CN103128401A - Jig bottom die used on hot press machine - Google Patents
Jig bottom die used on hot press machine Download PDFInfo
- Publication number
- CN103128401A CN103128401A CN2013100885250A CN201310088525A CN103128401A CN 103128401 A CN103128401 A CN 103128401A CN 2013100885250 A CN2013100885250 A CN 2013100885250A CN 201310088525 A CN201310088525 A CN 201310088525A CN 103128401 A CN103128401 A CN 103128401A
- Authority
- CN
- China
- Prior art keywords
- groove
- hot press
- bottom die
- bed die
- tool bed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Dry Formation Of Fiberboard And The Like (AREA)
Abstract
The invention provides a jig bottom die used on a hot press machine and relates to the field of hot press machines. The jig bottom die used on a hot press machine is composed of a bottom die substrate (1). A first groove (2) used for placing a printed circuit board (PCB) plate is arranged in the bottom die substrate (1). A second groove (3) is used for placing a flexible printed circuit (FPC) plate is further arranged in the bottom die substrate (1). A high temperature resistance material is arranged between the first groove (2) and the second groove (3). A third groove (4) used for placing the high temperature resistance material is arranged between the first groove (2) and the second groove (3). The high temperature resistance material is a quartz bar (5). The quartz bar (5) cooperates with the third groove (4) correspondingly. According to the technical scheme, the whole high temperature resistance performance of the jig bottom die is improved. Service life of the jig bottom die is prolonged, thus the effect of saving production operation cost is achieved.
Description
Technical field
The present invention relates to the hot press field, specifically belong to the tool bed die that is used on hot press.
Background technology
In electronic product manufacturing process, most operations all can relate to the use hot press.On the old thing platform of hot press, tend to place electronic product jig plate or the tool bed die of a suitable production operation.Current tool bed die mostly adopts plastic material, and the thermal head pressure ratio of hot press is larger, temperature is higher, and the tool bed die of plastic material can not resisted the high temperature that continues for a long time of hot press and a bit distortion does not occur under such state.Thus, the tool bed die of thermal head corresponding position distortion frequency is high, and causes deformation of products or scrap, thus the tool bed die that need to more renew, the cost of increase tool bed die.If adopt whole tool bed die high temperature resistant material to make, the tool bed die cost that so also improves.
Summary of the invention
The present invention aims to provide a kind of simple in structure, the tool bed die that is used on hot press easy to use.Mainly solve current tool bed die non-refractory and service life short problem.
To achieve these goals; the invention provides a kind of tool bed die that is used on hot press; consisted of by the bed die substrate; offer on described substrate be used to the first groove of laying pcb board; also offer on described substrate be used to the second groove of laying the FPC plate, be provided with exotic material between described the first groove and described the second groove.
Further, be provided be used to the three-flute of laying high-temperature material between described the first groove and described the second groove.
Further, described exotic material is quartz bar, described quartz bar and described corresponding cooperation of three-flute.
Use technical scheme of the present invention, because the job position of the thermal head of hot press is position between described the first groove and described the second groove, and according to technical scheme of the present invention, just in time be provided with exotic material between described the first groove and described the second groove, so improved the whole heat-resisting quantity of tool bed die, extended the service life of tool bed die.
Description of drawings
The Figure of description that consists of the application's a part is used to provide a further understanding of the present invention, and illustrative examples of the present invention and explanation thereof are used for explaining the present invention, do not consist of improper restriction of the present invention.In the accompanying drawings:
Fig. 1 shows the structural representation that is used in the embodiment of the tool bed die on hot press of the present invention.
The specific embodiment
Need to prove, in the situation that do not conflict, embodiment and the feature in embodiment in the application can make up mutually.Describe below with reference to the accompanying drawings and in conjunction with the embodiments the present invention in detail.
