CN101041209A - Laser processing method and processing device - Google Patents

Laser processing method and processing device Download PDF

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Publication number
CN101041209A
CN101041209A CNA2007101011215A CN200710101121A CN101041209A CN 101041209 A CN101041209 A CN 101041209A CN A2007101011215 A CNA2007101011215 A CN A2007101011215A CN 200710101121 A CN200710101121 A CN 200710101121A CN 101041209 A CN101041209 A CN 101041209A
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CN
China
Prior art keywords
laser beam
substrate
laser
processing
hole
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Granted
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CNA2007101011215A
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Chinese (zh)
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CN100553854C (en
Inventor
浜田史郎
山本次郎
山口友之
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Sumitomo Heavy Industries Ltd
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Sumitomo Heavy Industries Ltd
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Publication of CN101041209A publication Critical patent/CN101041209A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0652—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Electromagnetism (AREA)
  • Laser Beam Processing (AREA)

Abstract

A laser processing method and a processing device are provided, wherein, the laser processing method comprises the work procedure that: the diffuser angle of a laser beam emitted from a laser source is adjusted; the laser beam is radiated onto an approaching shading frame, which is arranged on a position paralleled with the surface of a processing object in a specified distance and has a through hole, while the travel direction of the laser beam with a specified diffuser angle is changed, so as to make the laser beam, which passes through the through hole, to radiate onto the surface of the processing object for transfer printing the shape of the through hole onto the surface of the object. At least one of the diffuser angle and specified distance work procedures is set as per a relation relatively found out according to the precision of transfer printing the image of the through hole onto the surface of the processing object, the diffuser angle of the laser beam and the distance between the approaching shading frame and the surface of the processing object.

Description

Laser processing and processing unit (plant)
The application is that the application number of on August 29th, 2003 application is " 03820478.9 ", denomination of invention dividing an application for the patent application of " laser processing and processing unit (plant) ".
Technical field
The present invention relates to laser processing and the laser processing device processed to processing object object illumination laser beam.
Background technology
Fig. 9 is the skeleton diagram that expression forms the existing laser processing device of groove.
Penetrate pulse laser beam from LASER Light Source 51 with for example frequency 1kHz.Evenly (head is average: ト Star プ Off ラ Star ト), with the masking frame 53 that for example has circular through hole beam cross-section shape is shaped as circle again with the pulse energy density of the beam cross section of laser beam with homogenizer 52.After speculum 54 reflections, incide substrate 56 through collector lens 55.Substrate 56 is the substrates that for example are formed with the ITO film on the glass basis material.Laser beam incident is to the ITO film of substrate 56.The luminous point of the lip-deep laser beam of ITO film for example is the circle of diameter 0.2mm.Substrate 56 is set on the XY worktable 57.XY worktable 57 moves in two dimensional surface by making substrate 56, can the surface on substrate 56 in the incoming position of mobile pulse laser beam.
At first, mobile XY worktable makes pulse laser beam shine on the substrate 56 with 50% repetitive rate, forms groove on the ITO of substrate 56 film.The repetitive rate here is meant, the distance that moves to the radius of a circle direction during the every irradiation of pulse laser beam 1 time and the ratio of circular diameter.
Figure 10 A is that expression utilizes the approximate vertical view that has formed the substrate 56 of groove with the continuous perforate of laser beam of 50% repetitive rate irradiation on the ITO film.The opening of representing groove with thick line.Punch out the hole that depends on the shape that incides the laser beam spots on the ITO film continuously, the result has formed groove.Therefore, prolong the edge of opening of slot length direction, the part by the circular light spot periphery has concavo-convex.In addition, when the laser beam frequency of irradiation be that laser beam spots on the ITO film of 1kHz, substrate 56 is that acceleration is 100mm/s under the situation of circle of diameter 0.2mm.Mainly be that rule speed is the responsiveness of XY worktable, if consider the uniformity of machining shape, process velocity can not be brought up to this more than speed.
For the edge of opening that will be formed at the groove on the ITO film is made near linearity, adopt the method that strengthens repetitive rate.For example, mobile XY worktable so that on the ITO of substrate 56 film with 90% repetitive rate irradiated with pulse laser, form groove.
Figure 10 B is that expression utilizes the approximate vertical view that has formed the substrate 56 of groove with the continuous perforate of laser beam of 90% repetitive rate irradiation on the ITO film.Identical with Figure 10 A, represent the opening of groove with thick line.Along the edge of opening of the length direction of groove near rectilinear form.But, because with 90% repetitive rate illuminating laser beam, thus process velocity be repetitive rate be 50% o'clock 1/5th, i.e. 20mm/s.Though improved opening shape, the time efficiency of processing reduces.
Figure 11 is the summary sectional view of the substrate 56 cut open along the PQ line of 10A.On the ITO film that is forming on the glass substrate, be formed with groove.The side of groove is with respect to the surface tilt of substrate 56.Groove preferably has more straight side view.
Summary of the invention
The objective of the invention is to the laser processing and the laser processing device that a kind of time efficiency height are provided and can carry out high-quality processing.
According to a viewpoint of the present invention, a kind of laser processing is provided, comprise following operation: adjust from the operation of the laser beam angle of flare of lasing light emitter ejaculation; Change the direct of travel that is adjusted to laser beam on one side with regulation angle of flare, on one side this laser beam is shone be configured in only leave the position of predetermined distance abreast from this surface with the surface of processing object thing and have through hole near on the masking frame, make the laser beam incident that passed through this through hole surface to this processing object thing, with the shape transferred thereon of this through hole to the lip-deep operation of this processing object thing; According to the shape transferred thereon of this through hole to the angle of flare of the lip-deep precision of this processing object thing, laser beam, the above-mentioned relation of obtaining in advance near the distance dependent ground between masking frame and the above-mentioned processing object thing surface, set at least one the operation in afore mentioned rules angle of flare and the afore mentioned rules distance.
Utilize the optical beam scanner of the direct of travel that changes laser beam, utilize Laser Processing, can carry out high-precision processing at high speed thus near masking frame.Moreover, according to obtain in advance, transfer printing precision and laser beam angle of flare and near the numerical relation that must satisfy at interval, add man-hour with the transfer printing precision of expectation, can select easily near interval and angle of flare.
According to other viewpoint of the present invention, a kind of laser processing can be provided, comprise following operation: with the cross section of masking frame shaping laser beam with through hole, and incide on the surface of this processing object thing after utilizing lens to make laser beam condensation by this through hole, so that the through hole of this masking frame is imaged on the surface of processing object thing; Scanning moves the incoming position of laser beam by the laser beam of said lens on the surface of above-mentioned processing object thing, and, in the scanning of laser beam, also above-mentioned through hole is imaged on the surface of above-mentioned processing object thing, process this processing object thing.
By at processing object thing surface scan laser beam, make the through hole imaging all the time of masking frame, can be to carry out the good processing of quality expeditiously.Can prevent the decline of the fuzzy crudy that is caused of focusing that the scanning of laser beam causes.
In addition,, provide following a kind of laser processing, comprise following operation: will be by the laser beam incident of lens light gathering to the lip-deep operation of processing object thing according to another viewpoint of the present invention; Scan this laser beam the incoming position of laser beam is moved on above-mentioned processing object thing surface, process this processing object thing thus, and, when this laser beam of scanning, the optical path length of this laser beam from said lens to above-mentioned processing object thing surface is not changed.
That the optical path length of Working position that on one side will be from lens to processing object thing surface remains is constant, scanning laser beam on one side, and focusing on processing object thing surface all the time for example can be to carry out high-quality Laser Processing expeditiously.
Moreover, according to another viewpoint of the present invention, provide following a kind of laser processing device, comprising: the lasing light emitter of outgoing laser beam; The maintenance platform that keeps the processing object thing; Masking frame has the through hole that shaping is carried out in the cross section of the laser beam that penetrates from above-mentioned lasing light emitter; Collector lens, will be by above-mentioned masking frame shaping the laser beam condensation in cross section so that the through hole of this masking frame is imaged on the surface of the processing object thing that is kept by above-mentioned maintenance platform; Optical beam scanner is accepted the control from the outside, and the laser beam by above-mentioned collector lens optically focused is being scanned on the one dimension direction on the surface of above-mentioned processing object thing at least; Travel mechanism accepts the control from the outside, moves above-mentioned masking frame and above-mentioned collector lens; And control device, make the scanning undertaken by above-mentioned optical beam scanner and the moving synchronously of the above-mentioned masking frame that undertaken by above-mentioned travel mechanism and above-mentioned collector lens.
If utilize this laser processing device, by with the scan-synchronized ground displacement masking frame and the collector lens of light beam, can carry out high-quality Laser Processing expeditiously.
According to other viewpoints of the present invention, following a kind of laser processing is provided, comprise following operation: operation (e), laser beam incide on the surface of processing object thing after by lens light gathering; Operation (f), when laser beam moves the incoming position of above-mentioned processing object thing, on one side mobile said lens, the incoming position of mobile laser beam in the surface of above-mentioned processing object thing on one side, suppress the pulse energy density of laser beam on above-mentioned processing object thing surface or power density, by the mobile change that causes of incoming position.
Mobile lens makes pulse energy density or the power density homogenising that is radiated at the laser beam on the machined surface, the processing characteristics that can be maintained fixed the wide region of machined surface.
According to other viewpoint of the present invention, following a kind of laser processing is provided, comprise following operation: laser beam incides on the processing object thing surface after by lens light gathering; When laser beam moves the incoming position of above-mentioned processing object thing, on one side mobile said lens, the incoming position of mobile laser beam in above-mentioned processing object thing surface on one side are with the area change of the mobile lip-deep luminous point of above-mentioned processing object thing that causes that suppresses incoming position.
Mobile lens makes the spot areas homogenising of the laser beam that is radiated on the machined surface, can realize the pulse energy density on the substrate or the homogenising of power density, the processing characteristics that can be maintained fixed the wide region of machined surface.
According to other viewpoint of the present invention, a kind of laser processing device is provided, comprising: the lasing light emitter of outgoing laser beam; The maintaining body that keeps the processing object thing; Lens will be from the laser beam condensation of above-mentioned lasing light emitter output; Optical beam scanner changes from the direct of travel of the laser beam of said lens ejaculation, makes laser beam incident to the surface of the processing object thing that is kept by above-mentioned maintaining body, the incoming position of mobile laser beam in the surface of processing object thing; Travel mechanism accepts the control signal from the outside, mobile said lens; And control device, when the incoming position of above-mentioned optical beam scanner at the surperficial mobile laser beam of processing object thing, control the position that above-mentioned travel mechanism comes mobile said lens, so that the pulse energy density of the laser beam on inhibition processing object thing surface or the variation of power density.
Mobile lens makes pulse energy density or the power density homogenising that is radiated at the laser beam on the machined surface, the processing characteristics that can be maintained fixed the wide region of machined surface.
According to other viewpoints of the present invention, a kind of laser processing device is provided, comprising: the lasing light emitter of outgoing laser beam; The maintaining body that keeps the processing object thing; Lens will be from the laser beam condensation of above-mentioned lasing light emitter output; Optical beam scanner changes from the direct of travel of the laser beam of said lens ejaculation, makes laser beam incident to the surface of the processing object thing that is kept by above-mentioned maintaining body, the incoming position of mobile laser beam in the surface of processing object thing; Travel mechanism accepts the control signal from the outside, mobile said lens; And control device, when the incoming position of above-mentioned optical beam scanner, control the position that above-mentioned travel mechanism comes mobile said lens, so that suppress the change of the spot areas on processing object thing surface at the surperficial mobile laser beam of processing object thing.
