TWI489100B - Method and apparatus for examining contamination of substrate with optical recognition system - Google Patents
Method and apparatus for examining contamination of substrate with optical recognition system Download PDFInfo
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本發明係有關於一種檢查基板污染的裝置及其方法,特別是有關於一種利用光學辨識系統檢查基板汙染的裝置及其方法。The present invention relates to an apparatus for inspecting substrate contamination and a method thereof, and more particularly to an apparatus and method for inspecting substrate contamination using an optical identification system.
近年來電子產品的蓬勃發展,半導體裝置因為具有極高的積集度,及輕薄短小的特性,所以被廣泛應用在許多電子產品中,例如:處理器(processor),記憶體(memory),其他積體電路(IC),發光二極體(LED),電荷耦合元件(CCD),互補式金屬氧化物半導體(CMOS)等。而在影像顯示方面,由於對於平面顯示的需求增加,液晶顯示面板(LCD panel),或發光二極體顯示面板(LED panel),有機發光二極體面板(OLED panel)也被廣泛地運用。再者,封裝基板(package substrate)及印刷電路板(PCB),更是在積體電路元件及許多電子設備中不可或缺的元件。In recent years, electronic products have flourished, and semiconductor devices have been widely used in many electronic products because of their high degree of integration, lightness, and shortness, such as processors, memory, and others. Integrated circuit (IC), light-emitting diode (LED), charge coupled device (CCD), complementary metal oxide semiconductor (CMOS), etc. In terms of image display, an LCD panel, or a LED panel, and an OLED panel are widely used due to an increase in demand for a flat display. Furthermore, package substrates and printed circuit boards (PCBs) are indispensable components in integrated circuit components and many electronic devices.
上述這些產品或半成品的製造,大多都在一基板上進行,舉例來說,半導體裝置大部分在一半導體基底上製造,比如矽基底,鍺基底,砷化鎵基底等。而液晶顯示面板則在一玻璃基板上進行製造,甚至近期還發展可撓性塑膠基板上製造。發光二極體的基板比如是藍寶石基板,磊晶基板等。封裝基板及印刷電路板則是在一有機基板上製造。然而這些產品 的製造方法包括:薄膜沉積,比如物理氣相沉積(PVD),化學氣相沉積(CVD),電漿加強化學氣相沉積(PECVD)等,微影(photolithography),電鍍,蝕刻,熱氧化,化學機械研磨,旋轉塗佈,網版印刷等。而每一個產品都是經過數十道或數百道上述的製程,才得以完成。為了提高這些產品生產的良率與品質,上述這些製程都需要在一個很潔淨的環境中進行,比如無塵室,或真空腔室中進行。而這些產品對於塵粒,雜質十分敏感,尤其是在製程中常會用到不同配方,包括液態或氣態,為了防止製程中配方的殘留(residue)影響後續製程的品質,製程與製程間需要進行清洗。習知是以多道的濕式化學反應與去離子水(DI water),進行清洗,然後再進行烘烤,以確保無殘留。然而,目前對於上述各種基板製程後是否有殘留或是因化學液製程異常導致基板表面狀況改變,並無較好的檢測方法,通常是在後續製程中,產生缺陷後才會被檢測出來,例如因殘酸造成的光阻剝落問題等。如果在製程實施前可以檢測出基板上是否有汙染或殘留,進行補救清洗,則可以避免產品的缺陷,提高生產的良率。Most of these products or semi-finished products are manufactured on a substrate. For example, semiconductor devices are mostly fabricated on a semiconductor substrate such as a germanium substrate, a germanium substrate, a gallium arsenide substrate, or the like. The liquid crystal display panel is fabricated on a glass substrate, and even recently developed on a flexible plastic substrate. The substrate of the light-emitting diode is, for example, a sapphire substrate, an epitaxial substrate or the like. The package substrate and the printed circuit board are fabricated on an organic substrate. However these products Manufacturing methods include: thin film deposition, such as physical vapor deposition (PVD), chemical vapor deposition (CVD), plasma enhanced chemical vapor deposition (PECVD), etc., photolithography, electroplating, etching, thermal oxidation, Chemical mechanical polishing, spin coating, screen printing, etc. And each product is completed after dozens or hundreds of the above processes. In order to improve the yield and quality of these products, these processes need to be carried out in a very clean environment, such as a clean room, or a vacuum chamber. These products are very sensitive to dust particles and impurities. Especially in the process, different formulations, including liquid or gaseous, are often used. In order to prevent the residue of the formulation in the process from affecting the quality of the subsequent process, cleaning between the process and the process is required. . Conventionally, it is washed with a multi-channel wet chemical reaction and DI water, and then baked to ensure no residue. However, at present, there is no good detection method for whether there is residual after the above various substrate processes or the surface condition of the substrate is changed due to abnormal chemical liquid process, and it is usually detected in the subsequent process after the defect is generated, for example, for example, for example, The problem of photoresist peeling caused by residual acid. If it is possible to detect contamination or residue on the substrate before the process is implemented, remedial cleaning can avoid product defects and improve production yield.
