CN101043019B - Chip retaining cushion - Google Patents
Chip retaining cushion Download PDFInfo
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- CN101043019B CN101043019B CN2007100893868A CN200710089386A CN101043019B CN 101043019 B CN101043019 B CN 101043019B CN 2007100893868 A CN2007100893868 A CN 2007100893868A CN 200710089386 A CN200710089386 A CN 200710089386A CN 101043019 B CN101043019 B CN 101043019B
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- holding member
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- 230000007246 mechanism Effects 0.000 claims abstract description 50
- 230000002093 peripheral effect Effects 0.000 claims abstract description 24
- 230000005855 radiation Effects 0.000 claims description 7
- 230000002687 intercalation Effects 0.000 claims description 2
- 238000009830 intercalation Methods 0.000 claims description 2
- 238000005728 strengthening Methods 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 79
- 239000004065 semiconductor Substances 0.000 description 43
- 238000012423 maintenance Methods 0.000 description 7
- 238000010521 absorption reaction Methods 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 5
- 230000003068 static effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- ZZUFCTLCJUWOSV-UHFFFAOYSA-N furosemide Chemical compound C1=C(Cl)C(S(=O)(=O)N)=CC(C(O)=O)=C1NCC1=CC=CO1 ZZUFCTLCJUWOSV-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 229910002601 GaN Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- -1 gallium nitride compound Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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- Mechanical Treatment Of Semiconductor (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Abstract
The invention provides a wafer holding mechanism capable of adsorbing and holding without damages even if a ring shape strengthening portion is provied at a peripheral portion and a wafer is formed with recesses. The wafer holding mechanism is provided with: at least three holding components holding a peripheral edge of the wafer; a support plate having a guide portion which guides the at least three holding components along a radial direction, and can movably support the holding components along the guide portion; and a moving mechanism moving the at least three holding components along the guide portion.
Description
Technical field
The present invention relates to the chip retaining cushion that keeps wafers such as semiconductor wafer to use.
Background technology
In the manufacturing process of semiconductor device, the surface of the semiconductor wafer of approximate circular plate shape is divided into a plurality of zones with the predetermined cut-off rule that is arranged in cancellate being called " road (ス ト リ one ト) ", forms devices such as IC, LSI in the zone that this is divided into.By cutting semiconductor wafer, cut apart the zone that has formed device and make single semiconductor chip along the road.And the optical device wafer of stacked gallium nitride compound semiconductor etc. is divided into optical devices such as single light-emitting diode, laser diode also by cutting along the road on the surface of Sapphire Substrate, is widely used in the electric equipment.
The wafer of cutting apart as described above first grinding back side or be formed into preset thickness before Yan Dao cuts by etching and processing.In recent years, for lightweight, the miniaturization that reaches electric equipment, require the thickness of wafer is formed on below the 50 μ m.
Yet, easily damaged if the thickness of wafer is formed on below the 50 μ m, there is the problem of the difficult treatment such as carrying of wafer.
In order to eliminate the problems referred to above, the applicant proposed grinding chip back surface and the corresponding zone of device area the thickness of device area was formed into preset thickness in Japanese Patent Application 2005-165395 communique, keep the chip back surface peripheral part simultaneously and form the ring-type rib, by forming the wafer processing method of wafer like this with rigidity.
In order to carry the wafer that forms predetermined thickness as described above, general whole whole the absorption layer that attracts to keep wafer that use.Yet,, have the crooked and damaged problem of device area that forms thinly if attract to keep the above-mentioned wafer that is provided with annular rib at outer peripheral portion, has formed recess with whole absorption layer.
Summary of the invention
The present invention makes in view of the above fact, even the chip retaining cushion that its major technique problem will provide a kind of is provided with annular rib at outer peripheral portion, the wafer that formed recess also can keep wafer not damagedly.
