CN100544877C - 活动扫描场 - Google Patents
活动扫描场 Download PDFInfo
- Publication number
- CN100544877C CN100544877C CNB2004800278685A CN200480027868A CN100544877C CN 100544877 C CN100544877 C CN 100544877C CN B2004800278685 A CNB2004800278685 A CN B2004800278685A CN 200480027868 A CN200480027868 A CN 200480027868A CN 100544877 C CN100544877 C CN 100544877C
- Authority
- CN
- China
- Prior art keywords
- wave beam
- scanning field
- control signal
- field
- size
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 210000001747 pupil Anatomy 0.000 claims abstract description 47
- 230000000007 visual effect Effects 0.000 claims abstract description 34
- 230000001105 regulatory effect Effects 0.000 claims abstract description 32
- 238000012545 processing Methods 0.000 claims abstract description 21
- 239000000758 substrate Substances 0.000 claims description 36
- 238000000034 method Methods 0.000 claims description 35
- 238000003913 materials processing Methods 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 18
- 238000012856 packing Methods 0.000 claims description 8
- 230000008569 process Effects 0.000 claims description 7
- 230000003287 optical effect Effects 0.000 claims description 5
- 230000033228 biological regulation Effects 0.000 claims description 2
- 230000004807 localization Effects 0.000 claims description 2
- 230000008859 change Effects 0.000 description 13
- 238000003860 storage Methods 0.000 description 10
- 230000001429 stepping effect Effects 0.000 description 9
- 238000005459 micromachining Methods 0.000 description 8
- 238000011112 process operation Methods 0.000 description 7
- 238000005520 cutting process Methods 0.000 description 6
- 230000006870 function Effects 0.000 description 4
- 238000009434 installation Methods 0.000 description 3
- 238000003698 laser cutting Methods 0.000 description 3
- 238000005457 optimization Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000001276 controlling effect Effects 0.000 description 2
- 238000012937 correction Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000008520 organization Effects 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 241000931526 Acer campestre Species 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000001143 conditioned effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 230000011514 reflex Effects 0.000 description 1
- 238000010408 sweeping Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/351—Working by laser beam, e.g. welding, cutting or boring for trimming or tuning of electrical components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
- H01C17/24—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material
- H01C17/242—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material by laser
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
Abstract
Description
Claims (34)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US51204303P | 2003-10-17 | 2003-10-17 | |
US60/512,043 | 2003-10-17 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1856383A CN1856383A (zh) | 2006-11-01 |
CN100544877C true CN100544877C (zh) | 2009-09-30 |
Family
ID=34465306
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004800278685A Active CN100544877C (zh) | 2003-10-17 | 2004-10-18 | 活动扫描场 |
Country Status (5)
Country | Link |
---|---|
US (3) | US7238913B2 (zh) |
EP (1) | EP1680255A4 (zh) |
JP (1) | JP2007509368A (zh) |
CN (1) | CN100544877C (zh) |
WO (1) | WO2005037478A2 (zh) |
Families Citing this family (34)
Publication number | Priority date | Publication date | Assignee | Title |
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US7486705B2 (en) | 2004-03-31 | 2009-02-03 | Imra America, Inc. | Femtosecond laser processing system with process parameters, controls and feedback |
US7133188B2 (en) * | 2004-06-07 | 2006-11-07 | Electro Scientific Industries, Inc. | AOM modulation techniques employing an upstream Bragg adjustment device |
WO2005121889A2 (en) * | 2004-06-07 | 2005-12-22 | Electro Scientific Industries, Inc. | Aom modulation techniques for improving laser system performance |
US7885311B2 (en) | 2007-03-27 | 2011-02-08 | Imra America, Inc. | Beam stabilized fiber laser |
JP4199820B2 (ja) * | 2005-06-01 | 2008-12-24 | フェトン株式会社 | レーザー加工装置及びレーザー加工方法 |
US20080151951A1 (en) * | 2006-12-22 | 2008-06-26 | Elliott David J | Laser optical system |
US20090323739A1 (en) * | 2006-12-22 | 2009-12-31 | Uv Tech Systems | Laser optical system |
US7897924B2 (en) * | 2007-04-12 | 2011-03-01 | Imra America, Inc. | Beam scanning imaging method and apparatus |
US8847114B1 (en) * | 2007-05-07 | 2014-09-30 | Purdue Research Foundation | Laser-assisted micromachining system and method |
