CN100553854C - Laser processing method and processing device - Google Patents

Laser processing method and processing device Download PDF

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Publication number
CN100553854C
CN100553854C CNB2007101011215A CN200710101121A CN100553854C CN 100553854 C CN100553854 C CN 100553854C CN B2007101011215 A CNB2007101011215 A CN B2007101011215A CN 200710101121 A CN200710101121 A CN 200710101121A CN 100553854 C CN100553854 C CN 100553854C
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laser beam
laser
surface
light
incident
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CNB2007101011215A
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Chinese (zh)
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CN101041209A (en
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山口友之
山本次郎
浜田史郎
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住友重机械工业株式会社
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Priority to JP254015/2002 priority
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0652Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising prisms
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/362Laser etching
    • B23K26/364Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • B23K26/382Removing material by boring or cutting by boring
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • B23K26/382Removing material by boring or cutting by boring
    • B23K26/389Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets

Abstract

提供一种激光加工方法及加工装置。 To provide a laser processing method and processing apparatus. 本发明的激光加工方法包括以下工序:调整从激光源射出的激光束扩散角的工序;一边改变被调整成具有规定扩散角的激光束的行进方向,一边将该激光束照射到配置在与加工对象物的表面平行地从该表面仅离开规定距离的位置、且具有贯通孔的接近遮光框上,使通过了该贯通孔的激光束入射该加工对象物的表面,将该贯通孔的形状转印到该加工对象物表面上的工序;根据同该贯通孔的形状转印到该加工对象物表面上的精度、激光束的扩散角、上述接近遮光框与上述加工对象物表面之间的距离有关地求出的关系,来设定上述规定扩散角和上述规定距离中的至少一个的工序。 The laser processing method of the present invention comprises the steps of: adjusting a laser light emitted from the laser beam source diffusion step angle; while changing is adjusted to have a predetermined spread angle in the direction of travel of the laser beam while the laser beam is irradiated to the configuration and processing in parallel to the surface of the object away from the surface only the position of a predetermined distance, and approaching the light shielding frame having a through hole, passing through the through-hole of the laser beam incident surface of the object, the shape of the through hole transfer the step of printing on the surface of the object; on the accuracy of the distance between the object surface, the diffusion angle of the laser beam, the light shielding frame and the approach described above in accordance with the object surface shape of the transfer to the through-hole For the obtained relationship, to set the at least one diffusion step and the predetermined angle in the predetermined distance.

Description

激光加工方法及加工装置 The laser processing method and processing apparatus

本申请是2003賴月29日申请的申请号为"03820478.9"、发明名称为"激光加工方法及加工装置"的专利申请的分案申请。 The present application is filed May 29, 2003 Lai filed is "03820478.9" divisional entitled "Laser processing method and processing apparatus" patent filed.

技术领域 FIELD

本发明涉及向加工X嫁4勿体照射激光束进行加工的激光加工方法及激光加工装置。 The present invention relates to a laser beam not to marry 4 machining the body X machining laser processing method and laser processing apparatus.

背景技术 Background technique

图9是表示形淑曹的5见有的激光加工装置的概略图。 9 is a see-shaped Shu Cao 5 a schematic view of a conventional laser processing apparatus.

从激光光源51以例如频率lkHz射出脉冲激光束。 For example, the frequency of the laser light source 51 emits a pulsed laser beam from lkHz. 用均化器52将激光束的光束截面的脉冲能量密度均匀(头部平均:卜'爿7° 7 , ?卜)后,再用例如具有圆形贯通孔的遮光框53将光束截面形状整形为圆形。 52 with a homogenizer pulse energy beam cross-section of the laser beam uniform density: After the light shielding frame (average head? Bu 'valves 7 ° 7, BU), and then through hole has a circular sectional shape of the beam shaper 53 round. 经反射镜54反射后,经过聚光透镜55入射到基板56。 After reflecting mirror 54 through the condenser lens 55 is incident on the substrate 56. 基板56是例如在玻璃基体材料上形成有IT0膜的基板。 For example, substrate 56 is formed on a glass base material IT0 film substrate. 激光束入射到基板56的ITO膜。 Laser beam is incident to the substrate 56 of the ITO film. ITO膜表面上的激光束的光点例如是直径0. 2ram的圆形。 The spot of the laser beam on the surface of the ITO film, for example, the diameter of the circular 0. 2ram. 基板56被设置在XY工作台57上。 Substrate 56 is disposed on the XY stage 57. XY工作台57通过使基板56在二维平面内移动,可在基板56上的表面内移动脉冲激光束的入射位置。 An XY stage 56 moves the substrate 57 by the two-dimensional plane, may be incident on the position of the inner surface of the substrate 56 moves pulsed laser beam.

首先,移动XY工作台,使脉冲激光束以50站勺重复率照射到^l及56上,在基 First, moving the XY stage, the pulsed laser beam 50 is irradiated to stop the repetition rate of the spoon ^ l and 56 in the group

板56的IT0膜上形成槽。 IT0 film plate 56 are formed grooves. 这里的重复率是指,脉冲激光束每照射l次时向圆的半 Herein refers to the repetition rate, the half-pulse laser beam is irradiated every time the circle l

径方向移动的距离与圆直径的比例。 Ratio of distance moved in the radial direction and the diameter of the circle.

图10A是表示利用以5(F。的重复率照射的激光束连续开孔而在IT0膜上形成 10A is a continuous opening with a laser beam to 5 (F. Repetition rate irradiated film is formed IT0

了槽的基板56的概略俯视图。 56 a schematic plan view of the substrate groove. 用粗线表示槽的开口。 Represented by a thick line opening groove. 连续地打穿出依赖于入射到ITO膜上的激光束光点的形状的孔,结果形成了槽。 Successively playing piercing hole shape depends on the laser beam spot is incident on the ITO film, resulting in the formation of the grooves. 因此,延槽长度方向的开口边缘,通过圆形光点外周的一部分而具有凹凸。 Therefore, the opening edge of the groove extending in the longitudinal direction, through part of the periphery of the circular light spot having irregularities. 此外,当照射'的激光朿频率为lkHz、基板56的IT0膜上的激光束光点为直径0.2誦的圆形的情况下,力卩速度为100mm/s。 Further, when the circular shape is irradiated 'laser frequency of the lkHz Bouquet, laser beam spot IT0 film substrate 56 having a diameter of 0.2 recite force Jie speed of 100mm / s. 主要是,律速为XY工作台的动作速度,如果考虑加工形状的均匀性,不能将加工速度提高到该速度以上。 Mainly, the operation speed is the rate-limiting XY stage, in consideration of the uniformity of the machining shape, can not increase the processing speed above the speed. 为了将形成于ITO膜上的槽的开口边缘做成接近直线状,采用加大重复率的 In order to form the opening edge of the groove of the ITO film is made nearly linear shape, used to increase the repetition rate

方法。 method. 例如,移动XY工作台,以便在繊56的IT0膜上以90。 For example, moving the XY stage so as Xian IT0 film 56 to 90. /。 /. 的重复率照射脉冲激光7形淑曹。 The repetition rate of the pulsed laser 7 Cao Shu shape.

郞0B是表示禾佣以90。 Lang Wo 0B is a commission of 90. /。 /. 的重复率照射的激光束连续开?L而在IT0膜上形成了槽的M56的概,视图。 The repetition rate of the laser beam irradiated succession? L to form a groove M56 overview, in view IT0 film. 与图10A相同,用粗线表示槽的开口。 The same as FIG. 10A, showing an open slot by a thick line. 沿槽的长度方向的开口边缘接近直线形状。 Longitudinal direction of the opening edge of the groove close to a linear shape. 但是,由于以90%的重复率照身中激光束,因此加工速度是重复率为50%时的五分之一,艮卩20腿/s。 However, since the repetition rate of 90% of the body as a laser beam, and therefore the processing speed is one-fifth at the repetition rate of 50%, 20 Gen Jie leg / s. 虽然改善了开口开邻,但加工的时间效率降低。 O Although improved aperture opening, but the efficiency of the processing time is reduced.

图11是沿10A的PQ线剖开的基板56的概略截面图。 FIG 11 is a schematic cross-sectional view taken along line PQ. 10A of the substrate 56. 在玻璃基板上形成着的ITO膜上,形成有槽。 Formed on the glass substrate with the ITO film, is formed with a groove. 槽的侧面相对于«56的表面倾斜。 Slot side with respect to the «surface 56 is inclined. 槽最好是具有更笔直的侧面皿。 More preferably a straight groove having a side dish.

发明内容 SUMMARY

本发明的目的在于,掛共一种时间效率高、且可进行优质加工的激光加工方法及激光加工體。 Object of the present invention, a total of a time-linked high efficiency, and high-quality processing can be laser processing method and laser processing thereof.

根据本发明的一个观点,提供一种激光加工方法,包括以下工序:根据与 According to one aspect of the present invention, there is provided a laser processing method, comprising the steps of: according to

接M光框的贯通孔的开邻转印至咖ID^m物表面上的精度、激光束的扩散角、上述接M光框与上述加工,物表面之间的距离有关地预先求出的关系,将从激光源射出的激光束的扩散角和接M光框与加工,物表面之间的距离分别设定为规定扩散角和规定距离的工序;将从激光源射出的激光束扩散角调整为上述规定扩散角的工序; 一边改变被调整成具有规定扩散角的激光束的行进 M then the through holes of the light box to open coffee ID ^ o transfer accuracy, the diffusion angle of the laser beam, said light box then M m on the surface of the above-described processing, the distance between the surface in relation to the previously determined relationship between the distance from the spread angle of the laser beam emitted from the laser light source and the optical block M and then processing the surface diffusion process are set to a predetermined angle and a predetermined distance; diffusion angle of the laser beam emitted from the laser light source adjusting the diffusion angle of the predetermined step; changed while the laser beam is adjusted to have a predetermined diffusion angle of travel

方向, 一边将该激光束照射到配置在与加工x^m物的表面平行地从该表面仅离 Direction, while the laser beam is irradiated to the surface configuration and x ^ m was processed in parallel away from the surface only

开上述规定距离的位置、且具有贯通孔的接M光框上,使通过了该贯通孔的 Position of the predetermined distance apart, and having a light housing connected to M through-hole, passing through the through hole

激光束入射到该加:wm物的表面,将该贯通孔的糊犬转印到该加工膽物表 The laser beam is incident to add: wm surface thereof, the through-hole transferring the paste to the canine bladder was working table

面上的工序。 Step surface.

禾佣改变激光束的《彌方向的光束扫描器,进行禾鹏接M光框的激光力口工,由此可高速i皿行高精度的加工。 Wo commission change "Mi direction of the laser beam scanner beam, a light block Wo Peng M laser bonding force working port, whereby the high-speed high-precision machining line i dish. 再者,根据事先求出的、转印精度和激光束扩散角、以及t魏间隔必须满足的数值关系,要以期望的转印精度进行加工时,可简便i鹏定接近间隔和扩散角。 Further, according to pre-determined, transfer accuracy and diffusion angle of the laser beam, and the numerical relationship Wei interval t must meet, is to be processed to a desired transfer accuracy, it can be simply set close to the interval i Peng and diffusion angle.

根据本发明的另外观点,可提供一种激光加工方法,包括以下工序:用具 According to a further aspect of the present invention, there is provided a laser processing method, comprising the steps of: Appliances

有贯通孔的遮光框整形激光束的截面,并禾佣透镜使通过该贯通?L的激光束聚光后入射到该加工)«物的表面上,以使该遮光框的贯通孔成像在加工x^物的表面上;扫描通MJl,镜的激光束,使激光束的入射位置在上述加工对象物的表面上移动,并且,在激光束的扫描中也将上述贯通?L成像在上述加工对象物的表面上,加工该加工)(像物。 A through hole of the light shielding box shaped cross section of the laser beam, and passing through the lens commission Wo through? L of the laser beam incident on the converging after processing) on ​​the surface of «object to the through hole of the light shielding frame in the image processing upper surface x ^ thereof; laser beam scanning through MJL, mirror, the incident position of the laser beam moves on the surface of the object, and, in the scanning laser beam will also be the through L imaged in the above process? on the surface of the object, process the processing) (image thereof.

通过在加工对象物表面扫描激光束,使遮光框的贯通孔始终成像,能够以高效對也进行品质良好的加工。 By scanning the laser beam on the surface of the object, the through hole forming a light-shielding frame is always able to be performed in an efficient processing of good quality. 可防止激光束的扫描弓胞的对焦模糊所造成的加工质量的下降。 Scan bow cells prevented the laser beam focus blur caused by the decline in processing quality.

此外,根据本发明的另一观点,提供如下一种激光加工方法,包括如下工序:将由透镜聚光的激光束入射到加工X寸象物表面上的工序;扫描该激光束使激光朿的入射位置在上述加工对象物表面上移动,由此加工该加工对象物,而 Further, according to another aspect of the present invention, there is provided the following A laser processing method comprising the steps of: a laser beam condensed by the lens is incident to the step of processing the surface of the X-inch image; scanning the laser beam incident laser Bouquet position in the processing surface of the object, thereby processing the object, and

且,在扫描该激光束时使从上ays镜至ij上述加工对象物表面的该激光束的光路 And that from the optical path of the laser beam ays mirror ij to above the surface of the object during the scanning of the laser beam

长度不变化。 Length does not change.

—边将从透镜到加工对象物表面的加工位置的光路长度保持为恒定、 一边 - side of the optical path length from the lens to the processing position of the object surface is maintained constant, while

扫描激光束,例如始终在加工^a物表面上对焦点,能够以高效率i爐行高品 Scanning the laser beam, for example in the machine always ^ a surface point, i can be a high efficiency furnace product line height

质的激光加工。 The laser processing quality.

再者,根据本发明的另一观点,提供如下一种激光加工装置,包括:射出 Further, according to another aspect of the present invention, there is provided the following A laser processing apparatus, comprising: emitting

激光束的激光源;保持加工对象物的保持台;遮光框,具有对从上述激光源射出的激光束的截面进行整形的贯通孔;聚光透镜,将由上述遮光框整形了截面的激光束聚光,以使该遮光框的贯通孔成像在被上述保持台保持的加工到象物的表面上;光束扫描器,接受来自外部的控制,使由上述聚光透镜聚光的激光束在上述加工对象物的表面上至少在一维方向上扫描;移动机构,接受来自外部的控制,移动上,光框和上述聚光透镜;以及控制装置,使通过上述光束扫描器进行的扫描和通过上述移动机构进行的上述遮光框及上述聚光透镜的移动同步。 Laser source of the laser beam; holding the object table; a light-shielding frame having a cross section of the laser beam emitted from the laser light source is shaped through hole; a condenser lens, the light shielding frame by shaping a laser beam cross section poly light, so that the through hole of the light shielding frame in the image processing to be held by the holding table to the surface of the object image; beam scanner, receives a control from the outside, the laser beam is condensed by the condenser lens in the machining scanning the surface of the object at least in one-dimensional direction; moving mechanism, receives a control from the outside, the movement of the light, and the condenser lens frame; and a control means, through said scanning performed by the moving beam scanners and the light shielding frame and the moving mechanism of synchronization of the condenser lens.

若利用该激光加工装置,通过与光束的扫描同步地移位遮光框和聚光透镜,可高效率ifcl行高品质的激光加工。 When using this laser processing apparatus, the condenser lens and the light-shielding frame shift in synchronization with the scanning by the beam, the line can be efficiently ifcl high-quality laser processing.

根据本发明的其他观点,提供如下一种激光加工方法,包括以下工序:工序(e),激光束由透镜聚光后入射倒加]:X寸象物的表面上;工序(f),当激光束X寸上述加工对象物的入射位置移动时, 一边移动上述透镜、 一边在上述加工对象物的表面内移动激光束的入射位置,来抑制上述加工对象物表面的激光束的脉冲能量密度或功率密度的、由入射位置的移动弓i起的变动。 According to another aspect of the present invention, there is provided the following A laser processing method comprising: a step (E), the laser beam is condensed by the lens is incident inverted added]: X-inch image on the surface thereof; step (F), when laser beam X-inch when the incident position of the object moved, while moving the lens, while moving the incident position of the laser beam within the surface of the object to be processed to suppress the pulse energy density of the laser beam of the object surface or by moving the incident position i from the bow of the power density variation. 移动透镜使照射在被加工面上的激光束的脉冲能量密度或功率密度均匀化,可对被加工面的较宽区域保持固定的加工性能。 Moving the lens was irradiated in a pulse energy density or power density of the laser beam uniform working surface, can maintain a fixed processing performance of the wider region of the working plane.

根据本发明的另外观点,提供如下一种激光加工方法,包括以下工序:激光束由透镜聚光后入射到加工X嫁物表面上;激光束对上述加工Xt象物的入射位置移动时, 一边移动上i^3I镜、 一边在上述加工对象物表面内移动激光束的入射位置,以抑制入射位置的移动弓胞的上述加工对象物表面上的光点的面积变动。 According to a further aspect of the present invention, there is provided the following A laser processing method comprising the steps of: a laser beam incident on the converging lens by the rear working surface X married; when laser beam is incident to the machining position Xt as the object moves, while i ^ 3I moving mirror, while moving the incident position of the laser beam in the working surface of the object, in order to suppress the fluctuation of the spot area on the surface of the moving object position of incidence bow cell.

移动透镜使照射在被加工面上的激光束的光点面积均匀化,可实现基板上的脉冲能量密度或功率密度的均匀化,可对被加工面的较宽区域保持固定的加工性能。 Moving the laser irradiation lens so that the working surface of the beam spot area in a uniform, pulse energy density and can achieve uniform power density on the substrate can be held stationary on the handling properties of the machined surface wide area.

根据本发明的另外观点,提供一种激光加工装置,包括:射出激光束的激光源;保持加:O樣物的保持机构;透镜,将MJ^激光源输出的激光束聚光;光束扫描器,改变从上述透镜射出的激光束的行进方向,使激光束入射到被上述保持机构保持的加工对象物的表面上,在加工对象物的表面内移动激光束的入射位置;移动禾几构,接受来自外部的控制信号,移动上述透镜;以及控制装置,当上述光束扫描器在加工对象物的表面移动激光束的入射位置时,控制上述移动机构来移动上,镜的位置,以便抑制加工»物表面的激光束的脉冲能量密度或功率密度的变化。 According to a further aspect of the present invention, there is provided a laser processing apparatus, comprising: a laser source emitting a laser beam; Keep Alive: O-like holding means thereof; lens, converging the laser beam MJ ^ output from the laser source; beam scanner changing the traveling direction of the laser beam lens emitted above, the laser beam is incident on the surface of the object to be held by the holding means moves the incident position of the laser beam within the surface of the object; moving Wo several configurations, receiving a control signal from the outside, the movement of the lens; and control means, when said light beam scanner moves the incident position of the laser beam on the surface of the object, controlling said moving means to move the position of the mirror, so as to suppress processing » pulse energy of the laser beam or varying the surface density of the power density.

移动透镜使照射在被加工面上的激光束的脉冲能量密度或功率密度均匀化,可对被加工面的较宽区域保持固定的加工性能。 Moving the lens was irradiated in a pulse energy density or power density of the laser beam uniform working surface, can maintain a fixed processing performance of the wider region of the working plane.

根据本发明的其懒见点,提供一种激光加工装置,包括:射出激光束的激 According to the present invention, see point lazy which is provided a laser processing apparatus, comprising: a laser emitting a laser beam

光源;保持加工Xtt、物的保持机构;透镜,将从上述激光源输出的激光束聚光;光束扫描器,改变从上述透镜射出的激光束的行进方向,使激光束入射到被上述保持机构保持的加工对象物的表面上,在加工对象物的表面内移动激光束的入射位置;移动机构,接受来自外部的控制信号,移动上述透镜;以及控制装置,当上述光束扫描器在加工赠物的表面移动激光束的入射位節t控制上述移动机构来移动上述透镜的位置,以便抑制加工对象物表面的光点面积的变动。 A light source; Xtt holding process, the object holding means; lens, converging the laser beam from the laser beam source output; beam scanner to change the traveling direction of the laser beam emitted from the lens, the laser beam is incident on the holding means on the surface of the object held by, moving the laser beam in the surface of the object incident position; moving mechanism, receives a control signal from outside, the movement of the lens; and a control means, when said beam scanner in the processing gratuity the surface of the moving section of the incident laser beam is t bits controlling the moving means to move the position of the lens, so as to suppress fluctuation of the light spot area of ​​the object surface.

移动透镜使照射在被加工面上的激光束的光点面积均匀化,可实现基板上的脉冲能量密度或功率密度的均匀化,可对被加工面的较宽区域保持固定的加工性能。 Moving the laser irradiation lens so that the working surface of the beam spot area in a uniform, pulse energy density and can achieve uniform power density on the substrate can be held stationary on the handling properties of the machined surface wide area.

