CN108807713A - A kind of packaging method of display panel, display panel and display device - Google Patents
A kind of packaging method of display panel, display panel and display device Download PDFInfo
- Publication number
- CN108807713A CN108807713A CN201710282900.3A CN201710282900A CN108807713A CN 108807713 A CN108807713 A CN 108807713A CN 201710282900 A CN201710282900 A CN 201710282900A CN 108807713 A CN108807713 A CN 108807713A
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- Prior art keywords
- display panel
- case chip
- hydrofluoric acid
- fringe region
- thickness
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The invention discloses the packaging methods of display panel, cause display panel to be scrapped for solving the problem of that prior art hydrofluoric acid during reduction processing penetrates into display panel, including：Reduction processing is carried out to the fringe region of case chip one side；Display panel is bonded with the case chip after being thinned, wherein the one side that the case chip is crossed through reduction processing is opposite with the display panel so that the joint place of the display panel and the case chip forms groove；Hydrofluoric acid resistant glue is coated in the groove.The application also provides a kind of display panel and a kind of display device.
Description
Technical field
The present invention relates to a kind of display technology field more particularly to packaging method of display panel, display panel and displays
Device.
Background technology
With the development of display technology, new display product emerges one after another.Wherein, Organic Light Emitting Diode (OLED,
Organic Light Emitting Display) by its flexible, self-luminosity, wide viewing angle, high comparison, low power consumption, height
It the advantages that reaction rate, simple true color and processing procedure, is increasingly praised highly by panel vendor and consumer.
It is as shown in Figure 1 the structural schematic diagram of the display panel after encapsulation in the prior art, display panel includes display surface
Plate 11 and case chip 12.Pair based on the demand to frivolous display panel, display panel outer surface can be etched by hydrofluoric acid, i.e.,
Display panel 11 in Fig. 1 carries out reduction processing, to achieve the purpose that thinned display panel, i.e., so that display panel 11 is thinned and is
Display panel 11 '.To avoid the display device of panel itself during reduction processing that from being corroded by hydrofluoric acid, often want
Coat hydrofluoric acid resistant glue at display panel and case chip pressing, i.e. hydrofluoric acid resistant glue 13 shown in Fig. 1.
However, in the prior art, when coating hydrofluoric acid resistant glue 13 to display panel 11 and 12 pressing of case chip, pressing
Place often has leak source or the partially thin position of hydrofluoric acid resistant glue, in this way during reduction processing hydrofluoric acid can from leak source or
The partially thin position of hydrofluoric acid resistant glue is penetrated into, the problem of being scrapped so as to cause display panel.
Invention content
The embodiment of the present invention provides a kind of packaging method of display panel, is subtracting for solving display panel in the prior art
Hydrofluoric acid penetrates into thin processing procedure, the problem of causing display panel to be scrapped.
The embodiment of the present invention also provides a kind of display panel, for solve in the prior art display panel in reduction processing mistake
Hydrofluoric acid penetrates into journey, the problem of causing display panel to be scrapped.
The embodiment of the present application also provides a kind of display device, for solve in the prior art display panel in reduction processing mistake
Hydrofluoric acid penetrates into journey, the problem of causing display panel to be scrapped.
The embodiment of the present invention uses following technical proposals：
A kind of packaging method of display panel, including：
Reduction processing is carried out to the fringe region of case chip one side, wherein the one side that the case chip is crossed through reduction processing
It is opposite with the display panel；
Display panel is bonded with the case chip after being thinned so that the display panel and the case chip
Joint place forms groove；
Hydrofluoric acid resistant glue is coated in the groove.
Preferably, reduction processing is carried out to the fringe region of case chip one side, specifically included：
Reduction processing carried out to the fringe region of the case chip one side by etching technics, it is arbitrary in the fringe region
Position is less than preset distance at a distance from nearest side.
Priority carries out reduction processing to the fringe region of the case chip one side by etching technics, specifically includes：
Gluing, development and exposure-processed are carried out to the one side of the case chip, marginal zone is removed in the face by photoresist
Other region overlays other than domain；
Bound edge material is coated in the preset thickness region of the case chip side, the bound edge material is for preventing hydrofluoric acid
Etching, the preset thickness are the thickness that back edge is thinned in preset case chip；
The case chip after cladding bound edge material is performed etching by hydrofluoric acid.
