CN101026138A - 散热器与封装结构 - Google Patents

散热器与封装结构 Download PDF

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CN101026138A
CN101026138A CN 200610059015 CN200610059015A CN101026138A CN 101026138 A CN101026138 A CN 101026138A CN 200610059015 CN200610059015 CN 200610059015 CN 200610059015 A CN200610059015 A CN 200610059015A CN 101026138 A CN101026138 A CN 101026138A
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chip
encapsulating structure
carrier
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material layer
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CN100481413C (zh
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李长祺
黄东鸿
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Advanced Semiconductor Engineering Inc
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Abstract

一种散热器，适于通入一冷却液。该散热器包括一外壳以及一多孔隙材料层。其中，多孔隙材料层设置在外壳内，且冷却液适于通入多孔隙材料层内。此外，本发明同时提出了一种封装结构，其适于藉由一冷却液进行散热。该封装结构包括一承载器、一芯片以及上述散热器。芯片配置在承载器上，而散热器配置在承载器上或芯片上方。藉由该散热器可以提高封装结构的散热效率。

Description

散热器与封装结构
技术领域
本发明涉及一种散热器(heat spreader)与封装结构(packagestructure)，特别是关于一种具有高散热效率的散热器与封装结构。
背景技术
近年来，随着集成电路(integrated circuit，IC)芯片内部线路的整合度(integration)不断地攀升，芯片所产生的热能也不断增加。就个人计算机而言，高整合度的集成电路芯片(例如中央处理器或绘图芯片等IC芯片)均会产生热能。为了使上述IC芯片能够维持正常运作，IC芯片必须维持在较佳的工作温度下，以避免温度过高造成效能下降或损坏。换言之，随着IC芯片的运算速度不断增加，对于散热系统的要求也相对提高。因此，目前部分现有封装结构已设有散热器。
然而，由于现有封装结构中的散热器均为被动式散热组件，在芯片内部线路的整合度持续攀升的情况下，芯片所产生的热能也不断地增加，因此被动式散热器已无法满足芯片目前的散热需求。
发明内容
因此，本发明的目的之一在于提供一种主动式散热器，其主要藉由冷却液进行散热，以提高散热器的散热效率。
本发明的另一目的在于提供一种封装结构，其承载器上具有一主动式散热器，该散热器主要藉由冷却液进行散热，以提高封装结构的散热效率。
本发明的又一目的在于提供一种封装结构，其芯片上方具有一主动式散热器，该散热器主要藉由冷却液进行散热，以提高封装结构的散热效率。
为实现上述目的，本发明散热器适于通入一冷却液。该散热器包括一外壳以及一多孔隙材料层(porous material layer)。该多孔隙材料层设置在外壳内，且冷却液适于通入多孔隙材料层内。
依据本发明提供的一种封装结构，其适于藉由一冷却液进行散热。该封装结构包括一承载器、一芯片以及一散热器。其中，芯片设置在承载器上，且与承载器电性连接，而散热器则设置在承载器上。该散热器包括一外壳以及一多孔隙材料层，其中多孔隙材料层设置在外壳内，且冷却液适于通入该多孔隙材料层内。
上述封装结构还可进一步包括一封装胶体，用于将芯片固着于承载器上。
上述封装结构中，承载器可以是一导线架(leadframe)，该导线架包括一芯片座以及复数个导脚(lead)。其中，芯片座具有一第一承载面与一相对的第一背面，芯片设置在第一承载面上，而散热器则设置在第一背面上，而导脚设置在芯片座周围。
上述封装结构中，承载器可以是一印刷电路板(printedcircuit board，PCB)。该承载器具有一第二承载面以及一相对的第二背面，芯片设置在第二承载面上。散热器可设置在承载器的第二承载面上或承载器的第二背面上。此外，芯片与散热器也可堆叠设于承载器的第二承载面上。
上述封装结构还可进一步包括复数个焊球(solder ball)，设置在承载器的第二承载面上或承载器的第二背面上。
依据本发明提供的另一种封装结构，其适于藉由一冷却液进行散热。该封装结构包括一承载器、一芯片以及一散热器。其中，芯片设置在承载器上，且与承载器电性连接，而散热器则设置在芯片上方。该散热器包括一外壳以及一多孔隙材料层，其中多孔隙材料层设置在外壳内，且冷却液适于通入多孔隙材料层内。
上述封装结构还可进一步包括一封装胶体，用于将芯片固着于承载器上。散热器可嵌入芯片上方的该封装胶体内。
上述封装结构中，承载器可以是一导线架。该导线架包括一芯片座与复数个导脚。其中，芯片座具有一第一承载面与一相对的第一背面，芯片设置在第一承载面上。此外，导脚设置在芯片座周围。
上述封装结构中，承载器可以是一印刷电路板。该承载器具有一第二承载面以及一相对的第二背面，芯片设置在第二承载面上。
上述封装结构还可进一步包括复数个焊球，设置在承载器的第二承载面上或承载器的第二背面上。
上述散热器与两种封装结构中，外壳设有一注入口以及一输出口，冷却液由注入口注入多孔隙材料层中，并由输出口输出。该外壳可以是板状外壳、条状外壳、框状外壳，或U形外壳。此外，外壳的材质可以是金属。
上述散热器与两种封装结构中，多孔隙材料层的材质可以是金属。此外，多孔隙材料层可以是金属烧结物(metal clinker)。
与现有技术相比，本发明散热器因多孔隙材料层中具有许多孔隙，因此可增加冷却液与多孔隙材料层的接触面积，从而使得冷却液可以迅速将散热器的热排出。因此，本发明散热器具有高散热效率。