Mobile lens makes the spot areas homogenising of the laser beam that is radiated on the machined surface, can realize the pulse energy density on the substrate or the homogenising of power density, the processing characteristics that can be maintained fixed the wide region of machined surface.
According to other viewpoint of the present invention, a kind of laser processing is provided, comprise following operation: operation (g), laser beam incide on the surface of processing object thing after by lens light gathering; Operation (h), when laser beam moves the incoming position of above-mentioned processing object thing, on one side regulate the power of laser beam, the incoming position of mobile laser beam in the surface of above-mentioned processing object thing on one side with variable attenuator, with the pulse energy density of the laser beam that suppresses above-mentioned processing object thing surface or power density, because of the mobile change that causes of incoming position.
Pulse energy density or the power density of utilizing variable attenuator to come the laser beam of homogenising irradiation machined surface, the processing characteristics that can be maintained fixed to the wide region of machined surface.
According to other viewpoint of the present invention, a kind of laser processing device is provided, comprising: the lasing light emitter of outgoing laser beam; The maintaining body that keeps the processing object thing; Lens will be from the laser beam condensation of above-mentioned lasing light emitter output; Optical beam scanner changes from the direct of travel of the laser beam of said lens ejaculation, makes laser beam incident to the surface of the processing object thing that is kept by above-mentioned maintaining body, the incoming position of mobile laser beam in the surface of processing object thing; Variable attenuator is accepted the control signal from the outside, comes the power of attenuated laser beam with variable attenuation rate; And control device, when the incoming position of above-mentioned optical beam scanner at the surperficial mobile laser beam of processing object thing, control above-mentioned variable attenuator and regulate the power of laser beam, so that the pulse energy density of the laser beam on inhibition processing object thing surface or the variation of power density.
Pulse energy density or the power density of utilizing variable attenuator to come the laser beam of homogenising irradiation machined surface, the processing characteristics that can be maintained fixed to the wide region of machined surface.
According to other viewpoint of the present invention, a kind of laser processing device is provided, comprising: the lasing light emitter of outgoing laser beam; The maintaining body that keeps the processing object thing; First lens are assembled or are dispersed from the laser beam of above-mentioned lasing light emitter output; Second lens, incident have passed through the laser beam of above-mentioned first lens, and with the laser beam condensation of incident; Optical beam scanner changes from the direct of travel of the laser beam of above-mentioned second lens ejaculation, makes laser beam incident to the surface of the processing object thing that is kept by above-mentioned maintaining body, the incoming position of mobile laser beam in the surface of processing object thing; Travel mechanism accepts the control signal from the outside, moves above-mentioned first lens; And control device, when the incoming position of above-mentioned optical beam scanner at the surperficial mobile laser beam of processing object thing, control the position that above-mentioned travel mechanism moves above-mentioned first lens, so that the pulse energy density of the laser beam on inhibition processing object thing surface or the variation of power density; For the numerical aperture of this second lens of the laser beam of incident second lens be made as NA1, when being made as NA2 for the numerical aperture of this second lens of the laser beam that has passed through above-mentioned second lens, NA1/Na2 is more than or equal to 2.
Move first lens and make pulse energy density or the power density homogenising that is radiated at the laser beam on the machined surface, the processing characteristics that can be maintained fixed the wide region of machined surface.Moreover, by shortening the displacement of first lens, can realize high speed, the high precision int processed.
According to other viewpoints of the present invention, a kind of laser processing device is provided, comprising: the lasing light emitter of outgoing laser beam; The maintaining body that keeps the processing object thing; The beam cross section reshaper has through hole, to the laser beam that this through hole incident is penetrated from above-mentioned lasing light emitter, accepts the control signal from the outside, can change the length of a direction of the lasing aperture that has passed through through hole; Lens will be from the laser beam condensation of above-mentioned beam cross section reshaper ejaculation; Optical beam scanner changes from the direct of travel of the laser beam of said lens ejaculation, makes laser beam incident to the surface of the processing object thing that is kept by above-mentioned maintaining body, the incoming position of mobile laser beam in the surface of processing object thing; And control device, when the incoming position of above-mentioned optical beam scanner, control above-mentioned beam cross section reshaper at the surperficial mobile laser beam of processing object thing, make above-mentioned beam cross section reshaper suppress the shape change of the laser beam on processing object thing surface.
When move processed position, suppress the change of light spot form, therefore the processing characteristics that can be maintained fixed to the wide region of machined surface.
According to other viewpoints of the present invention, a kind of laser processing device is provided, comprising: the lasing light emitter of outgoing laser beam; The maintaining body that keeps the processing object thing; Lens will be from the laser beam condensation of above-mentioned lasing light emitter ejaculation; Optical beam scanner changes from the direct of travel of the laser beam of said lens ejaculation, makes laser beam incident to the surface of the processing object thing that is kept by above-mentioned maintaining body, the incoming position of mobile laser beam in the surface of processing object thing; Near masking frame, be configured in the laser beam incident that penetrates from the above-mentioned optical beam scanner light path before the processing object thing, have through hole, make the laser beam incident that has passed through this through hole to the processing object thing.
Utilize the optical beam scanner of the direct of travel that changes laser beam, utilize Laser Processing, can carry out high-precision processing at high speed thus near masking frame.
According to other viewpoints of the present invention, a kind of laser processing device is provided, comprising: the lasing light emitter that penetrates continuous-wave laser beam; The maintaining body that keeps the processing object thing; Optical system, the laser beam that incident is penetrated from above-mentioned lasing light emitter, according to the opportunity signal that provides from the outside, the state that changeable laser beam with incident penetrates to first direction and not to the state of first direction ejaculation; Masking frame has the through hole of rectangle, injects this through hole from above-mentioned optical system to the laser beam that above-mentioned first direction penetrates, and the cross section of shaping laser beam; Lens will be imaged on the surface of the processing object thing that is kept by above-mentioned maintaining body the rectangle through hole of above-mentioned masking frame from the laser beam condensation of above-mentioned masking frame ejaculation; Travel mechanism moves above-mentioned maintaining body according to the control signal that provides from the outside, can move the position from the laser beam incident of said lens ejaculation to the processing object thing in the surface of processing object thing; Rotating mechanism according to the control signal that provides from the outside, makes above-mentioned masking frame around the axle rotation that parallels with the optical axis of the laser beam of the through hole that has passed through this masking frame; Controlling organization, send above-mentioned opportunity signal to above-mentioned optical system, and control above-mentioned travel mechanism, make above-mentioned travel mechanism move the incoming position of laser beam to the processing object thing to second direction, before above-mentioned travel mechanism moves the incoming position of the lip-deep laser beam of processing object thing to this second direction, control above-mentioned masking frame rotating mechanism, above-mentioned masking frame rotating mechanism rotates above-mentioned masking frame, makes certain of picture on processing object thing surface of above-mentioned rectangle through hole parallel with second direction on one side.
The surface irradiation continuous-wave laser beam of object machining object can form wire figure (line), shine from the intrafascicular pulse laser beam of telling of continuous wave laser, can easily form the discrete figure (point) of point-like.On processing object thing surface, Yi Bian by with certain irradiation position of mobile laser beam abreast of the rectangle luminous point of laser beam, when can form line, point, profile is formed rectangle.
According to other viewpoint of the present invention, a kind of laser processing is provided, comprise following operation: operation (i), the state that the operation of the continuous-wave laser beam that penetrates from lasing light emitter to optical system incident, the changeable laser beam with incident of this optical system penetrate to first direction and not to the state of first direction ejaculation; Operation (j), the laser beam incident that will penetrate to above-mentioned first direction from above-mentioned optical system carries out the cross section shaping to the masking frame with rectangle through hole, behind lens light gathering, the picture of above-mentioned through hole is imaged on the surface of processing object thing; And operation (k), on the surface of above-mentioned worker's object, the picture of above-mentioned through hole is being moved on one side with certain parallel direction of this picture; When forming the discrete figure of point-like on processing object thing surface, in above-mentioned operation (i), from above-mentioned optical system to above-mentioned first direction outgoing laser beam off and on; When forming the figure of wire on processing object thing surface, in above-mentioned operation (i), from above-mentioned optical system to above-mentioned first direction outgoing laser beam continuously.
The surface irradiation continuous-wave laser beam of object machining object can form wire figure (line), shine from the intrafascicular pulse laser beam of telling of continuous wave laser, can easily form the discrete figure (point) of point-like.On processing object thing surface, Yi Bian by with certain irradiation position of mobile laser beam abreast of the rectangle luminous point of laser beam, when can form line, point, profile is formed rectangle.
According to another viewpoint of the present invention, a kind of laser processing device is provided, comprising: the maintaining body that keeps the processing object thing; Penetrate first lasing light emitter of pulse laser beam; Penetrate second lasing light emitter of continuous-wave laser beam; Optical system, surface at the processing object thing that is kept by above-mentioned maintaining body, the pulse laser beam that irradiation is penetrated from above-mentioned first lasing light emitter and from the above-mentioned second lasing light emitter continuous-wave laser beam is so that comprise the luminous point of pulse laser beam in the inside of the luminous point of continuous-wave laser beam; And travel mechanism, on the processing object thing surface that is kept by above-mentioned maintaining body, the luminous point of mobile pulse laser beam and continuous-wave laser beam.
In lip-deep certain area to be machined of processing object thing, at first shine continuous-wave laser beam and give preheating, irradiated with pulse laser Shu Jinhang processing then.Can easily select the top layer of this area to be machined to process.
According to other viewpoint of the present invention, a kind of laser processing is provided, comprise following operation: operation (n), penetrate pulse laser beam from first lasing light emitter, penetrate continuous-wave laser beam from second lasing light emitter; Operation (o), the processed point of on the surface of processing object thing, delimiting with substrate layer and top layer, after the continuous-wave laser beam that irradiation is penetrated from above-mentioned second lasing light emitter is given preheating, to the pulse laser beam of this processed some irradiation from above-mentioned first lasing light emitter ejaculation, top layer at above-mentioned processing object thing forms the hole, wherein, above-mentioned top layer is formed on the surface of substrate layer, more is difficult to form by the material that the laser irradiation is processed by the material than substrate layer.
In lip-deep certain area to be machined of processing object thing, at first shine continuous-wave laser beam and give preheating, irradiated with pulse laser Shu Jinhang processing then.Can easily select the top layer of this area to be machined to process.
Description of drawings
Fig. 1 is the skeleton diagram of laser processing device of carrying out the laser processing of first embodiment of the invention.
Fig. 2 is the skeleton diagram of the light path of laser beam in the laser processing device of the expression laser processing of carrying out first embodiment of the invention.
Fig. 3 A and Fig. 3 B are the vertical views of the substrate of the summary irradiation processing of representing to utilize laser beam.
Fig. 4 A is the skeleton diagram of an example of the through hole of expression masking frame, Fig. 4 B be the through hole shown in the presentation graphs 4A on substrate during imaging, the skeleton diagram in the hole on substrate, left.
Fig. 5 A is the summary curve that is illustrated in energy density the cross section of the pulse laser beam that penetrates from LASER Light Source, 1 pulse; Fig. 5 B is the summary curve that has changed energy density in the pulse laser beam interface that pulse energy density distributes, 1 pulse by the circular cone optical system; Fig. 5 C utilizes the summary sectional view with hole that pulse laser beam that the pulse energy density shown in Fig. 5 B distributes processes.