In order to solve above-mentioned technical problem underlying, the invention provides a kind of chip retaining cushion with following characteristics.This wafer is the zone corresponding with device area in the back side of grinding wafer, the thickness of device area is formed on below the 50 μ m, keep the peripheral part in the back side of wafer simultaneously and be formed with the wafer of the rib of ring-type, it is characterized in that having: at least 3 holding members that keep the wafer outer peripheral edges; Have along the radiation direction guide these at least 3 holding members guide portion, can support the support plate of above-mentioned holding member along this guide portion movably; And make these at least 3 holding members along travel mechanism that this guide portion moves; The guide sections of above-mentioned support plate is by constituting along the long slotted hole of radiation direction; Above-mentioned holding member comprise maintaining part with the engaging recessed part that engages with the outer peripheral edges of wafer and the slotted hole that is provided with from the upright setting of the upper surface of this maintaining part, intercalation to above-mentioned support plate with establishing be directed support sector; And above-mentioned holding member has with this engaging recessed part the taper seat that is formed on upside continuously, the outer peripheral edges of wafer is directed to engaging recessed part; Above-mentioned support plate is provided with a plurality of intervals more outstanding than the maintaining part of above-mentioned holding member and forms pin; Above-mentioned travel mechanism has: at least 3 connectors that an end separately can be connected with above-mentioned 3 holding members rotationally at least; Can be connected, can be provided in rotationally the rotor plate of the central part of above-mentioned support plate rotationally with the other end of above-mentioned 3 connectors; And the driving mechanism that this rotor plate is rotated; This chip retaining cushion is supported in the top of movement arm with elasticity supporting mechanism, the mounting panel on 3 helical springs that elasticity supporting mechanism has at least 3 supporting pillars on the upright upper surface that is located at above-mentioned support plate, embed respectively for these 3 supporting pillars and the top that is installed to above-mentioned movement arm; Above-mentioned 3 supporting pillars are configured on the position of 3 openings that are provided with on the interspersed respectively above-mentioned rotor plate.
The effect of invention:, because the neighboring that chip retaining cushion keeps wafers with at least 3 holding members,, also can not make it keep wafer even therefore annular rib is set, formed the wafer of recess at peripheral part if adopt the present invention damagedly.
Description of drawings
Fig. 1 is the perspective view of expression with the preceding semiconductor wafer of grinding in the wafer of chip retaining cushion maintenance of the present invention.
Fig. 2 is illustrated in the perspective view that is pasted with the state of guard block on the surface of semiconductor wafer shown in Figure 1.
Fig. 3 is the perspective view of grinding attachment that is used for the back side of grinding semiconductor wafer shown in Figure 1.
Fig. 4 is the key diagram that forms operation with the rib at the back side of grinding attachment grinding semiconductor wafer shown in Figure 3.
Fig. 5 has implemented the cutaway view that rib shown in Figure 4 forms the semiconductor wafer of operation.
Fig. 6 is the perspective view that amplifies the major part of the carrying wafers mechanism of equipping in the expression grinding attachment shown in Figure 3.
Fig. 7 is the perspective view of the component parts of exploded representation carrying wafers mechanism shown in Figure 6.
Fig. 8 is the cutaway view that constitutes the maintaining body of carrying wafers mechanism shown in Figure 6.
Fig. 9 is that expression uses the chip retaining cushion that constitutes according to the present invention to keep the cutaway view of the operation of semiconductor wafer.
Figure 10 is that expression uses the chip retaining cushion that constitutes according to the present invention to keep the cutaway view of the state of semiconductor wafer.
Embodiment
Illustrate in greater detail the preferred implementation of chip retaining cushion of the present invention with reference to the accompanying drawings.
At first, illustrate keep with chip retaining cushion of the present invention, have the device area that is formed with a plurality of devices on the surface and around the processing method of the wafer of the periphery remaining area of this device area.
Fig. 1 represents to be worked into the perspective view as the semiconductor wafer of wafer before the predetermined thickness.Semiconductor wafer 10 shown in Figure 1 is that the silicon wafer of 700 μ m constitutes by for example thickness, and many roads 101 are formed clathrate on surperficial 10a, and are formed with devices 102 such as IC, LSI in a plurality of zones that are divided into by these roads 101.The semiconductor wafer 10 of Gou Chenging has device area 104 that forms device 102 and the periphery remaining area 105 that surrounds this device area 104 like this.
Be pasted with guard block 11 (guard block stickup operation) on the surperficial 10a of the semiconductor wafer 10 of above-mentioned such formation as shown in Figure 2.Therefore the form of exposing for the back side 10b of semiconductor wafer 10.