根据本发明的另夕卜观点,提供一种激光加工方法,包括以下工序:工序(g),激光束由透镜聚光后入射到加工对象物的表面上;工序(h),当激光束对上述加工对象物的入射位置移动时, 一边用可变衰减器调节激光束的功率、 一边在上述加工对象物的表面内移动激光束的入射位置,以抑制上述加工对象物表面的激光束的脉冲能量密度或功率密度的、因入射位置的移动弓跑的变动。 Bu Xi According to another aspect of the present invention, there is provided a laser processing method, comprising the steps of: step (G), the incident laser beam is condensed by the rear lens onto the surface of the object; a step (H), when the laser beam when the incident position of the moving object, while adjusting the power of the laser beam with a variable attenuator, while moving the incident position of the laser beam within the surface of the object to be processed, to inhibit the pulsed laser beam the surface of the object energy density or power density, due to the movement of the incident position of the bow run variation.

禾佣可变衰减器来均匀化照射被加工面的激光束的脉冲能量密度或功率密 Maid Wo variable attenuator is uniformly pulsed irradiation energy density or power density of the laser beam machining surface

度,可X诉皮加工面的较宽区域保持固定柳t]工性能。 Degrees, X v Piga surface area remains stationary Liu wide t] work performance.

根据本发明的另外观点,提供一种激光加工装置,包括:身拙激光束的激光源;保持加工对象物的保持机称透镜,将从J^激光源输出的激光束聚光;光束扫描器,改变从上述透镜射出的激光束的行进方向,使激光束入射到被上述保持机构保持的加工对象物的表面上,在加工对象物的表面内移动激光束的入射位置;可变衰减器,接受来自外部的控制信号,以可变的衰减率来衰减激光束的功率;以及控制装置,当上述光束扫描器在加工对象物的表面移动激光束的入射位置时,控制上述可变衰减器来调节激光束的功率,以便抑制加工对象物表面的激光束的脉冲能量密度或功率密度的变化。 According to a further aspect of the present invention, there is provided a laser processing apparatus, comprising: a body Zhuo laser source of the laser beam; holding unit holding the object, said lens, converging the laser beam from the J ^ output from the laser source; beam scanner changing the traveling direction of the laser beam emitted from the lens, the laser beam is incident on the surface of the object to be held by the holding means moves the incident position of the laser beam within the surface of the object to be processed; variable attenuator, receiving a control signal from the outside to the attenuation rate of the variable attenuator to the power of the laser beam; and a control means, when the position of the incident surface of the beam scanner moves the laser beam in the object, to control the variable attenuator adjusting the power of the laser beam, so as to suppress change in the pulse energy density or power density of the laser beam the surface of the object.

禾拥可变衰减器来均匀化照射被加工面的激光束的脉沖能量密度或功率密度,可对被加工面的较宽区域保持固定的加工性能。 Wo hold variable attenuator is uniformly pulsed irradiation energy density or power density of the laser beam of the machined surface, can maintain a fixed processing performance of the wider region of the working plane.

根据本发明的另外观点,提供一种激光加工装置,包括:射出激光束的激光源;保持加:O橡物的保持机构;第一透镜,会聚或发散从上述激光源输出的激光束;第二透镜,入射通过了上述第一透镜的激光束,并将入射的激光束聚光;光朿扫描器,改变从上述第二透镜射出的激光束的行进方向,使激光束入射到被上述保持机构保持的加工对象物的表面上,在加工x樣物的表面内移动激光束的入射位置;移动机构,接受来自外部的控制信号,移动上述第一透镜;以及控制装置,当上述光束扫描器在加工对象物的表面移动激光束的入射位置时,控制上述移动机构来移动上述第一透镜的位置,以便抑制加工X豫物表面的激光束的脉冲能量密度或功率密度的变化;对于入射第二透镜的激光束的该第二透镜的数值?L径设为NA1 、对于鹏了上述第二透镜的激光剌條第二 According to a further aspect of the present invention, there is provided a laser processing apparatus, comprising: a laser source emitting a laser beam; Keep Alive: O rubber material holding means; a first lens, converging or diverging laser beam from the laser light source output; a first two lenses, the laser beam is incident through the first lens, and converging the incident laser beam; Bouquet optical scanner, change the traveling direction of the laser beam emitted from the second lens, the laser beam is incident on the holding on the surface of the object holding means, moving the incident position of the laser beam in the x-like surface finish thereof; moving mechanism, receives a control signal from outside, the movement of the first lens; and a control means, when said beam scanner moving the incident position of the laser beam on the surface of the object, controlling said moving means to move the position of the first lens, in order to suppress the energy density of the laser beam machining surface Yu X or pulsed power density; for incidence value of the second lens of the second lens of the laser beam? L to diameter NA1, Peng laser for punching a second section of said second lens 透镜的数值?L径设为NA2时,NA1/Na2大于等于2。 Numerical lens? NA2 is a diameter L, NA1 / Na2 2 or more.

移动第一透镜使照射在被加工面上的激光束的脉冲能量密度或功率密度均匀化,可对被加工面的较宽区域保持固定的加工性能。 Moving the first lens is irradiated in pulse energy density or power density of the laser beam uniform working surface, can maintain a fixed processing performance of the wider region of the working plane. 再者,通过缩短第一透镜的移动距离,可实现加工的高速化、高精度化。 Further, by shortening the distance of movement of the first lens, can achieve high-speed processing, high precision.

根据本发明的其他观点,提供一种激光加工装置,包括:射出激光朿的激光源;保持加工对象物的保持机构;光束截面整形器,具有贯通孔,向该贯通孑L入射从上述激光源身寸出的激光束,接受来自外部的控制信号,可改变通过了贯通孔的激光束截面的一个方向的长度;透镜,将从上述光束截面整形器射出的激光束聚光;光束扫描器,改变从上皿镜身寸出的激光束的行进方向,使激光束入射到被上述保持机构保持的加工对象物的表面上,在加工对象物的表面 According to another aspect of the present invention, there is provided a laser processing apparatus, comprising: a laser source for emitting laser Bouquet; holding means holding the object; shaper beam cross-section, having a through hole penetrating to the larvae L incident from the laser light source inch body out of the laser beam, receives a control signal from the outside, can be changed by the longitudinal direction of the laser beam cross section of a through hole; lens from said beam cross-section of a laser beam emitted shaper converging; beam scanner, changing the traveling direction of the laser beam from the mirror body inch dish, the laser beam is incident on the surface of the object to be held by the holding means, the surface of the object to be processed

内移动激光束的入射位置;以及控制装置,当上述光束扫描器在加:a豫物的 Moving the incident position of the laser beam; and a control means, when said beam scanner in addition: a relaxation thereof

表面移动激光束的入射位動t,控制上述光束截面整形器,使上述光束截面整形器抑制加工膽物表面的激光束的形状变动。 Moving the laser beam incident on the surface of the movable position t, shaper controls the beam cross-section, so that the beam cross-section shape variation suppressing shaper laser beam machining surface of the bladder.

当被加工位置移动时,抑审恍点形状的变动,因此可对被加工面的较宽区域保持固定的加工性能。 When the processing position is moved, the shape changes suddenly suppressed trial points, thus maintaining a fixed processing performance of the wider region of the working surface.

根据本发明的其他观点,提供一种激光加工装置,包括:射'出激光束的激光源;保持加IO豫物的保持机构;透镜,将J)U:述激光源射出的激光束聚光;光束扫描器,改变从上«镜射出的激光束的行进方向,使激光束入射到被上述保持机构保持的加工对象物的表面上,在加工对象物的表面内移动激光束的入射位置;接«光框,被配置在从上述光束扫描器射出的激光束入射到加工对象物之前的光路中,具有贯通孔,使通过了该贯通孔的激光束入射至咖工对象物。 According to another aspect of the present invention, there is provided a laser processing apparatus, comprising: a shot 'of a laser beam of a laser source; Yu holding means plus IO thereof; lens, the J) U: converging said laser beam emitted from the laser light source ; beam scanner, moving the laser beam to change the inner surface of the object from the incident position of the laser beam traveling direction «mirror emitted laser beam incident on the surface of the object to be held by the holding means; then «light box, is arranged in the laser beam emitted from the beam scanner is incident on the optical path before the object having through-holes, the through holes passing through the laser beam incident on the object to work coffee.

利用改变激光束的行进方向的光束扫描器,进行利用接近遮光框的激光加工,由此可高速i,行高精度的加工。 Using a beam scanner to change the traveling direction of the laser beam, using a proximity light-shielding frame for laser processing, whereby high-speed i, highly precise machining.

根据本发明的其他观点,提供一种激光加工装置,包括:射出连续波激光束的激光源;保持加工对象物的保持机构;光学系统,入射从上述激光源射出的激光束,根据从外部提供的契机信号,可切换将入射的激光束向第一方向射出的状态和不向第一方向射出的状态;遮光框,具有矩形的贯通孔,从上述光学系统向上述第一方向射出的激光束射入该贯通孔,并整形激光束的截面;透镜,将从上述遮光框射出的激光束聚光,使上述遮光框的矩形贯通孔成像在被上述保持机构保持的加工对象物的表面上;移动机构,根据从外部提供的控制信号来移动上述保持机构,可在加工对象物的表面内移动从上述透镜射出的激光束入射到加工对象物的位置;旋转机构,根据从外部提供的控帝赔号,使上述遮光框绕与通过了该遮光框的贯通孔的激光束的光轴相平行的轴 According to another aspect of the present invention, there is provided a laser processing apparatus, comprising: a continuous wave laser beam emitted from a laser light source; holding means holding the object; an optical system, the incident light emitted from the laser light source laser beam in accordance with externally supplied opportunity signal can be switched to the incident laser beam emitted from the first direction state and a state of light emitted in the first direction; a light-shielding frame having a rectangular through hole, the laser beam emitted from the optical system in the first direction enters the through hole, and shape of the laser beam cross section; lens, emitted from said light-shielding frame condensing a laser beam, the light shielding frame of the rectangular upper surface of the through hole in the object to be imaged is held in the holding means; moving means in accordance with a control signal supplied from the outside to move the holding means may be in the surface of the object is moved from the laser beam incident on the lens is emitted to the object position; rotating mechanism, control Di from the outside in accordance with No compensation, so that the light shielding frame about an axis passing through the optical axis of the laser beam through hole of the light shielding frame parallel 乾控制机构,向上述光学系统送出上述契机信号,并控制上述移动机构,使上述移动机构向第二方向移动激光束对加工对象物的入射位置,在上述移动机构向该第二方向移动加工对象物表面上的激光朿的入射位置之前,控制上魏光框旋转机构,上纖光框旋转机构旋转上述遮光框,使上述矩形贯通孔的加工X豫物表面的像的某一边与第二方向平行。 Dry control means sends to the optical system of the above opportunity signal, and controls the moving means so that the moving means moves the incident position of the laser beam on the object in the second direction, moving the object to the second direction of said moving mechanism a second side direction of the image on the surface before the laser incident position Bouquet, WEI Guang block rotation control mechanism, the rotation of the optical fiber on the light shielding box frame rotating mechanism, so that the rectangular through hole surface of the processing Yu X parallel.

在对象加工物的表面照射连续波激光束可形成线状的的图形(线),从连续波激光束中分出脉冲激光束进行照射,可容易地形成点状的离散图形(点)。 In the graphics (lines) irradiated surface of the object of the workpiece continuous wave laser beam may be formed of a linear, pulsed laser beam separated from the continuous-wave laser beam is irradiated, a discrete dot pattern (dot) can be easily formed. 在加工X寸象物表面,通过与激光束的矩形光点的某一边平行地移动激光束的照射位置,可形成线、点的同时,将外形形成为矩形。 In the image processing X-inch surface, moving the laser beam through one side of the rectangular beam spot of the laser beam in parallel to the irradiation position, the line may be formed at the same time point, a rectangular outer shape.

根据本发明的另夕卜观点,提供一种激光加工方法,包括以下工序:工序(i),向光学系纟1A射从激光源射出的连续波激光束的工序,该光学系统可切换将入射的激光束向第一方向射出的状态和不向第一方向射出的状态;工序(j),将从上述光学系统向上述第一方向射出的激光束入射至惧有矩形贯通孔的遮光框中,迸行截面整形,由透镜聚光后,将上述贯通孔的像成像在加工对象物的表面上;以及工序(k),在上述加工X像物的表面上,使上述贯通孔的像在与该像的某一边平行的方向移动;在加工对象物表面形成点状的离散图形时,在上3iX序(i)中,从J^光学系统向上述第一方向间歇地射出激光束;在加工乂t^物表面形成线状的图形时,在上述工序(i)中,从上述光学系统向上述第一方向连续地射出激光束。 Bu Xi According to another aspect of the present invention, there is provided a laser processing method, comprising the steps of: step (I), the step of continuous wave laser beam emitted from the laser source to the optical system 1A Si emitted, the switching of the optical system may be incident the laser beam emitted from the first direction state and a state of light emitted in the first direction; step (j), the light emitted from the optical system in the first direction to the laser beam incident on a rectangular through hole fear shielding box , into line shaped cross-section, after condensed by the lens, the through hole forming the image on the surface of the object; and a step (K), the upper surface of the processing object as X, so that the through hole as in and moving parallel to the side of one of the image; forming discrete dot pattern of the object surface, in order 3iX (i), the laser beam is intermittently emitted from the optical system J ^ to the first direction; in t ^ qe machining linear pattern formed on the surface, in the step (i), the optical system from said laser beam is emitted continuously in the first direction.

在X寸象加工物的表面照射连续波激光束可形成线状的的图形(线),从连续波激光束中分出脉冲激光,行照射,可容易地形成点状的离散图形(点)。 Irradiating the surface of the workpiece as the X-inch continuous wave laser beam in a linear pattern (line) may be formed, laser pulse separation, is irradiated from the line of the continuous wave laser beam, a discrete dot pattern (dot) can be easily formed . 在加工对象物表面,通过与激光束的矩形光点的某一边平行地移动激光束的照身射立置,可形成线、点的同时,将外形形成为矩形。 In the object surface, by moving one side of the rectangular beam spot of the laser beam parallel to the laser beam emitted as the body upright, the line may be formed at the same time point, a rectangular outer shape.

根据本发明的另一观点,提供一种激光加工装置,包括:保持加工对象物 According to another aspect of the present invention, there is provided a laser processing apparatus, comprising: holding the object

的保持机构;射出脉冲激光朿的第一激光源;射出连续波激光束的第二激光源光学系统,在被上述保持机构保持的加工对象物的表面,照射从上述第一激光源射出的脉冲激光束和从上述第二激光源连续波激光朿,以便在连续波激光束的光点的内部包含脉冲激光束的光点;以及移动机构,在被上述保持机构保持的加工对象物表面上,移动脉冲激光束及连续波激光束的光点。 Holding means; a first laser light source emits a pulse laser Bouquet; a continuous wave laser beam emitted from the second laser light source optical system, the surface of the object to be held by the holding means, the irradiation light emitted from the first laser pulse source and a second laser beam from said laser light source Bouquet continuous wave laser, a continuous wave to the inside of the light spot of the laser beam spot comprises a pulsed laser beam; and a moving mechanism, on the surface of the object held by the holding means, moving a pulsed laser beam spot and a continuous wave laser beam.

在加工对象物表面上的某被加工区域,首先照射连续波激光束赋予预热,然后照射脉冲激光束进行加工。 A processed region on the surface of the object, irradiating continuous wave laser beam is first given preheated and then irradiated with a pulsed laser beam for processing. 可容易i鹏择该被加工区域的表层进行加工。 I can be readily processed by the Peng Optional processing region of the surface layer.

根据本发明的另外观点,提供一种激光加工方法,包括以下工序:工序(n),从第一激光源射出脉冲激光束,从第二激光源射出连续波激光束;工序(0),向在具有衬底层和表层的加工对象物的表面上划定的被加工点,照射从上述第二激光源射出的连续波激光束赋予预热后,向该被加工点照射从上述第一激光源射出的脉冲激光束,在上述加工对象物的表层形成孔,其中,上述表层形成在衬底层的表面上,由比衬底层的材质Bt以通逾敫光照射而加工的材质形成。 According to a further aspect of the present invention, there is provided a laser processing method, comprising the steps of: step (n-), emits a first pulsed laser beam from the laser light source emits continuous wave laser beam from the second laser light source; Step (0) to designated on the surface of the object has a substrate layer and a skin layer are the processing point, after irradiation of the second laser light emitted from the continuous wave laser beam source imparting preheated to the point to be processed is irradiated from the first laser light source the emitted pulsed laser beam, forming a hole in the surface layer of the above-described object, wherein the surface layer is formed on the surface of the substrate layer, formed from a material than the substrate layer Bt pass over Jiao irradiation light to process material.

在加工^m物表面上的某被加工区域,首先照射连续波激光束赋予预热,然后照射脉冲激光束进行加工。 In processing a processed region ^ m on the surface, irradiated with continuous wave laser beam is first given preheated and then irradiated with a pulsed laser beam for processing. 可容易i雌择该被加工区域的表层进行加工。 I can be readily processed by the selective estrogen processing region of the surface layer.

附图说明 BRIEF DESCRIPTION

图l是执行本发明第一实施例的激光加工方法的激光加工装置的概略图。 Figure l is a schematic diagram of laser processing apparatus performing laser processing method according to the first embodiment of the present invention. 图2是表示执行本发明第一实施例的激光加工方法的激光加工装置中激光束的光路的概略图。 FIG 2 is a schematic view showing an optical path of the laser processing apparatus of the embodiment of the laser processing method in a first embodiment of a laser beam of the present invention is performed.

图3A和图3B是概略表示利用激光束的照射加工的基板的俯视图。 3A and FIG. 3B is a schematic plan view of a substrate by irradiating a laser beam machining.

图4A是表/^H光框的贯通孔的一例的概略图,图4B是表示图4A所示的贯通孔在掛^J:成像时、在基板上幵出的孔的概略图。 4A is a schematic diagram showing an example of the through hole table / ^ H light box, FIG. 4B is a through-hole shown in FIG. 4A hanging ^ J: a schematic view of forming, on a substrate, a hole Jian.

图5A是,在从激光光源射出的脉冲激光束的截面中的、l个脉冲的能量密度的概略曲线;图5B是通过圆锥光学系统改变了脉冲能量密度分布的脉冲激光束界面中的、l个脉冲的能量密度的概略曲线;图5C是利用具有图5B所示的脉冲能量密度分布的脉冲激光束加工出的孔的概略截面图。 FIG 5A is a cross-sectional beam from the pulsed laser the laser light source is emitted in a schematic graph energy density l pulses; FIG. 5B is obtained by a conical optical system changes the pulsed laser beam interface pulse energy density distribution, and l pulse energy density of a schematic graph; FIG. 5C is a schematic sectional view of the hole using a pulsed laser having a pulse energy density distribution shown in FIG. 5B beam is processed.

图6是执行第一实施例的变形例涉及的激光加工方法的激光加工装置的概略图。 FIG 6 is a schematic diagram of laser processing apparatus of the modification of the laser processing method according to the first embodiment performs.

图7是表示光路调节机构的概略图。 FIG 7 is a schematic diagram of an optical path adjusting mechanism. 图8A和图8B是表示传送机构的概略图。 8A and 8B is a schematic view of a transfer mechanism. 图9是现有的激光划线装置的概略图。 9 is a schematic view of a conventional laser scribing apparatus.

图10A和图10B是用现有的激光划线装置加工的基板的概略俯视图。 10A and FIG. 10B is a schematic plan view of a conventional laser scribing a substrate processing apparatus.

图ll是用现有的激光划线装置加工的掛反的概略截面图。 Ll is a schematic sectional view of FIG linked anti-processed with conventional laser scribing device. 图12A是执行第二实施例的激光加工方法的激光加工装置的概略图;图12B是执行第二实施例的变形例涉及的激光加工方法的激光加工装置的概略图。 12A is a schematic diagram of laser processing apparatus performing the laser processing method of the second embodiment; FIG. 12B is a schematic diagram of laser processing apparatus performing laser processing method of the modification of the second embodiment according to embodiments.

图13是执行第二实施例的激光加工方法的激光加工装置中激光束光路的概略图。 FIG 13 is a schematic diagram of laser processing apparatus of the second embodiment of the laser processing method of the embodiment of the optical path of the laser beam is performed.

图14是执行第二实施例的变形例涉及的激光加工方法的激光加工装置中激 FIG 14 is a laser processing apparatus performing laser processing method of the modification of the second embodiment pertaining to the stimulated

光束光路的概略图。 FIG schematic beam path.

图15A是执行第三实施例的激光加工方法的激光加工装置的概略图;图15B 是表示初级聚光透镜的另一结构例的概略图。 15A is a schematic diagram of laser processing apparatus performing the laser processing method of the third embodiment; FIG. 15B is a schematic view showing another configuration example of the primary optical concentrator lens.

