CN108807713B - Display panel packaging method, display panel and display device - Google Patents
Display panel packaging method, display panel and display device Download PDFInfo
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- CN108807713B CN108807713B CN201710282900.3A CN201710282900A CN108807713B CN 108807713 B CN108807713 B CN 108807713B CN 201710282900 A CN201710282900 A CN 201710282900A CN 108807713 B CN108807713 B CN 108807713B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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Abstract
The invention discloses a packaging method of a display panel, which is used for solving the problem that the display panel is scrapped due to the fact that hydrofluoric acid permeates into the display panel in the thinning treatment process in the prior art, and comprises the following steps: thinning the edge area of one side of the packaging sheet; attaching the display panel to the thinned packaging sheet, wherein the thinned surface of the packaging sheet is opposite to the display panel, so that a groove is formed at the attachment position of the display panel and the packaging sheet; and coating hydrofluoric acid resistant glue in the groove. The application also provides a display panel and a display device.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display panel, a display panel and a display device.
Background
With the development of display technology, new display products are coming out endlessly. Among them, Organic Light Emitting Diodes (OLEDs) are increasingly popular among panel manufacturers and consumers due to their advantages of flexibility, self-luminescence, wide viewing angle, high contrast, low power consumption, high reaction rate, full color, and simple process.
Fig. 1 is a schematic structural diagram of a display panel packaged in the prior art, and the display panel includes a display panel 11 and a packaging sheet 12. Based on the requirement for a light and thin display panel, the outer surface of the display panel is etched by hydrofluoric acid, that is, the display panel 11 in fig. 1 is thinned, so as to thin the display panel, that is, the display panel 11 is thinned to be the display panel 11'. In order to prevent the display device inside the panel from being corroded by hydrofluoric acid during the thinning process, a hydrofluoric acid resistant glue, i.e., the hydrofluoric acid resistant glue 13 shown in fig. 1, is often coated at the pressing position of the display panel and the packaging sheet.
However, in the prior art, when the hydrofluoric acid resistant glue 13 is coated at the stitching position between the display panel 11 and the packaging sheet 12, the stitching position often has a leak point or a position where the hydrofluoric acid resistant glue is too thin, so that the hydrofluoric acid can permeate from the leak point or the position where the hydrofluoric acid resistant glue is too thin in the thinning process, thereby causing the problem of scrapping the display panel.
Disclosure of Invention
The embodiment of the invention provides a packaging method of a display panel, which is used for solving the problem that the display panel is scrapped due to hydrofluoric acid infiltration in the thinning treatment process of the display panel in the prior art.
The embodiment of the invention also provides a display panel, which is used for solving the problem that the display panel is scrapped due to the infiltration of hydrofluoric acid in the thinning process of the display panel in the prior art.
The embodiment of the application further provides a display device, which is used for solving the problem that in the prior art, hydrofluoric acid permeates into the display panel in the thinning treatment process to cause the display panel to be scrapped.
The embodiment of the invention adopts the following technical scheme:
a packaging method of a display panel comprises the following steps:
thinning the edge area of one side of the packaging sheet, wherein the thinned side of the packaging sheet is opposite to the display panel;
attaching the display panel and the thinned packaging sheet to form a groove at the attachment position of the display panel and the packaging sheet;
and coating hydrofluoric acid resistant glue in the groove.
Preferably, the thinning process is performed on the edge area of one side of the packaging sheet, and specifically includes:
and thinning the edge area of one side of the packaging sheet by an etching process, wherein the distance between any position in the edge area and the nearest edge is less than a preset distance.
And the priority level is realized by thinning the edge area of one side of the packaging sheet through an etching process, and the method specifically comprises the following steps:
coating glue, developing and exposing one surface of the packaging sheet to cover the other areas except the edge area of the surface by photoresist;
wrapping a wrapping material in a preset thickness area on the side edge of the packaging piece, wherein the wrapping material is used for preventing hydrofluoric acid from etching, and the preset thickness is the thickness of the edge of the packaging piece after the packaging piece is thinned;
and etching the packaging sheet coated with the edge-covering material by hydrofluoric acid.
Preferably, after the hydrofluoric acid resistant glue is coated at the groove, the method further comprises:
and thinning the display panel which is attached to the display panel to reduce the whole thickness of the display panel.
A display panel comprising an encapsulating sheet and a display panel, wherein:
the thickness of the edge area of the packaging sheet is smaller than that of the middle area;
the display panel is attached to the packaging sheet, and the edge area of the packaging sheet and the display panel form a groove-shaped structure;
hydrofluoric acid resistant glue is coated in the groove-shaped structure.
