JP6021493B2 - Laser processing system and laser processing method - Google Patents

Description

  The present invention relates to a laser processing system and a laser processing method for scanning a workpiece by superimposing a first laser beam and a second laser beam having different wavelengths.

  Conventionally, a laser processing system that scans a workpiece by superimposing a first laser beam having a wavelength in the infrared region and a second laser beam having a wavelength in the ultraviolet region is widely known.

  For example, Patent Document 1 uses an f-θ lens in which a first laser beam and a second laser beam are superimposed by a dichroic mirror and scanned by a galvano scanner, and then wavelength correction (achromatic processing) is performed. The technical idea of focusing on the workpiece is disclosed.

  Further, for example, in Patent Document 2, the first laser beam scanned by the first galvano scanner is transmitted through the f-θ lens and the dichroic mirror in this order, and then irradiated to the work, and the second galvano A technical idea is disclosed in which a second laser beam scanned by a scanner is reflected by the dichroic mirror and applied to the workpiece.

JP-A-11-277272 Japanese Patent No. 4346254

  By the way, in recent years, carbon fiber reinforced resin (CFRP: carbon fiber reinforced plastics) has been used as a lightweight structural material for transportation equipment such as aircraft. However, since CFRP is a difficult-to-process composite material, development of a laser processing technique capable of processing such a composite material (workpiece) at high speed and high quality is desired.

  As one of laser processing methods capable of processing the workpiece at high speed and high quality, there can be considered a method in which a plurality of laser beams having different wavelengths are superimposed on the same axis and scanned together with the workpiece.

  In the conventional technique according to Patent Document 1 described above, since it is necessary to use a special f-θ lens with wavelength correction, the number and the number of constituent lenses are increased as compared with an f-θ lens without wavelength correction. As a result, there is a concern about an increase in size and cost of the laser processing system. In particular, when laser light having a wavelength in the ultraviolet region (second laser light) is included, it is difficult to design and manufacture an f-θ lens because there are few glass materials that can be used for the lens. is there.

  On the other hand, in the prior art according to Patent Document 2, the first laser beam and the second laser beam scanned by the galvano scanner are superimposed on each other by a dichroic mirror. However, it is not easy to superimpose and scan together. For this reason, there is a possibility that the workpiece cannot be laser processed at high speed and with high quality.

  The present invention has been made in consideration of such problems. A laser processing system and a laser capable of laser processing a workpiece at high speed and high quality, and reducing the cost and size of the workpiece. An object is to provide a processing method.

A laser processing system according to the present invention includes a first laser oscillator that oscillates a first laser beam, a second laser oscillator that oscillates a second laser beam having a wavelength different from the wavelength of the first laser beam, together and superimposing system for superposing a first laser beam and the second laser beam coaxially with the superimposing optical system superimposed derived from the said first laser beam and said second laser beam relative to the workpiece A first scanning optical system that is arranged on an optical path between the first laser oscillator and the superimposing optical system and that condenses the first laser light and can change a focal length. A second condensing unit provided on an optical path between the condensing optical system, the second laser oscillator, and the superimposing optical system and configured to condense the second laser light and change a focal length. an optical system, the scanning angle of said scanning optical system A scanning angle obtaining means for obtaining, said a first condensing optical system and a control unit for controlling the second condensing optical system, wherein the first condensing optical system is expanded to the first laser beam A first condensing lens, a first condensing lens that condenses the first laser light expanded by the first condensing lens, and the first condensing lens of the first condensing lens. A first lens holder that is displaceably supported along the optical axis, wherein the second condensing optical system includes a second diameter-expanding lens that expands the diameter of the second laser light, and the second diameter-expanding lens. A second condenser lens for condensing the second laser light whose diameter has been enlarged by the lens, and a second lens for supporting the second enlarged lens so as to be displaceable along the optical axis of the second condenser lens. A holder, and the control unit stores the processing data and a correction curve or a parameter table, and the scan Based on the scanning angle acquired by the degree acquisition means and the correction curve or the parameter table stored in the storage unit, the first displacement amount of the first enlarged lens and the second displacement lens A displacement amount calculating unit that calculates two displacement amounts, and driving and controlling the first lens holder based on the first displacement amount calculated by the displacement amount calculating unit. A focal length for adjusting a focal length of the second condensing optical system by adjusting a focal length and drivingly controlling the second lens holder based on the second displacement amount calculated by the displacement amount calculation unit. an adjustment unit, and wherein Rukoto that having a scanning control section which controls the scanning optical system based on the processing data stored in the storage unit.

