JP5596579B2 - Plate member conveying device - Google Patents

Description

  The present invention relates to a plate-shaped member conveying apparatus, and more particularly to a plate-shaped member conveying apparatus that can support and convey a plate-shaped member on the outer edge side.

  Conventionally, a transfer device for transferring a plate-like member such as a semiconductor wafer (hereinafter sometimes simply referred to as “wafer”) has been widely used. Such a transfer device is disclosed in, for example, Patent Document 1. Has been. The transfer device of Patent Document 1 includes a hand connected to a robot arm, and an abutting member that is provided on the distal end and the proximal end side of the hand and includes a claw member that abuts on the outer edge of the wafer. The abutting member on the distal end side of the hand and the abutting member on the proximal end side are provided so as to be able to approach each other, whereby the wafer can be sandwiched and gripped from the outer edge side.

  Here, as shown in FIG. 5, since the cross-sectional shape of the outer edge of the wafer W is formed in an arc shape, the contact surface 51A of the contact member 51 with the wafer W is also the outer edge shape of the wafer W. Accordingly, it is provided in a shape recessed in a substantially semicircular arc shape. The wafer W has an adhesive sheet S including a base sheet BS and an adhesive layer AD provided on one surface of the base sheet BS in order to perform a predetermined process such as back grinding. Affixed to the lower surface side of the figure. The adhesive sheet S is affixed so as to wrap around the arc-shaped portion of the outer edge of the wafer W in order to prevent the grinding powder, cooling water and the like from entering when the predetermined processing is performed. In such sticking, an adhesive sheet S having a size protruding from the outer edge of the wafer W is pasted, and then the adhesive sheet S is cut by inclining a cutting blade in the tangential direction of the arc portion of the wafer W.

Japanese Patent Laid-Open No. 11-220003

  When the adhesive sheet S attached to the wafer W is cut as described above, the adhesive layer AD of the adhesive sheet S is exposed to the outer edge side of the wafer W. For this reason, in the contact member 51 as shown in FIG. 5, there is a disadvantage that the adhesive layer AD exposed on the contact surface 51 </ b> A adheres. As a result, when the wafer W is transported and placed, the wafer W cannot be separated from the contact member 51, and the placement position of the wafer W as the transport destination is shifted, or the contact means 51 and the wafer are moved. The hand moves to the next operation while W is adhered, causing a disadvantage that the wafer W falls to an unexpected position and is damaged.

[Object of the invention]
The objective of this invention is providing the conveying apparatus of the plate-shaped member which can prevent that the adhesive bond layer of the adhesive sheet affixed on the plate-shaped member contacts a contact means.

In order to achieve the above object, the present invention is a transport device for a plate-like member in which an adhesive sheet in which an adhesive layer is laminated on one surface of a base sheet,
The adhesive sheet is affixed to a position reaching the outer edge of the plate-like member,
A plurality of contact means capable of contacting the outer edge of the plate-like member, gripping means provided so as to be able to grip the plate-like member by separating and approaching the contact means, and the gripping means and the contact means A supporting means for supporting, and a moving means capable of moving the supporting means;
The contact means includes a relief portion that is in non-contact with the adhesive layer on the outer edge side of the adhesive sheet that is affixed to the plate-like member when abutting on the outer edge side of the plate-like member. Adopted.

In the present invention, the plate-like member includes first and second surfaces located on both sides in the thickness direction,
The contact means includes a first inclined surface that is inclined with respect to the first surface, and a second inclined surface that is inclined with respect to the second surface, and the first and second inclined surfaces are formed with the plate-like member. You may take the structure that it is provided in a base material sheet so that line contact is possible.

  Further, a configuration in which the escape portion is formed by a concave groove continuously provided in a direction in which the first and second inclined surfaces are narrowed is preferably employed.

  According to the present invention, since the contact means has the escape portion, the adhesive layer on the outer edge side of the adhesive sheet and the contact means can be made non-contact by this escape portion, so the plate-like member and the contact means As a result, the plate-like member cannot be separated from the contact means, the mounting position of the plate-like member at the transport destination is shifted, or the contact means and the plate-like member are bonded. It is possible to prevent the abutting means from moving to the next operation while the plate member is dropped to an unexpected position and damaged.

  In addition, since the contact means has first and second inclined surfaces that can come into line contact with the plate-like member and the base sheet, the contact area between the contact means and the plate-like member can be reduced as much as possible. It becomes possible to make it easy for the means to be in a non-contact state with the adhesive layer.