Preferably, after the groove coats hydrofluoric acid resistant glue, the method further includes：
Reduction processing is carried out to the display panel for the display panel being bonded, the entirety of the display panel is thinned
Thickness.
A kind of display panel, the display panel include case chip and display panel, wherein：
The thickness of the case chip fringe region is less than the thickness of intermediate region；
The display panel fits with the case chip, and the case chip fringe region forms recessed with the display panel
Groove-like structure；
Hydrofluoric acid resistant glue is coated in the groove-like structure.
Preferably, the value range of the thickness h 1 of the case chip fringe region is 0.3mm≤h1≤0.75mm, the envelope
The value range of the thickness h 2 of load central area is 0.5mm≤h2≤1.1mm, h1<h2.
Preferably, any position is less than preset distance with the distance apart from nearest side in the fringe region, described pre-
The value range of set a distance is 1mm-10mm.
Preferably, the ingredient of the hydrofluoric acid resistant glue includes acrylate.
A kind of display device, including display panel described above.
Above-mentioned at least one technical solution used in the embodiment of the present invention can reach following advantageous effect：
The packaging method of display panel provided by the present application carries out the fringe region of case chip one side place is thinned first
Reason, then by display panel with it is thinned after case chip be bonded, and the one side crossed through reduction processing of case chip and display
Panel is opposite, just forms groove in the joint place of display panel and case chip in this way, finally coats hydrofluoric acid resistant in a groove
Glue, it is just not in leak source and partially thin position to have coated in a groove in this way after hydrofluoric acid resistant glue, so as to avoid right
When display panel carries out reduction processing, hydrofluoric acid penetrates into display panel from hydrofluoric acid resistant glue leak source and partially thin position, causes to show
Show the problem of panel is scrapped.
Description of the drawings
Attached drawing described herein is used to provide further understanding of the present invention, and constitutes the part of the present invention, this hair
Bright illustrative embodiments and their description are not constituted improper limitations of the present invention for explaining the present invention.In the accompanying drawings：
Fig. 1 is the structural schematic diagram of the display panel after encapsulating in the prior art and carries out that place is thinned to the display panel
The schematic diagram of reason；
Fig. 2 is the implementation process diagram of the packaging method of display panel provided by the present application；
Fig. 3 a are the structural schematic diagram of case chip provided by the present application；
Fig. 3 b provide the process schematic that reduction processing is carried out to case chip fringe region for the application；
Fig. 3 c are the groove structure schematic diagram formed after display panel 31 and case chip 32 are bonded by the application；
Fig. 4 a are a kind of structural schematic diagram of specific implementation mode of display panel provided by the present application；
Fig. 4 b are the structural schematic diagram of the case chip in display panel provided by the present application.
Specific implementation mode
To make the object, technical solutions and advantages of the present invention clearer, below in conjunction with the specific embodiment of the invention and
Technical solution of the present invention is clearly and completely described in corresponding attached drawing.Obviously, described embodiment is only the present invention one
Section Example, instead of all the embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art are not doing
Go out the every other embodiment obtained under the premise of creative work, shall fall within the protection scope of the present invention.
The technical solution provided below in conjunction with attached drawing, each embodiment that the present invention will be described in detail.
Display panel is penetrated into solve prior art hydrofluoric acid during reduction processing, causes what display panel scrapped to ask
Topic, the application provide a kind of packaging method of display panel.As shown in Fig. 2, for the implementation process diagram of this method, including：
Step 11, reduction processing is carried out to the fringe region of case chip one side；
Wherein, reduction processing when that can be that case chip is bonded with display panel, the fringe region in the face, than
Fringe region 32-1 as that can be case chip 32 shown in Fig. 3 a, and the another side of case chip then can according to actual demand and
It is fixed, it will be not specifically limited here.Equally, in practical applications, the specific size and shape of fringe region can also be according to realities
Depending on the demand of border, any position in fringe region can be preset and be less than preset distance at a distance from nearest side.