Fig. 6 is a skeleton diagram of carrying out the laser processing device of the laser processing that the variation of first embodiment relates to.
Fig. 7 is the skeleton diagram of expression light path governor motion.
Fig. 8 A and Fig. 8 B are the skeleton diagrams of expression connecting gear.
Fig. 9 is the skeleton diagram of existing laser scribe apparatus.
Figure 10 A and Figure 10 B are the approximate vertical views with the substrate of existing laser scribe apparatus processing.
Figure 11 is the summary sectional view with the substrate of existing laser scribe apparatus processing.
Figure 12 A is the skeleton diagram of laser processing device of carrying out the laser processing of second embodiment; Figure 12 B is a skeleton diagram of carrying out the laser processing device of the laser processing that the variation of second embodiment relates to.
Figure 13 is a skeleton diagram of carrying out laser beam light path in the laser processing device of laser processing of second embodiment.
Figure 14 is a skeleton diagram of carrying out laser beam light path in the laser processing device of the laser processing that the variation of second embodiment relates to.
Figure 15 A is the skeleton diagram of laser processing device of carrying out the laser processing of the 3rd embodiment; Figure 15 B is the skeleton diagram of another structure example of expression primary condenser lens.
Figure 16 is the skeleton diagram of the structure example of expression secondary condenser lens.
Figure 17 is the skeleton diagram of laser processing device of carrying out the laser processing of the 4th embodiment.
Figure 18 A is the skeleton diagram when the rotor shaft direction of peristome leaning device is seen aperture by peristome leaning device rotation; Figure 18 B is the skeleton diagram when the optical axis direction of laser beam is seen aperture by peristome leaning device rotation; Figure 18 C is the skeleton diagram when the optical axis direction of laser beam is seen peristome by the rotation of peristome leaning device and peristome rotating mechanism.
Figure 19 is the skeleton diagram of laser processing device of carrying out the laser processing of the 5th embodiment.
Figure 20 be the expression analog result relevant with the transfer printing precision in the laser processing that has utilized contiguous masking frame, projection has the vertical view of the substrate of through hole picture.
Figure 21 is that summary is represented to add the angle of flare of man-hour, laser beam and the curve of the relation that contiguous masking frame is satisfied with a certain transfer printing precision.
Figure 22 A is the skeleton diagram of laser processing device of carrying out the laser processing of the 6th embodiment, and Figure 22 B is the summary sectional view of substrate.
Figure 23 is an example of the sequential chart of opportunity signal when utilizing the laser processing device of the 6th embodiment to carry out Laser Processing and laser beam.
Figure 24 A is the approximate vertical view that has formed the substrate of line; Figure 24 B is the approximate vertical view that has formed the substrate of point.
Figure 25 is the skeleton diagram that expression has kept the masking frame rotating mechanism of masking frame.
Figure 26 utilizes the masking frame rotating mechanism to form the approximate vertical view of the substrate of line.
Figure 27 A is the skeleton diagram of laser processing device of carrying out the laser processing of the 7th embodiment; Figure 27 B is the summary construction diagram of substrate.
Figure 28 A, Figure 28 B, Figure 28 C are the vertical views of substrate that is used to illustrate the position relation of processed point and luminous point.
Figure 29 does not use the masking frame rotating mechanism just to form the approximate vertical view of the substrate of line.
The specific embodiment
Fig. 1 is the skeleton diagram of laser processing device of carrying out the laser processing of first embodiment of the invention.
In LASER Light Source 1,, penetrate three times of high frequency waves (wavelength 355nm) of Nd:YAG laser instrument with pulse energy 1mJ/ pulse, the wide 50ns of pulse from for example comprising the Nd:YAG laser oscillator of wavelength conversion assembly.Laser beam incides circular cone optical system 4 behind the variable attenuator 2 and expanded light beam diameter and the beam expander 3 with the directional light ejaculation of regulating impulse energy.Circular cone optical system 4 comprises a pair of Conical Lenses 4a, 4b and constitutes.A pair of Conical Lenses 4a, 4b are for example identical shaped, and it is opposed mutually to be configured to the bottom surface.Laser beam from straight circular cone axially to Conical Lenses 4a incident, the beam cross section center is overlapped with the summit of straight tapered segment, penetrate from Conical Lenses 4b then.Circular cone optical system 4 changes the beam distribution figure of the laser beam of incident, makes in the central portion intensity of beam cross section weak, stronger at periphery.About this point, describe in detail in the back.And,, also can replace the Conical Lenses 4b of laser beam emitting side with convex lens about circular cone optical system 4.
The masking frame 5 of the laser beam that penetrates from circular cone optical system 4 by for example having the rectangle through hole, the object lens 6 of rectangle through hole imaging on substrate 12 that make masking frame 5.Masking frame 5 and object lens 6 can move in the direction parallel with the direct of travel of laser beam respectively by voice coil loudspeaker voice coil mechanism 9 and 10 (also can replace to driving mechanisms such as drive mechanism).Utilizing moving of voice coil loudspeaker voice coil mechanism 9 and 10, is to be undertaken by the signal that slave controller 11 sends.And substrate 12 is placed on and keeps on the platform 8.
By the laser beam incident of object lens 6 optically focused to current scanning instrument (ガ Le バ ノ ス キ ヤ Na) 7.Current scanning instrument 7 comprises X and constitutes with scanner 7b with scanner 7a and Y, makes laser beam high-velocity scanning on two-dimensional directional.X comprises the speculum that can shake with scanner 7a and Y with scanner 7b and constitutes.On the substrate 2 that is held platform 8 maintenances, when delimiting (it is fixed to draw) mutually orthogonal directions X and Y direction, X with scanner 7b scanning laser beam, moves the incidence point by the laser beam of object lens 6 optically focused with scanner 7a and Y respectively along directions X, Y direction on the surface of substrate 12.Current scanning instrument 7 combination X can make laser beam scan along two-dimensional directional with scanner 7a and Y scanner 7b.
Substrate 12 as the processing object object is the substrates that for example are formed with the ITO film on the glass basis material, and laser beam is with about 1J/cm 2The ITO film of machining energy incident substrate 12.
Fig. 2 be the expression behind masking frame 5, object lens 6, current scanning instrument 7 on substrate 12 skeleton diagram of laser beam scanned light path.
During the incoming position M of laser beam incident to substrate 12, the through hole of masking frame 5 is imaged on the M.In addition, if will be from masking frame 5 to object lens 6 optical path length is made as a, the optical path length of the incoming position from object lens 6 to substrate on 12 is made as b, object lens focal length be made as f, then, must satisfy following relational expression for the through hole that makes masking frame is imaged on the substrate 12.
(1/a)+(1/b)＝1/f (1)
By the action of current scanning instrument 7, the incoming position of laser beam changes to N from the incoming position M on the substrate 12.To the incidence angle of incoming position M with different to the incidence angle of incoming position N, the motionless state if masking frame 5 and object lens 6 are fixed, the then optical path length from object lens 6 to incoming position M and different from object lens 6 to the optical path length of incoming position N (difference of establishing them is Δ b), therefore, the through hole in shading hole 5 is not imaged on the N place.
In laser processing device shown in Figure 1, controller 11 sends and the synchronously mobile masking frame 5 of action of current scanning instrument 7 and the signal of object lens 6 to voice coil loudspeaker voice coil mechanism 9,10 respectively.This signal is for example to be the signal of mobile as follows masking frame 5 and object lens 6: make from masking frame 5 to object lens 6 optical path length a and the optical path length b of the incoming position on 12 remains unchanged from object lens 6 to substrate.Voice coil loudspeaker voice coil 9,10 accepts the signal of self-controller 11, mobile respectively masking frame 5 and object lens 6 on the direction parallel with the direct of travel of laser beam.
As shown in Figure 2, when incoming position changed to N from M, the distance that masking frame 5 and object lens 6 move by voice coil loudspeaker voice coil mechanism 9 and 10 was Δ b.Masking frame 5 and object lens 6 are to the identical identical distance, delta b of direction displacement.Like this, can satisfy above-mentioned formula (1), the through hole of masking frame 5 is imaged on the incoming position N.
Not only at incoming position M and these 2 points of N, if for example make from masking frame 5 to object lens 6 optical path length a all the time and the optical path length b of the incoming position on 12 remains unchanged from object lens 6 to substrate in the scanning of laser beam, then the through hole of masking frame 5 is imaged on the surface of substrate 12 all the time.Move to the scanning synchronised of masking frame 5 and object lens 6 and the laser beam that drives by current scanning instrument 7, and make optical path length a and optical path length b constant all the time.At this moment, the imaging multiplying power (minification) of the through hole of masking frame 5 is constant all the time.
For example, under the situation of the steady state value that remain the steady state value of 833mm in the focal distance f with object lens 6,6 optical path length a remains the steady state value of 5000mm from masking frame 5 to object lens, the optical path length b of the incoming position from object lens 6 to substrate on 12 remains 1000mm, the imaging multiplying power (minification) of the through hole of masking frame 5 is 1/5.
To be irradiation pulsatile once laser beam formed the hole so that from the teeth outwards with the approximate vertical view of the substrate 12 of the rectangle through hole imaging of masking frame 5 at image space to Fig. 3 A.Having formed imaging on substrate 12 has the rectangle luminous point of through hole, on the ITO of this position film perforate.
Fig. 3 B shines the vertical view that 4 subpulse laser beams come to have formed at irradiation position the substrate 12 of groove with certain imaging multiplying power (minification) with the rectangle through hole imaging of masking frame 5, the incoming position of one side mobile beam on one side.Utilize current scanning instrument 7 to be imaged as the long side direction scanning impulse light beam of the luminous point of rectangle.In addition, the repetitive rate illumination beam with 50% forms perforate with each time irradiation continuously, thereby forms groove.
Rectangle luminous point by forming a certain size and with direction that the pair of parallel limit parallels on scanning laser beam, can form the groove of certain width.As shown in this embodiment, utilizing under the situation of pulse laser beam the scanning that the part on pair of parallel limit of luminous point of a part and last time irradiation on the pair of parallel limit (the long limit among Fig. 3 B) of luminous point is overlapped.The edge of opening of groove is formed by the line part of rectangle luminous point, and therefore becoming does not have concavo-convex linearity.
Consider that from aspects such as property easy to control preferably the direction on the pair of parallel limit of the luminous point that forms at substrate 12 is parallel with directions X or Y direction.
And the through hole of the masking frame 5 of imaging on substrate 12 can not be a rectangle also.As long as with the shape with pair of parallel limit form luminous point and on the direction parallel with this pair of parallel limit scanning laser beam, the edge that just can be formed on opening does not have the groove of concavo-convex certain width.
Fig. 4 A is the figure of an example of through hole of expression masking frame 5.The through hole of masking frame 5 forms has the shape on pair of parallel limit.Another opposite side that this opposite side is coupled together is inwards crooked.The masking frame that utilization has a through hole like this comes the cross section of shaping laser beam, just can form the luminous point of the shape with pair of parallel limit on substrate 12.
Fig. 4 B be expression when the through hole shown in Fig. 4 A on substrate 12 during imaging, the skeleton diagram in the hole on substrate 12, left.By on the direction parallel, forming the hole with this Kong Xiangtong shape continuously, just can process the groove that does not have concavo-convex certain width at the edge of opening with the pair of parallel limit.Moreover, incide near the cumlative energy density of the cumlative energy density of the laser beam the edge of groove such as the laser beam that is mapped to groove central authorities, therefore, can make the side of groove more approaching vertical.