此外，由于本发明封装结构将上述散热器设置在承载器上或芯片上方，所以散热器可以快速吸收与其接触的表面的热能，并且藉由冷却液将散热器所吸收的热能迅速排出。因此，本发明封装结构的散热效率较高。
以下结合附图与实施例对本发明作进一步的说明。
附图说明
图1A至图1C为依照本发明第一实施例的三种封装结构的剖面图。
图2A与图2B为图1A至1C所示的本发明散热器的两种剖面图。
图3为依照本发明第二实施例的一种封装结构的剖面图。
图4A与图4B为依照本发明第三实施例的两种封装结构的剖面图。
图5A与图5B为依照本发明第四实施例的两种封装结构的剖面图。
具体实施方式
有关本发明的详细说明及技术内容，现就结合附图说明如下：
图1A至图1C为依照本发明第一实施例的三种封装结构的剖面图，而图2A与图2B为本发明散热器的两种剖面图。请先参照图1A、图1B、图2A与图2B，本实施例的封装结构200a适于藉由一冷却液100进行散热。该封装结构200a包括一承载器210a、一芯片220以及一散热器230。其中，芯片220设置在承载器210a上，而散热器230设置在芯片220上方(如图1A所示)或承载器210a上(如图1B所示)。此外，散热器230包括一外壳232以及一多孔隙材料层234，其中多孔隙材料层234设置在外壳232内，冷却液适于通入该多孔隙材料层234内。
上述封装结构还可进一步包括一封装胶体240，用于将芯片220固着于承载器210a上。此外，散热器230的外壳232可设有一注入口232a以及一输出口232b。冷却液100由注入口232a注入多孔隙材料层234中，并由输出口232b输出。
如上所述，由于本实施例封装结构200a将散热器230设置在承载器210a上或芯片220上方，所以散热器230的外壳232可以吸收与其接触的表面(承载器或封装胶体的表面)的热。此外，由于多孔隙材料层234内部具有许多孔隙234a，所以当冷却液100由注入口232a注入多孔隙材料层234中时，冷却液100与多孔隙材料层234的接触面积较大，使得冷却液100可以迅速吸收散热器230的热能并将其排出。因此，本实施例的封装结构200a具有高散热效率。
在本实施例中，散热器230外壳232的材质可以是金属。此外，多孔隙材料层234的材质也可以是金属。在本实施例中是以烧结的方式，将金属变成具有许多孔隙234a的金属烧结物，或者是利用贯孔或其它方式使金属具有许多孔隙234a，以作为冷却液100流动的通道。
值得注意的是，图2B中所示外壳232的形状仅为举例之用，并非用以限定本发明。事实上，本实施例外壳的形状可为条状外壳、板状外壳、框状外壳、U形外壳或是其它形状的外壳。此外，本实施例的封装结构具有多种形式，以下将举几个较佳的形式进行说明。
本发明实施例中，承载器可以是一印刷电路板、导线架或其它类型的承载装置。图1A至图1C中所示的承载器210a为一印刷电路板，其具有一承载面212a以及一相对的背面214a。芯片220设置在承载面212a上。此外，散热器230可嵌入芯片220上方的封装胶体240内(如图1A所示)，或是设置在承载器210a的承载面212a上(如图1B所示)。此外，芯片220与散热器230也可堆叠设于承载器210a的承载面212a上(如图1C所示)。
本实施例的封装结构200a还可进一步包括复数个焊球250，设置在承载器210a的背面214a上。封装结构200a通过焊球250而与其它组件电性连接。此外，封装结构200a还可进一步包括复数条焊线260，连接于芯片220与承载器210a之间。芯片220通过焊线260而与承载器210a电性连接。值得注意的是，本实施例的焊线260也可由凸块(未图示)取代。
图3为依照本发明第二实施例的另一种封装结构的剖面图。请参照图3，本实施例的封装结构200a’中，承载器210a可以是一印刷电路板，其具有一承载面212a以及与承载面212a相对的一背面214a。其中，芯片220设置在承载面212a上，并藉由凸块270而与承载器210a电性连接。此外，散热器230设置在芯片220上方，而焊球250设置在承载器210a的背面214a上。
图4A与图4B为依照本发明第三实施例的又两种封装结构的剖面图。请参照图4A与图4B，本实施例的封装结构200a”中，承载器210a可以是一印刷电路板，其承载面212a具有一凹陷216a，芯片220设置在凹陷216a的底部。此外，散热器230设置在承载器210a的背面214a上(如图4A所示)，或是设置在芯片220上方的封装胶体240内(如图4B所示)，而焊球250设置在承载器210a的承载面212a上。
由上述可知，本发明封装结构的散热器230可设置在承载器210a的承载面212a上(如图1B与图1C所示)、承载器210a的背面214a上(如图4A所示)、芯片220上方(如图1A与图3所示)，或是嵌入芯片220上方的封装胶体240内(如图1A、1B与图4B所示)。此外，焊球250可设置在承载器210a的承载面212a上(如图4A与图4B所示)或承载器210a的背面214a上(如图1A至图1C及图3所示)。
图5A与图5B为本发明第四实施例的再两种封装结构的剖面图。请参照图5A与图5B，本实施例的封装结构200b中，承载器200b可以是一导线架，其包括一芯片座212b以及复数个导脚214b。其中，芯片220设置在芯片座212b上，而导脚214b设置在芯片座212b周围，并且与芯片220电性连接。此外，芯片座212b具有一承载面216b与一相对的背面218b，芯片220设置在承载面216b上，而散热器230可设置在芯片座212b的背面218b上(如图5 A所示)或芯片220上方的封装胶体240内(如图5B所示)。
上述封装结构200b还可进一步包括复数条焊线260，连接于芯片220与导脚214b之间，以使芯片220与导脚214b电性连接。当然，封装结构200b中的焊线260也可以凸块(未图示)取代。
值得注意的是，上述各种封装结构200a、200a’、200a”、200b中，散热器230的外壳的形状并非仅限于图中所示的形状。也就是说，外壳的形状可为条状、板状、框状、U形或是其它形状。
综上所述，本发明至少具有下列优点：
1.由于散热器的多孔隙材料层中具有许多孔隙，因此可增加冷却液与多孔隙材料层的接触面积，从而使得冷却液可以迅速将散热器的热排出。因此，本发明封装结构中的散热器具有高散热效率。
2.由于散热器是设置在承载器上或芯片上方，所以具有高散热效率的散热器可以快速吸收与其接触的表面的热能，并将其迅速排出，从而提高封装结构的散热效率。

