection camera is installed is checked the translational speed of described first vertical component of camera and described displacement transducer faster than described indenture is installed relatively.
12. inspecting substrate equipment according to claim 11, wherein said flaw detection camera is taken a picture to the All Ranges of described TAB, so that check and whether occur the crack in the described substrate, and described indenture inspection camera is taken a picture at least a portion of selecting from the zone of described TAB, so that check whether occur indenture among the described TAB.
13. inspecting substrate equipment according to claim 1, it further comprises:
The checkout facility main body, it supports described, makes described end face that is coupled to described checkout facility main body regularly.
14. inspecting substrate equipment according to claim 1, wherein said indenture check that the type of camera and described flaw detection camera is line scan camera or area array cameras.
15. an inspecting substrate equipment, it comprises:
Platform stably is equipped with substrate above it, described substrate becomes the inspection target, wherein indenture inspection and flaw detection is carried out in the zone of the TAB on one side of being attached to described substrate;
At least one camera, take a picture in its indenture inspection area to described substrate;
The optical system mobile unit, it is coupled to described camera, and relatively moves described camera with respect to described;
At least one displacement transducer, it measures the displacement of described substrate; And
Control module, it controls moving of described camera on the basis of the information that is obtained by described displacement transducer.
16. inspecting substrate equipment according to claim 15, wherein said displacement transducer is provided at described camera front on the moving direction of described camera, and arrive at described camera before the indenture inspection area of described substrate, described control module obtains information about the flatness of the described indenture inspection area of described substrate from described displacement transducer in advance, and controls moving of described camera.
17. inspecting substrate equipment according to claim 16, wherein said control module are controlled moving of described camera, make described camera carry out focusing automatically to the described indenture inspection area of described substrate in real time.
18. inspecting substrate equipment according to claim 17, the type of wherein said camera are line scan camera or area array cameras.
19. inspecting substrate equipment according to claim 18, wherein said control module allow described camera to move continuously, so that when the photograph operation of described camera, obtain the image on the whole zone of mobile route of described camera.
20. inspecting substrate equipment according to claim 16, the wherein said displacement transducer moving direction about described camera on described indenture inspection area is coupled to described camera in described camera front, and moves with described camera is whole in fact.
21. inspecting substrate equipment according to claim 20, wherein said is fixedly mounted in the pre-position.
22. an inspecting substrate equipment, it comprises:
Fixed station stably is equipped with substrate above it, described substrate becomes indenture and checks target, wherein the indenture inspection is carried out in the zone of the TAB on one side of being attached to described substrate, and described fixed station is fixedly mounted in the pre-position;
At least one camera, take a picture in its indenture inspection area to described substrate; And
The optical system mobile unit, it is coupled to described camera, and relatively moves described camera with respect to described fixed station, makes described camera take a picture to the described indenture inspection area of the described substrate on the described fixed station.
23. inspecting substrate equipment according to claim 22, the type of wherein said camera is line scan camera or area array cameras, and a plurality of cameras are provided.
24. according to the described inspecting substrate equipment of arbitrary claim in the claim 1,15 and 22, wherein said substrate is as in the LCD of flat-panel monitor (FPD) (LCD) substrate, Plasmia indicating panel (PDP) substrate and Organic Light Emitting Diode (OLED) substrate any one.
25. a substrate support pedestal, it comprises:
A plurality of liners, its supporting substrate; And
Mobile support section, it supports described a plurality of liner movably, makes described a plurality of liner closer to each other and with rule at interval away from each other.
26. substrate support pedestal according to claim 25, wherein said a plurality of liners comprise:
A pair of fixed-bearing, it is selected from described a plurality of liners;
At least one pair of drives liner, and it is selected from described a plurality of liners, and away from described fixed-bearing is located; And
Many to driven liner, it is arranged on described to fixed-bearing and described to driving between the liner.
27. substrate support pedestal according to claim 26 is wherein said to fixed-bearing location and be fixed on the center of described a plurality of liners, and described at least to driving the both sides that liner is arranged on described a plurality of liners.
28. substrate support pedestal according to claim 27, it further comprises:
The fixed-bearing coupling part, it makes and described fixed-bearing is connected to each other;
Drive the liner coupling part, it makes and describedly at least is connected to each other to driving liner; And
Driven liner coupling part, wherein each all make described many each driven liner to correspondence in the driven liner is connected to each other,
Wherein said mobile support section partly is linked to described liner coupling part.
29. substrate support pedestal according to claim 28, wherein said mobile support section comprises:
A plurality of link parts, it is arranged to intersected with each other, and closer to each other and away from each other; And
A plurality of swivel pin parts, it is at the joining places of described a plurality of link parts, integrally hingedly is coupled to described a plurality of link partly and described a plurality of liners coupling part.
30. substrate support pedestal according to claim 29, wherein said a plurality of link part is divided into two independently cell link groups, and in described two cell link groups each all drives liner coupling part one side from described fixed-bearing coupling part towards each and forms.
31. substrate support pedestal according to claim 30, in the described a plurality of swivel pins part that wherein in described two cell link groups, is provided, the hinged swivel pin that is coupled to described fixed-bearing coupling part partly is provided as on described fixed-bearing coupling part away from each other.
32. substrate support pedestal according to claim 30, in the described a plurality of swivel pins part that wherein in described two cell link groups, is provided, the hinged swivel pin that is coupled to described fixed-bearing coupling part partly is provided at same position place on the described fixed-bearing coupling part.
33. substrate support pedestal according to claim 26, it further comprises:
First guide rail, its be coupled to described at least one pair of drive liner, and guide described at least one pair of drive moving of liner, make described at least one pair of drive on liner and direction away from each other closer to each other mobile at described a plurality of liners; And
Second guide rail, it is coupled to described many to driven liner, and guides described many moving driven liner.
34. substrate support pedestal according to claim 33, it further comprises:
Equipment body, it supports described first and second guide rails,
Wherein, in described equipment body, described first guide rail is provided at than the relatively low position of described second guide rail.
35. substrate support pedestal according to claim 33, the driver element that wherein drives described at least one pair of driving liner independently further is coupled to described first guide rail.
36. substrate support pedestal according to claim 25, wherein said a plurality of liners are by described mobile support section and closer to each other and with equal intervals away from each other.
37. substrate support pedestal according to claim 25, it further comprises:
The supplemental support liner, it is coupled to the end face of described a plurality of liners, and supports described substrate.
38. according to the described substrate support pedestal of claim 37, wherein provide a plurality of supplemental support liners, and described a plurality of auxiliary pad to be coupled to described many each in the liner separately right.
CN2007101108687A 2006-06-13 2007-06-12 Substrates examination device Expired - Fee Related CN101089616B (en)