图16是表示次级聚光透镜的结构例的概略图。 FIG 16 is a schematic view showing a configuration example of a secondary condenser lens.

图17是执行第四实施例的激光加工方法的激光加工装置的概略图。 FIG 17 is a schematic diagram of laser processing method of a laser processing apparatus according to the fourth embodiment is performed.

图18A是从开口部倾斜机构的转轴方向看由幵口部倾余財几构旋转的孔径时的概略图;图18B是从激光束的光轴方向看由幵口部倾斜机构旋转的孔径时的概略图;图18C是从激光束的光轴方向看由开口部倾斜机构和开口部旋转机构旋转的开口部时的概略图。 See FIG. 18A is a schematic view of several configurations of the rotating aperture was poured over a fiscal Jian from the rotation shaft direction of the opening mouth portion of the tilt mechanism; see FIG. 18B is rotated by Jian aperture mouth portion of the tilt mechanism of the laser beam from the optical axis direction when FIG schematic; FIG. 18C is a schematic view when viewed from the opening portion of the rotating opening mechanism and the opening portion is inclined from the optical axis direction of the rotation mechanism of the laser beam.

图19是执行第五实施例的激光加工方法的激光加工装置的概略图。 FIG 19 is a schematic diagram of laser processing apparatus according to a fifth embodiment of the laser processing method of the embodiment performs.

图20是表示与利用了邻M光框的激光加工方法中的转印精度有关的模拟结果的、投影有贯通孔像的掛及的俯视图。 FIG 20 is a diagram showing a simulation result relating to the use of the transfer accuracy o M block light in the laser processing method, and the hanging projection top view image through hole.

图21是概略表示以某一转印精度进行加工时、激光束的扩散角和邻近遮光框所满足的关系的曲线。 FIG 21 is a schematic when processed in a transfer accuracy, the diffusion angle of the laser beam and the adjacent light-shielding frame graph showing the relationship satisfied.

图22A是执行第六实施例的激光加工方法的激光加工装置的概略图,图22B A schematic diagram of laser processing apparatus 22A is performing laser processing method in the sixth embodiment, FIG. 22B

是基板的概略截面图。 It is a schematic sectional view of a substrate.

图23是利用第六实施例的激光加工装置进行激光加工时的契机信号和激光 FIG 23 is a laser processing apparatus of the sixth embodiment is the laser signal and the opportunity during the laser processing

束的时序图的一例。 Example of a time chart bundle.

图24A是形成了线的基板的概略俯视图;图24B是形成了点的基板的概略俯视图。 24A is a schematic plan view of a substrate formed of lines; FIG. 24B is a schematic plan view of a substrate formed of dots.

图25是表示保持了遮光框的遮光框旋转机构的概略图。 FIG 25 is a schematic view showing a light-shielding frame holding the rotating mechanism of the light shielding box. 图26是禾佣遮光框旋转机构形成了线的基板的概略俯视图。 FIG 26 is a light blocking frame rotating mechanism Wo commission a schematic plan view of a substrate formed of the line. 图27A是执行第七实施例的激光加工方法的激光加工装置的概略图;图27B 27A is a schematic diagram of laser processing method of a laser processing apparatus according to the seventh embodiment is performed; FIG. 27B

是掛及的概略结构图。 And is a schematic diagram of the hanging.

图28A、图28B、图28C是用于说明被加工点和光点的位置关系的基板的俯视图。 FIG. 28A, 28B, and 28C is a top plan view of the substrate of the positional relationship between the machining point and the spot described.

图29是不4OT遮光框旋转机构就形成了线的基板的概略俯视图。 FIG 29 is a rotating mechanism not 4OT shielding block is formed schematic plan view of a substrate line. 具体实施方式 Detailed ways

图1是执行木发明第一实施例的激光加T方法的激光加工装置的概略图。 FIG 1 is a schematic diagram of laser processing apparatus performing the method of laser light T plus a first embodiment of the invention the wood. 在激光光源l中,从例如包含波长变换组件的Nd: MG激光振荡器,以脉冲 In the laser light source l, for example from the wavelength conversion module comprising Nd: MG laser oscillator, a pulse

能量lmJ/脉冲、脉冲宽50ns射出Nd: YAG激光器的三倍高频波(波长355nm)。 Energy lmJ / pulse, a pulse width of 50ns emitted Nd: YAG laser is tripled frequency wave (wavelength 355nm). 激光束经调节脉冲能量的可变衰减器2和扩大光束直径并以平行光射出的扩束器3后,入射至,锥光学系统4。 Laser beam pulse energy is adjusted by the variable attenuator 2 and the enlarged diameter and a parallel light beam emitted from the beam expander 3, enters the cone of the optical system 4. 圆锥光学系统4包含一对圆4錢镜4a、他构成。 Tapered optical system 4 includes a pair of circular mirror 4 money 4a, he composed. --对圆衝慰竟4a、 4b例如相同形状,被配置成底面相互对置。 - A circular punch comfort actually 4a, 4b, for example, the same shape, the bottom surface configured to face each other. 激光束从直圆锥的轴向向圆H31镜4a入射,使光束截面中心与直圆锥部分的顶点重合,然后从圆驗镜4b射出。 The laser beam from linear to circular cone axially H31 incident mirror 4a, the center of the beam cross section coincides with a straight apex cone portion, and then is emitted from the circular posterior lens 4b. 圆锥光学系统4改勉射的激光束的光束分布图,使在光束截面的中央部强度较弱、在周边部较强。 4 the beam profile of the laser beam to change the optical system cone emitted Mian the intensity of the beam cross section at the central portion of the weak, strong in the peripheral portion. 关于这点,在后面详述。 In this regard, he described in detail later. 并且,关于圆锥光学系统4,也可以用凸透镜来代替激光束射出侧的圆M镜4b。 And, on the cone of the optical system 4, may be replaced by a circular lens 4b mirror M of the laser beam exit side.

从圆锥光学系统4射出的激光束通过例如具有矩形贯通孔的遮光框5、使遮光框5的矩形贯通?L在基板12上成像的物镜6 。 4 from the cone of the optical system of the laser beam emitted by a light-shielding frame 5, for example, a rectangular through hole of the rectangular light shielding frame 5 through? L on the substrate 12 of the imaging objective lens 6. 遮光框5和物镜6可分别通过音圈机构9和10 (也可以替换成压电驱动机构等驱动机构),在与激光束的行进方向平行的方向移动。 A light-shielding frame 5 and the objective lens 6, respectively 9 and the voice coil 10 (drive mechanism may be replaced by a piezoelectric drive mechanism or the like), moving in a direction parallel to the traveling direction of the laser beam. 禾拥音圈机构9和10的移动,魏过从控制器ll发送的信号进行的。 Wo hold voice coil movement means 9 and 10, the signal transmission Wei collected from the controller ll performed. 而且,基板12被放置在保持台8上。 Further, the substrate 12 is placed on the holding table 8.

由物镜6聚光的激光束入射到电流扫描仪(力'/^V只年卞于)7。 Condensed by the objective lens 6 of the laser beam is incident to the scanner current (force '/ ^ V only in Bian in) 7. 电流扫描仪7包含X用扫描仪7a和Y用扫描仪7b构成,使激光束在二维方向上高速扫描。 Current scanner comprising X 7 constituted by a scanner with a scanner 7a and Y 7b, high-speed scanning of the laser beam in two dimensions. X用扫描仪7aS!Y用扫描仪7b都包含可摇动的反射镜而构成。 X scanner 7aS! Y scanner comprising 7b are swingably mirror constituted. 在被保持台8保持的^f反2上,划定(画定)相互正交的X方向禾nY方向时,X用扫描仪7a和Y用扫描仪7b扫描激光束,使由物傲聚光的激光束的入射点在基板12的表面上分别沿X方向、Y方向移动。 In table 8 are held by holding reverse ^ f 2, when designated (fixed Videos) mutually orthogonal directions X direction Wo nY, X Y scanner 7a and 7b with a scanner scanning the laser beam so that the converging was proud point of incidence of the laser beam, the Y direction on the surface of the substrate 12 in the X direction, respectively. 电流扫描仪7组合X用扫描仪7a和Y用扫描仪7b,可以使激光束沿二维方向扫描。 Current scanner composition 7 X Y scanner with a scanner 7a and 7b, the laser beam can be scanned in two dimensions.

作为加XX像物体的SI反12是例如在玻璃基体材料上形成有IT0膜的基板, 激光束以大约lJ/cm2的加工會巨量入射凝反12的IT0膜。 XX object image as an addition of anti-SI 12 is formed, for example, on a glass substrate base material, to a laser beam machining IT0 film about lJ / cm2 of anti-coagulation would be massive incident IT0 film 12.

图2是表示经遮光框5、物镜6、电流扫描仪7后在基板12上扫描的激光束光路的概略图。 FIG 2 shows a light-shielding frame 5 via the objective lens 6, a schematic diagram of the laser beam path after the current scanner 7 scans on the substrate 12.

激光束入射到超反12上的入射位置M时,遮光框5的贯通孔成像在M上。 When the incident position of the laser beam is incident on the super anti-M 12, the through hole forming a light-shielding frame 5 in the M. 此外, 如果将从遮光框5到物镜6的光路长度设为a、从物镜6到基板12上的入射位置的光路长度设为b、物镜的焦距设为f,贝ij为了使遮光框的贯通孔成像在基板12上,必须满足如下关系式。 Further, if the optical path length from the light shielding box 5 to the objective lens 6 is a, from the objective lens 6 is set to the optical path length of the incident position on the substrate 12 b, a focal length of the objective lens is f, ij shell in order to make the light shielding frame through forming holes in the substrate 12 must satisfy the following formula.

<formula>formula see original document page 13</formula> (1) <Formula> formula see original document page 13 </ formula> (1)

通过电流扫描仪7的动作,激光束的入射位置从g^反12上的入射位置M变化至!JN。 7 by the operation of the current scanner, the incident position of the laser beam incident position counter 12 changes from M g ^ to! JN. 对入射位置M的入射角和对入射位置N的入射角不同,如果遮光框5禾口物衞被固定不动的状态,则从物镜6到入射位置M的光路长度和从物镜6到入射位置N 的光路长度不同(设他们之差为Ab),因此,遮光孔5的贯通孔不成像砂处。 The incident angle of the incident position of the incident position M and N different angle of incidence, if the light-shielding frame 5 Wo mouth guard composition is immobilized state, the objective lens 6 from the position M to the incident optical path length from the position of the objective lens 6 and the entrance to N different optical path lengths (the difference between them is disposed Ab), and therefore, the light blocking holes forming the through hole 5 is not at the sand.

在图l所示的激光加工装置中,控制器11分别向音圈机构9、 IO发送与电流扫描仪7的动作同步地移动遮光框5和物镜6的信号。 In the laser processing apparatus shown in Figure l, the controller 11 respectively 9, IO scanner transmits the current operation of the signal light shielding block 7 moves the objective lens 5 and the mechanism 6 to the voice coil in synchronization. 该信号是例如是如下地移动遮光框5和物镜6的信号:使从遮光框5到物镜6的光路长度a、和从物镜6到敏反12上的入射位置的光路长度b都保持不变。 This signal is, for example, a mobile follows the signal light shielding frame 5 and the objective lens 6: make the light shielding block the optical path 5 to the objective lens 6 of length a, and unchanged from the objective lens 6 to sensitive anti optical path length b of the incident position on the 12 remains . 音圈9、 10接魏自控制器11的信号, 在与激光束的行进方向平行的方向上分另幡动遮光框5和物镜6。 The voice coil 9, 10 connected to the controller 11 from the signal Wei, points in a direction parallel to the traveling direction of the laser beam light shielding frame 5 further streamers and the objective lens 6.

如图2所示,入射位置/AM变化至,时,遮光框5和物镜6通过音圏机构诉卩10 移动的距离是Ab。 As shown, the position of the incident / AM 2 to change, when the objective lens 6 and the light-shielding frame 5 through the rings of sound v Jie mechanism 10 moves the distance Ab. 遮光框5和物镜6向相同的方向移位相同的距离Ab。 A light-shielding frame 5 and the objective lens 6 Ab displaced the same distance in the same direction. 这样, 可满足上述式(1),将遮光框5的贯通孔成像在入射jiSN上。 Thus, the incident jiSN meet the above formula (1), the light-shielding frame 5 in the through-hole forming.

不仅在入射位置M和N这2个点,如果在激光束的扫描中始终使例如从遮光框5到物镜6的光路长度a、和从物镜6至隨板12上的入射位置的光路长度b保持不变,贝ij遮光框5的贯通孔始终成像在繊12的表面上。 Not only in the incident position M and N of these two points, if consistently so, for example, from the light shielding block the optical path 5 to the objective lens 6, the length of a scanning laser beam, and from the objective lens 6 with the optical path length b incident position on the plate 12 remains unchanged, the light shielding frame shell ij through hole 5 is always imaged on the surface 12 of Xian. 遮光框5和物镜6与由电流扫描仪7驱动的激光束的扫描相同步地移动,并且使光路长度a和光路长敷始终不变。 A light-shielding frame 5 and the objective lens 6 is moved in synchronism with the scanning by the scanner driving current of the laser beam 7, and the optical path length of the optical path length and a plating remains unchanged. 此时,遮光框5的贯通孔的成像倍率(縮小率)始终不变。 In this case, the imaging magnification of the light shielding frame of the through hole 5 (reduction ratio) is always constant.

例如,在将物镜6的焦距f保持为833mm的恒定值、从遮光框5到物镜6的光路长度a保持为5000,的恒定值、从物镜6到基板12上的入射位置的光路长度b保持为1000mm的恒定值的情况下,遮光框5的贯通孔的成像倍率(缩小率)为1/5。 For example, the objective lens 6, a focal length f kept at a constant value of 833mm, keeping the light blocking frame 5 to the objective lens the optical path length 6 is a 5000, a constant value, b maintained from the objective lens 6 to the optical path length of the incident position on the substrate 12 is a constant value in the case of 1000mm, the imaging magnification of the light shielding frame of the through hole 5 (reduction ratio) is 1/5.

图3A是照射一次脉冲激光束在成像位置形成了孔、以便在表面上将遮光框5 的矩形贯通孔成像的基板12的概略俯视图。 3A is irradiated with a pulsed laser beam forms a hole in the imaging position, so that the substrate 12 through a schematic plan view of the rectangular holes on the imaging surface of the light-shielding frame 5. 在基板12上形成了成像有贯通孔的矩形光点,在该位置的ITO膜上幵孔。 Forming a light spot forming a rectangular through hole on the substrate 12, ITO film, the position of the hole Jian.

图3B是一边以一定的成像倍率(縮小率)将遮光膨的矩形贯通?L成像、一边移动光束的入射位置来照射4次脉冲激光束来在照射位置形成了槽的基板12 的俯视图。 3B is a side of a certain imaging magnification (reduction ratio) rectangular shielding expansion through? L image, while moving the incident position of the beam to illuminate four pulsed laser beam to form a top plan view of the groove of the substrate 12 at the irradiation position. 利用电流扫描仪7成像为矩形的光点的-L幼方向扫描fi永冲光束。 7 by the current scanner imaging scan fi permanent red beam direction is -L immature rectangular light spot. 此外, 以50%的重复率照射光束,连续地用各次照射形成开孔,从而形鹏。 Further, at a repetition rate of 50% of the radiation beam, are formed continuously with each irradiation opening, thereby forming Peng.

通过形成一定大小的矩形光点、并在与一对平fi^相平行的方向上扫描激光束,可以形成一定宽度的槽。 By forming a rectangular beam spot of a certain size, and with a pair of flat fi ^ scanning the laser beam, a width of the groove may be formed in a direction parallel to. 如本实施例所示,在利用脉冲激光束的情况下, 进行使光点的一对平行边(图3B中的长边)的一部分与上次照射的光点的一对平行边的一部分重合的扫描。 As shown in this embodiment, in the case of using a pulsed laser beam, a part of the light spot coincides with a pair of parallel sides (long side in FIG. 3B) is part of a pair of parallel light spot irradiated side of the last the scan. 槽的开口边缘由矩形光点的直线部形成,因此成为没有凹凸的直线状。 The opening edge of the slot is formed by a straight portion of the rectangular light spot, it does not become linear irregularities.

从易控制性等方面考虑,最好是在基板12形成的光点的一对平行边的方向与X方向或Y方向平行。 From the aspect of easy-controllability considerations, a pair of parallel light spot is preferably formed on the substrate 12 side in a direction parallel to the X or Y direction.

而且,在掛反12上成像的遮光框5的贯通孔也可以不是矩形。 Moreover, anti-hanging imaged on the light shielding frame 12 through hole 5 may be other than rectangular. 只要以具有一对平行边的形状形成光点、并在与该一对平行边平行的方向上扫描激光束,就可以形成在开口的边缘没有凹凸的一定宽度的槽。 As long as having the shape of a pair of parallel sides forming the light spot, and scanning the laser beam in a direction parallel with the pair of parallel sides, grooves can be formed without irregularities in fixed width edge of the opening.

图4A是表g光框5的贯通孔一个例子的图。 FIG 4A is a table through hole 5 g of a light box of an example of FIG. 遮光框5的贯通孔形成具有一对平行边的形状。 The through-hole having a light-shielding frame 5 is formed in the shape of a pair of parallel sides. 将这一对边连接起来的另一对边朝内侧弯曲。 The other pair of curved edges connecting the edges inward. 利用具有如此贯通孔的遮光框来整形激光束的截面,就可以在基板12上形成具有一对平行边的形状的光点。 The light shielding frame having such a through hole is shaped section of the laser beam, a light spot can be formed having the shape of a pair of parallel sides of the substrate 12.

图4B是表示当图4A所示的贯通?L在基板12上成像时、在基板12上开出的孔的概略图。 4B is shown in Figure 4A through when? L When imaged on the substrate 12, the substrate 12 on the schematic of FIG out of the hole. 通过在与一X寸平行边平行的方向上连续地形成与该孔祥同形状附L 就可以加工在开口的边缘不具有凹凸的一定宽度的槽。 By continuously forming Kung can be processed with the same shape is attached to L in a direction parallel to a X-inch parallel sides of the groove having no unevenness in a width edge of the opening. 再者,入射至鹏的边缘附近的激光束的累积能量密度比如射到槽中央的激光朿的累积能量密度,因此, 可以使槽的侧面更接近垂直。 Furthermore, the cumulative energy density of the laser beam incident on the vicinity of the edge such as Peng cumulative energy density of the laser light to the groove center Bouquet, therefore, can be made closer to the slot side vertical.

而且,如图3B所示,仅激光加工在一个方向延伸的槽的情况下,也可以使用具有i摆动反射镜的一维电流扫描仪或多面扫描仪。 Further, as shown in FIG. 3B, a case where only the laser processed groove extending in one direction, may also be used to oscillate the mirror i with a one-dimensional current scanner or the scanner surface. 此时,使扫描仪的扫描方向和光点的一对平斤边的方向一致即可。 At this time, the scanning direction and a spot scanner pounds direction a pair of flat sides can coincide.

参照图5A〜5C说明圆锥光学系统4。 5A~5C described with reference to FIG. 4 cone of the optical system. 如前所述,圆锥光学系统4将入射的激 As described above, the optical system 4 is incident cone of laser

光束的光束分布图变换成在光束截面的中央部较弱、在周边部较强。 FIG beam profile of the light beam into a center portion of the beam cross section is weak, strong in the peripheral portion.

图5A是表示从激光源1射出的脉冲激光束的截面中的、l个脉冲的能量密度的概略曲线图。 5A is a schematic graph l pulses sectional energy density beam from a pulsed laser source 1 emits laser light in. 脉冲激光束一般是,在截面的中央部分脉冲能量密度高、向接近周边脉冲能量密度变低。 Generally a pulsed laser beam, a high energy density at the central portion of the cross section of the pulse, the pulse energy density is close to the lower periphery. 圆锥光学系统4通过2个圆锥透镜4a、 4b将入射的激光束的中央部禾啁边部反转后射出。 Tapered optical system 4 4a, 4b to the central portion Wo Zhou exit side portion of the incident laser beam is inverted by two conical lenses. 因此,从圆锥光学系统4射出的激光束的光束分布图,具有在光束截面的中央部较弱、在周边部较强的分布。 Thus, the distribution of cone beam 4 emitted from the optical system of a laser beam having a beam cross-section in a central portion is weak, strong distribution in the peripheral portion.

图5B是概略表示从圆锥光学系统4射出并由遮光框5整形后的脉冲激光束的 5B is a schematic showing the pulsed laser beam shaping cone emitted by the optical system 4 from the light-shielding frame 5

截面中的、l个脉冲的貪糧密度的曲线图。 , L a greedy graph grain density of a cross section of the pulse. 光束具有脉冲能量密度在中央部弱、在周边部强的分布。 Beam having a pulse energy density at the central portion in the weak intensity distribution of the peripheral portion.