Preset distance is the depth of the groove formed after being bonded in the later stage, and groove is deeper, then the hydrofluoric acid resistant that can be accommodated
The thickness of glue is thicker, and the thickness of hydrofluoric acid resistant glue can be determined according to actual demand, in practical applications, the thickness of hydrofluoric acid resistant glue
Degree can preferably prevent hydrofluoric acid from corroding display panel, will not cause very much the hydrofluoric acid resistant glue of filling too many greatly due to thickness
And it causes to waste.So in actual demand, those skilled in the art can determine the thickness of hydrofluoric acid resistant glue according to the standard
Degree, that is, determine the occurrence of preset distance.
For example, as shown in Figure 3a, the case chip it is each while fringe region in any position with it is nearest while at a distance from it is equal
Less than preset distance, the pre-determined distance size on each side can be the same or different depending on actual conditions, here not
It limits.
When carrying out reduction processing, the fringe region of case chip one side can be thinned by etching technics, be subtracted
The specific implementation process of thin processing includes：
Sub-step 101：Gluing, development and exposure-processed are carried out to the one side of case chip, to remove the face by photoresist
Other region overlays other than fringe region；
Before carrying out reduction processing to case chip, the surface of case chip can be cleaned, and to the encapsulation after cleaning
The surface of piece carries out drying and processing.
After case chip skin drying, you can gluing processing is carried out to case chip, specifically, can be after drying and processing
The photoresist that uniformly coating a layer thickness of case chip one side is 80 ± 10 μm, which such as can be photosensitive oil
Ink is used for protection packaging piece, and the region coated with photoresist will not be etched away in development treatment.
In order to accelerate the photoresist of dry coating, the case chip for uniformly having coated a face photoresist can be put into oven
In, and toasted under preset baking condition, preset baking condition such as can be that temperature is 120 ± 10
DEG C, when baking a length of 60min.
After the photoresist drying on to be packaged surface, you can processing is exposed, for positive photoresist and negative photo
The region of glue, exposure is different, specifically, when the photoresist of case chip one side coating is positive photoresist, can pass through exposure
Ray machine is exposed processing to the photoresist of fringe region so that the photoresist of fringe region is more prone to be dissolved in developer solution；
And when the photoresist of case chip one side coating is negtive photoresist, other areas that can be by exposure machine to the face in addition to fringe region
Domain is exposed processing so that photoresist is regions curing at other, to be not easily dissolved in developer solution.
The case chip after the completion of exposure-processed is finally subjected to development treatment, to need to be thinned the marginal zone of processing
Domain is exposed.I.e. when photoresist is positive photoresist, then photosensitive photoresist dissolving can be removed by chemical action, will not feel
The photoetching adhesive curing of light, and when photoresist is negtive photoresist, then uncured photoresist can be removed, to need to be thinned
The fringe region of processing is exposed.
Sub-step 102 coats bound edge material in the preset thickness region of case chip side, and the bound edge material is for preventing hydrogen
Fluoric acid etches, which such as can be polyvinyl chloride electric insulation glue adhesive tape；
Wherein, preset thickness is the thickness that back edge is thinned in predetermined case chip, which can be by be etched
The height of groove determine that the occurrence of the preset thickness is that the thickness of case chip subtracts the height of groove to be etched.Also
It is to say, the preset thickness region of case chip side is the region that be not etched away in case chip side, preset thickness therein
Occurrence depend on the thickness of case chip entirety and the height of groove to be formed, the correlation specifically seen in Fig. 3 b shows
Example.It is pre- that any position in preset thickness region is less than second at a distance from the side of nearest another side (one side being not etched)
Set a distance.For example, the thickness of case chip be 0.5mm when, when it is expected to case chip upward one side edge be thinned 0.2mm when, that
Preset thickness region is region of the case chip side between from lower edge to top edge 0.3mm, with protection by cladding
The region of processing is not by hf etching, so as to carry out the reduction processing of preset thickness to case chip.
