CN100523305C - 用于电解电镀的系统和方法 - Google Patents

用于电解电镀的系统和方法 Download PDF

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Publication number
CN100523305C
CN100523305C CNB028203887A CN02820388A CN100523305C CN 100523305 C CN100523305 C CN 100523305C CN B028203887 A CNB028203887 A CN B028203887A CN 02820388 A CN02820388 A CN 02820388A CN 100523305 C CN100523305 C CN 100523305C
Authority
CN
China
Prior art keywords
printed circuit
circuit board
pcb
cover
dividing plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB028203887A
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English (en)
Chinese (zh)
Other versions
CN1571865A (zh
Inventor
H·V·肯彭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Viasystems Group Inc
Original Assignee
Viasystems Group Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Viasystems Group Inc filed Critical Viasystems Group Inc
Publication of CN1571865A publication Critical patent/CN1571865A/zh
Application granted granted Critical
Publication of CN100523305C publication Critical patent/CN100523305C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • H05K3/0088—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor for treatment of holes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/024—Electroplating of selected surface areas using locally applied electromagnetic radiation, e.g. lasers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/20—Electroplating using ultrasonic waves
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
CNB028203887A 2001-10-19 2002-10-21 用于电解电镀的系统和方法 Expired - Fee Related CN100523305C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US34441701P 2001-10-19 2001-10-19
US60/344,417 2001-10-19

Related Child Applications (2)

Application Number Title Priority Date Filing Date
CN2009101458143A Division CN101570873B (zh) 2001-10-19 2002-10-21 用于电解电镀的系统和方法
CNA2006101467242A Division CN1962956A (zh) 2001-10-19 2002-10-21 用于电解电镀的系统和方法

Publications (2)

Publication Number Publication Date
CN1571865A CN1571865A (zh) 2005-01-26
CN100523305C true CN100523305C (zh) 2009-08-05

Family

ID=23350458

Family Applications (3)

Application Number Title Priority Date Filing Date
CNB028203887A Expired - Fee Related CN100523305C (zh) 2001-10-19 2002-10-21 用于电解电镀的系统和方法
CN2009101458143A Expired - Fee Related CN101570873B (zh) 2001-10-19 2002-10-21 用于电解电镀的系统和方法
CNA2006101467242A Pending CN1962956A (zh) 2001-10-19 2002-10-21 用于电解电镀的系统和方法

Family Applications After (2)

Application Number Title Priority Date Filing Date
CN2009101458143A Expired - Fee Related CN101570873B (zh) 2001-10-19 2002-10-21 用于电解电镀的系统和方法
CNA2006101467242A Pending CN1962956A (zh) 2001-10-19 2002-10-21 用于电解电镀的系统和方法

Country Status (8)

Country Link
US (1) US6818115B2 (enExample)
EP (1) EP1438446B1 (enExample)
JP (1) JP2005506447A (enExample)
KR (1) KR100660086B1 (enExample)
CN (3) CN100523305C (enExample)
AU (1) AU2002349972B2 (enExample)
ES (1) ES2449076T3 (enExample)
WO (1) WO2003033770A2 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103320844A (zh) * 2013-05-16 2013-09-25 陈焕宗 一种电镀工艺的面铜控制装置
TWI854044B (zh) * 2019-10-08 2024-09-01 美商應用材料股份有限公司 電鍍系統及電鍍一基板之方法