Preferably, the thickness h1 of the edge region of the packaging sheet ranges from 0.3mm to h 1mm to 0.75mm, the thickness h2 of the central region of the packaging sheet ranges from 0.5mm to h 2mm to 1.1mm, and h1 is less than h 2.
Preferably, the distance between any position in the edge region and the nearest edge is less than a predetermined distance, and the value range of the predetermined distance is 1mm-10 mm.
Preferably, the hydrofluoric acid resistant glue comprises acrylate.
A display device comprises the display panel.
The embodiment of the invention adopts at least one technical scheme which can achieve the following beneficial effects:
the application provides a display panel's encapsulation method, at first carry out the attenuate processing to the marginal area of encapsulation piece one side, then laminate display panel and the encapsulation piece after the attenuate, and the encapsulation piece is relative with display panel through the one side that the attenuate was handled, just so formed the recess in the laminating department of display panel and encapsulation piece, at last coating is able to bear or endure hydrofluoric acid and glues in the recess, just can not appear leaking point and position partially thin after having coated to bear or endure hydrofluoric acid and glue in the recess like this, thereby can avoid when carrying out the attenuate processing to display panel, hydrofluoric acid permeates display panel from resisting hydrofluoric acid and gluing leaking point and position partially thin, lead to the condemned problem of display panel.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 is a schematic structural diagram of a packaged display panel and a schematic diagram of thinning the display panel in the prior art;
fig. 2 is a schematic flowchart illustrating an implementation of a method for packaging a display panel according to the present application;
fig. 3a is a schematic structural diagram of an encapsulating sheet provided by the present application;
FIG. 3b is a schematic diagram of the thinning process for the edge region of the package piece provided in the present application;
fig. 3c is a schematic diagram of a groove structure formed after the display panel 31 and the encapsulating sheet 32 are attached to each other according to the present application;
FIG. 4a is a schematic structural diagram of an embodiment of a display panel provided in the present application;
fig. 4b is a schematic structural diagram of an encapsulating sheet in a display panel provided by the present application.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to the specific embodiments of the present invention and the accompanying drawings. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The technical solutions provided by the embodiments of the present invention are described in detail below with reference to the accompanying drawings.
In order to solve the problem that hydrofluoric acid permeates into a display panel in the thinning treatment process in the prior art and causes the display panel to be scrapped, the application provides a packaging method of the display panel. As shown in fig. 2, a schematic flow chart of the implementation of the method includes:
the thinned surface may be a surface where the encapsulating sheet is attached to the display panel, an edge region of the surface may be, for example, an edge region 32-1 of the encapsulating sheet 32 shown in fig. 3a, and the other surface of the encapsulating sheet may be determined according to actual requirements, which is not specifically limited herein. Similarly, in practical applications, the specific size and shape of the edge region may also be determined according to practical requirements, and the distance between any position in the edge region and the nearest edge may be preset to be smaller than the predetermined distance.
The preset distance is the depth of the groove formed after later-stage laminating, the deeper the groove is, the thicker the hydrofluoric acid glue thickness can be accommodated, the hydrofluoric acid glue thickness can be determined according to actual requirements, and in practical application, the hydrofluoric acid glue thickness can preferably prevent hydrofluoric acid from corroding the display panel, and waste caused by too much filled hydrofluoric acid glue due to too large thickness can be avoided. Then, in actual need, the thickness of the hydrofluoric acid resistant paste may be determined by those skilled in the art according to the standard, i.e., a specific value of the predetermined distance is determined.
For example, as shown in fig. 3a, the distance between any position in the edge region of each side of the encapsulating sheet and the nearest side is smaller than a predetermined distance, and the predetermined distance of each side may be determined according to actual situations, and may be the same or different, and is not limited herein.
When thinning treatment is carried out, the edge area of one side of the packaging sheet can be thinned through an etching process, and the specific implementation process of the thinning treatment comprises the following steps:
substep 101: coating glue, developing and exposing one surface of the packaging sheet to cover the other areas except the edge area of the surface by photoresist;
before thinning the packaging sheet, the surface of the packaging sheet can be cleaned, and the cleaned surface of the packaging sheet is dried.
After the surface of the packaging sheet is dried, the packaging sheet can be subjected to glue coating treatment, specifically, a layer of photoresist with the thickness of 80 +/-10 μm can be uniformly coated on the surface of one side of the packaging sheet after drying treatment, the photoresist can be photosensitive ink for example and is used for protecting the packaging sheet, and the region coated with the photoresist cannot be etched away in the developing treatment.