Sub-step 103 performs etching the case chip after cladding bound edge material by hydrofluoric acid, and after the etch to envelope
Load carries out cleaning, drying, to complete the fringe region progress reduction processing to case chip one side.
Fig. 3 b are please referred to, since other regions other than fringe region have been coated with photoresist, and fringe region is not
There is photoresist, then fringe region will be corroded by hydrofluoric acid, and the preset thickness region of case chip side is also coated
There is bound edge material, will not be corroded by hydrofluoric acid, and side will be corroded without the region that bound edge material coats by hydrofluoric acid, in this way
It can finally realize being thinned to the fringe region of case chip one side, obtain the case chip after fringe region is thinned.
Step 12, display panel is bonded with case chip, wherein the one side that case chip is crossed through reduction processing and display
Panel is opposite so that forms groove at the pressing of display panel and case chip；
Fig. 3 c are please referred to, for the groove 33 that will be formed after display panel 31 and the fitting of case chip 32, wherein case chip 32 passes through
The one side that reduction processing is crossed is opposite with display panel 31.Specific bonding processes are not repeated herein.
Step 13, hydrofluoric acid resistant glue is coated in a groove.
To avoid during carrying out reduction processing to display panel, the display device of panel itself can be by hydrofluoric acid
Erosion, can coat hydrofluoric acid resistant glue in a groove, and coat to the hydrofluoric acid resistant glue fill up display panel and case chip it
Between entire groove until, to complete the encapsulation of display panel.The case where hydrofluoric acid resistant glue is completely filled out in entire groove
Under, in groove the joint place of display panel and case chip certainly can also be covered by hydrofluoric acid resistant glue, and cover thickness with it is recessed
The depth of slot is suitable, is not in hydrofluoric acid resistant glue leak source and partially thin situation.
Since the joint place of display panel and case chip forms fluted, hydrofluoric acid resistant can be coated in a groove in this way
Glue avoids leak source or the partially thin position of hydrofluoric acid resistant glue, and in this way when carrying out reduction processing to display panel, hydrofluoric acid then will not
It is penetrated into from the joint place of display panel and case chip, so as to avoid the display device meeting of panel itself during reduction processing
The problem of being corroded by hydrofluoric acid, display panel caused to be scrapped.
Based on the packaging method of display panel provided by the present application, the application also provides a kind of display panel, including encapsulation
Piece and display panel, wherein the thickness of case chip fringe region is less than the thickness of intermediate region, and display panel is affixed with case chip
It closes, case chip fringe region forms groove-like structure with display panel, and hydrofluoric acid resistant glue is coated in the groove-like structure.Its
In, the fringe region of case chip refers to explaining in detail above, and the intermediate region of case chip is：The case chip and display panel
In the one side of fitting, other regions in addition to fringe region.
Display panel provided by the embodiments of the present application, since the thickness of case chip fringe region is less than the thickness of intermediate region
Degree, after display panel and case chip fit, case chip fringe region forms groove-like structure, the groove-like with display panel
It is coated with hydrofluoric acid resistant glue in structure, is just not in hydrofluoric acid resistant glue leak source in this way in the groove in the display panel and partially thin
Position, so as to avoid when carrying out reduction processing to display panel, hydrofluoric acid is from hydrofluoric acid resistant glue leak source and partially thin
Display panel, the problem of causing display panel to be scrapped, are penetrated into position.
Based on the above-mentioned core idea that display panel provided by the present application has been briefly described, below by specific embodiment party
The design of display panel provided by the present application is described in detail in formula.
Fig. 4 a are please referred to, are a kind of structural schematic diagram of specific implementation mode of display panel provided by the present application, including
Display panel 31 and case chip 32, wherein the thickness of case chip fringe region be less than intermediate region thickness, display panel 31 with
Case chip 32 fits, and case chip fringe region forms groove-like structure 43 with display panel, is coated in the groove-like structure 43
There is hydrofluoric acid resistant glue.
Fig. 4 b are please referred to, are the structural schematic diagram of the case chip 32 of display panel provided by the present application, case chip 42 is specific
Region 32-2 including fringe region 32-1 and for placement display part.In practical applications, the thickness of case chip fringe region
The value range for spending h1 can be 0.3mm≤h1≤0.75mm, and the value range of the thickness h 2 of case chip central area then can be with
For 0.5mm≤h1≤1.1mm.
