CN101026205A - Light-emitting diode package structure - Google Patents
Light-emitting diode package structure Download PDFInfo
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- CN101026205A CN101026205A CNA2006100076754A CN200610007675A CN101026205A CN 101026205 A CN101026205 A CN 101026205A CN A2006100076754 A CNA2006100076754 A CN A2006100076754A CN 200610007675 A CN200610007675 A CN 200610007675A CN 101026205 A CN101026205 A CN 101026205A
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- package structure
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Abstract
This invention relates to a package structure of a LED, which adds an insulation backing layer between a conduction base plate and a LED, and the package structure includes a heat conduction base plate with a pit, an insulation backing set on the pit of said heat-conduction base plate and a LED set on said insulation backing and connected with an outside supply by lead, in which, circuit can be made on the insulation backing, which can increase light emission efficiency of the LED.
Description
Technical field
The present invention relates to a kind of package structure for LED, particularly relate to a kind of package structure for LED of between light-emitting diode and conductive sole plate, inserting insulating substrate.
Background technology
At present light-emitting diode (LED; Light emitting diode) among the encapsulating structure, these two kinds of methods of general using eutectic (Eutectic) and conductivity viscose glue are as the main combination of light-emitting diode and conductive sole plate.Method wherein mainly is the faying face in the bottom of light-emitting diode and conductive sole plate (as metallic support), by above-mentioned method with its combination, the effect of closing, dispelling the heat and conducting electricity to reach admittedly.General light-emitting diode is positioned at the pit of conductive sole plate, yet produces when the material of conductive sole plate has problem during for metal material.
Because some metal heat-conducting base plate is to use cold forging (cold forge) processing procedure to allow it be shaped, so the molded surface roughness of metal material can be bad, particularly the surface roughness at moulding edge.Therefore, the rough surface at the moulding edge of metal heat-conducting base plate can influence the effect of the reflection ray of light-emitting diode, and then influences the whole light extraction efficiency of light-emitting diode.And the rough surface of metal heat-conducting base plate also can influence the surface bonding strength between light-emitting diode and conductive sole plate, reduces the reliability (Reliability) of package structure for LED.
In addition, the thermal coefficient of expansion (CTE of conductive sole plate (as metallic support) and light-emitting diode; Coefficient of thermal expansion) difference causes when rising-heat contracting-cold, can be on the surface of conductive sole plate and light-emitting diodes pipe jointing the phenomenon pullled of generation stress, thereby easily produce slit (void) in the junction or easily cause the problem of delamination (delamination).
This shows that above-mentioned existing package structure for LED obviously still has inconvenience and defective, and demands urgently further being improved in the use.In order to solve the problem that package structure for LED exists, relevant manufacturer there's no one who doesn't or isn't seeks solution painstakingly, but do not see always that for a long time suitable design finished by development, and common product does not have appropriate structure to address the above problem, and this obviously is the problem that the anxious desire of relevant dealer solves.Therefore how to found a kind of package structure for LED of new structure, just become the current industry utmost point to need improved target.
Because the defective that above-mentioned existing package structure for LED exists, the inventor is based on being engaged in this type of product design manufacturing abundant for many years practical experience and professional knowledge, and the utilization of cooperation scientific principle, actively studied innovation, in the hope of founding a kind of package structure for LED of new structure, can improve general existing package structure for LED, make it have more practicality.Through constantly research, design, and after studying sample and improvement repeatedly, create the present invention who has practical value finally.
Summary of the invention
The objective of the invention is to, overcome the defective that existing package structure for LED exists, and a kind of package structure for LED of new structure is provided, technical problem to be solved is to make it that a kind of encapsulating structure with light-emitting diode of preferable luminous efficiency is provided.The insulating substrate that utilization is set up is changed the position of light-emitting diode, producing preferable light reflection efficiency, and then improves the light effect that of light-emitting diode, thereby is suitable for practicality more.
Another object of the present invention is to, a kind of package structure for LED is provided, technical problem to be solved is to make it provide a kind of combination firm package structure for LED.Between conductive sole plate and light-emitting diode, add the surface insulating substrate level and smooth, increase the bond strength between conductive sole plate and light-emitting diode, thereby be suitable for practicality more than conductive sole plate.
A further object of the present invention is, a kind of package structure for LED is provided, and technical problem to be solved is to make it that a kind of more firm package structure for LED is provided, and adds the insulating substrate of heat conduction between light-emitting diode and conductive sole plate.When package structure for LED when being heated or cool off, relax between light-emitting diode and conductive sole plate and pull phenomenon because of the stress that difference produced of thermal coefficient of expansion, solving the problem of delamination (delamination), thereby be suitable for practicality more.
