CN100506693C - 热解制备的二氧化硅 - Google Patents
热解制备的二氧化硅 Download PDFInfo
- Publication number
- CN100506693C CN100506693C CNB2003801065855A CN200380106585A CN100506693C CN 100506693 C CN100506693 C CN 100506693C CN B2003801065855 A CNB2003801065855 A CN B2003801065855A CN 200380106585 A CN200380106585 A CN 200380106585A CN 100506693 C CN100506693 C CN 100506693C
- Authority
- CN
- China
- Prior art keywords
- powder
- sio
- gas
- oxygen
- silicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 28
- 239000000377 silicon dioxide Substances 0.000 title claims abstract description 12
- 235000012239 silicon dioxide Nutrition 0.000 title claims description 11
- 239000000843 powder Substances 0.000 claims abstract description 44
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 claims abstract description 36
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 25
- 239000001301 oxygen Substances 0.000 claims abstract description 25
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 25
- 239000007789 gas Substances 0.000 claims abstract description 20
- 150000003377 silicon compounds Chemical class 0.000 claims abstract description 9
- 239000000203 mixture Substances 0.000 claims abstract description 7
- 239000007787 solid Substances 0.000 claims abstract description 3
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 29
- 238000000034 method Methods 0.000 claims description 20
- 238000002360 preparation method Methods 0.000 claims description 12
- 229960001866 silicon dioxide Drugs 0.000 claims description 10
- 239000006185 dispersion Substances 0.000 claims description 8
- 239000001257 hydrogen Substances 0.000 claims description 8
- 229910052739 hydrogen Inorganic materials 0.000 claims description 8
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 7
- 239000007788 liquid Substances 0.000 claims description 6
- 238000000197 pyrolysis Methods 0.000 claims description 6
- 239000008246 gaseous mixture Substances 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 5
- -1 silicon halide Chemical class 0.000 claims description 4
- VXEGSRKPIUDPQT-UHFFFAOYSA-N 4-[4-(4-methoxyphenyl)piperazin-1-yl]aniline Chemical compound C1=CC(OC)=CC=C1N1CCN(C=2C=CC(N)=CC=2)CC1 VXEGSRKPIUDPQT-UHFFFAOYSA-N 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 claims description 3
- 239000005049 silicon tetrachloride Substances 0.000 claims description 3
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- 238000005253 cladding Methods 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 239000000945 filler Substances 0.000 claims description 2
- 239000004922 lacquer Substances 0.000 claims description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 2
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 2
- 229920002689 polyvinyl acetate Polymers 0.000 claims description 2
- 239000011118 polyvinyl acetate Substances 0.000 claims description 2
- 230000001105 regulatory effect Effects 0.000 claims description 2
- 229910052710 silicon Inorganic materials 0.000 claims description 2
- 239000010703 silicon Substances 0.000 claims description 2
- 229920002050 silicone resin Polymers 0.000 claims description 2
- 229920002379 silicone rubber Polymers 0.000 claims description 2
- 239000010409 thin film Substances 0.000 claims description 2
- 239000002245 particle Substances 0.000 description 7
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 230000001698 pyrogenic effect Effects 0.000 description 4