  According to the laser processing system of the present invention, the first condensing optical system formed so as to condense the first laser light and change the focal length is disposed on the optical path between the first laser oscillator and the superimposing optical system. Provided with a second condensing optical system that condenses the second laser light and is capable of changing the focal length on the optical path between the second laser oscillator and the superimposing optical system. There is no need to provide an f-θ lens. Thereby, size reduction and cost reduction of a laser processing system can be achieved. Further, since the first laser beam and the second laser beam superimposed coaxially by the superimposing optical system can be scanned together with the workpiece by the scanning optical system, the workpiece is laser processed at high speed and with high quality. It is possible.

Further , the focal length (combined focal length) of the first condensing optical system is changed by changing the interval between the plurality of lenses constituting the first condensing optical system, and the plurality of constituents constituting the second condensing optical system. Since the focal length (synthetic focal length) of the second condensing optical system is changed by changing the distance between the lenses, the focal length of each of the first condensing optical system and the second condensing optical system is changed. Adjustment can be made reliably.

Further , since the distance between the first enlarged lens and the first condenser lens can be changed by displacing the first lens holder along the optical axis of the first enlarged lens, the first condenser optical system can be changed. The focal length of can be easily adjusted. In addition, since the distance between the second enlarged lens and the second condenser lens can be changed by displacing the second lens holder along the optical axis of the second enlarged lens, the second condenser optical system can be changed. The focal length of can be easily adjusted.

Furthermore , since it includes a focal length adjustment unit that adjusts the focal length of the first condensing optical system and the focal length of the second condensing optical system based on the scanning angle acquired by the scanning angle acquisition unit, The condensing position of the first laser light and the condensing position of the second laser light can be dynamically matched on the workpiece. Thereby, the workpiece can be laser-processed at higher speed and higher quality.

In the above SL laser processing system, the workpiece is constituted by CFRP, wherein the first laser beam which has a wavelength in the infrared region, the second laser beam may have a wavelength in the ultraviolet region .

  According to such a system, the first laser beam having the wavelength in the infrared region and the second laser beam having the wavelength in the ultraviolet region can be coaxially superimposed and scanned on the CFRP. High-quality laser processing is possible.

In the laser processing method according to the present invention, the first laser beam is incident on the storage step of storing the processing data and the correction curve or the parameter table in the storage unit, and the first condensing optical system formed so that the focal length can be changed. A first incident step, a second incident step in which a second laser beam having a wavelength different from the wavelength of the first laser beam is incident on a second condensing optical system formed so that a focal length can be changed, A superimposing step of coaxially superimposing the first laser light guided from the first condensing optical system and the second laser light guided from the second condensing optical system by a superimposing optical system; and the storage unit A scanning step of scanning the workpiece together with the first laser beam and the second laser beam superimposed in the superimposing step based on the processing data stored in the scanning optical system , The first condensing optical system includes the first recording optical system. A first expanding lens for expanding the light, a first condensing lens for condensing the first laser light expanded by the first expanding lens, and the first expanding lens. A first lens holder that is displaceably supported along the optical axis of the first condensing lens, and the second condensing optical system includes a second diameter-expanding lens that expands the diameter of the second laser light, A second condensing lens that condenses the second laser light expanded by the second diameter expanding lens, and the second diameter expanding lens can be displaced along the optical axis of the second condensing lens. A second lens holder to be supported, and in the scanning step, an acquisition step of acquiring a scanning angle of the scanning optical system, the scanning angle acquired in the acquisition step, and the storage unit are stored. Based on the correction curve or the parameter table, the first displacement amount of the first enlarged lens and the second A calculation step of calculating a second displacement amount of the diameter lens, and driving control of the first lens holder based on the first displacement amount calculated in the calculation step. A focal length adjustment step of adjusting a focal length of the second condensing optical system by adjusting a focal length and drivingly controlling the second lens holder based on the second displacement amount calculated in the calculation step. And performing.