In the electronic product production process, the use of hot press is absolutely necessary.Yet hot press can be used for soldering, just relates to the soldering function of hot press herein.When operator when needing the pcb board of soldering and FPC plate to be placed in exactly to carry out soldering on tool bed die on hot press; relatively-high temperature high pressure due to the hot press generation; the tool bed die often can deform; thereby can affect the soldering validity of hot press; can make the welding of pcb board and FPC plate unsuccessful, cause material to be scrapped.
According to research, finding to produce on the tool bed die position that is out of shape is the position that the hot press thermal head is aimed at, the namely junction of pcb board and FPC plate.Therefore, the present invention is mainly that improve the position herein, satisfies the resistant to elevated temperatures requirement of tool bed die to reach.
Fig. 1 is the structural representation that is used in the embodiment of the tool bed die on hot press of the present invention.As shown in Figure 1; the invention provides a kind of tool bed die that is used on hot press; consisted of by bed die substrate 1; offer on described substrate 1 be used to the first groove 2 of laying pcb board; also offer on described substrate 1 be used to the second groove 3 of laying the FPC plate, be provided with exotic material between described the first groove 2 and described the second groove 3.
Current tool bed die due to lack heat-resisting quantity cause occurring in actual job the tool bed die often distortion the bad phenomenon such as scrap.Thereby, affected the quality of processed electronic product, more seriously even make processed electronic product scrap, the waste material has also just increased the cost of producing electronic product.According to the present embodiment technical scheme, just can solve easily this difficulty.And the tool bed die that technical solution of the present invention is made compared with the high temperature resistant material of full use is saved cost more.
The material of withstanding again high temperature also has service life, if exotic material is arranged on the tool bed die non-exchangely, so when service life of exotic material to the time, just need whole tool bed die is changed, also can cause waste to the production operation cost.Therefore,
Preferably, be provided be used to the three-flute 4 of laying high-temperature material between described the first groove 2 and described the second groove 3.Through so arranging, just can when exotic material reach service life, only need to change exotic material and just can.Thereby saved the production operation cost.
Of particular note exotic material has a variety ofly, and every kind of exotic material is used for all being fine on technical solution of the present invention, within also being included in protection domain of the present invention.After comprehensive many factors,
Preferably, described exotic material is quartz bar 5, described quartz bar 5 and described corresponding cooperation of three-flute 4.Described quartz bar 5 is placed in described three-flute 4.
The above is only the preferred embodiments of the present invention, is not limited to the present invention, and for a person skilled in the art, the present invention can have various modifications and variations.Within the spirit and principles in the present invention all, any modification of doing, be equal to replacement, improvement etc., within all should being included in protection scope of the present invention.
Claims (3)
1. tool bed die that is used on hot press; consisted of by bed die substrate (1); offer on described substrate (1) be used to the first groove (2) of laying pcb board; also offer on described substrate (1) be used to the second groove (3) of laying the FPC plate, it is characterized in that: be provided with exotic material between described the first groove (2) and described the second groove (3).
2. the tool bed die that is used on hot press according to claim 1, is characterized in that: be provided be used to the three-flute (4) of laying high-temperature material between described the first groove (2) and described the second groove (3).