In order to accelerate the drying of the coated photoresist, the packaging sheet coated with a photoresist uniformly can be placed into an oven and baked under the preset baking condition, for example, the preset baking condition can be that the temperature is 120 +/-10 ℃ and the baking time is 60 min.
After the photoresist on the surface of the packaging piece is dried, exposure treatment can be carried out, the exposed areas are different for positive photoresist and negative photoresist, specifically, when the photoresist coated on one surface of the packaging piece is the positive photoresist, the photoresist on the edge area can be exposed by an exposure machine, so that the photoresist on the edge area is more easily dissolved in a developing solution; and when the photoresist coated on one surface of the packaging sheet is negative, the other areas except the edge area of the surface can be exposed through an exposure machine, so that the photoresist is cured in the other areas and is not easy to dissolve in a developing solution.
And finally, developing the packaging piece after the exposure treatment is finished so as to expose the edge area needing to be thinned. That is, when the photoresist is a positive photoresist, the photosensitive photoresist can be dissolved and removed by chemical action, and the non-photosensitive photoresist can be cured, and when the photoresist is a negative photoresist, the non-cured photoresist can be removed, so that the edge region to be thinned is exposed.
A substep 102 of covering a wrapping material in a preset thickness area at the side edge of the packaging sheet, wherein the wrapping material is used for preventing hydrofluoric acid from etching, and the wrapping material can be polyvinyl chloride electric insulating adhesive tape for example;
the preset thickness is the thickness of the edge of the thinned packaging piece, the thickness can be determined by the height of the groove to be etched, and the specific value of the preset thickness is the thickness of the packaging piece minus the height of the groove to be etched. That is, the predetermined thickness region of the side edge of the package sheet is a region that is not to be etched away, wherein the specific value of the predetermined thickness depends on the thickness of the whole package sheet and the height of the groove to be formed, which can be specifically referred to as the related example in fig. 3 b. The distance between any position in the preset thickness area and the edge of the other side (the side not etched) which is nearest is smaller than a second preset distance. For example, when the thickness of the encapsulating sheet is 0.5mm, when the edge of the upward surface of the encapsulating sheet is expected to be thinned by 0.2mm, the preset thickness region is a region between the lower edge and the upper edge of the side edge of the encapsulating sheet by 0.3mm, so as to protect the region subjected to the coating treatment from being etched by hydrofluoric acid, and thus the thinning treatment of the preset thickness can be performed on the encapsulating sheet.
And a substep 103, etching the packaging sheet coated with the edge-covering material by hydrofluoric acid, and cleaning and drying the packaging sheet after etching, thereby finishing thinning the edge area of one side of the packaging sheet.
Referring to fig. 3b, since the other regions except the edge region are already coated with the photoresist and the edge region is not coated with the photoresist, the edge region is corroded by the hydrofluoric acid, the region with the preset thickness on the side surface of the package sheet is also coated with the edge-covering material and is not corroded by the hydrofluoric acid, and the region without being coated with the edge-covering material on the side surface is corroded by the hydrofluoric acid, so that the edge region on one side of the package sheet can be thinned finally, and the package sheet with the thinned edge region is obtained.
referring to fig. 3c, the groove 33 is formed after the display panel 31 and the packaging sheet 32 are attached, wherein the thinned surface of the packaging sheet 32 is opposite to the display panel 31. The specific pressing process is not described herein.
And step 13, coating hydrofluoric acid resistant glue in the groove.
In order to avoid that the display device inside the panel is corroded by hydrofluoric acid in the process of thinning the display panel, the groove can be coated with hydrofluoric acid-resistant glue until the hydrofluoric acid-resistant glue fills the whole groove between the display panel and the packaging sheet, so that the packaging of the display panel is completed. Under the condition that the whole groove is completely filled with the hydrofluoric acid resistant glue, the joint of the display panel and the packaging sheet in the groove is certainly covered by the hydrofluoric acid resistant glue, the thickness of the covering is equivalent to the depth of the groove, and the situation of hydrofluoric acid resistant glue leakage points and thinness can not occur.