WO2009136189A1 (en) * | 2008-05-07 | 2009-11-12 | Ulive Enterprises Limited | Microstructuring |
GB2460648A (en) * | 2008-06-03 | 2009-12-09 | M Solv Ltd | Method and apparatus for laser focal spot size control |
JP4873578B2 (ja) * | 2009-09-07 | 2012-02-08 | 住友重機械工業株式会社 | レーザ加工装置及び加工条件の決定方法 |
EP2531322A1 (en) * | 2010-02-04 | 2012-12-12 | Echelon Laser Systems, Lp | Laser etching system and method |
KR101256954B1 (ko) * | 2010-06-15 | 2013-04-25 | (주)엔에스 | 레이저를 이용한 롤 필름 절단 장치 |
US20120097833A1 (en) * | 2010-10-22 | 2012-04-26 | Industrial Technology Research Institute | Laser scanning device |
US8669507B2 (en) * | 2010-10-22 | 2014-03-11 | Industrial Technology Research Institute | Laser scanning device |
FR2973118B1 (fr) * | 2011-03-24 | 2013-08-23 | Centre Nat Rech Scient | Dispositif numerique et adaptatif de focalisation d'un faisceau laser |
CN102751585B (zh) * | 2011-04-20 | 2015-03-11 | 深圳光启高等理工研究院 | 电磁波透镜、波束扫描装置及方法 |
TWI608886B (zh) | 2011-07-05 | 2017-12-21 | 電子科學工業股份有限公司 | 用於提供聲光束偏轉器與聲光調變器使用期間之溫度穩定性之系統與方法 |
ES2530070T3 (es) * | 2011-09-05 | 2015-02-26 | ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung | Aparato de marcado con una pluralidad de láseres y conjuntos ajustables individualmente de medios de desviación |
DK2565673T3 (da) | 2011-09-05 | 2014-01-06 | Alltec Angewandte Laserlicht Technologie Gmbh | Indretning og fremgangsmåde til markering af et objekt ved hjælp af en laserstråle |
EP2565994B1 (en) | 2011-09-05 | 2014-02-12 | ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung | Laser device and method for marking an object |
EP2564972B1 (en) * | 2011-09-05 | 2015-08-26 | ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung | Marking apparatus with a plurality of lasers, deflection means and telescopic means for each laser beam |
EP2564973B1 (en) * | 2011-09-05 | 2014-12-10 | ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung | Marking apparatus with a plurality of lasers and a combining deflection device |
ES2544269T3 (es) * | 2011-09-05 | 2015-08-28 | ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung | Aparato de marcado con una pluralidad de láseres de gas con tubos de resonancia y medios de deflexión ajustables individualmente |
EP2564976B1 (en) | 2011-09-05 | 2015-06-10 | ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung | Marking apparatus with at least one gas laser and heat dissipator |
ES2444504T3 (es) | 2011-09-05 | 2014-02-25 | ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung | Dispositivo láser con una unidad láser, y un recipiente de fluido para medios de refrigeración de dicha unidad láser |
JP5908705B2 (ja) * | 2011-11-30 | 2016-04-26 | 株式会社ディスコ | レーザー加工装置 |
FR2993805B1 (fr) | 2012-07-27 | 2014-09-12 | Phenix Systems | Dispositif de fabrication d'objets tridimensionnels par couches superposees et procede de fabrication associe |
WO2015161315A1 (en) * | 2014-04-18 | 2015-10-22 | Revolaze, LLC | Systems and methods for patterning using a laser |
GB2529453B (en) * | 2014-08-20 | 2019-04-17 | Datalase Ltd | Label imaging and cutting |
CN104616851B (zh) * | 2015-01-23 | 2017-09-29 | 洛阳冰岩激光设备有限公司 | 一种激光调阻机 |
US11260472B2 (en) * | 2016-12-30 | 2022-03-01 | Electro Scientific Industries, Inc. | Method and system for extending optics lifetime in laser processing apparatus |
EP3902666B1 (en) | 2018-12-27 | 2024-02-07 | LayerWise NV | Three-dimensional printing system optimizing contour formation for multiple energy beams |
Family Cites Families (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4289378A (en) * | 1978-06-21 | 1981-09-15 | Ernst Remy | Apparatus for adjusting the focal point of an operating laser beam focused by an objective |
US4532402A (en) * | 1983-09-02 | 1985-07-30 | Xrl, Inc. | Method and apparatus for positioning a focused beam on an integrated circuit |
US5168454A (en) * | 1989-10-30 | 1992-12-01 | International Business Machines Corporation | Formation of high quality patterns for substrates and apparatus therefor |
US5109149A (en) * | 1990-03-15 | 1992-04-28 | Albert Leung | Laser, direct-write integrated circuit production system |
US5171964A (en) * | 1990-07-23 | 1992-12-15 | International Business Machines Corporation | High accuracy, high flexibility, energy beam machining system |
US5362940A (en) * | 1990-11-09 | 1994-11-08 | Litel Instruments | Use of Fresnel zone plates for material processing |
US5293025A (en) * | 1991-08-01 | 1994-03-08 | E. I. Du Pont De Nemours And Company | Method for forming vias in multilayer circuits |
JPH07116869A (ja) * | 1993-10-21 | 1995-05-09 | Nippon Steel Corp | レーザ刻印方法 |
US5523543A (en) * | 1994-09-09 | 1996-06-04 | Litel Instruments | Laser ablation control system and method |
US5932119A (en) * | 1996-01-05 | 1999-08-03 | Lazare Kaplan International, Inc. | Laser marking system |
