CN100493300C - Method for welding FPC plate with PCB plate and its dedicated clamp - Google Patents
Method for welding FPC plate with PCB plate and its dedicated clamp Download PDFInfo
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- CN100493300C CN100493300C CNB2006100607965A CN200610060796A CN100493300C CN 100493300 C CN100493300 C CN 100493300C CN B2006100607965 A CNB2006100607965 A CN B2006100607965A CN 200610060796 A CN200610060796 A CN 200610060796A CN 100493300 C CN100493300 C CN 100493300C
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- 238000000034 method Methods 0.000 title claims abstract description 33
- 238000003466 welding Methods 0.000 title claims abstract description 33
- 229910000679 solder Inorganic materials 0.000 claims abstract description 12
- 238000005476 soldering Methods 0.000 claims description 18
- 230000003044 adaptive effect Effects 0.000 claims description 3
- 230000002146 bilateral effect Effects 0.000 claims description 3
- 238000010992 reflux Methods 0.000 abstract description 2
- 238000010438 heat treatment Methods 0.000 description 15
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 208000002925 dental caries Diseases 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 230000002463 transducing effect Effects 0.000 description 1
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Abstract
The present invention offers a method of welding FPC board and PCB board, and the special fixture for this method which includes an upper-template and an under-template. The method includes the following steps: the first step, printing solder paste onto a big-piece PCB board composed of several small-piece PCB boards; the second step, using SMT to compose components onto the PCB board; the third step, fixing the PCB board in the slot of under-template of the fixture for locating; the fourth step, aligning the solder pad zones of FPC board and PCB board; the fifth step, covering the upper-template of the fixture to the upper-surface of the PCB board, and the overlapped area of solder-pad zone is 50%-80%, the under-surface of the upper-template should must maintain horizontal, rotating the block button on the under-template to fasten the upper-template; the sixth step, sending the fastened fixture into enclosed reflow oven for refluxing weld; the seventh step, taking off the template, checking the welding state between FPC board and PCB board. As the said welding method is less in steps and simple in its special fixture, the productive efficiency is high, and the cost is low.
Description
Technical field
The present invention relates to the welding method and the special fixture thereof of a kind of FPC plate and pcb board.
Background technology
The FPC plate is that flexible printed circuit board (Flexible Printed Circuit Board is called for short FPC) is the printed circuit board (PCB) made from flexible insulating substrate, has many pcb boards---the advantage that rigid printed circuit board does not possess.For example it can free bend, coiling, folding, can require to arrange arbitrarily according to space layout, and move arbitrarily and flexible, thereby reach integrated that the components and parts assembling is connected with lead at three dimensions.Utilize FPC can dwindle the volume of electronic product greatly, be suitable for the needs that electronic product develops to high density, miniaturization, high reliability direction.Therefore, FPC has obtained using widely on field such as space flight, military affairs, mobile communication, laptop computer, computer peripheral equipment, PDA, digital camera or product.FPC also has good thermal diffusivity and solderability and is easy to advantages such as load, integrated cost be lower, and the design that the FPC plate combines with the pcb board soft or hard has also remedied flexible parent metal not enough slightly on the element bearing capacity to a certain extent.Traditional FPC plate and the welding process flow between the pcb board: pcb board print solder paste → SMT paster (mounting components and parts) → reflow soldering components and parts → PULSE HEATING reflow soldering FPC plate.
PULSE HEATING reflow soldering (pulse-heated reflow soldering) is heated to two first-class in advance scaling powders, zinc-plated parts is enough to make melts soldering tin, mobile temperature, after the curing, between part and scolding tin, form a permanent electricapparatus and be connected.The PULSE HEATING solder reflow process mainly is by pulse current resistance welding electrode heating and cooling to be welded.In whole heating, backflow with will exert pressure in the cooling cycle.PULSE HEATING control transfers the energy to the thermode that is installed on the Reflow Soldering joint.Attached to the thermocouple on the thermode for repeatably, the thermal source control that continues provides feedback.Plumb joint directly contacts two parts.With an accurate pressure, transducing signal is given controller, starts the heat cycles of thermode.Thermode is given the FPC plate with heat conduction, and heat conduction subsequently is with the melts soldering tin between the pad of FPC plate and pcb board, and the zone of fusing begins to flow, and causes the joint of two-layer scolding tin.When controller termination reflux cycle, FPC plate and pcb board continue to keep together in cool cycles, so scolding tin solidifies the formation solder joint again.A good solder joint should be that scolding tin is fully in conjunction with two surfaces, in FPC plate and pcb board surface generation wetting (wetting).The processing step of PULSE HEATING reflow soldering:
1, pcb board is put into anchor clamps, and scaling powder is applied to pad;
2, the FPC plate is positioned in the anchor clamps, guarantees the aligning of two cover pads;
3, provide the technology commencing signal to welding controller;
4, welding controller drives plumb joint (thermode module) to part;
5, with a default pressure, beginning heating process; Preheating, welding, cooling.