因此,本發明之一範疇在於提供一種光學辨識方法及其裝置,可在一製程實施前,檢查一基板上是否有汙染或殘留,以確保製程的良率。Therefore, one aspect of the present invention is to provide an optical identification method and apparatus thereof, which can check whether a substrate is contaminated or left before a process is implemented to ensure the yield of the process.
根據本發明的一實施例,提出一種光學辨識系統,用於檢查一基板上之可能的一污染物,包括:承載裝置,光學辨識裝置及液體噴霧裝置。承載裝置,配置用以支撐基板,光學辨識裝置,配置於承載裝置上方,用以掃描基板之一上表面。液體噴霧裝置,配置於承載裝置上方,用以於基板上產生複 數個液體粒子,其中液體粒子具有一預定尺寸範圍,並適於在特定基板表面能時彼此以一預定間距與形態附著於基板之上表面,以利光學辨識裝置進行掃描。當基板上未含有汙染物時,液體粒子附著於上表面呈一約略球面狀且具有一預定尺寸與間距範圍;當基板上含有汙染物時,液體粒子附著於上表面呈一薄膜狀、不規則狀或非預定尺寸與間距範圍球面狀。由光學辨識系統加以分辨基板上液體粒子是否呈現異常現象可判定是否有表面污染產生。而液體粒子可借由自然揮發、吹氣揮發或升溫揮發等方式加以去除。According to an embodiment of the invention, an optical identification system is provided for inspecting a possible contaminant on a substrate, comprising: a carrying device, an optical identification device and a liquid spray device. The carrying device is configured to support the substrate, and the optical identification device is disposed above the carrying device for scanning an upper surface of the substrate. a liquid spray device disposed above the carrier device for generating a complex on the substrate A plurality of liquid particles, wherein the liquid particles have a predetermined size range and are adapted to be attached to the upper surface of the substrate at a predetermined pitch and shape at a predetermined spacing of the surface of the substrate to facilitate scanning by the optical identification device. When the substrate does not contain contaminants, the liquid particles adhere to the upper surface in an approximately spherical shape and have a predetermined size and spacing range; when the substrate contains contaminants, the liquid particles adhere to the upper surface in a film shape and irregularity. The shape or the non-predetermined size and the range of the pitch are spherical. It is determined by the optical identification system whether the liquid particles on the substrate exhibit an abnormal phenomenon to determine whether surface contamination occurs. The liquid particles can be removed by natural volatilization, blowing volatilization or heating and volatilization.
根據本發明的另一實施例,提出一種光學辨識方法,用於檢查一基板上之可能的一污染物,包括:提供基板於一承載裝置上。然後藉由一蒸氣噴霧裝置,產生複數個液體粒子,其中液體粒子分別具有一預定尺寸範圍,並適於彼此以一預定間距與形態附著於基板之一上表面。以一光學辨識裝置針對基板之上表面進行掃描,以擷取至少一影像,並辨識影像中的液體粒子之尺寸與間距。當基板上未含有汙染物時,液體粒子附著於上表面呈一約略球面狀且具有一預定尺寸與間距範圍;當基板上含有汙染物時,液體粒子會超出非預定尺寸與間距範圍。In accordance with another embodiment of the present invention, an optical identification method for inspecting a possible contaminant on a substrate is provided, comprising: providing a substrate on a carrier. A plurality of liquid particles are then produced by a vapor atomizing device, wherein the liquid particles each have a predetermined size range and are adapted to adhere to one of the upper surfaces of the substrate at a predetermined pitch and shape. The surface of the substrate is scanned by an optical identification device to capture at least one image and identify the size and spacing of the liquid particles in the image. When the substrate does not contain contaminants, the liquid particles adhere to the upper surface in an approximately spherical shape and have a predetermined size and spacing range; when the substrate contains contaminants, the liquid particles may exceed a non-predetermined size and spacing range.
根據本發明的再一實施例,提出一種光學辨識系統,用於檢查一基板上之可能的一污染物,包括:光學辨識裝置及液體噴霧裝置。光學辨識裝置,配置於基板上方,用以掃描基板之一上表面。液體噴霧裝置,配置於基板上方,用以產生複數個液體粒子,其中液體粒子附著於基板之上表面,以利光學辨識裝置進行掃描。且擷取至少一影像,並辨識影像中的液體粒子。當基板上未含有汙染物時,液體粒子在影像中呈現一第一形 式;當基板上含有汙染物時,液體粒子在影像中呈現一第二形式,而第一形式與第二形式不同。In accordance with still another embodiment of the present invention, an optical identification system is provided for inspecting a possible contaminant on a substrate, including: an optical identification device and a liquid spray device. The optical identification device is disposed above the substrate for scanning an upper surface of the substrate. The liquid spray device is disposed above the substrate to generate a plurality of liquid particles, wherein the liquid particles are attached to the upper surface of the substrate for scanning by the optical identification device. And capturing at least one image and identifying liquid particles in the image. When the substrate does not contain contaminants, the liquid particles present a first shape in the image. When the substrate contains contaminants, the liquid particles assume a second form in the image, and the first form is different from the second form.