Because the laminating department of display panel and encapsulation piece is formed with the recess, like this alright with resistant hydrofluoric acid glue of coating in the recess, avoid leak source or resistant hydrofluoric acid glue thin position partially, when carrying out the attenuate processing to display panel, hydrofluoric acid then can not follow the laminating infiltration of display panel and encapsulation piece to can avoid the inside display device of panel can receive hydrofluoric acid's erosion in the attenuate processing procedure, lead to the condemned problem of display panel.
Based on the packaging method of the display panel, the application also provides the display panel, which comprises a packaging sheet and the display panel, wherein the thickness of the edge area of the packaging sheet is smaller than that of the middle area, the display panel is attached to the packaging sheet, the edge area of the packaging sheet and the display panel form a groove-shaped structure, and hydrofluoric acid resistant glue is coated in the groove-shaped structure. For the edge area of the encapsulating sheet, please refer to the above detailed explanation, the middle area of the encapsulating sheet is: the packaging piece is attached to the display panel in the other areas except the edge area.
The display panel that this application embodiment provided, because the thickness of encapsulation piece edge region is less than the thickness of middle zone, after display panel and encapsulation piece laminate mutually, encapsulation piece edge region forms recess column structure with display panel, it glues to coat in this recess column structure has resistant hydrofluoric acid, just can not appear in the recess in this display panel resistant hydrofluoric acid glue leak source and position slightly thin like this, thereby can avoid when carrying out the attenuate processing to display panel, hydrofluoric acid permeates display panel from resistant hydrofluoric acid glue leak source and position slightly thin, lead to the condemned problem of display panel.
Based on the above brief description of the core concept of the display panel provided by the present application, the following describes the concept of the display panel provided by the present application in detail through specific embodiments.
Please refer to fig. 4a, which is a schematic structural diagram of a specific embodiment of a display panel provided in the present application, including a display panel 31 and a packaging sheet 32, wherein a thickness of an edge region of the packaging sheet is smaller than a thickness of a middle region, the display panel 31 and the packaging sheet 32 are attached to each other, the edge region of the packaging sheet and the display panel form a groove-shaped structure 43, and a hydrofluoric acid resistant glue is coated in the groove-shaped structure 43.
Referring to fig. 4b, which is a schematic structural diagram of an encapsulating sheet 32 of the display panel provided in the present application, the encapsulating sheet 32 specifically includes an edge region 32-1 and a region 32-2 for placing a display device. In practical application, the thickness h1 of the edge region of the packaging sheet can be 0.3 mm-0.75 mm of h1, and the thickness h2 of the central region of the packaging sheet can be 0.5 mm-1.1 mm of h 1.
It should be noted that, in order to form a groove-shaped structure at the joint after the display panel is jointed with the packaging sheet, the thickness h1 of the edge area of the packaging sheet and the thickness h2 of the central area of the packaging sheet should satisfy the following conditions: the specific values of h1< h2, h1 and h2 can be determined according to practical situations, and the application is not limited to the specific values. The value of h2-h1 is the height of the groove, so that after the packaging sheet is attached to the display panel, the groove capable of being filled with a proper amount of hydrofluoric acid resistant glue can be formed at the attachment position, the value of the height of the groove can be determined according to actual requirements, and the filled hydrofluoric acid resistant glue can be preferably ensured to prevent hydrofluoric acid from corroding the display panel and avoid waste caused by too much filled hydrofluoric acid resistant glue due to too large grooves. Further, in order to prevent the edge region from being broken due to too thin thickness, the thickness of the edge region is preferably more than 0.3 mm.
In addition, the distance between any position in the edge area and the nearest edge is smaller than a predetermined distance, the predetermined distance may be 1mm-10mm, the larger the predetermined distance is, the deeper the groove is finally formed, the thicker the hydrofluoric acid resistant glue can be accommodated, and the better the hydrofluoric acid resistant glue performance of the display panel is, but the too thick hydrofluoric acid resistant glue thickness has no great significance, as long as the thickness can prevent hydrofluoric acid from entering the display panel, and therefore, the predetermined distance may be specifically determined according to practical situations, and the present application does not limit this.
In practical application, in order to avoid corrosion of the display panel by hydrofluoric acid required by thinning treatment when the display panel is thinned, the component in the hydrofluoric acid-resistant glue coated in the groove-shaped structure of the display panel comprises acrylate, and the component can effectively prevent corrosion of hydrofluoric acid in the thinning treatment process of the display panel.
In the foregoing, a display panel and a packaging method thereof are provided, and based on the packaging method and the display panel, embodiments of the present application further provide a display device including the display panel.