图5C是沿图3B的C5-C5线切断的基板i2的概略剖面图。 5C is a schematic cross-sectional view of the substrate taken along i2 FIG. 3B C5-C5 cut line. 具有图5B所示的光束分布图的激光束被物镜6聚光后入射到基板12,可在基板12的IT0膜上使侧面的倾斜角舰90。 5B with FIG. 12 is incident to the substrate, the inclination angle may be in the side of the ship IT0 film of the substrate 12 after the laser beam profile shown in FIG beam 90 condensed by the objective lens 6. . 因此,图3B所示的槽,不仅开口的边缘形成直线状,还具有切起的侧壁。 Thus, the groove shown in Figure 3B, the edge of the opening is formed not only straight, but also have a cut and raised side walls.

而且,与电流扫描仪7的动作同步地调节脉冲激光束的脉冲能量,可进行更优质的加工。 Further, adjusting the pulse energy and pulse laser beam scanner 7, the operation of the current synchronization processing can be performed better. 如果入射至瞎板12的激光束的入射角变大,入射位置的光点面积变大。 If the angle of incidence of the laser beam incident on the blind plate 12 becomes large, the incident position of the spot area becomes large. 因此,当把由电流扫描仪7扫描的激光束的脉冲能量固定为恒定值的情况下,随着入射角的增大,入射位置的激光束的脉冲能量密度变小,力口工性能发生变化。 Thus, the case where the current pulse energy of the laser beam scanner 7 scans fixed to a constant value, with increasing angle of incidence, the pulse energy of the laser beam incident position of the density becomes small, the force working properties vary mouth . 为了保持固定的加工性能,有时也需要将入射位置的激光束的脉冲能量密度保持为恒定值。 In order to maintain a fixed processability sometimes required pulse energy of the laser beam incident position of the density is kept constant.

可变衰减器2与电流扫描仪7的动作同步地改变从激光源1射出的及光束的脉冲能量。 Variable attenuator 2 and the operation of the scanner 7 changes the current emitted from the laser beam source 1 and the synchronism pulse energy. 在根据从控制器il发送来的同歩信号、激光束以较大入射角入射到基板12时,减小脉冲能量的衰减率,增加从可变衰减器2射出的光束的脉冲能量。 When the substrate 12 is incident at a large incident angle transmitted from the controller according to the same il ho signal, the laser beam, reducing the rate of decay of the pulse energy, pulse energy increases from the variable attenuator 2 emitted beam. 如此,在光束的扫描过程中也可以将激光束入射位置处的脉冲能量密度保持为恒定。 Thus, during scanning of the light beam may be a laser beam at a pulse energy density of the incident position is kept constant.

此外,即使不保持为恒定,在激光刺寸基板12的入射角变化时,只要改变由可变衰减器2决定的脉冲能量的衰减率,就可以提高加工质量。 Further, even if does not remain constant, a change in the angle of incidence of the laser beam 12 gill-inch substrate, provided by the variable attenuator 2 to change the attenuation rate determined pulse energy, can improve processing quality.

此外,向基阪121A射激光束并扫柳寸,能够与电流扫描仪7的动作同步地改变遮光框5的贯通?L的成像倍率(縮小率),同时将激光束入射位割邻永冲能 In addition, the group Sakamoto 121A emitting a laser beam and sweeping Liu inch, can be changed in synchronization with the operation of the current scanner 7, the light shielding frame through 5? L of the imaging magnification (reduction ratio), while the laser beam incident position cutting o permanent red can

量密度保持为恒定。 An amount of density is kept constant.

<formula>formula see original document page 15</formula> 根据激光束对极板12的入射角0 (基板12的法线与入射角所成的角)确定满足以上2个式子的A,、 A2,并且与入射角9相对应地移动遮光框5和物镜6, 使从遮光框5到物镜6的光路长度成为3+ △ 2、从物镜6到基板12上的入射位置的光路长度成为bA,。 <Formula> formula see original document page 15 </ formula> laser beam satisfies the above two equations to determine the angle of incidence of 0 (normal angle of incidence to the substrate 12 of the angle) of the electrode plate 12 according to the A ,, A2 , and should move the incident angle 9 relative to a light-shielding frame 5 and the objective lens 6, so that became 3+ △ 2 from the shielding block the optical path length 5 to the objective lens 6, the objective lens 6 to the optical path length of the incident position on the substrate 12 becomes bA, . 这里,a、 b分别是0为0时从遮光框5到物镜6的光路长度和从物镜6到基板12上的入射位置的光路长度。 Here, a, b are 0 to 0 the optical path length from the light shielding box 5 to the objective lens 6 and the optical path length from the position of the objective lens 6 to incident on the substrate 12. 此外,f是物镜6的焦距。 Further, f is the focal length of the objective lens 6. 而且,即使不严格地满足式(2)和式(3),也可以在入射角变化时改变成像倍率以使光点面积的变动较小,由此,可改善激光加工质量。 Moreover, even if not strictly satisfy the formula (2) and (3), the imaging magnification may be changed to make a change in the angle of incidence variation of the light spot area is small, thereby, improve the quality of laser processing. 如果入射角变大,只要减小成像倍率(缩小率)即可。 If the incident angle becomes large, as long as the reduced imaging magnification (reduction ratio) can be.

图6是具有改变从物镜6至U基板12上入射位置的光路长度b的光路调整机构20的、第l实施例的变形例涉及的激光装置的概略图。 Figure 6 is a change in optical path length b of the incident position of the light path adjusting means from the objective lens 6 to the substrate 12 U, l 20 first schematic diagram of the laser apparatus according to a modification of the embodiment. 从图l所示的激光装置中去除了音圈机构9和10,追加了光路调整机构20。 In addition to the voice coil 9 and the mechanism 10, the optical path adjusting mechanism is added from a laser apparatus 20 shown in l. 其它结构与图l所示的激光加工装置的结构相同。 The same configuration as the laser processing apparatus further configuration shown in Figure l. 在图6所示的激光加工装置中,从遮光框5到物镜6的光路长度a是疸定的。 In the laser processing apparatus shown in FIG. 6, the light shielding frame 5 from the objective lens 6 of the optical path length is a predetermined jaundice. 通过光路调整机构20,例如与电流扫描仪7的动作同步地、在激光束的扫描过程中可以始终将从物镜6至隨板12上入射位置的光路b保持为恒定。 By light path adjusting means 20, for example, the current operation of the scanner 7 in synchronization during scanning of the laser beam from the objective lens 6 to be always with the board 12 is incident on the position of the light path b is held constant. 通过这样,可以使遮光框5的贯通孔始终以恒定的成像倍率(缩小率)成像在基板12上,可以加工出图3B所示的槽。 By this way, the through-hole of the light shielding frame 5 is always constant imaging magnification (reduction ratio) imaged on the substrate 12, grooves may be machined as shown in Figure 3B.

图7是光路调整机构20的概略图。 7 is a schematic view of an optical path adjusting means 20. 光路调整机构20例如包含21a〜21d的四片反射镜而构成。 Optical path adjusting means 20 comprises, for example, four mirrors being configured 21a~21d. 四片反射镜分别将入射激光束的行进方向例如改变9(T ,光路调整机构20向与入射的激光束行进方向平行的方向射出激光束。2片反射敏la 和21b形成移动部22。移动部22可向图中箭头方向移动。从物镜6至基板12的光路长度b可Mil使移动部22移位来调节。如果激光束对基板12的入射角变大,移动部22在图7中向上移动,通过缩短光路调整机构20内的激光束的光路长度,可将光路长度W呆持为恒定。移动部2的移动是接受来自控制部22的信号而进行。 控制器11通过使电流扫描仪7的动作和移动部22的移动同步,将图6所示的物镜6 到基板12的光路长度b保持为恒定。 Four mirrors each traveling direction of the incident laser beam, for example, changing 9 (T, the optical path adjusting means 20 emits a laser beam in a direction parallel to the traveling direction of the incident laser beam reflected .2 sensitive sheet la and 21b which form the mobile portion 22 moves portion 22 is movable in the direction of the arrow in FIG. 6 from the optical path length of the objective lens 12 to the substrate 22 b may be displaced so that the mobile unit Mil adjusted. If the laser beam incident angle of the substrate 12 becomes large, the moving part 22 in FIG. 7 is moved upward by shortening the optical path length of the laser beam within the 20 optical path adjusting means, the light path length W stay held constant. movement of the moving portion 2 is receiving a signal from the control unit 22 is performed. the controller 11 by passing a current scan an operation device 7 and the moving section 22 synchronization, the objective lens shown in FIG. 66 to the optical path length of the substrate 12 b remains constant.

在图6所示的激光加工装置中,为了调整光路长度b追加了光路调整机构20, 但是,为了迸一步调整光路a,也可以插入到遮光框5和物镜6之间。 In the laser processing apparatus shown in FIG. 6, in order to adjust the optical path length of the light path b is added to adjust mechanism 20, however, in order to adjust the optical path Beng step a, may be inserted between the objective lens 6 and the light-shielding frame 5. 通过利用2 个光路调整机构20,在激光束的扫描过程中也可以调整光路长度a!P光路长度b, 20, the optical path length may be adjusted during scanning a laser beam by using two optical path adjusting means! P optical path length B,

例如使其满足关系式(1)。 For example so as to satisfy the relationship of formula (1).

此外,根据进行的加工不同,可以仅移动遮光框5和物镜6中的任一个来调整光路长度a或光路长度b。 Further, according to the processing performed by different, you can move only a light-shielding frame 5 and the objective lens 6 according to any one of the optical path length adjusting optical path length a or b. 例如,也可以固定物镜6,仅使遮光框5进行满足关系式(l)的移动。 For example, the objective lens 6 may be fixed, only the light-shielding frame 5 is moved to satisfy the relationship of formula (l) a.

作为加XX豫,考虑了在玻璃基体材料上形成有ITO膜的基板,但也可以利用在硅基板上形成有聚酰亚胺膜的基板,加工聚酰亚胺膜。 Yu added as XX, considering a substrate having an ITO film on a glass base material, but may be formed using a substrate with a polyimide film on a silicon substrate, a polyimide film processed. 这些被用作太阳能电池基板或液晶基板。 These are used as a solar cell substrate or a liquid crystal substrate. 此外,也可以加工在聚酰亚胺膜上形成了ITO膜的触摸面板、乃至半导体膜等。 In addition, processing may be formed of a touch panel, an ITO film, semiconductor film and the polyimide film. 而且,也可以加工薄膜状的加工对象物。 Moreover, processing may be a film-like object to be processed.

图8A是传送薄膜30的传送机构31的概略图。 8A is a schematic view of a transfer conveying mechanism 31 of the film 30. 禾拥传送机构31传送薄膜30。 Wo 31 owned transport membrane transport mechanism 30. 真空吸盘32固定被传送来的薄膜30上的规定的加工位置,划定加工面。 Vacuum chuck 32 is fixed to a predetermined processing position on the film 30 to the transmission, designated working surface. 通过电 By electricity

流扫描仪7扫描的激光束入射到由真空吸盘32固定的薄膜32上,进行规定加工位置的加工。 Flow scanner scanning a laser beam 7 is incident on the vacuum chuck 32 is fixed by the film 32, for processing a predetermined processing position. 当规定位置的加工结束吋,传送机构31传送薄膜30,用真空吸盘32 固定另外的加工位置,进行加工。 When processing a predetermined end position inch, 30 transport membrane transport mechanism 31, 32 is fixed with a vacuum chuck further processing position for processing.

以前,用XY工作台移动由真空吸盘32固定的薄膜30,并使用固定光学系统照射光朿,由ite^行加工。 Before, XY table 32 for moving the fixing film 30 by the vacuum suction, and an optical system irradiating light fixed Bouquet, the row processing ite ^. 在本实施例中,是用电流扫描仪7扫描光束、在加工位置入射光束而迸行加工,因此可提高加工速度。 In the present embodiment, the scanner 7 is scanning beam current, the incident light beam at the processing position into line processing, the processing speed can be improved.

图8B是具有旋转式编码器33的传送机构31的概略图。 FIG 8B is a schematic view of the rotary encoder 33 of the conveying mechanism 31. 旋转式编码器33检测由传送机构31传送来的薄膜30的速度。 The rotary encoder 33 detects the speed of the film 30 by the transporting mechanism 31. 检测结果送给控制器ll,控制器ll根据薄膜30的传送速度求出薄膜30的传送量。 A detection result to the controller ll, ll controller 30 obtains the amount of the film transport speed of the film 30 according to the transfer. 薄膜30的传送速度、传送量及利用在薄膜30上划定的规定加工位置数据生成的控制信号,从控制器l拨送给电流扫描仪7。 The conveying speed of the film 30, and the transfer amount in the film 30 by using the designated position predetermined control signal processing data generated from the controller to the current scanner l dial 7. 电流扫描仪7接受控帝瞻号扫描激光束,向薄膜30上的规定的加工位置照射光束,迸行加工。 The scanner controller receiving current Di 7-numbered scan looking laser beam illumination beam to a predetermined processing position on the film 30, into line processing.

不必一定需要XY工作台,此外,可以一边传送薄膜30—边加工,所以能够 It does not necessarily require the XY stage, in addition, the film can be transferred while 30- edge processing, it is possible to

提高加工速度。 Improve processing speed.

通过使用从图1所示的激光装置中去除了圆锥光学系统4、遮光框5及音圈机构9的激光加工装置,还可以进行聚焦加工。 In addition to the cone of the optical system 4, a light-shielding frame 5 and the laser processing apparatus voice coil mechanism 9 may also focus the laser machining apparatus shown in FIG. 1 by using. 激光束通过物镜6以聚焦的方式聚光在基阪12上。 Laser beam focused by the objective lens 6 converging manner on the base 12 Osaka. 利用电流扫描仪7的动作,激光束在基板12上扫描,当基板12上的光束入射位置变化时,物镜6通过音圈机构10使物镜在与通过的光束行进方向平行的方向上移动,以働每从物镜6到SI反12的激光束的光路长度b保持为恒定。 7 using the operation of the current scanner, the laser beam is scanned on the substrate 12, when the light beam is incident on the change in position of the substrate 12, so that the objective lens 6 is moved in the direction parallel to the traveling direction of the light beam passing through the coil means 10 to Dong from the objective lens 6 to each of the optical path length of the laser beam 12 b of the anti-SI remains constant. 通鄉匕移动,激光束在^l及12上始终聚焦。 Dagger moved through rural, the laser beam is always focused on the ^ l and 12. 因此,可实现优良的加工。 Thus, excellent workability can be achieved.

在本实施例中,虽然使用了脉冲激光,但根据加工不同,也可以f顿连续波的激光束。 In the present embodiment, although the use of a pulsed laser, but according to different processing, f may be a continuous wave laser beam Dayton. 此外,作为激光源,4顿包含波长变换組件的Nd:YAG激光振荡器, 射出了Nd:YAG激光器的三倍高频波,但可使用固体激光器的基波〜五倍高频波。 Further, as the laser source, the wavelength converting 4 Dayton assembly comprising Nd: YAG laser oscillator emits a Nd: YAG laser triple wave frequency, but the solid-state laser may be used five times the fundamental frequency wave ~. 而且,还可以使用CO激光器等。 Further, it is also a CO laser.

另外,本实施例中,作为高速扫描光学系统使用了扫描仪,但也可以使用利用了多面镜的高速扫描光学系统。 Further, in this embodiment, used as a high-speed scanner a scanning optical system, it may be used utilizing a high-speed polygon mirror scanning optical system. 由于不通过用XY工作台移动加工对象物来改变激光束的入射位置,而是用高速扫描光学系统扫描光束来改变激光朿的入射位置,因此可提高加工速度。 Due to movement of the XY stage with the object to change the position of the incident laser beam by a scanning optical system but with a high speed scanning of the laser beam to change the incident position Bouquet, the processing speed can be improved.

并且,在上述的焦点加工方法中,激光束始终在超反表面上聚焦。 Further, in the above-described focus processing method, the laser beam is always focused on the super anti-surface. 接着,说明根据激光束对S^表面的入射位置调节激光束的焦点和基板表面之间位置关系、进行优良加工的方法。 Next, the surface of the incident position S ^ adjusting the positional relationship between the substrate surface and the focal point of the laser beam by a laser beam, a method of fine processing.

图12A所示的第二实施例的激光加工装置,是从图l所示的激光加工装置中去除了圆锥光学系统4、遮光框5及音圈机构9,还去除了可变衰减器2,并在扩束器3和物镜6之间配置了具有圆形贯通孔且调节光束直径的开口部5a。 The laser processing apparatus of the second embodiment shown in FIG. 12A, the from the laser processing apparatus shown in Figure l in addition to the taper of the optical system 4, a light-shielding frame 5 and voice coil means 9, also removes the variable attenuator 2, and between the beam expander 3 and the objective lens 6 disposed circular opening portion 5a having a through-hole and adjusting the beam diameter. 开口部5a的贯通孔不一定要成像在基板12的表面上。 The through-hole opening 5a need not be imaged on the surface of the substrate 12.

利用音圈机构IO,与通过物镜6的激光束行进方向相平衍也移动物激,使激光束的焦点接近或远离基板12的表面,这样,能够调节照射在基板表面上的激光束的脉冲能量密度。 The IO voice coil mechanism, and the focal point of the laser beam by the objective lens 6 relative to the direction of travel of flat laser derivative thereof is also moved, the laser beam close to or away from the substrate surface 12, so that is possible to adjust the pulse laser beam irradiated on the substrate surface Energy Density.

根据从控制器ll发送来的控制信号,电流扫描仪7在期望的时刻将激光束照向期望的行进方向。 7 at a desired timing according to the laser beam according to a desired direction of travel ll transmitted from the controller to the control signal, the current scanner. 通过利用从控制器11发送来的控制信号使音圈机构10与电流扫描仪7同步动{乍,可根据激光束的入射位置、以期望的脉冲能量密度向基板12照射激光。 By using a control signal sent from the controller 11 to the voice coil of the scanner mechanism 10 and the current synchronous dynamic {7 at first, according to the position of the incident laser beam to a desired energy density of the pulsed laser light irradiating the substrate 12.

参照图13说明利用了图12A的激光加工體的激光加工方法的一个例子。 Referring to FIG. 13 illustrates an example of a processing method utilizing a laser in the laser processing thereof in FIG. 12A. 在图13的上侧概略示出经物镜6、电流扫描仪7后在基板12上扫描的脉冲激光的光路。 In the upper side of FIG. 13 shows a schematic view through the objective lens 6, the optical path of the pulsed laser 7 after the current scanner to scan on the substrate 12.

激光束Llb垂直于^l及表面且以入射^SMl入射。 And the laser beam is incident to the incident Llb ^ SMl ^ l and perpendicular to the surface. 激光束Lla、 Llc分别在入射位置Nla、 Nlc以入射角al入射。 Laser beam Lla, Llc are incident position Nla, Nlc incident at an incident angle al. 入射位置Ml位于以入射位置Nla、 Nlc为两端的线段的中点。 Ml incident position is located at the incident position Nla, Nlc the midpoint of a line segment ends.

图13的下侧示出从电流扫描仪7—侧向下看去的基板表面。 The lower side of FIG. 13 shows the substrate viewed from the lower surface of the scanner 7- lateral current. 光点91a、 91b、 91c分别表示激光束Lla、 Llb、 Llc在基板表面上的(即入射位置Nla、 Ml、 Nlc 处)的光点。 The light spot 91a, 91b, 91c respectively, of the laser beam Lla, Llb, Llc on the substrate surface (i.e., the incident position Nla, Ml, Nlc at) the light spot.

从激光束Lla的光路向激光束Llc的光路方向改变激光束的行进方向, 一边重复脉冲激光束的照射,与图10A、 IOB所示结构相同地在各激光照射位置形成连续的?L从而在^>反表面上形成槽101。 Beam from the optical path of the laser beam Lla to the laser Llc optical path direction changing the traveling direction of the laser beam, while repetition pulsed laser beam, and 10A, the structure shown in IOB same form a continuous? L in the laser irradiation position whereby ^> groove 101 is formed on the reverse surface.

首先,当照射形淑曹101起始点的激光束Lla时,设定物镜6的位置,使激光束Lla在入射位置Nla聚焦。 First, when irradiated Cao Shu-shaped laser beam 101 Lla ​​starting point, setting the position of the objective lens 6 focusing the laser beam incident position Lla Nla. 并且,将光点的尺寸最小的点称为激光束的焦点。 Then, the minimum dot size is called the focal spot of the laser beam.

