CN100571965C - Welding agent for braze, method for welding and printed base plate - Google Patents
Welding agent for braze, method for welding and printed base plate Download PDFInfo
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- CN100571965C CN100571965C CNB2004100973159A CN200410097315A CN100571965C CN 100571965 C CN100571965 C CN 100571965C CN B2004100973159 A CNB2004100973159 A CN B2004100973159A CN 200410097315 A CN200410097315 A CN 200410097315A CN 100571965 C CN100571965 C CN 100571965C
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- metal salts
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
Abstract
The solder flux that uses when the present invention relates on the substrate of having implemented electroless plating nickel, carry out soldering, it contains resin and activating agent and the solvent with film forming ability, total amount with respect to solder flux, it contains the metal salts of organic acids of 0.1～20 weight %, and above-mentioned activating agent is organic acid identical with the organic acid that constitutes above-mentioned metal salts of organic acids or the organic acid lower than its acidity.Like this, the stability of metal salts of organic acids improves, and can keep high bond strength for a long time.
Description
Technical field
The soldering paste that uses when the present invention relates to be soldered to various electronic components on the printed base plate, particularly solder flux, method for welding and the printed base plate that in the brazing district of the printed base plate of having implemented electroless plating nickel, uses during soldering.
Background technology
In the past, when being soldered to electronic component on the printed base plate, used tin-lead alloy scolding tin or Pb-free solder in the brazing district that forms on the printed base plate, to carry out soldering.In order to prevent the oxidation of copper, how to implement electroless plating nickel on the surface of above-mentioned welding zone.
But, when on above-mentioned welding zone, implementing electroless plating nickel, owing to use hypophosphites as reducing agent, the therefore remaining phosphide that trace is arranged in the coating of nickel.
Therefore, when using the soldering alloy to carry out soldering on the surface of electroless plating nickel, the nickel in the nickel coating is diffused in the soldering alloy of fusion, border spot segregation at nickel coating and soldering alloy goes out phosphorus, produce the extremely part of denseization, bond strength reduces, and soldering is sometimes peeled off.
Therefore, the inventor at first proposes to make the slaine (spy opens the 2003-236695 communique) that contains 0.1～20 weight % in the solder flux that uses when carrying out soldering on the substrate of having implemented electroless plating nickel.That is, contain slaine in the solder flux to suppress metal in the slaine owing to separate out with the nickel displacement by making, can suppress the metal reaction in consequent nickel and the soldering alloy, the nickel that suppresses the welding zone surface spreads in the soldering alloy.Therefore, can prevent denseization, the bond strength of scolding tin is improved at the boundary phosphorus of welding zone and scolding tin.
But, when when containing as mentioned above to some extent that quantitatively the solder flux of slaine carries out long preservation, compare with the solder flux after the firm manufacturing, produce problems such as the bond strength of scolding tin and the insulaion resistance between welding zone reduce significantly.If the insulaion resistance between welding zone reduces, for example between welding zone, be easy to generate short circuit, the reliability of soldering and printed base plate is suffered damage.Therefore wish to improve the storage stability of the solder flux that contains slaine.
Therefore, the object of the present invention is to provide welding agent for braze, the method for welding that uses it and the printed base plate of the storage stability raising that makes solder flux.
Summary of the invention
The inventor is in order to solve the above-mentioned problem that solder flux had that contains slaine, carried out research with keen determination repeatedly, it found that: when solder flux is preserved for a long time, compare with the solder flux after the firm manufacturing, the bond strength of soldering and the insulaion resistance between welding zone reduce, be because the inorganic acid (hydrochloric acid that adds with the form of amine hydrochlorate usually) that adds as activating agent decomposes the metal salts of organic acids in the solder flux.The reduction of insulaion resistance for example is printed as β (ベ ) shape with solder flux having on the substrate of welding zone, and mounting soldering ball makes its backflow (reflow) on above-mentioned welding zone then, takes place easily in soldering ball and the method for welding that welding zone engages.This is presumably because the decomposition of above-mentioned slaine, thereby metal is separated out form thin metal film between welding zone, the cause that this metal film can't be removed by washing.Think that in addition because the part of slaine is decomposed, the effect of improving that slaine adds the bond strength that produces becomes not enough, so bond strength also descends.