And shown in Fig. 3 B, only Laser Processing also can be used one dimension current scanning instrument or multiaspect scanner with 1 swinging mirror under the situation of the groove that a direction is extended.At this moment, make consistent the getting final product of direction on the pair of parallel limit of the scanning direction of scanner and luminous point.
With reference to Fig. 5 A～5C explanation circular cone optical system 4.As previously mentioned, circular cone optical system 4 is transformed at the central portion of beam cross section the beam distribution figure of the laser beam of incident weak, stronger at periphery.
Fig. 5 A is the summary curve map of expression energy density from the cross section of the pulse laser beam of lasing light emitter 1 ejaculation, 1 pulse.Pulse laser beam generally is, at the middle body pulse energy density height in cross section, to approaching peripheral pulse energy density step-down.Circular cone optical system 4 penetrates the central portion and the periphery counter-rotating back of the laser beam of incident by 2 Conical Lenses 4a, 4b.Therefore, the beam distribution figure of the laser beam that penetrates from circular cone optical system 4, have weak at the central portion of beam cross section, in the stronger distribution of periphery.
Fig. 5 B is that summary is represented to penetrate and by the curve map of energy density the cross section of the pulse laser beam after masking frame 5 shapings, 1 pulse from circular cone optical system 4.Light beam has pulse energy density a little less than central portion, in the strong distribution of periphery.
Fig. 5 C is the summary section along the substrate 12 of the C5-C5 line cut-out of Fig. 3 B.Laser beam with the beam distribution figure shown in Fig. 5 B incides substrate 12 after by object lens 6 optically focused, can make the inclination angle of side near 90 ° on the ITO of substrate 12 film.Therefore, the groove shown in Fig. 3 B, not only the edge of opening forms linearity, also has the sidewall of having cut.
And, with the action of current scanning instrument 7 pulse energy of regulating impulse laser beam synchronously, can carry out the more processing of high-quality.Become big if incide the incidence angle of the laser beam of substrate 12, it is big that the spot areas of incoming position becomes.Therefore, when the pulse energy by current scanning instrument 7 laser beam scanned is fixed as under the situation of steady state value, along with the increase of incidence angle, the pulse energy density of the laser beam of incoming position diminishes, and processing characteristics changes.For the processing characteristics that is maintained fixed, also need sometimes the pulse energy density of the laser beam of incoming position is remained steady state value.
Variable attenuator 2 synchronously changes from lasing light emitter 1 pulse energy that penetrate and light beam with the action of current scanning instrument 7.When the synchronizing signal of sending according to slave controller 11, laser beam incide substrate 12 with big incidence angle, reduce the attenuation rate of pulse energy, increase from the pulse energy of the light beam of variable attenuator 2 ejaculations.So, in the scanning process of light beam, also the pulse energy density of laser beam incident position can be remained constant.
In addition, even do not remain constantly, when laser beam changes the incidence angle of substrate 12,, just can improve crudy as long as change attenuation rate by the pulse energy of variable attenuator 2 decisions.
In addition, incoming laser beam and when scanning on substrate 12 can synchronously change the imaging multiplying power (minification) of the through hole of masking frame 5 with the action of current scanning instrument 7, and the pulse energy density with the laser beam incident position remains constant simultaneously.
Δ 2＝f 2×Δ 1/(b-f-Δ 1)/(b-f) (2)
[(a+Δ 2)/(b-Δ 2)] 2+(a/b) 2/cosθ (3)
The incidence angle θ (angle that the normal of substrate 12 is become with incidence angle) of pole plate 12 is determined to satisfy the Δ of above 2 formulas according to laser beam 1, Δ 2, and with mobile accordingly masking frame 5 of incidence angle θ and object lens 6, make from masking frame 5 to object lens 6 optical path length become the a+ Δ 2, the incoming position from object lens 6 to substrate on 12 optical path length become the b-Δ 1Here, a, b be respectively θ be 0 o'clock from masking frame 5 to object lens 6 optical path length and from object lens 6 to substrate the optical path length of the incoming position on 12.In addition, f is the focal length of object lens 6.And, even strictly do not satisfy formula (2) and formula (3), also can when changing, incidence angle change over the picture multiplying power so that the change of spot areas is less, thus, can improve the Laser Processing quality.If it is big that incidence angle becomes, as long as be reduced to picture multiplying power (minification).
Fig. 6 is the skeleton diagram with change laser aid that variation light-path adjusting mechanism 20, the 1st embodiment of the optical path length b of incoming position relates on 12 from object lens 6 to substrate.From laser aid shown in Figure 1, remove voice coil loudspeaker voice coil mechanism 9 and 10, appended light-path adjusting mechanism 20.Other structure is identical with the structure of laser processing device shown in Figure 1.In laser processing device shown in Figure 6,6 optical path length a is constant from masking frame 5 to object lens.By light-path adjusting mechanism 20, for example with the action of current scanning instrument 7 synchronously, can be all the time in the scanning process of laser beam with from object lens 6 to substrate on 12 the light path b of incoming position remain constant.By like this, the through hole of masking frame 5 is imaged on the substrate 12 with constant imaging multiplying power (minification) all the time, can process the groove shown in Fig. 3 B.
Fig. 7 is the skeleton diagram of light-path adjusting mechanism 20.Light-path adjusting mechanism 20 for example comprises four speculums of 21a～21d and constitutes.Four speculums for example change 90 ° with the direct of travel of incoming laser beam respectively, and light-path adjusting mechanism 20 is to the direction outgoing laser beam parallel with the laser beam direct of travel of incident.2 speculum 21a and 21b form moving part 22.Moving part 22 can the direction of arrow move in figure.12 optical path length b can regulate by making moving part 22 displacements from object lens 6 to substrate.If laser beam becomes big to the incidence angle of substrate 12, moving part 22 moves up in Fig. 7, by shortening the optical path length of the laser beam in the light-path adjusting mechanism 20, optical path length b can be remained constant.Moving part 2 mobile is to accept to carry out from the signal of control part 22.Action and the moving synchronously of moving part 22 of controller 11 by making current scanning instrument 7 remains constant to the optical path length b of substrate 12 object lens shown in Figure 66.
In laser processing device shown in Figure 6, appended light-path adjusting mechanism 20 in order to adjust optical path length b, still,, also can be inserted between masking frame 5 and the object lens 6 in order further to adjust light path a.By utilizing 2 light-path adjusting mechanisms 20, in the scanning process of laser beam, also can adjust optical path length a and optical path length b, for example make it satisfy relational expression (1).
In addition, according to the processing difference of carrying out, can only mobile masking frame 5 and object lens 6 in any adjust optical path length a or optical path length b.For example, also fixing object lens 6 only make masking frame 5 satisfy moving of relational expression (1).
As processing object, considered on the glass basis material, to be formed with the substrate of ITO film, but also can utilize the substrate that on silicon substrate, is formed with polyimide film, the processing polyimide film.These are used as solar cell substrate or crystal liquid substrate.In addition, also can process the touch panel that on polyimide film, formed the ITO film and even semiconductor film etc.And, processing object thing that also can the film processed shape.
Fig. 8 A is the skeleton diagram that transmits the connecting gear 31 of film 30.Utilize connecting gear 31 to transmit film 30.Vacuum cup 32 fixedly is transmitted the Working position of the regulation on the next film 30, delimits machined surface.Incide on the film of fixing by vacuum cup 32 32 by current scanning instrument 7 laser beam scanned, carry out the processing of regulation Working position.When the process finishing of assigned position, connecting gear 31 transmits films 30, with vacuum cup 32 fixing other Working positions, processes.
In the past, moved the film of fixing by vacuum cup 32 30 with XY worktable, and used the fixed optical system illumination beam, processed thus.In the present embodiment, be with current scanning instrument 7 scanning light beams, process, therefore can improve process velocity at the Working position incident beam.
Fig. 8 B is the skeleton diagram with connecting gear 31 of rotary encoder 33.Rotary encoder 33 detects the speed of the film 30 that is sent by connecting gear 31.Testing result is given controller 11, and controller 11 is obtained the conveying capacity of film 30 according to the transfer rate of film 30.The control signal that the regulation Working position data that the transfer rate of film 30, conveying capacity and utilization delimited on film 30 generate, slave controller 11 sends to current scanning instrument 7.Current scanning instrument 7 is accepted the control signal scanning laser beam, and the Working position illumination beam of the regulation on film 30 is processed.
Needn't necessarily need XY worktable, in addition, process, so can improve process velocity while can transmit film 30.
From laser aid shown in Figure 1, remove the laser processing device of circular cone optical system 4, masking frame 5 and voice coil loudspeaker voice coil mechanism 9 by using, can also focus on processing.Laser beam by object lens 6 with the mode optically focused that focuses on substrate 12.Utilize the action of current scanning instrument 7, laser beam scans on substrate 12, when the light beam incoming position on the substrate 12 changes, object lens 6 move object lens by voice coil loudspeaker voice coil mechanism 10 on the direction parallel with the light beam direct of travel that passes through, so as will be from object lens 6 to substrate the optical path length b of 12 laser beam remain constant.Move by this, laser beam focuses on substrate 12 all the time.Therefore, can realize good processing.
In the present embodiment, though used pulse laser,, also can use the laser beam of continuous wave according to the processing difference.In addition,, use the Nd:YAG laser oscillator that comprises the wavelength conversion assembly, penetrated three times of high frequency waves of Nd:YAG laser instrument, but can use the first-harmonic～five times high frequency waves of solid state laser as lasing light emitter.And, can also use CO 2Laser instrument etc.
In addition, in the present embodiment, used scanner, but also can use the high-velocity scanning optical system of having utilized polygonal mirror as the high-velocity scanning optical system.Owing to not by moving the incoming position that the processing object thing changes laser beam with XY worktable, but change the incoming position of laser beam, so can improve process velocity with high-velocity scanning optical system scans light beam.
And in above-mentioned focus processing method, laser beam focuses on substrate surface all the time.Then, illustrate according to laser beam the incoming position of substrate surface is regulated position relation between the focus of laser beam and the substrate surface, carried out good method for processing.
The laser processing device of second embodiment shown in Figure 12 A, be from laser processing device shown in Figure 1, to have removed circular cone optical system 4, masking frame 5 and voice coil loudspeaker voice coil mechanism 9, also remove variable attenuator 2, and between beam expander 3 and object lens 6, disposed the peristome 5a that has circular through hole and regulate beam diameter.The through hole of peristome 5a not necessarily will be imaged on the surface of substrate 12.
Utilize voice coil loudspeaker voice coil mechanism 10, parallel the mobile object lens 6 in ground with laser beam direct of travel by object lens 6, the focus that makes laser beam near or away from the surface of substrate 12, like this, can regulate the pulse energy density that is radiated at the laser beam on the substrate surface.
According to the control signal that slave controller 11 sends, current scanning instrument 7 shone laser beam to the direct of travel of expecting in the moment of expectation.Make voice coil loudspeaker voice coil mechanism 10 and current scanning instrument 7 synchronization actions by the control signal of utilizing slave controller 11 to send, can according to the incoming position of laser beam, with the pulse energy density of expectation to substrate 12 irradiating lasers.
An example of the laser processing of the laser processing device that has utilized Figure 12 A is described with reference to Figure 13.Briefly show the light path of the pulse laser that behind object lens 6, current scanning instrument 7, on substrate 12, scans at the upside of Figure 13.
Laser beam L1b is perpendicular to substrate surface and with incoming position M1 incident.Laser beam L1a, L1c respectively at incoming position N1a, N1c with incidence angle α 1 incident.It is the mid point of the line segment at two ends that incoming position M1 is positioned at incoming position N1a, N1c.
