CN100452339C - 硅片外延线性缺陷的测定方法 - Google Patents
硅片外延线性缺陷的测定方法 Download PDFInfo
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- CN100452339C CN100452339C CNB2006100292467A CN200610029246A CN100452339C CN 100452339 C CN100452339 C CN 100452339C CN B2006100292467 A CNB2006100292467 A CN B2006100292467A CN 200610029246 A CN200610029246 A CN 200610029246A CN 100452339 C CN100452339 C CN 100452339C
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CNB2006100292467A CN100452339C (zh) | 2006-07-21 | 2006-07-21 | 硅片外延线性缺陷的测定方法 |
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CNB2006100292467A CN100452339C (zh) | 2006-07-21 | 2006-07-21 | 硅片外延线性缺陷的测定方法 |
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CN101110379A CN101110379A (zh) | 2008-01-23 |
CN100452339C true CN100452339C (zh) | 2009-01-14 |
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CNB2006100292467A Expired - Fee Related CN100452339C (zh) | 2006-07-21 | 2006-07-21 | 硅片外延线性缺陷的测定方法 |
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Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
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CN103063729A (zh) * | 2011-10-21 | 2013-04-24 | 上海华虹Nec电子有限公司 | 检测外延硅缺陷的方法 |
CN104576429B (zh) * | 2013-10-24 | 2017-09-05 | 北大方正集团有限公司 | 一种薄膜层应力的测量方法和系统 |
CN109273378B (zh) * | 2018-09-20 | 2021-11-02 | 长江存储科技有限责任公司 | 平衡晶圆弯曲度分布的方法 |
TWI673476B (zh) * | 2018-10-04 | 2019-10-01 | 財團法人工業技術研究院 | 軟性基板之應變量測與應力優化之方法、裝置、回授系統與電腦可讀取記錄媒體 |
CN111781243A (zh) * | 2020-06-16 | 2020-10-16 | 天津中环领先材料技术有限公司 | 一种硅片微缺陷测试方法 |
CN114018698B (zh) * | 2021-10-20 | 2024-03-15 | 北京卫星制造厂有限公司 | 一种利用可控加工损伤测算复合材料本征强度的方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2001201458A (ja) * | 2000-01-21 | 2001-07-27 | Hokuriku Plant Services Co Ltd | 浸透探傷判定ゲージ |
JP2003197547A (ja) * | 2001-12-28 | 2003-07-11 | Shin Etsu Handotai Co Ltd | シリコンエピタキシャルウェーハの製造方法 |
JP2005202287A (ja) * | 2004-01-19 | 2005-07-28 | Seiko Epson Corp | 半導体装置、電気光学装置、半導体装置の製造方法、並びに電子機器 |
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- 2006-07-21 CN CNB2006100292467A patent/CN100452339C/zh not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001201458A (ja) * | 2000-01-21 | 2001-07-27 | Hokuriku Plant Services Co Ltd | 浸透探傷判定ゲージ |
JP2003197547A (ja) * | 2001-12-28 | 2003-07-11 | Shin Etsu Handotai Co Ltd | シリコンエピタキシャルウェーハの製造方法 |
JP2005202287A (ja) * | 2004-01-19 | 2005-07-28 | Seiko Epson Corp | 半導体装置、電気光学装置、半導体装置の製造方法、並びに電子機器 |
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CN101110379A (zh) | 2008-01-23 |
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C14 | Grant of patent or utility model | ||
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Owner name: SHANGHAI HUAHONG GRACE SEMICONDUCTOR MANUFACTURING Free format text: FORMER OWNER: HUAHONG NEC ELECTRONICS CO LTD, SHANGHAI Effective date: 20140108 |
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Free format text: CORRECT: ADDRESS; FROM: 201206 PUDONG NEW AREA, SHANGHAI TO: 201203 PUDONG NEW AREA, SHANGHAI |
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Effective date of registration: 20140108 Address after: 201203 Shanghai city Zuchongzhi road Pudong New Area Zhangjiang hi tech Park No. 1399 Patentee after: Shanghai Huahong Grace Semiconductor Manufacturing Corporation Address before: 201206, Shanghai, Pudong New Area, Sichuan Road, No. 1188 Bridge Patentee before: Shanghai Huahong NEC Electronics Co., Ltd. |
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CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090114 Termination date: 20200721 |