After having implemented guard block stickup operation; the zone corresponding among the back side 10b of grinded semiconductor wafer 10 with device area 104; the thickness of device area 104 is formed predetermined thickness, form the ribs formation operations of annular rib among the back side 10b of the semiconductor wafer 10 of enforcement reservation simultaneously with periphery remaining area 105 corresponding zones.This rib forms operation and implements with grinding attachment shown in Figure 3.
The grinding subassembly 3 of illustrated embodiment has moves above-mentioned movable base 36 on pair of guide rails 22,22, the vertical movement mechanism 37 that Grinding wheel 33 is moved along the direction vertical with the maintenance face of grain-clamping table described later.Vertical movement mechanism 37 possesses: set along the vertical direction abreast with pair of guide rails 22/22, can be supported in the external thread rod 371 on the above-mentioned static support plate 21 rotatably, drive the pulse motor 372 of this external thread rod 371 rotations, and be installed on the above-mentioned movable base 36 and be screwed in and not have the internal thread piece represented among the figure on the external thread rod 371; Driving external thread rods 371 by pulse motor 372 is just changeing or is reversing, make thus grinding subassembly 3 along the vertical direction (direction vertical) with the maintenance face of grain-clamping table described later mobile.
The grinding attachment 2 of illustrated embodiment has with the upper surface of crust of the device 20 and is provided in the rotating disk 4 of above-mentioned static support plate 21 front sides for same plane earth roughly.This rotating disk 4 forms the bigger disc-shape of diameter, is driven by the rotary drive mechanism that does not have expression among the figure and suitably rotates along the direction shown in the arrow 4a.Can in horizontal plane, dispose 2 grain-clamping tables 5 that under the situation of illustrated embodiment, have 180 ° phase angle each other rotatably on the rotating disk 4.This grain-clamping table 5 is by discoid base 51 and form discoid absorption with porous ceramic materials and keep clamper 52 to constitute, by the attraction mechanism action that not have expression among the figure being attracted keep being placed on the machined object on the absorption maintenance clamper 52 (maintenance face).And, there is not the Blast mechanism of expression to be connected among grain-clamping table 5 and the figure, be placed on absorption and keep the machined object on the clamper 52 from maintenance face, to float a little by making this Blast mechanism action, making.The grain-clamping table 5 of this structure does not have the direction rotation shown in the effect lower edge arrow 5a of rotary drive mechanism of expression as shown in Figure 3 in the drawings.By rotating disk 4 is suitably rotated, be provided in 2 grain-clamping tables 5 on the rotating disk 4 and move to machined object successively and move into/take out of regional A, regional A is moved into/taken out of to grinding area B and machined object.The grinding attachment 2 of illustrated embodiment has the semiconductor wafer 10 that will remain on the grain-clamping table 5, implement the aftermentioned grinding from carrying wafers mechanism 6 that grain-clamping table 5 is taken out of.Relevant these carrying wafers mechanism 6 back are described in detail.
When implementing rib formation operation with above-mentioned grinding attachment 2; to be sidelong on the upper surface (maintenance face) of putting the grain-clamping table 5 that is positioned at machined object and moves into/take out of regional A by the guard block 11 1 of the above-mentioned semiconductor wafer 10 of the carrying wafers mechanism carrying that does not have expression among the figure, semiconductor wafer 10 is attracted to remain on the grain-clamping table 5.Then, make rotating disk 4 along the direction Rotate 180 shown in the arrow 4a °, make the grain-clamping table 5 that is placed with semiconductor wafer 10 be positioned at grinding position B with the rotary drive mechanism of not representing among the figure.The relation of semiconductor wafer 10 that remains on the grain-clamping table 5 and the annular abrasive grinding wheel 332 that constitutes Grinding wheel 33 is described with reference to Fig. 4 here.The pivot P2 off-centre of the pivot P1 of grain-clamping table 5 and annular abrasive grinding wheel 332, the external diameter of annular abrasive grinding wheel 332 be set to diameter than the device area 104 of semiconductor wafer 10 and the boundary line 106 of periphery remaining area 105 little, than the big size of the radius of boundary line 106, annular abrasive grinding wheel 332 is through the pivot p1 (center of semiconductor wafer 10) of grain-clamping tables 5.