  According to the laser processing method of the present invention, the first laser light is incident on the first condensing optical system formed so that the focal length can be changed, and the second condensing optical system formed so that the focal length can be changed. Since the second laser beam having a wavelength different from the wavelength of the first laser beam is incident on the first laser beam, it is not necessary to provide a special f-θ lens. Thereby, size reduction and cost reduction of a laser processing system can be achieved. In addition, since the first laser beam and the second laser beam superimposed on the same axis in the superimposing step are scanned with respect to the workpiece, the workpiece can be laser processed at high speed and with high quality.

  As described above, according to the present invention, the workpiece can be laser-processed at high speed and with high quality, and the cost can be reduced and the size can be reduced.

It is a mimetic diagram of a laser processing system concerning one embodiment of the present invention. It is a block diagram which shows the structure of the control part shown in FIG. It is a flowchart for demonstrating the laser processing method which concerns on one Embodiment of this invention. It is a flowchart for demonstrating the content of the scanning process shown in FIG.

  Hereinafter, a laser processing system and a laser processing method according to the present invention will be described in detail with reference to the accompanying drawings by illustrating preferred embodiments.

  The laser processing system 10 according to the embodiment of the present invention scans the workpiece W by coaxially superimposing the first laser beam LB1 and the second laser beam LB2 having different wavelengths and scanning the workpiece W together. This is a system for laser processing at high speed and high quality.

  As shown in FIG. 1, the workpiece W can be composed of an arbitrary material, but is configured as a plate material of a difficult-to-process composite material such as carbon fiber reinforced resin (CFRP), for example.

  The laser processing system 10 includes a first laser oscillator 12 that oscillates the first laser light LB1, a second laser oscillator 14 that oscillates the second laser light LB2, and a first collection for condensing the first laser light LB1. The optical optical system 16, the second condensing optical system 18 for condensing the second laser light LB2, the first laser light LB1 emitted from the first condensing optical system 16, and the second condensing optical system 18 A dichroic mirror (superimposing optical system) 20 for coaxially superimposing the second laser beam LB2 emitted from the laser beam, and a support base for the first laser beam LB1 and the second laser beam LB2 superimposed by the dichroic mirror 20 A galvano scanner (scanning optical system) 22 that operates together with the workpiece W placed on 100 and a control unit 26 are provided.

  The first laser oscillator 12 is configured to be able to oscillate, for example, the first laser light LB1 having a wavelength in the infrared region (near infrared region). As such a 1st laser oscillator 12, a fiber laser oscillator etc. are mentioned, for example.

  For example, the second laser oscillator 14 is configured to be able to oscillate the second laser light LB2 having a wavelength in the ultraviolet region. Examples of the second laser oscillator 14 include a third harmonic laser oscillator (Q switch type solid-state laser oscillator).

  The first condensing optical system 16 is disposed on the optical path between the first laser oscillator 12 and the dichroic mirror 20. Specifically, the first condensing optical system 16 collects the first diameter-expanding lens 28 that expands the first laser light LB1 and the first laser light LB1 that has been expanded by the first diameter-expanding lens 28. A pair of first condensing lenses 30 and 32 that emit light, and a first lens holder 34 that supports the first diameter-expanding lens 28 so as to be displaceable along its optical axis.

  In the present embodiment, a concave lens is used as the first enlarged lens 28, and convex lenses are used as the first condenser lenses 30 and 32. The focal lengths of the first condenser lenses 30 and 32 are different.

  The first condensing optical system 16 configured as described above changes the focal length (composite) of the first condensing optical system 16 by changing the interval between the first diameter-expanding lens 28 and the first condensing lens 30. (Focal distance) can be easily adjusted.