  Furthermore, by forming the relief portion with the concave groove, it is possible to better avoid contact between the adhesive layer on the outer edge side of the adhesive sheet and the contact means with a simple configuration.

FIG. 3 is a schematic plan view of the transport device according to the embodiment. The partial schematic front view of the said conveying apparatus. The fragmentary sectional view of the said conveying apparatus. The front view similar to FIG. 3 of the conveying apparatus which concerns on a modification. The front view similar to FIG. 3 of the conveying apparatus which concerns on a prior art example.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  In FIG. 1 to FIG. 3, the transfer device 10 includes a support unit 11 formed of an arm member branched in a bifurcated manner, and a moving unit 12 formed of an articulated robot as a driving device provided so as to be movable. A cassette capable of accommodating a plurality of wafers W, comprising a plurality of contact means 13 that can contact the outer edge of the wafer W as a plate-like member, and a gripping means 15 that allows the contact means 13 to be separated and approached. Wafer W is provided between C and a table (not shown) or the like.

  The wafer W has a substantially circular shape in plan view, and the lower surface in FIG. 3 is a first surface W1 having a circuit surface, the upper surface in FIG. 3 is a second surface W2, and the first and second surfaces W1, W2 are the wafer W. Located on both sides in the thickness direction. The wafer W is provided in a shape having a ring-shaped convex portion W3 on the outer edge side of the second surface W2, while the outer edge shape is formed in an arc shape when viewed in cross section in the radial direction. A protective adhesive sheet S is affixed to the first surface W1 of the wafer W, and the adhesive sheet S is bonded to the base sheet BS and one surface of the base sheet BS (upper surface in the figure). The adhesive layer AD is attached to the wafer W through the adhesive layer AD. Further, the adhesive sheet S is applied and cut in the same manner as the adhesive sheet S of FIG. 5, is applied to a position reaching the outer edge of the wafer W, and the adhesive layer AD is exposed on the outer edge side of the wafer W.

  The moving means 12 includes a base portion 16 and an articulated arm portion 17 provided on the upper surface of the base portion 16 and capable of relatively rotating a plurality of arms. The amount of movement of each arm of the multi-joint arm unit 17 is controlled by a program with numerical information corresponding to a motor (not shown) provided in the joint unit.

  The contact means 13 includes two fixed contact means 13A provided on the distal end side (left side in FIG. 1) of the support means 11 and the grip means 15 on the proximal end side (right side in FIG. 1) of the support means 11. And two movable contact means 13B supported. Each of the contact means 13A and 13B is provided with a shape in which a region of contact with the outer edge of the wafer W is recessed, and a fluorine resin or a silicone resin, a fluorine coat or a silicone coat to which the adhesive of the adhesive layer AD is difficult to adhere. ing. Specifically, the first and second surfaces incline with respect to the first and second surfaces W1 and W2 positioned horizontally in FIG. 3 and approach as they go away from the outer edge of the wafer W (left direction in FIG. 3). Two inclined surfaces 21 and 22 and a relief portion 23 extending in the vertical direction by connecting the end portions (left end portions in the figure) on which the first and second inclined surfaces 21 and 22 are narrowed are provided. It has been. When gripping the wafer W via the contact means 13A, 13B, the first inclined surface 21 is in line contact with the base sheet BS of the adhesive sheet S, and the second inclined surface 22 is a semicircular arc-shaped wafer. W is provided on the outer edge so as to be capable of line contact. Further, the escape portion 23 is provided at a position where it does not contact the outer edge of the wafer W and the adhesive layer AD on the outer edge side of the adhesive sheet S.

The gripping means 15 is an air cylinder 26 as a driving device provided on the base end side of the support means 11 and a connecting member that is provided on the output shaft of the air cylinder 26 and connects the two movable contact means 13B. 27, the movable contact means 13B is moved in the left-right direction in FIGS. 1 and 2 by the operation of the air cylinder 26, and the fixed contact means 13A and the movable contact means 13B can be separated and approached. As a result, the gripping means 15 can grip the wafer W by bringing the fixed contact means 13A and the movable contact means 13B closer, and can release the gripping of the wafer W by separating them. .

  Next, a method for transferring the wafer W by the transfer apparatus 10 will be described.

  First, by moving the moving means 12, the support means 11 is made to enter the lower surface side of the wafer W placed on the shelf C1 provided on both sides of the cassette C in the direction perpendicular to the paper surface in FIG. The wafer W is positioned between the contact means 13A and the movable contact means 13B. Next, the air cylinder 26 is operated to bring the fixed contact means 13A and the movable contact means 13B closer to each other, whereby the wafer W is held by the contact means 13A and 13B.