It should be noted that after being bonded with case chip for ease of display panel, groove-like structure can be formed in joint place, is sealed
To meet condition between the thickness h 1 of load fringe region and the thickness h 2 of case chip central area：h1<H2, and the tool of h1 and h2
Body numerical value can then determine that the application does not limit this according to actual conditions.The value of h2-h1 is the height of groove, this
Sample can form the groove that can fill appropriate hydrofluoric acid resistant glue in the joint place after case chip is bonded with display panel,
The value of the height of groove can be determined according to actual demand, be preferably capable of ensureing that the hydrofluoric acid resistant glue of filling can prevent hydrogen fluorine
Acid attack display panel will not be caused very much the hydrofluoric acid resistant glue of filling too many greatly due to groove and cause to waste.In addition, in order to
Prevent that the thickness of fringe region is too thin and fringe region is caused to be broken, the thickness of fringe region is desirable to be more than 0.3mm.
In addition, any position is less than preset distance at a distance from nearest side in fringe region, which can be
1mm-10mm, preset distance is bigger, then finally formed groove is deeper, and the hydrofluoric acid resistant glue that can be accommodated is also thicker, then aobvious
Show that the performance of panel hydrofluoric acid resistant glue is also better, but the thickness of hydrofluoric acid resistant glue is too thick also without too big meaning, as long as should
Thickness can prevent hydrofluoric acid from entering display panel, and therefore, preset distance specifically can be depending on actual conditions, this Shen
Please this is not limited.
In practical applications, in order to avoid when carrying out reduction processing to display panel, the hydrofluoric acid needed for reduction processing
Display panel is corroded, the ingredient in the groove-like structure of display panel in coated hydrofluoric acid resistant glue includes acrylate, should
Ingredient can effectively prevent the erosion of hydrofluoric acid during display panel reduction processing.
Be above a kind of packaging method and its display panel of display panel provided by the present application, based on the packaging method and
Its display panel, embodiments herein also provide a kind of display device, including above-mentioned display panel.
Wherein, which for example can be organic electroluminescence device, but not limited to this；As long as display panel with
The joint place of case chip forms reeded display panel, should all be within the protection domain of the application.
The packaging method of display panel provided by the present application carries out the fringe region of case chip one side place is thinned first
Reason, then by display panel with it is thinned after case chip be bonded, and the one side crossed through reduction processing of case chip and display
Panel is opposite, just forms groove in the joint place of display panel and case chip in this way, finally coats hydrofluoric acid resistant in a groove
Glue, it is just not in leak source and partially thin position to have coated in a groove in this way after hydrofluoric acid resistant glue, so as to avoid right
When display panel carries out reduction processing, hydrofluoric acid penetrates into display panel from hydrofluoric acid resistant glue leak source and partially thin position, causes to show
Show the problem of panel is scrapped.
Example the above is only the implementation of the present invention is not intended to restrict the invention.For those skilled in the art
For, the invention may be variously modified and varied.It is all within spirit and principles of the present invention made by any modification, equivalent
Replace, improve etc., it should be included within scope of the presently claimed invention.
It should be noted that unless otherwise defined, all of technologies and scientific terms used here by the article and belong to this hair
The normally understood meaning of bright those skilled in the art is identical.Term used in the description of the invention herein
It is only for the purpose of describing specific embodiments and is not intended to limit the present invention.Term as used herein "and/or" packet
Include any and all combinations of one or more relevant Listed Items.Term as used herein " vertically ", " level
", " first ", " second " and similar statement for illustrative purposes only, be not offered as being unique embodiment.
Claims (9)
1. a kind of packaging method of display panel, which is characterized in that including：
Reduction processing is carried out to the fringe region of case chip one side, wherein the case chip one side is and the display panel phase
To the one side of fitting；
Display panel is bonded with the case chip after being thinned, display panel makes the display panel and the encapsulation
The joint place of piece forms groove；
Hydrofluoric acid resistant glue is coated in the groove.