根據本發明的某些實施例,基板可以是矽基底,鍺基底,砷化鎵基底,玻璃基板,可撓性塑膠基板,藍寶石基板,磊晶基板,有機基板等。而光學辨識裝置不但可以辨識液體粒子的尺寸、間距與/或形狀,還可以辨識液體粒子的色彩,以辨別是否含有汙染物。According to some embodiments of the present invention, the substrate may be a germanium substrate, a germanium substrate, a gallium arsenide substrate, a glass substrate, a flexible plastic substrate, a sapphire substrate, an epitaxial substrate, an organic substrate, or the like. The optical identification device not only recognizes the size, spacing and/or shape of the liquid particles, but also identifies the color of the liquid particles to identify whether they contain contaminants.
關於本發明的優點,精神與特徵,將以實施例並參照所附圖式,進行詳細說明與討論。值得注意的是,為了讓本發明能更容易理解,後附的圖式僅為示意圖,相關尺寸並非以實際比例繪示。The advantages, spirits and features of the present invention will be described and discussed in detail by reference to the accompanying drawings. It is to be noted that, in order to make the invention more comprehensible, the appended drawings are only schematic representations, and the related dimensions are not shown in actual scale.
10‧‧‧基板10‧‧‧Substrate
12,12’,208,208’‧‧‧液體粒子12,12’,208,208’‧‧‧ liquid particles
200‧‧‧光學辨識系統200‧‧‧ Optical Identification System
202‧‧‧基板202‧‧‧Substrate
204‧‧‧上表面204‧‧‧Upper surface
206‧‧‧液體噴霧裝置206‧‧‧Liquid spray device
210‧‧‧光學辨識裝置210‧‧‧Optical identification device
212‧‧‧光學鏡頭212‧‧‧ optical lens
214‧‧‧感光元件214‧‧‧Photosensitive elements
216‧‧‧影像辨識裝置216‧‧‧Image recognition device
220‧‧‧承載裝置220‧‧‧ Carrying device
302‧‧‧第二加熱器302‧‧‧second heater
304‧‧‧第一加熱器或冷卻器304‧‧‧First heater or cooler
402‧‧‧網版402‧‧‧Web Edition
404‧‧‧孔洞404‧‧‧ hole
D,D’‧‧‧直徑D, D’‧‧‧ Diameter
S,S’‧‧‧間距S, S’‧‧‧ spacing
502,504,506‧‧‧步驟502, 504, 506‧ ‧ steps
圖一為根據本發明一實施例,基板表面具有液體粒子之示意圖。1 is a schematic view of a surface of a substrate having liquid particles, in accordance with an embodiment of the present invention.
圖二為根據本發明一實施例,一種光學辨識系統的示意圖。2 is a schematic diagram of an optical identification system in accordance with an embodiment of the present invention.
圖二A為圖二中部分區域的放大圖。Figure 2A is an enlarged view of a portion of the area in Figure 2.
圖三為根據本發明另一實施例,一種光學辨識系統的示意圖。FIG. 3 is a schematic diagram of an optical identification system according to another embodiment of the present invention.
圖四為根據本發明再一實施例,一種光學辨識系統的示意圖。4 is a schematic diagram of an optical identification system in accordance with still another embodiment of the present invention.
圖五為根據本發明一實施例,一種光學辨識方法的流程圖。FIG. 5 is a flow chart of an optical identification method according to an embodiment of the invention.
為了讓本發明的優點,精神與特徵可以更容易且明確地了解,後續將以實施例並參照所附圖式進行詳述與討論。值得注意的是,這 些實施例僅為本發明代表性的實施例,其中所舉例的特定方法,裝置,條件,材質等並非用以限定本發明或對應的實施例。For the sake of the advantages and spirit of the invention, the spirit and the features may be more easily and clearly understood, and the detailed description and discussion will be made by way of example and with reference to the accompanying drawings. It is worth noting that this The embodiments are merely representative of the present invention, and the specific methods, devices, conditions, materials, and the like are not intended to limit the invention or the corresponding embodiments.
本發明的光學辨識系統與方法,可以應用在各種基板中,比 如半導體裝置對應的半導體基底(比如矽基底,鍺基底,砷化鎵基底等),液晶顯示面板的玻璃基板,可撓性塑膠基板,發光二極體的藍寶石基板,磊晶基板等,封裝基板及印刷電路板的有機基板等等。The optical identification system and method of the present invention can be applied to various substrates, For example, a semiconductor substrate corresponding to a semiconductor device (such as a germanium substrate, a germanium substrate, a gallium arsenide substrate, etc.), a glass substrate of a liquid crystal display panel, a flexible plastic substrate, a sapphire substrate of a light emitting diode, an epitaxial substrate, etc., a package substrate And organic substrates of printed circuit boards and the like.