  The second condensing optical system 18 has the same configuration as the first condensing optical system 16 described above, and is disposed on the optical path between the second laser oscillator 14 and the dichroic mirror 20. In other words, the second condensing optical system 18 condenses the second diameter expanding lens 36 that expands the second laser light LB2 and the second laser light LB2 expanded by the second diameter expanding lens 36. Second condensing lenses 38 and 40 and a second lens holder 42 that supports the second enlarged lens 36 so as to be displaceable along its optical axis.

  In the present embodiment, a concave lens is used as the second enlarged lens 36, and convex lenses are used as the second condenser lenses 38 and 40. The focal lengths of the second condenser lenses 38 and 40 are different.

  The second condensing optical system 18 configured in this way changes the focal length (composite) of the second condensing optical system 18 by changing the distance between the second expanding lens 36 and the second condensing lens 38. (Focal distance) can be easily adjusted.

  The dichroic mirror 20 transmits the first laser beam LB1 from the back side and reflects the second laser beam LB2. Thereby, the dichroic mirror 20 can superimpose the first laser beam LB1 emitted from the first condensing optical system 16 and the second laser beam LB2 emitted from the second condensing optical system 18 on the same axis. .

  The galvano scanner 22 includes a galvanometer mirror 44 for scanning the first laser beam LB1 and the second laser beam LB2 superimposed by the dichroic mirror 20 along the X-axis direction (the length direction of the workpiece W), and a galvanometer. A motor 46 for rotating the mirror 44, an encoder (scanning angle acquisition means) 48 for acquiring the scanning angle of the galvanometer mirror 44, and the first laser beam LB1 and the second laser beam guided from the galvanometer mirror 44 A galvanometer mirror 50 for scanning the LB 2 along the Y-axis direction (the width direction of the workpiece W), a motor 52 for rotating the galvanometer mirror 50, and an encoder for acquiring the scanning angle of the galvanometer mirror 50 (Scanning angle acquisition means) 54.

  The galvano scanner 22 configured in this way can easily scan the first laser beam LB1 and the second laser beam LB2 within the XY plane of the workpiece W.

  As shown in FIG. 2, the control unit 26 includes a storage unit 56, a laser control unit 58, a scanning control unit 60, a displacement amount calculation unit 62, and a focal length adjustment unit (focal length adjustment unit) 64.

  The storage unit 56 stores machining data input by an input device (not shown). The storage unit 56 stores a correction curve or a parameter table. The correction curve or the parameter table includes, for example, the relationship between the scanning angle of each galvanometer mirror 44, 50 acquired by each encoder 48, 54 and the position of the first enlarged lens 28, and the scanned angle and the second enlarged diameter. What shows the relationship with the position of the lens 36 is used.

  The laser controller 58 supplies a drive current to the first laser oscillator 12 to oscillate the first laser beam LB1 from the first laser oscillator 12, and supplies a drive current to the second laser oscillator 14 to supply the second laser. The second laser beam LB2 is oscillated from the oscillator.

  The scanning control unit 60 controls driving of the motors 46 and 52 based on the processing data stored in the storage unit 56. The displacement amount calculation unit 62 calculates the displacement amount of the first diameter-expanding lens 28 and the displacement amount of the second diameter-expansion lens 36 based on the scanning angle of each galvanometer mirror 44, 50 acquired by each encoder 48, 54. .

  The focal length adjustment unit 64 drives and controls the first lens holder 34 based on the displacement amount of the first enlarged lens 28 calculated by the displacement amount calculation unit 62, and is calculated by the displacement amount calculation unit 62. The second lens holder 42 is driven and controlled based on the displacement amount of the second enlarged lens 36.

  Next, a laser processing method using the laser processing system 10 configured as described above will be described with reference to FIGS.

  First, the operator inputs machining data using an input device (not shown) (step S1 in FIG. 3). Thereby, the processing data is stored in the storage unit 56. Subsequently, the laser control unit 58 drives and controls the first laser oscillator 12 and the second laser oscillator 14 to oscillate the first laser light LB1 having a wavelength in the infrared region from the first laser oscillator 12, The second laser beam LB2 having a wavelength in the ultraviolet region is oscillated from the laser oscillator 14 (step S2).

