CN101060163A - Organic EL device and its manufacture method - Google Patents
Organic EL device and its manufacture method Download PDFInfo
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- CN101060163A CN101060163A CN 200610076737 CN200610076737A CN101060163A CN 101060163 A CN101060163 A CN 101060163A CN 200610076737 CN200610076737 CN 200610076737 CN 200610076737 A CN200610076737 A CN 200610076737A CN 101060163 A CN101060163 A CN 101060163A
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Abstract
The disclosed organic electroluminescence (OEL) device comprises: a substrate including at least one first concave area near its edge; at least one OEL element, including a first electrode, at least one organic function layer, and a second electrode; and a package unit including a cover plate and the adhesive, wherein the adhesive is partial accommodated in the first concave area to connect the cover plate and substrate. The corresponding preparation method comprises: in turns, preparing the OEL element and the concave area, and packing the product.
Description
Technical field
The present invention relates to a kind of Organic Light-Emitting Device and manufacture method thereof, particularly relate to a kind of Organic Light-Emitting Device and manufacture method thereof that is applied to substrate or cover plate thinning.
Background technology
Organic electroluminescence display device (organic electroluminescent apparatus) has self-luminous, the restriction of no visual angle, power saving, processing procedure is simple and easy, low-cost, operating temperature range is wide, the advantage of high answer speed and full-colorization or the like, make it have great potentiality, be expected to become the main flow of New Times flat display apparatus.
Organic light emitting apparatus is the device that a kind of self-luminous characteristic of utilizing organic functional material (organic functionalmaterials) reaches display effect, it can be divided into micromolecule organic light emitting apparatus (small molecule OLED according to the molecular weight difference of organic functional material, SM-OLED) with macromolecule organic light emitting apparatus (polymer light-emitting device, PLED) two big classes; If according to the type of drive difference, (passive matrixOLED is PM-OLED) with active organic electroluminescent display unit (active matrixOLED, AM-OLED) two big classes can be divided into the passive type organic electroluminescence display device.
See also shown in Figure 1, known Organic Light-Emitting Device 1, it is to comprise a substrate 11 and at least one organic electroluminescent element 12 is arranged on the substrate 11, wherein organic electroluminescent element 12 comprises an anode 121, an organic functional layer 122 and a negative electrode 123 in regular turn, but and anode 121 and the position of negative electrode 123 are double replacements mutually.Action principle is to impose electric current between electrode 121,123, when making electric hole and electronics in organic functional layer 122, produce exciton in conjunction with (recombination) again, just can make organic functional layer 122 according to its properties of materials, and produce the mechanism of giving out light of different colours.
Because the material of organic functional layer 122 is very responsive for aqueous vapor and/or oxygen, for guaranteeing the useful life of Organic Light-Emitting Device 1, as shown in Figure 1, Organic Light-Emitting Device 1 more comprises the encapsulation unit of cover plate 13 for example, be bonding on the substrate 11 by an adhesive agent 14, form a confined space, hold organic electroluminescent element 12, to intercept the intrusion of aqueous vapor and/or oxygen.
The above-mentioned integral thickness scope that comprises the Organic Light-Emitting Device 1 of cover plate 13 is to be 1.4mm to 2.2mm, the electronic product trend is light and for meeting in recent years, thin, short, little development, known is the purpose that reaches reduction Organic Light-Emitting Device 1 integral thickness with the technology of for example etch process thin substrate 11 and/or cover plate 13, wherein substrate 11 and/or cover plate 13 can carry out number of assembling steps again after thinning, in this reduction by substrate 11 and/or cover plate 13 thickness, the integral thickness of the Organic Light-Emitting Device 1 after the assembling can be reduced between the 1.2mm-1.65mm, yet, since substrate 11 and/or cover plate 13 that thickness reduces, the problem of in manufacture process, deriving easily and breaking.