請參照圖一,其繪示基板表面具有液體粒子之示意圖。以半導體基板10為例,比如矽基底,在經過某些製程後,透過去離子水清洗,期望能夠去除殘留。舉例來說,沉積製程後表面殘留的反應物粒子,微影製程後殘留的光阻或蝕刻液,電鍍後的殘留的電鍍液,研磨後殘留的研磨液等等,或者是基板運送過程中從環境中附著的灰塵。這些都會形成基板10表面的汙染物,而影響後續製程的缺陷,比如微影製程中顯像缺陷等。值得注意的是,當噴灑液體粒子在具有殘留的表面,這些汙染物粒子會對於這些液體粒子的部分特性產生影響,比如表面張力,色彩等。Please refer to FIG. 1 , which shows a schematic diagram of liquid particles on the surface of the substrate. Taking the semiconductor substrate 10 as an example, for example, a germanium substrate, after some processes, is washed by deionized water, and it is desirable to remove the residue. For example, reactive reactant particles remaining on the surface after the deposition process, residual photoresist or etching solution after the lithography process, residual plating solution after plating, residual polishing liquid after polishing, etc., or during substrate transport Dust attached to the environment. These will form contaminants on the surface of the substrate 10, which will affect defects in subsequent processes, such as development defects in the lithography process. It is worth noting that when the sprayed liquid particles have a residual surface, these contaminant particles may affect some of the characteristics of these liquid particles, such as surface tension, color, and the like.
以在半導體製程中最常用的純水或去離子水為例,當我們噴吐蒸氣於基板上產生許多液體粒子12(亦即去離子水粒子)在基板10上,若液體粒子12所在位置存在一污染物,則此汙染物會與液體粒子12融合或混合。熟習該技術者應知,由於水的表面張力很高,72.75mN/m,所以只要粒子尺寸適當,在基板10上會呈現一約略球面狀,如圖中液體粒子12。相反地,如果液體粒子12’與污染物融合或混合,可能因為污染物破壞了水的表面張力,若液體粒子12’相對基板表面的附著力大於表面張力,則使得液體粒子12’在基板上無法呈現球面狀,反而變成薄膜狀,如圖一中液體粒子12’ 所示。特別的是,當汙染物為有機化合物分子,或習稱表面活性劑,例如醇類、醛類、酸類和酯類等,會溶於水粒子中,而降低水粒子的表面張力。而這些有機化合物常出現於微影製程,介電層薄膜沉積,研磨製程中,所以當某些製程後,如果可能發生有機化合物殘留,則可以用上述的方法辨別,表面是否有殘留。Taking pure water or deionized water, which is the most commonly used in the semiconductor process, as an example, when we spray steam on the substrate, a plurality of liquid particles 12 (i.e., deionized water particles) are generated on the substrate 10, and if the liquid particles 12 are present, Contaminants, this contaminant will fuse or mix with the liquid particles 12. Those skilled in the art will recognize that since the surface tension of water is very high, 72.75 mN/m, as long as the particle size is appropriate, an approximately spherical shape will appear on the substrate 10, as shown by the liquid particles 12 in the figure. Conversely, if the liquid particles 12' are fused or mixed with contaminants, the surface tension of the water may be destroyed by the contaminants. If the adhesion of the liquid particles 12' to the surface of the substrate is greater than the surface tension, the liquid particles 12' are made on the substrate. Can not appear spherical, but instead become a film, as shown in Figure 1 liquid particles 12' Shown. In particular, when the contaminant is an organic compound molecule, or a surfactant, such as an alcohol, an aldehyde, an acid, or an ester, it is soluble in the water particles, and the surface tension of the water particles is lowered. These organic compounds are often found in lithography processes, dielectric layer deposition, and polishing processes. Therefore, if some organic compounds remain after some processes, the above method can be used to discriminate whether the surface remains.
同樣以在半導體製程中最常用的純水或去離子水為例,當我們噴吐蒸氣於基板上產生許多液體粒子12(亦即去離子水粒子)在基板10上,基板因製造過程中化學液製程異常導致污染物與基板形成強鍵結,此時污染物雖不會與液體粒子12’產生融合或混合,但因基板表面能改變,同樣會造成液體粒子尺寸、間距或形態上的改變。Similarly, in the case of pure water or deionized water, which is most commonly used in semiconductor manufacturing, when we spray steam on a substrate, a plurality of liquid particles 12 (i.e., deionized water particles) are generated on the substrate 10, and the substrate is chemically liquid during the manufacturing process. The process abnormality causes the contaminant to form a strong bond with the substrate. At this time, the contaminant does not fuse or mix with the liquid particle 12', but the surface energy of the substrate changes, which also causes the liquid particle size, spacing or morphology to change.