US5837962A (en) * | 1996-07-15 | 1998-11-17 | Overbeck; James W. | Faster laser marker employing acousto-optic deflection |
US5998759A (en) * | 1996-12-24 | 1999-12-07 | General Scanning, Inc. | Laser processing |
JPH1190988A (ja) * | 1997-09-25 | 1999-04-06 | Hyper Photon System:Kk | 光学系 |
US6366357B1 (en) * | 1998-03-05 | 2002-04-02 | General Scanning, Inc. | Method and system for high speed measuring of microscopic targets |
US6307799B1 (en) * | 1998-12-03 | 2001-10-23 | Nanyang Technological University | Acousto optic data storage system on a stationary and high density data storage media |
US6633338B1 (en) * | 1999-04-27 | 2003-10-14 | Gsi Lumonics, Inc. | Programmable illuminator for vision system |
WO2000064622A1 (en) * | 1999-04-27 | 2000-11-02 | Gsi Lumonics Inc. | Laser calibration apparatus and method |
JP2002542043A (ja) * | 1999-04-27 | 2002-12-10 | ジーエスアイ ルモニクス インコーポレイテッド | 多重レーザビームを使用する材料処理システム及び方法 |
US6341029B1 (en) * | 1999-04-27 | 2002-01-22 | Gsi Lumonics, Inc. | Method and apparatus for shaping a laser-beam intensity profile by dithering |
US6204955B1 (en) * | 1999-07-09 | 2001-03-20 | Advanced Optical Technologies, Inc. | Apparatus for dynamic control of light direction in a broad field of view |
DE50004665D1 (de) * | 1999-07-23 | 2004-01-15 | Heidelberg Instruments Mikrotechnik Gmbh | Verfahren zur erzeugung von mikrobohrungen |
CN1433350A (zh) * | 1999-11-29 | 2003-07-30 | 西门子公司 | 基板加工装置和采用这样的装置加工基板的方法 |
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US6483071B1 (en) * | 2000-05-16 | 2002-11-19 | General Scanning Inc. | Method and system for precisely positioning a waist of a material-processing laser beam to process microstructures within a laser-processing site |
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EP1238745A3 (en) * | 2001-03-07 | 2004-06-30 | Nec Corporation | Galvanometer controller and laser machining apparatus |
US6639177B2 (en) * | 2001-03-29 | 2003-10-28 | Gsi Lumonics Corporation | Method and system for processing one or more microstructures of a multi-material device |
KR100992262B1 (ko) * | 2001-06-13 | 2010-11-05 | 오르보테크 엘티디. | 기판 미세가공 시스템 |
US6875950B2 (en) * | 2002-03-22 | 2005-04-05 | Gsi Lumonics Corporation | Automated laser trimming of resistors |
US6951995B2 (en) * | 2002-03-27 | 2005-10-04 | Gsi Lumonics Corp. | Method and system for high-speed, precise micromachining an array of devices |
US6750974B2 (en) * | 2002-04-02 | 2004-06-15 | Gsi Lumonics Corporation | Method and system for 3D imaging of target regions |
US6787734B2 (en) * | 2002-07-25 | 2004-09-07 | Matsushita Electric Industrial Co., Ltd. | System and method of laser drilling using a continuously optimized depth of focus |
JP4515034B2 (ja) * | 2003-02-28 | 2010-07-28 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
US7425471B2 (en) * | 2004-06-18 | 2008-09-16 | Electro Scientific Industries, Inc. | Semiconductor structure processing using multiple laser beam spots spaced on-axis with cross-axis offset |
-
2004
- 2004-10-18 EP EP04795525A patent/EP1680255A4/en not_active Withdrawn
- 2004-10-18 CN CNB2004800278685A patent/CN100544877C/zh active Active
- 2004-10-18 US US10/967,895 patent/US7238913B2/en active Active
- 2004-10-18 JP JP2006535408A patent/JP2007509368A/ja active Pending
- 2004-10-18 WO PCT/US2004/034378 patent/WO2005037478A2/en active Application Filing
-
2007
- 2007-04-03 US US11/695,721 patent/US7402774B2/en active Active
- 2007-04-18 US US11/736,638 patent/US20070205186A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
US20070205186A1 (en) | 2007-09-06 |
EP1680255A4 (en) | 2008-10-08 |
US20070181546A1 (en) | 2007-08-09 |
US7238913B2 (en) | 2007-07-03 |
WO2005037478A2 (en) | 2005-04-28 |
US20050161444A1 (en) | 2005-07-28 |
WO2005037478A3 (en) | 2006-04-27 |
JP2007509368A (ja) | 2007-04-12 |
EP1680255A2 (en) | 2006-07-19 |
CN1856383A (zh) | 2006-11-01 |
US7402774B2 (en) | 2008-07-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: GSI LUMONICS CORP. Free format text: FORMER OWNER: GSI LUMONICS CORP. Effective date: 20131209 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20131209 Address after: Massachusetts, USA Patentee after: GSI Lumonics Corp. Address before: Massachusetts, USA Patentee before: Gsi Lumonics Corp. |
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ASS | Succession or assignment of patent right |
Owner name: ELECTRO SCIENT IND INC. Free format text: FORMER OWNER: GSI LUMONICS CORP. Effective date: 20150807 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20150807 Address after: oregon Patentee after: Electro Scient Ind Inc. Address before: Massachusetts, USA Patentee before: GSI Lumonics Corp. |