- 238000010191 image analysis Methods 0.000 description 3
- 229910003902 SiCl 4 Inorganic materials 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000001186 cumulative effect Effects 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000007062 hydrolysis Effects 0.000 description 2
- 238000006460 hydrolysis reaction Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000000376 reactant Substances 0.000 description 2
- 239000011541 reaction mixture Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 101100293222 Arabidopsis thaliana XI-K gene Proteins 0.000 description 1
- 238000003917 TEM image Methods 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 229910021485 fumed silica Inorganic materials 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000005055 methyl trichlorosilane Substances 0.000 description 1
- JLUFWMXJHAVVNN-UHFFFAOYSA-N methyltrichlorosilane Chemical compound C[Si](Cl)(Cl)Cl JLUFWMXJHAVVNN-UHFFFAOYSA-N 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 238000007873 sieving Methods 0.000 description 1
- FDNAPBUWERUEDA-UHFFFAOYSA-N silicon tetrachloride Chemical class Cl[Si](Cl)(Cl)Cl FDNAPBUWERUEDA-UHFFFAOYSA-N 0.000 description 1
- ZFAYZXMSTVMBLX-UHFFFAOYSA-J silicon(4+);tetrachloride Chemical compound [Si+4].[Cl-].[Cl-].[Cl-].[Cl-] ZFAYZXMSTVMBLX-UHFFFAOYSA-J 0.000 description 1
- 238000004448 titration Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/113—Silicon oxides; Hydrates thereof
- C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
- C01B33/18—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/113—Silicon oxides; Hydrates thereof
- C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
- C01B33/18—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof
- C01B33/181—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof by a dry process
- C01B33/183—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof by a dry process by oxidation or hydrolysis in the vapour phase of silicon compounds such as halides, trichlorosilane, monosilane
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/113—Silicon oxides; Hydrates thereof
- C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/50—Agglomerated particles
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/62—Submicrometer sized, i.e. from 0.1-1 micrometer
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/11—Powder tap density
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/12—Surface area
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/19—Oil-absorption capacity, e.g. DBP values
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/90—Other properties not specified above
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Silicon Compounds (AREA)
- Percussion Or Vibration Massage (AREA)
Abstract
Description
实施例 | 1 | 2 | 3 | 4 | 5 | 6 | |
SiCl<sub>4</sub> | kg/h | 500 | 500 | 500 | 500 | 500 | 500 |
H<sub>2</sub>芯体 | Nm<sup>3</sup>/h | 145 | 160 | 190 | 210 | 240 | 318 |
空气 | Nm<sup>3</sup>/h | 207 | 238 | 326 | 371 | 405 | 500 |
空气中氧气的含量 | Vol.% | 35 | 34 | 34 | 34 | 34 | 34 |
增加的空气(二次空气) | Nm<sup>3</sup>/h | 250 | 250 | 250 | 250 | 250 | 250 |
H<sub>2</sub>套筒 | Nm<sup>3</sup>/h | 15 | 15 | 15 | 15 | 15 | 15 |
λ | 1.0 | 1.0 | 1.0 | 1.0 | 1.0 | 1.0 | |
γ | 1.0 | 1.2 | 1.4 | 1.6 | 1.8 | 2.4 |
实施例 | 1 | 2 | 3 | 4 | 5 | 6 | |
BET | m2/g | 46 | 43 | 46 | 50 | 46 | 96 |