The present invention is based on these experiences and finish.Promptly, welding agent for braze of the present invention, it contains resin and activating agent and the solvent with film forming ability, use when on the substrate of having implemented electroless plating nickel, carrying out soldering, it is characterized in that: with respect to the total amount of solder flux, it contains the metal salts of organic acids of 0.1～20 weight %, and above-mentioned activating agent is organic acid identical with the organic acid that constitutes above-mentioned metal salts of organic acids or the organic acid lower than its acidity.
As mentioned above, according to the present invention, the activating agent that adds in the solder flux is organic acid identical with the organic acid that constitutes above-mentioned metal salts of organic acids or the organic acid lower than its acidity, even when therefore solder flux being carried out long preservation, can prevent that also metal salts of organic acids from decomposing, the stability of this slaine improves.
Welding agent for braze of the present invention preferably also has arbitrary formation of following (1)～(6).
(1) above-mentioned metal salts of organic acids is preferably the slaine that is selected from gold, silver, copper, lead, zinc, bismuth, indium, antimony and nickel, is preferably the organic acid mantoquita especially.
(2) above-mentioned metal salts of organic acids is preferably the slaine that the carbon number of the alkyl that does not comprise carboxyl is 7～21 saturated fatty acid, the mantoquita of preferred especially this saturated fatty acid.
(3) above-mentioned resin with film forming ability is rosin or acrylic resin.
(4) above-mentioned activating agent is a rosin.
(5) above-mentioned resin with film forming ability is a rosin, and the above-mentioned activating agent of this rosin double as.
(6) do not contain halogen compounds.
The 1st method for welding involved in the present invention, it is characterized in that: implemented the above-mentioned welding agent for braze of printing on the substrate with brazing district of electroless plating nickel on the surface, place the soldering ball then on above-mentioned welding zone, heating refluxes the soldering ball, with the soldering ball bond to welding zone.Employed soldering ball is from the viewpoint to the influence of environment, preferred lead-free soldering ball.
The 2nd method for welding involved in the present invention, it is characterized in that: the paste of having implemented the above-mentioned welding agent for braze of printing and soldering powder on the substrate with brazing district of electroless plating nickel on the surface, heating is flowed paste then, forms the soldering alloy on welding zone.
The present invention also provides the printed base plate that adopts these method for welding to engage soldering.
Generally also use after having implemented electroless plating nickel on the substrate, consider that wetability improves and implemented the golden substrate that waits other coats of metal thereon.In the present invention, so-called " having implemented the substrate of electroless plating nickel ", its notion also is included in and has also implemented the golden substrate that waits other coats of metal in the nickel plating.
According to the present invention, even when solder flux preserved for a long time, owing to use specific organic acid as activating agent, so the stability of metal salts of organic acids improves in the solder flux.Therefore, in the soldering part of the substrate of having implemented electroless plating nickel, metal salts of organic acids is inhibited the diffusion of nickel in scolding tin, and denseization of phosphorus is prevented, and the bond strength that its result can suppress soldering reduces.In addition, thereby separate out, therefore can prevent the reduction significantly of insulaion resistance between welding zone owing in long preservation, suppressing slaine decomposition metal.In addition, use solder flux of the present invention, braze ability is good, does not have to find owing to being suitable for the braze ability decline that the present invention produces.
In addition, therefore solder flux of the present invention can improve the stability of metal salts of organic acids owing to do not conform to halide such as hydrochloric acid is arranged.
The specific embodiment
Welding agent for braze of the present invention contains resin, activating agent and the metal salts of organic acids with film forming ability.As resin, can enumerate for example rosin or thermoplastic acrylic resin with film forming ability.
As acrylic resin, molecular weight can be for below 10000, and preferred 3000～8000.If molecular weight surpasses 10000, crack resistance and anti-fissility might descend.In addition, in order to encourage active function, preferably using acid number is more than 50, need soften when soldering, and therefore preferred softening point is below 230 ℃.
Therefore, acrylic resin can use the monomer with polymerism unsaturated group, for example (methyl) acrylic acid, its ester (for example (methyl) methyl acrylate etc.), crotonic acid, itaconic acid, maleic acid (maleic anhydride) and its ester, (methyl) acrylonitrile, (methyl) acrylamide, vinyl chloride, vinylacetate etc., use catalyst such as peroxide, adopt the radical polymerization of block polymerization, aqueous polymerization, outstanding turbid polymerization, emulsion polymerization etc. to carry out the acrylic resin that polymerization obtains.