請同時參照圖二及圖二A,圖二繪示根據本發明一實施例,一種光學辨識系統的示意圖,圖二A繪示圖二中部分區域的放大圖。如圖所示,本發明某些實施例中,提供一種光學辨識系統200,用於檢查一基板202上是否有污染物(未繪示)殘留,比如上述之有機化合物。基板202具有一上表面204,上表面204可能已形成一些元件(未繪示),或是堆疊一些薄膜(未繪示),這些元件包括主動元件,比如場效電晶體(FET),被動元件,比如電容,電阻,電感等,而薄膜層包括介電層,絕緣層,金屬層,線路層,光阻層等。所以上表面204的材質,可以是金屬,介電材料,絕緣材料,有機化合物,聚合物等。當基板202經過至少一製程步驟處理,並經過適當的清洗步驟後,即可以在本發明的光學辨識系統中進行檢查。本發明的光學辨識系統包括一承載裝置220,用以承載,支撐並固持基板202。承載裝置220比如是靜電夾盤,或真空夾盤等。液體噴霧裝置206,配置於基板202上方, 用以產生複數個液體粒子208,附著於基板202之上表面204上。液體噴霧裝置206,包括蒸氣噴吐裝置、超音波震盪噴霧裝置,或一般噴嘴噴霧裝置等。請參照圖二A,為了利於後續辨識,液體粒子208較佳是分別具有一預定尺寸,比如直徑D。直徑D的決定與液體粒子208的成分,及液體分子208相對於上表面204的材質附著力有關,在某些實施例中,較佳的直徑D約為2微米到約2mm,根據光學辨識解析度來決定,可藉由噴霧參數、基板表面氣流量與基板溫度等參數進行調整。液體粒子208彼此間以一預定間距S間隔配置於上表面204上,對蒸氣噴吐,冷凝產生液體粒子方式,間距S與液體種類、基板溫度與基板表面狀態有關,能產生小間距的液體粒子;而其他主動式液珠產生裝置則可動態性調整間距S,但當間距過小時會有液珠重疊問題影響檢驗。在某些實施例中,本發明的光學辨識系統可以配置在一潔淨室(clean room)或一潔淨腔體(clean chamber)中。Please refer to FIG. 2 and FIG. 2A simultaneously. FIG. 2 is a schematic diagram of an optical identification system according to an embodiment of the present invention, and FIG. 2A is an enlarged view of a partial area of FIG. As shown, in some embodiments of the present invention, an optical identification system 200 is provided for inspecting a substrate 202 for residual contaminants (not shown), such as the organic compounds described above. The substrate 202 has an upper surface 204. The upper surface 204 may have formed some components (not shown) or stacked thin films (not shown) including active components such as field effect transistors (FETs) and passive components. Such as capacitors, resistors, inductors, etc., and the thin film layer includes a dielectric layer, an insulating layer, a metal layer, a wiring layer, a photoresist layer, and the like. Therefore, the material of the upper surface 204 may be metal, dielectric material, insulating material, organic compound, polymer, or the like. The substrate 202 can be inspected in the optical identification system of the present invention after it has been subjected to at least one process step and subjected to a suitable cleaning step. The optical identification system of the present invention includes a carrier 220 for carrying, supporting and holding the substrate 202. The carrier device 220 is, for example, an electrostatic chuck, or a vacuum chuck or the like. The liquid spray device 206 is disposed above the substrate 202, It is used to generate a plurality of liquid particles 208 attached to the upper surface 204 of the substrate 202. The liquid spray device 206 includes a steam spout device, an ultrasonic oscillating spray device, or a general nozzle spray device. Referring to FIG. 2A, in order to facilitate subsequent identification, the liquid particles 208 preferably have a predetermined size, such as a diameter D, respectively. The determination of the diameter D is related to the composition of the liquid particles 208 and the material adhesion of the liquid molecules 208 relative to the upper surface 204. In some embodiments, the preferred diameter D is from about 2 microns to about 2 mm, which is resolved according to optical identification. The degree can be adjusted by parameters such as spray parameters, substrate surface gas flow rate and substrate temperature. The liquid particles 208 are disposed on the upper surface 204 at a predetermined interval S, and are vented to the vapor to condense to generate liquid particles. The pitch S is related to the liquid type, the substrate temperature and the surface state of the substrate, and can generate liquid particles having a small pitch; The other active bead generating devices can dynamically adjust the spacing S, but when the spacing is too small, the liquid bead overlap problem will affect the inspection. In some embodiments, the optical identification system of the present invention can be configured in a clean room or a clean chamber.