Then, make grain-clamping table 5 along the speed rotation of the direction shown in the arrow 5a as shown in Figure 3 and Figure 4 like that with 300rpm, and make abrasive grinding wheel 332 along the speed rotation of the direction shown in the arrow 32a with 6000rpm, make vertical movement mechanism 37 actions simultaneously, making Grinding wheel 33 is that abrasive grinding wheel 332 contacts with the back side of semiconductor wafer 10.Be the predetermined stock removal of abrasive grinding wheel 332 feeding downwards with predetermined grinding and feeding speed with Grinding wheel 33 then.The result, the back side of semiconductor wafer 10 is ground with device area 104 corresponding zones as shown in Figure 5 and removes, form the circular depressions 104b of predetermined thickness (for example 30 μ m), keep with periphery remaining area 105 corresponding zones simultaneously, form annular rib 105b.
After having implemented above-mentioned rib formation operation, make rotating disk 4 along the direction Rotate 180 shown in the arrow 4a ° with the rotary drive mechanism of not representing among the figure, make to be placed with and implemented semiconductor wafer 10 that rib forms operation and be positioned at machined object and move into/take out of regional A.Be held in place on the grain-clamping table 5 of regional A is moved into/taken out of to machined object, implemented the semiconductor wafer 10 that rib forms operation, be maintained on the maintaining body 7 of carrying wafers mechanism 6 and be transported to next process.
Below with reference to Fig. 6 to Fig. 8 carrying wafers mechanism 6 is described.
Fig. 6 possesses maintaining body 7 that constitutes according to the present invention and the movement arm 8 of supporting this maintaining body 7 to carrying wafers mechanism 6 shown in Figure 8, and the root of movement arm 8 is connected on the rotation axis 9 as shown in Figure 3.In addition, rotation axis 9 drives rotation by the rotary drive mechanism that does not have expression among the figure, is driven along the vertical direction by the travel mechanism that does not have expression among the figure simultaneously and moves.
Maintaining body 7 possesses 3 holding members 71 of the neighboring that keeps above-mentioned semiconductor wafer 10 as shown in Figure 6 and Figure 7 and can support the support plate 72 of these 3 holding members 71 along the radiation direction movably.Holding member 71 constitutes by the maintaining part 711 that has the annular engaging recessed part 711a that engages with the outer peripheral edges of above-mentioned semiconductor wafer 10 on the outer peripheral face with from the columned support sector 712 that is directed that the upper surface of this maintaining part 711 is holded up setting.Maintaining part 711 has as shown in Figure 8 with engaging recessed part 711a and is formed on upside continuously, the outer peripheral edges of semiconductor wafer 10 are directed to taper seat 711b in the engaging recessed part 711a.And, be directed being formed with in the support sector 712 the surperficial from it internal thread hole 712a that is provided with vertically.The synthetic resin that frictional resistance such as the holding member 71 usefulness fluorine resins of this structure are little forms.
Above-mentioned support plate 72 is made of circular slab in illustrated embodiment, is provided with 3 long slotted holes 721 of radially (radiation direction) of predetermined space spaced apart in the circumferential direction at its periphery position.The width setup of this slotted hole 721 is the size bigger slightly than the external diameter that is directed support sector 712 of above-mentioned holding member 71.As shown in Figure 8, support sector 712 side below support plate 72 that is directed of above-mentioned holding member 71 is inserted the slotted hole 721 that forms like this.And, have the upper surface that band step nut 722 that particle size part 722a and small diameter part divide 722b is installed in the centre of support plate 72.