Wherein, the display device can be, for example, an organic electroluminescent device, but is not limited thereto; the present disclosure is not limited to the above embodiments, and various modifications and changes can be made without departing from the spirit and scope of the present disclosure.
The application provides a display panel's encapsulation method, at first carry out the attenuate processing to the marginal area of encapsulation piece one side, then laminate display panel and the encapsulation piece after the attenuate, and the encapsulation piece is relative with display panel through the one side that the attenuate was handled, just so formed the recess in the laminating department of display panel and encapsulation piece, at last coating is able to bear or endure hydrofluoric acid and glues in the recess, just can not appear leaking point and position partially thin after having coated to bear or endure hydrofluoric acid and glue in the recess like this, thereby can avoid when carrying out the attenuate processing to display panel, hydrofluoric acid permeates display panel from resisting hydrofluoric acid and gluing leaking point and position partially thin, lead to the condemned problem of display panel.
The above description is only an example of the present invention, and is not intended to limit the present invention. Various modifications and alterations to this invention will become apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.
It is to be noted that, unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items. The terms "vertical," "horizontal," "first," "second," and the like as used herein are for illustrative purposes only and do not denote a single embodiment.
Claims (8)
1. A method for encapsulating a display panel, comprising:
thinning the edge area of one side of the packaging sheet, wherein one side of the packaging sheet is the side which is relatively attached to the display panel;
attaching the display panel to the thinned packaging sheet, wherein the display panel enables a groove to be formed at the attachment position of the display panel and the packaging sheet;
coating hydrofluoric acid resistant glue in the groove;
wherein, carry out thinning treatment to the marginal area of encapsulation piece one side, specifically include:
and thinning the edge area of one side of the packaging sheet by an etching process, wherein the distance between any position in the edge area and the nearest edge is less than a preset distance.
2. The method of claim 1, wherein thinning the edge region of the one side of the package sheet by an etching process comprises:
coating glue, developing and exposing one surface of the packaging sheet to cover the other areas except the edge area of the surface by photoresist;
wrapping a wrapping material in a preset thickness area on the side edge of the packaging piece, wherein the wrapping material is used for preventing hydrofluoric acid from etching, and the preset thickness is the thickness of the edge of the packaging piece after the packaging piece is thinned;
and etching the packaging sheet coated with the edge-covering material by hydrofluoric acid.
3. The method of claim 1, wherein after applying the hydrofluoric acid resistant glue at the groove, the method further comprises:
and thinning the display panel which is attached to the display panel to reduce the whole thickness of the display panel.
4. A display panel, comprising an encapsulating sheet and a display panel, wherein:
the thickness of the edge area of the packaging sheet is smaller than that of the middle area;
the display panel is attached to the packaging sheet, and the edge area of the packaging sheet and the display panel form a groove-shaped structure;
hydrofluoric acid resistant glue is coated in the groove-shaped structure;
wherein the thickness of the edge region of the packaging sheet is smaller than the thickness of the middle region of the packaging sheet, and the thickness of the edge region of the packaging sheet comprises the following steps:
and thinning the edge area of one side of the packaging sheet by an etching process, wherein the distance between any position in the edge area and the nearest edge is less than a preset distance.
5. The display panel of claim 4, wherein the thickness h1 of the edge region of the encapsulating sheet ranges from 0.3mm < h1< 0.75mm, the thickness h2 of the central region of the encapsulating sheet ranges from 0.5mm < h2 < 1.1mm, and h1< h 2.
6. The display panel of claim 4, wherein a distance between any position in the edge region and the nearest edge is less than a predetermined distance, and the predetermined distance ranges from 1mm to 10 mm.
7. The display panel according to claim 4, wherein the composition of the hydrofluoric acid resistant paste comprises acrylate.
8. A display device comprising the display panel according to any one of claims 4 to 7.
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| CN201710282900.3A CN108807713B (en) | 2017-04-26 | 2017-04-26 | Display panel packaging method, display panel and display device |
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| CN101060163A (en) * | 2006-04-18 | 2007-10-24 | 铼宝科技股份有限公司 | Organic EL device and its manufacture method |
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| CN101201490A (en) * | 2007-12-04 | 2008-06-18 | 友达光电股份有限公司 | Method for thinning display panel device |
| TW201201083A (en) * | 2010-06-23 | 2012-01-01 | Fortrend Taiwan Scient Corp | Single piece type capacitive touch panel structure |
| CN103955085B (en) * | 2014-04-14 | 2017-04-05 | 京东方科技集团股份有限公司 | Baseplate-laminating technique and board unit to be fit |
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