In addition, substrate 11 and/or cover plate 13 also can carry out the thinning processing procedure afterwards again with each member assembling, in this, Organic Light-Emitting Device 1 after the assembling needs in addition to be beneficial to follow-up thinning processing procedure (as shown in Figure 2) with reinforced structure with an adhesive agent 14 ' involution around device 1, wherein adhesive agent 14 ' also partly is placed between the spacing of substrate 11 and cover plate 13 all around except coating device 1, adhesive agent 14 ' when preventing substrate 11 and/or cover plate 13 thinning processing procedures around the device 1 comes off, and invasion and attack destroy the organic electroluminescent element 12 between substrate 11 and the cover plate 13 via the spacing infiltration to avoid etching solution for example, yet, because the spacing of cover plate 13 and substrate 11 is 5 μ m-15 μ m only, so need adhesive agent 14 ' could inserted between spacing with superfine little syringe needle or via high-pressure extrusion cover plate 13 and substrate 11 on the processing procedure, therefore increase degree of difficulty and the cost of manufacture on the processing procedure.
This shows that above-mentioned existing Organic Light-Emitting Device and manufacture method thereof obviously still have inconvenience and defective, and demand urgently further being improved in product structure, manufacture method and use.In order to solve the problem of above-mentioned existence, relevant manufacturer there's no one who doesn't or isn't seeks solution painstakingly, but do not see always that for a long time suitable design finished by development, and common product does not have appropriate structure to address the above problem, this obviously is the problem that the anxious desire of relevant dealer solves.Therefore how to found a kind of new structure-reinforced, processing procedure is simple and easy and be beneficial to Organic Light-Emitting Device and the manufacture method thereof that is applied in substrate or cover plate thinning, has just become the current industry utmost point to need improved target.
Because the defective that above-mentioned existing Organic Light-Emitting Device and manufacture method thereof exist, the inventor is based on being engaged in this type of product design manufacturing abundant for many years practical experience and professional knowledge, and the utilization of cooperation scientific principle, actively studied innovation, in the hope of founding a kind of new Organic Light-Emitting Device and manufacture method thereof, can improve general existing Organic Light-Emitting Device and manufacture method thereof, make it have more practicality.Through constantly research, design, and after studying sample and improvement repeatedly, create the present invention who has practical value finally.
Summary of the invention
Because the problems referred to above, the object of the present invention is to provide a kind of structure-reinforced, processing procedure is simple and easy and be beneficial to Organic Light-Emitting Device and the manufacture method thereof that is applied to substrate or cover plate thinning.
The object of the invention to solve the technical problems realizes by the following technical solutions.A kind of Organic Light-Emitting Device according to the present invention proposes comprises: a substrate, and it is to comprise an edge or the periphery that at least one first depressed area is adjacent to substrate; At least one organic electroluminescent element, it is to comprise one first electrode, at least one organic functional layer and one second electrode to be arranged on the substrate in regular turn; And an encapsulation unit, it is to cover organic electroluminescent element, and encapsulation unit is to comprise a cover plate and an adhesive agent, and adhesive agent is that part is placed in first depressed area binding cover plate and substrate.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
Aforesaid Organic Light-Emitting Device, the spacing of first depressed area of wherein said cover plate and substrate are greater than 15 μ m.
Aforesaid Organic Light-Emitting Device, wherein said cover plate are to comprise at least one second depressed area, and it is an edge or the periphery that is adjacent to cover plate.
Aforesaid Organic Light-Emitting Device, wherein said adhesive agent are that part is placed in second depressed area or adhesive agent is to coat substrate or at least one side of cover plate or the side that adhesive agent is covered substrate or cover plate.
The object of the invention to solve the technical problems also realizes by the following technical solutions.A kind of Organic Light-Emitting Device according to the present invention proposes comprises: a substrate; At least one organic electroluminescent element, it is to comprise one first electrode, at least one organic functional layer and one second electrode to be arranged on the substrate in regular turn; An and encapsulation unit, it is to cover organic electroluminescent element, encapsulation unit is to comprise a cover plate and an adhesive agent, and cover plate is to comprise an edge or the periphery that at least one first depressed area is adjacent to cover plate, and adhesive agent is that part is placed in first depressed area binding cover plate and substrate.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
Aforesaid Organic Light-Emitting Device, the spacing of first depressed area of wherein said substrate and cover plate are greater than 15 μ m.
Aforesaid Organic Light-Emitting Device, wherein said substrate are to comprise at least one second depressed area, and it is an edge or the periphery that is adjacent to substrate.
Aforesaid Organic Light-Emitting Device, wherein said adhesive agent are that part is placed in second depressed area or adhesive agent is to coat substrate or at least one side of cover plate or the side that adhesive agent is covered substrate or cover plate.