然后,当照射形淑曹101的终点的激光束Llc时,设定物镜6的位置,使激光束Llc在入射位置Nlc聚焦。 Then, when the irradiation end Cao Shu-shaped laser beam 101 Llc, setting the position of the objective lens 6 focusing the laser beam incident position Llc Nlc. 从物镞到入射位置Nla、 Nlc的光路长度大致相等' 因此,可以认为物镜6的位置在槽加工开始时和结束时相同。 From the object to the incident position Nla arrowhead, the optical path length is substantially equal Nlc 'can therefore be considered the same as the position of the objective lens 6 in the beginning and end of the groove processing. 而且,可以认为激光束Lla和Llc的入射角相等、光点91a和91c的面积相等。 Further, the laser beam can be considered equal Llc Lla and the incident angle of light spots 91a and 91c is equal to the area.

在此,首先说明在物镞依旧被固定在该位置的情况下扫描激光束来形淑曹会产生什么样的问题。 Here, first described in a case where the scanning laser beam was still arrowhead is secured in this position to form Cao Shu what problems occur.

在把物镜6固定在使激光束Lla在入射位置Nla聚焦(或者使激光束Llc在入射位置Nlc聚焦)的位置时,通过电流扫描仪7改变了行进方向的激光束的焦点轨迹所描绘的假想面是聚光面81a。 When the objective lens 6 is fixed to the laser beam Lla Nla focusing incident position (or the laser beam Llc Nlc focusing incident position), the current through the scanner 7 to change the traveling direction of the focal track of the laser beam as depicted in phantom the condenser side surface 81a. 聚光面81a上的点R表示激光朿Llb的焦点位置。 Point R on the light collecting surface 81a indicates the laser focal position Llb Bouquet.

在入射《體NIa、 Nlc以外的槽101上的入射位置,激光束在向焦点会聚的途中入射基板。 Other than the incident position of the incident "body NIa, Nlc the groove 101, the laser beam is incident to the substrate in the middle of the focal convergence. 从入射位置到焦点的距离越长,则入射位置处的光束直祖瞧点处的光束直径越大。 The longer the distance from the incident position to the focal point, the larger the beam diameter at the position of the beam at the incident point look straight progenitor. 入射位置和焦点的距离,对于向槽中央照射的激光束Lib是最大的。 Focus distance and the incident position of the laser beam irradiated to the center of the groove greatest Lib.

激光束的脉冲能量密度,通常是在光束截面的中心比外周附近高。 Pulse energy density of the laser beam, is usually high in the center of the beam cross-section than near the periphery. 光束直径变大时,光束截面内的^f立置的脉冲能量密度斷氏。 When the beam diameter is increased, the pulse energy ^ f upright section density in the beam's off. 因此即使光束直径变大' 可加工基板的阈值以上的脉冲能量密度区域也仅限于光束截面的中心附近。 Therefore, even if the beam diameter becomes larger than 'a threshold pulse energy density processable substrate is limited to the region near the center of the beam cross section.

在作为槽101端部的入射位置Nla、 Nlc附近,光柬直径虽然小,但是,在光 Nla 101 as the incident position at the end portion of the groove, near the NLC, Cambodia optical diameter small, but, in the light

束截面的外周附近脉冲能量密度成为加工阈值以上的激光束,以高的脉冲能量密度照射,形成宽度较大的槽。 Near the outer periphery of the pulse energy density of the beam cross section becomes more than the threshold value of the laser beam machining, a high pulse density energy irradiation, a large width of the groove is formed. 另一方面,在槽中央、即入射位置M1附近,光束直径较大,但是,仅在光束截面中心的狭窄区域脉冲能量密度成为力fl工阈值以上的激光束,以低的脉冲能量密度照射,形成宽度较细的槽。 On the other hand, the center of the groove, i.e., near the incident position M1, the beam diameter is large, but only a narrow region in the center of the section pulse energy density of the beam becomes more than the threshold force fl working laser beam is irradiated at a low pulse energy density, forming a groove width smaller. 这样,槽的宽度随场所而改变。 Thus, the width of the groove is changed with the venue.

并且,入射角al越大,从激光束Llb的入射位置Ml至驟光面81a上的点R的距离越大。 Further, the larger the incident angle al, the laser beam incident position Ml Llb greater the distance to the quench point R on the light receiving surface 81a. 因此,入射角al越大,照射到入射位置Nla、 Nlc的激光束直径与照射到入射位置M1的激光束直径之差越大。 Thus, the larger the incident angle al, irradiated to the incident position Nla, Nlc diameter of the laser beam irradiated to the laser beam incident position M1 of the larger-diameter difference. 艮口,槽的端部和中央之间的宽度差明显。 Gen mouth, the difference in width between the end of the groove and the central significantly. 入脊J"角al是形成槽端部的激光束入射角,因此,例如要在大型基ULh形成长槽时等情况下,入射角al变大。 The ridge J "angle of the laser beam incident angle al is formed in an end portion of the groove, and therefore, for example, be formed like the case where the long grooves, the incident angle becomes large in a large group al ULh.

接着,说明一边移动物镜6的位置调节焦点位置、 一边扫描激光束来形淑曹的方法。 Next, while moving the objective lens 6, the focal position adjustment position, while a laser beam to form a scanning method Shu Cao. 当调节激光束的焦点位置时,照射到基板上的激光束的光束直径被调节,«表面上的脉冲能量密度被调节。 When adjusting the focus position of the laser beam, the beam diameter of the laser beam is irradiated on the substrate is adjusted, the pulse energy density on the «surface is adjusted.

考虑一下将入射到入射位置的激光束Llb的焦点对在什么位置为好。 Consider the incident to the incident position of the laser beam focus on what Llb good position. 通过将焦点设定在比聚光面81a上的点R更靠近入射位置Ml的位置,可减小光朿直径,能够修正成增加入射位置M1的脉冲能量密度。 By setting the focal point at a position closer than the incident position Ml point R on the light collecting surface 81a, light can be reduced diameter Bouquet, it can be corrected to increase the pulse energy density of the incident position M1. 其中,如果焦点接近至入射位置 Wherein, if the focus position closer to the entrance

Ml,入射位置Ml处的脉冲能量密度比入射位置Nla、 Nlc处的脉冲能量密度大。 Ml, Ml pulse energy density of the incident position at the incident position than Nla, the pulse energy density at the Nlc. 由于激光束Llb垂直于基板表面入射,在入射位置M1聚焦时的激光束是圆 Llb since the laser beam is incident perpendicular to the surface of the substrate, when the incident position of the laser beam is focused circle M1

形。 shape. 另一方面,激光束Lla、 Llc以入射角al倾斜于基板表面入射,因此光点 On the other hand, the laser beam Lla, Llc al oblique incident angle is incident on the substrate surface, the light spot

9la、 91c扩散成椭圆形状。 9la, 91c spread into an elliptical shape. 艮卩,设激光束Llb在入射位置Ml聚焦时的光点91b的 Gen Jie, provided at the laser beam spot focused on the incident position Llb Ml 91b of

脉冲能量密度比光点91a、 91c处的脉冲能量密度高。 Pulse energy density 91a, 91c at a pulse energy density higher than the light spot.

因此,将激光束Llb的焦点对在比入射位置Mi稍深GAA射位置M塌超反的 Accordingly, the focal point of the laser beam Llb Mi incident position a little deeper than the position of the exit GAA M super anti collapse

内部远离)的位置,使光点91b的面积与入射位置Nla的光点91a、 91c的面积相 Position away from the interior), so that the area of ​​the light spot incident position of the light spot 91b of Nla 91a, 91c relative to the area of

等。 Wait. 若如此,能够以与入射位置Nla劍lc及Ml相等的脉冲能量密度照射激光, If so, it is possible to pulse energy equal to the incident position of the sword Nla Ml and density lc irradiated with laser light,

迸行加工。 Into line processing.

在槽101上的其它入射位置也保持光点面积为恒定,调整脉冲能量密度进行加工即可。 Other incident position groove 101 spot area is also kept constant, the pulse energy density is adjusted to be processed. 在槽101上以不改变光点面积的条件扫描时的焦点$»为聚光面8比。 In the groove 101 during the focus spot area without changing the scanning condition $ »is 8 to the condensing surface. 激光束Llb的焦点位置是聚光面81b上的点Q。 Llb focal position of the laser beam is a point on the condensing surface 81b Q.

说明使焦点沿着聚光面81b上移动时如何调节物镜6的位置。 Illustrate how to adjust the focal position of the objective lens 6 is moved along the condensing surface 81b. 首先,当照射激光束Lla时,物镜6被设定在使焦点聚在入射位置Nla上的位置。 First, when a laser beam is irradiated Lla, the objective lens 6 is set so that the focus will be on the incident position Nla position. 该位置被称为基准位置。 This position is called a reference position.

,AA射〗體Nla朝Ml扫描激光束时,从基准位置慢漫向激光源一方移动物镜6,从而使焦点沿着比聚光面81a更M繊表面的聚光面81b移动,光点的面积 , AA radio〗 body toward Ml Nla when scanning the laser beam slowly diffuse to the laser source moves from one reference position of the objective lens 6, so that the focal point moves along more M Xian surface 81b converging surfaces than the condensing surfaces 81a, the light spot area

变大,可抑制脉冲能量密度的降低。 Becomes large, reducing the pulse energy density can be suppressed. 从物镜基准位置算起的移动距离,对于入射到入射位置Nla的激光束Lla来说是零,随着激光朝向入射位置M1而增大,对于入射到入射位置M1的激光束Llb来说是最大的。 A moving distance of the objective lens from the reference position counting, the incident position of the incident laser beam Lla Nla is zero, as the laser is increased toward the incident position M1, the incident position of the incident laser beam M1 is the maximum Llb of.

接着,/AA射位置Ml向Nlc扫描激光束时,使物镜6慢漫接近基准位置即可。 Subsequently, / AA exit position when Nlc Ml to a scanning laser beam, an objective lens 6 can slowly diffuse close to the reference position. 从基准^S算起的物镜的移动距离,随着激光朝向入射^2Nlc而减小,对于入射至lJ入射位置Nlc的激光束来说是零。 ^ S from the reference counting of the movement distance of the objective lens, with the laser beam toward the incident ^ 2Nlc decreases, the laser beam is incident to the incident position Nlc the lJ is zero.

如此,通过一边调M镜6的位置使照射各入射位置的激光束的焦点沿着聚光面81b上移动、 一边扫描激光,可抑制由场所引起的宽度变化来形成槽IOI。 Thus, by adjusting the side mirror position 6 M of the focal position of the laser irradiation of each incident beam moves along the condensing surface 81b, while the laser scanning width variation can be suppressed due to the spaces formed grooves IOI.

总结一下移动物镜的方法。 Summarize the method of moving the objective lens. 在如果不移动物镜位置而继续扫描、则基板表面的脉冲能量密度陶氐的情况下,移动物镜使激光束的焦点接近入射位置,从而抑制脉冲能量密度的降低。 In the case of moving the objective lens position and if not continues to scan, pulse energy density of the ceramic substrate surface is Di, and moves the objective lens near the focal point of the laser beam incident position, thereby suppressing the reducing pulse energy density. 在如果不移动物镜位置而继续扫描、则基板表面的脉冲能量密度上升的情况下,相反,移动物镜使激光束的焦点位置远离入射位置,从而抑制脉冲能量密度的上升即可。 In the case of moving the objective lens position and if not continues to scan, the pulse energy density at the surface of the substrate is increased, on the contrary, the focal position of the objective lens moves away from the laser beam incident position, to thereby suppress an increase in the pulse energy density.

作为一个加工例子,说明了在槽两端的入射位置将焦点X寸在基板表面上的方法,但是,也可以在别的入射位置对焦点。 As a working example of how the focus of the X-inch method on the substrate surface in the incident position of both ends of the groove, but may be in other focus incident position. 只要将各入射位置的光点保持为大致恒定面积,就可以调整脉冲能量密度进行加工,因此,对于任何入射位置都可以保证固定的加工性能。 As long as each of the light spot incident position is maintained substantially constant area, it is possible to adjust the pulse energy density processing, and therefore, any incident position can be guaranteed a fixed processing performance.

在各入射位置也可以不严格保持照射激光束的脉冲能量密度,只要在入射位置变化时抑制入射位置的脉冲能量密度的变动,就可以良好地进行加工。 At each incident position may not be strictly maintained pulse energy density of the laser beam irradiation, as long as the pulse energy density of suppressing fluctuation in the incident position of the incident position changes, can be processed satisfactorily.

以槽加工(划线加工)为例进行了说明,但也可以进行开孔加工等。 In the groove processing (scribing) has been described as an example, but may be drilling and the like. 虽然说明了在一维方向上扫描电流扫描仪的例子,但也可以在二维方向上扫描,在整个基板表面上进行加工。 Although the example described scanner scanning current in a one-dimensional direction, but may be scanned in two dimensions, for processing on the entire surface of the substrate. 虽然以利用脉冲激光束的加工为例进行了说明,但激光束也可以是连续波。 Although the processing with a pulsed laser beam has been described as an example, but the laser beam may be a continuous wave. 用连续波激光束加工的情况下,可抑制被加工面上的功率密度随入射位置的变化。 The case of using a continuous wave laser beam machining, the power density can be suppressed in the working surface of the detector to incident position.

也可以用可变衰«来调节照射在基10:的激光束的脉冲能量密度,来代替移动物镜6进行的调节。 A variable attenuator may be «10 adjusted is irradiated on the base: a pulse energy density of the laser beam, instead of moving the objective lens 6 is adjusted.

如图12B所示的第2实施例的娜例涉及的激光加工装置是,在图12A所示的激光加工装置中追加有可变衰减器2。 The laser processing apparatus of the second embodiment according to a Na 12B, is added in the laser processing apparatus shown in FIG. 12A with a variable attenuator 2. 可变衰减器2根据从控制器1拨送来的控制信号,与电流扫描仪7的动作同步地、以期望的衰减率棘减照射在基教12上的脉冲?敫光束的功率。 Variable attenuator according to a control signal sent from the control dial 1, the current operation of the scanner 7 and synchronization to a desired attenuation rate ratchet Save irradiation pulse on the base 12 of the teaching? Jiao beam power.

参照图14说明利用了可变衰减器的激光加工方法的一个例子。 Referring to FIG. 14 illustrates an example of using the laser processing method of the variable attenuator. 图i4概略表示图12B所示激光加工装置中经物镜6和电流扫描仪7后在基板12上扫描的脉冲 FIG i4 schematic showing the pulsed laser processing apparatus 7 scan on the substrate 12 via the objective lens 6 and the current scanner shown in FIG. 12B

激光束的光路。 The optical path of the laser beam.

激光束L2b垂直于繊表面入射到入射位置M2。 L2b laser beam perpendicularly incident on the incidence surface position M2 in Xian. 激光束L2a、 L2c分另赃入射位置N2a、 N2c以入射角a2入射。 Laser beam L2a, L2c incident position of the other points stolen N2a, N2c incident at an incident angle a2. 入射位置M2位于以入射位置N2a、 N2c为两端的线段的中点。 M2 is located at the incident position of the incident position N2a, N2c the midpoint of a line segment ends.

物镜6被固定在使激光束L2b在入射位置M2聚焦的位置。 The objective lens 6 is fixed to the position of the laser beam incident position M2 L2b focused. 通过电流扫描仪7 改变了行进方向的激光束的焦点轨迹所描绘的假想面为聚光面82。 7 by the current scanner to change the direction of travel of the laser beam focal track depicted in the imaginary plane 82 is the condensing surface.

与参照图13进行的说明相同,一边从激光束L2a的光路向激光束L2c的光路方向改变激光束的行进方向, 一边重复脉冲激光束的照射,在凝及表面形成槽。 Same instructions with reference to FIG 13, while the beam path direction L2c changes the traveling direction of the laser beam, while pulsed laser beam is repeated, and the condensate formed in the groove from the surface of the optical path of the laser beam L2a to the laser.

随着激光束的入射位置离开入射位置M2 ,从激光束聚焦到入射到基板的距离变长。 As the incident position of the laser beam away from the incident position M2, to the incident laser beam is focused from the substrate to the longer distance. 通过焦点后的激光束是发散光线束,因此,从焦点到入射位置的距离越长,基板表面的光点越大。 By a laser beam after the focus light beam is divergent, and therefore, the longer the distance from the focal position of the incidence of the light spot larger substrate surface.

此外,随着激光束的入射位置离开入射位置M2,激光束X寸基板的入射角变大。 Furthermore, as the position of the incident laser beam is incident away from the position M2, the incident angle of the laser beam becomes large X-inch substrate. 照射具有相同光束直径的激光束的情况下,入射角越大,基板表面的光点越大。 A case where the same beam diameter is irradiated with a laser beam, the larger the incident angle, the light spot larger substrate surface.

如参照图13说明的那样,大光点内的脉冲能量密度在整个光束截面上降低, Referring to FIG. 13 as described, a large pulse energy density in the beam spot over the entire cross-section decreases,

仅在光束截面的中心附近成为可加工的阈值以上。 Only near the center of the beam cross-section becomes a threshold value or more processable. 因此,禾拥大光点的照射形成的槽宽度变细。 Accordingly, the groove width Wo hold large irradiation light spot formed tapered.

如果对任何入射位置都用恒定的脉冲能量照射激光来形成槽,则在槽的中央附近形成的宽度较大,在槽的端部形成的宽度较细。 If any incident position grooves are formed with a constant pulse energy of laser irradiation, the groove is formed near the center of the large width, the width of the groove formed at the end portion finer.

因此,根据入射位置'利用可变衰减器2调节功率,以便在任何入射位置, 基板表面上的脉冲能量密度为恒定。 Thus, depending on the incident position 'by a variable attenuator 2 regulator power, so that in any position of the incident pulse energy density on the substrate surface is constant. 功率的衰减量,在加工槽端部时最小,随着向槽中心接近而增大,当照射槽中心即入射位置M2时最大。 Attenuation of power in the processing of the minimum slot end, as close to the center of the groove is increased, i.e., the incident illumination slot center when the maximum position M2. 这样,可抑制随场所不同而变动的宽度,形成槽。 Thus, different properties can be suppressed with a width which varies a groove is formed.

而且,为了谋求照射至!j掛肚的激光束的脉冲能量密度的均匀化,也可以采用利用音圈机构10移动物镜6来移动焦点位置和利用可变衰减器2移动物镜6 Further, in order to seek to irradiate! J belly hanging pulse energy density of the laser beam is uniform, it can be employed using a voice coil mechanism 10 moves the focus position of the objective lens 6 is moved by a variable attenuator 2 and move the objective lens 6

来移动焦点位置的组合。 To move the focus position of the composition.

并且,激光束也可以是连续波。 Further, the laser beam may be a continuous wave. 用连续波激光束加工的情况下,用可变衰减器调节连续波湊i光束的功率,以便抑制使被加工面上的功率密度随入射位置 The case of using the continuous wave laser beam machining, adjust the continuous wave beam i Minato power with a variable attenuator, to inhibit that the working surface is a function of the power density of the incident position

o再者,例如在表面上形成有ITO膜的玻璃基!材才料的加工中,^!反尺寸有大型化的趋势。 o Further, for example, formed on the surface of the glass substrate with an ITO film! processing material before the material, ^! anti large size trend. 如果^t及成大型化、被加工区域变大,则如参照图13说明的那样, 在根据激光束的入射位置移动物镜6謝亍的加工中,有时物镜6的移动量会变大。 If the size of the ^ t and to, the region to be processed becomes large, as described in reference to FIG. 13, the movement amount becomes large according to the laser beam 6 is incident on the objective lens 6 position of the right foot Xie processing, sometimes the objective lens. 从控制容易的角度考虑,最好是物镜6的移动量较小。 From the viewpoint of easy control, which has a small amount of movement of the objective lens 6.

下面,参照图15说明在将物镜6的移动抑制在较短距离的情况下、可加大激光束焦点位置的移动距离的第3实施例的激光加工方法。 Referring to FIG 15 described in the case of moving the objective lens 6 is suppressed to a short distance, can increase the laser processing method of the third embodiment of the moving distance of the focus position of the laser beam.

在图15A所示的激光加工装置中,在图i2A所示的激光加工装置的物徵和电流扫描仪7之间追加了次级聚光透镜71。 In the laser processing apparatus shown in FIG. 15A, FIG i2A added between the secondary condenser lens 71 of the laser processing apparatus 7 was characterized and shown current scanners. 在图15A的说明中,将物镜6称为初级聚光透镜6。 In the description of FIG. 15A, the objective lens 6 will be referred to as primary condenser lens 6.

从开口部5a射出的激光束入射初级聚光透镜6 。 Primary beam is incident from the condenser lens 6 of the laser beam emitted from the opening portion 5a. 初级聚光透镜6将激光束聚光在假想的初级聚光面83上。 Primary condenser lens 6 the laser beam converging on an imaginary surface 83 in a primary optical concentrator. 通过了初级聚光面83的激光束成为发散光线束,入射次级聚光透镜71 。 By converging the laser beam of the primary surface 83 becomes diverging light beam, a condenser lens 71 enters the secondary. 由次级聚光透镜71会聚的激光束被电流扫描仪改变行进 By the secondary condensing lens condensing the laser beam 71 is changed to the traveling current scanner

方向,入射基板12。 Direction, the substrate 12 is incident.