The downside of Figure 13 illustrates the substrate surface of looking under current scanning instrument 7 one side direction. Luminous point 91a, 91b, 91c represent the luminous point of laser beam L1a, L1b, L1c (being incoming position N1a, M1, N1c place) on substrate surface respectively.
Change the direct of travel of laser beam to the optical path direction of laser beam L1c from the light path of laser beam L1a, the irradiation of repetition pulse laser beam on one side, form continuous hole at each laser irradiating position in the same manner with structure shown in Figure 10 A, the 10B, thereby on substrate surface, form groove 101.
At first, when irradiation forms the laser beam L1a of groove 101 starting points, set the position of object lens 6, laser beam L1a is focused at incoming position N1a.And, the point of the size minimum of luminous point is called the focus of laser beam.
Then, when shining the laser beam L1c of the terminal point that forms groove 101, set the position of object lens 6, laser beam L1c is focused at incoming position N1c.Therefore optical path length from object lens 6 to incoming position N1a, N1c, can think that the position of object lens 6 is identical when groove when beginning processing and end about equally.And, can think that the incidence angle of laser beam L1a and L1c equates, the area of luminous point 91a and 91c equates.
At this, illustrate that at first still being fixed under the situation of this position scanning laser beam at object lens 6 forms groove and can produce which type of problem.
Object lens 6 are being fixed on when making laser beam L1a focus on the position of (laser beam L1c is focused at incoming position N1c) at incoming position N1a, having changed the imaginary plane that the focal track of the laser beam of direct of travel describes by current scanning instrument 7 is caustic surface 81a.Some R on the caustic surface 81a represents the focal position of laser beam L1b.
Incoming position on the groove 101 beyond incoming position N1a, the N1c, laser beam is the incident substrate in the way of assembling to focus.Distance from the incoming position to the focus is long more, and then the beam diameter at incoming position place is bigger more than the beam diameter at focus place.The distance of incoming position and focus is maximum for the laser beam L1b to the groove central illumination.
The pulse energy density of laser beam is normally high near than periphery at the center of beam cross section.When beam diameter became big, the pulse energy density of each position in the beam cross section reduced.Therefore, big even beam diameter becomes, but the above pulse energy density zone of the threshold value of substrate processing also only limits near the center of beam cross section.
Near incoming position N1a, N1c as groove 101 ends, though beam diameter is little,, becoming the laser beam of processing more than the threshold value near the pulse energy density periphery of beam cross section, the pulse energy density irradiation with high forms the bigger groove of width.On the other hand, in groove central authorities, be near the incoming position M1, beam diameter is bigger, and still, only the narrow zone pulse energy density at the beam cross section center becomes the laser beam more than the processing threshold value, and the pulse energy density irradiation with low forms the thinner groove of width.Like this, the width of groove changes with the place.
And incidence angle α 1 is big more, and the distance of the some R on from the incoming position M1 of laser beam L1b to caustic surface 81a is big more.Therefore, incidence angle α 1 is big more, and the lasing beam diameter that shines incoming position N1a, N1c is big more with the difference of the lasing beam diameter that shines incoming position M1.That is, the end of groove and the stand out between the central authorities are obvious.Incidence angle α 1 is the laser beam incident angle that forms the groove end, and therefore, under the situation, incidence angle α 1 becomes greatly in the time of for example will forming elongated slot on large substrate etc.
Then, the position adjustments focal position of the mobile object lens 6 in one side, the method that one side scanning laser beam forms groove are described.When regulating the focal position of laser beam, the beam diameter that shines the laser beam on the substrate is conditioned, and the pulse energy density on the substrate surface is conditioned.
The focus of considering the laser beam L1b that will incide incoming position to where for well.By with focusing in position than the more close incoming position M1 of some R on the caustic surface 81a, can reduce beam diameter, can be modified to the pulse energy density that increases incoming position M1.Wherein, if focus approaches to incoming position M1, the pulse energy density at incoming position M1 place is bigger than the pulse energy density at incoming position N1a, N1c place.
Because laser beam L1b is perpendicular to substrate surface incident, the laser beam when incoming position M1 focuses on is circular.On the other hand, laser beam L1a, L1c favour substrate surface incident with incidence angle α 1, and therefore, luminous point 91a, 91c diffuse into elliptical shape.That is, establish the pulse energy density height of the pulse energy density of the luminous point 91b of laser beam L1b when incoming position M1 focuses on than luminous point 91a, 91c place.
Therefore, in position, the area of luminous point 91b is equated with the luminous point 91a of incoming position N1a, the area of 91c the focus of laser beam L1b than incoming position M1 dark slightly (inside away from) from incoming position M1 towards substrate.If so, can process with the pulse energy density irradiating laser that equates with incoming position N1a or N1c and M1.
It is constant that other incoming position on groove 101 also keeps spot areas, and the adjustment pulse energy density is processed and got final product.Focal track with condition when scanning of not changing spot areas on groove 101 is caustic surface 81b.The focal position of laser beam L1b is the some Q on the caustic surface 81b.
Illustrate and make focus go up position how to regulate object lens 6 when mobile along caustic surface 81b.At first, when illuminating laser beam L1a, object lens 6 are set at and make focus gather position on incoming position N1a.This position is called as the reference position.
During from incoming position N1a towards the M1 scanning laser beam, from the reference position slowly to the mobile object lens 6 of lasing light emitter one side, thereby focus is moved along the caustic surface 81b than the more close substrate surface of caustic surface 81a, and it is big that the area of luminous point becomes, but the reduction of suppressor pulse energy density.The displacement of counting from the object lens reference position is zero for the laser beam L1a that incides incoming position N1a, along with laser increases towards incoming position M1, is maximum for the laser beam L1b that incides incoming position M1.
Then, when the N1c scanning laser beam, object lens 6 are slowly got final product from incoming position M1 near the reference position.The displacement of the object lens of counting from the reference position along with laser reduces towards incoming position N1c, is zero for the laser beam that incides incoming position N1c.
So, while make the focus of the laser beam of each incoming position of irradiation go up mobile, scan laser, can suppress to form groove 101 by the wide variety that the place causes along caustic surface 81b by the position of adjusting object lens 6.
Sum up the method for mobile object lens.If continue to scan at not mobile object lens position, then under the situation that the pulse energy density of substrate surface reduces, mobile object lens make the focus of laser beam near incoming position, thus the reduction of suppressor pulse energy density.If continue to scan at not mobile object lens position, then under the situation that the pulse energy density of substrate surface rises, on the contrary, mobile object lens make the focal position of laser beam away from incoming position, thereby the rising of suppressor pulse energy density gets final product.
As a processing example, illustrated incoming position at the groove two ends with focus to the method on substrate surface, still, also can be in other incoming position focusing.As long as the luminous point of each incoming position is remained the constant area, just can adjust pulse energy density and process, therefore, can guarantee the processing characteristics of fixing for any incoming position.
Each incoming position also can not strict maintenance illuminating laser beam pulse energy density, as long as the change of the pulse energy density of inhibition incoming position when incoming position changes just can be processed well.
With groove processing (line processing) is that example is illustrated, but also can carry out perforate processing etc.Although understand the example of sweep current scanner on the one dimension direction, but also can on two-dimensional directional, scan, on the whole base plate surface, process.Though be illustrated with the example that is processed as of utilizing pulse laser beam, laser beam also can be a continuous wave.Under the situation with continuous-wave laser beam processing, can suppress power density on the machined surface with the variation of incoming position.
Also can regulate the pulse energy density that is radiated at the laser beam on the substrate, the adjusting that replaces mobile object lens 6 to carry out with variable attenuator.
The laser processing device that the variation of the 2nd embodiment shown in Figure 12 B relates to is to have appended variable attenuator 2 in the laser processing device shown in Figure 12 A.The control signal that variable attenuator 2 sends according to slave controller 11, with the action of current scanning instrument 7 synchronously, decaying with the attenuation rate of expectation is radiated at the power of the pulse laser beam on the substrate 12.
An example of the laser processing that has utilized variable attenuator is described with reference to Figure 14.The light path of the pulse laser beam that behind object lens 6 and current scanning instrument 7, on substrate 12, scans in the laser processing device shown in Figure 14 summary presentation graphs 12B.
Laser beam L2b incides incoming position M2 perpendicular to substrate surface.Laser beam L2a, L2c respectively at incoming position N2a, N2c with incidence angle α 2 incidents.It is the mid point of the line segment at two ends that incoming position M2 is positioned at incoming position N2a, N2c.
Object lens 6 are fixed on and make the position of laser beam L2b in incoming position M2 focusing.Having changed the imaginary plane that the focal track of the laser beam of direct of travel describes by current scanning instrument 7 is caustic surface 82.
Identical with the explanation that reference Figure 13 carries out, from the light path of laser beam L2a to the optical path direction of laser beam L2c change the direct of travel of laser beam on one side, the irradiation of repetition pulse laser beam on one side forms groove at substrate surface.
Along with the incoming position of laser beam leaves incoming position M2, it is elongated to focus on the distance that incides substrate from laser beam.By the laser beam after the focus is the diverging light wire harness, and therefore, the distance from the focus to the incoming position is long more, and the luminous point of substrate surface is big more.
In addition, along with the incoming position of laser beam leaves incoming position M2, laser beam becomes big to the incidence angle of substrate.Shine under the situation of the laser beam with same light beam diameter, incidence angle is big more, and the luminous point of substrate surface is big more.
As reference Figure 13 explanation, the pulse energy density in the big luminous point reduces on the overall optical area of beam, is only becoming more than machinable threshold value near the center of beam cross section.Therefore, utilize the well width of the irradiation formation of big luminous point to attenuate.
If all use constant pulse energy irradiating laser to form groove to any incoming position, then near the width that forms the central authorities of groove is bigger, and the width that forms in the end of groove is thinner.
Therefore, according to incoming position, utilize variable attenuator 2 to regulate power, so that at any incoming position, the pulse energy density on the substrate surface is constant.The attenuation of power, minimum when the working groove end, along with to groove center near and increase, when irradiation groove center maximum when being incoming position M2.Like this, can suppress to form groove with the different width that change in place.
And, for the homogenising of the pulse energy density of seeking to shine the laser beam on the substrate, also can adopt and utilize voice coil loudspeaker voice coil mechanism 10 to move object lens 6 to come the moving focal point position and utilize variable attenuator 2 to move the combination that object lens 6 come the moving focal point position.
And laser beam also can be a continuous wave.Under the situation with continuous-wave laser beam processing, regulate the power of continuous-wave laser beam, so that suppress to make power density on the machined surface with the variation of incoming position with variable attenuator.
Moreover, for example being formed with from the teeth outwards in the processing of glass basis material of ITO film, substrate size has the trend of maximization.If substrate become to maximize, the area to be machined becomes big, illustrating then as with reference to Figure 13, move in the processing that object lens 6 carry out at incoming position according to laser beam, the amount of movement of object lens 6 can become big sometimes.Be easy to the angle consideration from controlling, preferably the amount of movement of object lens 6 is less.
Below, be suppressed at object lens 6 mobile under more short-range situation, can strengthening the laser processing of the 3rd embodiment of the displacement of laser beam foucing position with reference to Figure 15 explanation.
In the laser processing device shown in Figure 15 A, between the object lens 6 of the laser processing device shown in Figure 12 A and current scanning instrument 7, appended secondary condenser lens 71.In the explanation of Figure 15 A, object lens 6 are called primary condenser lens 6.