The object of the invention to solve the technical problems also realizes in addition by the following technical solutions.The manufacture method of a kind of Organic Light-Emitting Device that proposes according to the present invention comprises: an organic electroluminescent element making step, and it is that one first electrode, an organic functional layer and one second electrode are set on a substrate in regular turn; One depressed area making step, it is in an edge of a substrate or a cover plate or periphery forms at least one first depressed area; And an encapsulation step, it is partly to be placed in first depressed area with an adhesive agent cover plate is linked to substrate.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
The manufacture method of aforesaid Organic Light-Emitting Device, the spacing of the wherein said substrate and first depressed area are that the spacing greater than 15 μ m or the cover plate and first depressed area is greater than 15 μ m.
The manufacture method of aforesaid Organic Light-Emitting Device, it more comprises corresponding first depressed area, at least one second depressed area and is arranged at another edge or the periphery of substrate or cover plate.
The manufacture method of aforesaid Organic Light-Emitting Device, wherein said adhesive agent are that part is placed in second depressed area or adhesive agent is to coat substrate or at least one side of cover plate or the side that adhesive agent is covered substrate or cover plate.
By technique scheme, Organic Light-Emitting Device of the present invention and manufacture method thereof have following advantage at least:
The present invention is relevant for a kind of Organic Light-Emitting Device and manufacture method thereof, it is to be formed with a depressed area in an edge of the cover plate of substrate and/or encapsulation unit or periphery, this depressed area makes the part pitch enlargement of the substrate and the cover plate of Organic Light-Emitting Device, compared to known techniques, since the depressed area only the part thinning substrate and/or cover plate, therefore do not influence substrate and/or structure of cover plate intensity, in addition, when substrate and/or cover plate carry out the thinning processing procedure, the depressed area has also increased the accommodation space of the required adhesive agent of intensifying device structure, so avoided substrate and/or the easy situation of breaking of cover plate after the known thinning, and exempted the known superfine little syringe needle of use that needs and injected the technical limitations of adhesive agent or high-pressure extrusion substrate and cover plate, thereby reduced the difficulty and the cost of manufacture of processing procedure.
In sum, the present invention has above-mentioned plurality of advantages and practical value, no matter it all has bigger improvement on product structure, manufacture method or function, obvious improvement is arranged technically, and produced handy and practical effect, and more existing Organic Light-Emitting Device and manufacture method thereof have the effect of enhancement, thus be suitable for practicality more, and have the extensive value of industry, really be a new and innovative, progressive, practical new design.
Above-mentioned explanation only is the general introduction of technical solution of the present invention, for can clearer understanding technological means of the present invention, and can be implemented according to the content of specification, and for above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, below especially exemplified by preferred embodiment, and conjunction with figs., be described in detail as follows.
Description of drawings
Fig. 1 is the schematic diagram of the known a kind of Organic Light-Emitting Device of a demonstration.
Fig. 2 is the schematic diagram of the known another kind of Organic Light-Emitting Device of a demonstration.
Fig. 3-Fig. 6 is for showing the schematic diagram according to a kind of Organic Light-Emitting Device of first embodiment of the invention.
Fig. 7 is the schematic diagram of a demonstration according to a kind of Organic Light-Emitting Device of second embodiment of the invention.
Fig. 8 is the schematic diagram of a demonstration according to a kind of substrate of third embodiment of the invention.
Fig. 9 is the flow chart of a demonstration according to the manufacture method of a kind of Organic Light-Emitting Device of fourth embodiment of the invention.
Figure 10 is the flow chart of a demonstration according to the manufacture method of a kind of Organic Light-Emitting Device of fifth embodiment of the invention.
121: anode 123: negative electrode
1,2,4: Organic Light- Emitting Device 11,21,30,41: substrate
211,433: the first depressed areas 12,22,43: organic electroluminescent element
221,421: the first electrodes 122,222,422: organic functional layer
223,423: the second electrodes 23,43: encapsulation unit
13,231,431: cover plate 14,232,33,432: adhesive agent
233,434: disposal area 234,411: the second depressed areas
31: body 32: depressed area
D1, D2: interval S 1, S2, S3, S4: process step
S1 ', S2 ', S3 ', S4 ': process step
Embodiment
Reach technological means and the effect that predetermined goal of the invention is taked for further setting forth the present invention, below in conjunction with accompanying drawing and preferred embodiment, to Organic Light-Emitting Device and its embodiment of manufacture method, structure, manufacture method, step, feature and the effect thereof that foundation the present invention proposes, describe in detail as after.