Claims (11)

1、一种封装结构，适于藉由一冷却液进行散热，该封装结构包括：
一印刷电路板；
一芯片，设置在该印刷电路板上，且与该印刷电路板电性连接；
一散热器，设置在该印刷电路板上；其特征在于：
该散热器包括一外壳以及一配置在该外壳内的多孔隙材料层，该冷却液适于通入该多孔隙材料层内。
2、如权利要求1所述的封装结构，其特征在于该封装结构进一步包括一封装胶体，用于将该芯片固着在该印刷电路板上。
3、如权利要求1所述的封装结构，其特征在于该印刷电路板具有一第二承载面以及一相对的第二背面，且该芯片设置在该第二承载面上，而该散热器设置在该第二承载面上或该第二背面上。
4、如权利要求1所述的封装结构，其特征在于该外壳具有一注入口以及一输出口，且该冷却液由该注入口注入该多孔隙材料层中，并由该输出口输出。
5、如权利要求1所述的封装结构，其特征在于该多孔隙材料层包括金属烧结物。
6、一种封装结构，适于藉由一冷却液进行散热，该封装结构包括：
一承载器；
一芯片，设置在该承载器上，且与该承载器电性连接；
一散热器，设置在该芯片上方；其特征在于：
该散热器包括一外壳以及一配置在该外壳内的多孔隙材料层，该冷却液适于通入该多孔隙材料层内。
7、如权利要求6所述的封装结构，其特征在于该封装结构进一步包括一封装胶体，用于将该芯片固着在该承载器上。
8、如权利要求7所述的封装结构，其特征在于该承载器包括一导线架，该导线架包括：
一芯片座，具有一第一承载面与一相对的第一背面，该芯片设置在该第一承载面上；以及
复数个导脚，设置在该芯片座周围。
9、如权利要求6所述的封装结构，其特征在于该承载器包括印刷电路板。
10、如权利要求6所述的封装结构，其特征在于该外壳具有一注入口以及一输出口，该冷却液由该注入口注入该多孔隙材料层中，并由该输出口输出。
11、如权利要求6所述的封装结构，其特征在于该多孔隙材料层包括金属烧结物。
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CN104103609A (zh) * 2013-04-04 2014-10-15 英飞凌科技奥地利有限公司 封装及其制造方法
CN108278581A (zh) * 2018-01-28 2018-07-13 陈攀攀 一种led阵列模块的冷却结构
CN114345092A (zh) * 2022-01-11 2022-04-15 眉山金豆智能科技有限公司 一种微波等离子废气净化方法及装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104103609A (zh) * 2013-04-04 2014-10-15 英飞凌科技奥地利有限公司 封装及其制造方法
US9961798B2 (en) 2013-04-04 2018-05-01 Infineon Technologies Austria Ag Package and a method of manufacturing the same
CN108278581A (zh) * 2018-01-28 2018-07-13 陈攀攀 一种led阵列模块的冷却结构
CN114345092A (zh) * 2022-01-11 2022-04-15 眉山金豆智能科技有限公司 一种微波等离子废气净化方法及装置

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