The maintaining body 7 of illustrated embodiment possesses makes 3 holding members 71 inserting respectively on the above-mentioned support plate 72 in 3 slotted holes 721 that are provided with along travel mechanism 73 that slotted hole 721 moves.Travel mechanism 73 by separately an end can be rotationally coupled to above-mentioned 3 holding members 71 be directed in the support sector 712 3 connectors 731, can support the rotor plate 732 of these 3 connectors 731 other end separately rotationally and constitute as the Pneumatic pressure power cylinder 733 of the driving mechanism that drives these rotor plate 732 rotations.One end of connector 731 is provided with porose 731a as shown in Figure 8, and this hole 731a fits loosely in above-mentioned being directed in the support sector 712.In addition, the hole 731a with union piece 731 fit loosely in be directed in the support sector 712 before, ring-type lining 734 be nested into be directed in the support sector 712.This lining 734 preferably forms with the little synthetic resin of frictional resistance.Like this hole 731a of union piece 731 is fitted loosely in be directed in the support sector 712 after, the bolt 735 that slip-off preventing is used is screwed among the internal thread hole 712a that is directed being provided with in the support sector 712 of holding member 71.
The rotor plate 732 that constitutes above-mentioned travel mechanism 73 not only has the small diameter part that can be nested into the band step nut 722 on the central part that is installed in above-mentioned holding member 71 rotationally at central part and divides the 732a of the hole on the 722b, and has from outer peripheral face to outstanding 3 the arm 732b that be provided with, predetermined space spaced apart in the circumferential direction of direction (radiation direction) radially.The top of these 3 arm 732b can be connected with the other end of above-mentioned union piece 731 respectively mutually rotationally with pivot 736.And among 3 arm 732b one is provided with and is used for the connection bump 732c that is connected with the piston rod of Pneumatic pressure power cylinder 733 described later.In addition, the rotor plate in the illustrated embodiment 732 has the opening 732d of 3 predetermined spaces spaced apart in the circumferential direction in the arranged outside of the hole of central part setting 732a.Like this rotor plate 732 of Gou Chenging as shown in Figure 8, the hole 732a of central part setting can be nested into rotationally the band step nut 722 small diameter part divide on the 722b.So, being screwed in the band step nut 722 by the bolt 737 that slip-off preventing is used, restriction rotor plate 732 comes off.
The Pneumatic pressure power cylinder 733 that constitutes above-mentioned travel mechanism 73 is provided on the upper surface of support plate 72.The top of the piston rod 733a of this Pneumatic pressure power cylinder 733 is connected on the connection bump 732c of a last setting among above-mentioned 3 arm 732b.
The maintaining body 7 of illustrated embodiment predetermined interval spaced apart in the circumferential direction on the peripheral part lower surface of support plate 72 is equipped with the interval that 3 lower surfaces that are used to prevent the maintaining part 711 of above-mentioned holding member 71 contact with the upper surface of above-mentioned grain-clamping table 5 and forms pin 738.These 3 length that forms at interval pin 738 forms about the long 0.5mm of length than the axis direction of above-mentioned maintaining part 711, is provided with highlightedly than the lower ends downward of maintaining part 711.
More than the maintaining body 7 usefulness elasticity supporting mechanisms 74 that constitute like this be supported in the top of above-mentioned movement arm 8.Mounting panel 743 on 3 helical springs 742 that the elasticity supporting mechanism 74 of illustrated embodiment has 3 supporting pillars 741 on the perpendicular upper surface that is located at support plate 72, embed respectively for these 3 supporting pillars 741 and the top that is installed to above-mentioned movement arm 8.3 supporting pillars 741 are configured on the position of 3 opening 732d that are provided with on the interspersed respectively above-mentioned rotor plate 732, and the upper end is provided with internal thread hole 741a.Above-mentioned mounting panel 743 is provided with inserting hole 743a with 3 supporting pillars, 741 corresponding positions respectively.The internal diameter of this inserting hole 743a forms bigger, littler than the external diameter of helical spring 742 than the external diameter of supporting pillar 741.Therefore, by supporting pillar 741 is punctured among the inserting hole 743a, slip-off preventing is screwed among the internal thread hole 741a that the upper end of supporting pillar 741 is provided with bolt 744, maintaining body 7 by helical spring 742 downwards under the state of the application of force elasticity be supported in the top of movement arm 8.
The carrying wafers mechanism 6 of illustrated embodiment as above constitutes like that, the following describes its effect.