First embodiment
See also shown in Figure 3ly, comprise a substrate 21, at least one organic electroluminescent element 22 and an encapsulation unit 23 according to a kind of Organic Light-Emitting Device 2 of preferred embodiment of the present invention.
See also shown in Figure 3ly, organic electroluminescent element 22 is to comprise one first electrode 221, at least one organic functional layer 222 and one second electrode 223 to be arranged in regular turn on the substrate 21.
In the present embodiment, first electrode 221 is generally anode, its material is the metal oxide that can be conduction, the conduction metal oxide be selected from indium tin oxide, aluminium zinc oxide, indium-zinc oxide and cadmium tin-oxide at least one of them, form on the substrate 21 with for example sputter (sputtering) or ion plating modes such as (ionplating); In addition, organic functional layer 222 comprises an electric hole implanted layer, an electric hole transfer layer, a luminescent layer, barrier layer, an electric hole, an electron transfer layer, an electron injecting layer and combination (not shown) thereof usually, and organic functional layer 222 is to utilize evaporation (evaporation), rotary coating (spin coating), ink jet printing (ink jet printing), transfer (transfer) or printing modes such as (printing) to be formed on first electrode 221; Second electrode 223 is usually as negative electrode, its material is to can be conductive material, conductive material be selected from aluminium, calcium, magnesium, indium, tin, manganese, copper, silver, gold and alloy thereof at least one of them, the alloy that wherein contains magnesium can be magnesium silver alloy, magnesium indium alloy, magnesium ashbury metal, magnesium antimony alloy or magnesium tellurium alloy, utilizes methods such as sputter or ion plating to be formed on the organic functional layer 222.
In addition, the material of first electrode 221 and second electrode 223 with as the application of anode and cathode, can be exchanged according to actual demand.
In the present embodiment, as shown in Figure 5, cover plate 231 also can comprise the edge that at least one second depressed area 234 is adjacent to cover plate 231, as mentioned above, second depressed area 234 is the peripheries that can be adjacent to cover plate 231, in this, the collocation of second depressed area 234 and first depressed area 211 and the spacing of enlarged substrate 21 and cover plate 231 more.
See also shown in Figure 5, adhesive agent 232 is partly to be placed in first depressed area 211 and second depressed area 234 and binding substrate 21 and cover plate 231, in addition, adhesive agent 232 also can coat at least one side of substrate 21 and/or cover plate 231, in the present embodiment, adhesive agent 232 is the edge all around that coat substrate 21 and cover plate 231; In addition, adhesive agent 232 also can be covered in a side of substrate 21 (as shown in Figure 6) or cover plate 231, in order to Organic Light-Emitting Device 2 structures of strengthening pending thinning processing procedure, in order to the thinning processing procedure of subsequent substrate 21 and/or cover plate 231.Wherein adhesive agent 232 is to be optic-solidified adhesive or heat-curable glue.
Second embodiment
Seeing also shown in Figure 7ly, is to comprise a substrate 41, at least one organic electroluminescent element 42 and an encapsulation unit 43 according to a kind of Organic Light-Emitting Device 4 of preferred embodiment of the present invention.
Because member, the material of the substrate 41 of present embodiment and organic electroluminescent element 42, relation and functional character are set is as described in the similar elements of first embodiment, so repeat no more.
In the present embodiment, encapsulation unit 43 is to cover organic electroluminescent element 42, it is to comprise a cover plate 431 and an adhesive agent 432, cover plate 431 is to comprise the edge that at least one first depressed area 433 is adjacent to cover plate 431, as shown in Figure 7, first depressed area 433 is the peripheries that are adjacent to cover plate 431, and the space D 2 that makes substrate 41 and first depressed area 433 of cover plate 431 is greater than 15 μ m.Wherein, cover plate 431 also can more comprise at least one disposal area 434 relative organic electroluminescent elements 42 and be provided with, and its depth bounds is between the 0.2mm to 0.25mm.