2. the method as described in claim 1, which is characterized in that carry out reduction processing, tool to the fringe region of case chip one side
Body includes：
Reduction processing carried out to the fringe region of the case chip one side by etching technics, any position in the fringe region
With at a distance from nearest side be less than preset distance.
3. method as claimed in claim 2, which is characterized in that by etching technics to the fringe region of the case chip one side
Reduction processing is carried out, is specifically included：
Gluing, development and exposure-processed are carried out to the one side of the case chip, with by photoresist by the face except fringe region with
Outer other region overlays；
Bound edge material is coated in the preset thickness region of the case chip side, the bound edge material is for preventing hydrofluoric acid from carving
Erosion, the preset thickness are the thickness that back edge is thinned in preset case chip；
The case chip after cladding bound edge material is performed etching by hydrofluoric acid.
4. the method as described in claim 1, which is characterized in that after the groove coats hydrofluoric acid resistant glue, the method
Further include：
Reduction processing is carried out to the display panel for the display panel being bonded, the whole thick of the display panel is thinned
Degree.
5. a kind of display panel, which is characterized in that the display panel includes case chip and display panel, wherein：
The thickness of the case chip fringe region is less than the thickness of intermediate region；
The display panel fits with the case chip, and the case chip fringe region forms groove-like with the display panel
Structure；
Hydrofluoric acid resistant glue is coated in the groove-like structure.
6. display panel as claimed in claim 5, which is characterized in that the value model of the thickness h 1 of the case chip fringe region
It encloses for 0.3mm≤h1≤0.75mm, the value range of the thickness h 2 of the case chip central area is 0.5mm≤h2≤1.1mm,
h1<h2。
7. display panel as claimed in claim 5, which is characterized in that any position and nearest side in the fringe region
Distance is less than preset distance, and the preset distance value range is 1mm-10mm.
8. display panel as claimed in claim 5, which is characterized in that the ingredient of the hydrofluoric acid resistant glue includes acrylate.
9. a kind of display device, which is characterized in that including the display panel described in any claims of claim 5-8.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710282900.3A CN108807713B (en) | 2017-04-26 | 2017-04-26 | Display panel packaging method, display panel and display device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710282900.3A CN108807713B (en) | 2017-04-26 | 2017-04-26 | Display panel packaging method, display panel and display device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101060163A (en) * | 2006-04-18 | 2007-10-24 | 铼宝科技股份有限公司 | Organic EL device and its manufacture method |
| CN101201490A (en) * | 2007-12-04 | 2008-06-18 | 友达光电股份有限公司 | Method for thinning display panel device |
| US20110316808A1 (en) * | 2010-06-23 | 2011-12-29 | Fortrend Taiwan Scientific Corp. | Single piece type capacitive touch panel |
| CN103955085A (en) * | 2014-04-14 | 2014-07-30 | 京东方科技集团股份有限公司 | Substrate bonding process and substrate module to be bonded |
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2017
- 2017-04-26 CN CN201710282900.3A patent/CN108807713B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101060163A (en) * | 2006-04-18 | 2007-10-24 | 铼宝科技股份有限公司 | Organic EL device and its manufacture method |
| CN101201490A (en) * | 2007-12-04 | 2008-06-18 | 友达光电股份有限公司 | Method for thinning display panel device |
| US20110316808A1 (en) * | 2010-06-23 | 2011-12-29 | Fortrend Taiwan Scientific Corp. | Single piece type capacitive touch panel |
| CN103955085A (en) * | 2014-04-14 | 2014-07-30 | 京东方科技集团股份有限公司 | Substrate bonding process and substrate module to be bonded |
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| CN108807713B (en) | 2020-05-05 |
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Address after: 215300, 188, Feng Feng Road, Kunshan hi tech Zone, Suzhou, Jiangsu, Kunshan Patentee after: Suzhou Qingyue Photoelectric Technology Co., Ltd Address before: 215300, 188, Feng Feng Road, Kunshan hi tech Zone, Suzhou, Jiangsu, Kunshan Patentee before: Kunshan Visionox Technology Co.,Ltd. |
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