As rosin, can be used for the rosin and the derivative thereof of solder flux since can using in the past.As rosin and derivative thereof, can use common natural gum, ト one Le, wood rosin, as its derivative, can enumerate heat treated resin, newtrex, Foral, formolation rosin, rosin ester, Abietyl modified maleic acid resin, rosin modified phenolic resin, rosin modified alkyd resin etc.
Content with resin of film forming ability can be 20～80 weight %, preferred 30～65 weight % with respect to the solder flux total amount.If contain quantity not sufficient 20 weight %, wetability might worsen.On the other hand, if content surpasses 80 weight %, can not adjust viscosity, operation might worsen.
Add the metal ingredient of the metal salts of organic acids in the solder flux to as the present invention, can enumerate gold, silver, copper, lead, zinc, bismuth, indium, antimony, nickel etc., special preferably copper.In addition, as the organic acid composition, can enumerate all aliphatic acid, resin acid etc.Specifically, the carbon number that can enumerate the such moieties of stearic acid, sad, aphthenic acids and rosin acid (being included as the diterpene acid such as rosin acid, pimaric acid of rosin principal component) is generally saturated fatty acid about 7～21, resin acid etc.
As the concrete example of metal salts of organic acids, can enumerate copper stearate, Bismuth Octoate, copper naphthenate etc.
The content of metal salts of organic acids is 0.1～20 weight % with respect to the total amount of solder flux.If content less than 0.1 weight %, the nickel that suppresses the welding zone surface spreads the difficulty that becomes in the soldering alloy, and the bond strength of soldering is improved.On the other hand, if content surpasses 20 weight %, insulaion resistance might reduce.
Activating agent among the present invention can be and the identical organic acid of organic acid that constitutes metal salts of organic acids, or be than the organic acid a little less than its acidity.Acidity uses acidity constant (dissociation constant) the Ka value or the pKa value of solution (logKa) to estimate usually.Usually along with the increase of organic acid carbon number, there is the tendency that reduces in acidity, and therefore the low organic acid of so-called acidity means the organic acid of Duoing than the organic acid carbon number that constitutes metal salts of organic acids.For example, for cupric octoate, can use than the big organic acids such as stearic acid of its carbon number as activating agent.In addition, the above-mentioned rosin that contains rosin acid also can suitably use as the low organic acid of acidity.
As activating agent, if use than the high organic acid of organic acid acidity that constitutes metal salts of organic acids, this acid might be decomposed metal salts of organic acids, and is therefore not preferred.If enumerate the preferred compositions of metal salts of organic acids and activating agent (organic acid), can enumerate for example copper stearate and stearic acid, copper stearate and rosin etc.
The content of activating agent can be 0.1～30 weight % with respect to the solder flux total amount.If contain quantity not sufficient 0.1 weight %, the function of activating agent promptly is used for the metal oxide of metal surface is removed the active power deficiency of purification, and braze ability might reduce.On the other hand, if content surpasses 30 weight %, the epithelium reduction of solder flux, hydrophily improves, so corrosivity and insulating properties might reduce.When using rosin with the use form of the function that has resin and activating agent concurrently, the content of rosin and its derivative is necessary for the amount of not damaging this two function.
As solvent, can enumerate for example ethanol, isopropyl alcohol, ethyl cellosolve, BC, hexyl carbitol alcohols solvents such as (diglycol monotertiary hexyl ethers), esters solvent such as vinylacetate, butyl acetate, toluene, turpentine (テ レ ピ Application) wet goods varsol etc.
Solvent preferably with respect to the solder flux total amount is being 5～70 weight % machine solvent less thaies, 5 weight %, and the viscosity of solder flux improves, and the coating of solder flux worsens.On the other hand, if organic solvent surpasses 70 weight %, reduce as the ratio of the active ingredient (resin etc.) of solder flux, so braze ability might reduce.
Solder flux of the present invention by will be above-mentioned each component mixing, heating and melting and making.Solder flux of the present invention except above-mentioned component, can also contain other components such as thixotropic agent.As thixotropic agent, can enumerate rilanit special (hardened castor oil), beeswax, Brazil wax, stearmide, hydroxy stearic acid ethene diamides etc.The content of thixotropic agent can be 1.0～25 weight % with respect to the total amount of solder flux.