See also shown in Figure 5ly, in the present embodiment, substrate 41 also can comprise at least one second depressed area 411, and it is an edge that is adjacent to substrate 41, and as mentioned above, second depressed area 411 is the peripheries that are adjacent to substrate 41.
From the above, the relation that is provided with, material and the functional character of the cover plate of present embodiment 431 and adhesive agent 432 is all as described in the similar elements of first embodiment, so do not give unnecessary details at this.
The 3rd embodiment
See also shown in Figure 8ly, comprise a body 31 and at least one depressed area 32 according to the substrate 30 of a kind of Organic Light-Emitting Device of preferred embodiment of the present invention, depressed area 32 is edges that are adjacent to body 31.
The body 31 of present embodiment is can be as the application of the substrate 21 of first embodiment, in addition, also can be as the application of the cover plate 231 of first embodiment, for example can more comprise at least one disposal area 233 and be formed at (as shown in Figure 3) on the body 31, be all as mentioned above, so do not give unnecessary details at this with the material of the body 31 of present embodiment and architectural feature; And being provided with of the depressed area 32 of present embodiment concerns it is the application (as shown in Figure 4) that can be first depressed area 211 and second depressed area 234 of first embodiment, so also do not give unnecessary details at this.
In addition, the substrate 30 of present embodiment more comprises an adhesive agent 33 parts and is placed in depressed area 32.Because, the material of the adhesive agent 33 of present embodiment, relation and functional character are set all as described in the first embodiment similar elements, so repeat no more.
The 4th embodiment
Seeing also shown in Figure 9ly, according to the manufacture method of a kind of Organic Light-Emitting Device of preferred embodiment of the present invention, is to comprise a substrate manufacture step S1, an organic electroluminescent element making step S2 and an encapsulation step S3.
In step S1, be to be formed up to few one first depressed area in an edge of substrate, in the present embodiment, first depressed area is the periphery that is formed at substrate in for example modes such as dry-etching, Wet-type etching, mechanical lapping or sandblast.Wherein, substrate be selected from rigid substrates, flexible base, board, glass substrate, plastic substrate and silicon substrate at least one of them, and its material be selected from polymethyl methyl esters, plastic cement, macromolecule, glass and silicon at least one of them.
In step S2, be that one first electrode, an organic functional layer and one second electrode are set on substrate in regular turn, in more detail, first electrode is to be formed on the substrate with for example sputter (sputtering) or ion plating modes such as (ion plating), the material of first electrode is the metal oxide that can be conduction, the metal oxide of conduction be selected from indium tin oxide, aluminium zinc oxide, indium-zinc oxide and cadmium tin-oxide at least one of them; The organic functional layer is to be formed on first electrode with for example evaporation (evaporation), rotary coating (spin coating), ink jet printing (ink jet printing), transfer (transfer) or printing modes such as (printing); Second electrode is to be formed on the organic functional layer with for example method such as sputter or ion plating, wherein the material of second electrode is to can be conductive material, conductive material be selected from aluminium, calcium, magnesium, indium, tin, manganese, copper, silver, gold and alloy thereof at least one of them, the alloy that wherein contains magnesium can be magnesium silver alloy, magnesium indium alloy, magnesium ashbury metal, magnesium antimony alloy or magnesium tellurium alloy.In addition, the material of first electrode and second electrode can be exchanged according to actual demand.
In step S3, be partly to be placed in first depressed area so that a cover plate is linked on the substrate with an adhesive agent, in this, the spacing of first depressed area of cover plate and substrate is greater than 15 μ m.Wherein adhesive agent is to be optic-solidified adhesive or heat-curable glue.
In the present embodiment, adhesive agent also is at least one side of coating cover plate and substrate, comes off with the adhesive agent of avoiding being placed between substrate and the cover plate, and in addition, adhesive agent also can be covered in a side of substrate or cover plate, with the intensity of reinforcement more.
In addition, before step S3, cover plate is that for example modes such as dry-etching, Wet-type etching, mechanical lapping or sandblast form at least one second depressed area, second depressed area is an edge that is adjacent to cover plate, in the present embodiment, second depressed area is the periphery that is adjacent to cover plate, promptly be formed at cover plate around; In addition, also can form the relative organic electroluminescent element setting at least one disposal area on cover plate, wherein the depth bounds of disposal area is between the 0.2mm to 0.25mm.
