CN101075653A - 准垂直混合式N型高掺杂GaN LED倒装芯片制备工艺 - Google Patents
准垂直混合式N型高掺杂GaN LED倒装芯片制备工艺 Download PDFInfo
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- CN101075653A CN101075653A CNA200610124448XA CN200610124448A CN101075653A CN 101075653 A CN101075653 A CN 101075653A CN A200610124448X A CNA200610124448X A CN A200610124448XA CN 200610124448 A CN200610124448 A CN 200610124448A CN 101075653 A CN101075653 A CN 101075653A
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CNB200610124448XA CN100463241C (zh) | 2006-09-05 | 2006-09-05 | 准垂直混合式N型高掺杂GaN LED倒装芯片的制备方法 |
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CNB200610124448XA CN100463241C (zh) | 2006-09-05 | 2006-09-05 | 准垂直混合式N型高掺杂GaN LED倒装芯片的制备方法 |
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CN101075653A true CN101075653A (zh) | 2007-11-21 |
CN100463241C CN100463241C (zh) | 2009-02-18 |
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012040978A1 (zh) * | 2010-09-29 | 2012-04-05 | 映瑞光电科技(上海)有限公司 | 发光装置及其制造方法 |
CN102544274A (zh) * | 2010-12-16 | 2012-07-04 | Lg伊诺特有限公司 | 晶片衬底结合结构、发光器件和用于制造发光器件的方法 |
CN102800778A (zh) * | 2011-05-27 | 2012-11-28 | 东莞市福地电子材料有限公司 | 一种芯片倒装的发光二极管及其制造方法 |
CN103972223A (zh) * | 2013-04-16 | 2014-08-06 | 朱慧琴 | Led多杯集成一体化cob光源及其封装方法 |
CN104779331A (zh) * | 2015-03-12 | 2015-07-15 | 聚灿光电科技股份有限公司 | 一种具有二维电子气结构的GaN基LED器件及其制备方法 |
CN111312869A (zh) * | 2020-03-04 | 2020-06-19 | 深圳市炬诠科技有限公司 | 一种具有纳米二氧化钛层的led芯片及制备方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100353576C (zh) * | 2004-11-19 | 2007-12-05 | 中国科学院半导体研究所 | 倒装氮化镓基发光二极管芯片的制作方法 |
CN1694269A (zh) * | 2005-01-21 | 2005-11-09 | 杭州士兰明芯科技有限公司 | 发光二极管及其制造方法 |
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2006
- 2006-09-05 CN CNB200610124448XA patent/CN100463241C/zh not_active Expired - Fee Related
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012040978A1 (zh) * | 2010-09-29 | 2012-04-05 | 映瑞光电科技(上海)有限公司 | 发光装置及其制造方法 |
CN102544274A (zh) * | 2010-12-16 | 2012-07-04 | Lg伊诺特有限公司 | 晶片衬底结合结构、发光器件和用于制造发光器件的方法 |
CN102544274B (zh) * | 2010-12-16 | 2015-02-25 | Lg伊诺特有限公司 | 晶片衬底结合结构、发光器件和用于制造发光器件的方法 |
US8987920B2 (en) | 2010-12-16 | 2015-03-24 | Lg Innotek Co., Ltd. | Wafer substrate bonding structure and light emitting device comprising the same |
CN102800778A (zh) * | 2011-05-27 | 2012-11-28 | 东莞市福地电子材料有限公司 | 一种芯片倒装的发光二极管及其制造方法 |
CN102800778B (zh) * | 2011-05-27 | 2015-03-18 | 东莞市福地电子材料有限公司 | 一种芯片倒装的发光二极管及其制造方法 |
CN103972223A (zh) * | 2013-04-16 | 2014-08-06 | 朱慧琴 | Led多杯集成一体化cob光源及其封装方法 |
CN104779331A (zh) * | 2015-03-12 | 2015-07-15 | 聚灿光电科技股份有限公司 | 一种具有二维电子气结构的GaN基LED器件及其制备方法 |
CN111312869A (zh) * | 2020-03-04 | 2020-06-19 | 深圳市炬诠科技有限公司 | 一种具有纳米二氧化钛层的led芯片及制备方法 |
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CN100463241C (zh) | 2009-02-18 |
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Denomination of invention: Process for producing quasi-vertical hybrid N-type GaN LED reversed chip with high-doping performance Effective date of registration: 20110815 Granted publication date: 20090218 Pledgee: Bank of Hankou, Limited by Share Ltd, Optics Valley branch Pledgor: Diyuan Photoelectric Science & Technology Co., Ltd., Wuhan Registration number: 2011990000310 |
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