接着,说明初级聚,镜6的移动量。 Next, a primary polyethylene, the amount of movement of the mirror 6. 使初级聚光面83接近次级聚光透镜71 时,由次级聚光透镜71会聚的激光束的焦点位置朝激光束行进的方向移动。 When the primary condensing surface 83 close to the secondary condenser lens 71, converged by the secondary condensing lens focal position of the laser beam 71 moves in the direction of travel of the laser beam. 设初级聚光面83的移动距离为dl、激光束的焦点移动距离为d2。 A moving distance of the condensing surface 83 is provided for primary dl, the focal distance of the laser beam is moved d2. 此外,对于入射次级聚,镜71的激光束的次级聚,镜71的数值孔径设为NA1,对于通过了次级聚光透镜71的会聚光束的次级聚,隨镜71的数值?L径设为NA2。 Further, the incident secondary polyethylene, the laser beam of the secondary mirror 71 together, the numerical aperture NA1 to the mirror 71, the secondary polymerization for converging beam by a secondary condenser lens 71, the mirror 71 with the value of? L diameter to NA2. 如果设备率为P = NA1 / NA2,则下式成立: If the device was P = NA1 / NA2, the following expression holds:

d2 二dl X P2 two dl X P2 d2

从上式可知,如果加大倍率,贝卿使缩短初级聚光面83的移动距离dl,也可以增加焦点的移动距离d2。 It is seen from the formula, if the magnification is increased, so that shortening of the primary shell Qing converging surface movement distance dl 83 may also increase the moving distance d2 of the focal point. 例如,倍率P为2的情况下,通过使初级聚光面83 接近次级聚光面2mm,能够使激光束的焦点向激光束的行进方向移动8mm。 For example, the magnification is 2 P by the primary condensing surface 83 close to the secondary condenser surface 2mm, the focal point of the laser beam can be moved 8mm traveling direction of the laser beam.

初级聚光面83的移动是通过将初级聚光透镜6向光轴方向移动进行。 Move the primary surface 83 is condensed by the primary condenser lens 6 is moved in the optical axis direction. 入射初级聚光透镜6的激光束是平行光线束时,初级聚光透镜6的移动距离和初级聚光面83的移动距离相等。 Primary laser beam is incident to the condenser lens 6 is a parallel light beam, a primary condenser lens moving distance from the surface 83 of the primary optical concentrator and 6 are equal. 如果移动初级聚光透镜6的距离为约2mm以下,则可以利用使用了压电驱动机构的直接驱动机构。 If the moving distance of the primary condenser lens 6 is about 2mm or less, it is possible to use a direct drive mechanism using a piezoelectric actuator. 通过利用使用了压电驱动机构的直接马区动机构来代替音圈机构IO ,可高M高精度地移动初级聚光透镜6 。 Instead of using the coil means by using direct IO horse region piezoelectric actuator mechanism can be moved with high accuracy high M primary condenser lens 6.

图16表示次级聚光透镜71的一结构例。 16 shows a configuration example of a secondary condenser lens 71. 次级聚光透镜71由多个透镜构成。 The secondary condenser lens 71 is constituted by a plurality of lenses. 物点So和像点Si具有共轭关系。 So the object point and the image point having a conjugate relationship Si. 该物点So相当于图15A所示的初级聚光面8让的光点位置。 So the object point corresponding to a primary condensing surface 15A of FIG 8 shown in position so that the light spot. 将该成像光学系统考虑为无限远共轭光学系统。 The imaging optical system is considered as infinite conjugate optical system. 将次级聚光透镜71 分割为前侧透镜组71a和后侧透镜组71b。 The front lens group 71a and the rear lens group 71 is divided into a secondary condenser lens 71b. 从物点So射出的光线束通过前侧透镜组71a成为平行光线束。 So from the light beam emitted from the object point through the front lens group 71a into a parallel light beam. 该平行光线ma过后侧透镜组71b在像点Si聚焦。 After the parallel light 71b ma-side lens group in the focused image point Si. 并且, 次级聚光透镜71有时不能进行物理分割,但这里可认为是假想的分割。 And the secondary condenser lens 71 may not be physically divided, but here can be considered an imaginary segmentation.

设前侧透镜组71a的前焦距为Ff、后侧透镜组71b的后焦距为Fr。 The front lens group 71a is provided in the front focal distance Ff, the rear lens group 71b of the back focal length Fr. 此时,由 At this time,

上述式子定义的倍率可表示为: P = Fr / Ff Ratio defined above equation may be expressed as: P = Fr / Ff

在图15A所示的激光加工装置中,初级聚光透镜6由凸透输勾成,但如图15B 所示也可以由凹透镜6a构成。 In the laser processing apparatus shown in FIG. 15A, the primary condenser lens 6 to hook the output convex lens, but as shown in FIG 15B may be constituted by a concave lens 6a. 此时,初级聚光面83a成为虚像,在比凹透镜6a更 In this case, the primary optical concentrator surface 83a becomes a virtual image, in more than the concave lens 6a

M激光源一侧出现。 M laser light source side appears.

如此地,通过加大倍率P,在依旧将初级聚光透镜6的移动距离抑制在较短的情况下,可较大地改变照射基板的激光束的焦点位置。 Thus, by increasing the magnification P, the moving distance is still the primary condenser lens 6 in the inhibition is short, can significantly change the focal position of the laser beam irradiation of the substrate. 为了达到有益效果, 较好是使倍率P邻以上,更好是4以上。 To achieve the beneficial effect, it is preferred that the ratio of P o or more, preferably 4 or more.

图13所示的光点91a、 91d斜向入射基板的激光束的光点,因此是椭圆形。 The light spot shown in FIG. 13 91a, 91d obliquely incident on the substrate of the light spot of the laser beam, and therefore is elliptical. 另一方面,光点91b是垂;! On the other hand, the light spot 91b is vertical;! A射基扳的激光束的光点,因此是圆形。 A pull-yl emitted laser beam spot, thus circular. 如此,根据激光束的入射位置,入射角不同,弓胞基扳上的光点形状不同。 Thus, depending on the incident position of the laser beam, different angles of incidence, different spot shape on the pull bow intracellular group.

如果光点为椭圆形,贝咖工出的孔的开口为椭圆形,如果是圆形,加工出的孔的开口为圆形。 If the spot is an oval opening, a shell work coffee elliptical hole, if the circular opening machined hole is circular. 但是,也有对任何入射位置、孔的开口具有相同形状的情况。 However, there are any incident position, where the opening hole has the same shape.

接着,参照图17说明可根据入射位置修正光点形状的第4实施例的激光加工装置。 Next, with reference to FIG. 17 illustrates the laser machining apparatus according to the fourth embodiment of the incident position of the spot shape correction.

图17所示的激光加工装置是,在图12A戶标的激光力旺装置中追加了使开口部5a绕与激光束的光轴垂直的轴旋转的开口部倾斜机构60a、和使开口部5a绕与激光束的光轴平行的轴旋转的开口部旋转机构61a。 The laser processing apparatus shown in FIG. 17 is added to the opening portion 5a around an axis of rotation perpendicular to the optical axis of the laser beam of the opening portion 60a in the reclining mechanism underlying Thang laser apparatus 12A in FIG households, and around the opening portion 5a an opening portion of the laser beam and the optical axis rotating mechanism parallel to the axis 61a.

而且,开口部旋转机构61a是与后面参照图22说明的激光加工装置所具有的遮光框旋转机构使遮光框旋转的结构相同的机构,使开口部5a绕与激光束的光车由平行的轴旋转。 Further, the opening portion of the rotating mechanism 61a is later with reference to the light shielding block rotation mechanism laser processing apparatus described has FIG. 22 that the same configuration mechanism shielding block rotation of the opening portion 5a around the laser beam light vehicle by a shaft parallel rotation.

开口細顷斜机构60a、开口部旋转机构61a分别根据从控制器li发送来的控制信号,与电流扫描仪7的动作同步地改变幵口部5a的、绕与激光束的光轴垂直的轴旋转的倾斜角和绕与激光束的光轴平行的轴旋转的旋转角。 Are fine diagonal opening mechanism 60a, the opening 61a of the rotating mechanism in accordance with a control signal transmitted from the controller to the li, the current operation of the scanner 7 and the mouth portion 5a Jian changes are in synchronization, about perpendicular to the optical axis of the laser beam inclination angle of rotation and a rotation angle about an axis parallel to the optical axis of the laser beam rotates.

比较激光束倾斜入射基板表面时的垂直于光轴的光束截面形状和基板表面上的光束截面形状。 Comparing the cross-sectional shape perpendicular to the laser beam when the substrate surface is obliquely incident on the substrate surface and the beam cross-sectional shape of the optical axis of the light beam. 基板表面上的光束截面形状是在基板表面和入射面的交线方向上拉伸垂直于光轴的光束截面形状而成的形状。 Cross-sectional shape of the beam on the substrate surface is stretched shape beam cross section perpendicular to an optical axis formed in the direction of intersection line of the incident surface and the substrate surface. 例如,如果圆形截面的激光束倾斜入射基板表面,则基板表面上的光朿截面成为在基板表面与入射面的交线方向较长的椭圆形。 For example, if the laser beam is obliquely incident on the circular section of the substrate surface, the light Bouquet cross section on the substrate surface become longer and the intersecting line of the substrate surface incident surface direction of the ellipse shape. 并且,入射角越大,基板表面的光点在交线方向更长的形状。 Further, the larger the incident angle, the light spot longer in the substrate surface direction of intersection line shape.

因此,将垂直于光轴的截面整形为具有适当的长轴与短轴之比的椭圆的激 Thus, the cross-section perpendicular to the optical axis of the elliptical shaped laser having an appropriate ratio of major and minor axes of the

光束,以其椭圆的长轴方向垂直于入射面的方式倾斜入射基板表面,可以使基 Beam long axis direction of the ellipse perpendicular to the incident surface of the manner obliquely incident surface of the substrate, the base can be

板表面的光点成为圆形。 Spot plate surface is circular.

图18A概略示出沿开口部倾斜机构60a的旋转轴方向看通过开口謝顷刹机构 FIG. 18A schematically shows the rotation axis direction along the opening portion 60a of the tilt mechanism are looking through the opening Frank brake mechanism

60a绕与激光束的光轴垂直的轴旋转的开口部5a时的图。 FIG. 60a around the opening portion 5a when rotating perpendicular to the optical axis of the laser beam. 从图左侧入射的激光朿lb由开口部5a整形其截面后向图右侧射出。 FIG laser light incident from the left side of the opening portion 5a Bouquet lb shaped cross section which is emitted to the right in FIG.

如图18B所示,用沿激光束光轴的视线看由幵口部倾斜机构60a旋转的开口部5a的圆形贯通孔62a时,是椭圆形。 18B, the line of sight along the laser beam with the optical axis is rotated by Jian see mouth portion 60a of the tilt mechanism portion 5a of the circular opening the through hole 62a, it is elliptical. 艮卩,激光束的截面被整形为椭圆形。 Gen Jie, the laser beam cross section is shaped as an ellipse.

并且,当包含开口部5a的圆形贯通孔的不同的2根直径的面与激光束的光轴正交时,激光束的截面被整形为圆形。 And, when the two different diameters of the through hole comprises a circular opening portion 5a of the surface perpendicular to the optical axis of the laser beam, the laser beam cross section is shaped circular. 使开口部5a倾斜,随着圆形贯通孔的旋转中心轴和激光束的光轴所成的角变大,整形后的光束截面的椭圆形短轴变短。 The inclination of the opening portion 5a, with the rotation center axis and the optical axis of the laser beam into a circular through-hole of the angle becomes large, the minor axis elliptical beam cross-section after shaping becomes short. 这样,开口部倾斜机构60a可改变整形后的光朿截面的长宽比。 Thus, the opening portion 60a may be inclined to change the aspect ratio of the optical mechanism section of the shaped Bouquet.

如图18C所示,a^用开口部旋转机构61a使开口部5a绕与激光束的光轴平行的轴旋转。 As shown in FIG. 18C, a ^ rotating mechanism 61a with the opening portion of the opening portion 5a and the optical axis of the laser beam around an axis parallel to the rotation.

激光束的光点成为最小的位置(称为激光束的焦点)的光束截面形状是椭圆形。 The laser beam spot becomes the minimum position (referred to as the focal point of the laser beam) of the beam cross-sectional shape is elliptical. 焦点处的光束截面的长轴方向与开口部5a的贯通孔位置的光束截面的短轴方向对应。 Minor-axis direction corresponding to the beam cross section of the through-hole and the position of the longitudinal direction of the opening portion 5a at the focal point of the beam cross section.

因此,用开口部旋转机构61a使开口部5a旋转,以使贯通?L位置的光束截面的椭圆的长轴方向与该交线方向相一致。 Thus, the opening 61a of the opening portion of the rotary mechanism portion 5a is rotated so that the through? Ellipse major axis direction L of beam cross section coincides with the position of the cross line direction. 这样,基板上的光点形状可以对任何入射位置都保持圆形。 Thus, the spot shape on the substrate may remain circular for any incident position.

说明了利用不需要使开口部的贯通?L在基板表面成像的聚光法的加工,但是,在利用使贯通孔的像成像在基板表面上的遮光框投穀去进行加工的情况下, 也可以修正基板上的光点形状。 Need not be described using the case where the opening portion of the through? L converging the processing method of the surface of the imaging substrate, however, that the use of the image forming light-shielding frame through hole administered valley on the substrate surface to be processed, and you can correct the spot shape on the substrate. 在遮光框投影法的情况下,在基板表面上形成的贯通孔像的长轴方向,与遮光框的贯通孔位置的光束截面的长轴方向对应。 In the case where the light-shielding frame projection method, the long axis direction of the through-hole image formed on the substrate surface, the beam cross section corresponding to the longitudinal direction of the through hole of the light shielding frame position.

使具有圆形贯通孔的遮光框绕与激光束的光轴相垂直的轴倾斜的结构是相同的。 The light shielding frame having a circular through-hole with the optical axis of the laser beam around an axis perpendicular to the inclined structure is the same. 但是,进一步使遮光框绕与激光束的光轴平行的轴旋转时,使贯通孔旋转成射出时的光束截面的椭圆形的敏由方向、与入射面和基板表面的交线方向相一致。 However, the light shielding block is further rotated about the axis parallel to the optical axis of the laser beam during the rotation of the through-hole into an elliptical beam cross-section when emitted by the sensitive direction, consistent with the direction of intersection line of the incident surface and the substrate surface.

说明了贯通孔的形状为圆的情况,但是,也可以修正由其它形状的贯通孔整形的激光束的光点形状。 Illustrates the shape of a circular through hole of the case, however, the correction may be the spot shape of the laser beam is shaped by the through holes of other shapes.

接着,参照图19说明进行使用了接M光框的激光加工法的第5实施例涉及的激光加工装置。 Next, with reference to FIG. 19 illustrates a laser processing apparatus according to a fifth embodiment using the optical contact block M laser working method. 图19所示的激光加工装置是,在图12 A所示的激光加工装置中追加了接,光框63。 The laser processing apparatus shown in FIG. 19 is additionally connected to the laser processing apparatus shown in FIG. 12 A, the light box 63.

接«光框63被接鹏光框保持机构64保持、且与對及12的表面平行地配 Then «Peng light box 63 is connected to the light holding mechanism 64 holding frame, and the counter and parallel to the surface 12 and the feature

置在基板12的正上方。 Placed directly above the substrate 12. 在接近遮光框63上形成有与要在基板表面上加工的形状相同形状的贯通孔。 To be processed is formed in the same shape on the substrate surface in the through-hole 63 near the shielding block. 接iffii光框63和基板12的表面之间的距离(接近间隔)dg 可以由接ifiii光框保持机构64调节。 Iffii contact distance between the surface 63 and the substrate 12 blocks light (close spacing) DG adjusting mechanism 64 can be held by the access ifiii light box.

扩束器3扩大从激光源谢出的激光束的光束直径,射出平行的激光束。 3 beam expander expanding the beam diameter of the laser beam from the laser source Xie, emits a laser beam parallel. 从扩束器3射出的激光束具有扩散角l3 0当通过扩束器3使激光束的光束直径例如扩大为10倍时,扩散角减小至十分之一。 Emitted from the beam expander 3 has a diffusion angle of the laser beam l3 0 when passing through the beam expander so that the beam diameter of the laser beam 3, for example, 10 times enlarged, the diffusion angle is reduced to one-tenth. 通过扩束器3可调整激光束的扩散角。 3 through the beam expander to adjust the diffusion angle of the laser beam.

一边用电流扫描仪7在接近遮光框63上扫描, 一边进行激光束的照射。 7 by the current while the scanner scans the light shielding box 63 in the approaching, while a laser beam is irradiated. 激光束通过接3M光框63的贯通孔后,入射到基板12,加工基板12。 After receiving the laser beam passes through the through hole 3M light box 63 is incident to the substrate 12, the substrate 12 processing. 在贯通空以的部分,激光束不通过,基板12不被加工。 In the through-space portion, the laser beam does not pass, the substrate 12 is not processed. 如此,通过转弓!具有接近遮光框63的贯通空形状,可加工^f反表面。 Thus, through the transfer bow! Having a light-shielding frame 63 through close empty shape, workability ^ f counter surface.

此时,即使激光束的入射位置改变,可以一边根据激光束对基板的入射位置移动物镜6的位置,抑制基板表面上的脉冲能量密度的变动,一ii3S行激光照射。 In this case, even if the position change of the incident laser beam, the laser beam may be incident side position of the substrate 6 moves the position of the objective lens, to suppress variation of the pulse energy density on the substrate surface, a row ii3S laser irradiation. 并且,激光源l也可以劍拙连续波激光束的器件。 Further, the laser source may be a sword Zhuo l continuous-wave laser beam device. 此时,能够抑制掛反表面上的功率密度的变动。 In this case, the power density variation can be suppressed to hang on the reverse surface.

为了进行高精度加工,有必要将接M光框63所具有的贯通孔形状正确地转印到基板上。 For precision machining, it is necessary to access the optical block M through hole 63 having a shape accurately transferred to the substrate. 转印的精度取决于接近间隔dg和照射到接iffil光框63的激光柬的扩散角。 Transfer depends on the accuracy and the approaching distance dg iffil light irradiated to the contact angle of the laser diffusing block 63 Cambodia. 照射到接ifii光框63的激光束的扩散角,可以认为与通过扩束器3时 Diffusion angle of the laser beam irradiated to the optical pick ifii block 63 may be considered through the beam expander 3

的激光束的扩散角0相等。 Diffusion angle of the laser beam is equal to 0.

图20示出对具有T字状贯通孔的接近遮光框模拟了转印精度如何取决于接 Figure 20 shows a proximity light-shielding frame has a T-shaped through hole transfer accuracy depending on how the analog ground

近间隔和激光束扩散角而变化的结果。 The results closely spaced and diffusion angle of the laser beam varies. 并列示出将接近间隔和激光朿的扩散角进行多种改变时的T字状贯通孔的像97。 And lists the spacer and the proximity of the diffusion angle of the laser Bouquet T-shaped through hole 97 when a plurality of image change. 各图中,配置在右侧的激光束扩散角小, In the drawings, disposed on the right side of the small diffusion angle of the laser beam,

酉己置在下侧的接近间隔小。 Unitary has opposite side near the lower small interval.

像97的边缘越明确,转印的精度越高。 Like the more clear the edge 97, the higher the accuracy of the transfer. 从图中可知,相同扩散角的情况下, 接近间隔越大贝啭印精度越差。 From the figure, a case where the same divergence angle, approaching distance greater accuracy Kai warble worse. 此外,相同的接近间隔的情况下,扩散角越大, 则转印的精度越差。 In addition, the same case close spacing, the greater the diffusion angle, the poorer the accuracy of the transfer. 接近间隔和扩散角都越小,则能够使转印精度越高。 Diffusion close spacing and angles are smaller, the transfer accuracy can be made higher.

图21榔咯示出要确保某一转印精度时接近间隔和激光束的扩散角必须满足的关系曲线。 Figure 21 shows a slightly palm transfer accuracy to ensure a close spacing and divergence angle of the laser beam must satisfy the relation curve. 要确保某一转印精度时,如果接近间隔大,则扩散角必须变小, 此外,如果扩散角变大,贝赎近间隔必须变小。 To ensure that a transfer accuracy, if the proximity distance is large, the diffusion angle becomes to be smaller, in addition, if the diffusion angle becomes large, closely spaced redemption must shell becomes small.