3. the tool bed die that is used on hot press according to claim 2, it is characterized in that: described exotic material is quartz bar (5), described quartz bar (5) and corresponding cooperation of described three-flute (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013100885250A CN103128401A (en) | 2013-03-19 | 2013-03-19 | Jig bottom die used on hot press machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013100885250A CN103128401A (en) | 2013-03-19 | 2013-03-19 | Jig bottom die used on hot press machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103128401A true CN103128401A (en) | 2013-06-05 |
Family
ID=48489203
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013100885250A Pending CN103128401A (en) | 2013-03-19 | 2013-03-19 | Jig bottom die used on hot press machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103128401A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005159241A (en) * | 2003-11-28 | 2005-06-16 | Denso Corp | Soldering method and device, and method for manufacturing circuit board |
| US20060238107A1 (en) * | 2005-04-23 | 2006-10-26 | Samsung Electronics Co., Ltd. | Surface light source device and liquid crystal display having the same |
| CN101083878A (en) * | 2006-05-29 | 2007-12-05 | 深圳飞通光电子技术有限公司 | Method for welding FPC plate with PCB plate and its dedicated clamp |
| US20100134124A1 (en) * | 2006-07-06 | 2010-06-03 | Au Optronics Corp. | Misalignment detection devices |
| CN102858097A (en) * | 2012-09-04 | 2013-01-02 | 深圳市华星光电技术有限公司 | PCB (printed circuit board), laminating method for PCB and COF (chip on FPC (flexible printed circuit)), as well as liquid crystal display device |
| CN203140917U (en) * | 2013-03-19 | 2013-08-21 | 苏州市国晶电子科技有限公司 | Jig bottom die for hot press |
-
2013
- 2013-03-19 CN CN2013100885250A patent/CN103128401A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005159241A (en) * | 2003-11-28 | 2005-06-16 | Denso Corp | Soldering method and device, and method for manufacturing circuit board |
| US20060238107A1 (en) * | 2005-04-23 | 2006-10-26 | Samsung Electronics Co., Ltd. | Surface light source device and liquid crystal display having the same |
| CN101083878A (en) * | 2006-05-29 | 2007-12-05 | 深圳飞通光电子技术有限公司 | Method for welding FPC plate with PCB plate and its dedicated clamp |
| US20100134124A1 (en) * | 2006-07-06 | 2010-06-03 | Au Optronics Corp. | Misalignment detection devices |
| CN102858097A (en) * | 2012-09-04 | 2013-01-02 | 深圳市华星光电技术有限公司 | PCB (printed circuit board), laminating method for PCB and COF (chip on FPC (flexible printed circuit)), as well as liquid crystal display device |
| CN203140917U (en) * | 2013-03-19 | 2013-08-21 | 苏州市国晶电子科技有限公司 | Jig bottom die for hot press |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN202725794U (en) | Mould | |
| CN203140917U (en) | Jig bottom die for hot press | |
| CN103128401A (en) | Jig bottom die used on hot press machine | |
| CN201261042Y (en) | Electrical heating butt screw concave point punching mold | |
| CN103415158B (en) | A kind of pcb board heat insulation restricted driving journey heat pressing utensil | |
| CN204466068U (en) | A kind of FPC preformer precompressed pressure head | |
| CN206927796U (en) | A kind of floating type compensation 3D glass heaters | |
| CN202998693U (en) | Hot-pressing tool for PCB | |
| CN206960515U (en) | A kind of push-press type test chassis | |
| CN202683763U (en) | Die for mobile phone communication spring plate | |
| CN101562942A (en) | Assembling method based on die for processing PCB to improve utilization ratio of plates | |
| CN204524070U (en) | A kind of accurate feeding decompressor | |
| CN207011072U (en) | A kind of PCB high level superimposed plates being easily installed | |
| CN206314055U (en) | A kind of printed circuit board (PCB) | |
| CN204687335U (en) | A kind of heat pressing forming device for insulating materials | |
| CN204322771U (en) | A kind of tool manufactured for soft board | |
| CN203853421U (en) | Double-head curling machine for plate spring | |
| CN204069499U (en) | A kind of PCB jigsaw | |
| CN103491713B (en) | For the automatic board descending stripper of circuit board forming machine | |
| CN206100628U (en) | Hot melt mould of counterpointing in advance | |
| CN219372716U (en) | Improve tool of wave soldering bridging | |
| CN203537673U (en) | PCB locating and stroke-limiting hot-pressing fixture | |
| CN201562120U (en) | Mould pressing tool | |
| CN204991799U (en) | Four point type supports and battery of moulding plastics | |
| CN207266300U (en) | Ptc heater, which cures, uses afterbody backer's mould |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130605 |