An also purpose of the present invention is, provide a kind of package structure for LED, but technical problem to be solved is that its package structure for LED that provides a kind of Flexible Design to manufacture circuit is provided, and insulating substrate is set below light-emitting diode.This insulating substrate can design at the demand of encapsulating structure and manufacture circuit, makes this package structure for LED have more flexible design and the space of manufacturing circuit, thereby is suitable for practicality more, and have the value on the industry.
The object of the invention to solve the technical problems realizes by the following technical solutions.According to a kind of package structure for LED that the present invention proposes, comprising: a conductive sole plate has a pit; One insulating substrate is located on this pit of this conductive sole plate; And a light-emitting diode, being located on this insulating substrate, this light-emitting diode links to each other with the power supply in the external world by lead.
The object of the invention to solve the technical problems also adopts following technical measures further to realize.
Aforesaid package structure for LED, it more comprises an adhesive layer, this adhesive layer is located between this conductive sole plate and this insulating substrate.
Aforesaid package structure for LED, the material of wherein said adhesive layer are a glue material, an eutectic material or a welding material.
Aforesaid package structure for LED, it more includes a strong layer, this strong layer is positioned on the periphery and this conductive sole plate of this insulating substrate, with this insulating substrate of set on this conductive sole plate.
Aforesaid package structure for LED, the material of wherein said strong layer is a heat-conducting glue material.
Aforesaid package structure for LED, wherein said conductive sole plate are a metallic support.
Aforesaid package structure for LED, wherein said insulating substrate are a silicon substrate.
Aforesaid package structure for LED, the material of wherein said insulating substrate are carbon nanotube.
Aforesaid package structure for LED, the material of wherein said insulating substrate are ceramic material.
Aforesaid package structure for LED, wherein said ceramic material are aluminium oxide or aluminium nitride.
Aforesaid package structure for LED, the material of wherein said insulating substrate are composite material.
Aforesaid package structure for LED, there is a coating on the surface of wherein said insulating substrate.
Aforesaid package structure for LED, the material of wherein said coating are a radiating insulating material.
Aforesaid package structure for LED, wherein said radiating insulating material is a diamond coating film.
Aforesaid package structure for LED, the thermal coefficient of expansion of wherein said insulating substrate (coefficient of thermal expansion) is between this conductive sole plate and this light-emitting diode.
Aforesaid package structure for LED, wherein said light-emitting diode are High Power LED or laser diode.
Aforesaid package structure for LED, the number of wherein said light-emitting diode are more than one.
Aforesaid package structure for LED, it more comprises a packing material, this packing material is coated on this light-emitting diode.
Aforesaid package structure for LED, wherein said packing material are a light transmissive material.
Aforesaid package structure for LED, wherein said light transmissive material are a gel.
The present invention compared with prior art has tangible advantage and beneficial effect.By above technical scheme as can be known, major technique of the present invention thes contents are as follows:
The above-mentioned purpose according to the present invention proposes a kind of package structure for LED, comprises conductive sole plate, insulating substrate and light-emitting diode.In the pit of conductive sole plate, be equipped with an insulating substrate, again light-emitting diode be located on this insulating substrate, utilize lead that light-emitting diode is connected with power supply to form electrical path.
According to one embodiment of the invention, in this package structure for LED,, change the height of light-emitting diode in pit by using the insulating substrate of different-thickness.So adjustment can make the light of light-emitting diode produce different reflecting effects, increases integral body and goes out light effect.
The above-mentioned purpose according to the present invention proposes a kind of package structure for LED that includes conductive sole plate, insulating substrate and light-emitting diode.In the pit of conductive sole plate, be equipped with the insulating substrate that a surface is coated with coating, make this insulating substrate have smooth surface.Again light-emitting diode is located on this insulating substrate, utilizes lead that light-emitting diode is connected with power supply to form electrical path.
According to another embodiment of the present invention, in package structure for LED, the coating (for example diamond coating film) that will have the insulating heat-conductive characteristic is plated in the surface of insulating substrate.So make insulating substrate except utilizing smooth surface, more can increase the thermal conduction characteristic of insulating substrate with the bond strength that improves own and element.
The above-mentioned purpose according to the present invention proposes a kind of package structure for LED, comprises conductive sole plate, insulating substrate and light-emitting diode.In the pit of conductive sole plate, be equipped with an insulating substrate, again light-emitting diode be located on this insulating substrate, utilize lead that light-emitting diode is connected with power supply to form electrical path.The thermal coefficient of expansion of above-mentioned insulating substrate is between conductive sole plate and light-emitting diode, reducing interelement contact-making surface, to avoid delamination, crack or to cause the problem of light-emitting diode characteristic attenuation because of the structure of thermal stress damage LED wafer because of the thermal stress that difference was produced of expanding with heat and contract with cold.