如前所述,當液體粒子208未含有汙染物時或基板上無異常元素鍵結時,附著於上表面204呈一約略球面狀,而當液體粒子208含有汙染物時,或基板上有異常元素鍵結時,會因表面張力及附著力改變,附著於上表面204時呈一薄膜狀(如圖二之液體粒子208’所示)。由於液體粒子208與208’形狀不同,因此可以利用一光學辨識裝置210進行辨識。在本發明的某些實施例中,光學辨識裝置210包括一光學鏡頭212,一電荷耦合元件214(CCD),及一影像辨識裝置216。電荷耦合元件214透過該光學鏡頭212掃描基板202之上表面204以擷取一影像,影像中含有上表面204上液體粒子208,208’的影像。影像辨識裝置216,用以辨識影像中的液體粒子208,208’的形狀,比如球面狀或非球面狀(薄膜狀)。熟習此技藝者應知,影像辨識裝 置一般包括一處理器(processor),記憶體,及輸入/輸入裝置等,可以接收影像,進行計算識別,然後輸出辨識結果,而其步驟可以利用韌體或軟體完成,此為現今常用之技術,因此在此不再贅述。在本發明的某些實施例中,當影像辨識裝置,辨識出影像中之液體粒子208’為非球面狀,亦即不規則形的薄膜狀,則可以斷定,基板202表面尚有殘留或汙染物,即可以進行後續補救清洗。As described above, when the liquid particles 208 do not contain contaminants or when there is no abnormal element bonding on the substrate, the adhesion to the upper surface 204 is approximately spherical, and when the liquid particles 208 contain contaminants, or there is an abnormality on the substrate. When the element is bonded, it changes due to surface tension and adhesion, and adheres to the upper surface 204 as a film (as shown by the liquid particles 208' in FIG. 2). Since the liquid particles 208 and 208' are different in shape, they can be identified by an optical identification device 210. In some embodiments of the invention, optical identification device 210 includes an optical lens 212, a charge coupled component 214 (CCD), and an image recognition device 216. The charge coupled device 214 scans the upper surface 204 of the substrate 202 through the optical lens 212 to capture an image containing an image of the liquid particles 208, 208' on the upper surface 204. The image recognition device 216 is configured to recognize the shape of the liquid particles 208, 208' in the image, such as a spherical shape or an aspherical shape (film shape). Those skilled in the art should know that image recognition equipment The device generally includes a processor, a memory, and an input/output device, etc., can receive images, perform calculation and recognition, and then output the identification result, and the steps can be completed by using firmware or software, which is a commonly used technology. Therefore, it will not be repeated here. In some embodiments of the present invention, when the image recognition device recognizes that the liquid particles 208' in the image are aspherical, that is, irregularly shaped, it can be concluded that the surface of the substrate 202 remains or is contaminated. Subsequent remedial cleaning can be performed.
值得注意的是,光學辨識裝置210的解析度需能準確偵測前述液體粒子208’之間距S與尺寸D,因此需視需求選用合適辨識度的感光元件214(如電荷耦合元件CCD或互補式金屬-氧化層-半導體CMOS),及光學鏡頭212的放大倍率。為了提高光學辨識的精準度,還有考量各種基板202的尺寸與屬性,光學辨識裝置210對於上表面204的掃描方式,可以採用步進機(stepper)的方式,矩陣式逐一掃瞄部分區域。而光學鏡頭212的放大倍率也應考慮基板的尺寸,因此放大倍率可以大於1,小於1或等於1。此外,應注意的是,污染物對於液體粒子208’的影響,除了改變表面張力之外,還可能改變液體粒子208’表面的反射或折射特性。在某些實施例中,透過適當的光線照射,受汙染的液體粒子208',與未受汙染的液體粒子208,在影像中會呈現不同的色彩。因此光學辨識裝置210也可以藉由辨識影像中液體粒子的色彩來判斷上表面204是否遭受汙染。另外,如前所述,基板202因製造過程中化學液製程異常導致污染物與基板202形成強鍵結,此時污染物雖不會與液體粒子208’產生融合或混合,但因基板202表面能改變,同樣會造成液體粒子208’尺寸、間距(因異常聚合)或形態(因附著力改變)上的改變。因此光學辨識裝置210也可以藉由辨識影像中液體粒子的尺寸,間距或形態來 判斷上表面204是否遭受汙染。It should be noted that the resolution of the optical identification device 210 needs to be able to accurately detect the distance S between the liquid particles 208' and the size D. Therefore, it is necessary to select a photosensitive element 214 with a suitable degree of identification (such as a charge coupled device CCD or a complementary type). Metal-oxide layer-semiconductor CMOS), and the magnification of the optical lens 212. In order to improve the accuracy of optical recognition, the size and properties of the various substrates 202 are also considered. The scanning method of the optical recognition device 210 for the upper surface 204 may be stepped by a stepper method, and the partial regions are scanned one by one in a matrix. The magnification of the optical lens 212 should also take into account the size of the substrate, so the magnification can be greater than 1, less than 1 or equal to 1. Furthermore, it should be noted that the effect of contaminants on the liquid particles 208' may, in addition to changing the surface tension, alter the reflective or refractive properties of the surface of the liquid particles 208'. In some embodiments, the contaminated liquid particles 208', and the uncontaminated liquid particles 208, may exhibit different colors in the image by appropriate light illumination. Therefore, the optical recognition device 210 can also determine whether the upper surface 204 is contaminated by recognizing the color of the liquid particles in the image. In addition, as described above, the substrate 202 is strongly bonded to the substrate 202 due to an abnormal chemical liquid process during the manufacturing process. At this time, the contaminant does not fuse or mix with the liquid particles 208', but the surface of the substrate 202 Can change, also causes changes in the size, spacing (due to abnormal polymerization) or morphology (changes in adhesion) of the liquid particles. Therefore, the optical identification device 210 can also recognize the size, spacing or form of the liquid particles in the image. It is judged whether or not the upper surface 204 is contaminated.