DBP | g/100g | 76 | 91 | 96 | 107 | 127 | 127 |
夯实密度<sup>($)</sup> | g/l | 53 | 38 | 33 | 28 | 25 | 28 |
pH(<sup>#</sup>) | 4.5 | 4.5 | 4.7 | 4.7 | 4.8 | 4.6 |
Claims (11)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10258858A DE10258858A1 (de) | 2002-12-17 | 2002-12-17 | Pyrogen hergestelltes Siliciumdioxid |
DE10258858.9 | 2002-12-17 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1726169A CN1726169A (zh) | 2006-01-25 |
CN100506693C true CN100506693C (zh) | 2009-07-01 |
Family
ID=32518993
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2003801065855A Expired - Lifetime CN100506693C (zh) | 2002-12-17 | 2003-12-16 | 热解制备的二氧化硅 |
Country Status (9)
Country | Link |
---|---|
US (1) | US7541014B2 (zh) |
EP (1) | EP1572586B1 (zh) |
JP (1) | JP4511941B2 (zh) |
KR (1) | KR101080562B1 (zh) |
CN (1) | CN100506693C (zh) |
AT (1) | ATE497930T1 (zh) |
AU (1) | AU2003292247A1 (zh) |
DE (2) | DE10258858A1 (zh) |
WO (1) | WO2004054928A1 (zh) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6223165B1 (en) * | 1999-03-22 | 2001-04-24 | Keen.Com, Incorporated | Method and apparatus to connect consumer to expert |
DE10258858A1 (de) * | 2002-12-17 | 2004-08-05 | Degussa Ag | Pyrogen hergestelltes Siliciumdioxid |
DE102005001410A1 (de) | 2005-01-12 | 2006-07-20 | Degussa Ag | Pyrogen hergestelltes Siliciumdioxidpulver und Dispersion hiervon |
DE102005001408A1 (de) * | 2005-01-12 | 2006-07-20 | Degussa Ag | Pyrogen hergestelltes Siliciumdioxidpulver |
DE102005001409A1 (de) * | 2005-01-12 | 2006-07-20 | Degussa Ag | Pyrogen hergestelltes Siliciumdioxidpulver und dieses Pulver enthaltene Silikondichtmasse |
WO2008094928A1 (en) | 2007-01-29 | 2008-08-07 | Evonik Degussa Gmbh | Fumed metal oxides for investment casting |
ATE497483T1 (de) * | 2007-05-21 | 2011-02-15 | Evonik Degussa Gmbh | Pyrogen hergestelltes siliciumdioxid mit niedriger verdickungswirkung |
DE102007024096A1 (de) * | 2007-05-22 | 2008-11-27 | Evonik Degussa Gmbh | Klebstoffe |
EP2014622B1 (de) * | 2007-07-06 | 2017-01-18 | Evonik Degussa GmbH | Verfahren zur Herstellung eines Kieselglasgranulats |
DE102010031585A1 (de) | 2010-07-21 | 2012-01-26 | Evonik Degussa Gmbh | Siliciumdioxidpulver mit speziellen Oberflächeneigenschaften und dieses Pulver enthaltende Tonerzusammensetzung |
CN102513031B (zh) * | 2011-11-30 | 2014-04-16 | 广州吉必盛科技实业有限公司 | 一种脱酸工艺及其设备 |
EP3580173B1 (de) * | 2017-07-13 | 2021-10-20 | Wacker Chemie AG | Verfahren zur herstellung von hochdispersem siliciumdioxid |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE790704A (fr) * | 1971-10-28 | 1973-02-15 | Degussa | Procede pour la fabrication d'oxydes finement |
US6193795B1 (en) * | 1993-08-02 | 2001-02-27 | Degussa Corporation | Low structure pyrogenic hydrophilic and hydrophobic metallic oxides, production and use |
DE19530339A1 (de) * | 1995-08-18 | 1997-02-20 | Degussa | Pyrogene Kieselsäure, Verfahren zu ihrer Herstellung und Verwendung |
DE19616781A1 (de) * | 1996-04-26 | 1997-11-06 | Degussa | Silanisierte Kieselsäure |
US5959005A (en) * | 1996-04-26 | 1999-09-28 | Degussa-Huls Aktiengesellschaft | Silanized silica |
DE19847161A1 (de) * | 1998-10-14 | 2000-04-20 | Degussa | Mittels Aerosol dotiertes pyrogen hergestelltes Siliciumdioxid |
EP1148026B1 (de) * | 2000-04-12 | 2016-08-10 | Evonik Degussa GmbH | Dispersionen |
EP1182168B1 (de) | 2000-08-21 | 2004-05-12 | Degussa AG | Pyrogen hergestelltes Siliciumdioxid |