In addition, solder flux of the present invention can and with synthetic resin such as the known mylar that used as the matrix resin of solder flux, phenoxy resin, terpene resins in the past etc., also can add additives such as antioxidant, mould inhibitor, delustering agent.
Solder flux of the present invention uses under the situation of having implemented electroless plating nickel on the substrate.Implement the metal and the indefinite of this electroless plating nickel, but this metal is preferably copper.
In addition, also indefinite of the kind of soldering alloy can be used common tin-lead alloy soldering during soldering, in addition, also can use based on tin, has mixed the what is called of metals such as silver, zinc, bismuth, indium, antimony and has not had lead-tin soldering.
Method for welding of the present invention is to have on the substrate in the brazing district that has implemented electroless plating nickel on the surface, adopts the above-mentioned welding agent for braze of printing such as serigraphy, and mounting soldering on above-mentioned welding zone then, heating reflux soldering, and soldering is engaged with welding zone.As the soldering ball, from environment, preferably form by above-mentioned no lead-tin soldering.The backflow of soldering ball, after printing, for example 150～200 ℃ of following preheatings, or not preheating is directly heated under 170～250 ℃ temperature and is carried out.Printing and backflow can be carried out in atmosphere, also can carry out in inert gases such as nitrogen, argon, helium.
In the present invention, also can have on the substrate in the brazing district that has implemented electroless plating nickel on the surface, printing is the paste of above-mentioned welding agent for braze and soldering powder, heats then paste is refluxed, at last formation soldering alloy.
Embodiment
Below enumerate embodiment welding agent for braze of the present invention is elaborated, but the present invention has more than and is limited to following embodiment.
＜experimental example 1～8 and comparative example 1～7 〉
[selection of mantoquita and activating agent]
As slaine, select following material.
A：(C
17H
35COO)
2Cu
B：(C
7H
15COO)
2Cu
C：(C
21H
43COO)
2Cu
D：(C
17H
35COO)
2Pb
As activating agent, select following material.
E：C
7H
15COOH
F：C
17H
35COOH
G：C
21H
43COOH
H：(CH
3)
2CHNH
2·HCl
Here, acid strong and weak order is H＞E＞F＞G.
[modulation of rosin flux]
WW level ト one Le rosin 70 weight portions
Hexyl carbitol 25 weight portions
Rilanit special 5 weight portions
According to above-mentioned prescription each material is mixed, be heated to 120 ℃ and make its fusion, cool to room temperature, the solder flux that modulation has viscosity.
[modulation of acrylic acid solder flux]
Acrylic resin (the パ ラ ロ イ De B-48N of ロ one system ア Application De Ha one ス society system) 50 weight portion hexyl carbitols, 45 weight portion rilanit specials, 5 weight portions
According to above-mentioned prescription each material is mixed, be heated to 120 ℃ and make its fusion, cool to room temperature, the solder flux that modulation has viscosity.
[modulation of mantoquita, activating agent mixing solder flux]
The solder flux of the slaine selected previously and activating agent and above-mentioned modulation is mixed, be heated to 100 ℃ and make its fusion, cool to room temperature.The kind and the mixed proportion (weight %) of solder flux, slaine and the activating agent that uses are shown in table 1.
Table 1
Unit: weight %
| The basis solder flux | Slaine | Activating agent | |
| Embodiment 1 | Rosin flux: 90 | A：10 | - |
| Embodiment 2 | Rosin flux: 88 | A：10 | F：2 |
| Embodiment 3 | Rosin flux: 88 | A：10 | G：2 |
| Embodiment 4 | Rosin flux: 88 | B：10 | E：2 |
| Embodiment 5 | Rosin flux: 88 | C：10 | G：2 |
| Embodiment 6 | Rosin flux: 88 | D：10 | F：2 |
| Embodiment 7 | Acrylic acid solder flux: 88 | A：10 | F：2 |
| Embodiment 8 | Acrylic acid solder flux: 88 | A：10 | G：2 |
| Comparative example 1 | Rosin flux: 100 | - | - |
| Comparative example 2 | Rosin flux: 88 | A：10 | E：2 |
| Comparative example 3 | Rosin flux: 88 | A：10 | H：2 |
| Comparative example 4 | Rosin flux: 88 | C：10 | F：2 |
| Comparative example 5 | Acrylic acid solder flux: 90 | A：10 | - |
| Comparative example 6 | Acrylic acid solder flux: 88 | A：10 | E：2 |
| Comparative example 7 | Acrylic acid solder flux: 88 | A：10 | H：2 |
[mensuration of insulaion resistance]
On comb pattern, disposed on the substrate of welding zone the solder flux for preparing with in each embodiment of the thickness printing table 1 of 100 μ m and the comparative example, become the β shape, under 250 ℃ of maximum temperatures, refluxed.The solvent that is used for determination of insulation resistance has 2 kinds of solder flux having placed 1 month under solder flux after the firm manufacturing and 40 ℃.Again behind the levelling, on substrate, add the voltage of DC50V, in 85 ℃ of temperature, relative humidity 85% atmosphere, place after 1000 hours, carry out the determination of insulation resistance between welding zone according to the method for testing of JIS Z 3197.