  Then, the first laser beam LB1 oscillated from the first laser oscillator 12 enters the first condensing optical system 16 (step S3: first incident step). At this time, the first laser beam LB1 is condensed by the pair of first condenser lenses 30 and 32 after its beam diameter is enlarged by the first enlarged lens 28.

  On the other hand, the second laser beam LB2 oscillated from the second laser oscillator 14 is incident on the second condensing optical system 18 (step S4: second incident step). At this time, the second laser beam LB2 is condensed by the pair of second condenser lenses 38 and 40 after its beam diameter is enlarged by the second enlarged lens 36.

  The first laser light LB1 emitted from the first condensing optical system 16 is transmitted through the dichroic mirror 20 from the back side, and the second laser light LB2 emitted from the second condensing optical system 18 is reflected by the dichroic mirror 20. . As a result, the first laser beam LB1 and the second laser beam LB2 are superimposed on the same axis (step S5: superposition step).

  Thereafter, the superimposed first laser beam LB1 and second laser beam LB2 are reflected by the pair of galvanometer mirrors 44 and 50 and applied to the workpiece W. At this time, the scanning control unit 60 scans the workpiece W together with the first laser beam LB1 and the second laser beam LB2 based on the processing data stored in the storage unit 56 (step S6: scanning). Process). Thereby, the site | part irradiated with 1st laser beam LB1 and 2nd laser beam LB2 among the workpiece | work W is processed.

  In this embodiment, in this step S6, the displacement amount calculation unit 62 uses the scanning angle of each galvanometer mirror 44, 50 acquired by each encoder 48, 54 and the correction curve or parameter table stored in the storage unit 56. Based on the above, the amount of displacement of the first enlarged lens 28 and the amount of displacement of the second enlarged lens 36 are calculated (step S10 in FIG. 4).

  Then, the focal length adjustment unit 64 displaces the first lens holder 34 based on the calculated displacement amount of the first enlarged lens 28, and the second distance based on the calculated displacement amount of the second enlarged lens 36. The lens holder 42 is displaced (step S11). Thereby, the condensing position of 1st laser beam LB1 and the condensing position of 2nd laser beam LB2 can be made to correspond dynamically on the workpiece | work W. FIG.

  Next, the control unit 26 determines whether or not the machining of the workpiece W has been completed (step S7). If machining of the workpiece W has not been completed (step S7: NO), the process of step S6 is repeated.

  On the other hand, when the machining of the workpiece W is completed (step S7: YES), the laser control unit 58 controls the first laser oscillator 12 to stop the oscillation of the first laser beam LB1, and the second laser oscillator 14 Is controlled to stop the oscillation of the second laser beam LB2 (step S8). At this stage, the current flowchart ends.

  According to the present embodiment, the first condensing optical system 16 that condenses the first laser beam LB1 and can change the focal length is placed on the optical path between the first laser oscillator 12 and the dichroic mirror 20. Since the second condensing optical system 18 is provided on the optical path between the second laser oscillator 14 and the dichroic mirror 20 so that the second laser light LB2 is condensed and the focal length can be changed. There is no need to provide a special f-θ lens.

  That is, in the first condensing optical system 16 and the second condensing optical system 18, it is not necessary to perform wavelength correction (achromatization) processing, so that lens design is easy. In other words, the first condensing lens 28 and the first condensing lenses 30 and 32 constituting the first condensing optical system 16, and the second condensing lens 36 and the second condensing constituting the second condensing optical system 18. The optical lenses 38 and 40 can be designed with general optical glass for laser such as quartz or borosilicate glass (BK7). Thereby, size reduction and cost reduction of the laser processing system 10 can be achieved.

  Further, the first laser beam LB1 and the second laser beam LB2 that are coaxially superimposed by the dichroic mirror 20 are scanned together with the workpiece W by the galvano scanner 22, so that the workpiece W is lasered at high speed and high quality. Can be processed.