請參照圖三,為根據本發明另一實施例,一種光學辨識系統的示意圖。圖式中相同的標號,代表相似的元件或裝置,其作用與詳細說明,請參照上述說明書內容,在此不再贅述。在某些實施例中,為了讓液體粒子208均勻分布,並控制其尺寸,可以在承載裝置220中增加一第一加熱器或冷卻器304,對基板202進行適度的烘烤或冷卻,使上表面204上的液體粒子208,視需求進行適度的蒸散與冷卻,以保持間距及控制粒子尺寸。為了提高辨識精確度,防止液體粒子208附著於鏡頭,影響影像擷取,可以在光學鏡頭212週緣配置一第二加熱器302,對於光學鏡頭進行烘烤,以使附著其上的液體粒子(未繪示)蒸散。Please refer to FIG. 3, which is a schematic diagram of an optical identification system according to another embodiment of the present invention. The same reference numerals in the drawings represent similar elements or devices. For the function and detailed description, please refer to the above description, and no further details are provided herein. In some embodiments, in order to evenly distribute and control the size of the liquid particles 208, a first heater or cooler 304 may be added to the carrier 220 to moderately bake or cool the substrate 202. The liquid particles 208 on the surface 204 are subjected to moderate evapotranspiration and cooling as needed to maintain spacing and control particle size. In order to improve the identification accuracy and prevent the liquid particles 208 from adhering to the lens and affecting the image capturing, a second heater 302 may be disposed around the periphery of the optical lens 212 to bake the optical lens to adhere the liquid particles thereon (not Show) evapotranspiration.
請參照圖四為根據本發明再一實施例,一種光學辨識系統的示意圖。圖式中相同的標號,代表相似的元件或裝置,其作用與詳細說明,請參照上述說明書內容,在此不再贅述。在某些實施例中,為了讓液體粒子208均勻分布,並控制其尺寸的另一種作法為:當液體噴霧裝置206產生液體粒子208時,在液體噴霧裝置206與上表面204之間配置一網版402(screen),網版402具有許多孔洞404,而這些孔洞404的直徑D’略大於預定的液體粒子208的直徑D,使得液體粒子208,可以輕易地通過而附著於上表面204。而孔洞404的間距S’則與預訂的液體粒子208間距S相同,因此液體噴霧裝置206所產生的液體粒子208可以均勻分布在上表面204上。網版402的材質可以選擇疏水性材質,使得液體粒子208不容易附著於其上,且網版402可以貼近上表面204,使液體粒子208在網版402與上表面204間不易產生飄移。當然後續光學辨識裝置210進行掃描前,會將網版402移除。Please refer to FIG. 4, which is a schematic diagram of an optical identification system according to still another embodiment of the present invention. The same reference numerals in the drawings represent similar elements or devices. For the function and detailed description, please refer to the above description, and no further details are provided herein. In some embodiments, another method for uniformly distributing liquid particles 208 and controlling its size is to configure a web between liquid spray device 206 and upper surface 204 when liquid spray device 206 produces liquid particles 208. The screen 402 has a plurality of holes 404, and the diameter D' of the holes 404 is slightly larger than the diameter D of the predetermined liquid particles 208, so that the liquid particles 208 can be easily passed through to the upper surface 204. The spacing S' of the holes 404 is the same as the spacing S of the predetermined liquid particles 208, so that the liquid particles 208 produced by the liquid atomizing device 206 can be evenly distributed on the upper surface 204. The material of the screen 402 may be selected from a hydrophobic material such that the liquid particles 208 are not easily attached thereto, and the screen 402 may be in close proximity to the upper surface 204, so that the liquid particles 208 are less likely to drift between the screen 402 and the upper surface 204. Of course, the screen 402 will be removed before the subsequent optical identification device 210 performs scanning.