  In a state where the wafer W is gripped, the first inclined surface 21 of each of the contact means 13A and 13B is in line contact with the base sheet BS, and the second inclined surface 22 is in line contact with the outer edge of the wafer W. In FIG. 3, movement in the vertical and horizontal directions is restricted. At this time, although the adhesive layer AD is exposed on the outer edge side of the adhesive sheet S, the escape portion 23 is positioned away from the adhesive layer AD, and the contact means 13A, 13B and the adhesive The layer AD is kept out of contact.

  After gripping the wafer W, the moving means 12 is actuated again to move the wafer W onto a mounting surface such as a table (not shown). Thereafter, the air cylinder 26 is operated to separate the fixed contact means 13A and the movable contact means 13B, release the gripping of the wafer W, and place it on the placement surface, thereby completing the transfer of the wafer W. To do.

  Therefore, according to such an embodiment, the wafer W can be transported with the contact means 13A, 13B and the adhesive layer AD being in non-contact. As a result, the contact means 13A, 13B and the wafer W can be prevented from adhering to each other, and when the wafer W is released, the wafer W is displaced as the movable contact means 13B moves. Thus, it is possible to prevent the device from being placed on a placement surface of a table (not shown). Furthermore, it is possible to eliminate a dedicated device for releasing the adhesion between the contact means 13A, 13B and the wafer W, manual work by manpower, and the like.

As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this.
In other words, the present invention has been illustrated and described mainly with respect to specific embodiments, but without departing from the scope of the technical idea and object of the present invention, the shape, position, or With respect to the arrangement and the like, those skilled in the art can make various changes as necessary.
Therefore, the description limited to the shape disclosed above is an example for easy understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded one part or all part is included in this invention.

  The shape of the escape portion 23 can be variously changed. For example, as shown in FIG. The concave groove 30 is provided continuously in the direction in which the first and second inclined surfaces 21 and 22 are narrowed, and is provided in a shape that is recessed away from the outer edge of the wafer W, whereby the contact means 13A and 13B are provided. Adhesion of the adhesive layer AD can be prevented better.

  The drive device in the embodiment includes an electric device such as a rotation motor, a linear motion motor, a linear motor, a single-axis robot, and an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition to these, a combination of them directly or indirectly may be employed (some of them overlap with those exemplified in the embodiment).

  Further, in the present invention, the plate-like member can be a target of other adherends such as a glass plate, a steel plate, or a resin plate, and the semiconductor wafer may be a silicon semiconductor wafer or a compound semiconductor wafer. Good.

Further, the arm member constituting the support means 11 is not limited to a bifurcated shape as shown in the above embodiment, but has a bifurcated shape or a bifurcated shape. Even I-type, same shape as plate-like member, shape similar to plate-like member, round, triangle, quadrilateral or more polygon, geometric shape Good.
Further, the number and position of the contact means 13A and 13B may be changed according to the shape of the arm member as long as the wafer W can be gripped as described above.

DESCRIPTION OF SYMBOLS 10 Conveyance apparatus 11 Support means 12 Movement means 13 Contact means 15 Holding means 21 1st inclined surface 22 2nd inclined surface 23 Escape part AD Adhesive layer BS Base material sheet S Adhesive sheet W Semiconductor wafer (plate-shaped member)
W1 1st surface W2 2nd surface

Claims (3)

A transport device for a plate-like member in which an adhesive sheet in which an adhesive layer is laminated on one surface of a base sheet is attached,
The adhesive sheet is affixed to a position reaching the outer edge of the plate-like member,
A plurality of contact means capable of contacting the outer edge of the plate-like member, gripping means provided so as to be able to grip the plate-like member by separating and approaching the contact means, and the gripping means and the contact means A supporting means for supporting, and a moving means capable of moving the supporting means;
The abutting means is provided in a shape having a relief portion that comes into non-contact with the adhesive layer on the outer edge side of the adhesive sheet attached to the plate-like member when abutting on the outer edge side of the plate-like member. A conveying device for a plate-like member. The plate-like member includes first and second surfaces located on both sides in the thickness direction,
The contact means includes a first inclined surface that is inclined with respect to the first surface, and a second inclined surface that is inclined with respect to the second surface, and the first and second inclined surfaces are formed with the plate-like member. The plate-shaped member conveying device according to claim 1, wherein the conveying device is provided so as to be able to come into line contact with the base material sheet.   3. The plate-shaped member conveying apparatus according to claim 2, wherein the escape portion is formed by a concave groove continuously provided in a direction in which the first and second inclined surfaces are narrowed.

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