CN100570910C - 表面安装型led - Google Patents

表面安装型led Download PDF

Info

Publication number
CN100570910C
CN100570910C CN 200610126547 CN200610126547A CN100570910C CN 100570910 C CN100570910 C CN 100570910C CN 200610126547 CN200610126547 CN 200610126547 CN 200610126547 A CN200610126547 A CN 200610126547A CN 100570910 C CN100570910 C CN 100570910C
Authority
CN
China
Prior art keywords
side electrode
substrate
surface mounting
face side
led
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 200610126547
Other languages
English (en)
Chinese (zh)
Other versions
CN1921162A (zh
Inventor
小川芳宏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Stanley Electric Co Ltd
Original Assignee
Stanley Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stanley Electric Co Ltd filed Critical Stanley Electric Co Ltd
Publication of CN1921162A publication Critical patent/CN1921162A/zh
Application granted granted Critical
Publication of CN100570910C publication Critical patent/CN100570910C/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Led Device Packages (AREA)
CN 200610126547 2005-08-26 2006-08-25 表面安装型led Expired - Fee Related CN100570910C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005246734A JP4989867B2 (ja) 2005-08-26 2005-08-26 表面実装型ｌｅｄ
JP2005246734 2005-08-26

Publications (2)

Publication Number Publication Date
CN1921162A CN1921162A (zh) 2007-02-28
CN100570910C true CN100570910C (zh) 2009-12-16

Family

ID=37778805

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 200610126547 Expired - Fee Related CN100570910C (zh) 2005-08-26 2006-08-25 表面安装型led

Country Status (3)

Country Link
JP (1) JP4989867B2 (ja)
KR (1) KR101252675B1 (ja)
CN (1) CN100570910C (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5013596B2 (ja) 2007-02-19 2012-08-29 シチズン電子株式会社 裏面実装型ｌｅｄ
JP5099885B2 (ja) * 2007-04-06 2012-12-19 シチズン電子株式会社 発光ダイオード
JP5227693B2 (ja) * 2008-08-11 2013-07-03 スタンレー電気株式会社 半導体発光装置
JP6262816B2 (ja) * 2011-02-16 2018-01-17 ローム株式会社 Ｌｅｄモジュール
JP2012186450A (ja) 2011-02-16 2012-09-27 Rohm Co Ltd Ｌｅｄモジュール
JP5781801B2 (ja) * 2011-03-29 2015-09-24 シチズン電子株式会社 Ｌｅｄ発光装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS646038U (ja) * 1987-06-30 1989-01-13
JP2686568B2 (ja) * 1991-04-05 1997-12-08 シャープ株式会社 光学装置
JPH065926A (ja) * 1992-06-18 1994-01-14 Rohm Co Ltd チップ形発光ダイオード
JP3065509B2 (ja) * 1995-06-02 2000-07-17 スタンレー電気株式会社 表面実装型発光ダイオード
JP3930710B2 (ja) * 2000-09-13 2007-06-13 シチズン電子株式会社 チップ型発光ダイオード及びその製造方法
JP2005064047A (ja) * 2003-08-13 2005-03-10 Citizen Electronics Co Ltd 発光ダイオード

Also Published As

Publication number Publication date
JP4989867B2 (ja) 2012-08-01
KR20070024359A (ko) 2007-03-02
CN1921162A (zh) 2007-02-28
KR101252675B1 (ko) 2013-04-09
JP2007059837A (ja) 2007-03-08

Similar Documents

Publication Publication Date Title
CN212209306U (zh) 按键背光光源装置及背光键盘
CN100570910C (zh) 表面安装型led
CN101345283B (zh) 芯片部件型led及其制造方法
CN100376041C (zh) 发光二极管
TWI393241B (zh) 發光裝置、顯示器及其製造方法
US7977698B2 (en) System and method for surface mountable display
JP5350242B2 (ja) 光源装置及びこれを備えた液晶表示装置
US8860074B2 (en) Light emitting device, method of fabricating the same and lighting system having the same
WO2016153168A1 (ko) 차량램프용 메탈 피씨비 조립체 및 그 제조방법
EP2369652A2 (en) Light emitting device package and lighting system having the same
CN102147080B (zh) 背光单元和使用该背光单元的显示装置
JPH07235696A (ja) チップ部品型ｌｅｄ及びその製造方法
US20020057567A1 (en) Light-emitting diode illuminated light-emitting
TW200615654A (en) Backlight module
US7339196B2 (en) Packaging of SMD light emitting diodes
CN1679179A (zh) 表面安装型发光二极管
US9184349B2 (en) Light emitting device, adhesive having surface roughness, and lighting system having the same
CN103939810A (zh) 一种背光模组及其制造工艺
US6822265B2 (en) Light emitting diode
CN217635194U (zh) 一种线条灯带
CN101457905A (zh) 发光单元
KR100808644B1 (ko) 표면 실장형 발광 다이오드 램프 및 그 제조 방법
CN210348144U (zh) 一种改善组装间隙的灯条
CN113707046A (zh) 灯板、显示终端及灯板的制备方法
CN101752470B (zh) 发光二极管结构的电镀制程改良方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20091216

Termination date: 20150825

EXPY Termination of patent right or utility model