CN100554499C - 用于对准托盘和托盘固定器的装置 - Google Patents
用于对准托盘和托盘固定器的装置 Download PDFInfo
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- CN100554499C CN100554499C CNB2006100004313A CN200610000431A CN100554499C CN 100554499 C CN100554499 C CN 100554499C CN B2006100004313 A CNB2006100004313 A CN B2006100004313A CN 200610000431 A CN200610000431 A CN 200610000431A CN 100554499 C CN100554499 C CN 100554499C
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- 239000000758 substrate Substances 0.000 claims abstract description 86
- 238000005452 bending Methods 0.000 claims abstract description 13
- 239000004020 conductor Substances 0.000 claims description 3
- 238000012546 transfer Methods 0.000 claims description 2
- 239000003795 chemical substances by application Substances 0.000 claims 2
- 239000012530 fluid Substances 0.000 claims 2
- 230000008021 deposition Effects 0.000 abstract description 8
- 230000015572 biosynthetic process Effects 0.000 abstract description 5
- 238000007740 vapor deposition Methods 0.000 description 13
- 239000011368 organic material Substances 0.000 description 10
- 230000033001 locomotion Effects 0.000 description 9
- 238000001771 vacuum deposition Methods 0.000 description 8
- 238000000151 deposition Methods 0.000 description 7
- 238000005401 electroluminescence Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 230000008016 vaporization Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000001360 synchronised effect Effects 0.000 description 4
- 238000009834 vaporization Methods 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000011553 magnetic fluid Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 230000027756 respiratory electron transport chain Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 210000001364 upper extremity Anatomy 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/191—Deposition of organic active material characterised by provisions for the orientation or alignment of the layer to be deposited
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroluminescent Light Sources (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Description
Claims (27)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020050000953 | 2005-01-05 | ||
KR1020050000948A KR100639003B1 (ko) | 2005-01-05 | 2005-01-05 | 기판트레이홀더용 정렬장치 |
KR1020050000948 | 2005-01-05 | ||
KR1020050000952 | 2005-01-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1800436A CN1800436A (zh) | 2006-07-12 |
CN100554499C true CN100554499C (zh) | 2009-10-28 |
Family
ID=36810637
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2006100004313A Active CN100554499C (zh) | 2005-01-05 | 2006-01-05 | 用于对准托盘和托盘固定器的装置 |
Country Status (2)
Country | Link |
---|---|
KR (1) | KR100639003B1 (zh) |
CN (1) | CN100554499C (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110573646A (zh) * | 2018-04-03 | 2019-12-13 | 应用材料公司 | 用于在真空腔室中的载体对准的设备和真空系统及对准载体的方法 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010110052A1 (ja) * | 2009-03-25 | 2010-09-30 | 芝浦メカトロニクス株式会社 | スパッタ成膜装置 |
US10276797B2 (en) * | 2014-11-17 | 2019-04-30 | Sharp Kabushiki Kaisha | Vapor deposition device, vapor deposition method, and method for manufacturing organic electroluminescence element |
KR20190116977A (ko) * | 2018-04-03 | 2019-10-15 | 어플라이드 머티어리얼스, 인코포레이티드 | 디바이스에 캐리어를 클램핑하기 위한 어레인지먼트 |
CN109023234B (zh) * | 2018-08-09 | 2020-08-28 | 深圳市华星光电半导体显示技术有限公司 | 一种掩膜板更换装置及更换方法 |
CN110066981B (zh) * | 2019-06-17 | 2023-11-28 | 浙江晶驰光电科技有限公司 | 正装基片定位装置及基片装载方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6589382B2 (en) | 2001-11-26 | 2003-07-08 | Eastman Kodak Company | Aligning mask segments to provide a stitched mask for producing OLED devices |
-
2005
- 2005-01-05 KR KR1020050000948A patent/KR100639003B1/ko not_active IP Right Cessation
-
2006
- 2006-01-05 CN CNB2006100004313A patent/CN100554499C/zh active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110573646A (zh) * | 2018-04-03 | 2019-12-13 | 应用材料公司 | 用于在真空腔室中的载体对准的设备和真空系统及对准载体的方法 |
Also Published As
Publication number | Publication date |
---|---|
CN1800436A (zh) | 2006-07-12 |
KR20060080468A (ko) | 2006-07-10 |
KR100639003B1 (ko) | 2006-10-26 |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20090109 Address after: Gyeonggi Do, South Korea Applicant after: Samsung Mobile Display Co., Ltd. Address before: Gyeonggi Do, South Korea Applicant before: Samsung SDI Co., Ltd. |
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ASS | Succession or assignment of patent right |
Owner name: SAMSUNG MOBILE DISPLAY CO., LTD. Free format text: FORMER OWNER: SAMSUNG SDI CO., LTD. Effective date: 20090109 |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: SAMSUNG DISPLAY CO., LTD. Free format text: FORMER OWNER: SAMSUNG MOBILE DISPLAY CO., LTD. Effective date: 20121018 |
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C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20121018 Address after: Gyeonggi Do, South Korea Patentee after: Samsung Display Co., Ltd. Address before: Gyeonggi Do, South Korea Patentee before: Samsung Mobile Display Co., Ltd. |