Adopt the PULSE HEATING solder reflow process to have the following disadvantages a little:
1, must drop into the activity duration separately, increase the production turn around time, can't form continuous productive process with the SMT technological process;
2, separate unit once can only weld a slice FPC plate, when between different product, switching, devices such as the anchor clamps of need replacing product, pressure head, and just can weld after doing steps such as a series of debugging, check, like this, the PULSE HEATING Reflow Soldering is met sb. at the airport and must be shut down more than half an hour in this process, causes production efficiency extremely low;
3, every PULSE HEATING Reflow Soldering cost of meeting sb. at the airport all more than tens thousand of units, causes welding cost higher;
4, during the different single product of same batch of welding, its temperature curve has deviation (error is generally 5 degree～10 degree), causes product reliability poor;
5, the PULSE HEATING Reflow Soldering meet sb. at the airport employed thermode in routine duties its state one-period is also arranged, can't accomplish the height consistency, therefore also can influence product quality;
6, the PULSE HEATING Reflow Soldering is met sb. at the airport when welding, requires the back side of pcb board and the corresponding welding disking area of FPC plate that components and parts cannot be arranged, and the pcb board back side must be provided with fulcrum.
Summary of the invention
For overcoming above shortcoming, it is simple to the invention provides a kind of technology, production efficiency height, the welding method and the special fixture thereof of reliable FPC plate of product welding performance and pcb board.
For reaching above goal of the invention, the invention provides the welding method of a kind of FPC plate and pcb board, comprise the steps: the first step, large stretch of pcb board print solder paste that will be linked to be by multi-disc PCB platelet in second step, is carried out SMT with pcb board and is mounted components and parts; In the 3rd step, pcb board is fixed in the draw-in groove of lower clamping fixture plate and locatees; The 4th step, the pad bit alignment of FPC plate and pcb board; The 5th step was covered in the upper surface of pcb board with the upper clamping fixture plate, and the pad position is amassed 50%～80% by pressure surface, and the bottom surface of cope match-plate pattern must keep level, the rotary snap lock cope match-plate pattern of rotation lower bolster; In the 6th step, the anchor clamps after the locking are put into closed reflow ovens carry out reflow soldering; In the 7th step, the welding situation of checking FPC plate and pcb board is taken out in the demoulding.
Described pcb board by more than a slice in flakes the PCB platelet form sheet, every PCB platelet can weld a slice FPC plate at least.
Special fixture for the welding method of implementing described FPC plate and pcb board, comprise: a lower bolster, the surperficial two ends of this lower bolster respectively are provided with two rotary buckles symmetrically, the center of lower bolster is provided with the draw-in groove adaptive with pcb board, the degree of depth h of draw-in groove is less than pcb board thickness 0.1mm～0.2mm, the bilateral symmetry ground of draw-in groove bottom respectively is provided with a pair of reference column to upper process, draw-in groove bottom is provided with the hollow cavity of at least one lower bolster, and this hollow cavity body is used for components and parts that the exposed pcb board back side mounts in order to avoid touching; With a cope match-plate pattern, comprising: the hollow cavity of at least one cope match-plate pattern, this cope match-plate pattern hollow cavity body are used for components and parts that exposed pcb board front mounts in order to avoid touching; Cope match-plate pattern also is provided with and draw-in groove bottom reference column corresponding positioning hole, this location hole aimed to be inserted in behind reference column make the cope match-plate pattern level be covered in pcb board upper surface in the draw-in groove, the pad position of PCB is amassed 50%～80% by pressure surface, rotates rotary snap lock cope match-plate pattern.
Hollow cavity of described lower bolster and the hollow cavity of cope match-plate pattern are respectively two.
For ease of the demoulding, the surperficial two ends of described lower bolster also respectively are provided with a pair of demoulding hole symmetrically.