The rotary drive mechanism that carrying wafers mechanism 6 does not represent in figure under state shown in Figure 3 makes the predetermined angle of rotation axis 9 rotations, the maintaining body 7 on the top that is installed in movement arm 8 is moved to be held in place the top of moving into/take out of the semiconductor wafer 10 on the grain-clamping table 5 of regional A in machined object.Then, rotation axis 9 is moved downwards, make 3 of maintaining body 7 to form pin 738 mountings at interval to the upper surface of the peripheral part of grain-clamping table 5 as shown in Figure 9 by such picture with the travel mechanism that does not represent among the figure.As a result, the maintaining part 711 of the holding member 71 of formation maintaining body 7 is in the state that floats a little from the peripheral part upper surface of grain-clamping table 5.
Then, the action of the attraction mechanism that does not have expression among the figure is stopped, attraction that removing 5 pairs of semiconductor wafers 10 of grain-clamping table keeps, and makes the Blast mechanism action that does not have expression among the figure.As a result, the semiconductor wafer 10 that remains on the grain-clamping table 5 floats.Even because semiconductor wafer 10 moved in the horizontal direction also and to be formed pin 738 at interval by 3 and surround this moment, so the mobile of horizontal direction is limited.The taper seat 711b that the semiconductor wafer 10 that so floats is provided with on the maintaining part 711 of neighboring and the holding member 71 that constitutes maintaining body 7 as shown in Figure 9 connects.Then, make 733 actions of Pneumatic pressure power cylinder, make piston rod 733a along the action of the direction shown in the arrow 739a among Fig. 6.Therefore, rotor plate 732 rotates to the direction shown in the 739b, the connector 731 that is connected with the arm 732b of rotor plate 732 is to the direction shown in arrow 739c action, therefore be connected holding member 71 on the connector 731 shown in arrow 739d along slotted hole 721 to the medial movement of direction radially.The result, the outer peripheral edges of semiconductor wafer 10 (the periphery remaining area 105 of semiconductor wafer 10 is the outer peripheral edges of annular rib 105b) relatively move to engaging recessed part 711a along taper seat 711b, are engaged in the engaging recessed part 711a as the outer peripheral edges of semiconductor wafer 10 as shown in Figure 10.So, it is annular rib 105b that the engaging recessed part 711a that is provided with on the maintaining part 711 of maintaining body 7 usefulness holding members 71 only keeps the periphery remaining area 105 of semiconductor wafer 10, therefore do not contact, so 104 ground, damage device zone are not carried with device area 104.
More than narration is the example that chip retaining cushion of the present invention is used for the carrying mechanism of grinding attachment, but chip retaining cushion of the present invention also can be used for the carrying mechanism that other processing unit (plant) reaches carrying wafer between processing unit (plant).
Claims (1)
1. chip retaining cushion, this wafer is the zone corresponding with device area in the back side of grinding wafer, the thickness of device area is formed on below the 50 μ m, keep the peripheral part in the back side of wafer simultaneously and be formed with the wafer of the rib of ring-type, it is characterized in that having: at least 3 holding members that keep the wafer outer peripheral edges; Have along the radiation direction guide these at least 3 holding members guide portion, can support the support plate of above-mentioned holding member along this guide portion movably; And make these at least 3 holding members along travel mechanism that this guide portion moves;
The guide sections of above-mentioned support plate is by constituting along the long slotted hole of radiation direction; Above-mentioned holding member comprise maintaining part with the engaging recessed part that engages with the outer peripheral edges of wafer and the slotted hole that is provided with from the upright setting of the upper surface of this maintaining part, intercalation to above-mentioned support plate with establishing be directed support sector; And above-mentioned holding member has with this engaging recessed part the taper seat that is formed on upside continuously, the outer peripheral edges of wafer is directed to engaging recessed part;