  In the present embodiment, the focal length of the first condensing optical system 16 (synthetic focal length) is changed by changing the distance between the first condensing lens 28 and the first condensing lens 30 constituting the first condensing optical system 16. ) And the distance between the second expanding lens 36 and the second condensing lens 38 constituting the second condensing optical system 18 is changed to thereby change the focal length (synthetic focal point) of the second condensing optical system 18. Since the distance) is changed, the focal length in each of the first condensing optical system 16 and the second condensing optical system 18 can be reliably adjusted.

  Further, since the distance between the first enlarged lens 28 and the first condenser lens 30 can be changed by displacing the first lens holder 34 along the optical axis of the first enlarged lens 28, the first lens holder 34 can be changed. The focal length of the condensing optical system 16 can be easily adjusted.

  Furthermore, since the distance between the second enlarged lens 36 and the second condenser lens 38 can be changed by displacing the second lens holder 42 along the optical axis of the second enlarged lens 36, the second lens holder 42 can be changed. The focal length of the condensing optical system 18 can be easily adjusted.

  According to this embodiment, based on the scanning angle of each galvanometer mirror 44, 50 acquired by each encoder 48, 54 and the correction curve or parameter table, the displacement amount calculation unit 62 displaces the displacement amount of the first enlarged lens 28. The amount of displacement of the second enlarged lens 36 is calculated.

  Then, the focal length adjustment unit 64 displaces the first lens holder 34 based on the calculated displacement amount of the first enlarged lens 28, and the second distance based on the calculated displacement amount of the second enlarged lens 36. Since the lens holder 42 is displaced, the condensing position of the first laser beam LB1 and the condensing position of the second laser beam LB2 can be dynamically matched on the workpiece W. Thereby, the workpiece W can be laser-processed at higher speed and higher quality.

  In the present embodiment, the first laser beam LB1 having the wavelength in the infrared region and the second laser beam LB2 having the wavelength in the ultraviolet region are coaxially overlapped and scanned together with the CFRP as the workpiece W. The CFRP can be laser processed at high speed and with high quality.

  In addition, the laser processing system 10 according to the present embodiment can process the workpiece W having a three-dimensional shape by adjusting the positions of the first enlarged lens 28 and the second enlarged lens 36.

  The present embodiment is not limited to the above configuration. For example, the first laser oscillator 12 oscillates the first laser beam LB1 having a wavelength in the ultraviolet region, and the second laser oscillator 14 has a wavelength in the infrared region. You may comprise so that 2 laser beam LB2 may be oscillated. In this case, a dichroic mirror 20 that transmits light having a wavelength in the infrared region and reflects light having a wavelength in the ultraviolet region may be used.

  Further, the first laser light LB1 and the second laser light LB2 may be laser light having a wavelength in the visible region. Further, the first condensing optical system 16 may be a liquid crystal lens that is formed so that the focal length can be changed and condenses the first laser light LB1. The same applies to the second condensing optical system 18.

  The present invention is not limited to the above-described embodiment, and it is naturally possible to adopt various configurations without departing from the gist of the present invention. For example, in the laser processing system and the laser processing method according to the present invention, three or more laser beams having different wavelengths may be superimposed on the same axis and scanned together with the workpiece.

DESCRIPTION OF SYMBOLS 10 ... Laser processing system 12 ... 1st laser oscillator 14 ... 2nd laser oscillator 16 ... 1st condensing optical system 18 ... 2nd condensing optical system 20 ... Dichroic mirror (superimposition optical system)
22 ... Galvano scanner (scanning optical system)
28 ... 1st expansion lens 30, 32 ... 1st condensing lens 34 ... 1st lens holder 36 ... 2nd expansion lens 38, 40 ... 2nd condensing lens 42 ... 2nd lens holder 48, 54 ... encoder ( Scanning angle acquisition means)
64: Focal length adjustment section (focal length adjustment means)
LB1 ... 1st laser beam LB2 ... 2nd laser beam

Claims (3)