The above-mentioned purpose according to the present invention proposes a kind of package structure for LED, except including conductive sole plate, insulating substrate and light-emitting diode, more comprises a strong layer.In the pit of conductive sole plate, be equipped with an insulating substrate, and utilize strong layer that the insulating substrate periphery is closed admittedly with conductive sole plate, again light-emitting diode is located on this insulating substrate, utilize lead that light-emitting diode is connected with power supply to form electrical path.
According to an embodiment more of the present invention, in this package structure for LED, by strong layer good consolidate the ability of closing, increase the bond strength of conductive sole plate and insulating substrate periphery, to avoid occurring the delamination or the problem in slit, make this package structure for LED when different situations operate, all can have stable encapsulating structure.
Via as can be known above-mentioned, a kind of package structure for LED of the present invention in this package structure for LED, adds one deck insulating substrate between conductive sole plate and light-emitting diode.This insulating substrate goes out light effect except the integral body that can increase light-emitting diode, more can manufacture circuit on insulating substrate, makes the circuit design of package structure for LED have more elasticity.
By technique scheme, package structure for LED of the present invention has following advantage at least:
1, the insulating substrate set up of utilization of the present invention is changed the position of light-emitting diode, producing preferable light reflection efficiency, and then improves the light effect that of light-emitting diode.
2, the present invention adds the surface insulating substrate level and smooth than conductive sole plate between conductive sole plate and light-emitting diode, increases the bond strength between conductive sole plate and light-emitting diode.
3, the present invention adds the insulating substrate of heat conduction between light-emitting diode and conductive sole plate.When package structure for LED when being heated or cool off, relax between light-emitting diode and conductive sole plate and pull phenomenon, to solve the problem of delamination (delamination) because of the stress that difference produced of thermal coefficient of expansion.
But 4, the invention provides the package structure for LED that a kind of Flexible Design is manufactured circuit, insulating substrate is set below light-emitting diode.This insulating substrate can design at the demand of encapsulating structure and manufacture circuit, makes this package structure for LED have more flexible design and the space of manufacturing circuit, thereby is suitable for practicality more.
In sum, the package structure for LED of special construction of the present invention, it has above-mentioned many advantages and practical value, and in like product, do not see have similar structural design to publish or use and really genus innovation, no matter it all has bigger improvement on product structure or function, have large improvement technically, and produced handy and practical effect, and more existing package structure for LED has the multinomial effect of enhancement, thereby be suitable for practicality more, and have the extensive value of industry, really be a new and innovative, progressive, practical new design.
Above-mentioned explanation only is the general introduction of technical solution of the present invention, for can clearer understanding technological means of the present invention, and can be implemented according to the content of specification, and for above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, below especially exemplified by preferred embodiment, and conjunction with figs., be described in detail as follows.
Description of drawings
Fig. 1 is the generalized section that illustrates according to the package structure for LED of a preferred embodiment of the present invention.
Fig. 2 is the generalized section that illustrates according to the package structure for LED of another embodiment of the present invention.
Fig. 3 is the generalized section that illustrates according to the package structure for LED of another preferred embodiment of the present invention.
100: package structure for LED 111: pit
130: insulating substrate 140: knitting layer
160: lead 180: strong layer
110: conductive sole plate 120: adhesive layer
131: insulating substrate pit 150: light-emitting diode
170: packing material
Embodiment
Reach technological means and the effect that predetermined goal of the invention is taked for further setting forth the present invention, below in conjunction with accompanying drawing and preferred embodiment, to its embodiment of package structure for LED, structure, feature and the effect thereof that foundation the present invention proposes, describe in detail as after.
See also shown in Figure 1ly, it illustrates the generalized section according to the package structure for LED of a preferred embodiment of the present invention.Package structure for LED 100 wherein comprises conductive sole plate 110, adhesive layer 120, insulating substrate 130, knitting layer 140, light-emitting diode 150, lead 160 and packing material 170.
Conductive sole plate 110 has the good heat conductive ability, and its material can be metal material, silicon substrate or ceramic material, in order to the substrate as this package structure for LED 100, to carry other elements.This conductive sole plate 110 has a pit 111, can be for placing light-emitting diode.The shape of this pit 111 can change on demand, but as pit 111 reflection rays of bowl cup-shaped.