After step S3, the manufacture method of present embodiment more comprises a thinning step S4, and it is the thickness with mode thin substrates such as for example dry-etching, Wet-type etching, mechanical lapping or sandblast or cover plate.
The 5th embodiment
See also shown in Figure 10ly, the manufacture method according to a kind of Organic Light-Emitting Device of preferred embodiment of the present invention comprises an organic electroluminescent element making step S1 ', a cover plate making step S2 ' and an encapsulation step S3 '.
In step S1 ', be that one first electrode, an organic functional layer and one second electrode are set on a substrate in regular turn, the relation that is provided with, generation type and the material of the substrate of present embodiment, first electrode, organic functional layer and second electrode is as described in the 4th embodiment similar elements, so do not give unnecessary details at this.
In step S2 ', be to form at least one first depressed area in for example modes such as dry-etching, Wet-type etching, mechanical lapping or sandblast in an edge of cover plate, in the present embodiment, first depressed area is the periphery that is adjacent to cover plate.
In addition, also can form at least one disposal area on cover plate, it is relative organic electroluminescent element setting, and its depth bounds is between the 0.2mm to 0.25mm.
In step S1 ' before, substrate for example modes such as dry-etching, Wet-type etching, mechanical lapping or sandblast forms the edge that one second depressed area is adjacent to substrate, and as mentioned above, second depressed area is to form in the periphery of substrate.
In step S3 ', be partly to be arranged at first depressed area so that cover plate is linked to substrate with an adhesive agent, in this, the spacing of first depressed area of substrate and cover plate is greater than 15 μ m.Because the relation that is provided with and the material of the adhesive agent of present embodiment are as described in the 4th embodiment, so also repeat no more.
In addition, in step S3 ' afterwards, the manufacture method of present embodiment more comprises the thickness of a thinning step S4 ' with mode thin substrates such as for example dry-etching, Wet-type etching, mechanical lapping or sandblast or cover plate.
In sum, because of a kind of Organic Light-Emitting Device of foundation the present invention and manufacture method thereof are that a edge or periphery in the cover plate of substrate and/or encapsulation unit is formed with a depressed area, this depressed area makes the part pitch enlargement of the substrate and the cover plate of Organic Light-Emitting Device, compared to known techniques, since the depressed area only the part thinning substrate and/or cover plate, therefore do not influence substrate and/or structure of cover plate intensity, in addition, when substrate and/or cover plate carry out the thinning processing procedure, the depressed area has also increased the accommodation space of the required adhesive agent of intensifying device structure, it is situation to have avoided substrate after the known thinning and/or cover plate easily to break, and exempted the known superfine little syringe needle of use that needs and injected the technical limitations of adhesive agent or high-pressure extrusion substrate and cover plate, thereby reduced the difficulty and the cost of manufacture of processing procedure.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, though the present invention discloses as above with preferred embodiment, yet be not in order to limit the present invention, any those skilled in the art, in not breaking away from the technical solution of the present invention scope, when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent embodiment of equivalent variations, in every case be not break away from the technical solution of the present invention content, according to technical spirit of the present invention to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solution of the present invention.
Claims (12)
1, a kind of Organic Light-Emitting Device is characterized in that it comprises:
One substrate, it is to comprise an edge or the periphery that at least one first depressed area is adjacent to substrate;
At least one organic electroluminescent element, it is to comprise one first electrode, at least one organic functional layer and one second electrode to be arranged on the substrate in regular turn; And
One encapsulation unit, it is to cover organic electroluminescent element, and encapsulation unit is to comprise a cover plate and an adhesive agent, and adhesive agent is that part is placed in first depressed area binding cover plate and substrate.
2, Organic Light-Emitting Device according to claim 1, the spacing that it is characterized in that first depressed area of wherein said cover plate and substrate are greater than 15 μ m.
3, Organic Light-Emitting Device according to claim 1 is characterized in that wherein said cover plate is to comprise at least one second depressed area, and it is an edge or the periphery that is adjacent to cover plate.