Applications Claiming Priority (12)

Application Number Priority Date Filing Date Title
KR1020060052916A KR100797571B1 (en) 2006-06-13 2006-06-13 Denting and Crack Inspecting Apparatus
KR1020060052915 2006-06-13
KR10-2006-0052916 2006-06-13
KR10-2006-0052915 2006-06-13
KR1020060052915A KR100785420B1 (en) 2006-06-13 2006-06-13 Denting inspecting apparatus
KR1020060052916 2006-06-13
KR1020060134764A KR20070118939A (en) 2006-12-27 2006-12-27 Denting inspecting apparatus
KR1020060134764 2006-12-27
KR10-2006-0134764 2006-12-27
KR1020070029577A KR100837599B1 (en) 2007-03-27 2007-03-27 Stage for glass panel
KR10-2007-0029577 2007-03-27
KR1020070029577 2007-03-27

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN200910179862A Division CN101666760A (en) 2006-06-13 2007-06-12 Substrates support table and substrates examination device with same

Publications (2)

Publication Number Publication Date
CN101089616A true CN101089616A (en) 2007-12-19
CN101089616B CN101089616B (en) 2010-11-17

Family

ID=38943046

Family Applications (2)

Application Number Title Priority Date Filing Date
CN2007101108687A Expired - Fee Related CN101089616B (en) 2006-06-13 2007-06-12 Substrates examination device
CN200910179862A Pending CN101666760A (en) 2006-06-13 2007-06-12 Substrates support table and substrates examination device with same

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN200910179862A Pending CN101666760A (en) 2006-06-13 2007-06-12 Substrates support table and substrates examination device with same

Country Status (2)

Country Link
KR (1) KR100785420B1 (en)
CN (2) CN101089616B (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103888636A (en) * 2014-03-03 2014-06-25 常州市赛嘉机械有限公司 Fast plane image collector
TWI489100B (en) * 2013-04-30 2015-06-21 Crystalwise Technology Method and apparatus for examining contamination of substrate with optical recognition system
CN111239139A (en) * 2020-01-21 2020-06-05 珠海锐翔智能科技有限公司 Double-station FPC (flexible printed circuit) material supplementing offset and re-pasting/missing pasting inspection machine
CN111527371A (en) * 2017-12-28 2020-08-11 日本电产理德股份有限公司 Inspection apparatus and inspection method