Insulating substrate 130 is positioned at the top of adhesive layer 120, makes conductive sole plate 110 and insulating substrate 130 be able to closely close admittedly by adhesive layer 120.Insulating substrate 130 has electric insulation and heat conducting characteristic, also can comply with different package requirements design and manufacture circuit on insulating substrate 130, and insulating substrate 130 can be widely used on the different encapsulating structures.The material of insulating substrate 130 can be silicon, carbon nanotube, ceramic material or composite material, or has the insulating material of diamond coating film.Above-mentioned ceramic material can be aluminium oxide or aluminium nitride.
Light-emitting diode 150 is positioned on the knitting layer 140, has positive and negative polarities (not illustrating), is being subjected to can to send specific wavelength light under the electric energy effect, is attended by heat simultaneously and produces.The number of this light-emitting diode 150 is not limit one, also can be more than one.And light-emitting diode 150 can be High Power LED or laser diode.
Lead 160 positive and negative polarities of light-emitting diode 150 and external power source can be connected to form an electrical path with so that light-emitting diode 150 it is luminous.The material of lead 160 can be gold, silver, aluminium, platinum or caesium.
170 of packing materials are on conductive sole plate 110.Packing material 170 can coat light-emitting diode 150 and lead 160, with protection and fixedly light-emitting diode 150 and lead 160.In addition, this packing material 170 can be light transmissive material (as gel), and its purpose is the light penetration that makes light-emitting diode 150.
Please consult shown in Figure 1 again, in package structure for LED 100, because the pit 111 of conductive sole plate 110 is the light in order to reflection light-emitting diode 150, different go out light effect (as scattering, concentrate or evenly bright dipping) to produce, so the shape of pit 111 and the degree of depth can change because of product demand.For the light effect that goes out of the reflection that increases pit 111, can change the height of light-emitting diode 150 by the thickness that changes insulating substrate 130, to change the reflection angle of light in pit 111 that light-emitting diode 150 is sent at pit 111.Thus, only need determine the thickness of insulating substrate 130, just can change the light effect that of light-emitting diode, increase the application of package structure for LED 100.
See also shown in Figure 1ly, when the material of the conductive sole plate 110 of package structure for LED 100 was metal material, pit 111 surfaces usually can coarse injustice.At this moment, can utilize the surface coating technology on insulating substrate 130, to produce flat surface,, use increase pit 111 and close intensity with consolidating of insulating substrate 130 to increase the bond strength of 130 of adhesive layer 120 and insulating substrates.
In addition, also can plate the electrical insulating material (as diamond coating film) of good heat transfer characteristic on demand prior to insulating substrate 130 surfaces, or use heat conduction and insulation effect good insulation performance base material 130, on insulating substrate 130, manufacture circuit again, improve the heat-transfer capability and the electrical isolation capabilities of insulating substrate 130.
In addition, the thermal coefficient of expansion of insulating substrate 130 (CTE) is between conductive sole plate 110 and light-emitting diode 150, reducing interelement contact-making surface, to avoid delamination, crack or to cause the problem of light-emitting diode characteristic attenuation because of thermal stress damage LED wafer structure because of the thermal stress that difference was produced of expanding with heat and contract with cold.
In aforesaid package structure for LED 100, can on insulating substrate 130, design according to the demand of encapsulating structure and (for example manufacture circuit, in response to the both positive and negative polarity position of light-emitting diode 150 or the change of lead 160 link positions), make this package structure for LED 100 can be widely used in different package structure for LED, for example High Power LED, laser diode.
See also shown in Figure 2ly, it illustrates the generalized section according to the package structure for LED of another embodiment of the present invention.Wherein the insulating substrate 130 of package structure for LED 100 has insulating substrate pit 131.And knitting layer 140 is arranged on insulating substrate pit 131, and be equipped with light-emitting diode 150 on this knitting layer 140, re-use lead 160 connection light-emitting diodes 150 and external power source to form electrical path.Wherein, the surface of this insulating substrate pit 131 can be coated with a coating, in order to increase the effect of light reflection, improves the bright dipping benefit of light-emitting diode 150.
See also shown in Figure 3ly, it illustrates the generalized section according to the package structure for LED of another preferred embodiment of the present invention.Package structure for LED 100 wherein more comprises strong layer 180, attached to the periphery of insulating substrate 130, insulating substrate 130 is fixed on the conductive sole plate 110.So, can increase the adhesion of conductive sole plate 110 and insulating substrate 130, overcome the operation condition rugged environment.For example under the environment of variations in temperature excessive (be heated or cool off too violent), these strong layer 180 stress that can disperse between insulating substrate 130 and the conductive sole plate 110, with the faying face that solves said two devices the problem of slit (void) or delamination (delamination) appears, to increase the reliability (Reliability) that package structure for LED operates under different situations.
