CN100478412C - 一种蓝宝石衬底化学机械抛光浆液 - Google Patents
一种蓝宝石衬底化学机械抛光浆液 Download PDFInfo
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- CN100478412C CN100478412C CNB2007100371637A CN200710037163A CN100478412C CN 100478412 C CN100478412 C CN 100478412C CN B2007100371637 A CNB2007100371637 A CN B2007100371637A CN 200710037163 A CN200710037163 A CN 200710037163A CN 100478412 C CN100478412 C CN 100478412C
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- mechanical polishing
- sapphire
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- 238000005498 polishing Methods 0.000 title claims abstract description 62
- 239000000126 substance Substances 0.000 title claims abstract description 25
- 229910052594 sapphire Inorganic materials 0.000 title claims description 51
- 239000010980 sapphire Substances 0.000 title claims description 51
- 239000000758 substrate Substances 0.000 title description 29
- 239000002245 particle Substances 0.000 claims abstract description 49
- 238000000227 grinding Methods 0.000 claims abstract description 37
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000011248 coating agent Substances 0.000 claims abstract description 6
- 238000000576 coating method Methods 0.000 claims abstract description 6
- 239000013543 active substance Substances 0.000 claims description 7
- 239000008367 deionised water Substances 0.000 claims description 7
- 229910021641 deionized water Inorganic materials 0.000 claims description 7
- 239000003795 chemical substances by application Substances 0.000 claims description 6
- 238000005516 engineering process Methods 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 6
- -1 polyoxyethylene sodium sulfate Polymers 0.000 claims description 5
- 239000004094 surface-active agent Substances 0.000 claims description 5
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 4
- 230000003750 conditioning effect Effects 0.000 claims description 4
- 229910019142 PO4 Inorganic materials 0.000 claims description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims description 3
- 239000010452 phosphate Substances 0.000 claims description 3
- 229920001495 poly(sodium acrylate) polymer Polymers 0.000 claims description 3
- 239000012736 aqueous medium Substances 0.000 claims description 2
- 239000002612 dispersion medium Substances 0.000 claims description 2
- 239000000725 suspension Substances 0.000 claims description 2
- 238000010792 warming Methods 0.000 claims description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims 2
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 claims 1
- 230000003746 surface roughness Effects 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 4
- 150000001875 compounds Chemical class 0.000 abstract description 3
- 229910052580 B4C Inorganic materials 0.000 abstract description 2
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 abstract description 2
- 229910000366 copper(II) sulfate Inorganic materials 0.000 abstract 2
- JZCCFEFSEZPSOG-UHFFFAOYSA-L copper(II) sulfate pentahydrate Chemical compound O.O.O.O.O.[Cu+2].[O-]S([O-])(=O)=O JZCCFEFSEZPSOG-UHFFFAOYSA-L 0.000 abstract 2
- 239000012190 activator Substances 0.000 abstract 1
- 239000003002 pH adjusting agent Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 description 12
- 238000012545 processing Methods 0.000 description 10
- 238000005253 cladding Methods 0.000 description 9
- 239000002002 slurry Substances 0.000 description 9
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 8
- 238000012360 testing method Methods 0.000 description 6
- 239000006061 abrasive grain Substances 0.000 description 5
- 238000007517 polishing process Methods 0.000 description 5
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000008187 granular material Substances 0.000 description 4
- 230000001105 regulatory effect Effects 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 239000010432 diamond Substances 0.000 description 3
- 229910003460 diamond Inorganic materials 0.000 description 3
- 238000003754 machining Methods 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- 239000011246 composite particle Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000010437 gem Substances 0.000 description 2
- 229910001751 gemstone Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
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- 229940051841 polyoxyethylene ether Drugs 0.000 description 2
- 229920000056 polyoxyethylene ether Polymers 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- NNMHYFLPFNGQFZ-UHFFFAOYSA-M sodium polyacrylate Chemical compound [Na+].[O-]C(=O)C=C NNMHYFLPFNGQFZ-UHFFFAOYSA-M 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 238000013019 agitation Methods 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- ZXVOCOLRQJZVBW-UHFFFAOYSA-N azane;ethanol Chemical compound N.CCO ZXVOCOLRQJZVBW-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
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- 238000005260 corrosion Methods 0.000 description 1