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4759834B2 (ja) * 2001-04-25 2011-08-31 凸版印刷株式会社 フィルムキャリア用電気めっき装置
US20050061660A1 (en) * 2002-10-18 2005-03-24 Kempen Hein Van System and method for electrolytic plating
EP1903129A1 (en) * 2003-11-20 2008-03-26 Process Automation International Limited A liquid delivery system for an electroplating apparatus, an electroplating apparatus with such a liquid delivery system, and a method of operating an electroplating apparatus
US7947161B2 (en) * 2004-03-19 2011-05-24 Faraday Technology, Inc. Method of operating an electroplating cell with hydrodynamics facilitating more uniform deposition on a workpiece with through holes
US7553401B2 (en) * 2004-03-19 2009-06-30 Faraday Technology, Inc. Electroplating cell with hydrodynamics facilitating more uniform deposition across a workpiece during plating
JP2011256444A (ja) * 2010-06-10 2011-12-22 Sumitomo Bakelite Co Ltd 基板の処理方法および処理装置
NL2005480C2 (nl) * 2010-10-07 2012-04-11 Meco Equip Eng Inrichting voor het eenzijdig elektrolytisch behandelen van een vlak substraat.
CN103590079A (zh) * 2012-08-14 2014-02-19 亚洲电镀器材有限公司 一种电镀方法
KR101457060B1 (ko) * 2014-04-30 2014-10-31 (주)네오피엠씨 진동전달기능을 갖는 도금장치
CN105862098B (zh) * 2016-06-22 2018-01-12 苏州翔邦达机电有限公司 适用于pcb板电镀的浮架系统
JP2020147831A (ja) * 2019-03-15 2020-09-17 三菱マテリアル株式会社 電解めっき装置、及び、電解めっき方法
CN112822873A (zh) * 2019-11-15 2021-05-18 宇泰和股份有限公司 高纵深比电路板通孔化学处理/电化学处理装置
CN112111779A (zh) * 2020-09-04 2020-12-22 深圳市欣佳宏科技有限公司 线路板电镀电源无线感应飞巴机构及电源无线感应方法
KR102751572B1 (ko) * 2024-05-23 2025-01-09 (주)티피에스일렉콤 피도금물의 도금 품질 개선 및 광택 저하 방지를 위한 도금장치

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3015282C2 (de) * 1980-04-21 1986-07-17 Siemens AG, 1000 Berlin und 8000 München Vorrichtung zum partiellen Galvanisieren von leitenden oder leitend gemachten Oberflächen
US4634503A (en) * 1984-06-27 1987-01-06 Daniel Nogavich Immersion electroplating system
US4696729A (en) * 1986-02-28 1987-09-29 International Business Machines Electroplating cell
JPH04500838A (ja) * 1988-10-25 1992-02-13 ベロルススキ　ポリテフニチェスキ　インスティテュト 電気化学加工のための装置
US4879007B1 (en) * 1988-12-12 1999-05-25 Process Automation Int L Ltd Shield for plating bath
DE4106733A1 (de) * 1991-03-02 1992-09-03 Schering Ag Vorrichtung zum abblenden von feldlinien in einer galvanikanlage (iii)
DE4337724A1 (de) * 1993-11-05 1995-05-11 Hoellmueller Maschbau H Vorrichtung zur Beschichtung der Wandung von Bohrungen in elektrischen Leiterplatten oder Multilayern
JP2002121699A (ja) * 2000-05-25 2002-04-26 Nippon Techno Kk めっき浴の振動流動とパルス状めっき電流との組み合わせを用いた電気めっき方法
US20030010625A1 (en) * 2001-07-16 2003-01-16 Gramarossa Daniel J. Processing cells for wafers and other planar articles

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103320844A (zh) * 2013-05-16 2013-09-25 陈焕宗 一种电镀工艺的面铜控制装置
TWI854044B (zh) * 2019-10-08 2024-09-01 美商應用材料股份有限公司 電鍍系統及電鍍一基板之方法
US12104269B2 (en) 2019-10-08 2024-10-01 Applied Materials, Inc. Mechanically-driven oscillating flow agitation

Also Published As

Publication number Publication date
CN1962956A (zh) 2007-05-16
US20030196904A1 (en) 2003-10-23
WO2003033770A3 (en) 2003-09-18
US6818115B2 (en) 2004-11-16
WO2003033770A2 (en) 2003-04-24
HK1136011A1 (zh) 2010-06-18
ES2449076T3 (es) 2014-03-18
AU2002349972B2 (en) 2006-08-24
CN101570873B (zh) 2011-08-03
EP1438446A4 (en) 2006-03-29
CN101570873A (zh) 2009-11-04
CN1571865A (zh) 2005-01-26
KR100660086B1 (ko) 2006-12-20
EP1438446A2 (en) 2004-07-21
JP2005506447A (ja) 2005-03-03
EP1438446B1 (en) 2012-06-20
KR20040058210A (ko) 2004-07-03

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20090805

Termination date: 20131021