[mensuration of bond strength]
In the brazing district on the substrate, implement electroless plating nickel, implement the flash plating of gold more thereon, form the welding zone of diameter 0.4mm, on this substrate with 100 μ m thickness with each embodiment of table 1 and the solder flux of comparative example (just having made the back solder flux), printing becomes the β shape.
Then, tower carries the Sn-3.5Ag-0.5Cu soldering of diameter 0.6mm on this welding zone, and levelling makes soldering engage with welding zone again.Then, this substrate be impregnated in the sonic washing machine of the BC solution that is equipped with 60 ℃ and wash, solder flux is removed.
Then, measure the bond strength (heated type バ Application プ プ Le intensity) of soldering ball with the system DAGE-SERIES-4000P of DAGE society.Measure and respectively to carry out 30 points, with its mean value as bond strength, with minimum of a value as minimum bond strength.
[wetability evaluation]
Placing each embodiment of 0.025g table 1 and each solder flux of comparative example (solder flux after just having made) on the copper coin that has carried out 1 hour acidification under 150 ℃, carrying the Sn-Pb soldering ball of diameter 1mm in the above, with 230 ℃ hot plate heating 1 minute.Then, measure the height of soldering, calculate the wetting rate of spread by following formula.The wetting rate of spread is used to estimate the active power of activating agent, and the wetting rate of spread is high more, represents that then the active power of activating agent is high more.
The wetting rate of spread=(1-soldering height) * 100
These result of the test is shown in table 2.
Table 2
As shown in table 2, even the solder flux of embodiment 1～8 can not make insulaion resistance reduce significantly after placing 1 month under 40 ℃ yet.In contrast to this, in comparative example 2,3,4,6,7, the poor stability of slaine if use 40 ℃ of solder flux of placing down after 1 month, finds that insulaion resistance reduces.
In addition, all keeping high bond strength at the solder flux of embodiment 1～8.In contrast to this, in comparative example 1,, a little less than the therefore average bond strength, and there is the point that shows extremely low bond strength owing to do not contain slaine.In addition, in comparative example 5, owing to a little less than the active power, therefore show the low wetting rate of spread.
Claims (9)
1, a kind of method for welding, it is to print welding agent for braze on having implemented the substrate with brazing district of electroless plating nickel on the surface, places the soldering ball then on above-mentioned welding zone, heating refluxes the soldering ball, with the method for welding of soldering ball bond to the welding zone,
It is characterized in that, described welding agent for braze contains resin, activating agent and the solvent with film forming ability, total amount with respect to solder flux, it contains the metal salts of organic acids of 0.1～20 weight %, and above-mentioned activating agent is organic acid identical with the organic acid that constitutes above-mentioned metal salts of organic acids or the organic acid lower than its acidity, and this solder flux halide-containing not.
2, the described method for welding of claim 1, wherein above-mentioned soldering ball is unleaded.
3, a kind of method for welding, it is to have implemented the paste that printing on the substrate with brazing district of electroless plating nickel has mixed welding agent for braze and soldering powder on the surface, heating refluxes paste then, forms the method for welding of soldering alloy on welding zone,
It is characterized in that, described welding agent for braze contains resin, activating agent and the solvent with film forming ability, total amount with respect to solder flux, it contains the metal salts of organic acids of 0.1～20 weight %, and above-mentioned activating agent is organic acid identical with the organic acid that constitutes above-mentioned metal salts of organic acids or the organic acid lower than its acidity, and this solder flux halide-containing not.
4, claim 1 or 3 described method for welding, wherein above-mentioned metal salts of organic acids is the slaine that is selected from gold, silver, copper, lead, zinc, bismuth, indium, antimony and nickel.