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- 238000004132 cross linking Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- MUJOIMFVNIBMKC-UHFFFAOYSA-N fludioxonil Chemical compound C=12OC(F)(F)OC2=CC=CC=1C1=CNC=C1C#N MUJOIMFVNIBMKC-UHFFFAOYSA-N 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 230000036571 hydration Effects 0.000 description 1
- 238000006703 hydration reaction Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
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- 239000004065 semiconductor Substances 0.000 description 1
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- 239000002904 solvent Substances 0.000 description 1
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Abstract
Description
Claims (6)
Priority Applications (1)
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CNB2007100371637A CN100478412C (zh) | 2007-02-06 | 2007-02-06 | 一种蓝宝石衬底化学机械抛光浆液 |
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CNB2007100371637A CN100478412C (zh) | 2007-02-06 | 2007-02-06 | 一种蓝宝石衬底化学机械抛光浆液 |
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CN101016439A CN101016439A (zh) | 2007-08-15 |
CN100478412C true CN100478412C (zh) | 2009-04-15 |
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CNB2007100371637A Active CN100478412C (zh) | 2007-02-06 | 2007-02-06 | 一种蓝宝石衬底化学机械抛光浆液 |
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Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101302403B (zh) * | 2008-07-03 | 2011-10-19 | 大连理工大学 | 用于大尺寸金刚石晶圆超精密低损伤抛光的抛光液及制备方法 |
JP5819076B2 (ja) * | 2010-03-10 | 2015-11-18 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
CN102212334B (zh) * | 2011-04-19 | 2013-06-26 | 浙江露笑光电有限公司 | 蓝宝石衬底片粗磨研磨液及其配制方法 |
CN102773933B (zh) * | 2011-05-13 | 2014-11-05 | 江苏协鑫硅材料科技发展有限公司 | 线切割回收液的化学处理方法 |
TWI453273B (zh) * | 2011-11-07 | 2014-09-21 | Uwiz Technology Co Ltd | 研漿組成物及其用途 |
CN102911606A (zh) * | 2012-11-10 | 2013-02-06 | 长治虹源科技晶片技术有限公司 | 一种蓝宝石抛光液及配制方法 |
CN103072988B (zh) * | 2013-01-09 | 2014-07-16 | 烟台同立高科新材料股份有限公司 | 一种蓝宝石用研磨废浆中的碳化硼回收利用的方法 |
CN103072989B (zh) * | 2013-01-09 | 2014-07-09 | 烟台同立高科新材料股份有限公司 | 一种蓝宝石用抛光废浆中的碳化硼回收利用的方法 |
CN104559798B (zh) * | 2014-12-24 | 2017-08-29 | 上海新安纳电子科技有限公司 | 一种氧化铝基化学机械抛光液 |
CN105479606B (zh) * | 2015-11-20 | 2017-04-05 | 东北大学 | 一种用碳化硼刃料切割蓝宝石的方法 |
CN106281045A (zh) * | 2016-08-11 | 2017-01-04 | 广州市新稀冶金化工有限公司 | 一种用于不锈钢精密抛光的纳米材料配方及其制备工艺 |
CN106566473A (zh) * | 2016-10-28 | 2017-04-19 | 扬州翠佛堂珠宝有限公司 | 一种红宝石研磨液 |
CN107083192A (zh) * | 2017-04-17 | 2017-08-22 | 黄美香 | 一种氧化铝抛光液的制备方法 |
CN110591562A (zh) * | 2019-09-12 | 2019-12-20 | 江苏吉星新材料有限公司 | 一种用于蓝宝石研磨抛光工艺的抛光液及其制备方法 |
CN111073520B (zh) * | 2019-12-25 | 2021-09-03 | 苏州纳迪微电子有限公司 | 碳化硅晶圆片抛光用抛光粉及其制备方法、抛光液 |
CN112457780A (zh) * | 2020-12-20 | 2021-03-09 | 长沙县新光特种陶瓷有限公司 | 一种用于碳化硅晶片的抛光粉生产方法 |
CN115651608B (zh) * | 2022-10-31 | 2024-03-26 | 太仓硅源纳米材料有限公司 | 一种纳米氧化铝复合磨粒的制备方法及应用 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1334849A (zh) * | 1998-09-24 | 2002-02-06 | 联合讯号公司 | 用于低介电常数材料的氧化抛光淤浆 |
WO2004053013A2 (de) * | 2002-12-10 | 2004-06-24 | Treibacher Schleifmittel Gmbh | Schleifmittel mit verbesserten schleifeigenschaften |
CN1629246A (zh) * | 2003-12-15 | 2005-06-22 | 长兴化学工业股份有限公司 | 化学机械研磨浆液及其使用方法 |
CN1635043A (zh) * | 2003-12-25 | 2005-07-06 | 长兴化学工业股份有限公司 | 用于彩色光阻材料平面化的研磨浆液 |
CN1654585A (zh) * | 2005-01-17 | 2005-08-17 | 上海大学 | 核/壳型纳米粒子研磨剂抛光液组合物及其制备方法 |
WO2006032984A2 (en) * | 2004-09-23 | 2006-03-30 | Element Six (Pty) Ltd | Polycrystalline abrasive materials and method of manufacture |
WO2006058504A1 (fr) * | 2004-12-03 | 2006-06-08 | Anji Microelectronics (Shanghai) Co., Ltd | Procédé de polissage chimico-mécanique et composition de polissage |
-
2007
- 2007-02-06 CN CNB2007100371637A patent/CN100478412C/zh active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1334849A (zh) * | 1998-09-24 | 2002-02-06 | 联合讯号公司 | 用于低介电常数材料的氧化抛光淤浆 |
WO2004053013A2 (de) * | 2002-12-10 | 2004-06-24 | Treibacher Schleifmittel Gmbh | Schleifmittel mit verbesserten schleifeigenschaften |
CN1629246A (zh) * | 2003-12-15 | 2005-06-22 | 长兴化学工业股份有限公司 | 化学机械研磨浆液及其使用方法 |
CN1635043A (zh) * | 2003-12-25 | 2005-07-06 | 长兴化学工业股份有限公司 | 用于彩色光阻材料平面化的研磨浆液 |
WO2006032984A2 (en) * | 2004-09-23 | 2006-03-30 | Element Six (Pty) Ltd | Polycrystalline abrasive materials and method of manufacture |
WO2006058504A1 (fr) * | 2004-12-03 | 2006-06-08 | Anji Microelectronics (Shanghai) Co., Ltd | Procédé de polissage chimico-mécanique et composition de polissage |
CN1654585A (zh) * | 2005-01-17 | 2005-08-17 | 上海大学 | 核/壳型纳米粒子研磨剂抛光液组合物及其制备方法 |
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Address after: 138 Yunxing Road, Xieqiao Town, Haining City, Jiaxing City, Zhejiang Province Patentee after: Zhejiang Xinchuona Electronic Technology Co.,Ltd. Address before: 138 Yunxing Road, Xieqiao Town, Haining City, Zhejiang Province Patentee before: Zhejiang Xinchuona Electronic Technology Co.,Ltd. |
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