Because the said welding method step is few, special fixture is simple, cost is low, having saved the welding of traditional FPC plate and pcb board must adopt expensive PULSE HEATING Reflow Soldering to meet sb. at the airport, after the SMT that FPC plate and components and parts have been finished pcb board together mounts step, place closed reflow ovens to carry out reflow treatment and just can finish whole welding procedure.This method has following advantage:
1, the solder reflow process of FPC plate can form continuous productive process with traditional SMT components and parts attachment process, need not to carry out separately the PULSE HEATING reflow soldering process again;
2, all components and parts and the FPC plate on the disposable welding pcb board of the closed reflow ovens of employing, its welding temperature curve conformity is good, and the product of different batches has a narrow range of temperature, and the soldering reliability height is suitable for mass production;
3, the design of the back side of pcb board need not reserved back side fulcrum.
Description of drawings
Fig. 1 represents special fixture assembling schematic diagram of the present invention;
Fig. 2 represents FPC plate of the present invention and pcb board connection diagram;
Fig. 3 represents lower module schematic perspective view shown in Figure 1;
Fig. 4 represents cope match-plate pattern schematic perspective view shown in Figure 1;
Fig. 5 represents lower bolster generalized section shown in Figure 3.
Embodiment
Describe most preferred embodiment of the present invention in detail below in conjunction with accompanying drawing.
As shown in Figure 1, special fixture comprises: clamping has pcb board 300 between lower bolster 100 and cope match-plate pattern 200, two templates.
As shown in Figure 2, pcb board 300 is by the sheet that forms of PCB platelet 301 in flakes more than a slice, must leave enough spaces on the pcb board 300 and be used to mount FPC plate 303, every PCB platelet 301 can weld a slice FPC plate 303 at least, and pcb board is arranged with location hole 304 on 300 4 angles.In the present embodiment, become a large stretch of pcb board 300 in flakes by 10 PCB platelets 301, the edge of every PCB platelet 301 has a pad position 302 and even draws with FPC plate 303, and pad position 302 can be positioned at the centre of PCB platelet 301.
Cope match-plate pattern 200 as shown in Figure 4 comprises: the hollow cavity 201 of at least one cope match-plate pattern, this cope match-plate pattern hollow cavity body are used for components and parts that exposed pcb board 300 fronts mount in order to avoid touching; Cope match-plate pattern 200 also is provided with and draw-in groove 102 bottom reference columns 104 corresponding positioning hole 202, this location hole 202 aimed to be inserted in behind reference columns 104 make cope match-plate pattern 200 levels be covered in pcb board 300 upper surfaces in the draw-in groove 102, the pad position 302 of pcb board 300 is amassed 50%～80% by pressure surface, rotate rotary buckle 101 locking cope match-plate patterns 200.
As shown in Figure 5, because the degree of depth h of draw-in groove 102 is less than the thickness 0.1mm～0.2mm of pcb board, after like this in pcb board 300 is inserted draw-in groove 102, will be to upper process, after cope match-plate pattern 200 covered, lock rotary buckle 101, just can guarantee the seamless link of the pad position 302 of pcb board and FPC plate 303.
Adopt above-mentioned special fixture to implement the welding method of FPC plate provided by the invention and pcb board, detailed step is as follows:
1) large stretch of pcb board 300 print solder paste that will be linked to be by multi-disc PCB platelet 301, during the steel mesh print solder paste, its mesh and pcb board 300 pad ratios are 1:1, the suggestion of steel mesh thickness is: 0.13mm;
2) mounted the pcb board 300 of finishing components and parts from the taking-up of SMT chip mounter, put into lower bolster 100, four reference columns 104 of draw-in groove 102 bottoms are kept flat respectively with after the location hole 304 of pcb board 300 is aimed at, because draw-in groove 102 degree of depth are less than the thickness 0.1mm～0.2mm of pcb board 300, pcb board has part to upper process like this.
3) using the manual gripping FPC of tweezers plate 303 to aim at the pad position 302 of pcb board 300 mounts.
Whether 4) mount contraposition by the microscope sight check accurate.
5) cope match-plate pattern 200 is covered on the pcb board 300 along four reference columns 104 in the lower bolster 100, utilizes four buckles 101 in the lower bolster 100 that cope match-plate pattern 200 is locked then.In this process, must guarantee that FPC plate 303 pad positions 302 are amassed 50%～80% by pressure surface, the bottom surface of cope match-plate pattern 200 must keep level.For avoiding touching relevant components and parts, the zone beyond the pad position 302 of FPC plate 303, the bottom surface of cope match-plate pattern 200 can have depression, but projection cannot be arranged.