5, the described method for welding of claim 4, wherein above-mentioned metal salts of organic acids is the organic acid mantoquita.
6, claim 1 or 3 described method for welding, wherein above-mentioned metal salts of organic acids is not for comprising that carbon number carboxyl, alkyl is the slaine of 7～21 saturated fatty acid.
7, claim 1 or 3 described method for welding, wherein above-mentioned resin with film forming ability is rosin or acrylic resin.
8, the described method for welding of claim 7, wherein above-mentioned resin with film forming ability is a rosin, and this rosin double as activating agent.
9, adopt claim 1 or 3 described method for welding to engage the printed base plate of soldering.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP236407/2004 | 2004-08-16 | ||
| JP2004236407A JP4213642B2 (en) | 2004-08-16 | 2004-08-16 | Soldering flux, soldering method and printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1736653A CN1736653A (en) | 2006-02-22 |
| CN100571965C true CN100571965C (en) | 2009-12-23 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100973159A Active CN100571965C (en) | 2004-08-16 | 2004-11-26 | Welding agent for braze, method for welding and printed base plate |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4213642B2 (en) |
| KR (1) | KR101117884B1 (en) |
| CN (1) | CN100571965C (en) |
| MY (1) | MY140781A (en) |
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| KR101140462B1 (en) * | 2010-07-02 | 2012-04-30 | 김성균 | Solder Paste and Flux for Aluminum |
| JP5531188B2 (en) * | 2012-03-12 | 2014-06-25 | 株式会社弘輝 | Flux, solder composition and method for manufacturing electronic circuit mounting board |
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| CN104625288A (en) * | 2014-12-23 | 2015-05-20 | 常熟高嘉能源科技有限公司 | Solar cell welding process |
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| JP6940963B2 (en) * | 2017-03-10 | 2021-09-29 | 株式会社タムラ製作所 | Flux composition and solder paste |
| CN109014656A (en) * | 2018-08-24 | 2018-12-18 | 云南科威液态金属谷研发有限公司 | A kind of halogen-free scaling powder and its preparation method and application |
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| KR102591564B1 (en) * | 2021-09-15 | 2023-10-19 | 엘에스이브이코리아 주식회사 | Laser Soldering System |
| CN114434047B (en) * | 2021-11-25 | 2023-02-28 | 浙江亚通新材料股份有限公司 | Soldering flux for indium-based solder low-temperature welding and preparation method thereof |
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|---|---|---|---|---|
| CN85102604A (en) * | 1985-04-06 | 1985-12-20 | 福建师范大学 | Resina-type flux of brazing |
| CN1047238A (en) * | 1989-05-09 | 1990-11-28 | 化学工业部晨光化工研究院一分院 | A kind of flux assistant for tin soldering of printed circuit board |
| CN1110205A (en) * | 1994-04-06 | 1995-10-18 | 化学工业部晨光化工研究院成都分院 | Non-halogen non-rosin type low solid content non-cleaning scaling powder |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3867116B2 (en) * | 2002-02-15 | 2007-01-10 | ハリマ化成株式会社 | Soldering flux |
-
2004
- 2004-08-16 JP JP2004236407A patent/JP4213642B2/en active Active
- 2004-10-25 KR KR1020040085304A patent/KR101117884B1/en active IP Right Grant
- 2004-11-24 MY MYPI20044864A patent/MY140781A/en unknown
- 2004-11-26 CN CNB2004100973159A patent/CN100571965C/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN85102604A (en) * | 1985-04-06 | 1985-12-20 | 福建师范大学 | Resina-type flux of brazing |
| CN1047238A (en) * | 1989-05-09 | 1990-11-28 | 化学工业部晨光化工研究院一分院 | A kind of flux assistant for tin soldering of printed circuit board |
| CN1110205A (en) * | 1994-04-06 | 1995-10-18 | 化学工业部晨光化工研究院成都分院 | Non-halogen non-rosin type low solid content non-cleaning scaling powder |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2006051532A (en) | 2006-02-23 |
| KR101117884B1 (en) | 2012-03-07 |
| MY140781A (en) | 2010-01-15 |
| KR20060016056A (en) | 2006-02-21 |
| JP4213642B2 (en) | 2009-01-21 |
| CN1736653A (en) | 2006-02-22 |
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