Material of this strong layer 180 is the heat-conducting glue material with heat-transfer capability, therefore can increase the area of dissipation of conductive sole plate 110, to improve radiating efficiency with the heat conduction of insulating substrate 130 peripheries to conductive sole plate 110.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, though the present invention discloses as above with preferred embodiment, yet be not in order to limit the present invention, any those skilled in the art, in not breaking away from the technical solution of the present invention scope, when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent embodiment of equivalent variations, in every case be the content that does not break away from technical solution of the present invention, according to technical spirit of the present invention to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solution of the present invention.
Claims (20)
1, a kind of package structure for LED is characterized in that it comprises:
One conductive sole plate has a pit;
One insulating substrate is located on this pit of this conductive sole plate; And
One light-emitting diode is located on this insulating substrate, and this light-emitting diode links to each other with the power supply in the external world by lead.
2, package structure for LED according to claim 1 is characterized in that it more comprises an adhesive layer, and this adhesive layer is located between this conductive sole plate and this insulating substrate.
3, package structure for LED according to claim 2, the material that it is characterized in that wherein said adhesive layer are a glue material, an eutectic material or a welding material.
4, package structure for LED according to claim 1 is characterized in that it more includes a strong layer, and this strong layer is positioned on the periphery and this conductive sole plate of this insulating substrate, with this insulating substrate of set on this conductive sole plate.
5, package structure for LED according to claim 4 is characterized in that the material of wherein said strong layer is a heat-conducting glue material.
6, package structure for LED according to claim 1 is characterized in that wherein said conductive sole plate is a metallic support.
7, package structure for LED according to claim 1 is characterized in that wherein said insulating substrate is a silicon substrate.
8, package structure for LED according to claim 1, the material that it is characterized in that wherein said insulating substrate is a carbon nanotube.
9, package structure for LED according to claim 1, the material that it is characterized in that wherein said insulating substrate is a ceramic material.
10, package structure for LED according to claim 9 is characterized in that wherein said ceramic material is aluminium oxide or aluminium nitride.
11, package structure for LED according to claim 1, the material that it is characterized in that wherein said insulating substrate is a composite material.
12, package structure for LED according to claim 1 is characterized in that there is a coating on the surface of wherein said insulating substrate.
13, package structure for LED according to claim 12, the material that it is characterized in that wherein said coating are a radiating insulating material.
14, package structure for LED according to claim 13 is characterized in that wherein said radiating insulating material is a diamond coating film.
15, package structure for LED according to claim 1, the thermal coefficient of expansion that it is characterized in that wherein said insulating substrate is between this conductive sole plate and this light-emitting diode.
16, package structure for LED according to claim 1 is characterized in that wherein said light-emitting diode is High Power LED or laser diode.
17, package structure for LED according to claim 1, the number that it is characterized in that wherein said light-emitting diode is more than one.
18, package structure for LED according to claim 1 is characterized in that it more comprises a packing material, and this packing material is coated on this light-emitting diode.
19, package structure for LED according to claim 18 is characterized in that wherein said packing material is a light transmissive material.
20, package structure for LED according to claim 19 is characterized in that wherein said light transmissive material is a gel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100076754A CN100481543C (en) | 2006-02-17 | 2006-02-17 | Light-emitting diode package structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100076754A CN100481543C (en) | 2006-02-17 | 2006-02-17 | Light-emitting diode package structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101026205A true CN101026205A (en) | 2007-08-29 |
| CN100481543C CN100481543C (en) | 2009-04-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006100076754A Expired - Fee Related CN100481543C (en) | 2006-02-17 | 2006-02-17 | Light-emitting diode package structure |
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| Country | Link |
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| CN (1) | CN100481543C (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102403441A (en) * | 2010-09-08 | 2012-04-04 | 展晶科技(深圳)有限公司 | Light emitting diode packaging structure |
| CN104659185A (en) * | 2015-02-09 | 2015-05-27 | 上海三思电子工程有限公司 | LED light emitting device |
-
2006
- 2006-02-17 CN CNB2006100076754A patent/CN100481543C/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102403441A (en) * | 2010-09-08 | 2012-04-04 | 展晶科技(深圳)有限公司 | Light emitting diode packaging structure |
| CN104659185A (en) * | 2015-02-09 | 2015-05-27 | 上海三思电子工程有限公司 | LED light emitting device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100481543C (en) | 2009-04-22 |
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Granted publication date: 20090422 Termination date: 20110217 |