如果事先对各种转印精度求出图21所示的接近间隔和激光束的扩散角必须满足的关系,要以期望的转印精度进行加工时,可简便i鹏定接近间隔和扩散角。 If the transfer accuracy is obtained in advance for various intervals and the spread angle of the laser beam approaching shown in FIG. 21 must satisfy the relationship, is to be processed to a desired transfer accuracy, it can be simply set close to the interval i Peng and diffusion angle. 在利用接M光框的激光加工方法中,具有将接近间隔和扩散角设定成较小、能够以高的转印精度进行加工的优点。 In the laser processing method using a light box contact M having a close spacing and the diffusion angle is set to be small, it can be processed at high transfer accuracy. 此外,通过在基板的被加工位置的正上方配置接近遮光框的贯通?L3S行加工,能够获得高的定位精度。 Further, by arranging the light shielding frame near the machining position over the substrate through n? L3S line processing, it is possible to obtain a high positioning accuracy. 在被加工位置以外部分,由接近遮光框覆盖着基板表面,因此,具有在加工时基板被削而产生的飞散物难以附着在^l及表面上的优点。 In the portion other than the processing position, by the proximity of the substrate surface covered with the light shielding frame, and therefore, has an advantage in the processing of the substrate is cut to produce scattering it was difficult to adhere to the surface and ^ l.

而且,将通过了接,光框的贯通孔的激光束照射至'Mt反上进行加工时, 通过用电流扫描仪改变激光束的行迸方向来迸行激光束对基板的入射位置的移动,同移动放置了基板的XY工作台来进行入射位置的移动的情况相比,可实现加工的高速化。 Furthermore, through the connection, laser beam irradiation through hole light box to 'during processing on Mt trans, by changing the laser beam with the current scanner row Beng direction into line moving the laser beam incident position of the substrate, moving the XY stage with the substrate placed to the mobile incident position compared to the high-speed processing can be achieved.

接着,参照图22A说明具有激振连续波激光束的激光源的第6实施例涉及的 Next, with reference to FIG 22A described sixth embodiment the excitation laser light source having a continuous wave laser beam according to

激光加工装置。 The laser processing apparatus. 作为激振连续波激光束的激光源l,例如可使用激振具有红外线段波长的激光束的半导体激光器。 As the excitation laser beam of a continuous wave laser light source l, for example, a semiconductor laser excitation using a laser beam of infrared-wavelength.

从激光源谢出的激光束lb0入射到分配光学系统65。 Xie out from the laser source lb0 laser beam incident on the splitting optical system 65. 分配光学系统65在某—吋间带将激光束lbO分配给沿某光轴行进的激光束M ,在其他时间带将激光束lb0分配给沿其它光轴行进的激光束lb2。 The optical system 65 in a dispensing - inch between the band allocated to lbO laser beam travels along an optical axis of the laser beam M, at other times with the laser beam in the other lb0 assigned to the optical axis of the laser beam traveling lb2.

分配光学系统65例如包括半波片65a、显示波克尔斯效应(光电效应)的电光元f^5b、偏振片65c而构成。 The optical system 65 comprises, for example, dispensing a half-wave plate 65a, the electro-optical Pockels effect display (photoelectric effect) element f ^ 5b, a polarizing plate 65c is configured. 半波片65a使从激光源l射出的激光束lb0成为直线偏振光,以便对偏振片65c成为P波。 Half-wave plate 65a the laser beam emitted from the laser source lb0 l linearly polarized light to become P-wave polarizing plate 65c. 该P波入射到电光元^65b。 The P wave is incident to the electro-optical element ^ 65b.

电光元件65b根据从控制器ll发送的契机信号sig使激光束的偏光轴旋转。 Electro-optical element 65b in accordance with an opportunity to signal the laser beam transmitted from the controller ll sig polarization axis. 电光元ft65b处于未施加电压的状态时,电光元ft65b使P波的偏振面旋转9(T 。 由此,从电光元件65b射出的激光束对于偏振片65c成为S波。 The electro-optical element ft65b state when no voltage is applied, the electro-optical element ft65b P wave polarization plane rotation 9 (T. Thus, light emitted from the electro-optical element 65b for the laser beam is the S-wave polarizing plate 65c.

偏振片65c使P波直接通过,但反射S波。 The P-wave polarizer 65c directly through, but reflects the S waves. 由偏振片65c反射的S波即激光束lbl,入射到成为激光束的终端的光束挡板66。 S wave reflected by the polarizer 65c i.e. a laser beam lbl, becomes incident on the beam damper 66 of the terminal laser beam. 透过偏振片65c的P波即激光束lb2 入射到扩束器3。 Through P-wave plate 65c, i.e., the laser beam is incident on the beam expander lb2 3.

通过扩束器3扩大光束直径后成为平行光的激光束lb2入射到具有矩形贯通孔的遮光框5。 After the beam diameter expanded by a beam expander 3 into parallel light of laser beams incident on the light-shielding lb2 block 5 has a rectangular through hole. 在此,说明禾鹏遮光框投影法进行加工的例子。 Here, an example of processing of the light shielding block Wo Peng projection. 艮P,遮光框5的贯通孔的像成像在^l及12的表面,进行加工。 Gen P, the light shielding frame through holes in the surface of the image forming 5 ^ l and 12 for processing.

遮光框旋转机构61用于使遮光框5绕与激光束的光轴平行的轴旋转。 The light shielding frame rotating mechanism 61 for rotating the light-shielding frame 5 about an axis parallel to the optical axis of the laser beam. 遮光框旋转机构61例如包含测角器构成,根据从控制器ll送出的控制信号,在期望的时亥鞭遮光框仅旋转期望的角度。 Shielding block comprises a rotating mechanism 61 e.g. goniometer configuration, in accordance with a control signal sent from the controller ll, at a desired time frame Hai whip shielding only a desired angle of rotation. 对于遮光框旋转机构61,在后面详述。 For the light shielding frame rotating mechanism 61, described later. 音圈机构9使遮光框5的位置与激光束的行进方向平行地移动。 The light shielding coil frame movement mechanism 9 in parallel to the traveling direction of the laser beam position 5.

从遮光框5射出的激光朿lb2由物镜6聚光。 Emitted from the laser light-shielding frame 5 Bouquet lb2 condensed by the objective lens 6. 音圈机构10使物镜6的位置与激光束的行进方向平行地移动。 Coil means 10 the position of the traveling direction of the laser beam of the objective lens 6 is moved in parallel. 从物镜6射出的激光束通过电流扫描仪7后,入射基板12的表面。 The laser beam emitted from the objective lens 6 from the rear surface of the current scanner 7, 12 is incident through the substrate.

参照图22B说明作为加工对象物的基板12。 Referring to FIG 22B described substrate 12 as the object. 在衬底层110的表面上存在着转印层l 11 。 L 11 there is a transfer layer on a surface of the substrate layer 110. 该转印层l 11具有加热后与衬底层l IO的表面粘接的性质。 The transfer layer has a surface adhesive properties l 11 and l IO substrate layer after heating.

例如,通过用激光照射转印层lll的一部分llla进行加热,使其与衬底层1110粘接。 For example, a portion heated by irradiation with laser light llla lll the transfer layer, the substrate layer 1110 so that an adhesive. 除去转印层lll中未加热的部分lllb后,在衬底层110的表面上只剩下被加热的部分illa。 After the transfer layer in the non-heated part lll lllb removed, on the surface of the substrate layer 110 only partially illa heated. 这与例如进行热转印式打印时墨带的被加热部分的墨转印至慨上的情况相似。 This is for example the thermal transfer printer when the ink ribbon is transferred to the heated portion of the ink similarly to the case on the generous.

返回图22A继续说明。 Returning to FIG. 22A is continued. XY工作台8a被用作SI反12的保持台。 XY table 8a is used as the counter-holder table 12 SI. XY工作台8a能够使基板12在与基板12的表面相平行的二维面内移动。 XY table 8a of the substrate 12 can be moved in the two-dimensional plane of the surface of the substrate 12 parallel. 通过控制器l 1控制XY工作台8a,使對及12在期望的时刻移动到期望位置。 By controlling the XY stage controller 8a l 1, 12 and so on at a desired time to a desired position.

这里说明的激光加工方法的例子中,电流扫描仪7的X用扫描仪7a和Y用扫描仪7b被固定在使从电流扫描仪7射出的激光束垂直入射基板12的位置。 Examples of the laser processing method described herein, the current 7b of the scanner X 7 is fixed in position so that the laser beam is perpendicularly incident on the substrate from the current scanner 7 emitted by the scanner 12 and the Y-scanner 7a. 通过用XY 扫描仪8a移动繊12,可移动激光束对SI反12的入射位置。 By 12, the movable position of the incident laser beam 12 with the SI anti 8a moves the XY scanner Xian.

利用音圈机构9、 10设定从遮光框5至嗍镜6的光路长度和从物镜6至隨板12 的激光束入射位置的光路长度,以便使遮光框5的贯通孔的像以期望的成像倍率(縮小率)成像在基板12的表面上。 A voice coil mechanism 9, 10 is set from the shielding block the optical path length of 5 to sulfon mirror 6 and the objective lens the optical path length of the laser beam incident position 6 with the plate 12, so that the light shielding frame through hole 5 as desired imaging magnification (reduction ratio) imaged on the surface of the substrate 12.

参照图23说明分配光学系统的控制方法。 Referring to FIG. 23 illustrates a control method of an optical distribution system. 图23示出契机信号sig、激光束lbO、 lbl、 lb2的时序图的一例。 Figure 23 shows an opportunity to signal sig, the laser beam lbO, lbl, lb2 the example of a time chart. 在吋刻tO,开始激光束lbO的射出。 In engraved inch tO, the laser beam emitted lbO start.

从时刻tO至时亥ijtl,从控制器未送出契机信号sig。 From time to time tO Hai ijtl, not sent from the controller opportunity signal sig. 在这期间,电光元件上不施加电压,从分配光学系统始终射出激光束ib2。 During this period, no voltage is applied on the electro-optical element, from the distribution of the optical system of the laser beam is always emitted ib2. 不射出激光束lbl。 It does not emit a laser beam lbl. 这期间的激光束lb2是连续波。 Lb2 which the laser beam is a continuous wave period.

从时亥ijtl至时刻t2,与控第ij器周期性地发出的契机信号sig同步,在分配光 To time t2, the signal sig opportunity periodically sends the controller from when the first synchronized ij Hai ijtl, the light distribution

学系统的电光元件上施加电压。 Voltage is applied to the electro-optical element of the optical system.

在送出契机信号sig期间,电光元件处于电压施加状态,激光朿lbO被分配给激光束lbl。 During sending opportunity signal SIG, a voltage applied state in the electro-optical element, the laser being assigned to a Bouquet lbO laser beam lbl. 另一方面,在不送出契机信号sig期间,电光元件处于电压未施加状态,激光束lb0被分配给激光束lb2。 On the other hand, during the signal SIG is not sending opportunity, the electro-optical element is in a state no voltage is applied, the laser beam is assigned to a laser beam lb0 lb2. 从时刻tl到寸刻t2期间的激光束lb2成 The laser beam during the time from tl to t2 lb2 inch carved into

为周期性地重复激振和停止的激光束。 To periodically repeat the excitation and the laser beam stop. 该间歇地射出的激光束lb2中,通过调节契机信号sig可将脉冲宽度wl和周期w2设定为任意长度。 Lb2 the laser beam is intermittently emitted, the signal sig opportunity by adjusting the pulse width can be set wl and w2 period of any length. 例如脉冲宽度wl设为10us〜数十us、周期w2设为100y Wl pulse width is set to, for example, several tens 10us~ us, w2 period set 100y

S o S o

这样,向分配光学系统不输入契机信号时,可获得连续射出的激光束lb2; In this way, the optical system is not allocated to the input signal opportunity to be obtained continuously emitted laser beam Lb2;

向分配光学系统间歇地输入契机信号时,可获得间曷幼拙的脉冲激光束lb2。 When the signal input to the opportunity for intermittently dispensing an optical system can be obtained between Camps clumsy immature pulsed laser beam lb2. 并且,连续射出的激光束lb2可连续地照射SM,因此,例如适用于形成线 Further, the continuous laser beam emitted continuously irradiated lb2 SM, therefore, suitable for forming line e.g.

状的加工(在衬底层上留下线状转印层的加工)。 Shaped processing (processing to leave linear transfer layer on the substrate layer). 另一方面,间ltl寸出的激光束 On the other hand, between the laser beam inch ltl

1b2间歇地照射凝反,因此,例如适用于形成点状的加工(在衬底层上留下点状的转印层的加工)。 Anti-coagulation 1b2 intermittently irradiated, thus, for example, (left point of the processing on the underlayer transfer layer) suitable for forming a dot processing.

参照图24说明线形加工的方法。 Referring to FIG. 24 illustrates a method of processing line. 开始对基板12的激光照身寸,开始加工。 Inch body for laser as the substrate 12, the processing starts. 加工开始时,首先,线103的一端的針宽度上的区i或,被矩形激光束93照射。 When processing is started, first, the i region of the pin end of the line width of 103 or 93 is irradiated with a rectangular laser beam. 其后, 一鹏续地照射激光,一边将XY工作台向一个方向移动,使光点朝着线103 的另一端移动。 Thereafter, a laser beam is irradiated continuously Peng, while moving the XY stage in one direction, the light spot moves toward the other end of the line 103. XY工作台的移动方向与矩形光点93的某一边平行。 A rectangular light spot moving direction of the XY stage 93 in a parallel side. 用箭头示出基板上的光点的移动方向。 The arrows show the direction of movement by the light spot on the substrate.

当光点到达线103的另一端时,停止对SM的激光照射,结束加工。 When the light spot reaches the other end of the line 103, the laser irradiation is stopped on the SM, the processing ends. 这样, 通过用激光照射加热基板表面的线状区域,在衬底层的表面形成线状地残留了转印层的銜03。 Thus, by heating the surface of the substrate is irradiated with a laser linear region, to form a linear residue 03 of title transfer layer on the surface of the substrate layer.

形成的线103的外形是如下的矩形:长度方向的边与光点93的某一边平行, 宽度方向的边与同光点93的某一边相垂直的边平行。 Contour line 103 is formed in a rectangular follows: a side edge of the light spot 93 is parallel to the longitudinal direction, a light spot with the same side edge in the width direction 93 perpendicular to the parallel sides. 线103的宽度与同光点93的某一边垂直的边的长度相等。 With the same width of the light spot equal to the length of a line 103 perpendicular to the side edges 93.

参照图24B说明点加工方法。 Referring to FIG 24B described point processing method. 在点加工中, 一边向基板12间歇地ml寸激光束, 一边将XY工作台向一个方向移动。 In point processing, while, while the XY table is moved in one direction to the substrate 12 is intermittently ml inch laser beam. XY工作台的移动方向与矩形光点94a的某一边(禾尔为边p)平行。 The moving direction of the XY stage with a rectangular light spot 94a is a side (side of Seoul Wo p) in parallel.

首先,开始第一个脉冲的激光照射时,点104a的一端的整个宽度上的区域被矩形的光点94a照射。 First, at the beginning of a pulse laser irradiation, the irradiation spot area 94a over the entire width of the end point 104a are rectangular. 由于XY工作台正在移动,因此,直到i^m—个脉冲的激光照射结束,光点在基既匕移动。 Since the XY table is moved, until the end of laser irradiation pulses i ^ m-, dagger moving the light spot in both groups. 用箭头示出光点的移动方向。 The arrows show the direction of movement by the light spot.

这样,基板表面的点状区域通过激光照射被力喊"在衬底层的表面形成点状地残留了转印层的点104a。 Thus, dot-like areas of the substrate surface is irradiated by a laser power shouting "formed on the surface of the substrate layer remaining point dot shape transfer layer 104a.

以后同样地,通过第二、第三、第四、第五个脉冲的激光照射,分别形成点104b、 104c、 104d、飾。 Hereinafter, similarly, the second, third, fourth, fifth pulse laser irradiation, are formed points 104b, 104c, 104d, ornaments. 并且,在第二、第三、第四、第五个脉沖的照射开始时光点94b、 94c、 94d、 94e分另鹏射的對及表面的区域,与将光点94a所照射的基板表面的区域,同XY工作台的移动方向相平行地移动的区域相一致。 Further, in the second, third, fourth, fifth irradiation start time point of the pulse 94b, 94c, 94d, 94e and the subregion of the surface of another Peng emitted, and the light spot 94a irradiated substrate surface region, moving parallel to the moving direction of the XY stage with the regions coincide. 各点排列在与XY工作台的移动方向平行的直线上。 Points arranged in a line parallel to the moving direction of the XY stage.

各点的外形是具有与光点94a的边p平行的边、以及与同光点94a的边p相垂直的边(称为边q)平行的边的矩形。 Each point is an edge shape having sides parallel to the p of the light spot 94a, and a p-side with the light spot 94a perpendicular to the edge (referred to as edge q) parallel to the edge of the rectangle.

各点的、与XY工作台的移动方向垂直的边的长度,与边q的长度相等例如边q的长度为20um时,该长度为20ura。 , Length of the side perpendicular to the moving direction of the XY stage, with q equal length sides, for example, the length of each side of the point of q is 20um, the length 20ura.

各点的、与XY工作台的移动方向平行的边的长度,取决于光点的边p的长度、 XY工作台的边p的长度、以及脉冲的照射时间(脉冲宽度)。 Each point, parallel to the moving direction of the XY stage side length, depending on the length of the edges p of the light spot, the length p of the side of the XY table, and the pulse irradiation time (pulse width).

例如,设光点的边P的长度为12ym、 XY工作台的移动速度为800mm/s、脉冲宽度为10"s。在脉冲宽度10Ps期间,XY工作台移动的距离(即基板移动的距离)是8um,因此,点的、与XY工作台的移动方向平行的边的长度,是光点的边P的长度12 U ra加上移动距离8 ym的20 um。 For example, the length of the side of the light spot P is provided 12ym, the moving speed of the XY stage is 800mm / s, a pulse width of 10 "s. 10Ps during the pulse width, the XY stage moving distance (i.e. the distance of substrate movement) 8um is, therefore, the point, parallel to the moving direction of the XY stage side length, P is the length of a side of the light spot 12 U ra plus a moving distance of 20 um 8 ym.

邻接点之间的间距d,在脉冲的一个周期期间与XY工作台移动的距离一致。 Distance d between the adjacent points, consistent with the movement distance of the XY stage during a period of the pulse. 例如,脉冲的周期为375iis、 XY工作台的移动速度为800mm/s时,间距d为300u m。 For example, for the period of the pulse 375iis, the moving speed of the XY stage is 800mm / s, the distance d is 300u m.

总结以上内容,当将光点的尺寸设定为边P长度为12pm、边q长度为20詣, 以脉冲宽度10us、周期375ys激振激光,并且使XY工作台以800mm/s的速度移动的情况下,可用3(X3 um的间距形成20 um角的点。 Summarized above, when the size of the light spot P side is set to be a length of 12pm, length of sides 20 q Yi, pulse width of 10us, the excitation laser 375ys period, and the XY stage speed of 800mm / s moving case, the available 3 (X3 um 20 um pitch angle point is formed.

有时要在基l肚加工具有分另怀同的方向的多个线。 Sometimes having a plurality of line with the other points in the direction of the pregnant l-yl belly processing. 但是,如果在固定基板上的光点的方向的情况下形成不同方向的线,会产生根据线的方向线宽变化的问题。 However, if the lines are formed in different directions in the case where the direction of the light spot on the fixed substrate, line width variation causes a problem depending on the direction of the line.

参照图29说明这种状况的一例。 Referring to FIG. 29 illustrates an example of such a situation. 利用参照图24A说明的方法,首先形成线109a。 Referring to FIG 24A using the method described, firstly forming line 109a. 接着,不改变光点的方向,形成具有与线109a不同的方向的线109b。 Next, without changing the direction of the light spot formed wire line 109a and 109b having different directions. 激光照射开始时,光点99照射到线109b的一端。 When the start of laser irradiation, irradiation spot 99 to the end of the wire 109b. 一边在线109b的长度方向移动XY 工作台, 一边将光点移动到线109b的另一端,形成线109b。 Moving the XY stage 109b side of the longitudinal direction of the line, while the other end of the light spot is moved to the line 109b, line 109b is formed.

如图所示,线109a的宽度与光点99的长边的长度相等,但是,线i09b的宽度不一定与该长边的长度相等。 As shown, the length of the long side 109a of the line width of the light spot 99 is equal, however, the line width is not necessarily equal to the length i09b of the long sides. 此外,线109b的端部的边,不能与线的长度方向垂直。 Further, the side ends 109b of the line, not perpendicular to the longitudinal direction of the line. 通过使用图22A所示的遮光框旋转机构61,可避免这样的问题。 Shielding block rotation mechanism 61 as shown by FIG 22A, can avoid such problems.