Laser beam incident primary condenser lens 6 from peristome 5a ejaculation.Primary condenser lens 6 with laser beam condensation on imaginary elementary caustic surface 83.The laser beam that has passed through elementary caustic surface 83 becomes the diverging light wire harness, incident secondary condenser lens 71.The laser beam of being assembled by secondary condenser lens 71 is changed direct of travel, incident substrate 12 by the current scanning instrument.
The amount of movement of primary condenser lens 6 then, is described.When making elementary caustic surface 83 near secondary condenser lens 71, the direction of advancing towards laser beam in the focal position of the laser beam of being assembled by secondary condenser lens 71 moves.If the displacement of elementary caustic surface 83 is the focus displacement of d1, laser beam is d2.In addition, be made as NA1, be made as NA2 for the numerical aperture of the secondary condenser lens 71 of the convergent beam that has passed through secondary condenser lens 71 for the numerical aperture of the secondary condenser lens 71 of the laser beam of incident secondary condenser lens 71.If the equipment rate is P=NA1/NA2, then following formula is set up:
d2＝d1×P 2
From following formula as can be known, if strengthen multiplying power,, also can increase the displacement d2 of focus even then shorten the displacement d1 of elementary caustic surface 83.For example, multiplying power P is under 2 the situation, by making elementary caustic surface 83 near secondary caustic surface 2mm, can make the focus of laser beam move 8mm to the direct of travel of laser beam.
The mobile of elementary caustic surface 83 is to be undertaken by primary condenser lens 6 is moved to optical axis direction.When the laser beam of incident primary condenser lens 6 was the directional light wire harness, the displacement of the displacement of primary condenser lens 6 and elementary caustic surface 83 equated.If the distance of mobile primary condenser lens 6 then can be utilized the direct driving mechanism that has used drive mechanism for below about 2mm.Used the direct driving mechanism of drive mechanism to replace voice coil loudspeaker voice coil mechanism 10 by utilization, can high speed and mobile accurately primary condenser lens 6.
Figure 16 represents a structure example of secondary condenser lens 71.Secondary condenser lens 71 is made of a plurality of lens.Object point So and picture point Si have conjugate relation.This object point So is equivalent to the light spot position on the elementary caustic surface 83 shown in Figure 15 A.This imaging optical system is thought of as the infinity conjugate optical system.Secondary condenser lens 71 is divided into front side set of lenses 71a and rear side lens group 71b.The light shafts that penetrate from object point So become the directional light wire harness by front side set of lenses 71a.This directional light wire harness focuses at picture point Si by rear side lens group 71b.And secondary condenser lens 71 can not be carried out physical segmentation sometimes, but can think imaginary cutting apart here.
If the front focal length of front side set of lenses 71a is that the back focal length of Ff, rear side lens group 71b is Fr.At this moment, the multiplying power by above-mentioned formula definition can be expressed as:
P＝Fr/Ff
In the laser processing device shown in Figure 15 A, primary condenser lens 6 is made of convex lens, but also can be made of concavees lens 6a shown in Figure 15 B.At this moment, elementary caustic surface 83a becomes the virtual image, is occurring than more close lasing light emitter one side of concavees lens 6a.
So,, be suppressed under the short situation, can change the focal position of the laser beam of irradiated substrate significantly in the displacement that remains unchanged primary condenser lens 6 by strengthening multiplying power P.In order to reach beneficial effect, better be that multiplying power P more than 2, is more preferably more than 4.
Luminous point 91a, 91c shown in Figure 13 is the luminous point of the laser beam of oblique incidence substrate, therefore is oval.On the other hand, luminous point 91b is the luminous point of the laser beam of vertical incidence substrate, therefore is circular.So, according to the incoming position of laser beam, the incidence angle difference causes the light spot form difference on the substrate.
If luminous point is oval, the opening in the hole that then processes is for oval, if circular, the opening in the hole that processes is for circular.But, also have opening to have identical shaped situation to any incoming position, hole.
Then, can be with reference to Figure 17 explanation according to the laser processing device of the 4th embodiment of incoming position correction light spot form.
Laser processing device shown in Figure 17 is, appended to make peristome 5a around with the peristome leaning device 60a of the vertical axle rotation of the optical axis of laser beam with make the peristome rotating mechanism 61a of peristome 5a around the axle rotation parallel with the optical axis of laser beam in the laser processing device shown in Figure 12 A.
And peristome rotating mechanism 61a makes the structure identical mechanism of masking frame rotation with the back with reference to the masking frame rotating mechanism that laser processing device had of Figure 22 explanation, makes peristome 5a around the axle rotation parallel with the optical axis of laser beam.
The control signal that peristome leaning device 60a, peristome rotating mechanism 61a send according to slave controller 11 respectively, with the action of current scanning instrument 7 synchronously change peristome 5a, around with the inclination angle of the vertical axle rotation of the optical axis of laser beam with around the anglec of rotation of the axle rotation parallel with the optical axis of laser beam.
Relatively during laser beam oblique incidence substrate surface perpendicular to the beam cross-section shape of optical axis and the beam cross-section shape on the substrate surface.Beam cross-section shape on the substrate surface is the shape that beam cross-section shape perpendicular to optical axis forms that stretches on the intersection direction of the substrate surface and the plane of incidence.For example, if the laser beam oblique incidence substrate surface of circular cross-section, then the beam cross section on the substrate surface becomes at the long ellipse of the intersection direction of the substrate surface and the plane of incidence.And incidence angle is big more, and the luminous point of substrate surface is in the longer shape of intersection direction.
Therefore, will be shaped as laser beam, and, can make the luminous point of substrate surface become circle with the mode oblique incidence substrate surface of its long axis of ellipse direction perpendicular to the plane of incidence perpendicular to the cross section of optical axis with suitable major axis and ellipse of the ratio of minor axis.
Figure 18 A briefly shows along the rotating shaft direction of peristome leaning device 60a and sees the figure when the peristome 5a of the axle rotation vertical with the optical axis of laser beam by peristome leaning device 60a.Penetrate to the figure right side after from the laser beam 1b of figure left side incident by its cross section of peristome 5a shaping.
Shown in Figure 18 B, use when the sight line of laser beam optical axis is seen circular through hole 62a by the peristome 5a of peristome leaning device 60a rotation, be oval.That is, the cross section of laser beam is shaped as ellipse.
And when the light shaft positive cross of the face of 2 different diameters of the circular through hole that comprises peristome 5a and laser beam, the cross section of laser beam is shaped as circle.Peristome 5a is tilted, and along with the rotary middle spindle of circular through hole and the angle that optical axis became of laser beam become big, the oval minor axis of the beam cross section after the shaping shortens.Like this, peristome leaning device 60a can change the length-width ratio of the beam cross section after the shaping.
Shown in Figure 18 C, also utilize peristome rotating mechanism 61a to make peristome 5a around the axle rotation parallel with the optical axis of laser beam.
The beam cross-section shape that the luminous point of laser beam becomes minimum position (focus that is called laser beam) is oval.The long axis direction of the beam cross section at focus place is corresponding with the short-axis direction of the beam cross section of the through hole position of peristome 5a.
Therefore, make peristome 5a rotation with peristome rotating mechanism 61a, so that the long axis of ellipse direction of the beam cross section of through hole position is consistent with this intersection direction.Like this, the light spot form on the substrate can all keep circular to any incoming position.
Having illustrated to utilize does not need to make the processing of the through hole of peristome at the method for caustic of substrate surface imaging, still, in utilization the picture of through hole is imaged under the situation that the masking frame sciagraphy on the substrate surface processes, and can revise the light spot form on the substrate yet.Under the situation of masking frame sciagraphy, the long axis direction of the through hole picture that forms on substrate surface is corresponding with the long axis direction of the beam cross section of the through hole position of masking frame.
Making masking frame with circular through hole is identical around a structure that tilts with the perpendicular axle of the optical axis of laser beam.But, further make masking frame when the axle parallel with the optical axis of laser beam rotates, the oval-shaped short-axis direction of the beam cross section when making through hole be rotated into ejaculation, consistent with the intersection direction of the plane of incidence and substrate surface.
The situation that being shaped as of through hole is round has been described, still, also can have revised light spot form by the laser beam of the through hole shaping of other shape.
Then, the laser processing device that has used the 5th embodiment near the laser processing method of masking frame to relate to reference to Figure 19 explanation.Laser processing device shown in Figure 19 is to have appended near masking frame 63 in the laser processing device shown in Figure 12 A.
Near masking frame 63 kept near masking frame maintaining body 64 and with the surface of substrate 12 be configured in abreast substrate 12 directly over.On near masking frame 63, be formed with and the identical shaped through hole of shape that will on substrate surface, process.Dg can be by regulating near masking frame maintaining body 64 near the distance between the surface of masking frame 63 and substrate 12 (near at interval).
Beam expander 3 enlarges from the beam diameter of the laser beam of lasing light emitter 1 ejaculation, penetrates parallel laser beam.The laser beam that penetrates from beam expander 3 has angle of flare β.When the beam diameter that makes laser beam by beam expander 3 was for example expanded as 10 times, angle of flare was decreased to 1/10th.Can adjust the angle of flare of laser beam by beam expander 3.
Scan on current scanning instrument 7 on one side, Yi Bian carry out the irradiation of laser beam near masking frame 63.Laser beam incides substrate 12, substrate processing 12 by behind the through hole near masking frame 63.Connect empty with part, laser beam does not pass through, substrate 12 is not processed.So, have near the empty shape of the perforation of masking frame 63 by quoting, but the substrate processing surface.
At this moment, even the incoming position of laser beam changes, the position that can move object lens 6 according to laser beam to the incoming position of substrate on one side suppresses the change of the pulse energy density on the substrate surface, Yi Bian carry out the laser irradiation.And lasing light emitter 1 also can be the device that penetrates continuous-wave laser beam.At this moment, can suppress the change of the power density on the substrate surface.
In order to carry out high accuracy processing, be necessary that the through hole shape that will be had near masking frame 63 correctly is transferred on the substrate.The precision of transfer printing depends near interval dg and the angle of flare that shines near the laser beam of masking frame 63.Shine angle of flare, can think that the angle of flare β of the laser beam with by beam expander 3 time equates near the laser beam of masking frame 63.
Figure 20 illustrates having having simulated transfer printing precision near masking frame and how depending near at interval and laser beam angle of flare and the result that changes of T word shape through hole.Illustrate side by side near at interval and the picture 97 of the T word shape through hole of the angle of flare of laser beam when carrying out multiple change.Among each figure, the laser beam angle of flare that is configured in the right side is little, is configured in the little near the interval of downside.
The edge of picture 97 is clear and definite more, and the precision of transfer printing is high more.As we know from the figure, under the situation of identical angle of flare, near big more then transfer printing precision is poor more at interval.In addition, under the identical situation near the interval, angle of flare is big more, and then the precision of transfer printing is poor more.All more little near interval and angle of flare, then can make transfer printing precision high more.
Figure 21 briefly shows in the time of will guaranteeing a certain transfer printing precision near at interval and the angle of flare of the laser beam relation curve that must satisfy.When guaranteeing a certain transfer printing precision, if near big at interval, then angle of flare must diminish, and is big if angle of flare becomes in addition, then near diminishing at interval.
If in advance various transfer printing precisions are obtained the relation that the angle of flare near interval and laser beam shown in Figure 21 must satisfy, add man-hour with the transfer printing precision of expectation, can select at interval approaching and angle of flare easily.