請參照圖五,為根據本發明一實施例,一種光學辨識方法的流程圖。在某些實施例中,本發明的光學辨識方法的步驟如下。首先如圖所示步驟502,提供基板於一承載裝置上。接著如步驟504藉由一液體噴霧裝置,產生複數個液體粒子。液體粒子分別具有一預定尺寸,並彼此以一預定間距附著於基板之一上表面。然後如步驟506,以一光學辨識裝置針對基板之上表面進行掃描,以擷取至少一影像,並辨識影像中的液體粒子。當基板上未含有汙染物時,液體粒子附著於上表面呈一約略球面狀,而當基板上含有汙染物時,液體粒子附著於上表面呈一非球面狀或一薄膜狀。如上所述,步驟506中,如果汙染物或因汙染導致基板表面能改變,會造成液體粒子的影像有不同呈現,比如色彩不同,液體粒子尺寸、間距或形態上的改變,也可以藉由液體粒子色彩,尺寸,間距,形態辨識進行判斷有無汙染。另外,如上所述,步驟504中可以加入如前所述的網版,使得液體粒子可以更均勻分布,並在步驟506前移除網版。值得注意的是,雖然上述的實施例中,液體粒子係以純水或去離子水為例,然而熟習此技藝者應知,可依據上表面材質及汙染物種類,而採用其他的液體作為液體粒子,比如有機溶劑,只要液體粒子與污染物混合或融合,或者汙染物改變基板表面能會產生明顯外觀的變化,比如形狀,尺寸,間距,色彩,形態等,即可藉由光學辨識技術鑑別,以判斷是否有汙染。Referring to FIG. 5, a flow chart of an optical identification method according to an embodiment of the invention is shown. In some embodiments, the steps of the optical identification method of the present invention are as follows. First, as shown in step 502, the substrate is provided on a carrier. A plurality of liquid particles are then produced by a liquid spray device as in step 504. The liquid particles respectively have a predetermined size and are attached to the upper surface of one of the substrates at a predetermined interval from each other. Then, in step 506, an optical recognition device is used to scan the upper surface of the substrate to capture at least one image and identify liquid particles in the image. When the substrate does not contain contaminants, the liquid particles adhere to the upper surface to have an approximately spherical shape, and when the substrate contains contaminants, the liquid particles adhere to the upper surface to form an aspherical shape or a film shape. As described above, in step 506, if the surface energy of the substrate is changed due to contaminants or contamination, the image of the liquid particles may be differently displayed, such as different colors, changes in liquid particle size, spacing, or morphology, and may also be by liquid. Particle color, size, spacing, and shape identification are used to determine whether there is contamination. Additionally, as noted above, the screen as previously described may be added in step 504 such that the liquid particles may be more evenly distributed and the screen removed prior to step 506. It should be noted that although the liquid particles are exemplified by pure water or deionized water in the above embodiments, those skilled in the art should know that other liquids can be used as the liquid according to the upper surface material and the type of the contaminant. Particles, such as organic solvents, can be identified by optical identification techniques as long as the liquid particles are mixed or fused with contaminants, or the contaminants change the surface properties of the substrate to produce significant changes in appearance, such as shape, size, spacing, color, morphology, etc. To determine if there is pollution.
藉由以上較佳具體實施例之詳述,係希望能更加清楚描述本發明之特徵與精神,而並非以上述所揭露的較佳具體實施例來對本發明之範疇加以限制。相反地,其目的是希望能涵蓋各種改變及具相等性的安排於本發明所欲申請之專利範圍的範疇內。雖然本發明已以實施方式揭露如 上,然其並非用以限定本發明,任何熟習此技藝者,在不脫離本創作之精神和範圍內,當可作各種之更動與潤飾,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。The features and spirit of the present invention will be more apparent from the detailed description of the preferred embodiments. On the contrary, the intention is to cover various modifications and equivalents within the scope of the invention as claimed. Although the invention has been disclosed in an embodiment, However, it is not intended to limit the invention, and any person skilled in the art can make various changes and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention is attached to the patent application. The scope is defined.
208,208’‧‧‧液體粒子208,208’‧‧‧ liquid particles
210‧‧‧光學辨識裝置210‧‧‧Optical identification device
200‧‧‧光學辨識系統200‧‧‧ Optical Identification System
212‧‧‧光學鏡頭212‧‧‧ optical lens
202‧‧‧基板202‧‧‧Substrate
214‧‧‧電荷耦合元件214‧‧‧Charge-coupled components
204‧‧‧上表面204‧‧‧Upper surface
216‧‧‧影像辨識裝置216‧‧‧Image recognition device
206‧‧‧液體噴霧裝置206‧‧‧Liquid spray device
220‧‧‧承載裝置220‧‧‧ Carrying device
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CN101089616A (en) * | 2006-06-13 | 2007-12-19 | Sfa工程股份有限公司 | Substrates support table and substrates examination device with same |
CN101303274A (en) * | 2007-02-15 | 2008-11-12 | 三星电子株式会社 | Contamination analyzing apparatus, its method, and reticle washing system using it |
TW201018897A (en) * | 2008-07-14 | 2010-05-16 | Tokyo Electron Ltd | Foreign material detecting method, foreign material detecting apparatus, foreign material detecting system and storage medium |
TW201201572A (en) * | 2010-06-25 | 2012-01-01 | Pixart Imaging Inc | Detecting device |
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CN101089616A (en) * | 2006-06-13 | 2007-12-19 | Sfa工程股份有限公司 | Substrates support table and substrates examination device with same |
CN101303274A (en) * | 2007-02-15 | 2008-11-12 | 三星电子株式会社 | Contamination analyzing apparatus, its method, and reticle washing system using it |
TW201018897A (en) * | 2008-07-14 | 2010-05-16 | Tokyo Electron Ltd | Foreign material detecting method, foreign material detecting apparatus, foreign material detecting system and storage medium |
TW201201572A (en) * | 2010-06-25 | 2012-01-01 | Pixart Imaging Inc | Detecting device |
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