图25是示出保持了具有矩形贯通孔62的遮光框5的遮光框旋转机构61的概略图。 FIG 25 is a diagram showing a light shielding frame holding the rotating mechanism 62 has a rectangular through-hole of the light shielding frame 61 of FIG. 5 schematic. 包含矩形贯通孔62的2l歐寸角线的面相对于激光束的光轴是垂直的。 Hole 62 comprises a rectangular through 2l European inch diagonal surface to the optical axis of the laser beam is vertical. 遮光 Shading

框旋转机构61使遮光框5以贯通孔62的矩形的对角线交点为旋转中心、绕与激光束的光轴平行的轴旋转。 Frame rotating mechanism 61 so that the light-shielding frame 5 through the intersection of diagonals in the rectangular hole 62 as a rotation center, about the laser beam parallel to the optical axis.

与遮光框5的旋转对应,在基板12的表面内贯通孔62的像旋转。 It corresponds to the rotation of the light shielding frame 5, the through hole 62 in the surface of the substrate 12 of the image rotation. 基板i:的贯通孔62的矩形像的边,可以与基板表面内的任意方向平行。 Substrate, i: a through hole 62 sides of the rectangular image to be any direction in parallel to the substrate surface.

如以下说明,为了改变加工的线等的方向,在改变基板上的激光束入射位置的移动方向之前,可禾拥遮光框旋转机构61来旋转遮光框5。 As described below, in order to change the direction of the processing line or the like, the laser light on the substrate prior to changing the direction of the incident beam shift position, you can hold the light-shielding block Wo rotating mechanism 61 to rotate the shielding frame 5.

参照图26说明使用了遮光框旋转机构的线加工方法。 Referring to FIG. 26 illustrates a method using a line forming a light-shielding box rotation mechanism. 利用参照图24A说明的方法,形成线103a。 Using the method described with reference to FIG. 24A, the forming line 103a. 光点93a的长边的长度与线103a的长度相等,光点93a的短边方向与线103a的长度方向平行。 Line 103a equal to the length of a long side of the light spot 93a, 93a parallel to the longitudinal direction of the light spot in the short-side direction of line 103a.

在开始加工具有与线103a不同方向的线103b之前,通M光框旋转机构旋转遮光框,使光点93b的短边与线103b的长度方向平行。 Before starting processing line 103a and 103b having different direction of the line, through the light box rotation mechanism M shielding frame 93b so that the short side of the light spot parallel to the longitudinal direction of the line 103b. 然后,通过XY工作台移动基板,以便在线103b的一端的整个宽度上照射光点。 Then, the XY stage by moving the substrate so that the entire line width of the irradiation light spot on an end 103b.

幵始激光束的照射,利用与参照图24A说明的工序相同的工序, 一边在线103b的长度方向移动XY工作台,一边形成线103b。 It starts its irradiating laser beam, with reference to FIG 24A using the same processes described, while moving the XY stage longitudinal direction line 103b, while forming line 103b. 线103b的宽度与光点93b的长边的长度相等。 The line width of the light spot 103b is equal to the length of the long side 93b,. 此外,线103b的宽度方向的边和长度方向的边相垂直。 Furthermore, side edges and longitudinal direction of the line width direction 103b perpendicular.

这样,可以按相同宽度形成具有分另怀同的方向的多个线。 Thus, a plurality of lines can be formed having the same direction of the other points of the arms of the same width. 并且,为了不改变大小、形状地形成具有不同方向的多个点,也可以使用遮光框旋转机构。 Further, in order not to change the size, shape having a plurality of dots formed in different directions, you may be used a light-shielding box rotation mechanism.

说明了禾!佣周期性的契机信号控制分配光学系统、将激光束脉冲化的例子, 但契机信号也可以不是周期性的。 DESCRIPTION Wo! Opportunity commission periodic control signal splitting optical system, the laser beam pulses of example, but may be not opportunity for periodic signals. 例如,要用不相等的间距形成多个点时,可以使用非周期性的契机信号。 For example, not to use a plurality of points at equal intervals, the opportunity can be used aperiodic signal. 此外,激光束的脉冲宽度也可以不恒定。 Further, the pulse width of the laser beam may not be constant. 根据形i^的点的尺寸适当设定即可。 The size of the dot-shaped appropriately set i ^.

通过改变斟肚的光点的形状和大小,可调节线的宽度和点的大小等。 By changing the shape and size of the spot of the belly of the pour, may adjust the size of the line width and the like of the point. 通ilii光框的交换,可改变光点的形状和大小。 Ilii exchange through the light box, can change the shape and size of the light spot. 此外,通过改变成像倍率(缩小率),可改变光点的大小。 Further, by changing the imaging magnification (reduction ratio), you can change the size of the light spot.

说明了在基板表面上线状或点状地留下转印层的加工的例子,但是,也可以是利用激光照射SI反表面被掘成线状或点状的加工。 Illustrates an example of a dot shape or a linear transfer layer is processed to leave on the substrate surface, however, it may be irradiated with a laser counter surface SI is dug into processing lines or dots.

遮光框的贯通空的形状不限于矩形,根据要形成的点或线的形状适当选择即可。 Empty shape of the through light-shielding frame is not limited to a rectangle, can be appropriately selected depending on the shape of points or lines to be formed.

说明了禾,XY工作台移动基feJ:的激光束的入射位置的例子,但是,还可以通过用电流扫描仪改变激光束附于进方向,来移动入射位置。 Wo described, XY table moving substrate feJ: Examples of the incident position of the laser beam, but also by changing the laser beam scanner is attached to the forward current direction to move the incident position.

接着,参照歐7A说明具都台激光源、其中l台激光源射出脉冲激光束而另 Next, while the other described with reference to European 7A are laser source, wherein the laser source l emits a pulse laser beam

i台激光源射出连续波激光束的第7实施例涉及的激光加工^a。 i laser source emits a continuous wave laser beam of a laser processing according to a seventh embodiment ^ a.

激光源la例如是包含波长变换组件的Nd: YAG激光振荡器,射出Ncl:YAG激光器的第四高频波(波长为266咖)的脉冲激光束。 La e.g. Nd laser light source comprising a wavelength converting components: YAG laser oscillator emits Ncl: a fourth high-frequency wave of the YAG laser (wavelength of coffee 266) is a pulsed laser beam. 脉冲宽度例如是10ns。 For example, pulse width 10ns. 激光源la射出的脉冲激光束入射到半波片69a,成为对偏振片67为P波的直线偏光。 La the laser light source emits a pulsed laser beam is incident to the half wave plate 69a, the polarizing plate 67 to become linearly polarized light is P-wave.

激光源lb例如是半导体激光振荡器,射出波长为808nni的连续波激光朿。 Lb laser light source is a semiconductor laser oscillator, a continuous wave laser emitting a wavelength of Bouquet 808nni. 激光源lb射出的连续波激光束入射到半波片69b,成为对偏振片67为S波的直线偏光。 Lb laser light source emits continuous wave laser beam is incident to the half wave plate 69b, the polarizing plate 67 on the linear polarization of the S wave.

从半波片69a射出的脉冲激光束,通过扩大光束直径后成为平行光的扩束器3a和具有例如矩形的贯通孔的遮光框5后,以入射角45。 After the pulsed laser beam 69a emitted from the half-wave plate, the beam diameter enlarged by the beam expander becomes parallel light shielding frame 3a and the through hole 5 having a rectangular shape, for example, to 45 incidence angle. 入射偏振片67的表面侧的面。 Incident surface side face plate 67.

从半波片69b射出的连续波激光束,通过扩大光束直径后成为平行光的扩束器3b后,被返回反射镜68反射,以入射角45°入射偏振片67的里侧的面。 From a continuous wave laser beam 69b emitted from the half-wave plate, the beam diameter enlarged by the beam expander 3b become parallel light, is reflected return mirror 68 at an incident angle of 45 ° back side surface plate 67 is incident.

偏振片67使作为P波的脉冲激光束透过、并反射作为S波的连续波激光束。 A polarizing plate 67 serving as a pulse laser beam transmitted through the P-wave and a continuous wave laser beam reflected S wave. 通过偏振片67,从激光源la射出的脉冲激光束和从激光源lb射出的连续波激光 Through the polarizer 67, light emitted from the laser light source la and the pulse laser beam emitted from the laser light source is a continuous wave laser lb

束在相同的光轴上重叠。 Beam is superimposed on the same optical axis.

透过偏振片67的脉冲激光束和被偏振片67反射的连续波激光束,由物镜6 Pulsed laser beam transmitted through the polarizer 67 and the polarizer 67 of the continuous wave laser beam reflected by the objective lens 6

聚光后通过电流扫描仪7,入射到基板12。 After concentrating the current through the scanner 7, is incident to the substrate 12.

作为基板12的保持台使用的XY工作台8a可使^^12在与基板12的表面平行的二维面内移动。 As the XY table 8a of the substrate holding table 12 can be used ^^ 12 moves within the two-dimensional plane parallel to the surface of the substrate 12. 由控制器ll控制XY工作台8a,在期望的时亥!j将基板l滩动到期望位置。 Controlled by the controller ll XY table 8a, when the desired Hai! L J Beach movable substrate to a desired position.

在此说明的激光加工方法的例子中,电流扫描仪7的X用扫描仪7a和糊扫描仪7b被固定在使从电流扫描仪7射出的激光束垂直入射基板12的位置。 In the example of laser processing method described here, the current 7b of the scanner X 7 is fixed in position so that the laser beam is perpendicularly incident on the substrate from the current scanner 7 emitted by the scanner 12 and paste 7a scanner. 通过用XY 工作台8a移动SI及12,可移动激光束对基板12的入射位置。 XY table 8a moving by treatment with SI and 12, the movable position of the laser beam incident on the substrate 12.

音圈机构9、 10分别将遮光框5和物镜6的位置、与从激光源la射出的脉冲激光束的行进方向平行地移动。 Coil means 9, 10 respectively, the light blocking position of the objective lens 6 and the frame 5, the movement of the traveling direction of the pulse laser beam emitted from the laser source parallel to la. 通过调节遮光框5和物镜6的位置,使遮光框5的贯通孔的像以期望的成像倍率(縮小率)成像在-繊12的表面上。 By adjusting the position of the light shielding frame 5 and the objective lens 6, the light shielding frame through hole 5 in the image to a desired imaging magnification (reduction ratio) imaging - the upper surface 12 of Xian.

参照图27B说明作为加工对象的基板12。 27B described with reference to FIG. 12 of the substrate as the processing object. 在衬底层120的表面上形成有表层121。 Is formed on a surface of the substrate layer 120 has a surface 121. 衬底层120例如是液晶显示装置的滤色器,是厚度为ltim的、由聚酰亚胺类树脂或丙烯类树脂等构成的树脂层。 Substrate layer 120, for example, a liquid crystal display device of a color filter, a thickness of ltim, a resin layer composed of polyimide resin or an acrylic resin composed. 表层121例如是厚度为0. 5 wm的ITO膜。 For example, the surface layer 121 having a thickness of 0. 5 wm ITO film. 通过激光照射仅去除表层121的情况下,衬底层120比表层121更容易被加 A case where the surface 121 is removed by laser irradiation only, substrate layer 120 than the surface 121 to be more easily applied

工,因此,难以仅加工表层m。 Work, therefore, is difficult to process the surface only m. 例如,向基板照射了激光时,在表层m未直 For example, a laser beam is irradiated onto the substrate, the surface is not straight m

接被加工咖寸候,因传导到衬底层120的热的影响,衬底层120会爆发式飞散, Then waiting to be processed coffee inch, due to the influence of heat conducted to the substrate layer 120, the substrate layer 120 will explosive scattering,

同时表层m会被吹飞。 M while the surface is blown off.

本发明者发现了如下情况:对SI反施加预热后照射激光,由此可容易地只加工表层121。 The present inventors have found the following: laser irradiation after the preheating is applied to the anti-SI, whereby only the processing surface 121 easily. 在图27A所示的激光加工装置中,禾拥从激光源lb射出的连续波激光束预热Sf反12,然后禾偶从激光源la射出的脉冲激光束进行空等的加工。 In the laser processing apparatus shown in FIG. 27A, He Yong emitted from the laser source lb continuous wave laser beam 12 anti preheating Sf, Wo even then emitted from the laser source is a pulsed laser beam la waited in vain processing.

接着,参照图28A〜28C说明用连纟M激^^寸基1匕的被加工点施加预热后、 照射脉冲激光形成孔的方法的一例。 Next, after the preheating is applied with a processing point is connected dagger M excited ^^ inch Si substrate, irradiating a pulsed laser example of a method of forming a hole with reference to FIG 28A~28C.

如图28A所示,在照射连续波激光束(用圆形的光点95表示)的基板12的表面,划定有被加工点105a、 105b、 105c。 Shown, the surface of the substrate is irradiated continuous wave laser beam (circular spot 95 shown) 12, as shown in FIG 28A has been designated processing point 105a, 105b, 105c. 光点95的中心位于连结被加工点舰a〜 105c的直线上。 Center of the light spot 95 is located on the connecting straight line 105c a~ working point of the ship. 与该直线平行地移动XY工作台,将被加工点105a〜105C向光点95—侧移动。 XY stage moving in parallel to the straight line, the point to be processed is moved to the spot 95- 105a~105C side.

如图28B所示,当被加工点105a到达光点95的边缘时,向被加工点105a照射 As shown in FIG 28B, when the processing point 105a reaches the edge of the spot 95, is irradiated to the processing point 105a

连续波激光,开始预热的供给。 Continuous wave laser, begins to warm up supply.

如图28C所示,当被加工点105a至(J达光点95的中心时,在光点95的中心謝亍1次的脉冲激光的照射。用光点96表示脉冲激光的光点。 As shown in FIG 28C, when the center point 105a to be processed (J of the light spot 95 in the center of the light spot 95 is irradiated Xie right foot once pulsed laser. Light spot 96 represents the pulse laser spot.

被加工点105a在从光点95的边缘移动到中心的期间被预热。 The point 105a to be processed is preheated during the movement from the edge 95 to the spot center. 通过对经预热的被加工点105a照射脉冲激光束,抑制了衬底层被加工的情况,在基板的表层形成了孔。 Point 105a is processed by the pulsed laser beam is irradiated on the preheated, where the substrate layer is suppressed to be processed, the surface layer of the substrate, holes are formed.

继续移动基板12,与被加工点105a同样地在被加工点105b、 105c上也形成孔。 We continue to move the substrate 12, and 105a are also formed in the same manner as the processing point 105b, 105c hole machining point.

用于预热的连续波激光束的照射条件是,例如光点为直径20mm的圆形状, ^f及表面的功率密度为0. 1W/crn2。 Irradiation conditions for the continuous-wave laser beam is preheated, for example, a circular shape the spot diameter of 20mm, the power density and surface ^ f is 0. 1W / crn2. 用于加工的脉冲激光束的照射条件是,例如光点为具有20 U m角的正方形,基板表面的脉冲能量密度为O. 1〜0. 4J/cra2。 The conditions for the irradiation of the pulse laser beam processing is, for example, a light spot having a square corner 20 U m, the pulse energy density of the substrate surface is O. 1~0. 4J / cra2.

并且,预热被加工点的时间,与被加工点移动与连续波激光的光点半径长度相当的距离时的时间大致相等。 Further, the pre-heating processing time point and the time when the machining point moves a distance equivalent to the length of the radius of the spot is substantially equal to a continuous wave laser. 例如设光点的半径为10mm、 XY工作台的移动速度为800mm/s,则该时间为O. 13秒。 For example the radius of the light spot is 10mm, the moving speed of the XY stage is 800mm / s, the time is O. 13 seconds. 通过向连续波激光束的光点中心照射脉冲激光,即使按各种方式改变XY工作台的移动方向,可容易地调整预热时间进行加工。 Through the center of the spot irradiated with the pulse laser beam to the continuous-wave laser, even when the XY stage moving direction is changed in various ways, the preheating time can be easily adjusted for processing. 通过连续波激光的照射赋予基板表面的预热一直传递到衬底层,因此,赋予的预热过多则会加工衬底层。 Irradiating the substrate surface by imparting a continuous wave laser has been transferred to the preheated substrate layer, therefore, it will impart too much processing preheating the substrate layer. 因此,供给预热时,需要使衬底层的温度保持在不能加工衬底层的温度以下。 Accordingly, preheating is supplied, it is necessary to maintain the temperature of the substrate layer can not be processed at a temperature of the substrate layer. 例如,需要使衬底层的温度保持在衬底层素材的熔点以下。 For example, it is necessary to maintain the temperature of the substrate layer at the melting point of the material of the substrate layer. ITO膜对可见光是透明的,但对例如波长808nm的近红外线的吸收系数不是零。 ITO film is transparent to visible light, but for example, a wavelength of 808nm near infrared absorption coefficient is not zero. 因此,可将该波长的光用于ITO膜的预热。 Therefore, the wavelength of light used for preheating the ITO film. 如果^顿ITO的吸收系数更大的波长(例如1064nm附近的波长)的光,则可期待预热效率的提高。 If the light absorption coefficient ^ Dayton ITO greater wavelength (eg wavelength near 1064nm), we can look forward to warm-up to improve efficiency. 说明了将脉冲激光束和连续波激光束重叠在相同的光轴上照射基板的例子,但是,也可以使两光束不在相同的光轴上。 Illustrates an example of the pulsed laser beam and the continuous-wave laser beam is superimposed on the same optical axis the substrate was irradiated, it is also possible that the two beams are not on the same optical axis. 如果在连续波激光束的光点内部包含脉冲波激光束的光点、并用两激光束照射基板,则被加工点到达连续波激光束的光点的边缘后、至到达脉冲激光的光点位置的期间,可以X寸被加工点供舒页热。 If contains a spot pulse laser beam inside the light spot continuous wave laser beam, and use two laser beam irradiation of the substrate, were working point reaches the edge of the spot of the continuous-wave laser beam to reach the light spot pulse laser position the period can be processed X-inch hot spot for comfortable page. 但是,为了供给预热,需要使被加工点通过连续波激光束的光点内部后、 到达脉冲激光束的照射位置。 However, in order to preheat the supply needs to be processed through the point of the interior of the light spot of the laser beam is a continuous wave, pulsed laser beam reaches the irradiation position. 因此,需要使脉冲激光束的照射位置与被加工点同连续波激光束的光点的外周接触时的被加工点位置不一致。 Therefore, the pulse laser beam irradiation position does not coincide with the center position of the workpiece is in contact with the outer periphery of a continuous wave light beam spot of the laser machining point. 说明了形成孔的例子,但也可以连续地形成多个?L,由此形成槽。 It illustrates an example of forming holes, but may be formed continuously a plurality of? L, thereby forming a groove. 说明了利用XY工作台移动SfeJl的激光束入射位置的例子,但是,也可以用电流扫描仪改变激光束的行进方向,来移动入射位置。 Illustrates an example of the laser beam incident position of the XY stage moves SfeJl, however, may change the traveling direction of the laser beam with the current scanner to move the incident position. 以上,按照实施例说明了本发明,但本发明并不限定于此。 Above, according to embodiments of the present invention it is described, but the present invention is not limited thereto. 例如,本领域技术人员当然明白,本发明可以进行各种变更、改进、组合等。 For example, those skilled in the art will certainly appreciate, the present invention may be various modifications, improvements, combinations and the like.

Claims (1)

1.一种激光加工方法,其特征在于,包括以下工序: 根据与接近遮光框的贯通孔的形状转印到加工对象物表面上的精度、激光束的扩散角、上述接近遮光框与上述加工对象物表面之间的距离有关地预先求出的关系,将从激光源射出的激光束的扩散角和接近遮光框与加工对象物表面之间的距离分别设定为规定扩散角和规定距离的工序; 将从激光源射出的激光束扩散角调整为上述规定扩散角的工序; 一边改变被调整成具有上述规定扩散角的激光束的行进方向,一边将该激光束照射到配置在与加工对象物的表面平行地从该表面仅离开上述规定距离的位置、且具有贯通孔的接近遮光框上,使通过了该贯通孔的激光束入射到该加工对象物的表面,将该贯通孔的形状转印到该加工对象物表面上的工序。 A laser processing method comprising the steps of: transferring the shape according to the light shielding frame close to the accuracy of the through hole on the surface of the object, the diffusion angle of the laser beam, said light blocking frame and close the machining the distance between the surface of the object in relation to a pre-determined relationship, the diffusion angle from the laser light source emits a laser beam and a light-shielding frame and the proximity between the object surface distance and a predetermined spreading angle are set as the predetermined distance step; diffusion angle of the laser beam emitted from the laser source is adjusted to the predetermined diffusion step angle; while changing the direction of travel is adjusted to a laser beam having the predetermined diffusion angle, while the laser beam is irradiated to the object arranged in the parallel to the surface thereof away from the surface only from the predetermined position, and close the light-shielding frame having a through hole, passing through the through-hole of the laser beam is incident to the surface of the object, the shape of the through hole transferred to a step on the surface of the object.
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