CN101075650A - 适用于覆晶封装的发光二极管结构及其制造方法 - Google Patents
适用于覆晶封装的发光二极管结构及其制造方法 Download PDFInfo
- Publication number
- CN101075650A CN101075650A CN 200610082598 CN200610082598A CN101075650A CN 101075650 A CN101075650 A CN 101075650A CN 200610082598 CN200610082598 CN 200610082598 CN 200610082598 A CN200610082598 A CN 200610082598A CN 101075650 A CN101075650 A CN 101075650A
- Authority
- CN
- China
- Prior art keywords
- layer
- utmost point
- emitting diode
- contact
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Landscapes
- Led Device Packages (AREA)
Abstract
Description
Claims (19)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200610082598 CN100508226C (zh) | 2006-05-18 | 2006-05-18 | 适用于覆晶封装的发光二极管结构及其制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200610082598 CN100508226C (zh) | 2006-05-18 | 2006-05-18 | 适用于覆晶封装的发光二极管结构及其制造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101075650A true CN101075650A (zh) | 2007-11-21 |
CN100508226C CN100508226C (zh) | 2009-07-01 |
Family
ID=38976543
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 200610082598 Expired - Fee Related CN100508226C (zh) | 2006-05-18 | 2006-05-18 | 适用于覆晶封装的发光二极管结构及其制造方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN100508226C (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106058024A (zh) * | 2015-04-17 | 2016-10-26 | 南茂科技股份有限公司 | 一种半导体封装及其制造方法 |
CN107402466A (zh) * | 2017-08-31 | 2017-11-28 | 深圳市华星光电技术有限公司 | 液晶显示面板的邦定方法与液晶显示面板邦定结构 |
CN109755266A (zh) * | 2017-11-02 | 2019-05-14 | 錼创显示科技股份有限公司 | 微型发光二极管显示面板 |
-
2006
- 2006-05-18 CN CN 200610082598 patent/CN100508226C/zh not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106058024A (zh) * | 2015-04-17 | 2016-10-26 | 南茂科技股份有限公司 | 一种半导体封装及其制造方法 |
CN107402466A (zh) * | 2017-08-31 | 2017-11-28 | 深圳市华星光电技术有限公司 | 液晶显示面板的邦定方法与液晶显示面板邦定结构 |
CN109755266A (zh) * | 2017-11-02 | 2019-05-14 | 錼创显示科技股份有限公司 | 微型发光二极管显示面板 |
CN109755266B (zh) * | 2017-11-02 | 2021-01-12 | 錼创显示科技股份有限公司 | 微型发光二极管显示面板 |
Also Published As
Publication number | Publication date |
---|---|
CN100508226C (zh) | 2009-07-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102194948B (zh) | 发光器件和发光器件封装 | |
CN107256860B (zh) | 半导体发光元件及其制作方法 | |
TWI616004B (zh) | 半導體發光元件 | |
WO2013165124A1 (ko) | 발광다이오드 패키지 및 그 제조방법 | |
CN112164742B (zh) | 一种发光二极管 | |
TWI597864B (zh) | 具有複數個發光結構之發光元件 | |
CN102237473B (zh) | 发光二极管及其制造方法 | |
US8581285B2 (en) | Semiconductor light-emitting element for flip-chip mounting | |
TWI604633B (zh) | 發光元件 | |
CN102237460A (zh) | 发光器件 | |
CN1731592A (zh) | 倒装焊结构发光二极管及其制造方法 | |
TW200828611A (en) | Electroluminescent device, and fabrication method thereof | |
CN107369753B (zh) | 发光元件 | |
TWI549278B (zh) | 發光二極體元件 | |
JP6546660B2 (ja) | 窒化物半導体発光素子用の基台及びその製造方法 | |
TWI546844B (zh) | 半導體發光元件及其製作方法 | |
CN114256391A (zh) | 显示基板的制作方法、显示基板及显示装置 | |
CN110265517A (zh) | 发光元件 | |
WO2014012323A1 (zh) | 一种倒装焊发光二极管的制造方法 | |
CN101075650A (zh) | 适用于覆晶封装的发光二极管结构及其制造方法 | |
CN109638125A (zh) | 一种倒装led芯片及其制作方法 | |
CN1779996A (zh) | 在金属热沉上的激光剥离功率型led芯片及其制备方法 | |
TWI397200B (zh) | 發光二極體元件及其封裝結構與製造方法 | |
CN109616564B (zh) | 一种倒装led芯片及其制作方法 | |
CN1649178A (zh) | 发光二极管元件、覆晶式发光二极管封装结构与光反射结构 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Luxtaltek Corporation Assignor: Zhoulei Science &. Technology Co., Ltd. Contract record no.: 2010990001028 Denomination of invention: Light-emitting diodes for crystal-coated package and its production Granted publication date: 20090701 License type: Exclusive License Open date: 20071121 Record date: 20101231 |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090701 Termination date: 20180518 |
|
CF01 | Termination of patent right due to non-payment of annual fee |