A first laser oscillator that oscillates a first laser beam;
A second laser oscillator that oscillates a second laser beam having a wavelength different from the wavelength of the first laser beam;
A superimposing optical system for superimposing the first laser beam and the second laser beam coaxially;
A scanning optical system that scans the first laser beam and the second laser beam superimposed from the superimposing optical system together with the workpiece;
A first condensing optical system provided on an optical path between the first laser oscillator and the superimposing optical system and configured to condense the first laser light and change a focal length;
A second condensing optical system provided on an optical path between the second laser oscillator and the superimposing optical system and configured to condense the second laser light and change a focal length;
Scanning angle acquisition means for acquiring a scanning angle of the scanning optical system;
A controller that controls the first condensing optical system and the second condensing optical system ,
The first condensing optical system includes:
A first diameter-expanding lens for expanding the diameter of the first laser beam;
A first condensing lens that condenses the first laser light whose diameter has been expanded by the first diameter-expanding lens;
A first lens holder that supports the first enlarged lens so as to be displaceable along an optical axis of the first condenser lens;
The second condensing optical system includes:
A second diameter expansion lens for expanding the diameter of the second laser beam;
A second condensing lens that condenses the second laser light that has been expanded by the second expanded lens;
A second lens holder that supports the second enlarged lens so as to be displaceable along the optical axis of the second condenser lens;
The controller is
A storage unit storing machining data and a correction curve or parameter table;
Based on the scanning angle acquired by the scanning angle acquisition means and the correction curve or the parameter table stored in the storage unit, the first displacement amount of the first enlarged lens and the second enlarged lens. A displacement amount calculation unit for calculating the second displacement amount of
A focal length of the first condensing optical system is adjusted by driving and controlling the first lens holder based on the first displacement amount calculated by the displacement amount calculation unit, and the displacement amount calculation unit A focal length adjusting unit that adjusts a focal length of the second condensing optical system by driving and controlling the second lens holder based on the calculated second displacement amount;
A scanning control unit that controls the scanning optical system based on the processing data stored in the storage unit;
Laser processing system characterized by having a. The laser processing system according to claim 1 , wherein
The workpiece is made of CFRP,
The laser processing system characterized in that the first laser beam has a wavelength in the infrared region and the second laser beam has a wavelength in the ultraviolet region. A storage step of storing machining data and a correction curve or parameter table in a storage unit;
A first incident step of entering a first laser beam into a first condensing optical system formed so that the focal length can be changed;
A second incident step in which a second laser beam having a wavelength different from the wavelength of the first laser beam is incident on a second condensing optical system formed so that the focal length can be changed;
A superimposing step of coaxially superimposing the first laser light guided from the first condensing optical system and the second laser light guided from the second condensing optical system on a superimposing optical system;
A scanning step of scanning the workpiece together with the first laser beam and the second laser beam superimposed in the superimposing step based on the processing data stored in the storage unit by a scanning optical system ; And
The first condensing optical system includes:
A first diameter-expanding lens for expanding the diameter of the first laser beam;
A first condensing lens that condenses the first laser light whose diameter has been expanded by the first diameter-expanding lens;
A first lens holder that supports the first enlarged lens so as to be displaceable along an optical axis of the first condenser lens;
The second condensing optical system includes:
A second diameter expansion lens for expanding the diameter of the second laser beam;
A second condensing lens that condenses the second laser light that has been expanded by the second expanded lens;
A second lens holder that supports the second enlarged lens so as to be displaceable along the optical axis of the second condenser lens;
In the scanning step,
An acquisition step of acquiring a scanning angle of the scanning optical system;
Based on the scan angle acquired in the acquisition step and the correction curve or the parameter table stored in the storage unit, the first displacement amount of the first diameter expansion lens and the second displacement diameter of the second diameter expansion lens. A calculation step of calculating two displacement amounts;
The focal length of the first condensing optical system is adjusted by driving and controlling the first lens holder based on the first displacement amount calculated in the calculation step, and the calculation is performed in the calculation step. A focal length adjustment step of adjusting the focal length of the second condensing optical system by driving and controlling the second lens holder based on a second displacement amount;
The laser processing method characterized by performing.

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