DE10239423A1 (de) * | 2002-08-28 | 2004-03-11 | Degussa Ag | Kieselsäure |
DE10258858A1 (de) * | 2002-12-17 | 2004-08-05 | Degussa Ag | Pyrogen hergestelltes Siliciumdioxid |
DE10326049A1 (de) | 2003-06-10 | 2004-12-30 | Degussa Ag | Flammenhydrolytisch hergestelltes Siliciumdioxid, Verfahren zu seiner Herstellung und Verwendung |
DE102005001410A1 (de) * | 2005-01-12 | 2006-07-20 | Degussa Ag | Pyrogen hergestelltes Siliciumdioxidpulver und Dispersion hiervon |
-
2002
- 2002-12-17 DE DE10258858A patent/DE10258858A1/de not_active Withdrawn
-
2003
- 2003-12-16 DE DE60336010T patent/DE60336010D1/de not_active Expired - Lifetime
- 2003-12-16 AU AU2003292247A patent/AU2003292247A1/en not_active Abandoned
- 2003-12-16 CN CNB2003801065855A patent/CN100506693C/zh not_active Expired - Lifetime
- 2003-12-16 AT AT03767810T patent/ATE497930T1/de not_active IP Right Cessation
- 2003-12-16 US US10/530,284 patent/US7541014B2/en active Active
- 2003-12-16 KR KR1020057011134A patent/KR101080562B1/ko active IP Right Grant
- 2003-12-16 WO PCT/EP2003/014326 patent/WO2004054928A1/en active Application Filing
- 2003-12-16 JP JP2004560437A patent/JP4511941B2/ja not_active Expired - Lifetime
- 2003-12-16 EP EP03767810A patent/EP1572586B1/en not_active Revoked
Also Published As
Publication number | Publication date |
---|---|
US20060093543A1 (en) | 2006-05-04 |
JP4511941B2 (ja) | 2010-07-28 |
DE60336010D1 (de) | 2011-03-24 |
CN1726169A (zh) | 2006-01-25 |
ATE497930T1 (de) | 2011-02-15 |
EP1572586B1 (en) | 2011-02-09 |
WO2004054928A1 (en) | 2004-07-01 |
KR101080562B1 (ko) | 2011-11-04 |
AU2003292247A1 (en) | 2004-07-09 |
EP1572586A1 (en) | 2005-09-14 |
KR20050091729A (ko) | 2005-09-15 |
DE10258858A1 (de) | 2004-08-05 |
JP2006509713A (ja) | 2006-03-23 |
US7541014B2 (en) | 2009-06-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN100506693C (zh) | 热解制备的二氧化硅 | |
US7351388B2 (en) | Pyrogenically produced silicon dioxide powder | |
CN1330570C (zh) | 热解二氧化硅及其分散体 | |
US7439298B2 (en) | Pyrogenically produced silicon dioxide powder and silicone sealing compound containing this powder | |
US7537833B2 (en) | Pyrogenically produced silicon dioxide powder and dispersion thereof | |
US7491375B2 (en) | Pyrogenically produced silicon dioxide powder | |
US6890873B2 (en) | Glass prepared from pyrogenically prepared silicon dioxide | |
US20070111880A1 (en) | Aluminium oxide powder produced by flame hydrolysis and having a large surface area | |
JP2008532901A (ja) | 熱分解により調整された二酸化ケイ素をベースとする顆粒、その製造方法及びその使用 | |
US9097996B2 (en) | Silicon dioxide powder having special surface properties and toner composition containing said powder | |
RU2395449C2 (ru) | Порошок смешанных оксидов, содержащий оксид щелочного металла, и силиконовый каучук, включающий этот порошок | |
JP6456786B2 (ja) | 球状酸化チタン粉末及びその製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: EVONIK DEGUSSA CO., LTD. Free format text: FORMER NAME: DECOUCHY STOCK COMPANY |
|
CP03 | Change of name, title or address |
Address after: essen Patentee after: Evonik Degussa GmbH Address before: Dusseldorf, Germany Patentee before: Degussa AG |
|
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: Essen, Germany Patentee after: Evonik Operations Ltd. Address before: Essen, Germany Patentee before: EVONIK DEGUSSA GmbH |
|
CX01 | Expiry of patent term | ||
CX01 | Expiry of patent term |
Granted publication date: 20090701 |