In the laser processing that utilizes near masking frame, have with near at interval and angle of flare set advantage less, that can process with high transfer printing precision for.In addition, process near the through hole of masking frame, can obtain high positioning accuracy by directly over the processed position of substrate, disposing.Part beyond in processed position by being covered with substrate surface near masking frame, therefore, having adding the man-hour substrate and is difficult to attached to the advantage on the substrate surface by the flying of cutting and producing.
And, the laser beam that will pass through near the through hole of masking frame shines when processing on the substrate, carry out laser beam moving by the direct of travel that changes laser beam with the current scanning instrument to the incoming position of substrate, carry out the situation about moving of incoming position with the mobile XY worktable of having placed substrate and compare, can realize the high speed of processing.
Then, with reference to Figure 22 A the laser processing device that the 6th embodiment of the lasing light emitter with exciting continuous-wave laser beam relates to is described.As the lasing light emitter 1 of exciting continuous-wave laser beam, for example can use exciting to have the semiconductor laser of the laser beam of infrared line segment wavelength.
The laser beam 1b0 that penetrates from lasing light emitter 1 incides distribution optical system 65.Distribution optical system 65 with laser beam 1b0 being distributed to the laser beam 1b1 that advances along certain optical axis, is distributed to laser beam 1b0 the laser beam 1b2 that along other optical axis advance at the other times band sometime.
Distribution optical system 65 for example comprises electrooptic cell 65b, the polarizer 65c of half-wave plate 65a, demonstration Pockels effect (photoelectric effect) and constitutes.Half-wave plate 65a makes the laser beam 1b0 that penetrates from lasing light emitter 1 become rectilinearly polarized light, so that polarizer 65c is become the P ripple.This P ripple incides electrooptic cell 65b.
The opportunity signal sig that electrooptic cell 65b sends according to slave controller 11 makes the polarizing axis rotation of laser beam.When electrooptic cell 65b was in the state that does not apply voltage, electrooptic cell 65b made P wave polarization face half-twist.Thus, the laser beam that penetrates from electrooptic cell 65b becomes the S ripple for polarizer 65c.
Polarizer 65c directly passes through the P ripple, but reflection S ripple.S ripple by polarizer 65c reflection is laser beam 1b1, incides the light beam baffle plate 66 of the terminal that becomes laser beam.The P ripple that sees through polarizer 65c is that laser beam 1b2 incides beam expander 3.
Incide masking frame 5 by the laser beam 1b2 that becomes directional light behind the beam expander 3 expanded light beam diameters with rectangle through hole.At this, the example that utilizes the masking frame sciagraphy to process is described.That is, the surface that the picture of the through hole of masking frame 5 is imaged on substrate 12 processes.
Masking frame rotating mechanism 61 is used to make masking frame 5 around the axle rotation parallel with the optical axis of laser beam.Masking frame rotating mechanism 61 for example comprises goniometer and constitutes, and the control signal according to slave controller 11 is sent makes masking frame only rotate desired angle in the moment of expectation.For masking frame rotating mechanism 61, describe in detail in the back.Voice coil loudspeaker voice coil mechanism 9 moves the position of masking frame 5 and the direct of travel of laser beam abreast.
The laser beam 1b2 that penetrates from masking frame 5 is by object lens 6 optically focused.Voice coil loudspeaker voice coil mechanism 10 moves the position of object lens 6 and the direct of travel of laser beam abreast.The laser beam that penetrates from object lens 6 is by behind the current scanning instrument 7, the surface of incident substrate 12.
With reference to the substrate 12 of Figure 22 B explanation as the processing object thing.On the surface of substrate layer 110, exist transfer printing layer 111.This transfer printing layer 111 has the surperficial bonding character of heating back and substrate layer 110.
For example, heat, make itself and substrate layer 1110 bonding by a part of 111a with laser irradiation transfer printing layer 111.After removing the part 111b that does not heat in the transfer printing layer 111, only remaining heated part 111a on the surface of substrate layer 110.This is similar to the situation that the China ink that is heated part that for example carries out heat transfer type China ink band when printing is transferred on the paper.
Returning Figure 22 A goes on to say.XY worktable 8a is used as the maintenance platform of substrate 12.XY worktable 8a can make substrate 12 move in the two-dimensional surface that the surface with substrate 12 parallels.By controller 11 control XY worktable 8a, make substrate 12 move to desired locations in the moment of expectation.
Here in the example of Shuo Ming laser processing, the X of current scanning instrument 7 is fixed on the position that makes from the laser beam vertical incidence substrate 12 of current scanning instrument 7 ejaculations with scanner 7a and Y with scanner 7b.By using XY scanner 8a moving substrate 12, removable laser beam is to the incoming position of substrate 12.
Utilize voice coil loudspeaker voice coil mechanism 9,10 to set from masking frame 5 to object lens 6 optical path length and from object lens 6 to substrate the optical path length of 12 laser beam incident position so that the picture of the through hole of masking frame 5 is imaged on the surface of substrate 12 with the imaging multiplying power (minification) of expectation.
The control method of distributing optical system is described with reference to Figure 23.Figure 23 illustrates an example of the sequential chart of opportunity signal sig, laser beam 1b0,1b1,1b2.At moment t0, the ejaculation of beginning laser beam 1b0.
To moment t1, slave controller is not sent opportunity signal sig from moment t0.In the meantime, do not apply voltage on the electrooptic cell, from distributing optical system outgoing laser beam 1b2 all the time.Outgoing laser beam 1b1 not.Laser beam 1b2 during this is a continuous wave.
From moment t1 to t2 constantly, synchronous with the opportunity signal sig that controller cycle ground sends, on the electrooptic cell of distribution optical system, apply voltage.
During sending opportunity signal sig, electrooptic cell is in voltage and applies state, and laser beam 1b0 is assigned to laser beam 1b1.On the other hand, during not sending opportunity signal sig, electrooptic cell is in voltage and does not apply state, and laser beam 1b0 is assigned to laser beam 1b2.Laser beam 1b2 during from moment t1 to moment t2 becomes the laser beam that periodically repeats exciting and stop.
Among the laser beam 1b2 that this penetrates off and on, pulse width w1 and cycle w2 can be set at random length by regulating opportunity signal sig.For example pulse width w1 is made as 10 μ s～tens of μ s, cycle w2 and is made as 100 μ s.
Like this, when distributing optical system not import the opportunity signal, can obtain the laser beam 1b2 that penetrates continuously; When distributing optical system to import the opportunity signal off and on, can obtain the pulse laser beam 1b2 that intermittently penetrates.
And the continuous laser beam 1b2 that penetrates is irradiated substrate serially, therefore, for example is applicable to the processing (staying the processing of wire transfer printing layer on substrate layer) that forms wire.On the other hand, the laser beam 1b2 that penetrates intermittence is irradiated substrate off and on, therefore, for example is applicable to the processing (staying the processing of the transfer printing layer of point-like on substrate layer) that forms point-like.
With reference to Figure 24 linear method for processing is described.Begin laser irradiation, begin processing substrate 12.During the processing beginning, at first, the zone on the whole width of an end of line 103 is by 93 irradiations of rectangular laser bundle.Thereafter, Yi Bian irradiating laser continuously Yi Bian XY worktable is moved to a direction, makes luminous point move towards the other end of line 103.The moving direction of XY worktable is parallel with certain one side of rectangle luminous point 93.The moving direction of the luminous point on the substrate is shown with arrow.
When the other end of luminous point receiving track 103, stop laser irradiation to substrate, finish processing.Like this, by wire zone with laser irradiation heated substrates surface, form on the surface of substrate layer wire ground residual the line 103 of transfer printing layer.
The profile of the line 103 that forms is following rectangles: the limit of length direction is parallel with certain one side of luminous point 93, and the limit of width is parallel with certain the perpendicular on one side limit with luminous point 93.The width of line 103 and equal in length with certain vertical on one side limit of luminous point 93.
With reference to Figure 24 B explanation point processing method.In a processing,, on one side XY worktable is moved to a direction on one side to substrate 12 illuminating laser beam off and on.The moving direction of XY worktable is parallel with certain one side (being called limit p) of rectangle luminous point 94a.
At first, when beginning the laser irradiation of first pulse, the zone on the whole width of the end of some 104a is shone by the luminous point 94a of rectangle.Because XY worktable moves, therefore, up to the laser irradiation end of this first pulse, luminous point moves on substrate.The moving direction of luminous point is shown with arrow.
Like this, the dotted region of substrate surface is heated by laser irradiation, form on the surface of substrate layer point-like ground residual the some 104a of transfer printing layer.
Similarly later on, by second, third, the irradiation of the laser of the 4th, the 5th pulse, form some 104b, a 104c, 104d, 104e respectively.And, at second, third, the irradiation of the 4th, the 5th pulse begins the zone of the substrate surface that time point 94b, 94c, 94d, 94e shine respectively, with the zone of the substrate surface that luminous point 94a is shone, with the moving direction of XY worktable move with paralleling regional consistent.Each point is arranged on the straight line parallel with the moving direction of XY worktable.
The profile of each point be have the limit parallel with the limit p of luminous point 94a and with rectangle with parallel limit, the perpendicular limit of the limit p of luminous point 94a (being called limit q).
The length on each point, vertical with the moving direction of XY worktable limit, with the equal in length of limit q, when for example the length of limit q was 20 μ m, this length was 20 μ m.
The length on each point, parallel with the moving direction of XY worktable limit depends on the length of limit p of length, XY worktable of the limit p of luminous point and the irradiation time (pulse width) of pulse.
For example, the length of establishing the limit p of luminous point is that the translational speed of 12 μ m, XY worktable is that 800mm/s, pulse width are 10 μ s.During pulse width 10 μ s, the distance that XY worktable moves (being the distance that substrate moves) is 8 μ m, and therefore, the length on point, parallel with the moving direction of XY worktable limit is the 20 μ m that the length 12 μ m of the limit p of luminous point add displacement 8 μ m.
Spacing d between the abutment points, the distance that moves with XY worktable during the one-period of pulse is consistent.For example, the cycle of pulse is the translational speed of 375 μ s, XY worktable when being 800mm/s, and spacing d is 300 μ m.
Sum up above content, when the size with luminous point is set at limit p length is that 12 μ m, limit q length are 20 μ m, with pulse width 10 μ s, cycles 375 μ s exciting laser, and make under the situation that XY worktable moves with the speed of 800mm/s, the spacing of available 300 μ m forms the point at 20 μ m angles.
Sometimes on substrate, process a plurality of lines with different respectively directions.But,, can produce problem according to the direction line width variation of line if under the situation of the direction of the luminous point on the fixing base, form the line of different directions.
One example of this situation is described with reference to Figure 29.Utilization at first forms line 109a with reference to the method for Figure 24 A explanation.Then, do not change the direction of luminous point, form line 109b with direction different with line 109a.During laser irradiation beginning, luminous point 99 shines the end of line 109b.On one side the length direction of online 109b moves XY worktable, on one side luminous point is moved to the other end of line 109b, form line 109b.
As shown in the figure, the equal in length on the long limit of the width of line 109a and luminous point 99, still, the width of line 109b is not necessarily grown the equal in length on limit with this.In addition, the limit of the end of line 109b can not be vertical with the length direction of line.By using the masking frame rotating mechanism 61 shown in Figure 22 A, can avoid such problem.