4, Organic Light-Emitting Device according to claim 3 is characterized in that wherein said adhesive agent is that part is placed in second depressed area or adhesive agent is to coat substrate or at least one side of cover plate or the side that adhesive agent is covered substrate or cover plate.
5, a kind of Organic Light-Emitting Device is characterized in that it comprises:
One substrate;
At least one organic electroluminescent element, it is to comprise one first electrode, at least one organic functional layer and one second electrode to be arranged on the substrate in regular turn; And
One encapsulation unit, it is to cover organic electroluminescent element, encapsulation unit is to comprise a cover plate and an adhesive agent, and cover plate is to comprise an edge or the periphery that at least one first depressed area is adjacent to cover plate, and adhesive agent is that part is placed in first depressed area binding cover plate and substrate.
6, Organic Light-Emitting Device according to claim 5, the spacing that it is characterized in that first depressed area of wherein said substrate and cover plate are greater than 15 μ m.
7, Organic Light-Emitting Device according to claim 5 is characterized in that wherein said substrate is to comprise at least one second depressed area, and it is an edge or the periphery that is adjacent to substrate.
8, Organic Light-Emitting Device according to claim 7 is characterized in that wherein said adhesive agent is that part is placed in second depressed area or adhesive agent is to coat substrate or at least one side of cover plate or the side that adhesive agent is covered substrate or cover plate.
9, a kind of manufacture method of Organic Light-Emitting Device is characterized in that it comprises:
One organic electroluminescent element making step, it is that one first electrode, an organic functional layer and one second electrode are set on a substrate in regular turn;
One depressed area making step, it is in an edge of a substrate or a cover plate or periphery forms at least one first depressed area; And
One encapsulation step, it is partly to be placed in first depressed area with an adhesive agent cover plate is linked to substrate.
10, manufacture method according to claim 9, the spacing that it is characterized in that the wherein said substrate and first depressed area are that the spacing greater than 15 μ m or the cover plate and first depressed area is greater than 15 μ m.
11, manufacture method according to claim 9 is characterized in that it more comprises corresponding first depressed area, at least one second depressed area and is arranged at another edge or the periphery of substrate or cover plate.
12, manufacture method according to claim 11 is characterized in that wherein said adhesive agent is that part is placed in second depressed area or adhesive agent is to coat substrate or at least one side of cover plate or the side that adhesive agent is covered substrate or cover plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610076737 CN101060163A (en) | 2006-04-18 | 2006-04-18 | Organic EL device and its manufacture method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN 200610076737 CN101060163A (en) | 2006-04-18 | 2006-04-18 | Organic EL device and its manufacture method |
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| CN101060163A true CN101060163A (en) | 2007-10-24 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016029547A1 (en) * | 2014-08-26 | 2016-03-03 | 京东方科技集团股份有限公司 | Organic electroluminescent device and manufacturing method therefor, and display apparatus |
| WO2018171163A1 (en) * | 2017-03-22 | 2018-09-27 | 京东方科技集团股份有限公司 | Oled packaging structure, display panel, and method for preparing packaging structure |
| CN108807713A (en) * | 2017-04-26 | 2018-11-13 | 昆山维信诺科技有限公司 | A kind of packaging method of display panel, display panel and display device |
-
2006
- 2006-04-18 CN CN 200610076737 patent/CN101060163A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016029547A1 (en) * | 2014-08-26 | 2016-03-03 | 京东方科技集团股份有限公司 | Organic electroluminescent device and manufacturing method therefor, and display apparatus |
| WO2018171163A1 (en) * | 2017-03-22 | 2018-09-27 | 京东方科技集团股份有限公司 | Oled packaging structure, display panel, and method for preparing packaging structure |
| US11183661B2 (en) | 2017-03-22 | 2021-11-23 | Boe Technology Group Co., Ltd. | OLED package structure, display panel and method for preparing package structure |
| US11785794B2 (en) | 2017-03-22 | 2023-10-10 | Boe Technology Group Co., Ltd. | OLED package structure, display panel and method for preparing package structure |
| CN108807713A (en) * | 2017-04-26 | 2018-11-13 | 昆山维信诺科技有限公司 | A kind of packaging method of display panel, display panel and display device |
| CN108807713B (en) * | 2017-04-26 | 2020-05-05 | 昆山维信诺科技有限公司 | Display panel packaging method, display panel and display device |
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