CN100481438C - 划片路径中具有光学控制模块的晶片 - Google Patents
划片路径中具有光学控制模块的晶片 Download PDFInfo
- Publication number
- CN100481438C CN100481438C CNB2004800384275A CN200480038427A CN100481438C CN 100481438 C CN100481438 C CN 100481438C CN B2004800384275 A CNB2004800384275 A CN B2004800384275A CN 200480038427 A CN200480038427 A CN 200480038427A CN 100481438 C CN100481438 C CN 100481438C
- Authority
- CN
- China
- Prior art keywords
- ocm
- field
- control module
- wafer
- dicing paths
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
- G03F7/70433—Layout for increasing efficiency or for compensating imaging errors, e.g. layout of exposure fields for reducing focus errors; Use of mask features for increasing efficiency or for compensating imaging errors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54453—Marks applied to semiconductor devices or parts for use prior to dicing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Dicing (AREA)
Abstract
Description
Claims (2)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP03104953.9 | 2003-12-23 | ||
EP03104953 | 2003-12-23 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1898796A CN1898796A (zh) | 2007-01-17 |
CN100481438C true CN100481438C (zh) | 2009-04-22 |
Family
ID=34717249
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004800384275A Expired - Fee Related CN100481438C (zh) | 2003-12-23 | 2004-12-09 | 划片路径中具有光学控制模块的晶片 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7508051B2 (zh) |
EP (1) | EP1700340A1 (zh) |
JP (1) | JP2007516618A (zh) |
KR (1) | KR20060117974A (zh) |
CN (1) | CN100481438C (zh) |
WO (1) | WO2005064678A1 (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ATE485597T1 (de) | 2007-07-12 | 2010-11-15 | Nxp Bv | Integrierte schaltungen auf einem wafer und verfahren zur herstellung integrierter schaltungen |
JP5466820B2 (ja) * | 2007-10-18 | 2014-04-09 | ピーエスフォー ルクスコ エスエイアールエル | 半導体基板、及び半導体装置の製造方法 |
CN108957960A (zh) * | 2018-06-06 | 2018-12-07 | 中国电子科技集团公司第五十五研究所 | 一种提升衬底有效芯片数目的曝光方法 |
US10942444B2 (en) * | 2019-05-01 | 2021-03-09 | Nxp Usa, Inc. | Optical control modules for integrated circuit device patterning and reticles and methods including the same |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5129974A (en) * | 1990-08-23 | 1992-07-14 | Colorcode Unlimited Corporation | Microlabelling system and method of making thin labels |
JPH10274855A (ja) * | 1997-03-31 | 1998-10-13 | Mitsubishi Electric Corp | レチクルおよびそれによって転写されたパターンならびに補正方法 |
JP4301584B2 (ja) | 1998-01-14 | 2009-07-22 | 株式会社ルネサステクノロジ | レチクル、それを用いた露光装置、露光方法および半導体装置の製造方法 |
US6400173B1 (en) * | 1999-11-19 | 2002-06-04 | Hitachi, Ltd. | Test system and manufacturing of semiconductor device |
US6699627B2 (en) * | 2000-12-08 | 2004-03-02 | Adlai Smith | Reference wafer and process for manufacturing same |
US6503765B1 (en) * | 2001-07-31 | 2003-01-07 | Xilinx, Inc. | Testing vias and contacts in integrated circuit fabrication |
US20030034489A1 (en) * | 2001-08-16 | 2003-02-20 | Broadcom Corporation | Apparatus and method for a production testline to monitor CMOS SRAMs |
EP1466365A2 (en) * | 2001-09-28 | 2004-10-13 | Koninklijke Philips Electronics N.V. | Method of manufacturing an integrated circuit, integrated circuit obtained in accordance with said method, wafer provided with an integrated circuit obtained in accordance with the method, and system comprising an integrated circuit obtained by means of the method |
US6974653B2 (en) | 2002-04-19 | 2005-12-13 | Nikon Precision Inc. | Methods for critical dimension and focus mapping using critical dimension test marks |
US6967348B2 (en) * | 2002-06-20 | 2005-11-22 | Micron Technology, Inc. | Signal sharing circuit with microelectric die isolation features |
US7102363B2 (en) * | 2003-11-21 | 2006-09-05 | Neocera, Inc. | Method and system for non-contact measurement of microwave capacitance of miniature structures of integrated circuits |
-
2004
- 2004-12-09 US US10/584,102 patent/US7508051B2/en not_active Expired - Fee Related
- 2004-12-09 KR KR1020067012630A patent/KR20060117974A/ko not_active Application Discontinuation
- 2004-12-09 EP EP04801509A patent/EP1700340A1/en not_active Withdrawn
- 2004-12-09 JP JP2006546424A patent/JP2007516618A/ja not_active Withdrawn
- 2004-12-09 CN CNB2004800384275A patent/CN100481438C/zh not_active Expired - Fee Related
- 2004-12-09 WO PCT/IB2004/052721 patent/WO2005064678A1/en not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
WO2005064678A1 (en) | 2005-07-14 |
US20070111352A1 (en) | 2007-05-17 |
US7508051B2 (en) | 2009-03-24 |
KR20060117974A (ko) | 2006-11-17 |
EP1700340A1 (en) | 2006-09-13 |
JP2007516618A (ja) | 2007-06-21 |
CN1898796A (zh) | 2007-01-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: NXP CO., LTD. Free format text: FORMER OWNER: KONINKLIJKE PHILIPS ELECTRONICS N.V. Effective date: 20070817 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20070817 Address after: Holland Ian Deho Finn Applicant after: Koninkl Philips Electronics NV Address before: Holland Ian Deho Finn Applicant before: Koninklijke Philips Electronics N.V. |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090422 Termination date: 20201209 |