Figure 25 is the skeleton diagram that the masking frame rotating mechanism 61 of the masking frame 5 that has kept having rectangle through hole 62 is shown.2 cornerwise the optical axis with respect to laser beam that comprises rectangle through hole 62 is vertical.Masking frame rotating mechanism 61 makes masking frame 5 be pivot, rotate around the axle parallel with the optical axis of laser beam with the diagonal intersection point of the rectangle of through hole 62.
Corresponding with the rotation of masking frame 5, the picture rotation of through hole 62 in the surface of substrate 12.The limit of the rectangle picture of the through hole 62 on the substrate can be parallel with any direction in the substrate surface.
As described below, for the direction of the line that changes processing etc., before the moving direction that changes the laser beam incident position on the substrate, can utilize masking frame rotating mechanism 61 to rotate masking frame 5.
The line processing method of having used the masking frame rotating mechanism is described with reference to Figure 26.Utilization forms line 103a with reference to the method for Figure 24 A explanation.The equal in length of the length on the long limit of luminous point 93a and line 103a, the short side direction of luminous point 93a is parallel with the length direction of line 103a.
Before beginning to process the line 103b that has with line 103a different directions,, make the minor face of luminous point 93b parallel with the length direction of line 103b by masking frame rotating mechanism rotation masking frame.Then, by the XY worktable moving substrate, so that shine luminous point on the whole width of the end of online 103b.
The irradiation of beginning laser beam utilizes and the identical operation of operation with reference to Figure 24 A explanation, on one side the length direction of online 103b move XY worktable, one side forms line 103b.The equal in length on the long limit of the width of line 103b and luminous point 93b.In addition, the limit of the limit of the width of line 103b and length direction is perpendicular.
Like this, can form a plurality of lines by same widths with different respectively directions.And,, also can use the masking frame rotating mechanism in order to form a plurality of points with different directions with not changing size, shape.
Illustrated utilize periodic opportunity signal controlling distribute optical system, with the example of laser beam pulsesization, but the opportunity signal also can not be periodic.For example, in the time of forming at a plurality of with unequal spacing, can use acyclic opportunity signal.In addition, the pulse width of laser beam also can be non-constant.Suitable setting of size according to the point that forms gets final product.
By changing the shape and the size of the luminous point on the substrate, the size of the width of adjustable nodel line and point etc.By the exchange of masking frame, can change the shape and the size of luminous point.In addition, by changing over picture multiplying power (minification), can change the size of luminous point.
On substrate surface wire or point-like have been described having stayed the example of the processing of transfer printing layer, still, also can be to utilize laser irradiated substrate surface to be dug into the processing of wire or point-like.
The shape of the perforation sky of masking frame is not limited to rectangle, suitably selects to get final product according to the shape of point that will form or line.
The example of the incoming position that utilizes the laser beam on the XY worktable moving substrate has been described, still, can also have come mobile incoming position by change the direct of travel of laser beam with the current scanning instrument.
Then, with reference to Figure 27 A explanation have 2 lasing light emitters, wherein 1 lasing light emitter penetrates pulse laser beam and the laser processing device that relates to of 1 lasing light emitter the 7th embodiment of penetrating continuous-wave laser beam in addition.
Lasing light emitter 1a for example is the Nd:YAG laser oscillator that comprises the wavelength conversion assembly, penetrates the pulse laser beam of the 4th high frequency waves (wavelength is 266nm) of Nd:YAG laser instrument.Pulse width for example is 10ns.The pulse laser beam that lasing light emitter 1a penetrates incides half-wave plate 69a, becomes polarizer 67 is the linear polarization of P ripple.
Lasing light emitter 1b for example is a semiconductor laser oscillator, and penetrating wavelength is the continuous-wave laser beam of 808nm.The continuous-wave laser beam that lasing light emitter 1b penetrates incides half-wave plate 69b, becomes polarizer 67 is the linear polarization of S ripple.
The pulse laser beam that penetrates from half-wave plate 69a, the beam expander 3a by becoming directional light behind the expanded light beam diameter and have the masking frame 5 of the through hole of rectangle for example after, with the face of the face side of 45 ° of incident polarization sheets 67 of incidence angle.
Continuous-wave laser beam from half-wave plate 69b penetrates behind the beam expander 3b that becomes directional light behind the expanded light beam diameter, is returned speculum 68 reflections, with the face of the inboard of 45 ° of incident polarization sheets 67 of incidence angle.
Polarizer 67 makes the pulse laser beam as the P ripple see through, also reflect the continuous-wave laser beam as the S ripple.By polarizer 67, overlapping on identical optical axis with the continuous-wave laser beam that penetrates from lasing light emitter 1b from the pulse laser beam that lasing light emitter 1a penetrates.
See through the pulse laser beam of polarizer 67 and be polarized the continuous-wave laser beam that sheet 67 reflects,, incide substrate 12 by passing through current scanning instrument 7 behind object lens 6 optically focused.
The XY worktable 8a that uses as the maintenance platform of substrate 12 can make substrate 12 with the surperficial parallel two-dimensional surface of substrate 12 in mobile.By controller 11 control XY worktable 8a, substrate 12 is moved to desired locations in the moment of expectation.
In the example of the laser processing of this explanation, the X of current scanning instrument 7 is fixed on the position that makes the laser beam vertical incidence substrate 12 that penetrates from current scanning instrument 7 with scanner 7a and Y with scanner 7b.By using XY worktable 8a moving substrate 12, removable laser beam is to the incoming position of substrate 12.
Voice coil loudspeaker voice coil mechanism 9,10 is respectively with the position of masking frame 5 and object lens 6, move abreast with the direct of travel of the pulse laser beam that penetrates from lasing light emitter 1a.By regulating the position of masking frame 5 and object lens 6, the picture of the through hole of masking frame 5 is imaged on the surface of substrate 12 with the imaging multiplying power of expecting (minification).
With reference to the substrate 12 of Figure 27 B explanation as processing object.On the surface of substrate layer 120, be formed with top layer 121.Substrate layer 120 for example is the colour filter of liquid crystal indicator, is that thickness is resin bed 1 μ m, that be made of polyimide based resin or propylene resin etc.Top layer 121 for example is that thickness is the IT0 film of 0.5 μ m.
Only remove under the situation on top layer 121 by the laser irradiation, substrate layer 120 is easier to be more processed than top layer 121, therefore, is difficult to only process top layer 121.For example, when substrate had shone laser, when top layer 121 was directly not processed, because of the influence of the heat that is transmitted to substrate layer 120, substrate layer 120 can disperse by explosion types, and top layer 121 is understood be blown and flown simultaneously.
The present inventor has found following situation: substrate is applied irradiating laser after the preheating, can easily only process top layer 121 thus.In the laser processing device shown in Figure 27 A, utilize the pre-hot substrate 12 of continuous-wave laser beam that penetrates from lasing light emitter 1b, utilize the pulse laser beam that penetrates from lasing light emitter 1a to carry out the processing of sky etc. then.
Then, with continuous wave laser the processed point on the substrate is applied preheating with reference to Figure 28 A～28C explanation after, irradiated with pulse laser forms an example of the method in hole.
Shown in Figure 28 A, on the surface of the substrate 12 that shines continuous-wave laser beam (representing with circular luminous point 95), delimiting has 105a, 105b, 105c at processed.Being centered close on the straight line that links processed some 105a～105c of luminous point 95.With this mobile XY worktable in straight line parallel ground, with processed some 105a～105C to luminous point 95 1 side shiftings.
Shown in Figure 28 B, when processed some 105a arrives the edge of luminous point 95, to processed some 105a irradiation continuous wave laser, the supply of beginning preheating.
Shown in Figure 28 C, when processed some 105a arrives the center of luminous point 95, carry out the irradiation of 1 time pulse laser at the center of luminous point 95.Luminous point with luminous point 96 indicating impulse laser.
Processed some 105a the edge from luminous point 95 move to the center during be preheated.By to processed some 105a irradiated with pulse laser bundle through preheating, suppressed the processed situation of substrate layer, formed the hole on the top layer of substrate.
Continue moving substrate 12, similarly on 105b, 105c, also form the hole at processed with processed some 105a.
The illuminate condition that is used for the continuous-wave laser beam of preheating is, for example luminous point is the toroidal of diameter 20mm, and the power density of substrate surface is 0.1W/cm 2The illuminate condition of the pulse laser beam that is used to process is, for example luminous point is the square with 20 μ m angles, and the pulse energy density of substrate surface is 0.1～0.4J/cm 2
And, the time of the processed point of preheating, with processed point move spot radius length with continuous wave laser suitable apart from the time time about equally.The radius of for example establishing luminous point is that the translational speed of 10mm, XY worktable is 800mm/s, and then this time is 0.13 second.By optical spot centre irradiated with pulse laser,, can easily adjust preheating time and process even press the moving direction that variety of way changes XY worktable to continuous-wave laser beam.
The preheating of giving substrate surface by the irradiation of continuous wave laser is delivered to substrate layer always, and therefore, the preheating of giving is crossed at most can the process substrate layer.Therefore, when supplying with preheating, the temperature of substrate layer is remained on can not be below the temperature of process substrate layer.For example, the temperature of substrate layer is remained on below the fusing point of substrate layer material.
The ITO film is transparent to visible light, but is not zero to the near infrared absorption coefficient of for example wavelength 808nm.Therefore, the light of this wavelength can be used for the preheating of ITO film.If use the light of the bigger wavelength of the absorption coefficient of ITO (near for example wavelength the 1064nm), then can expect the raising of the pre-thermal efficiency.
The example that pulse laser beam and continuous-wave laser beam is overlapped irradiated substrate on the identical optical axis has been described, still, also can have made two light beams not on identical optical axis.If comprise in the luminous point inside of continuous-wave laser beam the impulse wave laser beam luminous point, and use the two laser irradiated substrate, after then processed point arrives the edge of luminous point of continuous-wave laser beam, during the light spot position that arrives pulse laser, can supply with preheating to processed point.
But, in order to supply with preheating, need make processed point by behind the luminous point inside of continuous-wave laser beam, arrive the irradiation position of pulse laser beam.Processed some position when therefore, the irradiation position that need make pulse laser beam contacts with the periphery of processed luminous point with continuous-wave laser beam is inconsistent.
Illustrated to form the example in hole, but also can form a plurality of holes continuously, formed groove thus.
The example of the laser beam incident position that utilizes on the XY worktable moving substrate has been described, still, also can have changed the direct of travel of laser beam, come mobile incoming position with the current scanning instrument.
More than, according to embodiment the present invention has been described, but the present invention is not limited thereto.For example, those skilled in the art understand that certainly the present invention can carry out various changes, improvement, combination etc.

Claims (1)

1. a laser processing is characterized in that, comprises following operation:
Adjustment is from the operation of the laser beam angle of flare of lasing light emitter ejaculation;
Change the direct of travel that is adjusted to laser beam on one side with afore mentioned rules angle of flare, on one side this laser beam is shone be configured in only leave the position of predetermined distance abreast from this surface with the surface of processing object thing and have through hole near on the masking frame, make the laser beam incident that passed through this through hole surface to this processing object thing, with the shape transferred thereon of this through hole to the lip-deep operation of this processing object thing;
According to the shape transferred thereon of this through hole to the angle of flare of the lip-deep precision of this processing object thing, laser beam, the above-mentioned relation of obtaining in advance near the distance dependent ground between masking frame and the above-mentioned processing object thing surface, set at least one the operation in afore mentioned rules angle of flare and the afore mentioned rules distance.
CNB2007101011215A 2002-08-30 2003-08-29 Laser processing and processing unit (plant) Expired - Fee Related CN100553854C (en)

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