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101523531B1 (en) * 2008-10-28 2015-05-29 재단법인 포항산업과학연구원 Measuring apparatus and the method for flatness
CN102141693B (en) * 2010-01-28 2014-07-16 鸿富锦精密工业(深圳)有限公司 Brightness testing device
JP7440355B2 (en) * 2020-06-26 2024-02-28 キヤノントッキ株式会社 Alignment equipment, film forming equipment, alignment method, electronic device manufacturing method, program and storage medium
KR102426842B1 (en) * 2020-10-07 2022-07-29 에이치비솔루션㈜ Glass panel crack inspection device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08248443A (en) * 1995-03-06 1996-09-27 Hitachi Electron Eng Co Ltd Method for focusing ir camera to tft substrate
SG129992A1 (en) * 2001-08-13 2007-03-20 Micron Technology Inc Method and apparatus for detecting topographical features of microelectronic substrates
US20040183900A1 (en) * 2003-03-20 2004-09-23 Everest Vit Method and system for automatically detecting defects in remote video inspection applications
JP4228778B2 (en) * 2003-05-21 2009-02-25 ウシオ電機株式会社 Pattern inspection device
US20060029257A1 (en) * 2004-08-03 2006-02-09 Honda Motor Co., Ltd. Apparatus for determining a surface condition of an object

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI489100B (en) * 2013-04-30 2015-06-21 Crystalwise Technology Method and apparatus for examining contamination of substrate with optical recognition system
CN103888636A (en) * 2014-03-03 2014-06-25 常州市赛嘉机械有限公司 Fast plane image collector
CN111527371A (en) * 2017-12-28 2020-08-11 日本电产理德股份有限公司 Inspection apparatus and inspection method
CN111527371B (en) * 2017-12-28 2022-07-08 日本电产理德股份有限公司 Inspection apparatus and inspection method
CN111239139A (en) * 2020-01-21 2020-06-05 珠海锐翔智能科技有限公司 Double-station FPC (flexible printed circuit) material supplementing offset and re-pasting/missing pasting inspection machine
CN111239139B (en) * 2020-01-21 2020-11-03 珠海锐翔智能科技有限公司 Double-station FPC (flexible printed circuit) material supplementing offset and re-pasting/missing pasting inspection machine

Also Published As

Publication number Publication date
CN101666760A (en) 2010-03-10
KR100785420B1 (en) 2007-12-13
CN101089616B (en) 2010-11-17

Similar Documents

Publication Publication Date Title
CN101089616B (en) Substrates examination device
CN107966458B (en) Substrate half-plate detection device
CN101386477A (en) Method of manufacturing hermetically sealed container
JP3537202B2 (en) Multi-head microscope device
CN211669102U (en) Substrate inspection device
CN113499948B (en) Dispensing equipment
KR100854072B1 (en) Apparatus for inspecting glass
KR20070117188A (en) Apparatus and method for inspection of display panel
CN210775269U (en) Detection equipment
KR100797571B1 (en) Denting and Crack Inspecting Apparatus
TWI435073B (en) Substrate supporting stage
CN103201675A (en) Jig for adjusting film pitch, apparatus for joining film having the same, and method of adjusting film pitch using the apparatus
KR101906288B1 (en) Apparatus for etching substrates
KR101159947B1 (en) Paste applying device and applying method
CN212823383U (en) Welding and cutting integrated machine for stainless steel skip printing stepped template
KR100254054B1 (en) Probe head, method for manufacturing the same, and inspecting method using the same
JP3139179U (en) Inspection device for flat panel display
CN217043252U (en) Positioning mechanism applied to side coating
KR20070118939A (en) Denting inspecting apparatus
EP1253817A2 (en) Apparatus for picking and placing small objects
JP2769372B2 (en) LCD probe device
US20200201086A1 (en) Bonding device for a display panel and bonding method for same
JPH08115954A (en) Inspection equipment
JP2000147044A (en) Device and method for inspecting plate-shaped object to be inspected
CN217641385U (en) Needle-punching type die bonder

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20101117

Termination date: 20170612