Above-mentioned support plate is provided with a plurality of intervals more outstanding than the maintaining part of above-mentioned holding member and forms pin;
Above-mentioned travel mechanism has: at least 3 connectors that an end separately can be connected with above-mentioned 3 holding members rotationally at least; Can be connected, can be provided in rotationally the rotor plate of the central part of above-mentioned support plate rotationally with the other end of above-mentioned 3 connectors; And the driving mechanism that this rotor plate is rotated;
This chip retaining cushion is supported in the top of movement arm with elasticity supporting mechanism, the mounting panel on 3 helical springs that elasticity supporting mechanism has at least 3 supporting pillars on the upright upper surface that is located at above-mentioned support plate, embed respectively for these 3 supporting pillars and the top that is installed to above-mentioned movement arm; Above-mentioned 3 supporting pillars are configured on the position of 3 openings that are provided with on the interspersed respectively above-mentioned rotor plate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006080975A JP4634950B2 (en) | 2006-03-23 | 2006-03-23 | Wafer holding mechanism |
| JP080975/2006 | 2006-03-23 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101043019A CN101043019A (en) | 2007-09-26 |
| CN101043019B true CN101043019B (en) | 2010-12-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007100893868A Active CN101043019B (en) | 2006-03-23 | 2007-03-23 | Chip retaining cushion |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP4634950B2 (en) |
| CN (1) | CN101043019B (en) |
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| JP5261030B2 (en) * | 2008-05-29 | 2013-08-14 | リンテック株式会社 | Semiconductor wafer transfer method |
| JP5144434B2 (en) * | 2008-08-28 | 2013-02-13 | リンテック株式会社 | Support device |
| JP5137747B2 (en) * | 2008-08-28 | 2013-02-06 | 株式会社ディスコ | Work holding mechanism |
| JP5525794B2 (en) * | 2009-10-23 | 2014-06-18 | 株式会社ディスコ | Plate workpiece attaching / detaching method and processing apparatus |
| JP5412261B2 (en) * | 2009-12-11 | 2014-02-12 | 株式会社ディスコ | Processing equipment |
| JP2011155131A (en) * | 2010-01-27 | 2011-08-11 | Disco Abrasive Syst Ltd | Wafer carrying mechanism |
| JP5623213B2 (en) * | 2010-09-17 | 2014-11-12 | 株式会社ディスコ | Cutting device |
| JP5596579B2 (en) * | 2011-01-28 | 2014-09-24 | リンテック株式会社 | Plate member conveying device |
| JP5864114B2 (en) * | 2011-03-15 | 2016-02-17 | 株式会社Sumco | Wafer transfer device |
| JP5908703B2 (en) * | 2011-11-11 | 2016-04-26 | 株式会社ディスコ | Grinding apparatus and method for cleaning circular plate workpiece |
| JP5850757B2 (en) * | 2012-02-01 | 2016-02-03 | 株式会社ディスコ | Processing equipment |
| JP5930196B2 (en) * | 2012-06-25 | 2016-06-08 | 株式会社ディスコ | Grinding equipment |
| JP2013055360A (en) * | 2012-12-17 | 2013-03-21 | Lintec Corp | Support device and support method |
| JP6220240B2 (en) * | 2013-11-15 | 2017-10-25 | 株式会社ディスコ | Grinding equipment |
| JP6298364B2 (en) * | 2014-06-09 | 2018-03-20 | 株式会社ディスコ | Processing equipment |
| JP6294793B2 (en) * | 2014-08-19 | 2018-03-14 | 株式会社ディスコ | Edge clamp transport mechanism |
| JP6689160B2 (en) | 2016-08-24 | 2020-04-28 | 株式会社ディスコ | Plate-shaped material conveying device and processing device |
| JP6810585B2 (en) * | 2016-11-30 | 2021-01-06 | タツモ株式会社 | Chuck device and laminating device |
| JP2020102573A (en) * | 2018-12-25 | 2020-07-02 | 株式会社ディスコ | Transport device and processing device |
| CN114454075B (en) * | 2021-03-03 | 2022-12-16 | 华中科技大学 | Cam-driven wafer positioning and supporting device |
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2006
- 2006-03-23 JP JP2006080975A patent/JP4634950B2/en active Active
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2007
- 2007-03-23 CN CN2007100893868A patent/CN101043019B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5192087A (en) * | 1990-10-02 | 1993-03-09 | Nippon Steel Corporation | Device for supporting a wafer |
Non-Patent Citations (2)
| Title |
|---|
| JP特开平11-260895A 1999.09.24 |
| JP特开平11-31679A 1999.02.02 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4634950B2 (en) | 2011-02-16 |
| JP2007258450A (en) | 2007-10-04 |
| CN101043019A (en) | 2007-09-26 |
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