6) anchor clamps after the above-mentioned locking are put into closed reflow ovens and implemented welding, can carry out closed reflow soldering with the components and parts on FPC plate 303 and the pcb board 300 are disposable.
7) from closed reflow ovens, take out anchor clamps behind the stove excessively, anchor clamps are positioned on the demoulding base, the demoulding hole 105 of lower bolster 100 is aimed at base demoulding post, open the buckle 101 of lower bolster, take out cope match-plate pattern 200, and press lower bolster 100 downwards, the demoulding post jack-up pcb board 300 that will make progress is realized the demoulding.
8) welding by microscopic examination FPC plate 303 and pcb board 300 whether the bonding area deficiency arranged, overflow, rosin joint, warp, bad phenomenon such as off normal; Needing in time if any above-mentioned bad phenomenon, the notice stokehold personnel of mounting are corrected.
Through after the above-mentioned steps, just finished the welding of FPC plate and pcb board.
Claims (5)
1, the welding method of a kind of FPC plate (303) and pcb board (300) is characterized in that, comprises the steps:
The first step, large stretch of pcb board (300) print solder paste that will be linked to be by multi-disc PCB platelet (301) in second step, is carried out SMT with pcb board (300) and is mounted components and parts;
The 3rd goes on foot, and pcb board (300) is fixed on the interior location of draw-in groove (102) of lower clamping fixture plate (100);
In the 4th step, FPC plate (303) is aimed at the pad position (302) of pcb board (300);
The 5th step, upper clamping fixture plate (200) is covered in the upper surface of pcb board (300), pad position (302) is amassed 50%～80% by pressure surface, and the bottom surface of cope match-plate pattern (200) must keep level, rotary buckle (101) the locking cope match-plate pattern (200) of rotation lower bolster (100);
In the 6th step, the anchor clamps after the locking are put into closed reflow ovens carry out reflow soldering;
In the 7th step, the welding situation of checking FPC plate (303) and pcb board (300) is taken out in the demoulding.
2, the welding method of FPC plate according to claim 1 (303) and pcb board (300), it is characterized in that, described pcb board (300) by more than a slice in flakes PCB platelet (301) form large stretch ofly, every PCB platelet (301) can weld a slice FPC plate (303) at least.
3, be the special fixture of the enforcement described FPC plate of claim 1 (303) with the welding method of pcb board (300), it is characterized in that, described special fixture comprises: a lower bolster (100), the surperficial two ends of this lower bolster respectively are provided with two rotary buckles (101) symmetrically, lower bolster (100) center is provided with and the adaptive draw-in groove (102) of pcb board (300), the degree of depth h of draw-in groove is less than pcb board (300) thickness 0.1mm～0.2mm, the bilateral symmetry ground of draw-in groove bottom respectively is provided with a pair of reference column to upper process (104), draw-in groove bottom is provided with the hollow cavity of at least one lower bolster (103), and this hollow cavity body is used for components and parts that exposed pcb board (300) back side mounts in order to avoid touching; With a cope match-plate pattern (200), comprising: the hollow cavity of at least one cope match-plate pattern (201), this cope match-plate pattern hollow cavity body are used for components and parts that exposed pcb board (300) front mounts in order to avoid touching; Cope match-plate pattern (200) also is provided with and draw-in groove (102) bottom reference column (104) corresponding positioning hole (202), make cope match-plate pattern (200) level be covered in interior pcb board (300) upper surface of draw-in groove (102) with being inserted in behind this location hole (202) aligning reference column (104), PCB (300) pad position (302) is amassed 50%～80% by pressure surface, rotates rotary buckle (101) locking cope match-plate pattern (200).
4, special fixture according to claim 3 is characterised in that, hollow cavity of described lower bolster (103) and the hollow cavity of cope match-plate pattern (201) are respectively two.
5, special fixture according to claim 3 is characterised in that, the surperficial two ends of described lower bolster (100) also respectively are provided with two demoulding holes (105) symmetrically.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100607965A CN100493300C (en) | 2006-05-29 | 2006-05-29 | Method for welding FPC plate with PCB plate and its dedicated clamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100607965A CN100493300C (en) | 2006-05-29 | 2006-05-29 | Method for welding FPC plate with PCB plate and its dedicated clamp |
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| Publication Number | Publication Date |
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| CN101083878A CN101083878A (en) | 2007-12-05 |
| CN100493300C true CN100493300C (en) | 2009-05-27 |
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| CNB2006100607965A Active CN100493300C (en) | 2006-05-29 | 2006-05-29 | Method for welding FPC plate with PCB plate and its dedicated clamp |
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